2013 14th International

Conference on Electronic

Packaging Technology

(ICEPT 2013)

Dalian, China11-14 August 2013

Pages 656-1311

IEEE Catalog Number: CFP13553-PODISBN: 978-1-4799-0499-0

2/2

D-05 Microstructure analysis of sputtered copper thin film in packaging substrate

Ping Lyu, Hongkun Yu, Techun Wang

656

D-06 Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat

dissipation substrate 660

Yong Xiao, Mingyu Li, Jongmyung Kim

D-08 High Reliability Underfill Encapsulated Fine pitch System on Flex Packages 665

Kelvin Pun, Anupam Sharma, Am, eep Singh, M.N.Islam

Session E — Advanced Manufacturing Technologies and Packaging Equipment

E-01 Research of Wet Etching in HF-Based Solution to Release SOi-Based Gyroscope

Micro-Structures

Jing Fang, Xuefang Wang, Chang Hu, Zhicheng L V, Shuai Shi, Jiaojiao Yuan, Sheng Liu, Can Gao

671

E-02 Chemical-Mechanical Polishing of Bulk Tungsten Substrate 676

Jin Luo, Yiming Zhang, Lu Song, Shuhui Chen, Yuan Bian, Tianyu Li, Yilong Hao, Jing Chen

E-03 Oxidation: A Cu Wirebonding Challenge in an Interbond Connection through SSB (Stand-off

Stitch Bond) Bonding 679

Allen M. Descartin, Yan Bei Yue, Song MeiJiang

E-04 Buried Parts Simplify Fine Geometry Electronic Packaging, Interconnect, & Assembly 685

Charles E. Bauer, Herbert J. Neuhaus

E-05 A Flexible Software Architecture for Semiconductor Packaging Equipment 690

Xiaoli Liu, Jie Huo, Zheng Zhang, Ziyang Liu, Liang Tang

E-06 Fabrication of BGA Solder Balls by Pulsated Orifice Ejection Method 694

D. Lu, F.M. Xu, L. Zhao, Y.F. Fit, W. Dong, Y. Tan, A. Kawasaki

E-07 The study on grinding process of flip chip wafers 698

Xiaobo Zhuang, Binhao Lian, JinchunHe, Xiaocheng Feng

E-08 Studies on Pressure Control of Bonding Process 702

Tang Liang, Zhuang Wenbo, Ye Leizhi, Wang Zhiyue

E-09 Study on a Novel Bond Head with Proportional Electromagnet in Chip Operation 707

Ye Lezhi, Zhuang Wenbo, Liu Yaqi, Tang Liang

E-10 Study on Volume Production of Uniform Wafer-Level Micro Glass Cavities by A Chemical

Foaming Process (CFP) 711

Yu Zou, Jintang Shang, Yu Ji, Li Zhang, Chiming Lai, Dong Chen, Kim-HuiChen

E-ll A microreactor chip integrated with focus ultrasonic transducers prepared by a modified

Chemical Foaming Process 716

Jiafeng Xu, Jintang Shang

E-12 Microfabricated Low Cost Wafer-Level Spherical Alkali Atom Vapor Cells for Chip-scale Atomic

Clock by a Chemical Foaming Process (CFP) 720

Youpeng Chen, Jintang Shang, YuJi

E-13 Study on the Influencing Factors of Peeling Strength of Aluminum Nitride DBC Substrates 724

Zhao Dongliang, Gao Ling, Liu Zhiping

E-14 Post-manufacturing Effects of Laser Ablation Process on Ceramic-Polymer CompositeSubstrates 728

Ghulam Mehdi, Hu Anyong, Jungang Miao

E-16 Dynamic Characteristics Analysis of the Flip Chip Bonding Head Based on Multiple WorkingConditions 732

Wenfeng Gong, Meifa Huang, Leilei Chen, Liang Tang, Lezhi Ye

E-17 Simulation Analysis of Jetting Dispenser Based on Two Piezoelectric Stacks 738

