CONFERENCE PROGRAM

Wednesday, 10th of May 19:00 21:00

Welcome Reception Steering Committee Meeting

Thursday, 11th of May

Breakfast from 7:30 to 8:30 08:30 Opening Ceremony Room: Conference Room, Chaired by Anna Stoynova & Heinz Wohlrabe 08:45 Oral session 1 Room: Conference Room, Chaired by Anna Stoynova & Heinz Wohlrabe KN1 Old Boys about the Historic Times and Sites of the Spring Seminars, W. Sauer, K. Wolter, Z. Illyefalvi-Vitez, P.

Philippov, M. Somora, L. Golonka, J. Nicolics, P. Svasta, P. Mach Budapest University of Technology and Economics, Hungary

KN2 A Research Retrospective: Looking Back to Look Forwards J. Morris, Portland State University, United States

A06 Possible NO and CO Gas Sensing Using Pseudobrookite Thick Films G. Miskovic, M. Lukovic, M. Nikolic, Z. Vasiljevic, J. Nicolics, O. Aleksic, Technical University of Wien, Austria

A16 A Comparison of Embroidered and Screen-printed Ultra-Wideband Antennas M. Pavec, T. Bystricky, D. Moravcova, J. Reboun, R. Soukup, J. Navratil, A. Hamacek University of West Bohemia, Czech Republic

A22 Low Temperature Epitaxial Growth of In(x)Al(1-x)N on Epitaxially Grown SiC/Si (111) Wafers J. Tot, R. Dubreuil, D. Alexandrov, Lakehead University, Canada

10:45 Coffee break 11:00 Oral session 2 Room: Conference Room, Chaired by Philip Philippov & Johann Nicolics KN3 Advanced Automotive Electronics for Autonomous Driving

K. Wolter, V. Sundaram, R. Tummala, Technical University of Dresden, Germany D12 Corrosion Reliability of Lead-free Solder Systems Used in Electronics

F. Li, V. Verdingovas, B.Medgyes, R. Ambat, Technical University of Denmark, Denmark D14 Failure Analysis and Prediction using Neural Networks in the Chip Manufacturing Process

E. Sipos, L. Ivanciu, Technical University of Cluj-Napoca, Romania D20 Use of Impedance Spectroscopy for Detection of Water Layer Formation and Sequential Failure on PCBA

surface V. Verdingovas, P. Eckold, R. Ambat, Technical University of Denmark, Denmark

D21 Machine Learning for Additive Manufacturing of Electronics S. Stoyanov, C. Bailey, University of Greenwich, UK

13:00 Lunch 14:00 Oral session 3 Room: Conference Room, Chaired by Chris Bailey & Alena Pietriková KN4 Overview of Humidity Driven Reliability Issues of Electronics

R. Ambat, Technical University of Denmark, Denmark K04 Low Temperature Properties of Thin-Film Resistors on Laminates – a Behavioral Modeling

F. Balik, A. Dziedzic, Wrocław University of Science and Technology, Poland G11 Synthesis of gold nanoparticles with different kinds of stabilising agents

O. Rac-Rumijowska, M. Fiedot, P. Suchorska Woźniak, H. Teterycz Wrocław University of Science and Technology, Poland

H02 Analysis of Typical Semiconductor Manufacturer Layout Recommendations in Respect of EMC Behavior of DCDC Converter V. Todorov, P. Philippov, Techproject EMC GmbH, Austria

15:30 Coffee break 15:50 Poster Session 1 Room: Poster Room, Chaired by Nelu Blaz & Tomas Blecha D01 Investigating the Activation Energy of Intermetallic Layer Growth in

Innolot Solder Alloy O. Krammer, Á. Hadarits, Budapest University of Technology and Economics, Hungary

D02 Influence of Aging on Printed Passive Components Parameters T. Blecha, University of West Bohemia, Czech Republic

D03 Study of Temperature Profile Influence on Intermetallic Growth D. Bušek, K. Dušek, O. Renza, Czech Technical University in Prague, Czech Republic

