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HINNOTECH Introduction HINNOTECH Culture HINNOTECH Material Introduction Laminate Property Benchmark PCB Process Properties Summary. Contents. HINNOTECH Introduction. - PowerPoint PPT PresentationTRANSCRIPT
真诚 合作 创新 环保 Sincerity Cooperation Innovation Environmental
真诚 合作 创新 环保 Sincerity Cooperation Innovation Environmental
Contents
HINNOTECH Introduction
HINNOTECH Culture
HINNOTECH Material Introduction
Laminate Property Benchmark
PCB Process Properties
Summary
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HINNOTECH IntroductionJIANGMEN HINNO-TECH CO., LTD. is a professional manufacturer of CCL materials and optical materials, and a joint venture established by JIANGMEN YINGJIANG TRADING CO., LTD. and Hong Kong Well Bright International Development Co., Ltd. It owns independent production, marketing and development research.
HINNOTECH Basic Information
Established Date August 2009
Mass Production Date April 2010
Employee 50
Capacity
Prepreg: 600Km/month at present 1800Km/month in the end of 2010
Laminate: 300K SH/month in Q2 of 2011 600K SH/month in Q2 of 2012
Product Lead-free: H-840, H-850, H-880Lead-free and Halogen-free: H-850G
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HINNOTECH Organization Chart
Manufacturing Dept.
Chairman
Industrial Safety
Finance AdministrationPE QAWarehouse R&DProducingEquipment
MaintenanceTechnical
servicePMC Sales Purchasing
Technical Dept.Marketing Dept.
Management Representative
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HINNOTECH CultureCorporate culture:
Integrity Management, Pioneer Innovation, ECEP (Energy Conservation Environmental Protection), People-oriented.
Corporate values: Sincerity, Cooperation, Innovation, Environmental.
Quality policy: Create excellent quality, Exceed customer expectations.
Environmental Policy: Legislation compliance, Environmental protect implemention, Pollution prevention, Energy efficiency, Waste induction, Continuous improvement.
Vision: Technology innovation creates good lives.
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HINNOTECH Materials Introduction
Product Properties
PCB Application
End-user Application
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Product PropertiesItems Conditions Units H-840 H-850 H-880 H-850G
MaterialClassific-
ation
IPC-4101C - - 101 99 126 125
ANSI - - FR4(Normal)
FR4(Mid)
FR4(High) FR4(Mid)
Cure system - - PN PN PN PN
Halogen Free - - No No No Yes
Lead Free - - Yes Yes Yes Yes
General Charact-eristics
Tg DSC ℃ 145 155 180 155
Tg TMA ℃ 135 145 170 145
T260 TMA min 65 85 100 >120
T288 TMA min 12 18 20 >60
Td 5% wt loss ℃ 340 345 345 350
Z-CTE before Tg ppm/ ℃ 40 40 40 40
Z-CTE after Tg ppm/ ℃ 260 245 245 245
Z-CTE 50~260℃ % 3.5 3.2 2.8 3.2
Peel Strength HTE 1oz lb/in 9.0 9.0 9.0 9.0
Moisture Absorption D-24/23 % 0.09 0.09 0.08 0.14
Solder Heat Resistance(288 Floating, 10sec/cycle)℃ - - >6cycle >6cycle >6cycle >6cycle
Dk 1GHz - 4.8 4.8 4.8 4.8
Df 1GHz - 0.014 0.014 0.014 0.010
CAF 85 /85% ℃RH,50V hrs >2000 >2000 >2000 >2000
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PCB ApplicationItems Conditions Units H-840 H-850 H-880 H-850G
PCB Process
Layer count - - 2-10 2-24 >20 2-24
Total thickness - - 0.4-2.4 0.4-3.2 0.4-6.0 0.4-3.2
Cu thickness (max) Inner OZ 4 6 6 6
Line/Space (Min)Inner mil 2/2 2/2 2/2 2/2
Outer mil 3/3 3/3 3/3 3/3
Through hole diameter (min) - mm 0.25 0.25 0.25 0.25
Through hole pitch (min) - mm 0.60 0.60 0.60 0.60
Aspect Ratio (max) - - 10:1 14:1 18:1 14:1
Lamination - - 40min/180℃ 60min/180℃ 60min/180℃ 60min/180℃
Drilling - - Lead Free FR4 Lead Free FR4 Lead Free FR4 Lead Free FR4
Desmear - - Lead Free FR4 Lead Free FR4 Lead Free FR4 Lead Free FR4
HINNOTECH Products have high performance /cost
ratio.
