cpu identification 2004a

8/6/2019 CPU Identification 2004a

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Intel CPU Processor IdentificationThere are several package types for Intel processors. These different package types are illustrated belowalong with a brief explanation of how to easily identify them.

FC-PGA Package TypeThe FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket.These chips are turned upside down so that the die or the part of the processor that makes up the computer

chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can beapplied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance ofthe package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors andresistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins onthe bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can onlybe inserted one way into the socket. The FC-PGA package is used in Pentium III and Intel Celeronprocessors, which use 370 pins.

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OOI Package TypeOOI is short for OLGA. OLGA stands forOrganic Land Grid Array. The OLGA chips also use a flip chip

design, where the processor is attached to the substrate face-down for better signal integrity, more efficientheat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helpsheatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, whichhas 423 pins.

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FC-PGA2 Package TypeFC-PGA2 packages are similar to the FC-PGA package type, except these processors also have anIntegrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor duringmanufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface areafor better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is usedin Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

Pentium 4 processor:

Pentium III and Intel Celeron processor


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PGA Package TypePGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improvethermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. In addition, thepins are arranged in a way that the processor can only be inserted one way into the socket. The PGApackage is used by the Intel Xeon processor, which has 603 pins.

PPGA Package TypePPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. Toimprove thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. Thepins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processorcan only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors,which have 370 pins.


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S.E.C.C. Package TypeS.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor isinserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry itssignals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridgeassembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., mostprocessors have a printed circuit board called the substrate that links together the processor, the L2 cacheand the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which

have 242 contacts and the Pentium II Xeon and Pentium III Xeon processors, which have 330 contacts.


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S.E.C.C.2 Package TypeThe S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and doesnot include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium IIprocessor and Pentium III processor (242 contacts).

S.E.P. Package TypeS.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 packagebut it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P.package was used by early Intel Celeron processors, which have 242 contacts.


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Laptops:Micro-FCPGAThe micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organicsubstrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socketdesigns available, all of them are designed to allow zero-insertion force removal and insertion of theprocessor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes

capacitors on the bottom side.

Micro-FCBGAMicro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet.Instead of using pins, the packages use small balls, which acts as contacts for the processor. Theadvantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls,which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the topside.

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Micro-BGA2 PackageThe BGA2 package consists of a die placed face-down on an organic substrate. An epoxy materialsurrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use smallballs, which acts as contacts for the processor. The advantage of using balls instead of pins is that there areno leads that bend. The Pentium III processor uses the BGA2 package, which contains 495 balls.

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Micro-PGA2 PackageThe micro-PGA2 consists of a BGA package mounted to an interposer with small pins. The pins are 1.25mm long and 0.30 mm in diameter. While there are several micro-PGA2 socket designs available, all ofthem are designed to allow zero-insertion force removal and insertion of the mobile Pentium III processor.

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MMC-2 PackageThe Mobile Module Cartridge 2 (MMC-2) package has a mobile Pentium III processor and the host bridgesystem controller (consisting of the processor bus controller, memory controller and PCI bus controller) on asmall circuit. It connects to the system via a 400-pin connector. On the MMC-2 package, the thermal transferplate (TTP) provides heat dissipation from the processor and host bridge system controller.

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The Mobile Intel 915GM/PM/GMS and 910GML Express chipset family is a graphics memory controllerhub (GMCH) designed for use with 90nm process technology based Intel Pentium M Processors(containing 2 MB L2 Cache) and Intel Celeron M processors.

Mobile Intel 915 and 910GML

Express Chipset Family

The Mobile Intel 910GML Express chipset isoptimized for the Intel Celeron M processor, restwork with Centrino.

Intel 855 Chipset Family

cpu identification 2004a

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