D04 Wetting Balance Test - Comparison of Solder Alloys Wetting D. Bušek, M. Plaček, D. Růžička, Czech Technical University in Prague, Czech Republic

D05 Comparison of Mechanical Resistance of SnCu and SnBi of Solder Joints K. Dušek, D. Bušek, A. Ptráč, M. Kozák, A. Rudajevová, Czech Technical University in Prague, Czech Republic

D06 Ultrasonic Soldering, Mechanical Properties of Solder Joints K. Dušek, D. Bušek, M. Čepek, A. Rudajevová, Czech Technical University in Prague, Czech Republic

D09 Reliability Assessment of Electronic Units Included in Complex Electronic Systems N. Nikolov, T. Papanchev, A. Georgiev, Technical University of Varna, Bulgaria

D10 Reliability Assessment of Electricity Distribution Substation Surge Protection System N. Dimitrova, N. Nikolov, A. Georgiev, M. Vasileva, Technical University of Varna, Bulgaria

D11 Comparison of the Characteristics of PCB Protective Coatings M. Fridrichovský, F. Steiner, Martin Hirman, University of West Bohemia, Czech Republic

D13 Investigating Current Density in the Lead Free Solder Joints of Surface Mounted Resistors A. Géczy, D. Straubinger, O. Krammer, T. Hurtony, A. Kovács, Budapest University of Technology and Economics, Hungary

D15 Electrochemical Migration of Lead-free Solder Alloys in Na2SO4 Environment B. Medgyes, S. Ádám, V. Verdingovas, L.Tar, G. Harsányi, R. Ambat Budapest University of Technology and Economics, Hungary

D16 Electrochemical Migration Investigations on Sn-Sb Solder Alloys Using 3.5 wt% NaCl Solution B. Medgyes, R. Kiss, S. Szurdán, R. Dániel, L. Gál, R. Gál, G. Harsányi Budapest University of Technology and Economics, Hungary

D17 Life Cycle Test Bench for LiFePO4 Batteries R. Etz, D. Petreus, T. Patarau, C. Orian, Technical University of Cluj-Napoca, Romania

D18 Thermal Behaviour Study of Corroded Magnesium Alloys Used in Electronic Devices A. Stoynova, Y. Marcheva, B. Bonev, M. Loukaycheva, B. Dimova Technical University of Sofia, Bulgaria

D22 Comparative Shear Tests of Some Low Temperature Lead Free Solder Pastes Relating to their Thermal Diffusivity M. Branzei, M. Vladescu, I. Plotog, T. Cucu, University “Politehnica” of Bucharest, Romania

D23 Software Instrument for Testing Cluster Devices Using High-speed CAN Protocol M. A. Taut, M. Daraban, D. Pitica, Technical University of Cluj-Napoca, Romania

D24 The Analysis of Reliability of Solder Joints on SMD Ceramic Resistor Arrays V. Novotný, J. Skácel, I. Szendiuch, J. Šandera, Brno University of Technology, Czech Republic

D26 Microcontroller Based Thermal Enclosure for Electronic Boards Testing A. Lita, D. Visan, A. Mazare, University of Pitesti, Romania

17:20 Coffee break 17:40 Poster session 2 Room: Poster room, Chaired by Ivan Szendiuch & Ciprian Ionescu A11 A Multiplexor Based on Dynamic Heterogeneities

Y. Sydorenko, O. Oliinyk, B. Tsyganok, National Technical University of Ukraine, Ukraine I02 Electronic Test System for “Hasler” Type Locomotive Speedometers

N. Dodev, E. Dimitrov, N. Nenov, University of Transport, Bulgaria I03 Colour Sensing of Humidity Using Thin Films of Hydrophilic Cationic Copolymers

K. Lazarova, L. Todorova, D. Christova, T. Babeva Institute of Optical Materials and Technologies, Bulgarian Academy of Sciences

I04 Analysis of Loudspeakers Directivity Diagram vs Frequency and Impact to Sound Systems Effectiveness S. Filipov, S. Pleshkova, Technical University of Sofia, Bulgaria

