communication ic design and ic application electronicchina 2004, shanghai, march 2004
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Communication IC Design and IC Application electronicChina 2004, Shanghai, March 2004. Ivo Rutten Vice President and General Manager Business Segment Greater China Communications Semiconductor Division. Communication IC Design and IC Application - Agenda -. The Philips approach - PowerPoint PPT PresentationTRANSCRIPT
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Communication IC Designand IC ApplicationelectronicChina 2004, Shanghai, March 2004Ivo RuttenVice President and General Manager Business Segment Greater China CommunicationsSemiconductor Division
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Semiconductors 2
• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary
Communication IC Design and IC Application
- Agenda -
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Semiconductors 3
Differentiating technology• Leadership in Systems and Platforms
– Leveraging Philips’ core competencies in R&D and CE heritage
– Nexperia: The Solution for Video and Mobile applications– Shipping now in GSM handsets, digital televisions and
DVD recorders– Rich IP portfolio with fully integrated re-use concept
• Excellence in RF– RF is crucial for wireless applications– QUBiC4 low cost, high performance RF
• And now, best-in-class CMOS – 120 nm now, 90 nm first full lots now, 65 nm first silicon
in Q4 2003– Ramp-up of 300 mm wafers pilot line in Crolles on target– 0.18 µm non-volatile EE/Flash for encryption technology
in smart cards
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Semiconductors 4
• Nexperia solutions build on comprehensive collective expertise in the Philips Group, particularly Philips’ consumer AV IP
• At the heart of all of our future system products across the markets we serve
• Modular hardware and software• Support for industry standard operating systems• Two application areas:
– Nexperia Home for Connected Home / Digital Home applications including digital television, home entertainment hubs, media servers, DVD recorders, PVRs, wireless displays and media adapters
– Nexperia Mobile for mobile multimedia handsets, wireless PDAs, other portable wireless devices
Nexperia™
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Semiconductors 5
• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary
Communication IC Design and IC Application
- Agenda -
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Semiconductors 6
Nexperia Cellular System SolutionsEverything but the plastic:
• Complete reference designs for GSM/GPRS/EDGE mobile handhelds
• Full IOT validated system including Nexperia Cellular Multimedia Baseband, power management unit, RF, power amplifier and software
• Tailored for target applications• Add multimedia with minimal cost, risk and time-
to-market
… All you need for multimedia handsets
Well on our way to 1 out of 10 GSM/GPRS phones based on Nexperia Cellular System Solution
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Semiconductors 7
Power management
Services & software
Connectivity
Security/ identification
Pipeline
Imaging
Mobile displays
Multimediasolutions
Scope of Philips mobile applications
Voice/audio
Video
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Semiconductors 8
2003 2004 2005 2006/7 2008/9
Memory
Baseband
PMU/Charge
Transceiver
ASW/PA FEM/GSM module
Analog ICRFCMOS
Single dieCMOS
Step 1Step 1 Step 2Step 2 Step 3Step 3
RF-CMOS Development
AudioSySolBaseband IC
CMOS
SySolAnalog ICBiCMOS
System solutions: from sysol ME3 to ME4
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Semiconductors 9
Step 1: 2 dies in 2 technologies
Analog Digital
HighPower
LowPower
RF poweramplifier
Batt chargeswitch
Analog pwrsupply
RF powersupply
Dig pwrsupply
Ref.Oscillator
AuxiliarADCs
Transmitter+ Synth
MemoriesRam/ROM/Flash
DSP +CPU
JTAG +Peripherals
GMSK mod,Pre-dist.
BAI Audiosign. proc.
32 kHzclock unit
RTC +alarm
On/offcontrol CMOS 090
QUBIC4+
AuxiliaryDACs
AnalogueAudio
Micbias+Audio det
RF powercontrol
Receiverchain
RxADC
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Semiconductors 10
Step 2: 2 dies in 1 technology
Analog Digital
HighPower
LowPower
RF poweramplifier
Batt chargeswitch
Analog pwrsupply
RF powersupply
Dig pwrsupply
Ref.Oscillator
AuxiliarADC’s
Transmitter+ Synth
MemoriesRam/ROM/Flash
DSP +CPU
JTAG +Peripherals
GMSK mod,Pre-dist.
