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HeterogeneousIntegration:ARoadmapforFutureDataGeneration,TransmissionandProcessing
PresentedbyW.R.Bottoms,Chairman3MTS
#TheConFab2016
TheITRSPublishedItsFinalEditionLastMonth
• ITRSfocusedonsemiconductordeviceswhichhaveenjoyeda50+yearperiodofunprecedentedprogress.CMOSscalingwasthekeyenabler.
• Thedrivingforcehasalwaysbeeneconomicsandtechnologytheenabler.CMOSscalingtechnologycannotenablethefuture.
• Theworldismorecomplextodaybuteconomicsremainsthedriverandtechnologieswillbetheenablers.
ThequestioniswhichTechnologiesandRoadmapscanfindtheanswers
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Densityhasmaintainedtherateofimprovement
• Otherkeyparametershavenotand,insomecases,theyareheadinginwrongdirection
– Cost
– Powerefficiency
– Performance
Moore’sLawScalingcannotmaintainthepaceofProgressfortheElectronicsIndustry
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TheEndOfMoore’sLawIsComingButThatIsOnlyOneOfTheDrivingForces
Thereare4significantissuesdrivingchange:• TheapproachingendofMoore’sLawscalingofCMOS
• MigrationofData,logicandapplicationstotheCloud
• Theriseoftheinternetofthings
• Consumerizationofdataanddataaccess
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MigrationToTheCloud
Data,logicandapplicationsmigrationtotheCloudposesdifficultchallenges– Powerrequirements– Latency– Physicaldensityofbandwidth
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TheInternetOfEverything
Theriseoftheinternetofthingsalsoposesdifficultchallenges– Billionsortrillionsofdevices;butwillanybehighvolume?
– Newsecurityrisks– Arangefromlowcost,highlatencytohighcostlowlatency
– Environmentsfromdesertsandglacierstoin-bodyandunderthehood
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ConsumerizationOfData
Consumerizationofdataanddataaccessposesdifficultchallenges– Bigdata– Highperformance– Batterylife– Latency– Reliability– Theultimateinternethub(itiscominginAutos)
0
500
1000
1500
Shipmentsin
Millions
SmartPhoneShipmentHistory
2009
2010
2011
725.3
2013
70exabytes ofmemoryshippedinsmartphonesfor2015alone
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EverythingMustChangeIncludingRoadmaps
Source:Ansys “Engineering the internetofThings”
Consumer
These 4 driving forces present requirements we cannot satisfy through scaling CMOS
Lower Power, Lower latency, Lower Cost with Higher Performance
We must bring all electronics closer together and interconnect with photonics
This can only be accomplished by Heterogeneous Integration in a 3D-Complex SiP
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TheEnablingTechnologyWillBeInformationTechnology
ITincludesallsystemsandcomponentsfor:• physicaldevicestocreate,store,secureand
exchangeallformsofdata• Networkingforallformsofdatamovement
andsharing• Physicaldevicesandsoftwaretotransform
dataintoinformationandmakeitavailableworldwideinrealtime.
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ChangingRoadmapsTheITRSDominatedButMultipleSuccessorsWill
ContributeInTheFutureInternationalElectronicsManufacturingInitiative(INEMI)Roadmap
– 10yearhorizon– Availablefreetomembersandforpurchasetonon-members– Focusonmarketsegments andmanufacturingtechnologies“Animportanttoolfordefiningthe“stateoftheart”intheelectronics industryas
wellasidentifyingemerginganddisruptivetechnologies”
InternationalRoadmapforDevicesandSystems(IRDS)– 15yearhorizonforsomeparts– SponsoredbyIEEEStandardsAssociation– AvailableFreetoall“Theneweffortaimstotakeabroadviewoftheneedsofcomputinggenerally.Itwilladdressroadmapissuesthatincludecomputersystems,architecturesand
software aswellasthechipsandothercomponentsusedinthem”
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TheITRSDominatedAndMultipleSuccessorsWillContributeInTheFuture
PhotonicSystemsManufacturingRoadmap(PSMR)– 15yearhorizon– Availablefreetoall– FocusedonmanufacturingofPhotonicSystems– SponsoredbyNISTandAIMPhotonics,ManagedjointlybyMITMicrophotonics
CenterandINEMI“AstrategicRoadmapthati)identifiescriticaltechnicalrequirementsfornext-
generationsystemsintegrationandpackaging,ii)details potentialsolutionstomeetthoserequirementseconomically,andiii)identifies thetechnologysupplychain
limitations”HeterogeneousIntegrationTechnologyRoadmapforSemiconductors(HITRS)
– 15yearhorizonformosttopics;25yearhorizonforemergingresearchareas– Availablefreetoall– SponsoredbyIEEECPMTSociety,SEMIwithparticipationbyIEEEEDS
HeterogeneousIntegrationTechnologyRoadmapForSemiconductors
(HITRS)
The IEEE CPMT Society, The IEEE Electron Devices Society andSEMI sponsored a new Roadmap focused on the onlytechnologies that can maintain the pace of progress, at leastuntil a replacement for the CMOS switch is found.
http://cpmt.ieee.org/technology/heterogeneous-integration-roadmap.htmlhttp://www.semi.org/en/heterogeneous-integration-roadmap
TheHITRSiscommittedtocollaborationwithotherRoadmapswhereeverpossible
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HITRSPurpose• TheRoadmapservesasaguidelinefortheglobalelectronicsindustryof
projectedtechnologyneeds andopportunities forinnovation.• TheRoadmapisdevisedandintendedfortechnologyassessmentonlyandis
without regardtoanycommercialconsiderationspertaining toindividual productsorequipment.