I05 Development of System Model for Audio Visual Control of Mobile Robots with Voice and Gesture Commands Z. Zahariev, S. Pleshkova, Technical University of Sofia, Bulgaria

I08 On the Mass Sensitivity of Rayleigh Surface Acoustic Wave (RSAW) Resonators I. Avramov, U. Stahl, Institute of Solid State Physics, Bulgarian Academy of Sciences

I10 Virtual System for Analysis of Treated Water G. Nikolov, M. Marinov, I. Ruskova, E. Gieva, Technical University of Sofia, Bulgaria

I11 Design and Realisation of Planar Capacitive Proximity Sensor Based on LTCC Using Simulation Software S. Zuk, A. Pietrikova, I. Vehec, Technical University of Kosice, Slovak Republic

I12 A Review on Current eCall Systems for Autonomous Car Accident Detection A. Bonyár, O. Krammer, A. Géczy, J. Kámán, B. Illés, H. Sántha, G. Harsányi Budapest University of Technology and Economics, Hungary

I13 Design of Miniature 9 DoF Inertial Module with GSM/GPRS and Bluetooth Connectivity R. Miletiev, P. Kapanakov, E. Iontchev, R. Yordanov, Technical University of Sofia, Bulgaria

I14 Active Tamper Detection Circuit Based on the Analysis of Pulse Response in Conductive Mesh D.-C. Vasile, P. Svasta, M.-O. Dima, M. Safta, University “Politehnica” of Bucharest, Romania

I15 Analysis of the Harmonic Spectrum and the Amplitude Induced Error on the Mains Frequency Deviation Measurement Using Elements of the Subtraction Procedure D. Badarov, G. Mihov, Technical University of Sofia, Bulgaria

I16 Position Sensors with Sidewall Piezoresistors for Challenging Applications V. Stavrov, G. Stavreva, E. Tomerov, Y. Tsenkov, A. Shulev, AMG Technology Ltd., Bulgaria

I17 Multi Sensor Control Based on Fuzzy Logic N. Brayanov, A. Stojnova, Technical University of Sofia, Bulgaria

I18 Hardware Latency Investigation for an Autonomous Miniature Vehicle A. Tulbure, C. Hutanu, A. Tulbure, “1 DECEMBRIE 1918” University of Alba Iulia, Romania

I21 Environmental Noise Monitoring and Mapping M. Marinov, D. Nikolov, B. Ganev, G. Nikolov, Technical University of Sofia, Bulgaria

I22 Continuous Monitoring of Free-roaming Animals’ Behavior with Ear-tag Device Y. Tsenkov, V. Tsenev, Electroninvest Ltd., Bulgaria

I23 Fully Ink-Jet Printed Capacitive Pressure Sensor M. Kisić, N. Blaž, Č. Žlebič1, L. Živanov, I. Nikolić, University of Novi Sad, Serbia

I24 Flexible Polyimide Based Capacitive Displacement Sensor M. Kisić, N. Blaž, Č. Žlebič, L. Živanov, A. Huđik, University of Novi Sad, Serbia

I25 Flexible Smart Tag for Cold Chain Temperature Monitoring K. Sima, T. Syrovy, S. Pretl, J. Freisleben, P. Kubersky, A. Hamacek, University of West Bohemia, Czech Republic

I26 Hardware implementation of integrated navigation and inertial system R. Miletiev, P. Kapanakov, E. Iontchev, R. Yordanov, Technical University of Sofia, Bulgaria

I27 Displacement Sensor Fabricated by 3D Additive Manufacturing N. Blaž, M. Kisić, L. Živanov, M. Damnjanović, University of Novi Sad, Serbia

G07 Limitations of Variable Shaped Electron Beam Lithography for Advanced Research and Semiconductor Applications I. Kostic, K. Vutova, A. Bencurova, A.Ritomsky, R. Andok, Institute of Informatics, Slovak Academy of Sciences, Slovakia

19:30 21:00

Dinner Steering Committee Meeting on Demand

Friday, 12th of May

Breakfast from 7:30 to 8:30 8:30 Oral session 4 Room: Conference Room, Chaired by Jan Felba & James Morris KN5 Co-Simulation and Modelling for Heterogeneous Integration of High-Tech Electronic Systems

