cst catalogue 2014

8/12/2019 CST Catalogue 2014

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CST Co., Ltd. 248 Namdong-daero, Namdong-gu, Incheon-si, Korea(53BL-4L, Nonhyeon-dong)

TEL.+82-32-821-4220FAX.+82-32-821-4225

http://www.cstflex.com

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CST makes only the worlds best.

CST products made with the best passion and technology are already being exported to more than

10 countries. CST products are performing their best everywhere seen or unseen, making everyones

lives more convenient and beneficial. CST will continue to provide quality products and customer

service. CST will be with our customers on the way to the better future.

Global Leader in FPCB industryCST will be there for you!

To the World, For the futurewith Technology

CIRCUIT SOLUTION TECHNOLOGY


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CIRCUITSOLUTIONTECHNOLOGY

Achieving No.1

C ON TE NT S Value

Technology

Message from CEO

Global network

About us

Performance of management

R&D Research and development

Products

Production process

Technical specication

Equipment

Vision of enterprise

Activities

Certicates

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WE WILL DO OUR BEST All members of CST corporation practice harmonized unity,

truthful sincerity, and creation of value which are the mottos of the company,

and they endeavor for the creation of new value in order to grow as a

global enterprise under the strong resolution of fulfilling the best.

We will do our best in constant research and

development with the basis of truthfulness and sincerity.


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It is my great honor to introduce myself. My name is Jonghun Jeon and I am the CEO of CST. CST

exerts diversified efforts to lead the 21st century of information technology (IT) industry, and all

executives and staffs pursue endlessly develope themselves in order to join the ranks of super-

excellent enterprise by preparing global competitiveness of technology and business capability.

CST exercises speedy management with a rapid response to 'customer complaint' through the

prompt decision making and streamlining organization, and we are endeavoring to come closer to

the realization of 'customer admiration' by encouraging these efforts.

It is not an exaggeration to say that current industrial structure is led by information technology

(IT). However, no one can predict the industry of 'tomorrow'. Under these circumstances, we

practice innovative management with creative technology development and continuous equipment

investment to present the blue print of a strong future IT country.

CST promises to create high value-added products through speedy management activities, HR

training, and accumulation of technical capability which suit the age of limitless competition, and

not to be negligent about the effort to accomplish the IT Korea of the world.

We will create new paradigm of FPCB industrywith the mind of loving 'us' rather than 'me'.

CST will always do the best to bethe Global Leader .

Committed to becoming Global Leader

Jonghoon Jeon , CEO, CST Corporation

Achieving No.1 CST

Message fromCEO Message from CEO

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Oceania

Africa

Europe

Middle East

North America

South America

Asia

Africa

Europe

Middle East

North America

South America

Asia

Indian Ocean

Arctic Ocean

Pacific Ocean

Southem Ocean

Atlantic Ocean

CST corporation is leaping to be the front runner of worldwide FPCB industry through thestrengthening of existing business' profit basis and expansion of global management.

Global business network

CST corporation, the global leader of FPCB industry

CST is born again now as a high value-added global enterprise. New competitive power of technology is the

foundation of the CST growth, and the new competitive power of technology is being prepared upon the foundation

of growth. CST does its best for the production of FPCB in which up-to-date technology of the future is concentrated

by promptly responding to the flow of global market through the highest R&D investment and infrastructure. Please

watch the CST growing to be the new leader who will be the center of attention of the world and will initiate the

FPCB industry.

Globalnetwork Global network

Products

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1 CST Co., Ltd.

2 CST

3 BeLINK JAPAN CO., LTD

Operations Center

Date of establishment : 2002. 03

Fields of business : Manufacturing FP

Number of employees : 800persons

Area : 20,400m 2


Field of business :Head of Parts Department (SMT)

Number of employees : 400persons Area : 2,100m 2


Field of business : Japanese branch office of CST

Address :Takanawa, Minato-ku, Tokyo-do, Jap


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Performance of management

The challenge of CST to become a global FPCB manufacturing enterprise will be continued.

CST has advanced to the manufacturing enterprise of FPCB without contenting with the success of the

past, and the contents of this effort become the background of rightful management throughout the

period and endless innovation. Based on diversified experiences and advanced technical capability, CSTwill provide the best service to customers and will be the basis of continuous growth of FPCB field.

