COMPREHENSIVE CHIPSET SYSTEMSOLUTION PORTFOLIO

APPLICATION

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SHAPING CONVERGED COMMUNICATIONSLeveraging over two decades of leadership in semiconductor development and innovation in signal processing and wireless communications, DSP Group offers a comprehensive portfolio of System-On-Chip (SoC) solutions for consumer electronics (CE) end products at home, in the office and on-the-go. Our complete solutions enable OEMs/ODMs to introduce innovative products that embed smart processing and converged communications, addressing the growing demand for more cost-effective design, innovative applications/technologies and low-power processing. Our complete SoC solutions include hardware development kits (HDKs), embedded software packages, and software development kits (SDKs) – everything you need to develop innovative, cost-effective and power-efficient products. Our advanced technologies are positioning DSP Group as an enabler in the burgeoning Internet of things, smart voice processing for mobile and wearable devices, and enterprise telephony markets.

SOLUTIONSDSP Group continues to play a key role in the rapidly-changing communications arena. OEMs/ODMs, telecommunication operators, and service providers use our market-leading solutions to rapidly bring to market innovative products for mobile, home, and enterprise environments. Complementing our traditional offering, our new solutions for mobile voice and audio enhancement (HDClear™), always-on voice activation and sensor hub,, home automation and security (ULE), and enterprise telephony (VoIP) are enabling our customers to develop a new wave of products by raising the bar in both voice processing and converged communications.

Cordless

Leading the cordless phone market with over 70% market share, DSP Group continues to offer cost-effective, fully-featured and comprehensive solutions - delivering unrivaled range, unmatched listening experience and robust processing power, while enabling rich GUI functionality. For entry-level to high-end applications, our products feature the industry’s smallest footprint, the highest level of integration, and the lowest power consumption.

Our solutions include reference designs for the following applications:• CAT-iq reference design with advanced GUI• DECT/CAT-iq module• Wireless audio and cordless headset• PSTN cordless phone• Video Monitoring over DECT

Home Gateways, CAT-iq and FMC

DSP Group’s DCX DECT/CAT-iq SoC solution for home gateways and fixed-mobile convergence (FMC) provides advanced DECT cordless capabilities including HD voice quality, multi call, multi-line, and ULE functionality. Our DCX solutions support multiple lines and handsets while complying with the CAT-iq 2.0, 2.1, 3.0 (SUOTA) and ULE standards.

Our solutions include reference designs for the following applications:• DECT cordless phones• DECT/CAT-iq modules• DECT/ULE-enabled gateways

APPLICATIONAPPLICATION

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Home Automation & Security

Based on best-in-class ULE technology, our home automation and security solutions offer low cost of ownership together with market-leading performance. Utilized in a wide variety of sensors, ULE is an ideal short range wireless technology for security, safety, home automation, energy management, climate control, and healthcare applications connected via consumer premise equipment (CPE) such as home gateways and over the top boxes (OTT’s). Combination of ULE with Voice and Video capabilities places DECT/ULE in the unique position in IoT world.

Our solutions include reference designs for the following applications:• ULE nodes• ULE-enabled gateways

Enterprise VoIP

A leading VoIP silicon providers for enterprise voice, DSP Group offers comprehensive, best-in-class, yet highly-affordable VoIP solutions. Powering the full range of IP desktop phones and analog telephone adapters (ATAs), DSP Group’s scalable, green solutions are ideal for all enterprise segments They deliver enterprise-grade acoustics and exceptional HD voice quality, while featuring the industry’s lowest power consumption.

Our solutions include reference designs for the following applications:• Entry level IP phones• Mid-range to High-end IP phones• ATAs

HDClear™ – Voice and Audio Enhancement for Mobile

HDClear by DSP group is a revolutionary technology for eliminating background noise and enhancing voice quality. In mobile phones, wearable devices, PCs and tablets, HDClear suppresses background noise and promotes high speech intelligibility for unparalleled voice communications and user experience. HDClear also effectively filters ambient noise of any kind and delivers “cleaner” speech to ASR applications, resulting in best-in-class accuracy, enhanced ASR consistency, and improved productivity. HDClear is an ideal solution for mobile and wearable devices, bringing a better user experience to voice communications, command and activation – all with ultra-low power consumption.