C. Bailey, University of Greenwich, UK I06 Self-sensing Cantilevers with Nano-laminated Dielectric-Metal-Dielectric Resistors

V. Stavrov, G. Stavreva, E. Tomerov, C. Dikov, P. Vitanov, AMG Technology Ltd., Bulgaria I07 Ceramic Micro APGD Device with Evaporating Liquid Flowing Cathode for Analytical Purposes

J. Macioszczyk, T. Matusiak, P. Jamróz, L. Golonka, Wrocław University of Science and Technology, Poland I09 3D Glass Packages for Miniaturized Automotive Cameras

K. Wolter, C. Buch, R. Tummala, Technical University of Dresden, Germany

I20 Smart Sensor Integration in Minimally Invasive Surgery Tools D. Wagner, K. Pitschmann, B. Schmidt, U. Schumann, S. Freidank, M. Detert Otto-von-Güricke-University Magdeburg, Germany

I28 Chlorine gas sensor to work in high humidity conditions M. Fiedot, O. Rac-Rumijowska, P. Suchorska-Woźniak, H. Teterycz Wrocław University of Science and Technology, Poland

11:00 Coffee break 11:20 Poster session 3 Room: Poster room, Chaired by Andrzej Dziedzic & Reinhard Bauer E01 Numerical Study of Vapour Concentration Reduction in a Vacuum Vapour Phase Soldering Oven

B. Illés, A. Skwarek, Attila Géczy, Budapest University of Technology and Economics, Hungary E02 Analysis and Simulation Modeling of Programmable CFOA-Based Universal Filters with CMOS Digital

Potentiometers I. Pandiev, Technical University of Sofia, Bulgaria

E03 Pspice Discharge Model for Simulation Circuits with Lead-Acid Battery P. Ovidiu Aurel, A. Taut, A. Grama, R. Fizesan, E. Ceuca, Technical University of Cluj-Napoca, Romania

E04 A Comparison of Control Methods for Production Areas with Time Constraints and Tool Interruptions in Semiconductor Manufacturing C. Maleck, T. Eckert, Technical University of Dresden, Germany

E05 Extraction of Solar Cell Parameters using Source Measure Unit G. Nikolov, B. Nikolova, E. Gieva, I. Ruskova, Technical University of Sofia, Bulgaria

E06 Development of Method and Algorithm for Comparative Analysis with Simulative Software of Different Encryption Facilities Implementing PKI Infrastructure for Securing Transmitting of Audio Information D. Kinanev, S. Pleshkova, Technical University of Sofia, Bulgaria

E07 Simulation of a Wireless Charger System D. Filip, D. Petreus, University of Cluj Napoca, Romania

E10 Computer modeling of graphene nanoribbon interconnects E. Gadjeva, P. Popova, M. Hristov, G. Angelov, Technical University of Sofia, Bulgaria

E12 Circuit Modeling of Green Fluorescent Protein’s Hydrogen Bonding Network in Cadence R. Rusev, G. Angelov, E. Gieva, M. Hristov, Technical University of Sofia, Bulgaria

E13 Modelling of a Converter in an Energy Storage System with Parallel Working Units B. Gilev, N. Hinov, I. Nedyalkov, University of Telecommunication and post, Bulgaria

E14 Modeling of Synchronous DC-DC Converter with Guaranteed Parameters D. Arnaudov, N. Hinov, H. Kanchev, T. Hranov, Technical University of Sofia, Bulgaria

E15 2D Multiphysics Frequency Simulations of Thin-Film Bulk Acoustic Wave Resonator M. Terzieva, D. Gaydazhiev, B. Nikolova, Technical University of Sofia, Bulgaria

E16 SRAM Design Based on Carbon Nanotube Field Effect Transistor’s Model with Modified Parameters M. Spasova, D. Nikolov, G. Angelov, R. Radonov, M. Hristov, Technical University of Sofia, Bulgaria