Wenjian Luo, Guiling Deng

Session F -- Quality & Reliability

F-03 Key Failure Modes of Solder Joints on HASL PCBs and Root Cause Analysis 742

Yao Bin, Lit Yudong, Luo Daojun

F-04 Three-Dimensional X-Ray Laminography and Application in Failure Analysis for System in

Package (SiP) 746

Yuang Chen, Na Lin

F-05 Shear Strength and Brittle Failure of low-Ag SAC-Bi-Ni Solder Joints during Ball Shear Test... 750

LIU Yang, SUNFenglian, YANG Miaosen

F-06 A Simulation of IGBT Module Under Power Cycling Test Condition 754

Xueyin Zhang, Kailong Yang, Ming Li, Ming Chen, Liming Gao

F-07 Mechanisms of High Power Laser Diode 761

Lu Guoguang, Lai Canxiong, Huang Yun, En Yunfei

F-08 Effects of POSS-Silanol Addition on the Whisker Formation in Sn3.0Ag0.5Cu Pb-Free Solder ..765

Sihan Liu, Limin Ma, Yutian Shu, Yong Zuo, Fu Guo,

F-09 Cu pumping effect under different annealing conditions 769

Hongwen He, Chongshen Song, Cheng Xua, Lei Wang, Wenqi Zhang

F-10 Effect of High Temperature Thermal Agingon Microstructural Evolution of Sn3Ag0.5Cu/CuSolderJoints 772

Hailong Li, RongAn, Mingliang Fu, Chunqing Wang, MeiZhu, Rui Zhang

F-ll Study on moisture-induced corrosion mechanism of copper wire bonding by thermodynamic

calculation 777

Yingzhi Zeng, Kewu Bai, Hongmei Jin

F-12 Growth of Cu-Sn intermetallic compounds during isothermal aging processing in electroplated

Cu/Sn/Cu system 781

Na Huang, Anmin Hu, Ming Li

F-13 The effects of creep on electromigration behaviors in Sn-based Pb-free solder joints 784

Yong Zuo, Limin Ma, Ting Wan, Lei Qiao, Sihan Liu, Fu Guo

F-14 Electro-migration of silver alloy wire with its application on bonding

Shenggang Wang, Liming Gao, Ming Li, Dacheng Huang,Ken Qian, Hope Chiu

789

F-15 Advanced Failure Analysis Techniques for SiP Defect Location and Mechanism Analysis 794

Na Lin, Yuan Chen, Guoyuan Li

F-16 Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and

Ni-Wsubstrates 798

Jiaxing Liang, Tingbi Luo, Anmin Hit, Ming Li

F-17 The fatigue life analysis of conductive adhesive 804

Peisheng Liu, Jinxin Huang

F-18 Drop performance research of silver content on the SnAgCu based lead-free solder of joint level

809

Peng Gao, Jian Lin, Yongping Lei, Guichen Wen

F-19 A Study on Solder-joints Fall-off Failure of Electroless Nickel/Immersion Gold Pad 814

Wan Zhonghua, Zou Yabing, He Guanghui, Luo Daojun

F-20 Analysis of accelerator consumption in TSV copper electroplating 818

Qi Sun, Haiyong Cao, Huiqin Ling, Ming Li

F-21 Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron

Radiation Real-time Imaging Technology 822

Mingliang Huang, Fan Yang, Ning Zhao, Fei Zhang

F-22 The influence of silver content on the reliability of lead-free solder joints under drop condition

826

Lei Yongping, Yang Jinli, Lin Jian, Fu hanguang, Liu Baoquan, Bai Hailong, Qin Junhu

F-23 Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/polycrystaIline Cu

interface during solid-state aging 830

Ming Yang, Mingyu Li, Xin Ma

F-24 The Reliability Study of a High density Multi Chip Packaging with Folding Flexible Substrate ..835

Wen Yin, Bo Zhang, Yuan Lu, Liao Anmou, Du Tianmin, Shangguan Dongkai,

F-25 Mechanical Property and Reliability of Anisotropic Conductive Adhesive in surface mount

applications 839

Huang Lin, Zhou Liangjie, Liu Hui, Wu Fengshun, Xia Weisheng, Fu Hongzhi, Wang Shiyu, Liu Zhe

F-26 Accurate Thermal Characterization of a GaN PA MMIC using Thermoreflectance Thermography .