BAI Audiosign. proc.
32 kHzclock unit
RTC +alarm
On/offcontrol CMOS090
RFCMOS090
AuxiliaryDAC’s
AnalogAudio
Micbias+Audio det
RF powercontrol
Receiverchain
RxADC
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Semiconductors 11
Analog Digital
HighPower
LowPower
RF poweramplifier
Batt chargeswitch
Analog pwrsupply
RF powersupply
Dig pwrsupply
Ref.Oscillator
AuxiliarADC’s
Transmitter+ Synth
MemoriesRam/ROM/Flash
DSP +CPU
JTAG +Peripherals
GMSK mod,Pre-dist.
BAI Audiosign. proc.
32 kHzclock unit
RTC +alarm
On/offcontrol
CMOS090 with RF option
Step 3: 1 die in 1 technology ME4
AuxiliaryDAC’s
AnalogueAudio
Micbias+Audio det
RF powercontrol
Receiverchain
RxADC
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Semiconductors 12
High-level requirements for ME3
• Low to mid tier phone with EDGE capability• Main technologies CMOS090 and QUBiC4+• Target 1 package, maximum 2 packages• Enabling the path to1 die in CMOS for ME4• Main focus on size, component count and
process diversity reduction, reaching BOM reduction at the same time
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Semiconductors 13
Baseband - one page guideline• System target: GSM/EGPRS modem with integrated MRAM
Integrated MRAM, which satisfies the mainstream • Architecture: SC ARM9xx, DSP RD16025
DSP and SC memory concept to be revisited in the light of MRAM concept
• Technology: CMOS090• Typical
implementation: Package option for external bus interface (EBI) forhigher tier(s)On-chip integrated voltage regulators Stereo Audio and AUX ADCs on dieDigital RF interface, USB OTGDigital interface options for GPS (GIU), camera, etc.
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Semiconductors 14
Transceiver - one page guideline• System target: GMSK and 8PSK modulation• Architecture: TX: Polar modulation concept
RX: Near Zero IF receiver• Technology: QUBiC4+ 4.5 mm² target die size
• Typicalimplementation: SD FracN PLL for PM and AM by PA-control DAC
High dynamic RX ADC to relax analog requirements (filtering and # of AGC-steps)
Digital RF interfacePassive integration (PICS)Integrated power supply
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Semiconductors 15
PA/antenna switch - one page guideline• System target: GPRS/ EGPRS, MSC 12, QB• Architecture: Polar modulation; feed forward AM
AM and AM/PM pre-distortion may be needed
• Technology: CMOS control + GaAs RF + Passi Si alternative: QUBiC4+ and Passi Si (passive integration)
– cost/performance trade-off
• Typicalimplementation:Saturated QB PA for GPRS and EGPRS
Integrated QB, low-loss antenna switchWide dynamic, high accurate AM control via
analog AM control signalPhase pre-distortion via look-up tablesDigital RF; control interface part (only) – tbdIntegrated power supply regulator
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Semiconductors 16
Power management - one page guideline
• Distributed power supplies (RF and BB)• Bulk of the power management on QUBiC4+ die• Adaptive Voltage Scaling for BB part
– PowerWise– Tube (post regulation LDOs on CMOS090)
• Partitioning for extra functionality has to be studied:– Charging driver transistor (up to 20 V, including charge via USB)– Backlight management (fun lighting, flash light, 20 V)– USB OTG transceiver– Battery connected supplies (voltage limitation or pre-regulation for
RF and BB needed)
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Semiconductors 17
Sysol software – one page guideline
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Semiconductors 18
• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary
Communication IC Design and IC Application
- Agenda -
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Semiconductors 19
2.5/3G Nexperia PNX5220 MM baseband IC
• Contains– ARM926 system controller (SC) with rich set of peripherals– Telecom DSP– Speech/Audio DSP– Several intercore and and top-level blocks– analog baseband and audio interface (BAI)
• Process– 0.09 µm CMOS process for digital– 0.25 µm CMOS process for analog
• Packages– Production: TFBGA, 320 balls, 4 rows, 0.5 mm pitch– Development: BGA376, 1mm for digital; LQFP80 for analog
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Semiconductors 20
I&Q
Burst FLASH,SRAM/PSRAM
Front endhands free
MMCMemory Stick
PC, Mouse,USB Stick,Camera, ...
