cvp-360 solder paste€¦ · process benefit cvp-360 property performance capability fine feature...

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CVP-360 Solder Paste

ALPHA®

CVP-360 Solder Paste Product guide

A high performance low silver SACX® capable paste, designed to outperform SAC alloy paste in spread, wetting and in circuit pin test yield


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Welcome to theALPHA® CVP-360 Product Guide


Introduction 3Performance Summary 4Print Performance 5-17Reflow Performance 18-40

In-Circuit Pin Testing 41-44

Reliability 45-58

Contents Page #

Summary 59-63


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Introduction

Introducing ALPHA® CVP-360, a SACX® capable solder paste with a best in class combination of solder paste print volume and volume repeatability, reduced print cycle time, solder spread and wetting on OSP pad finishes, with maximum in circuit test yield.

The result is a more first time right assemblies, that are easier to test, PLUS the inherent economy of SACX® low silver solder alloy, along with resistance to thermal cycling that you would expect from higher silver SAC alloys.

Cookson’s world class phase gate product development process began with a rigorous set of product specifications based on the voice of our customers. Exhaustive lab and field testing have resulted in a robust, high yield product that can solve one or more of your challenges associated with lead free, surface mount assemblies.

You can count on Cookson’s complete support with our global team of technical experts, whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.



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Performance SummaryProcess Benefit CVP-360 Property Performance Capability

Fine Feature Print DefinitionExcellent print definition and consistant volumetric performance to 0.30mm(12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads.

Tack Life >24 hours at 25%, 50% and 75% Relative Humidity

Temperature Window Capable of printing in temperatures from 20°C to 30°C (68°F to 86°F)

Print Consistancy Repeatable volume deposition and low volume variability on 0.30mm (12 mil) circles with 125 micron (5mil) thick stencil.

Print Speed Range25mm/second to 150mm/second (1 inch/second to 6 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads.

Peak Reflow Temperature 235º C to 245º C

Resistance to Voids

Meetss requirements of IPC 7095 Class lll using soak reflow profile. Class III with straight ramp profile and 1% Ag BGA alloy spheres.Class II with straight ramp profiles and high silver BGA sphere

Resistance to Hot and Cold Slump

Exceeds the requirements of IPC J-STD-005 for hot and cold slump.

Flux Residue Cosmetics Clear, colorless residue.SIR Meets/Exceeds JIS, IPC and Bellcore Requirements

Electromigration Resistance Meets/Exceeds IPC and Bellcore SIR and EM RequirementsJ-STD-004 Classification ROM0

Halide Content Halide Free

Inspection In Circuit Pin Testing 100% first pass yield virtually eliminating false negatives during in circuit pin testing.

Print Process Window

Reflow Yield

Electrical Reliability


Performance Summary


5


Printing: Smallest Printed Feature


Print Performance

High Volume and Volume Repeatability with 12 mil (0.3mm) Diameter Circles Using 5 mil (125µ) Thick Stencil

CpK 2.76 @ 0.60 Area Ratio

630540450360270180900

LSL USL

LSL 225Target *USL 621.5Sample Mean 425.827Sample N 3600StDev(Within) 23.6507StDev(Overall) 31.0524

Process Data

Cp 2.79CPL 2.83CPU 2.76Cpk 2.76

Pp 2.13PPL 2.16PPU 2.10Ppk 2.10Cpm *

Overall Capability

Potential (Within) Capability

PPM < LSL 1666.67PPM > USL 0.00PPM Total 1666.67

Observed PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00

Exp. Within PerformancePPM < LSL 0.00PPM > USL 0.00PPM Total 0.00

Exp. Overall Performance

WithinOverall

BGA225-12mil


6


Printing: Print Speed Process Window


Print Performance

SpeedBoard

6 in/sec4 in/sec2 in/sec1 in/sec4321432143214321

1000

800

600

400

200

0

Vol

ume

(cub

ic m

ils)