Sales Results( Unit :1,000$)

6,000

22,00034,000

62,00073,000

90,000

2003

100,000

70,000

50,000

30,000

10,000

7,000

5,000

3,000

1,000

02006 2008 2010 2012 2013

Sales Goals( Unit :1,000$)

150,000200,000

300,000

500,000

2014 2015 2017 2020

1,000,000

500,000

400,000

300,000

200,000

100,000

50,000

30,000

10,000

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History

2013 11New office building constructed /Factory 1&2 integrated

2011 09 TS16949 certified

2010 09 Factory 2 construction completed

2007 10 INNO-BIZ certified

07 IS0 9001/14001 certificate of China factory

2006 12 Established Shimcheon CST

10 Established Hongkong corporation

2005 07 Established associated research institute

03 Registered venture business

2004 10 Constructed and moved to a new office building

04 IS0 9001, 14001 certificate

2003 05 Registered UL (FPCB)

2002 03 Established CST corporation

New customer value is created with smart technology.

For the past several years, CST has cultivated the capability of FPCB smart technology which leads thechange of business environment with the basis of thorough understanding and specialized technology for IT

industry. Our FPCB smart technology will create new customer value for the sake of the future which is bound to

approach to customers.

About us

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A valuable tomorrow will be made with endless transformations and challenges !

About us Performanceofmanagement


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Research and development

Passion for TechnologyCIRCUIT SOLUTION TECHNOLOGY

The passion of CST is emitting more light for the development ofnew product of the future under the lights of research institutewhich are not turned off even at present.

Technical Road MAP

PROCESS ITEMS 2012 2013 2014 2015

INNER LAYER LINE / SPACE 40 / 40 35 / 35 30 / 30 25 / 25

OUTER LAYER LINE / SPACE 50 / 50 45 / 45 40 / 40 35 / 35

LASER DRILLBVH DIAMETERPTH LANDANNULAR RING

50250100

5023090

5021080

4518570

MECHANICALDRILL

BVH DIAMETERPTH LANDANNULAR RING

120320100

100300100

7525590

7523580

MULTILAYER MAX LAYERREGISTRATION8 LAYERS100

10 LAYERS90

12 LAYERS80

14 LAYERS75

FINISHPLATING

ENIG (Ni/Au)ELECTRO SOFT/HARD (Ni/Au)IMMERSION TinELECTRO TINENEPIG (Ni/Pd/Au)

3 ~ 5 / 0.03 ~ 0.07 (Ni : 1 ~ A3 Comfortable)3 ~ 8 / 0.05 ~ 0.5 0.4 ~ 0.8 5 ~ 153 ~ 5 / Min. 0.03 / Min. 0.05

Technical Road MAP (ITEM)

ITEMS 2013 2014 2015

TSP

3 Layer Type Line / Space = 50 / 50 0.1 NC Drill

4 Layer Type Line / Space = 45 / 45

6 Layer Type Line / Space = 40 / 40

Camera Module

Control of atness corresponding to 8M pixels (30 ) ENIG + electrolytic composite plating ENEPIG

Control of atness correspondingto 13M pixels (20 )

- 7409 (High-Tg) material applied ENEPIG + ENIG composite plating

Control of atness corresponding to high pixels of more than 13M (15) ENEPIG + ENIG composite plating

MULTILAYER BOARD

Initiating mass production of the product with more than 10 layers of MLB 6 Layer R-FPCB for satellite

Initiating mass production of the product with more than 12 layers of MLB 8 Layer R-FPCB for Medical

Initiating mass production of the product with more than 14 layers of MLB 10 Layer R-FPCB for Medical

Min. Pattern Width(Line / Space)

Non Plating Type : 35 / 35 Plating : 45 / 45



IMPEDANCEImpedance control

Differential : 100 10%, Single : 50 20% control

Differential : 100 8%, Single : 50 15% control Improvement of transmitting velocity at high speed broadband (40GHz) through the

examination of the raw material with low Dk

Differential : 100 5%, Single : 50 10% control Stabilization of high speed broadband with

the raw material of low Dk

ANTENNA/NFC Mass production of 3oz FCCL-based NFC Making mass production of PET or PEN mater ial-based ANT Manufacturing thin plate ANT

Manufacturing super thin plate ANT

Etc. Applying INK Type Via Fill Applying plated Type Via Fill Applying Selective Plating of copper plating

The future of IT industry will be made with continuous researches and efforts.