843

J.H.L. Ling, A.A.O. Toy, K.F. Choo

F-27 Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder

joints 848

Jibing Chen, Weiwen Lv BingAn Longzao Zhou Yiping Wu

F-28 Effect of temperature on failure mode of solder joint under vibration loading condition 853

Zhang Hongwu, Zhao Tianhao, Liu Yang, Sun Fenglian

F-29 Effects of aging time on interfacial fracture behaviors of Sn3.5AgO.5Cu/Cu joints* 857

QIN Fei, WANG Xiaoliang, AN Tong

F-30 Fracture Mode of the IMC Layer in Soder Joints* 861

WANG Xuming, QIN Fei, AN Tong

F-31 Non-Destructive Testing for Defects in Electronic Package Based on Infrared Thermography* 865

LIUChengyan, QIN Fei, BAN Zhaowei

F-32 An Improved Way to Measure Thermal Impedance of Insulated Gate Bipolar Transistor (IGBT)Module for Power Electronic Packaging 870

Guo-Quan Lu, Meiyu Wang, Yunhui Mei, Xin Li,Lei Wang, Gang Chen, Xu Chen,

F-33 Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints 879

Mingliang Huang, Xianlin Hou, Hailao Ma, Jie Zhao, Yaochun Yang

F-34 Warpage Characteristics of Wafer-Level Package of MEMS with Glass Frit Bonding 883

GaoweiXu, Shuangfu Wang, Chunsheng Zhu, Jiaotuo Ye, WeiGai, Le Luo

F-35 Comparison of mechanical properties of lead-free microscale solder joints under tensile and

shear loading 888

L.M. Yin, J.X. Lin, T.T. Zhang, Z.X. Yao, C.H.Du, M.Tang

F-36 Electromigration Failure of SnAgCu Lead-free BGA Package Assembled with SnPb Solder Paste

892

Yanhong Tian, Baolei Liu, Rui Zhang, Jingkai Qin

F-38 Electromigration induced stress in Through-Silicon-Via (TSV) 896

Fei Su, Zixing Lu, Ping Liu, Weijia Li,

F-39 Effects of Pb Content on Solidification Behavior and Microstructure on Mixed Solder Alloy 903

Wei Xiongfeng, Li Xunping, Zhoubin, Wei Guoqiang

F-40 The interfacial microstructure and Kirkendall voidsin ln-48Sn/Cu solder joint 907

Fei-fei Tian, Zhi-quan Liu

F-41 Effect of Sn grain orientation on polarity effect in Sn-Ag-Cu solder joints during electromigration911

Jian-Qiang Chen, Jing-Dong Guo

F-43 The Green Material Effect on the Board Level Reliability Qualification of QFN Packages 915

Jeffrey ChangBing Lee, Li Li, Brian Smith

F-44 A study on reliability of chip scale packages in shock environments 921

Shuai Chen, Lei Wang, Mingxia Jiang, Jieying Tang

F-45 Effects of DC bias and spacing on migration of sintered nanosilver at high temperatures for

power electronic packaging 925

Guo-Quan Lu, Wen Yang, Yunhui Mei, Kin Li, Gang Chen, Xu Chen,

F-46 Tin Whisker Growth on Electroplating Sn Bilayer 931

Ting Liu, Dongyan Ding, Yu Hu, Yihua Gong

F-47 Inelastic Strain Evolution in Solder Joint under Thermal-mechanical Coupled Fatigue Loading..