60% of Theoretical Volume (530 cubic mils)

1 in/sec

2 in/sec

4 in/sec

6 in/sec

Speed

CVP-360 Lot# 90203005M Print Volume Repeatability ChartBGA36 (15 mil circles)

Consistent print deposit volume at speeds from 1 inch (25mm)/second to 6 inches (150 mm)/second


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Printing: Response to pause

No knead stroke required after 2 hour pause in printing


Print Performance

ConditionBoard

After 2 hr PauseAfter 100 KneadsOut of Jar432143214321

1200

1000

800

600

400

200

0

Vol

ume

(cub

ic m

ils)


Out of Jar

After 100 Kneads

After 2 hr Pause

Condition

CVP-360 Lot# 90203005M Out of Jar/ Response to Pause Volume ChartBGA36 (15 mil circles)


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Print Performance

Using SIX Sigma DOE technique, with print volume and print volume variation as response variables, ranges for squeegee speed (25 to 150mm/sec.),

squeegee pressure (0.22 to 0.36 kg/cm) and stencil release speed (3 to 10 mm/sec.) have been established.

600000

400000

200000

0.100.060.02

2.01.40.8

600000

400000

200000

6.03.51.0

600000

400000

200000

Print Speed

Print Pressure

Stencil Release

1.0

3.56.0

Speed

Print

1.0

3.56.0

Speed

Print

0.81.4

2.0

Pressure

Print

0.81.42.0

PressurePrint

0.02

0.060.10

Release

Stencil

0.020 06

Release

Stencil

Interaction Plot for Std. Deviation-12mil BGA225Data Means


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Printing – Resistance to Dog Ears

.05 in.(1.3mm)/sec


Print Performance

Increasing Stencil Snap Off Speed Reduces Occurrence of “Dog Ears”

Recommended Window .12-.4 in. (3-10mm)/sec

Snap Off Speed.10 in.(2.6mm)/sec


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Wipe Frequency

Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 0 0 0 05 >10 0 0 06 7 0 0 07 4 0 0 08 >10 0 0 09 >10 0 1 010 4 0 0 0

CVP-360 #081202-P1QFP Pitch

Number of Bridges

Equal or better than Leading SAC305 Brand- Reducing Average Print Cycle Time


Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 02 0 0 0 03 0 0 0 04 >10 0 0 05 7 0 0 06 0 0 0 07 10 0 1 08 >10 1 0 09 7 0 0 010 6 0 0 0

Leading SAC305 BrandNumber of Bridges

QFP Pitch

Print Performance


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Stencil Life – Volume Data


Print Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

1000

800

600

400

200

0

Time (hrs)

Vol

ume

(cub

ic m

ils)

Theoretical Volume (884 cubic mils)


CVP-360 Lot# 90203005M Stencil Life DataBGA36 (15 mil circles)

The solder paste is printed continuously for 8 Hours. Volume measurements are taken every

hour to confirm paste’s stencil life.


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Stencil Life – Volume Data

Minimal volume change over 8 hours of continuous printing using 5 mil (125µ) thick stencil


Print Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

4000

3000

2000

1000

0

Time (hrs)

Vol

ume

(cub

ic m

ils)

Theoretical Volume (3150 cubic mils)


CVP-360 Lot# 90203005M Stencil Life DataQFP120-1 (16 mil pitch, 63x10x5 mils)


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Stencil Life: Malcom Viscosity Method

No increase in viscosity over 24 hours at 25ºC

Continuous viscosity: CVP-360

0

500

1000

1500

2000

0 5 10 15 20 25 30

Time(s)

Pois

e @

10

rpm


Print Performance


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Stencil Life – 12 mil pitch QFP


Reflowed after 8 hours of continuous printing



Print Performance


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Stencil Life – Rheology

Stable Rheology over 19 hours

1

10

100

1000

1 10Shear rate (1/s)

Log

Visc

osity

(pas

)

t=0 t=1 t=2 t=3t=4 t=5 t=6 t=7t=8 t=9 t=10 t=11t=12 t=13 t=14 t=15t=16 t=17 t=18 t=19

ALPHA CVP-360 SACX Lot90304020M


Print Performance


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Acceptable viscosity after 2 weeks at 25 °C:10 days at 32 ºC.