SensorOM6802
Charger
Charge ICUBA2008
Bat
tery
LCDPCF8880/90
PNX5220
RF DAC
ARM926
UARTUSIM IIC
EBI
NFI
SDI
Stereo ADC
Stereo DAC
RFCU
GIUSPI3
UART
FCIMSI
SIM card
USB-OTG
BT-BBPCF87752
BT-RadioUAA3559
PNX5220 application diagram
IOM
2
UMTS ModemPCF0501
UAA3537
GMSKMod.
RF ADC
UAA3580UAA3581
PMUPCF50603PCF50606
GPS RadioUAF1572
Serial Flash
Nand FLASH
mobile SDRAM ImagingSubsystem
ATX
Keyboard 6x6 matrixKBD
Saturn DSP2 (audio)
Saturn DSP1 (telecom)
JDIjog dial
SPI2SPI1
new block
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Semiconductors 21
PNX5220 MM features
• Increased processing power– effective MIPS x 2-2.5
• high-performance memory interface– accelerators for multimedia
• Reduction of system cost– integration of multimedia features : MPEG4, camera i/f
• no need for additional IC– possibility to use cheaper memories
• Nand Flash + SDRAMs
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Semiconductors 22
• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary
Communication IC Design and IC Application
- Agenda -
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Semiconductors 23
Nexperia mobile multimedia application ICs
• Image processor PNX4000– Targets cost sensitive camera phones– Real-time image capture + graphics features
• A/V coprocessor PNX4004– Targets entertainment phone segment– Enhancing visual user-experience by unique smart imaging &
Display features
• Application engine PNX4008– Targets smart phone and gaming segment– High-end open-OS multimedia processor
optimized for Symbian v8
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Semiconductors 24
• Key features– Preview, capture, store JPEG images / MJPEG video clips– Streaming JPEG encode with variable compression ratio– Picture edition with transparency, icons animation– Scaling and Digital zoom (16x)– Sensor Interface with up to 1.3 Mpixels (30 fps in VGA)– Dual LCD support (max width=176, color depth = 65k)– Dedicated power management (10 mW preview, 10 µA
stand-by)– Small footprint (7x7 mm TFBGA112)
• Value proposition– Cost-effective solution for camera phones combining small footprint and
low power consumption
PNX4000 image processor
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Semiconductors 25
PNX4000 system architecture
PNX4000PNX4000 BBBBParallel IF
I²C
YUV IF
LCD2 selectLCD1 select
Parallel IF
CS
IT
Driver ex : Driver ex : - PCF8880- PCF8880 - PCF8833- PCF8833
Driver ex : Driver ex : - PCF8881- PCF8881 - PCF8835- PCF8835
Ex : Ex : - Sysol (ARM7)- Sysol (ARM7)
Ex : Ex : - OM6802- OM6802
Sensor Interface up to 1.3 Mpixels, 30fps in VGA Flexible Host Interface SPI or parallel (8080x or 68xx)Support for 2 LCD (SPI or parallel interface)
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Semiconductors 26
PNX4000 – product support• Standard Development Kit
– IC + development boards – Application notes– Public API
• Specification (function description)• Source code• Validation on Sysol mobile platform (ARM7 + Philips OS)
• Optional– Public API customization
• sensor, LCD display driver, on-site platform support– Customer applications support
• JPEG decoder, MJPEG/MPEG4 transcoder
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Semiconductors 27
PNX4004 AV coprocessor • Targets entertainment phone segment
– Low latency viewfinder, still image capture and playback, – Picture editing– Audio / video clips capture and playback– Audio / video streaming
• Enhancing visual user-experience by smart imaging & display features– Core audio / video engine– System peripherals– Imaging / display features
• Based on ARM926EJ CPU, 208 MHz + SiHiveTM ERC• Flexible host interface, compliant to TS27.010 protocol• Embedded RTOS