E17 The Evaluation of Parameters of Evaporated Aluminium Layers Depending on Initial Conditions I. Beshajová, M. Molhanec, K. Dušek, Czech Technical University in Prague, Czech Republic

E18 An Evaluation of Components Offset and Solder Spreadability Using Factorial Experiments M. Molhanec, M. Novák, Czech Technical University in Prague, Czech Republic

E19 Modelling and Control of a Grid-connected PV System for Smart Grid Integration H. Kanchev, N. Hinov, D. Arnaudov, R. Stanev, Technical University of Sofia, Bulgaria

E20 Model of Intelligent Traffic Sensors – Application in Hardware in the Loop F. Nemtanu, I. Costea, L. Obreja, University “Politehnica” of Bucharest, Romania

E21 Simulation and Implementation of a Pulse Position Modulator for Short-Range Optical Communication Systems D. Visan, I. Lita, L. Ionescu, I. Cioc, University of Pitesti, Romania

13:00 Lunch 14:00 Poster session 4 Room: Poster room, Chaired by Ioan Lita & Balázs Illés A01 Microstructural and Compositional Characterization of LTCC Multilayer Elements Based on CaCu3Ti4O12-

type Ceramics A.Skwarek, B. Illés, R. Socha, D. Szwagierczak, Institute of Electron Technology, Kraków Division, Poland

A02 Electrical and Optical Characterization of Sputtered ZnO:Ga Thin Films Doped with Nitrogen K. Shtereva, V. Tvarozek, J. Kovac, I. Novotny, O. Szabo, M. Vojs, S. Kovacova, University of Ruse „Angel Kanchev”, Bulgaria

A03 Flexible Optoelectronic Device with Polymer Based Electrode on Hybrimer Substrate M. Aleksandrova, G. Dobrikov, A. Singh, V. Videkov, G. Kolev, Technical University of Sofia, Bulgaria

A07 Comparison of Copper and Silver Thick Film on Alumina Substrates Properties J. Hlina, J. Reboun, A. Hamacek, University of West Bohemia, Czech Republic

A09 Aerosol Jet Silver Printed Lines on Subsequently Bent Glass Substrates J. Navratil, M. Pavec, J. Reboun, T. Rericha, A. Hamacek, University of West Bohemia, Czech Republic

A10 Mechanical Analysis of Experimental Sugar-based Bioepoxy Printed Circuit Boards L. Gál, A. Géczy, I. Hajdu, Budapest University of Technology and Economics, Hungary

A12 Obtaining and Characteristics of Y-type Hexaferrite Ba2Mg2Fe12O22 Powders B. Georgieva, T. Koutzarova, S. Kolev, K. Krezhov, Daniela Kovacheva, Institute of Electronics, Bulgarian Academy of Sciences

A13 Impedance Response of Pseudobrookite Thick Films with a Sandwich Configuration M. Lukovic, M. Nikolic, Z. Vasiljevic, N. Blaz, S. Lukovic, O. Aleksic, University of Belgrade, Serbia

A14 Logic Elements Based on Photoconductive Polycrystals A2B6 O. Dzekaniuk, O. Oliinyk, B. Tsyganok, National Technical University of Ukraine, Ukraine

A15 Photocell on CdS O. Horlachov, O. Oliinyk, B. Tsyganok, National Technical University of Ukraine, Ukraine

A17 Possibility of PCBs’ Miniaturization by Using Thick Film Polymer Resistors T. Rovensky, A. Pietrikova, I. Vehec, Technical University of Kosice, Slovak Republic

A18 Electrochemical Impedance Spectroscopy for Different Types of Supercapacitors R. Negroiu, P. Svasta, C. Pirvu, Al. Vasile, C. Marghescu, University “Politehnica” of Bucharest, Romania

A19 In-line Thickness Control of Self-sensing Cantilevers for Advanced AFM Applications V. Stavrov, G. Stavreva, E. Tomerov, V. Todorov, I. Buchvarov, AMG Technology Ltd., Bulgaria

A20 Refining Effect of Electron Beam Melting on Recycling of Nickel Wastes K. Vutova, V. Vassileva, T. Tanaka, Institute of Electronics, Bulgarian Academy of Sciences, Bulgaria