R&DResearch anddevelopment


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R&D Research and developmentCIRCUITSOLUTIONTECHNOLO

CST provides the best product and service with active and continuousresearch and development, and always accommodates on behalf ofcustomers.

SingleThis is the most basic shape of flexible PCB, and it is the type of forming the circuitwith thin conductive copper plate or aluminum and so forth at section film, and it isgenerally used as the Sub Board connected with the cable which is interconnectedbetween appliances and main board.

Specications

ITEMS SPEC.

B as e Ma te ri al s P ol yi mi de o r P o ly es te r

C ove r- la y P ol yi mi de ,S ol de r M ask

Thickness 50 ~125

LineWid th /Space NormalMin .0 .040 / 0.040mm

C ond uct or 1 /4o z, 1/ 3o z, 1/ 2oz

FinishPlating ENIG,Direct Gold,Soft Gold,Hard Gold,OSP,ImmersionTin

Stiffener PI, Epoxy

DoubleThis is the most general type for which the circuit is formed with thin copper plateat both sides of base film and the circuit is connected through the Via Hole. It isused for almost all electronic products and the technologies such as Fine Patterntechnology, Hot Press technology, surface treatment, and so forth are required. It ismainly used for the usage of expansion type Sub Board of mobile's Main Board, LCDModule, etc.

Specications

ITEMS SPEC.

Min.Line/Space(ou t) Normal :50 / 50 , Special40 / 40

M in . H ol e S iz e M ec ha ni ca l : 0 .1 5 , S pe ci al : 0 . 10

S ti ff en er P ol yi mi de ,Ep ox y, SU S

FinishPlatingENEPIG,ComplexSurfaceTreatment,HighductilityENEPIG, Soft GoldHardGold, ImmersionTIN

Stiffener PI, Epoxy

Multi (General)This is the product of more than 3 layers, and it becomes the light, thin, short, andsmall part for Fine Pattern and Laser Via Hole in accordance with the trend of highfunction, high density, etc. Its usages such as Main Board for mobile appliances,board for Touch Screen, and so forth are being gradually increased.

Specications

ITEMS SPEC.

Layer Over 3 Layer

Min. Line/Space (out) Normal : 60 / 60 , Special 50 / 50

Min. Hole Size Mechanical : 0.15, Special : 0.10Laser : 0.12, Special 0.08

St if fe ne r P ol yi mi de , E po xy, SU S

Surface FinishENEPIG, Complex Surface Treatment, Highductility ENEPIG, Soft GoldHard Gold

Multi (RFPCB)This is the PCB which strengthens the advantages for Hard PCB and Flexible PCB. Itis the PCB integrated for the sake of realizing light, thin, short, and small connectorjoining method between existing boards. At present, it is generalized for CameraModule, and it is also used for the integrated Main Board. Laser Via Hole Process isgenerally used.

Specications

ITEMS SPEC.

Layer Normaly 4 Layer

Flatness Under 8M : 30 , Over 8M : 20

Min. Hole Size Mechanical : 0.15, Special : 0.10Laser : 0.12, Special 0.08

Impedance Differential : 100 10%Single : 50 20%

PSR Color : Blue, Black, GreenGloss : Matt, Glossy

St if fe ne r P ol yi mi de , E po xy, SU S

Surface Finish ENEPIG, Complex Surface Treatment,High ductility ENEPIG, Soft Gold, Hard Gold

Impedance ControlPCB controls the impedance between circuits on PCB for reducing signal loss in accordance with the high-speed transformation of mobileappliances. This is the product which requires stabilization of overall process qualities such as control of circuit width, and control of stackingthickness. Recently, even from the camera module, the application is gradually extending in accordance with the transformation into high pixels.

Impedance circuit (6EA) Impedance circuit (6EA)Solid Type GND Hatched Type GND

- When the circuit width is 50, the impedance value will be 73.52

- In order to control the impedance value of 100 ,circuit width shall be controlled as 35 This cannot be controlled

- Impedance value is controlled as 100 by maintaining existing circuit width as 50 through the hatching design of GND.