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Semiconductors 28
PNX4004 system configuration
StereoAudio DAC
2 MpixCMOS sensor
VoiceCODEC
Cellular Baseband RF
Main QVGA LCD256k colours
MMC/SDCard
SDRAM NAND flash
DigitalTV encoder
(DENC)
PNX4004
Mobile MultimediaCo-processor
TV
sub-display
UART UART
Cam I/F
PCM/IOM-2 I2S
SPI
LCD-out
TV-out
SD I/FNAND I/FSDRAM I/F
8 YUV or10 RGB
I2C Optional
Version 0.3Jan.29 ‘04
YC or CVBS
E.g. for wirelessconnectivity devices
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Semiconductors 29
PNX4004 Video/Audio engine• Camera I/F supporting up to 2 Megapixel sensor
– supports both YUV and RGB Bayer sensors
• Real-time MPEG4 / H.263 HW accelerators– encoding / decoding up to 30 frames/sec CIF– adaptive deblocking post-processing filter for decoding
• Fast JPEG image HW encoder / decoder– encoding / decoding of multiple stills/sec of 2Mpix
• Audio support for video applications and MP3 player– AMR audio SW encoder / decoder– MP3 + AAC SW decoder– No advanced audio features > Baseband
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Semiconductors 30
PNX4004 system peripherals• Memory interface
– 32/16 bit SDRAM, max 128 MB ext. memory space, 104 MHz– NAND flash I/F, max 2 GByte, 8/16 bit devices– SD / MMC
• Host interfaces– High-speed UART (900kbps) with flow control– Parallel I80/M68 (8 and 16 bit, supports muxed Addr/Data)
• 2 audio interfaces– PCM/IOM-2 and I2S
• General– 4 UARTs, 2 high & 2 low-speed UARTS - one supports IrDA– Fast I2C– JTAG debug, ETM9/ETB with 1k x 24 bits trace store
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Semiconductors 31
PNX4004 imaging / display feature set
• Enhanced Camera Signal Processor (eCSP)– Optimized for Mpix digital still performance– Auto Exposure, Auto White Balance and Auto Focus– Sketch, solarization, negative, sepia, B&W, embossing modes
• Camcorder functionality– True continuous digital linear zoom– adaptive deblocking post-processing filter for decoding– Image stabilization– Video GFX renderer for capture overlays
• Embedded main LCD controller– Drive RAM-less TFT or C-STN display, 16/18-bit RGB
• TV output– Digital YUV I/F to external DENC IC
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Semiconductors 32
PNX4004 imaging / display feature set
• Graphics / Rendering– Overlay of several objects, stills, video,
graphics, text– Programmable attributes per object:
• Geometric transformations– Translation– Scaling– Rotation– Slant
• Depth• Transparency level
zoom
GFX rendering
Image stabilization
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Semiconductors 33
PNX4004 imaging / display feature set
• SiHiveTM Embedded Reconfigurable Computing core– Application-Specific-Instruction DSP– VLIW / Space Time Computing based
• Benefits– Si efficiency ~ dedicated HW accelerators– Allowing low cost solution to
Customization of Imaging / display feature set
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Semiconductors 34
PNX4008 application engine
• Targets high-end smart phone and gaming segment– performance + power consumption optimized
• Dedicated audio system based on XpertTeak DSP• ARM926EJS floating point RISC processor, 208 MHz
– includes Jazelle JAVA accelerator• High-performance 3D graphics processor / open-GL ES • HW accelerated JPEG/MPEG4/H263 video engine• HW accelerated security core• Host and OS independent
– optimized for Symbian OS V8.0B with UIQ V2.1• CMOS090, LFBGA320
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Semiconductors 35
PNX4008 system configuration
2 - 4 MpixCMOS sensor
VoiceCODEC
Bluetooth Cellular Baseband RFRF
Main QVGA LCD256k colours
MemoryStick
SDRAM NAND flash
