component minimum distance checklist
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7/27/2019 Component Minimum Distance Checklist
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Component to Component Minimum Spacing ChecklistTermsofusingthisarticleThisarticleisprimarilyforinternaluseinQuickteckPCBdesignteam.Nowwedecidedto
openit
up
publicly.
We
try
to
ensure
the
information
in
this
are
as
accurate
as
possible,
but
pleasebeawarewedonttakeanyreasonabilityforanythingthatresultsfromthisarticle.
Youreusingthisatyourownrisk.
Details1. Keepatlease2.5mm(100mil)betweenQFPorSOPcomponents.
2. Keepatleast1.5mm(60mil)betweenQFPorSOPcomponentstochip,DIPorSOTcomponents.
3. ForthesereflowsolderPCBdesign,pleasekeepatlease0.3mm(12mil)betweenchip,DIPorSOTcomponents.
Quick-teck EN-00414
Quick-teck Internal Technical Note http://www.quick-teck.co.uk
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4. ForthesewavesolderPCBdesign,keepatleast1.2mm(47mil)(PCBmovingaxis)and0.8mm(32mil)(verticalaxis)betweenchip,DIPorSOTparts.Forhighprofile
chipcomponents(liketantalumcapacitor),increasethedistanceto2.5mm(100mil).
5. Keepatleast5mm(200mil)betweenBGAandothercomponents.PlacedecouplingcapacitorscloseonbottomsideandkeepasmuchaspossibletoVCCpinonactive
components.
Quick-teck EN-00414
Quick-teck Internal Technical Note http://www.quick-teck.co.uk
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7/27/2019 Component Minimum Distance Checklist
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6. Keepatleast3mm(120mil)betweenPLCCsocketandothercomponents.PLCCsocketshouldbealwaysontopside(componentside).
7. ForSMTconnectors,keeptheheightoftheconnectorastheminimumclearancetotheothercomponents.Forexample,iftheconnectoris3.5mmhigh,thenplease
keepatlease3.5mmbetweenthisconnectortoadjacentcomponents.
8. Leaveatlease2mm(80mil)fromcomponenttotheshieldsolderingpad(metalshieldisquitenormalusedinwirelessproductdesigns).
Quick-teck EN-00414
Quick-teck Internal Technical Note http://www.quick-teck.co.uk
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7/27/2019 Component Minimum Distance Checklist
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9. Leaveatlease1.5mm(60mil)fromthecomponenttotheboardedge.
10.Componentsplacedonthesolderside(bottomside)shouldkeepatlease5mm(200mil)awayfromtheleadsofPTHcomponents.
Quick-teck EN-00414
Quick-teck Internal Technical Note http://www.quick-teck.co.uk