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End-user Application
Items H-840 H-850 H-880 H-850G
Application Type
AV Equipment ◎ ◎ ○ ◎
Digital Camera ◎ ◎ ○ ◎
Game Machine ◎ ◎ ○ ◎
Personal Computer ◎ ◎ ○ ◎
Liquid Crystal Display ○ ○ ◎ ○
Server ○ ◎ ◎ ◎
Mobile Phone ◎ ◎ ◎ ◎
Exchanger ○ ◎ ◎ ◎
Semiconductor - ○ ◎ ○
Memory Module ◎ ◎ ◎ ◎
Semiconductor Testing Device - ○ ◎ ○
Auto Engine Control ○ ◎ ◎ ◎
Remark: excellent application, ○ good application.◎
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Laminate Property Benchmark
Lead-free Normal Tg Benchmark
Lead-free Mid Tg Benchmark
Lead-free High Tg Benchmark
Lead-free & Halogen-free Benchmark
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Lead-free Normal Tg BenchmarkItem Unit H-840 NP-140M S1141K
F IT-588
Tg (DSC) ℃ 145 135 140 138
T260(TMA) min >60 35 >60 >60
T288(TMA) min 12 7 >15 15
Decomposition Temperature(5% wt loss) ℃ 340 326 >350 345
Z-CTE (before Tg) ppm/ ℃ 40 60 56 50
Z-CTE (after Tg) ppm/ ℃ 260 285 256 260
Z-CTE(50~260 )℃ % 3.5 4.2 4.0 3.8
Peel Strength (HTE 1oz) lb/in 9.0 11.5 9.0 8.8
Moisture Absorption (D-24/23) % 0.09 0.13 0.10 0.11
Solder Heat Resistance(288 Floating, 10sec/cycle)℃ - >6cycle >6cycle >6cycle >6cycle
Dk(1GHz) - 4.8 4.4 4.7 4.7
Df(1GHz) - 0.014 0.016 0.015 0.015Remark: based on 1.6mm.
H-840 has higher Tg, lower CTE and lower moisture absorption, which shows it has better thermal resistance than other similar materials.
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Lead-free Mid Tg BenchmarkItem Unit H-850 IS400 TU-662 EM-825 S1000 IT-158
Tg (DSC) ℃ 155 150 150 150 155 155
T260(TMA) min >60 60 >60 >60 60 >60
T288(TMA) min 18 10 15 15 10 17
Decomposition Temperature(5% wt loss) ℃ 345 330 340 340 335 345
Z-CTE (before Tg)ppm/ ℃
4030 50 50 49 46
Z-CTE (after Tg)ppm/ ℃
245250 260 260 250 255
Z-CTE(50~260 )℃ % 3.2 3.0 3.4 3.4 3.4 3.3
Peel Strength (HTE 1oz) lb/in 9.0 8.0 8.5 8.5 8.0 8.8
Moisture Absorption (D-24/23) % 0.09 0.13 0.13 0.09 0.10 0.10
Solder Heat Resistance(288 Floating, 10sec/cycle)℃ -
>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle
Dk(1GHz) - 4.8 3.9 4.7 4.7 4.7 4.7
Df(1GHz) - 0.014 0.022 0.015 0.015 0.013 0.015Remark: based on 1.6mm.
H-850 has excellent thermal resistance, low CTE, high peel strength and low moisture absorption. Its properties are similar to the others’.