Our solutions include reference designs for the following applications:• Mobile phones• Wearable devices

Always-On Voice Activation and Sensor Hub Functions for Smartphones and Wearables

DSP Group’s solution for smartphones, wearable devices and other mobile devices provides excellent performance of voice-trigger, voice command and sensor hub function while maintaining extremely low power consumption.

Our solution includes pre-process algorithms that improves the voice trigger hit-rate in noisy environments.

DSP Group’s solution is based on DSP Group’s SoC and embedded software and advanced voice activation and sensor fusion algorithms, providing simultaneous analysis of data from multiple sensor sources in addition to voice activation.

DSP Group’s solution includes audio input and output port and can be used as a Codec for wearable devices.

Our solution includes reference designs for smartphones and wearable devices and can be used for voice activation in other appliances.

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PRODUCTSPRODUCTS

PRODUCTSTargeting home, enterprise, and mobile markets, DSP Group’s comprehensive chipset portfolio reduces development risk costs, and shortens time to market. ODMs and service providers use our system-on-chips (SoCs), hardware reference packages (HDKs) and software development packages (SDKs) to rapidly and cost-effectively develop cutting- edge consumer electronics and business products.

CHIPSET PRODUCT FAMILIES

Home Enterprise Mobile

Cordless GatewaysHome Automation

& SecurityVoice Over IP

(VoIP)HDMobile

DCX (ARM9)DECT BB, DECT RFVoice AFE, PMU

DCX (ARM9)DECT BB, DECT RFPMU

DHX91 (ARM9)DECT ULE BB, DECT ULE RFVoice AFE, PMU

DVF99 (2xARM9)VoIP DSP, Voice AFE,Security HW, 2D GPUPMU,Opt: DECT BB

DBM11 (DSP)TL-DSP Noise Cancellation

DCE (DSP)DECT BBVoice AFE, PMU

RF19 DECT RFRF24 2.4DECT RF

DVF99 (2xARM9)DECT ULE BB,DECT ULE RFVoIP DSP, Voice AFE, PMU

DVFD8 (ARM9+DSP)VoIP DSP,Voice AFE, PMU,Opt: DECT BB DRF19: DECT RF, PMU

DBMD2 (DSP)TL-III-DSPNoise CancellationVoice TriggerVoice AuthenticationVoice CommandSensory Hub

DCX (ARM9)DECT ULE BB,DECT ULE RFVoice AFE, PMU

DVF1100 (Dual Cortex-A9@1.5GHz)Quad core GPU, Video ENC/DEC Voice AFE,Security HW, HDMI RX/TX, PCIe, USB3

DECT CORDLESS – DCE AND DCX FAMILIES

A market leader in DECT and next-generation CAT-iq cordless technology, DSP Group offers a wide range of cost-effective, highly-integrated SoC solutions. Delivering high-quality audio with notably low power consumption, our field-proven chipset solutions are ideal for totally integrated digital cordless telephony, home automation and security, and DECT-enabled gateways.

DSP Group’s cordless chipset solutions are available in two chipset families:

• The DCE family is a highly integrated, low-power ROM-based chipset solution, delivering enhanced audio and extended range for entry-level applications.

• The DCX SoC family is a low-power, Flash and ROM-based chipset solution targeting mid-to-high-range cordless applications. The cost-effective DCX is based on an open powerful ARM9™ core platform capable of advanced HD voice processing for multi-line and multi-call use cases as well as support for large LCDs and video applications.

