conducted emission analysis on printed circuit boards · pdf fileconducted emission analysis...

Conducted Emission AnalysisConducted Emission Analysison Printed Circuit Boardson Printed Circuit Boards

Dr. Matthias Tröscher @ SimLab Software GmbH 1

on Printed Circuit Boardson Printed Circuit Boards

SimLab Software GmbHSimLab Software GmbH

•• Founded 1994Founded 1994

•• Development and distribution of software products Development and distribution of software products for SI, PI, and EMC/EMI simulation combined with for SI, PI, and EMC/EMI simulation combined with servicesservices

Who is SimLab?Who is SimLab?


•• Modelling and simulation of parasitic effects on Modelling and simulation of parasitic effects on Printed Circuits Boards and in Cable HarnessesPrinted Circuits Boards and in Cable Harnesses

•• Analysis of devices (PCB, Cable Harness) Analysis of devices (PCB, Cable Harness) considering cross talk, signal integrity, radiation, considering cross talk, signal integrity, radiation, susceptibility, etc.susceptibility, etc.

•• Cooperation with CST started in 2007Cooperation with CST started in 2007

SynopsisSynopsis

•• EMC Issues & Concurrent Engineering ProcessEMC Issues & Concurrent Engineering Process

•• Simulation Tasks in the MISEA ProjectSimulation Tasks in the MISEA Project

•• Modeling and Simulation Approaches (Review)Modeling and Simulation Approaches (Review)-- IC LevelIC Level


-- IC LevelIC Level-- PCB LevelPCB Level-- Cabling LevelCabling Level-- System LevelSystem Level

•• Software SolutionsSoftware Solutions

•• Simulation ResultsSimulation Results

•• SummarySummary

EMC IssuesEMC Issues&&


&&Concurrent Engineering ProcessConcurrent Engineering Process

Why Simulation?Why Simulation?

Up to 100 motors and CM/PCBUp to 100 motors and CM/PCB

Cable Harness with more than 3 km total lengthCable Harness with more than 3 km total length

Up to 500 Sensors and ActuatorsUp to 500 Sensors and Actuators


WLAN, TV, Radio, GPS, Mobile PhoneWLAN, TV, Radio, GPS, Mobile Phone

AMS System: digital signals, power supplyAMS System: digital signals, power supply

About 300 product variants due to customizingAbout 300 product variants due to customizing

More than 15 highly sensitive AntennasMore than 15 highly sensitive Antennas

EMC IssuesEMC Issues

•• The growing number and package density of electric / The growing number and package density of electric /

IC LevelIC Level Component LevelComponent Level System LevelSystem Level


•• The growing number and package density of electric / The growing number and package density of electric / electronic equipment raises the risk of electromagnetic electronic equipment raises the risk of electromagnetic interferenceinterference

•• Integrated Circuits are one of the main sources of Integrated Circuits are one of the main sources of electromagnetic emissionelectromagnetic emission

•• Any disturbance guided through the component level likely Any disturbance guided through the component level likely cause crosstalk and emission on system levelcause crosstalk and emission on system level

Concurrent Engineering Concurrent Engineering –– think vertically, not horizontally!think vertically, not horizontally!

ICsICs

PCBsPCBs


Development Process / Time AxisDevelopment Process / Time Axis

CablesCables

AntennasAntennas

IdeaIdea DevelopmentDevelopment TestingTesting Plug and Play?Plug and Play?

The MISEA ProjectThe MISEA Project

•• Development and verification of EMC Development and verification of EMC simulation models of specific simulation models of specific automotive integrated circuits devices automotive integrated circuits devices (conducted emission of Power Drivers (conducted emission of Power Drivers and Micro Processors)and Micro Processors)


PartnersPartners•• Incorporation of the Incorporation of the generated models in EMC generated models in EMC simulation at IC, simulation at IC, Component and System Component and System Level in order to increase Level in order to increase EMC product qualityEMC product quality

Simulation Tasks in theSimulation Tasks in the


MISEA ProjectMISEA Project

MISEA Demonstrator BoardMISEA Demonstrator Board

•• 6 Layer PCB6 Layer PCB

•• 32 Bit microcontroller (TC1796)32 Bit microcontroller (TC1796)

•• Integrated HIntegrated H--Bridge (TLE7209)Bridge (TLE7209)