937

Jian LIN, Peng GAO, Yongping LEI, Lan WANG

F-48 Research on the Stress in Stacked Chip Packages 941

Chengjie Jiang, Jia Xi, Fei Xiao, Chuanguo Dou, Heng Yang

F-49 Failure Analysis of Au-Ge Solder in Microwave Circuit Packaging 946

Lili Ma, Xing!in Huang, Jie Zha

F-50 A spatial filtering algorithm in low frequency wavelet domain for X-ray inspection image

de-noising 950

Weiwen Lv, Peng Wang, Bing An, Qiangxiang Wang, Yiping Wu

F-51 Interfacial delamination analysis at chip/underfill interface and investigation of its effect on

flip-chip'sreliability 954

Xiang Gao, Fei Wang, Sheng Liu

F-52 Effect of Interface Structure on Fatigue Life under Thermal Cycle with SAC305 Solder Joints

959

Xu Yanjun, Wang Liquan, Wu Fengshun, Xia Weisheng, Liu Hui

F-54 Groove structure for stress releasing around TSV 965

Han SUN, YudanPl, Wei WANG, Jing CHEN, YufengJIN

F-55 Study of the junction to case thermal resistance test method for IC based on ETM 968

Zhang Hongshuo, Zhao Yuanfu, Yao Quanbin, Cao Yusheng

F-56 Simulation of Bonding Wire Deformation in Random Vibration 972

Peifeng Hu, Yusheng Cao, Binhao Lian, Quanbin Yao

F-58 Research on the Rework Process of the Ceramic BallGrid Array Package 976

Yingzhuo Huang, Bo Huang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao,

F-59 Microwave Induced Plasma Decapsulation of Thermally Stressed Multi-tier Copper Wire Bonded

IC Packages 981

J.Tang, A.R.G.W. Knobben, E.G.J. Reinders, C.Th.A. Revenberg, J.B.J. Schelen, CAM. Beenakker

F-60 Sensitivity study on a MEMS inclinometer with different packaging thickness 987

Yu Yang, Daoguo Yang, Zhen Zhang, Jianzhen Zhong

F-61 The microstructure and shear behaviors of the solder joints with decreasing diameter in WLCSP

991

Xiao Li, Lin Lin,Jun Wang

F-62 Effects of Different Temperature Profile on Solder Joints in PBGA Packages 994

Fei Wang, Xiang Gao,Sheng Liu

F-64 Isothermal Aging Effect on Microstructure and Mechanical Properties of

Ni/Sn3.0Ag0.5Cu/Nilnterconnects with the Decreasing Height 997

Jing-Bo Zeng, Guang-Sui Xu, Min-Bo Zhou, Xin-Ping Zhang

F-65 Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu

Joints 1005

Wu Yue, Min-Bo Zhou, Hong-Bo Qin, Xiao Ma, Xin-Ping Zhang

F-66 Effect of the Cross-Interaction on the Solidification Behaviors of Ni/Sn-Ag-Cu/Cu Solder Joint

1010

Li Xunping, He Xiaoqi, Xu hui

F-67 Performance and Reliability Study of Pd-coated Copper Wire Bonding on ENEPIG Substrate.1014

Lulu SHI, Qian WANG, Yu CHEN, Lin TAN, Jian CAI, Xin GU, Shuidi WANG, Jingwei LI, Yang HU

F-68 Influence of Geometry of Microbump Interconnectson Thermal Stress and Fatigue Life of

Interconnects in Copper Filled Through Silicon Via Structure 1019

LHong-Bo Qin, Hui-Hui Yuwen, Min-Bo Zhou, Xin-Ping Zhang

F-69 Geometrical size effect on interfacial reaction of Cu/SAC305/Cu during high-temperature

storageaging 1025

Liangliang Luo, Fenglian Sun, Yang Liu

F-70 Reliability of RDL structured Wafer Level Packages 1029

Jia Xi, Donglun Yang, Lin Bai, Xinduo Zhai, Fei Xiao, Hongyan Guo, Li Zhang, Chi Ming Lai