DCE DCX

DE56 + RF19Z/RF24

DCE58 + RF19Z/RF24

DCX79 DCX81 DCXD1 + DRF1912

Function Baseband + RF Baseband + RF Single Chip Single Chip Baseband + RFAPU

Segment

Entry Level ✓ ✓ ✓

Mid-Range ✓ ✓ ✓

High-End ✓ ✓ ✓

Radio Frequency

DECT (EUR) RF19Z RF19Z ✓ ✓ ✓

DECT 6.0 (US) RF19Z RF19Z ✓ ✓ ✓

K-DECT RF19Z RF19Z ✓ ✓ ✓

J-DECT RF19Z RF19Z ✓ ✓ ✓

2.4 GHz RF24 RF24

Memory

External QSPI Flash ✓ ✓

External SRAM ✓

Internal RAM ✓ ✓ ✓ ✓ ✓

Internal Flash ✓

ROM ✓ ✓ ✓

Processing and Features

Processor TeakLite TeakLite ARM968 ARM926 ARM926

MIPS 74-110 MHz 74-99 MHz 124MHz 208MHz 208MHz

Cache I+D I+D

Hardware Accelerators ADPCM ADPCMADPCMMLSE

JPEGDMA

ADPCMMLSE

JPEGDMA

ADPCM MLSE

Non-Blind Slot ✓ ✓ ✓

Integration

RF PA ✓ ✓ ✓ ✓ ✓

RF Switches ✓ ✓ ✓ ✓

Embedded LCD Controller ✓ ✓

I /O

Keypad ✓ ✓ ✓ ✓ ✓

GPIO ✓ ✓ ✓ ✓ ✓

UART ✓ ✓ ✓ ✓ ✓

USB ✓ ✓ ✓ ✓

PCM/IOM/TDM ✓ ✓ ✓ ✓

I2S ✓ ✓

SPI ✓ ✓ ✓ ✓ ✓

PWM ✓ ✓ ✓ ✓ ✓

External Bus 8-bit 16-bit

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PRODUCTSPRODUCTS

DECT-ENABLED HOME GATEWAY (HGW) – DCX81DSP Group’s DCX81 SoC for HGW and FMC provide advanced DECT cordless capabilities including HD voice, multi-line, multi-handset and ULE support, while integrating the most advanced CAT-iq 2.0, 2.1, 3.0 (SUOTA) stack.

The DCX81 is a low-power flash-based SoCs based on an open ARM9™ core processor with unsurpassed range, capable of advanced HD voice processing for multi-line, multi-call applications together with support of ULE standard for home automation applications.

DCX81

Function Single Chip

Standards

ULE ✓

DECT ✓

Radio Frequency

DECT (EUR) ✓

DECT 6.0 (US) ✓

K-DECT ✓

J-DECT ✓

Memory

External QSPI Flash ✓

Internal RAM ✓

Processing and Features

Processor ARM926

MIPS 208 MHz

Cache I+D

Non-Blind Slot ✓

Integration

RF PA ✓

RF Switches ✓

I/O

Keypad ✓

GPIO ✓

UART ✓

USB ✓

PCM/IOM/TDM ✓

SPI ✓

HOME AUTOMATION AND SECURITY – ULE (ULTRA LOW ENERGY) FAMILYDSP Group is leading the ULE revolution to meet the growing demand in the Home Area Network (HAN) market for efficient low-power, wireless IoT solutions.

An extension of DECT, the new ULE standard enables development of multi-year, battery-run HAN applications that enjoy all of the advantages of DECT, such as interference-free connectivity, extended range, voice and video support and more. Leveraging its long-term technological and market leadership in DECT applications, DSP Group designed the architecture for ULE and is driving its adoption, together with the DECT Forum and the ULE Alliance.

DSP Group offers an advanced ULE family of chips, as well as a comprehensive ULE and HAN FUN (Transport and Application layer) protocol.

The DHX91 isa low-power chipset solution for home automation and security. Equipped with audio capabilities and a powerful ARM926™ processor, it implements hibernation features to deliver advanced ULE.The ULE base utilizes existing and proven cordless SoCs, functioning as a standalone ULE over the top box (DVF99) and embedded module for home gateways (DCX81).