0

500

1000

1500

2000

2500

0 5 10 15 20Time (# of days)

Visc

osity

(poi

se)

Room Temperature & 32oC Stability

CVP-360 @ 25oCCVP-360 @ 32oC


Print Performance


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Tack / Tack Life

0.00.51.01.52.02.53.03.5

0 5 10 15 20Time (hours)

Tack

(g/m

m2)

Requirement:IPC – Measure and report up to 24 hours.

Requirement:JIS – Tack force > 100 g after 24 hours.

IPC

0

20

40

60

80

100

120

140

0 5 10 15 20Time (hours)

Tack

(gf)

JIS


Print Performance


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Reflow Performance

Reflow Process Guidelines


Parameter GuidelineAtmosphere Air Preferred

SnAgCu alloy melting ranges. Lower temperature=solidus;

higher temperature = liquidus

SACX® 0807: 217 – 225°CSACX® 0307: 217 – 228°C

Profile General Guideline Setting Zone Optimal Dwell Period40°C to 228°C 60 s – 260 s

Above 225°C 45 - 90 sec.

Peak temp. < 240°C for Entek Plus OSP finish

Joint cool down rate from 170°C > 3°C – 6°C


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Top Side Setting(ºC) 150 180 210 240 260 260Bottom Side Setting(ºC) 150 180 210 240 260 260

Conveyor Speed 60mm/sec


Example Reflow Profile P1Reflow Performance


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Conveyor Speed 70cm / minuteTop Side Setting(ºC) 150 180 200 210 230 260Bottom Side Setting(ºC) 150 180 200 210 230 260




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CVP-360 Solder PasteCVP-360 Solder Paste

Example Reflow Profile Summary

Profile

Average Time to Reach

130ºCmin:sec


170ºCmin:sec

Average Time Above

220ºCmin:sec


220ºCmin:sec

Average Time Above

225ºCmin:sec


225ºCmin:sec

P1 01:09.5 01:37.5 01:31.0 02:27.5 01:14.5 02:38.0P2 01:11.0 01:45.0 01:36.0 02:37.0 01:20.5 02:46.0P3 01:23.5 02:05.0 01:25.5 03:25.0 01:10.5 03:32.5P4 01:09.0 01:50.5 01:34.0 03:19.0 01:20.0 03:26.0

Reflow Performance


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Reflow Performance

Cross Print Wetting Test

One of the spread/wetting test included on the CERF board involves printing pairs of solder paste stripes

over equally spaced traces on the board. The spacing between the solder paste stripes range from 0.3mm up to 1.0mm (increasing by 0.1mm increments) and the stripes are printed perpendicular to the traces on the

board as shown above.

Wetting test cross-print pattern, Prior to reflow.

Upon reflow, the solder melts and since it does not wet to the masked surface between the traces, it pulls back to the metal and spreads out along the

traces. If there is enough spread, the gap between the two adjacent solder spots is bridged. There are a

maximum number of 20 bridges possible for each gap size. The bridges are counted, percentages computed and plotted for each profile against the

gap size.

Wetting test cross-print pattern, post reflow.