F-71 Studies on Reliability of a 3D System-in-Package Device 1033

Jia Xi, Kun Lin, Fei Xiao, Xiaofeng Sun

F-73 Study of Creep Performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by Nanoindentation 1037

Yang Miaosen, Sun Fenglian, Li Xia

F-74 Accelerated Aging Test and Failure Analysis of High Brightness Light Emitting Diodes 1040

Fei Yuan, Kailin Pan, Shujing Chen, Yu Guo, Na Wei

F-75 Study on PoP reliability with different edge bonding during thermal cycling byfinite element

methods 1044

Shujing Chen, Kailin Pan. Yu Guo, Fei Yuan, Xin Wang

F-76 Effect of Die-attach Materials and Thickness on the Reliability of HP-LED 1048

Fei Weng, Peng Song, Jinlong Zhang, Jianhua Zhang, Luqiao Yin,

F-78 Research on Peel Strength of Flexible Copper Clad Laminate 1053

Jie Shuai, Bing An

F-82 Reliability Analysis of Ceramic Quad Flat Package Under Thermal Cycling Loading Conditions by

3-D Finite Element Method 1057

Qin Jingkai, Gao ling, Ji Chunfeng

F-83 Reliability research on optoelectronics packaging 1061

Fengman Liu, HaiyunXne. Fei Wan, Fengze Hou, Baoxia Li, Haidong Wang, Binbin Yang, Jian Song, Lixi Wan, Liqiang

Cao,

F-84 Effects of Temperature and Current Density on (Au,Pd,Ni)Sn4 Redistribution and Ni-P

Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints 1064

Leida Chen, Yi Feng, Xiaoyan Liu, Mingliang Huang

F-85 Application of Construction Analysis in MMIC Device Intrinsic Reliability Evaluating 1070

Liu Xin, Fang Wenxiao,

F-86 Methodology Development for Counterfeit Component Mitigation 1073

Martin Huehne, Jeffrey ChangBing Lee, Harrison Miles, Mark Schaffer

F-87 Internal Thermal Resistance Test and Analysis of Power Device based on Structure Function

1082

Zhou Bin, Li Xunping, Yang Shaohua, He Xiaoqi

F-88 Mechanism of Cu6Sn5 layer act as a diffusion barrierlayer 1086

Hua Li, Lin Qu, Huijing Zhao, NingZhao, Haitao Ma

F-90 Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint..1090

Mingliang Huang, Qiang Zhou, Haitao Ma, Jie Zhao

F-92 Drop Failure Modes of A Wafer-Level Chip-Scale Packaging 1094

Mingliang Huang, Shuang Liu, Ning Zhao, Haohui Long, Jianhui Li, Weiqiang Hong

F-93 Reliability Analysis of RGB LED on Low-temperatureThermo-mechanical Coupling Field 1099

Yu Guo, Kailin Pan, Shujing Chen, Fei Yuan, Tao Lu

F-94 Multi-level University Educations Curriculum and Construction of Microelectronics Packaging

and Assembly Specialization 1104

Xiaosong Ma, G.Q.Zhang

F-95 Thermal and Hygro Effect on EMC Interface Property Characterization Using Cohesive Zone

Modeling Method 1109

Xiaosong Ma, Xianmin Huang, G. Q. Zhang

F-96 Research on Silk screen printing conductive ink RFID and measurement 1114

Song Li, Zhou Ru

F-97 Construction Analysis for Inherent Reliability Evaluation of Surface Acoustic Wave Filters .... 1118

Hong-Zhi Liu, Xin Liu, Yun-Fei En, Yun Huang, Ping Lai

F-98 Up-screening and Qualification of Plastic Encapsulated Microcircuits in High Reliability

Applications 1122

Shaohua Yang, Tao Ning

Session G ~ Solid State Lighting Packaging & Integration

G-01 The effects of humidity and temperature aging test on flexible packaging LED module 1126

Chunjing Hang, Jingming Fei, Yanhong Tian, WeiZhang, Chunqing Wang, Susan Zhao, Jo Caers