A23 Investigations on Implementing Solder Alloy Free Technology for Electronics Based on Printed Conductive Paste C. Ionescu, G. Vărzaru, N. Codreanu, C. Marghescu, University “Politehnica” of Bucharest, Romania

A24 Structural and Electrooptical Properties of Sn-doped VO2 Films Produced by Spray Pyrolysis A. Mrigal, M. Addou, M. El Jouad, N. Choukri, M. Aleksandrova, Ibn Tofail University, Morocco

K01 Implementation of a Fuzzy Logic-Based Embedded System for Temperature Control G. Oltean, L. Ivanciu, Technical University of Cluj-Napoca, Romania

K02 Spiral Inductor Fabricated by 3D Additive Manufacturing A. Menićanin, L. Živanov, D. Movrin, N. Blaž, University of Belgrade, Serbia

K03 Influence of Fabrication Parameters on Performance of LTCC Ferrite Core Solenoid Inductor A. Marić, G. Radosavljević, N. Blaž, Lj. Živanov, University of Novi Sad, Serbia

K05 Data-Driven Prognostics for Smart Qualification Testing of Electronic Products M. Ahsan, S. Stoyanov, C. Bailey, University of Greenwich, UK

K06 Influences of SMD Sample Preperation and Examination Conditions on Shear Test Results C. Henning, R. Schumann, R. Bauer, University of Applied Sciences, Germany

16:00 Museum 19:00 Dinner

Saturday, 13th of May Breakfast from 7:30 to 8:30

8:30 Poster session 5 Room: Poster room, Chaired by Oliver Krammer & Stoyan Stoyanov B01 Possibility of Cooling via Channels Embedded in Multilayer LTCC

T. Girasek, A. Pietrikova, T. Welker, J. Müller, Technical University of Kosice, Slovak Republic B02 Flat Pipe Cooling System for SMD Chips

M. A. Ilie, P. Dan, L. Viman, Technical University of Cluj-Napoca, Romania B03 Comparison of Synthetic Air Jet vs. Passive Heat Sinks for Cooling COB LED Modules

N. Bădălan(Drăghici), P. Svasta, N. Codreanu, University “Politehnica” of Bucharest, Romania B04 Material Study for Full-faced Heating Layers, Integrated in Printed Circuit Boards

D. Seehase, F. Lange, A. Novikov, M. Nowottnick, University of Rostock, Germany B05 Investigation of the Efficiency of the Heat Dissipation for the Heat-conducting Circuit Boards Made of

Aluminum with the Nanoporous Alumina Layer S. Andreev, K. Chernyakova, B. Tsaneva, V. Videkov, I. Vrublevsky, Belarusian State University of Informatics and Radioelectronics, Belarus

B06 LEDs’ Thermal Management For Special Application P. Mashkov, H. Beloev, B. Gyoch, R. Kandilarov, T. Pencheva, University of Ruse „Angel Kanchev”, Bulgaria

B07 Thermal Characterization of a 500W Motor Driver Module with Embedded Power Transistors J. Nicolics, M. Unger, S. Groß, M. Morianz, H. Stahr, Technical University of Wien, Austria

B08 Application of CFD Modeling to Solve Problems in Thermal Design of LED Applications in the Initial Project Phase N. Vakrilov, A. Stoynova, N. Kafadarova, Technical University of Sofia, Bulgaria

B09 Investigations of Thermal Influences on Clock Speed of Embedded Devices A. Fodor, R. Jano, D. Pitica, Techincal University of Cluj-Napoca, Romania

B10 Cooling Method for High Power dissipation SMD Packages A. Kotlar, P. Svasta, University “Politehnica” of Bucharest, Romania

B11 Testing of the Thermal Model of Microprocessor P. Markowski, M. Gierczak, A. Dziedzic, Wrocław University of Science and Technology, Poland

F01 LED Lighting for Ecological Environment in Closed Areas Intended for Senior Citizens B. Gyoch, H. Beloev, R. Kandilarov, P. Mashkov, T. Pencheva, University of Ruse „Angel Kanchev”, Bulgaria