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Profile: Straight ramp 1.5C/s 245ºC peak Better spread than Leading SAC305 Brand

0%

20%

40%

60%

80%

100%

0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Gap size (mm)

% o

f Gap

s B

ridg

ed

Cross Print Spread


CVP-360 (lot# 81202P1) SACX0807

Leading SAC305 Brand

Reflow Performance


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Spread per JIS Z-3284

Better than Leading SAC305 Brand

Leading SAC 305

Brand

Oxidized Cu, Solder bath at alloy MP + 50 °C

CVP-360 SACX0807

86.7% 87.9%

Reflow Performance



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CVP-360 Solder PasteCVP-360 Solder Paste

Self Alignment During Reflow

Component Self Alignment = Fewer Reflow Defects

Reflow Performance

16 mil pitch QFP after placement, before reflow 16 mil pitch QFP after placement, after reflow


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CVP-360

DPAK

Reflow / Pad Wetting

LQFP120 16 mil pitch

Profile: 1.5C/sec soak 250 C peak (Air)Reflow better/equal to Leading SAC 305 Brand-

No de-wetting observed

Reflow Performance


Leading SAC 305 Brand


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Reflow / Fillet Wetting

QFP120 (16 mil pitch)Profile: 1.5C/sec soak 250 C peak (Air)

CVP-360Leading SAC 305 Brand


Reflow Performance

Presenter�

Presentation Notes�

Here you can see how the 360 gives more complete coverage of the toe of this QFP lead versus PT SAC 405 �


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IPC Cold & Hot Slump Test Results

Pad Size 00.63 x 2.03mm

0.33 x 2.03mm

0.63 x 2.03mm

0.33 x 2.03mm

Largest Gap Bridged No Bridges 0.1 0.33 0.2

IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass

Cold Slump 25C / 50% / 75% RH

Hot Slump Oven 150C / 10mins

PASSES Hot/Cold Slump per IPC J-STD-005

CVP-360 Lot# 081202-P1, SACX0807 88.5%


Reflow Performance


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DIN Slump

DIN Requirement: - Large/Small - No bridge ≥ 0.3/0.2 mm (PASS)

DIN - 1 hr @ RT + 20 min @ 80 C

Small: 0.2 mm OK


Reflow Performance

Large: 0.3 mm OK


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JIS Slump Resistance

Both Pass

JIS 20 sec @ 150 C


Reflow Performance

Large: 0.4 mm OK Small: 0.4 mm OK


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Paste In Hole Performance2.5 mm overprint 7.5 mm overprint

Before reflow

After reflow

Excellent Pin in Paste Performance

3.75 mm overprint


Reflow Performance


34


Paste In Hole Performance

3.75 mm overprint w / connector – bottom

side after reflow

RCA Jack – Bottom side after reflow

Complete wetting down barrel No dripping or excess solder on pins

on bottom side.


Reflow Performance


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Residue Tackiness

Residue Tackiness Procedure:

Reflow paste in air, let cool. Sprinkle talc & store 24 hours.Brush with paintbrush.

Requirement: Talc removed by brush - PASS


Reflow Performance


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Random Solder ball – Straight Ramp 1.5oC/sec, peak 245oC

Meets IPC visual criteria for solder balling

4 hours @ 50 % RHInitial

Equal / better than Leading SAC305 Brand on maskOM360SAC305 CVP- 360

CVP-360 CVP- 360


Reflow Performance


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Random Solder ball – High Soak 160oC/60sec, 240oC peak

Meets IPC visual criteria for solder balling

4 hours @ 50 % RHInitial

OM360OM338PT PNC0808A

PNC0808A CVP-360CVP-360


Reflow Performance


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Resistance to Voiding

OM338PT


Reflow Performance

Soak profile reduces voiding versus straight ramp profile (20 mil circles, SAC 305 alloy BGA spheres)

Void Size DistributionBGA256 20 mil circles

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

CVP-360 Cerf 1.5c_s 245c Peak60s TAL_SACX

CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL


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Resistance to Voiding

OM338PT


Reflow Performance

10% Aperture reduction also reduces voiding

Void Size DistributionBGA256 90%

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

CVP-360 Cerf 1.5c_s 245cPeak 60s TAL_SACX

CVP-360 Cerf 160c_60s Soak240c Peak 60s TAL


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Resistance to Voiding4 hours @ 50 % RHInitial

OM338PT


Reflow Performance

Void Size Distribution - SACX0807 CVP-360 Paste, SAC105 CBGA84 (12 mil spheres on 20 mil pitch)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