G-02 A Study of the Functions of a Novel Ripple TIR Lens 1130

Shuiming Li, Fei Chen, Shuang Zhao, Zhili Zhao, Sheng Liu, Kai Wang

G-03 Integrated LED module for local dimming with lower computational complexity and higher

performances in LED backlight 1134

Zong Qin, Sheng Liu

G-05 Conformal phosphor coating for phosphor-converted white LEDs on basis of dispensing process1138

Huai Zheng, Yiman Wang, Xing Fu, Xiaobing Luo, Sheng Liu

G-06 Junction Temperature Estimation for Multiple Light Emitting Diodes Based on Surface Point

Measurement 1142

Xing Fu, Xiaobing Luo

G-07 System Packaging of Thousands Watt High Power LEDs with Heat Pipe-Fin Air Cooling System:

Design and Manufacturing 1146

Xing Fu, Zhangming Mao, Xiaobing Luo

G-08 Design of double freeform-surface lens by distributing the deviation angle for light-emittingdiode uniform illumination 1150

Run Hu, Zhiqiang Gan, Xiaobing Luo

G-10 Influence of rapid thermal cycling on optical property and microstructure of high power LED

1154

Jibing Chen, BingAn, Longzao Zhou, Yiping Wu

G-ll Direct Bonding of Alumina Substrate with Copper Heat Sink in Air Assisted by Ultrasonic

vibrations for High Power LEDs Devices 1158

llongjun Ji, Xiao Cheng, Hao Chen, Mingyu Li, Qingtao Li

G-14 Study on LED devices Step-stress Accelerated degradation test 1162

Junchao Wang, Xiaosong Ma

G-16 A multivariate system reliability estimation method based on step stress accelerated degradation

testing 1166

Hongliang Jia, Miao Cai, Daoguo Yang

G-17 A Novel Wafer Level Packaging for White Light LED 1170

Ye Xie, Dong Chen. Li Zhang, KH Tan, CM Lai

G-19 A Novel Lens for LED Airport Runway Centerline Lamp 1175

Fei Wang, Chuangang Ji, Xiang Gao, Sheng Liu

G-20 Mechanical lock design for LED silicone lens with silicon substrate 1179

Jiaojiao Yuan, Sheng Liu, Zhicheng Lv, Shuai shi, YapingLv, Jingfang, Shengwei Jiang, Can Gao, Xuefang Wan

G-21 Reliability test and failure analysis of high-brightness LEDs from Cree under the various injectioncurrents 1184

W. Liu, N. Li, P. Lei, B.B. Zou, P. Jin

G-22 Preparation of Phosphor Glass via Screen Printing Technology and Packaged Performance for

LEDs 1189

Liang Yang, Mingxiang Chen, Sheng Liu, Shenjun Zhou

G-23 Research on Direct Plated Copper Heat Spreader and Its Thermal Performances for High PowerLED Packaging 1193

Xuebin Zhang, Mingxiang Chen, Ziliang Hao, Sheng Liu

G-25 High Quality & Low Thermal Resistance Eutectic Flip Chip LED Bonding 1197

Ngai-Sze LAM, Chi-Yung LEE, Ming-Yeung WAN, Dewen TIAN, Ming LI

G-26 Reduction of Phosphor Particle Segregation Effects on the CIE & Spatial CIE Distribution of LED

Packages 1202ASM Dispensing Team

G-21 A reliability analysis method for LED Luminaires based on step stress accelerated degradationtest 1207

M. Cai, D. G. Yang, W. B. Chen, H.L. Jia, K. M. Tian, W. L. Guo, G. Q. Zhang

G-29 Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and theBottom of a SMD LED Leadframe Cup 1212