F02 Application of Microwave in Food Preservation A. Grama, O. Pop, A. Taut, L. Grama, Technical University of Cluj-Napoca, Romania

F03 Environmental Aspects of New Embedded Power Modules with 500 W and 50 kW M. Franz, M. Unger, R. Kollmann, University of Technology TU–Wien, Vienna, Austria

F04 New Trends of Power Electronics for Washing Machines E. Ceuca, O. Pop, I. Pocan, “1 DECEMBRIE 1918” University of Alba Iulia, Romania

F05 Materials Made of Renewable Resources in Electrical Engineering A. Staat, K. Harre, R. Bauer, University of Appllied Sciences Dresden, Germany

F06 Practical Behavior and Technology Challenges for Smart Home E.Ceuca, G. Corsiuc, I. Gavrila, “1 DECEMBRIE 1918” University of Alba Iulia, Romania

G02 Morphological Study of Sol-Gel Derived ZnO:In Thin Films T. Ivanova, A. Harizanova, T. Koutzarova, B. Vertruyen, B. Stefanov, Central Laboratory of Solar Energy and New Energy Sources, Bulgarian Academy of Sciences

G03 Investigation of Indium and Gallium Co-doped ZnO Films, Derived by Sol-Gel Method T. Ivanova, A. Harizanova, T. Koutzarova, B. Vertruyen, Central Laboratory of Solar Energy and New Energy Sources, Bulgarian Academy of Sciences

G04 Selective Patterned Growth of ZnO Nanorods/Nanosheets on Carbon Fabric and Their Wearable Properties P. Veluswamy, F. Khan, S. Sakamoto, Y. Hayakawa, H. Ikeda, Shizuoka University, Hamamatsu, Japan

G05 Design of Synthesized Hybrid Magnetite Filler in the Porous Texture of Activated Carbon and Influence on the Microwave Properties of Natural Rubber Composites K. Ruskova, P. Malinova, R. Nickolov, Technical University of Sofia, Bulgaria

G06 Quantum-Mechanical Modelling of Nanoelectronic Devices G. Hałdaś, A. Kolek, Rzeszów University of Technology, Poland

G08 Characterization of ZnO Nanolayers by Complex Impedance Spectroscopy Y. Marinov, T. Vlakhov, B. Blagoev, G. Luka, T. Krajewski, E. Guziewicz, E. Vlakhov Georgi Nadjakov Institute of Solid State Physics, Bulgarian Academy of Sciences

G10 Investigation of the AFM Contact Mode Force Calibration with Simulation J. Kámán, A. Bonyár, Budapest University of Technology and Economics, Hungary

10:40 Coffee break 11:00 Poster session 6 Room: Poster room, Chaired by Ryszard Kisiel & Emilian Ceuca C01 Combination of Solid-Liquid Interdiffusion and Sintering Bonding for GaN Devices Assembly

R. Kisiel, M. Myśliwiec, Warsaw University of Technology, Poland C03 Fluxless Pressure Ag Sintering in Creation of Au-Ag Connection Systems

M. Myśliwiec, R. Kisiel, Warsaw University of Technology, Poland C05 Solder Paste Hybrid Printing for Improving Solderability of Components with Different Thermal Mass

V. Tsenev, V. Videkov, A. Stratev, N. Georgiev, Technical University of Sofia, Bulgaria C06 Influence of Flexible Substrate Roughness with Aerosol Jet Printed Pads on the Mechanical Shear Strength

of Glued Joints M. Hirman, J. Navratil, R. Soukup, A Hamacek, F. Steiner, University of West Bohemia, Czech Republic

C07 Nanoparticle Based Ink Printed Chip Interconnections J. Navratil, J. Reboun, M. Hirman, T. Rericha, R. Soukup, University of West Bohemia, Czech Republic

C08 Fabrication and Characterization of Precise Titanium Nitride (TiN) Thin Film Integrated Resistors for 2.5D Interposer R. Singh, M. Boettcher, I. Panchenko, C. Fiedler, A. Schwarz, J. Wolf, Technical University of Dresden, Germany