Ramp: 0.7 C/sec, 240 Peak,TAL - 85 s

Ramp: 1.5 C/sec, 245 Peak,TAL - 45 s

Best results with 1% Silver BGA spheres


41


Pin Testability (Flying Probe Method)

Pad type: A B C D

A – 1.0 mm sq pads B – 1.0 mm sq pads with 0.33 mm vias C - 0.7 mm round pads D – 0.7 mm round pads with 0.33 mm vias

All pads coated with Cu-OSP (Entek Plus 106A)Data is average of 3 boards with 1000 pads of each type / board.

Reflow: 238 °C peak, sharp chisel, 6.5 oz. force

PNC0802A 12000 contacts


Pin Testability


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Equal to or better than Leading, Pin Testable SAC305 Paste

Dramatically reduced level of residue from

CVP-360


Pin Testability

Pin Testability (Flying Probe Method)

A B C DPaste

Leading SAC Paste 100% 91.60% 100% 72.40%CVP-360 100% 97.80% 99.40% 99.80%

Pad Type

Pin Test Yield %

Flying Probe Pin Test Yields


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Clamshell Fixture Pin Test


Pin Testability

3 Pin Shapes

4 Pin Probe Pressures


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Similar or Better Resistance to ICT False Failures vs. Leading Pin Testable SAC Paste

% Open % Open

2 0 04 0 06 0 08 0 02 0 18.14 0.6 1.36 0 08 0 02 0 04 0 06 0 08 0 02 0 12.54 0 06 0 08 0 0

Crown

Spear

Crown

Pin Shape

Force (oz)

Blade

Leading SAC Paste

CVP-360

In Circuit Testing Results: Clam Shell


Pin Testability

Presenter�

Presentation Notes�

Here are the results of the clamshell In Circuit test. Using Blade, crown and spear probes at pressures of 2,4,6 and 8 ounces (56, 112, 168 and 224 grams)CVP shows fewer false negative readings than OM-338 PT�


45


IPC Compliance

Cu Mirror: Pass (flux & paste)


Reliability

CVP-360


46


IPC Compliance

Paste is halide free ROM0WER: 8.8 ×

104 Ω-cm

Halogen content: <700 ppm (flux)

Ag Chromate paper: Pass


Reliability


47


Bellcore SIR- PassReliability


SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97)

Test #: 0806-44b Date: 12/5/2008 T/H/B:35/85/-48Tested by: K. Tellefsen Reported by:K. TellefP/F limit:1E11 Ohms_________________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION (1 day) (4 days) -------- --------CVP-360 4.7E+12 2.8E+12 Visually OKReflowed Paste SACX0807 5.0E+12 3.7E+12uncleaned 2.7E+10 4.5E+10 5.3E+11 4.8E+11 9.0E+11 9.9E+11 6.2E+12 5.0E+12 1.4E+12 1.7E+12 1.0E+10 1.3E+10 2.4E+10 4.1E+10 2.9E+10 4.5E+10 4.0E+12 4.8E+11 3.7E+10 5.3E+10 ----- -----Geometric mean: 3.4E+11 3.2E+11_________________________________________________________________

Control boards 1.1E+14 1.1E+14 1.1E+14 1.1E+14 5.0E+13 5.0E+13 8.3E+12 7.6E+12 7.6E+12 1.1E+13 9.9E+13 9.9E+13 5.0E+13 3.3E+13 2.5E+13 2.2E+12 1.1E+14 7.1E+12 9.9E+12 5.0E+12 1.6E+12 5.7E+11 4.7E+12 7.6E+12 ----- -----Geometric mean: 2.4E+13 1.4E+13