Base Node

Function DVF99 DCX81 DHX91

Segment

ULE ✓ ✓ ✓

Radio Frequency

DECT (EUR) ✓ ✓ ✓

DECT 6.0 (US) ✓ ✓ ✓

K-DECT ✓ ✓ ✓

J-DECT ✓ ✓ ✓

Memory

Internal RAM ✓ ✓ ✓

External QSPI Flash ✓ ✓ ✓

Processing and Features

Processor 2 x ARM926 ARM926 ARM926

MIPS 2 x 400MHz 208MHz 208MHz

Cache I+D I+D I+D

Hardware Accelerators SecurityJPEG

ADPCMMLSE

JPEG ADPCM MLSE

Non-Blind Slot ✓ ✓

Hibernation ✓

Integration

RF PA ✓ ✓

RF Switches ✓ ✓

I /O

Keypad ✓ ✓

GPIO ✓ ✓

UART ✓ ✓

USB ✓ ✓

PCM/IOM/TDM ✓ ✓

I2S ✓ ✓

SPI ✓ ✓

PWM ✓ ✓

External Bus 8-bit

ULE I/O ✓

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PRODUCTSPRODUCTS

ENTERPRISE VOICE – DVF FAMILY As the leading silicon vendor for enterprise voice, DSP Group offers the DVF chipset family. Our DVF SoCs family is a comprehensive solution for developing affordable, scalable and green VoIP home and office products.. DVF enables development of low-power enterprise IP Phones, analog terminal adapters (ATAs) and home VoIP phones that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface (UI). Built on an open platform with ARM processors running on Linux OS, DVF includes IPfonePro™, an extensive SDK for IP phones and ATAs.

DVF99xx provides outstanding cost/performance value for mid-range to high-end IP phones. Designed especially to meet Tier 1 requirements, DVF99 fully complements existing DSP Group solutions, including DVFD818x VoIP processors for low- and mid-range applications.

DVF1100 is the latest member of the DVF family, The DVF1100 is a dual-core System on a Chip (SoC) for Video and Voice over IP (V2oIP) solutions. It provides an ideal solution for high-end voice and video conferencing terminals with rich GUI, HD Video streaming and other multimedia content targeting media IP phones. It implements a high-performance, dual-core architecture with advanced memory support, while reducing power consumption and supporting green features. DVF1100 integrates high-quality HD video engines, hardware-based security and advanced graphics.

DVF99 Family Outline DVF9919 DVF9929 DVF9918

Applications Processor ARM926 up to 600 MHz ARM926 @ up to 500 MHz ARM926 up to 400 MHz

CSS Processor ARM926 up to 500 MHz ARM926 @ up to 456 MHz ARM926 up to 400 MHz

DDR3/3L, DDR2, mDDR ✓ DDR2/3/3L (one CS) x

SDRAM x x ✓

RGB LCD I/F ✓ x x

CPU LCD I/F CPU16/8CPU8, supporting monochrome and up

to WQVGA color displaysThrough memory bus

2D GUI Engine ✓ x x

NAND & QSPI Flash Controllers ✓ ✓ ✓

Parallel NOR Flash Controller ✓ x x

Security Hardware Accelerator ✓ ✓ ✓

Ethernet (G)MAC ✓ (RGMII/RMII/MII) ✓ (RGMII/RMII, no MII) ✓ (RGMII/RMII)

DECT Support ✓ ✓ ✓

High-speed USB OTG ✓ ✓ x

Full-speed USB ✓ x ✓

DVF9919 DVF9929 DVF9918

SDIO Interface (4-bit) ✓ ✓ ✓

TDM 2 1 1

SPI 2 1 1

Fast UART 2 2 2

I2C 2 1 1

Keyboard Scanner 10x8 keys 7x8 keys 7x8 keys

Touch Panel ✓ x x

GPIOs in IP-phone App >24 >16 >16

Audio Front-End 2 SWB codecs, 3+2 mics, 3 speakers 2 SWB codecs, 3 mics, 3 speakers 2 SWB codecs, 3 mics, 3 speakers