Incorporation of IC simulation models at component levelIncorporation of IC simulation models at component levelCorrelation of measurements and simulation results at component levelCorrelation of measurements and simulation results at component level

•• HighHigh--side switch PWM driverside switch PWM driver(BTS5440)(BTS5440)

•• SMB connectors for measurementsSMB connectors for measurements

•• CAN interface for programmingCAN interface for programming

Conducted Emission AnalysisConducted Emission Analysis


Software SolutionsSoftware Solutions&&


&&Industrial WorkflowIndustrial Workflow

SimLab’s Software SolutionsSimLab’s Software Solutions

PCBModPCBMod CableModCableMod RadiaSimRadiaSim SLIbisSLIbis SLSpiceSLSpice


Interactivity and Links to CST MWS Interactivity and Links to CST MWS –– soon all in one Suite!soon all in one Suite!

EnclosureEnclosure


AntennaAntenna

SPICESPICE

OEM Version OEM Version –– CST PCB STUDIO™ & CST CABLE STUDIO™CST PCB STUDIO™ & CST CABLE STUDIO™


Complete Technology (Outlook)Complete Technology (Outlook)


CST PCB STUDIO™ (Outlook)CST PCB STUDIO™ (Outlook)


CST CABLE STUDIO™ (Outlook)CST CABLE STUDIO™ (Outlook)


CST DESIGN STUDIO™CST DESIGN STUDIO™


CST MICROWAVE STUDIO™CST MICROWAVE STUDIO™


Modeling and Simulation ApproachesModeling and Simulation Approaches


for Conducted Emission Analysisfor Conducted Emission Analysis

Micro Controller (TC1796) Micro Controller (TC1796)

.SUBCKT tc1796 VSS_ball_center VSS_ball_D8 VSS_ball_D15 VSS_ball_D23 VSS_ball_C24 VSS_ball_B25 VSS_ball_A26.SUBCKT tc1796 VSS_ball_center VSS_ball_D8 VSS_ball_D15 VSS_ball_D23 VSS_ball_C24 VSS_ball_B25 VSS_ball_A26

+ VSS_ball_L23 VSS_ball_R23 VSS_ball_W23 VSS_ball_AC23 VSS_ball_AC19 VSS_ball_AC17 VSS_ball_AC10 VSS_ball_T4+ VSS_ball_L23 VSS_ball_R23 VSS_ball_W23 VSS_ball_AC23 VSS_ball_AC19 VSS_ball_AC17 VSS_ball_AC10 VSS_ball_T4

+ VSS_ball_J4 VDD_ball_D9 VDD_ball_D16 VDD_ball_E23 VDD_ball_D24 VDD_ball_C25 VDD_ball_B26 VDD_ball_P23+ VSS_ball_J4 VDD_ball_D9 VDD_ball_D16 VDD_ball_E23 VDD_ball_D24 VDD_ball_C25 VDD_ball_B26 VDD_ball_P23

+ VDD_ball_V23 VDD_ball_AB23 VDD_ball_AC20 VDD_ball_AC11 VDD_ball_R4 VDD_ball_H4 VDDE_ball_H23 VDDE_ball_H24+ VDD_ball_V23 VDD_ball_AB23 VDD_ball_AC20 VDD_ball_AC11 VDD_ball_R4 VDD_ball_H4 VDDE_ball_H23 VDDE_ball_H24

+ VDDE_ball_H25 VDDE_ball_H26 VDDE_ball_M23 VDDE_ball_T23 VDDE_ball_Y23 VDDE_ball_AC22 VDDE_ball_AC18+ VDDE_ball_H25 VDDE_ball_H26 VDDE_ball_M23 VDDE_ball_T23 VDDE_ball_Y23 VDDE_ball_AC22 VDDE_ball_AC18

+ VDDP_ball_AC16 VDDP_ball_AD16 VDDP_ball_AE16 VDDP_ball_AF16 VDDP_ball_K4 VDDP_ball_D7 VDDP_ball_D14+ VDDP_ball_AC16 VDDP_ball_AD16 VDDP_ball_AE16 VDDP_ball_AF16 VDDP_ball_K4 VDDP_ball_D7 VDDP_ball_D14