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IPC SIR- PassReliability


SIR TEST PER J-STD-004 Request: **********************Test #:0806-44i Date: 11/24/2008 T/H/B 85C/85%RH/-48VTested by: K. Tellefsen P/F limit:Reported by: K. Tellefsen 1.0E+08 ohms_____________________________________________________________________________MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTSCONDITION ambient (1 day) (4 days)(7 days) ambientCVP-360 SACX0807 >1.0E12 6.4E+08 3.4E+09 4.6E+09 >1.0E12 passed electricalReflowed paste >1.0E12 8.8E+08 7.9E+09 8.5E+09 >1.0E12 and visualuncleaned >1.0E12 8.1E+08 7.4E+09 8.2E+09 >1.0E12 requirements >1.0E12 6.5E+08 4.8E+09 5.6E+09 >1.0E12 >1.0E12 1.7E+09 1.6E+09 2.3E+09 >1.0E12 >1.0E12 1.8E+09 5.4E+09 6.2E+09 >1.0E12 >1.0E12 1.7E+09 2.1E+09 3.5E+09 >1.0E12 >1.0E12 1.8E+09 2.2E+09 3.2E+09 >1.0E12 >1.0E12 1.5E+09 8.6E+08 1.0E+09 >1.0E12 >1.0E12 6.8E+08 3.3E+08 2.5E+08 >1.0E12 >1.0E12 4.9E+08 1.9E+08 1.5E+08 >1.0E12 >1.0E12 1.5E+09 8.8E+08 5.6E+08 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.2E+09 3.1E+09 3.7E+09 >1.0E12_____________________________________________________________________________Control boards >1.0E12 8.4E+10 4.5E+10 5.0E+10 >1.0E12 >1.0E12 1.0E+11 4.9E+10 5.6E+10 >1.0E12 >1.0E12 2.0E+11 1.2E+11 1.0E+11 >1.0E12 >1.0E12 9.6E+10 4.8E+10 4.1E+10 >1.0E12 >1.0E12 1.5E+11 8.1E+10 7.5E+10 >1.0E12 >1.0E12 9.6E+10 5.6E+10 4.6E+10 >1.0E12 >1.0E12 9.2E+10 5.4E+10 4.3E+10 >1.0E12 >1.0E12 1.4E+11 7.2E+10 8.1E+10 >1.0E12 >1.0E12 5.8E+10 3.1E+10 3.3E+10 >1.0E12 >1.0E12 5.7E+10 2.9E+10 3.0E+10 >1.0E12 >1.0E12 7.6E+10 4.8E+10 4.5E+10 >1.0E12 >1.0E12 1.1E+11 5.7E+10 5.4E+10 >1.0E12 ------- ------- ------- ------- -------Arithmetic mean: >1.0E12 1.0E+11 5.8E+10 5.5E+10 >1.0E12


49


IPC SIR- PassReliability


IPC SIR CVP-360


50


Bellcore EM- PassReliability


Bellcore Electromigration (per GR-78-CORE Issue 1, September 1997) Request:Test #:0806-44e Start dat11/17/08bias = 10 V T/H: 65/85Tested by: K. Tellefsen Reported by: K. Tellefsen________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION 96 hr. 500 hr. bias ------- -------CVP-360 SACX0807 2.3E+09 4.5E+10 passed visual andIPC-B-25 pattern B 2.6E+09 4.1E+10 electrical requirementsreflowed paste 2.0E+09 1.1E+10Uncleaned 2.1E+09 3.7E+10 2.0E+09 3.4E+10 1.1E+09 2.2E+10 2.2E+09 2.9E+10 1.9E+09 3.2E+10 3.2E+09 6.1E+10 3.6E+09 5.7E+10 3.6E+09 4.7E+10 3.0E+09 5.1E+10 Pass/Fail ----- ----- final >Geometric mean: 2.4E+09 3.6E+10 initial/10________________________________________________________Controls 4.7E+11 1.0E+12 7.2E+11 1.0E+12 4.0E+11 7.1E+11 5.7E+11 1.0E+12 3.2E+09 3.1E+11 2.7E+09 3.0E+11 2.5E+09 2.0E+11 2.5E+09 3.0E+11 3.4E+11 1.0E+12 6.4E+11 9.4E+11 4.7E+11 9.0E+11 7.6E+11 4.9E+10 Pass/Fail ----- ----- final >Geometric mean: 9.1E+10 4.8E+11 initial/10