C09 Relationships between Noise and Nonlinearity of Adhesive Conductive Joints and Joints Resistance P. Mach, S. Barto, A. Duraj, Czech Technical University in Prague, Czech Republic

C10 Influence of Continual Mechanical Stress of Climatic Ageing of Conductive Adhesive Joints P. Mach, P. Žalská, Czech Technical University in Prague, Czech Republic

C12 Additive Copper Metallization of Semiconductors to enable a copper bonding process A. Hensel, M. Mueller, J. Franke, K. Kohlmann von Platen, Friedrich-Alexander-University Erlangen-Nuremberg, Germany

C13 Different Aspects of Non-metalized Silicon Dies Joining with Using Low Temperature and Low Pressure Sintered Silver Nanoparticles K. Stojek, J. Felba, T. Fałat, A. Mościcki, Wrocław University of Science and Technology, Poland

C14 Three Solutions for Ceramic Packages J. Skácel, I. Szendiuch, Brno University of Technology; Czech Republic

H01 Analysis of IC’s Electromagnetic Field Print throughout a Decapsulation Procedure M. Safta, D.-C. Vasile, M.-O. Dima, P. Svasta, University “Politehnica” of Bucharest, Romania

H03 Protection Supply Circuit Design for Power Electronics in Automotive A. Kotlar, P. Svasta, University “Politehnica” of Bucharest, Romania

J01 Euro-Asian Cooperation for Education in Nanoelectronics. Need Analysis S. Tzanova, Technical University of Sofia, Bulgaria

J02 Complex Education Program “Project Seminar ”To Meet Today and Tomorrow Needs of Fast Developing Optical-Electronic Industry A. Belov, T. Soloveva, A. Vnukov, National Research University Higher School of Economics, Russia

J03 Modeling DC-DC Converter for Charging Supercapacitors T. Hranov, G. Vacheva, N. Hinov, D. Arnaudov, Technical University of Sofia, Bulgaria

J04 Building a Cloud Platform for Education in MicroElectronics P. Martinek, Z. Illyefalvi-Vitez, O. Krammer, A. Geczy, S. Tzanova, Budapest University of Technology and Economics, Hungary

J05 High Quality Educational Platform for Online Tutoring Researchers and Engineers C. Hutanu, A. Tulbure, “1 DECEMBRIE 1918” University of Alba Iulia, Romania

J06 Modelling Parallel-loaded Resonant Converter N. Hinov, T. Hranov, Technical University of Sofia, Bulgaria

J07 Hardware and Software Modules for Education in Electronics Manufacturing L. Docheva, I. Dochev, Technical University of Sofia, Bulgaria

13:00 Lunch Break 14:00 Oral session 5 Room: Conference Room, Chaired by Pavel Mach & Klaus-Juergen Wolter KN7 Testing challenges and requirements for advanced industrial sensor solutions

I. Ivanov, FESTO Production, Bulgaria KN6 Siemens Innovative Solutions for Electronic and Electrical Systems in the Transport in Bulgaria

M. Margaritov, SIEMENS Bulgaria, Bulgaria C02 Study on the Interdependence of Soldering Profile, Ageing Conditions and Intermetallic Layer Thickness in

Large Area Solder Joints and its Influence on Reliability A. George, J. Zipprich, M. Klingler, M. Breitenbach, M. Nowottnick, Robert Bosch GmbH, Germany

C04 Influence of Flux-Assisted Isothermal Storage on Intermetallic Compounds in Cu/SnAg Microbumps L. Wambera, I. Panchenko, W. Steller, M. Müller, M. Wolf, Technical University of Dresden, Germany

C11 Cu Passivation with Self-assembled Monolayers for Direct Metal Bonding in 3D Integration M. Lykova, I. Panchenko, M. Geidel, J. Reif, J. Wolf, K.-D. Lang, Technical University of Dresden, Germany

15:30 City Tour 18:00 19:00

Steering Committee Meeting Gala Dinner

Sunday, 14th of May

09:00 Farewell; End of conference

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