+ VDDP_ball_D22 VDDP_ball_C23 VDDP_ball_B24 VDDP_ball_A25 VSSM_ball_Y4 VDDM_ball_W4 VDDSB_ball_R1+ VDDP_ball_D22 VDDP_ball_C23 VDDP_ball_B24 VDDP_ball_A25 VSSM_ball_Y4 VDDM_ball_W4 VDDSB_ball_R1

+ VDDFL3_ball_A18 VDDFL3_ball_B18 VSSOSC_ball_F25 VDDOSC3_ball_E26 VDDOSC_ball_F26 VSSAF_ball_AD9+ VDDFL3_ball_A18 VDDFL3_ball_B18 VSSOSC_ball_F25 VDDOSC3_ball_E26 VDDOSC_ball_F26 VSSAF_ball_AD9

+ VDDAF_ball_AC9 VDDMF_ball_AE9 VSSMF_ball_AF9 + VDDAF_ball_AC9 VDDMF_ball_AE9 VSSMF_ball_AF9

Rgr1Xocm2 p_x1_y1 Xocm21 0.15Rgr1Xocm2 p_x1_y1 Xocm21 0.15

Lgr1Xocm2 Xocm21 p_grid 1ELgr1Xocm2 Xocm21 p_grid 1E--1111

Cgr1Xocm2 p_grid g_grid 1ECgr1Xocm2 p_grid g_grid 1E--1212

Rgr2Xocm2 g_x1_y1 Xocm22 0.15Rgr2Xocm2 g_x1_y1 Xocm22 0.15 3.5

4

U [V]

SPICESPICE or IBIS Modelsor IBIS Models


Rgr2Xocm2 g_x1_y1 Xocm22 0.15Rgr2Xocm2 g_x1_y1 Xocm22 0.15

Lgr2Xocm2 Xocm22 g_grid 1ELgr2Xocm2 Xocm22 g_grid 1E--1111

Rsub1Xocsub3 g_x1_y1 s_x1_y1 1Rsub1Xocsub3 g_x1_y1 s_x1_y1 1

Rsub2Xocsub3 s_x1_y1 sub_bottom 1000Rsub2Xocsub3 s_x1_y1 sub_bottom 1000

Roc1Xocm4 p_x1_y1 Xocm4po1 0.36964Roc1Xocm4 p_x1_y1 Xocm4po1 0.36964

Loc1Xocm4 Xocm4po1 p_x2_y1 2ELoc1Xocm4 Xocm4po1 p_x2_y1 2E--1010

Roc2Xocm4 g_x1_y1 Xocm4gr1 0.36964Roc2Xocm4 g_x1_y1 Xocm4gr1 0.36964

Loc2Xocm4 Xocm4gr1 g_x2_y1 2ELoc2Xocm4 Xocm4gr1 g_x2_y1 2E--1010

Coc1Xocm4 p_x2_y1 g_x2_y1 1.3702ECoc1Xocm4 p_x2_y1 g_x2_y1 1.3702E--1111

Coc2Xocm4 p_x1_y1 g_x1_y1 1.3702ECoc2Xocm4 p_x1_y1 g_x1_y1 1.3702E--1111

Rgr1Xocm5 p_x2_y1 Xocm51 0.15Rgr1Xocm5 p_x2_y1 Xocm51 0.15

Lgr1Xocm5 Xocm51 p_grid 1ELgr1Xocm5 Xocm51 p_grid 1E--1111

Cgr1Xocm5 p_grid g_grid 1ECgr1Xocm5 p_grid g_grid 1E--1212

Rgr2Xocm5 g_x2_y1 Xocm52 0.15Rgr2Xocm5 g_x2_y1 Xocm52 0.15

Lgr2Xocm5 Xocm52 g_grid 1ELgr2Xocm5 Xocm52 g_grid 1E--1111

Rsub1Xocsub6 g_x2_y1 s_x2_y1 1Rsub1Xocsub6 g_x2_y1 s_x2_y1 1

Rsub2Xocsub6 s_x2_y1 s_x1_y1 300Rsub2Xocsub6 s_x2_y1 s_x1_y1 300

Rsub3Xocsub6 s_x2_y1 sub_bottom 1000Rsub3Xocsub6 s_x2_y1 sub_bottom 1000

Roc1Xocm7 p_x2_y1 Xocm7po1 0.36964Roc1Xocm7 p_x2_y1 Xocm7po1 0.36964

-5 0 5 10-0.4

-0.3

-0.2

-0.1

0

0.1

0.2

0.3

U[V]