Class D PA 2W 2W 1W

Force Mute HW ✓ ✓ ✓

Package16x16 mm TFBGA

(19x19 ball array), 0.8 mm pitch

16x16 mm TFBGA (19x19 ball array), 0.8 mm pitch Pin-compatible with DVF9919

12.5x12.5 mm TFBGA (15x15 ball array), 0.8 mm pitch

Availability In Production In Production In Production

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DVF1100 Feature ListDVF1100

Applications Processor Dual core Cortex-A9 @ 1.2 – 1.5 GHz

DDR2/3/3L Memory 16-/32-bit up to 1066 MHz

Video Decoder

H.264 AVC up to L4.2 1080p60 H.265 up to L4.1 1080p60

Also: VC-1, MPEG4, MPEG2, AVS, AVS+, Flash, DivX, Xvid, MJPEG, WMV

Video Encoder H.264 AVC up to L4.1 1080p30

3D GPU Engine OpenGLES 1.1/2.0 & OpenVG 1.1

2D GUI Engine Yes

Display InterfacesHDMI 1.4b RX & TX @ 2160p30

DVO @ 1080p60

Camera Interfaces Proprietary 720p30 YUV4:2:0

Flash Controller Serial NOR, SLC NAND, e.MMC/SD

Security Hardware Accelerator AES, DES/3DES, RC, SHA-1, SHA-2 + OTP

Ethernet MAC 10/100/1000

USB Host 1x USB3.0, 2x USB2.0

PCIe RC/EP / eSATA2/3 2x 1-lane Gen2

e.MMC4.5 / SD3.0 / SDIO3.0 2

TDM 2

Fast UART 4 + 2 always on + 1 IrDA

SSC (I2C / SPI) 6 + 3 always on

Key Matrix 4 x 4

Touch Panel Yes

Package FCBGA 25mm x 25mm

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TECHNOLOGIESPRODUCTS

VOICE ENHANCEMENT AND ALWAYS-ON – DBM FAMILYDSP Group’s DBM family of SoCs offers enhanced voice enhancement, voice activation and sensor hub functionality, enabling ultra-low power, always-on capabilities in smartphones, wearable devices and other mobile devices.

The DBM chipsets are available in small footprints and embed DSP Group’s advanced HDClear™ technology. DBM chipsets dramatically suppress background noise for far-end users, enhance privacy for near-end speakers, and maximize performance of Automatic Speech Recognition (ASR) engines.

DBMD2 (Part Number D2A3X) DBMD4 (Part Number D4A1A) DBMD4S (Part Number D4S1A)

Function

Always-on voice activation ✓ ✓ ✓

Low power consumption ✓ Extreme low Extreme low

Noise reduction ✓ ✓ ✓

Maximized ASR ✓ ✓ ✓

AEC ✓ ✓ ✓

Supported voice bandwidth NB, WB

Sensor hub Limited ✓

Segment

Mobile phone ✓ ✓ ✓

Wearable devices ✓ ✓ ✓

BT headset ✓ ✓ ✓

Tablets ✓ ✓ ✓

Toys ✓ ✓ ✓

DSP

Processor CEVA-TeakLite-III 32 bits CEVA-TeakLite-III 32 bits CEVA-TeakLite-III 32 bits

Program memory RAM RAM RAM

I/O

UART ✓ ✓ ✓

PCM/ I2S 4 ✓ ✓

I2C Slave ✓ ✓ ✓

I2C Master By SW ✓

SPI ✓ ✓ ✓

SLIMbus ✓ ✓ ✓

AFE

Audio In Digital and analog mic Digital and analog mic Digital and analog mic

Audio Out Digital Digital Digital

Package

Size 2.4 x 2.4 mm 2.1 x 1.8 mm 2.1 x 1.8 mm

TECHNOLOGIESDSP Group offers a broad portfolio of integrated technologies for diverse voice, audio, data and multimedia applications maintaining extensive expertise and a leading position in DECT/DECT6.0/JDECT, CAT-iq 1.0/2.0/2.1/3.0 (SOUTA), 2.4GHz, PSTN, and VoIP. We also leverage 25 years of audio processing experience to an array of new technologies that are shaping converged communications at home, in the office and in mobile devices. These advanced technologies include a revolutionary HDClear algorithm for the mobile applications, Ultra Low Energy (ULE) and VoIP.

Voice and AudioProviding the wireless industry’s most advanced chipset solutions, DSP Group offers innovative voice/audio technologies and advanced algorithms that extend the effective range of clear voice communications for CAT-iq and worldwide DECT - without increasing power and emission levels. In addition, we implement noise-reduction, acoustic echo cancellation and voice-enhancement algorithms that improve voice intelligibility and provide better user experience.