- Validity of hatching design Increased exibility

Solid Type GND73.52 Hatched GND101.78

SurfacetreatmentBaseCopper

Coverlay

BasePI

BasePI BasePI

BasePI

BondingBondingLaser Via

Coverlay SurfacetreatmentBaseCopper

ThroughHole

Laser ViaCoverlay

Coverlay

BasePI

Prepreg

BasePI

SurfacetreatmentBaseCopper

WireBonding

CST practices managerial philosophy based on value creation

with the continuous expansion of production capacity and sales

quantity, and displays innovative products and differentiated

service. Since the enhancement of enterprise image and

continuous growth of business are originated from customer

admiration, CST always ponders what items are desirable to

customers, and the vision and core value of CST.

Milestones of major development

2009.12Development and mass production of camera module

2014.01Development of multi-layer antenna for mobile phone

2010.08New development and mass production of small TSP (Application; Mobile phone)

2013.12Development of flatness and 13M technology is underway

2012.01Introduction of impedance measuring equipment and control of mass production

2013.02Development and progressing mass production of antenna for notebook

2011.11 Development and mass production of medium TSP (Application:Tap)

2013.11Development and mass production of largeTSP Fine Pattern (50 /50 )

2012.12Development and mass production of large TSP (Application:Notebook)

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Reinforcingplate

BasePI

SurfacetreatmentBaseCopperCoverlay

Reinforcingplate


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ProductsCIRCUITSOLUTIONTECHNO

S/S Type

Features

Single Side structure is the most basic structure, and it is the structurefor which the land is formed at one side, and it is mainly used for 3-Dwiring of small home appliances which utilizes bending characteristicamong the FPCB characteristics or PICK-up Module of ODD product.

Applications

- 3-D wiring of Camcorder and CDRW- Driving section of CDRW Pick-up- Driving section of CDRW Deck- Driving section of Inkjet Printer Head- Ground for intercepting electromagnetic wave of Moblie phone- Simple connection circuit between units of various electronic products

Mobile Phone Digital Camera CD-ROM Print

MLB Type

Features

Due to the small and high function trends of electric home appliancesand communication devices, products are becoming multi-layers inorder to have more circuits and parts into the product with the samesize.

Applications

- Color, Folder Type Mobile Phone- High integrated circuit

Mobile Phone Print Hard Disk

D/S Type

Features

For D/S, thin copper plate is adhered to both upper and lower sectionsof PI film, and in the case of this structure, part density can be raisedunder the same size when part is mounted because the land (thelocation where soldering can be conducted) can be formed at upper andlower sections.

Applications

- For fusing LCD and TFT-LCD- Mobile Phone Keypad, Side Key, Camera Module- Forming the circuit with higher density than S/S- Actual mounting of part to FPC

R/F Type

Features

This is a composite product for which actual mounting of SMT issimplified and the flexibility is provided by utilizing the hard property ofthe Rigid and soft property of the Flexible.

Applications

- Mobile Phone Keypad- CDRW Pick up Ass'y- Built-in type Camera CCD Ass'y

Mobile Phone LCD Mobile Phone Digital Camera CD-ROM


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Production processCIRCUITSOLUTIONTECHNO

AOIInspect the faulty pattern, Nick, short/open,and so forth of insideoutside layer circuitwhere the circuit has been formed withautomatic and optical equipment.

DESForm the circuit by removing the UVlight sensitive film after exposing thelight and etching the Cu at the sectiondeveloped with Etching liquid.

D/F exposed lightForm the Pattern Image by irradiating UVlight with Mask film or direct irradiationmethod of laser with LDI to the boardadhered with light sensitive film.

Temporary fixingConduct the temporary fixing of processedCoverlay and Adhesive of reinforcing stripwith heat.

Surface platingThis is the surface treatment process forjoining of part to Connetor and Land.

BBTDetect the abnormality of electric functions(short/open) with BBT Fixture.

DF LAMIAdhere the film with light sensitivity whichis hardened by UV light in order to formthe circuit.

Hot pressAfter laminating the temporary fixed productwith standardized subsidiary material, compressthe product and Coverlay with high temperatureand high pressure.

PrintingThis is the process of printing in order to indicatethe identifier or logo of product.