0.3

I [A]

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 x 10-80

0.5

1

1.5

2

2.5

3

3.5

t [s]

U [V]

HH--Bridge (TLE7209) & PWM Driver (BTS5440)Bridge (TLE7209) & PWM Driver (BTS5440)

LIBRARY IEEE, bts5440_lib;LIBRARY IEEE, bts5440_lib;

USE IEEE.ELECTRICAL_SYSTEMS.ALL;USE IEEE.ELECTRICAL_SYSTEMS.ALL;

USE IEEE.MECHANICAL_SYSTEMS.all;USE IEEE.MECHANICAL_SYSTEMS.all;

USE work.all;USE bts5440_lib.ALL;USE work.all;USE bts5440_lib.ALL;

----------------------------------------------------------------------------------------------------------------------------------------------------

Test bench entity definitionTest bench entity definition

ENTITY TestBench ISENTITY TestBench IS

END TestBench;END TestBench;

----------------------------------------------------------------------------------------------------------------------------------------------------

Test bench architecture definitionTest bench architecture definition

ARCHITECTURE behav OF TestBench ISARCHITECTURE behav OF TestBench IS

terminal in1 : electrical;terminal in1 : electrical;

VHDLVHDL--AMS ModelAMS Model


terminal in1 : electrical;terminal in1 : electrical;

terminal out1 : electrical;terminal out1 : electrical;

terminal vbat, vbb : electrical;terminal vbat, vbb : electrical;

terminal vlload, out2, out3, out4, is1, is2, is3, is4 : electrical;terminal vlload, out2, out3, out4, is1, is2, is3, is4 : electrical;

terminal vlload, is1 : electrical;terminal vlload, is1 : electrical;

......

......

......

--------------------------------------------------------------

......

vin: ENTITY vpulse_a(behav)vin: ENTITY vpulse_a(behav)

......

dut: ENTITY bts5440g(behav)dut: ENTITY bts5440g(behav)

......

r0: ENTITY resistor_vhd(behav)r0: ENTITY resistor_vhd(behav)

......

......

END behav;END behav;

--------------------------------------------------------------

Printed Circuit Board DesignPrinted Circuit Board Design

Partial Element Equivalent Circuit (PEEC)Partial Element Equivalent Circuit (PEEC)ModelModel

oror

Transmission Line (TL)Transmission Line (TL)ModelModel


LL RR

GG CC

LL RR

GG CC

LL RR

GG CC

LL RR

GG CCCouplingCoupling CouplingCoupling

ModelModel

3D Modeling Techniques for Power / Ground Nets3D Modeling Techniques for Power / Ground Nets


Cable Harness DesignCable Harness Design

Transmission Line (TL) ModelTransmission Line (TL) Model

ZZ

II11

UU11

VV11

RR<<<<ZZ

ZZ

II22

UU22

VV22

RR<<<<ZZ


LL RR

GG CC

LL RR

GG CC

PCB / CMPCB / CM Load / MotorLoad / MotorCable HarnessCable Harness

System Level Approach with SPICE / VHDLSystem Level Approach with SPICE / VHDL--AMS ModelsAMS Models


Net Pins (1)Net Pins (1) Cable Terminals (1/2)Cable Terminals (1/2) Net Pins (2)Net Pins (2)

XXSPICE Model (A)SPICE Model (A)

Co

nn

ecto

r (1)

Co

nn

ecto

r (1)

Co

nn

ecto

r (2)

Co

nn

ecto

r (2)

XXSPICE Model (B)SPICE Model (B)

XXSPICE Model (C)SPICE Model (C)VDHLVDHL--AMS Model (C)AMS Model (C)

System Level Approach with VHDLSystem Level Approach with VHDL--AMS ModelsAMS Models

MASTERSLSim (EXE)

DLL

uuTT

CoCo--Simulation Simulation SLSimSLSim™ (SimLab) with ™ (SimLab) with SMASHSMASH™ (Dolphin)™ (Dolphin)


ClientSMASH (DLL)

DLLInterface

iiTT

Some PCB and Cabling ApplicationsSome PCB and Cabling Applications


Some PCB and Cabling ApplicationsSome PCB and Cabling Applications

PCB: Current return path PCB: Current return path Most Dramatic for Radiated EmissionMost Dramatic for Radiated Emission


Low Frequency Low Frequency (~ DC)(~ DC)