Sam H. Y. Zou, Mian Tao, Jejfery C. C. Lo, S. W. Ricky Lee

G-30 Delamination Modeling in LED Package by Cohesive Zone Method 1217

Bingbing Zhang, Daoguo Yang

G-31 MEMS Roadmap and iNEMI Initiatives 1222

Haley Fu, Robert Pfahl

Session H ~ Emerging Technologies

H-01 Laser-induced Self-propagating Reaction in Ti/a-Si Multilayer Films 1227

MeiZhu, RongAn, Chunqing, WangXingyao Fu,

H-02 Reasearch on Simulation and Experiment of the Extrusion Process of High Conductivity

Aluminum Alloy for Electronic Packaging 1231

FU Jinlong, WANG Kaikun, WANG Yuanning, WANG Yuzhi, HEXukun

H-03 Electric-thermo-mechanical Analysis of TSV under High Current Stressing 1235

Ming Xiao, Fengshun Wit, Hui Liu, Weisheng Xia

H-04 Fabrication of a Novel Handheld Actuator for Use in Wireless Capsule Endoscope 1240

Bo. Ye, Chao. Deng, Zhenjun. Sun, Honghai. Zhang, Juhong. Peng, Sheng. Liu

H-06 Analysis of Thermal Cycling Testing for a 3D Integrated Package with Inter-Chip Microbumps

1243

Qiang Wang, Weidong Xie, Mudasir Ahmad

H-08 Closed-Form Expression for Capacitance of Tapered Through-Silicon-Vias Considering MOS

Effect 1250

Fengjuan Wang, Yintang Yang, Zhangming Zhu, Xiaoxian Liu, Yan Zhang

H-09 Reduction of Signal Reflection Caused by TSV Insertion in Three-Dimensional On-Chip High

Speed Interconnect Lines 1255

Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Yan Zhang

H-10 Effects of Thermal Contact Resistance and Thomson Heating on the Outputs of Solar

Thermoelectric Power Generation System 1260

Bimrew Tamrat Admasu, Xiaobing Luo

H-l 1 Novel Two-Dimensional EBG Structure Used to Suppress Simultaneous Switching Noise 1264

Liuping Wang, Liqiang Cao, Lixi Wan

H-l3 Polyol synthesis of silver nanowires with metal ions mediated 1268

Ding Su, Tian Yanhong, He Xiaobin

H-l5 Copper Filling by Electroplating for High Aspect Ratio TSV 1271

Yongfu Liu, Daowei Wu

H-16 Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate

1276

Rui Zhang, Yanhong Tian, Baolei Liu, Chunjin Hang

H-18 Structure-Air Damping Coupling Analysis of Micromachined Gyroscope 1280

Weihui Wang, Zhang Luo, Qiang Dan, Yong Xu , Sheng Liu

H-19 Simulation model and it's sharp tuning for Si02 Thin Film Transmission line 1284

Wenbin Chen, Xianmin Huang, Xiaosong Ma, Miao Cai, Daoguo Yang

H-20 Modeling of a MEMS-based display device with Electric-Mechanical Coupling 1288

FANG Wenxiao, HUANG Qinwen

H-21 Flexible ZnO Nanogenerator for Mechanical Energy Harvesting 1292

Yanbiao Chu, Lixi Wan, Guowei Ding, Peng Wu, Delong Qiu, Jie Pan, Huimin He

H-22 Thermo-mechanical reliability study for 3D package module based on flexible substrate 1296

Fengze Hou, Xia Zhang, Xueping Guo, Huiqin Xie, Yuan Lu, Liqiang Cao, Lixi Wan

H-23 The design and experiment research on two-phase flow dispenser 1301

Jinsong Zhang, Guowei Xiao, Guiren Huang, Jianhua Zhang

H-24 Wafer level packaging for GaAs optical detector using through wafer grooves (TWG) fabricated

by mechanical dicing and wet etching 1305

Jiaotuo Ye, Shuangfu Wang, Chunsheng Zhu, GaoweiXu, Le Luo

H-26 Hollow TSV VS Solid TSV and the Effect of Medium Filling in the Hollow TSV

Ning Jianye, Miao Min, Li Zhensong, Li Qinghai

1308