Keypad
Touchscreen
PNX4008
Mobile MultimediaApplications Engine
UART UART
Cam I/F
PCM/IOM-2 StereoAudio out
LCD-out
MS I/FNAND I/FSDRAM I/FKBD I/F
TS I/F
8 YUV
I2C
USBOn-The-Go
USB-OTG I/F
Version 0.2
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Semiconductors 36
PNX4008 feature set (1)• Audio:
– MP3, ATRAC3, dynamic compression and equalization, integrated Stereo Audio DACs
• Video– JPEG HW decode, MPEG4/H263 codec, SP L0 to L3, Up to CIF
30fr/s, Video conference mode• Graphics
– MBX 3D Graphics Accelerator, OpenGL ES1.0 compliant Performance @80MHz: 160Mpix/s, 1Mpolygons/s
• Camera– max 4Megapixel input, YUV 4:2:2 format
• LCD– Dual display support, max QVGA RGB 256K colors / 60fr/s
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Semiconductors 37
PNX4008 feature set (2)• Security:
– Discretix CryptoCell™; 5-15x HW acceleration:– PKI key exchange (RSA, ECC, DSS, DH), Symmetrical encryption
(DES, 3DES, AES), HASH core (SHA-1, MD5), Random nr generator, Secret Crypto key
• External Memory– 64MByte SDRAM supported– Direct NAND Flash support– Memory stick– SD / MMC
• TouchScreen, Keypad• USB OTG (12Mbit/s)• I²C, SPI, UARTS (960 kbaud)
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Semiconductors 38
PNX4008 development kit
• PNX4008 Applications Engine IC• Development and Integration board• Open-OS
– Base port of Symbian V8B and UIQ, including components, middleware and sample applications
• Software Development Kit– Compilers and IDE for system integration and application
development• Supported by partners Metroworks, Teleca, Symbian
SDK
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Semiconductors 39
• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Conclusion
Communication IC Design and IC Application
- Agenda -
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Semiconductors 40
• LCD (LB064V02) + backlight• Touch screen• Speakers 8 ohm / 2 Watt a piece• IO module with buttons and small LCD display• Battery (3 hours instead of 4)• Small PCB with USB plug, AC adaptor plug, on/off switch, rotary
knob
PCMCIAVodaphone
GPRS modem
USB-1.1 port
Internal CF Slotfor Flash or HDD
Build-in DVB-TAntenna and MPCI receiver
VGA LCD +Touch Screen +Stylus pen
Built-inLion battery
Built-inSpeakers
LocalButtons
Hotman DVB-T/GPRS portable devicePrototype @ CeBit 2004
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Semiconductors 41
DisplayBaseband
TV-Companion: 3-chip concept building on the programmable TV front-end
RF
Multi-standard Channel decoder
SiliconTuner
Add-on
Source decoderPNX0105
De-mux partitioni
ng
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Semiconductors 42
ApplicationEngineBase-Band
Programmable TV front-end add-on:for advanced phone using the available application engine
RF Display
Source decoding in the
AESiliconTuner
Add-on Programmable Multi-standard Channel decoder and De-mux
MSPOFDM
PES/IP
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• The Philips approach• Low-cost/high-performance system solutions • Single-chip MM baseband for feature phones• Mobile multimedia solutions• Portable DTV/GPRS solution• Software solutions• Summary
Communication IC Design and IC Application
- Agenda -
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Summary
Our IC and software technologies enable the Our IC and software technologies enable the world of the Connected Consumerworld of the Connected Consumer
Leading-edge process technologies, AV software, system expertise, roadmaps
Leveraging our Nexperia™ platforms: Capable of providing affordable full system
solutions Putting emphasis on multimedia functionality
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