51


Bellcore EM- PassReliability


Bellcore EM CVP-360


52


Reliability

Thermal Cycling- CERF Board Test VehicleBGA 256 Package


53


Joints from 2 ends and middle were cross-

sectioned

Thermal Cycling- CERF Board Test Vehicle

1,500 Cycles -40ºC to +100ºC BGA 256

Reliability


54


Reliability

After 1,500 Cycles -40ºC to +100ºC BGA 256Copper Component Pad

Copper Pad

Tin/Copper Intermetallic in Tact

Tin/Copper Intermetallic

Bulk BGA


55


Reliability


Surface Mount 1206 Resistors


56


Reliability

After 1,500 Cycles -40ºC to +100ºC 1206 Resistor

Surface Mount 1206 Resistor





57


Reliability


LQFP 120


58


Reliability

After 1,500 Cycles -40ºC to +100ºC LQFP 120 Copper Lead


Copper Pad




59


Summary

•High performance paste with the economy of low silver SACX alloy Delivers excellent print deposit volume consistency Prints speed window from 1 to 6 in. (25 to 150 mm)/second Excellent stencil life – reducing paste scrap Better spread and wetting than leading SAC 305 brand Best in Class in circuit pin test yield Exceeds IPC and Bellcore electromigration and surface insulation resistance requirements Solder joints survive 1500 thermal cycles (-40ºC to +100ºC)


60


Summary

Leading Products:

No Clean, SnPb• ALPHA OM-6106

•ALPHA OM-5100

No Clean, Lead-free• ALPHA OM-338 T

•ALPHA OM-338 PT

•ALPHA OM-340

•ALPHA OM-350

•ALPHA CVP-360

•ALPHA CVP-520

Water Soluble, SnPb• ALPHA WS-809

Water Soluble, Lead-free• ALPHA WS-820



61


AMERICAS

California, USAFlorida, USAIllinois, USANew York, USAPennsylvania, USAMexico City, MexicoMonterrey, MexicoManaus, BrazilSao Paulo, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceBudapest, HungaryHatar, HungaryNaarden, NetherlandsEast Kilbride, Scotland

ASIA-PACIFIC

Hong Kong, ChinaGuangxi, ChinaShenzhen, ChinaShanghai, ChinaChennai, IndiaHiratsuka, JapanSihung City, KoreaSingaporeTaoyuan, Taiwan

Global Manufacturing Sites Summary


62


AMERICAS

California, USAGeorgia, USAIllinois, USANew Jersey, USAPennsylvania, USAOntario, CanadaGuadalajara, MexicoBuenos Aires, ArgentinaSao Paulo, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, GermanyHatar, HungaryDublin, IrelandMilano, ItalyNaarden, NetherlandsEast Kilbride, Scotland

ASIA-PACIFICHong Kong, ChinaShenzhen, ChinaBeijing, ChinaChengdu, ChinaGuangxi, ChinaNanjing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaXiamen, ChinaBangalore, India

Global Sales Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaMuntinlupa, PhilippinesSingaporeTaoyuan, TaiwanBangkok, ThailandThomastown, AustraliaAuckland, New ZealandVietnam

Summary


63


AMERICAS

California, USANew Jersey, USAGeorgia, USAGuadalajara, MexicoMonterrey, MexicoBuenos Aires, ArgentinaSao Paulo, BrazilManaus, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, Germany

ASIA-PACIFIC

Hong Kong, ChinaShenzhen, ChinaBeijing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaBangalore, India

Global Customer Technical Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaSingaporeTaoyuan, Taiwan

Summary

cvp-360 solder paste€¦ · process benefit cvp-360 property performance capability fine feature...

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