• ServingtheProfession,Industry,AcademiaandResearchInstitutes,theRoadmapprovides:
• Aforecastofindustryrequirementstomaintainthepaceofprogressfortheindustryandusercommunity overthenext15years,andthenext25yearsfortheheterogeneous integrationofemergingdevicesandmaterialswhichrequirealongerresearchdevelopmenthorizon.
• Identificationofdifficultchallengesthatmustbeaddressedtomeettheseindustry requirements.
• Wherepossible theRoadmapwillidentifyresearchrequirementsandpotentialtechnicalsolutions.
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HITRSTechnicalWorkingGroupsHeterogeneousIntegrationComponents• Single-Chip&Multi-ChipPackaging(includingsubstrates)• IntegratedPhotonics• IntegratedPowerDevices• MEMS• RF&AnalogMixedSignal• Plasmonics
Allthesecomponentsexisttodaybuttheywillchangedramaticallyoverthe15yearlifeoftheHITRSRoadmap
MechanicalAssy-Laserwelding-Flexbending
Antenna-Packageintegrationfor2.4G/5G/60GHz
Passives/IPD-IntegratedPassive
Devices
Die/Pkg Stacking-Diethinning
-Dieinterconnect
EmbeddedTechnology-Passivecomponent
-Activedevice
Molding-MUF
-Exposeddie
WaferBumping/WLP-Leadfree /CuPillar-Barediepackage
InterconnectionFlipChip&WireBond
SMT-Passives-Components-Connectors
ASEConfidential
Shielding-Boardorpackagelevel
-Compartmental
Electronic/PhotonicSiPthroughHeterogeneousIntegration
Photonics
PhotonicsLayerPICChip- opticalbus
Source:ASEwithadditions
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BuildingBlocksForIntegratingPhotonicsintoSiPExist
16
B
Opticalbus
ActiveWavelengthLocking
Beamsplitters
Source:ECTC2014SiPhotonics-StephaneBERNABEwithadditions
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HITRSTechnicalWorkingGroupsCrossCuttingTopics• EmergingResearchMaterials• EmergingResearchDevices• IntegratedPowerDevices• Interconnect(system,subsystem,packageandchiplevel)
• Test
Newmaterialsanddeviceswillberequiredforintegratedpowerdevicesandhighperformanceinterconnect.
TestapproachesmustchangedramaticallytosupporttestaccessandtransistorwearoutwithComplex3DSiP.
NewDeviceTypesAreComingTheseDevicesAndTheirPackagingWillUseNewMaterials
Spin torque devices(2 magnetic junction pillars)
MEMS Photonic switchVertical coupler
Plasmomic emission Source(quantum dots and plasmons)
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HITRSTechnicalWorkingGroups
IntegrationProcesses• SysteminPackage• 2.5Dand3D• IntegratedPowerDevices• WaferLevelPackaging(Fan-in,fan-outandpanelprocessing)
Theseprocessesexisttodaybuthavebeenslowtomovetovolumeproduction
Costisthelimitingfactortoday.Costreductionatsystemlevelwillbethedrivingforceforwidespreadadoption
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HITRSTechnicalWorkingGroups
PackagingforSpecializedFunctions• Mobile• IoTandWearables• Medical• Automotive
Eachofthesefunctionshaveuniquerequirementsthatwilldrivespecializedpackagingtechnology.
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HITRSCalendarOf2016ActivityAsOfToday
FacetoFaceWorkshops1. ECTC+ITHERM LasVegas,NVUSA05/31- 06/04
2. PaloAltoWorkshopbeforeSEMICONWEST(3101AlexisDrive,PaloAlto.CA)07/10
3. SEMICONWEST SanFrancisco,CAUSA07/11
4. Taiwan(atITRI- 08/12)
5. China(associatedwithICEPTinWuhan,China08/16-19)http://www.icept.org/en/
6. JapanAugust2016(workshopschedulenotyetconfirmed)
ESTC Grenoble,France 09/13-16
7. ELECTRONICSPACKAGINGSYMPOSIUM Binghamton,NYUSA10/5-8
8. IMPACT Taipei,Taiwan 10/26-28
9. ICSJ Kyoto,Japan11/7-9
10. EPTC Singapore11/30– 12/03