PressProcess the external shape of subsidiary materialand product with metal mold.

Copper platingMaking the non-conducting areaof Through Hole's inner wall intoconductor by plating with Chemicalfor the sake of electrical conduction.

Post-processingCreate the Guide Hole by processing withAuto Punch M/C.

Stiff Attach reinforcing strip, tape, and so forth at the

connector section or adhered section in accordancewith the purpose because the product itself is softin terms of FPCB characteristic.

CuttingCutting the main and auxiliarymaterial of roll state into thework size for each model.

DrillProcessing the Through Holewith the purpose of conductionbetween layers of the productwith both sides and multi-layer

structure.

SMTThis is the process of actuallymounting the component to thecompleted FPCB.

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FinalShipment inspectionInspect the external appearance of completed product with microscope and magnifier.

Confirm whether the product is corresponded to the standard of product and workstandard so that it will be conformed to the standard of customer company.

PackingShipmentCompleted products are individually packed byexamining the quantity and re-arranging with theunit of lot.

Conduct the packing with the unit of box in orderto ship the packed product to customer.

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FPCB of CST is the core part used for main electronic parts such as mobilephone, display, digital camera, and so forth, and it is produced for variouspurposes by adding Flexibility

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Technical specicationCIRCUITSOLUTIONTECHNO

Our Advanced Technologyfor the Future


Most enterprises regard technology and quality as important elements,however, for CST, the quality and technology are the ' vision for thefuture value ' of CST itself, not the 'subject' of enhancement.

This is the promise to customers from the quality of product manufactured by CST.The technology of CST which is observed with attention not only from domestic market but also from global

market is becoming the living history of Korean FPCB industry as its quality has been accepted. From now on,

CST will be grown to a global enterprise which will be the foundation of FPCB industrial market with the basis of

excellent manpower, up-to-date production facility, and advanced competitive power of quality.

Technical innovation isour vision as well as our future.

The "product quality" of CST which is always faithful to the standard with

straightforward honesty without concession or compromise is like the

destiny of the company. Endless improvement and effort are diligently

executed in order to accomplish the realization of value through the meeting

with quality evaluation.

We will make the future of mankind more convenientand happy with up-to-date innovative technology.


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EquipmentCIRCUITSOLUTIONTECHNO

CU PLATING

ITEMS SPEC.

Name of process CU Plat ing

Name ofequipment Copper

Spe ci c at io n T hi ckne ss 2

Quantity 2

Purpose Plating for the sake of electrical conduction ofThrough Hole's inner wall

DRILL

ITEMS SPEC.

Name of process Dril l

Name ofequipment Drill

Specication 6axes / 250,000rpm / 0.05

Quantity 12

PurposeThrough Hole processing and copper plating with the purposeof conducting between layers of product with both sides andmulti-layer structure

D/FEXPOSED LIGHT

ITEMS SPEC.

Name of process D/F exposed light

Name ofequipment laminator Exposing machine

SpecicationAutomaticlami

Manuallami

Vacuumlami

Manualparallel

Automaticparallel LDI

Quantity 4 4 1 8 4 4

PurposeForming the circuit pattern with adhesion of light sensitivelm and UV investigation

DES

ITEMS SPEC.

Nam e of p ro ce ss DES

Name ofequipment DES Pre-treatment device

S pe ci c at io n S he et t y peCombined usefor Sheet andRoll to Roll

ScrubbingM/C Soft Etching

Quantity 2 1 2 3

Purpose Forming the circuit with Development Etching Stripping

AOI

ITEMS SPEC.

Name of process AOI

Name ofequipment AOI VRS

Spe ci c at ion L ine / Spac e : 30 / 3 0 Line / Space : 30 / 30

Quantity 10 12

Purpose Automatic detection of formed circuit 's short /open

HOT PRESS

ITEMS SPEC.

Name of process Hot press

Name ofequipment Hot press

Spe ci c at ion Ope ni ng o f t he rm al m e di um Vac uu m o f ther ma l me di um

Quantity 14 4

Pur pose Adh es ion of Cover la y and la mi na ti on o f ML B

The 'advanced technology of the future ' is displayed by CST which aimsthe highest operation quality with up-to-date specialized equipment andtechnical capability for IT.

