cw power capabilities
DESCRIPTION
CW Power Capabilities. April 29, 2012. Dave Zhang RFPP . Topics. LDMOS application and development trend LDMOS Ruggedness LDMOS Thermal characterization Reference design availability Design support. Industrial Applications. RF Heating. Microwave Furnace. Synchrotron. RF Lighting. - PowerPoint PPT PresentationTRANSCRIPT
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
Confidential and Proprietary
CW Power CapabilitiesApril 29, 2012
Dave ZhangRFPP
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Confidential and Proprietary
Topics
• LDMOS application and development trend
• LDMOS Ruggedness
• LDMOS Thermal characterization
• Reference design availability
• Design support
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Industrial Applications
UV sterilization
RF Heating
CO2 Laser
Microwave Furnace
RF Lighting
Food processingWood dryer
Synchrotron
Medical
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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LDMOS Trends
2010 20202000
50V LDMOS 1.25KW 65:1VSWR
500MHz
50% efficiency in S Band
1 KW 2.45GHzPower/Frequency /EfficiencyPrice(reduction per year in $ per watt)
Freescale Confidential Proprietary
50V LDMOS 1KW
Ceramic
Overmolded Plastic
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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RuggednessWhat is Ruggedness?• For RF devices it is the ability to perform reliably when operated outside of “normal” conditions • The more rugged a device is, the farther from normal conditions it operates without damageMeasures of ruggedness• VSWR – A ratio that represents the impedance mismatch between device and load• Energy Absorption (EA) – measure of ability to absorb energy applied to the output terminal. (1).
• Maximum operating temperature Who needs it?• Systems where normal operation is not into a matched load
• Laser driver• Plasma generator
• Systems where availability is critical and unintended operation can cause a mismatch• Broadcast overdrive, causing Filter reflection, common because of DPD• Communications system antenna Icing• Broadcast system Damaged RF feed line • OOPS: tech forgot to shut down transmitter when operating changeover switch
Scenarios above describe impedance mismatch between the device and the load causing power to be reflected back to the device.Mismatch also causes efficiencies to drop, resulting in sharply increased operating temperatures.• two mechanisms :
1. Lower efficiency generating power2. Reflected power is dissipated in device)
(1) http://www.freescale.com/files/rf_if/doc/white_paper/50VRFLDMOSWP.pdf (Page 6)
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Stuff happens video
• http://contact.freescale.com/content/RuggedVideo?t=el
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Freescale’s Latest Innovation 50V High Ruggedness Technology
• Developed primarily for high mismatch applications, such as Plasma generators, CO2 lasers, and MRI power amplifiers
• Key features: − 50V operation− Capable of handling >65:1 VSWR at all
phase angle, >50V and 3 dB overdrive− High efficiency− Low thermal resistance
Incident Power
Reflected Power
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Unclamped inductive switch test
Test procedure:1. Individual test sockets or automated handlers can be used with the ITC55100B Testers.2. The test controller generates a clean gate pulse waveform at the gate of the transistor3. The energy dissipation capability of the DUT is stressed by increasing the load current and load voltage
by attaching a unclamped inductor to the device’s drain and source connections.
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Unclamped inductive switch test
Pass Fail
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Freescale LDMOS Thermal performance• Freescale maintained industry leadership in LDMOS thermal
performance− Achieved through continual improvements in die layout and
packaging performance• Lower thermal resistances allows:
− Lower die temperature− Longer device life by reducing impact of electro metal
migration.
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Thermal Resistance
• LDMOS device thermal resistance benefits from having a backside source that is thermally and electrically bonded to the package flange, which in turn is directly mounted to the heat sink.
• The low thermal resistance of LDMOS allows significantly higher CW power levels in a given package than with competing technologies
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Thermal Resistance MeasurementContinuous Wave Test Signal
• Thermal resistance on Freescale LDMOS are calculated using:
• Rth = (Tdie - Tcase)/(PDissipated)• Infrared microscopy is used to measure die surface
temperature (Tdie), during operation. During measurement, the die is exposed because this IR measurement method requires direct view of the die. The exposed die is coated to obtain a fixed emissivity value for IR thermal measurement. The hottest portion of the die is used as Tdie
• The case temperature (Tcase) is measured with a thermocouple that is mounted through the heatsink , so it comes in contact with the device flange underneath the hottest component within the package.
• Total power dissipated in the RF transistor is calculated by:• Pdissipated = [RF input power + DC power(Idc*Vdc)] – [RF output power
+RF reflected power]
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Freescale LDMOS MTTF Calculator
• MTTF (mean time to failure) is defined as a 10% reduction in current handling capability on 50% of the device within a given sample size. The primary factor in device failure is due to metal electro-migration on the die surface.
• By reducing device thermal resistance(Rth) we can increase the active life time of Freescale LDMOS devices
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Freescale LDMOS MTTF• Example: MRFE6VP6K1K25KH, operating at 1.25kW, with 74.6% efficiency at
230MHz.• IDrain = 1250W/(74.6% x 50V) = 33.5A
• MRFE6VP61K25H have Rth of 0.15W/°C, Case temperature = 80°C
• Dissipated power = PDC – Pout + Pin
• Dissipated power = 50V*33.5A – 1250W +6W = 431W• Trise = 431W * 0.15W/°C = 64.7 °C
• TJ = Trise + Tcase = 64.7 /°C + 80°C = 144.7°CWith Rth of 0.15W/°C, operating at 1.25kW74.6% efficiency the MRFE6VP61K25H has a operating life time of 450 years.
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Available Devices
MRFE6VP61K25H MRF6V13250H MRFE6VP8600H
Freq : 2MHz-500MHzPout : 1.25kW @ 230MHzVdd : 50VAir cavity packageLongevity program
Freq : 1300MHzPout : 250WVdd : 50VAir cavity package
Freq : 460-870MHzPout : 600WVdd : 50VAir cavity packageLongevity program
*All device are designed, fabricated and assembled in the US
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Available Reference Designs
MRFE6VP61K25H – 352MHz
MRFE6VP61K25H – 500MHz MRF6V13250H – 1300MHz
Vdd=50VPout > 1100WGain > 20dBEff > 62%
Vdd=50VPout > 1000WGain > 18dBEff > 58%
Vdd=50VPout > 230WGain > 20dBEff > 53%
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Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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Confidential and Proprietary
Design support
• Physical model available for both ADS and Microwave office.
• Use Loadpull simulation to evaluate matching impedance at target frequency, power and efficiency.
• Use Harmonic balance to simulate fixture performance
Device model
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.
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MRF6VP2600H- Large signal simulation results352 MHZ MEASURED MODEL FET2 DELTA
Source Impedance 0.79 + j 2.06 0.67 + j 1.37 30.8 %Load Impedance 2.00 + j 1.98 2.39 + j 0.60 -12.4 %
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•352 MHz (50V, 100mA): Gain, IRL, Drain Efficiency versus Pout and Output Power versus Pin