High Frequency High Frequency (~ MHz/GHz)(~ MHz/GHz)

20

0 m

m2

00

mm

6 Layer6 Layer ∆∆∆∆∆∆∆∆ = 0.018 = 0.018 -- 0.035 mm0.035 mm

Uniform and grid areasUniform and grid areas

PCB: I/V Distribution with respect to Decoupling CapacitorsPCB: I/V Distribution with respect to Decoupling Capacitors


400 mm400 mm

Without decoupling capacitorsWithout decoupling capacitors With decoupling capacitorsWith decoupling capacitors

PCB: Electromagnetic Field Emission CalculationPCB: Electromagnetic Field Emission Calculation

Near Field Scan 5mm Near Field Scan 5mm above Test Boardabove Test Board


Electric FieldElectric Field Magnetic FieldMagnetic Field

1 M

Hz

1 M

Hz

1 G

Hz

1 G

Hz

Crosstalk into Coaxial Cable (Braided Shield)Crosstalk into Coaxial Cable (Braided Shield)


SimulationSimulation

MeasurementMeasurement

•• Coupling from Coupling from generator wire into generator wire into coaxial cablecoaxial cable



--1010

--55

00

55

1010

System Level Analysis System Level Analysis –– Coupling into Rod AntennaCoupling into Rod Antenna


Anechoic chamber test receiverAnechoic chamber test receiver(1kHz BW, 70(1kHz BW, 70--120MHz FM)120MHz FM)

7070 7575 8080 8585 9090 9595 100100 105105 110110 115115 120120

--3535

--3030

--2525

--2020

--1515

--1010

Frequency [MHz]Frequency [MHz]

Vo

lta

ge

[d

Bµ

V]

Vo

lta

ge

[d

Bµ

V]

MISEA Simulation ResultsMISEA Simulation Results


MISEA Simulation ResultsMISEA Simulation Results

32 Bit µC (TC1766/TC1796), ICEM Correlation in Frequency Domain32 Bit µC (TC1766/TC1796), ICEM Correlation in Frequency Domain

•• S11 at VDD, 150 S11 at VDD, 150 ΩΩ probing point; good correlation up to 1 GHzprobing point; good correlation up to 1 GHz


32 Bit µC (TC1766/TC1796), ICEM Correlation in Time Domain32 Bit µC (TC1766/TC1796), ICEM Correlation in Time Domain

•• EME at VDD, 150 EME at VDD, 150 ΩΩ probing point; good correlation up to 500 MHzprobing point; good correlation up to 500 MHz


HighHigh--side switch PWM driver (BTS5440), Emission Spectrumside switch PWM driver (BTS5440), Emission Spectrum




Integrated HIntegrated H--Bridge (TLE7209), Enhanced ModelBridge (TLE7209), Enhanced Model


•• Enhanced VHDLEnhanced VHDL--AMS model of TLE7209AMS model of TLE7209•• Red (Co) and green (VHDLRed (Co) and green (VHDL--AMS) curves show voltage supplyAMS) curves show voltage supply•• Blue (Co) and yellow (VHDLBlue (Co) and yellow (VHDL--AMS) curves show voltage at driver AMS) curves show voltage at driver

output 1output 1

32 Bit µC (TC1796), Conducted Emission at +12V Connector Pin32 Bit µC (TC1796), Conducted Emission at +12V Connector Pin

Schematic: µC, PCB, VC’s, (HF) C’s R’s L’s, Connector, Cable, Stripline, Battery…Schematic: µC, PCB, VC’s, (HF) C’s R’s L’s, Connector, Cable, Stripline, Battery…

Good correlation (< 5 dB)




Summary / OutlookSummary / Outlook

•• Software solutions for system Software solutions for system level analyses (PCB, Cable, …) level analyses (PCB, Cable, …) do existdo exist


•• PCB STUDIO and CABLE PCB STUDIO and CABLE STUDIO will be available in STUDIO will be available in CST MICROWAVE STUDIO in CST MICROWAVE STUDIO in Q4/2008Q4/2008

•• Ongoing development regarding Ongoing development regarding EMC / VHDLEMC / VHDL--AMS coAMS co--simulationsimulation

Thank you for your attention!Thank you for your attention!


SimLab Software GmbHSimLab Software GmbHEMC Solutions for Your SuccessEMC Solutions for Your Success

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