CST will advance toward the greater dream of th e enterprise with up-to-date technology which protects the value of human

and environment by endlessly challenging for the sake of global growth with the basis of core capability constituted with

creative high value added technical capability accumulated up t o the present and superior ability of excellent manpower.


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CIRCUITSOLUTIONTECHNO

HOLE PUNCH

ITEMS SPEC.

Name of process Hole Punch

Name ofequipment Punching machine

Spe ci c at io n Pre ci si on : 0 .02 / Hole : 0.27sec

Quantity 10

P ur po se M ach in in g of gu id e h ol e

BBT

ITEMS SPEC.

Name of process BBT

Name ofequipment BBT

Specication50M of insulation resistance /

20M of continuous resistance

Quantity 10

Purpose Detecting short /open with BBT Fixture Power press

PATTERN PLATING

ITEMS SPEC.

Name of process Pattern Plating

Name ofequipment Gold plating

Specication ENEPIG correspondence

Quantity 2

P ur po se P la tin g on La nd su rf ace

PRESS

ITEMS SPEC.

Name of process Press

Name ofequipment Power press

Sp ec i ca tio n 6 0 to n

Quantity 22

PurposeProcessing the external shape of member and product

with metal mold

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EquipmentCIRCUITSOLUTIONTECHNO

From now on, CST will be thebest partner who supports the success ofcustomers by providing differentiated technical capability and solution.

CST makes effort incessantly so as to be contributing to the success of customers by providing technical capability for

IT which is prepared with operational quality of global standard, and endlessly exerts the effort in order to be the global

enterprise recognized by the world for each of the FPCB fields without being satisfied with the present accomplishments.

SMT

ITEMS SPEC.

Name of process SMT

Name ofequipment SMT

Specication 4 point / sec

Quantity 2 Line

PurposeActually mounting the component to thecompleted PCB

PRINT

ITEMS SPEC.

Name of process Print

Name ofequipment Printing machine PSR exposing machine

Specication 25 5 8kw

Quantity 8 4

Purpose Marking print and PSR print and exposure to light


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Vision ofenterprise Vision of enterprise

The happiness for customers will be realized with thechallenge and passion which open the tomorrow.

Companies leading the

Paradigm


Hidden effort of CST which blooms brighter in the world!CST leads the paradigm of FPCB industry.

The future of CST is dependent upon the continuous growth and

future development which are to be shared with customers.

CST will actively survey the future technology desired by customers, and create new value which is inclined to

the continuous growth and prosperity. The our future is to be the global leader of the industry together with

customer on the basis of development of smart technology for IT industry and passion for new technology.

Development of new technology CST will present the vision of business advancing withinnovative product through technology development.

Differentiated facility and investmentInnovative product will be manufactured with systematic

research responding to the unpredictable future and market

analysis which will satisfy the pattern of consumers.

Global partner

Our future is not "I", but "we". We will be advancingforward with global leaders who lead the age of IT withaccompanied growth and cooperation.

WHAT

HOW

WHO

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Corporate Social

Responsibility & Activities

CIRCUIT SOLUTION TECHNOLOGYWe will make the world to be lived together by growing with society.

Activities Activities

CST will be growing together through the work of constituents and bepursuing the Workplace Innovation with the basis of open enterprise culture.

Under the belief that the driving force that leads the

market is derived from manpower, CST will be growingtogether through the work of constituents by endlessly

pondering for the sake of strengthening the capabilityof constituents and feeling of existence. In addition,

based on the open enterprise culture, the environmentof working with efficiency is being nurtured so that

the feeling of existence felt by constituents and themeaning of work can be found through the growth of

oneself.

Managerial target of CST as a community

CSTVision ofcommunity relation

Realizationofcommunitythroughcreationofcontinuousoutcome

CSTcharacteristic practicemethod

Partnershipof participationandcooperation

CSTBasic philosophyas a community

Managementof valuecreationandhumanrespectfor thesake ofcustomers

Vision Realization of value creation and common good

Organization

The center of trust relation between enterprise, personnel, and customers Focused on the system established through the discussion with personnel community

People

Forming the 1 to 1 trust relation with individual constituent Establishment of open communication and leadership management

CST Mechanism

Management

Customers

CST

Personnel


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cst catalogue 2014

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