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Lead-free High Tg BenchmarkItem Unit H-880 370HR TU-752 EM-827 S1000-2 IT-180A
Tg (DSC) ℃ 180 180 180 175 180 >170
T260(TMA) min >60 60 >60 >60 60 >60
T288(TMA) min 20 10 >15 30 20 20
Decomposition Temperature(5% wt loss) ℃ 345 330 350 345 345 350
Z-CTE (before Tg)ppm/ ℃
4050 45 45 45 45
Z-CTE (after Tg)ppm/ ℃
245270 255 255 250 250
Z-CTE(50~260 )℃ % 2.8 3.2 2.8 2.8 3.0 3.0
Peel Strength (HTE 1oz) lb/in 9.0 7.5 8.0 8.5 7.5 8.5
Moisture Absorption (D-24/23)
% 0.080.12 0.10 0.012 0.10 0.10
Solder Heat Resistance(288 Floating, 10sec/cycle)℃ -
>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle
Dk(1GHz) - 4.8 4.6 4.7 4.7 4.8 4.7
Df(1GHz) - 0.014 0.016 0.015 0.015 0.013 0.015Remark: based on 1.6mm.
H-880 also has high reliability as same as other high Tg materials.
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Lead-free & Halogen-free BenchmarkItem Unit H-850G R-1566 MCL-E-67G DE-156 NPG EM-285 S1155 IT-150G
Tg (DSC) ℃ 155 150 - 155 150 150 135 156
Tg (TMA) ℃ 145 142 145 145 140 141 126 148
T260(TMA) min >120 >60 >60 >60 >60 >60 >60 >60
T288(TMA) min >60 >60 >60 >60 >60 >60 >60 >60
Decomposition Temperature(5% wt loss) ℃ 350 350 340 390 348 340 355 355
Z-CTE (before Tg)ppm/ ℃
4040 50 45 35 50 45 45
Z-CTE (after Tg)ppm/ ℃
245255 250 220 210 250 260 260
Z-CTE(50~260 )℃ % 3.2 3.2 3.1 2.8 3.1 3.1 3.5 3.3
Peel Strength (HTE 1oz) lb/in 9.0 9.5 8.0 7.0 8.0 8.5 8.0 >6.0
Moisture Absorption (D-24/23) % 0.14 0.13 0.08 0.10 0.29 0.08 0.015 <0.5
Solder Heat Resistance(288 Floating, 10sec/cycle)℃ -
>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle >6cycle >6cycle
Dk(1GHz) - 4.8 4.8 4.7 4.5 4.6 4.7 4.9 4.7
Df(1GHz) - 0.010 0.009 0.009 0.014 0.012 0.009 0.011 0.012Remark: based on 1.6mm. H-850G also has good thermal resistance, low CTE,
high peel strength and low Df properties.
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PCB Process Properties
Inner Layer
Laminate
Drilling
Desmear
Punch or Routing
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Inner layer
The first board test must be taken to find suitable parameter (dimension compensation) before mass production.
For Oxide treatment, we prefer to multibond and recommend to use lead free medicament.
Recommend to post-oxide baking for at least 40min at 120 to remove moisture. ℃
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Lamination
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Drilling
H-880 H-850GH-850H-840FR4
370HREM827
Remark: 2000hit, 1.6mm 2PNL/stack for Φ0.4mm hole.
HINNOTECH products have low drilling
loss that is close to traditional FR4
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Desmear
Desmear cycles
Desmear
Loss
Desmear
Items
2
0.5
H-880
1
0.8
H-850
111
111
H-850GH-840FR4
H-840 and H-850G have good desmear properties as same as traditional FR4. But H-850 and H-880 are a little difficult to be desmeared comparing to traditional FR-4.
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Punch or Routing
Material TypeH-840 Punch or RoutingH-850 RoutingH-880 Routing
H-850G Punch or Routing
Punch ability comparison (FR4 、 H-840 、 H-850G)
H-840 and H-850G are same as
traditional FR4 for punch.
Guideline for punch or routing
Based on 1.6mm thickness.
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Summary
HINNOTECH lead-free or/and halogen-free materials have excellent performances such as high thermal resistance, high peel strength, low CTE, and so on.
The PCB process properties are quite excellent for HINNOTECH materials. Especially, their drilling loss are lower than similar materials in present market, which can help PCB to achieve cost down.
HINNOTECH products have high performance/cost ratio.
Based on the above information, it is absolutely optimal choice to use HINNOTECH lead-free or/and halogen-free materials for lead-free assembly application.
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UL Certification
UL File No. E335867
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Prepreg Manufacturing Process
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Laminate Manufacturing Process
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Thank you !