ULE (Ultra Low Energy)DSP Group is spearheading development of ULE for home area network (HAN) applications, including home automation, security and safety, energy management, climate control and healthcare. Leading design of the ULE architecture, we are driving ULE’s adoption by ETSI, DECT Forum, and the ULE Alliance.

DSP Group is one of the founding companies of the ULE Alliance, continues to be a promoter member, holding a position on the board and chairing the Technical Working Group.

Voice Intelligibility and Noise ReductionHDClear™ technology eliminates the traditional tradeoff between voice intelligibility and noise reduction. It delivers measurably higher and more consistent voice quality and intelligibility to mobile users, even in noisy surroundings. HDClear low power and small footprint enable easy integration in mobile and wearable devices.

HDClear technology extends voice data acquisition from multi microphones. After the combined input is processed, our Vocal algorithm is applied to the acquired data to enable diverse voice processing tasks such as: echo and background noise cancellation, maximized effectiveness of automatic speech recognition (ASR) engines, loudness equalization, and general voice enhancement.

Cordless TelephonyThe world leader in cordless telephony for over two decades, DSP Group promotes both traditional and next-generation cordless technologies. The company is an active member of the DECT Forum, holding a position on the board and chairing a number of key working groups (WGs), including WG USA, WG Marketing and WG Japan. . This involvement is complemented by our active participation in other relevant Forum working groups, as well as in the ETSI Technical Committee for DECT (TC DECT).

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CUSTOMERSTECHNOLOGIES

CAT-iqDSP Group has been deeply involved in all stages of defining CAT-iq since its inception, including participating in the DECT Forum and defining ETSI DECT NG specifications. DSP Group is also supports CableLabs’ specification activities.

VoIPDSP Group is recognized for its worldwide leadership in VoIP, maintaining the fastest growing market share in this domain and offering the advantage of seamless scalability to DECT. DSP Group provides best-in-class audio quality and cost-effective solutions for low-to-mid-range VoIP applications, which can be seamlessly extended to high-end applications.

Radio Frequency (RF)DSP Group is a leading provider of RF chips, covering all RF bands used in cordless and wireless applications. These bands include 1.7 GHz-1.9 GHz (DECT for the EU, US, LATAM Japan-DECT and Korea), 2.4 GHz (EDCT/WDCT and FHSS DECT), 5.8 GHz (EDCT/WDCT), and Wi-Fi (2.4 GHz and 5 GHz). Designed with CMOS technology, DSP Group’s new generation of chips incorporates all required RF functionality on a single chip, including RF transceiver, LNA, PA and channel filters.

CUSTOMER ADVANTAGES AND BENEFITS

Advantages Benefits

Reflecting DSP Group’s two decades of leadership in wireless semiconductor development, our offering features a number of advantages for CE manufacturers and OEMs:

• Comprehensive product portfolio of complete reference designs of HW, SW and System

• Mature, field -proven chipset solutions • Highly integrated SoCs• Operational excellence anoutstanding customer

support• Broad international standards compliance

and support• Green, low-power offering

DSP Group’s chipset solutions offer CE manufacturers and OEMs a range of benefits to help them better compete in today’s rapidly-evolving residential communications market:

• Low development effort, risk and cost• Fast time to market• Small design footprint • Easy customization and integration of features• Supply reliability• Innovative revenue-generating applications• Expanded market opportunities

CustomersDSP Group is a customer-centric company that proactively partners with our consumer electronics (CE) manufacturer customer base. We also team with service providers who are focused on bringing innovative residential and enterprise converged communications solutions to market. Based on a deep understanding of market needs, we encourage customer involvement in our roadmap development, and offer customers access to our internal R&D resources. A reliable long-term industry supplier, DSP Group maintains a proven track record of operational excellence and successful delivery. With office across Asia, Europe and North America, we provide our customers with outstanding local service and support worldwide.

DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics

(CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio

of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers

to shape the future of converged communications at home, office and on the go.

For more information, visit www.dspg.com.

Copyright © 2014, DSP Group, Inc. All rights reserved. DSP Group, Inc. and DSP Group Logo are trademarks of DSP Group, Inc. Other third party trademarks are property of their respective owners. All product information, dates and figures are not warranted as accurate or complete, and may be revised based on further information without notice.

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