common rf test on ate.ppt [兼容模式]

Common RF Test On ATEICTEST8 the 10th test symposium

COE Expert Engineer (ADVANTEST)p g ( )Kevin.Yan

2017/12/15 All Rights Reserved - ADVANTEST CORPORATION 1

Agenda• RF Typical test items Introduction

Test Challenges• Test Challenges

• WSRF Brief Introduction

• WSMX Brief Introduction

• Summary• Summary


RF device test blocksRF device test blocks• Typical PLL tests

• Typical Transmitter Tests

• Typical Receiver Tests


Typical PLL testsTypical PLL tests• Transceiver devices contain a PLL which is used to create a l l ill t flocal oscillator frequency.• The LO frequency is used to either:

– Beat with incoming RF signal to extract the baseband signalBeat with incoming RF signal to extract the baseband signal

– Combine with baseband signal to produce modulated RF output• Typical tests on the PLL includeyp

– Charge Pump Current

– Prescaler SelectivityPrescaler Selectivity


What is a charge pump circuit?

• Phase Locked Loops are Voltage or Current controlledVoltage or Current controlled oscillators.• The charge pump is the circuit which increases or decreaseswhich increases or decreases the voltage or current to the VCO.

– This causes the frequency of PrescaleCounter

Phase / Freq

Charge Pump VCOs causes t e eque cy o

the oscillator to increase or decrease in proportion to the voltage change.T i ll th h i

Counter detectorPump

– Typically the charge pump is controlled by a frequency or phase detector which produces a voltage change proportional

FeedbackDivider

g g p pto the difference from a reference signal.


Transceiver BlockTransceiver BlockSet voltage to CP, and measure current

LNA / Mixer Base band G i / FiltGain / Filter

PLL / Local O ill t DCCharge

P

Transmitter / Baseband

Oscillator DC instruments

Pump

modulator Filter

Digital ControlControl DUT to switch mode and band Digital ControlControl DUT to switch mode and band


Goal of Prescaler Sensitivity TestGoal of Prescaler Sensitivity Test• Ensure that the PLL is stable in all operating modes of the d idevice.

– In each mode the frequency of the recovered output after the

prescale di ider sho ld be constantprescale divider should be constant

– Across all modes the frequency of the recovered signal should not

b th t i tvary by more than a certain amount


Internal PLL structureInternal PLL structureDigitizer Measure

Prescaler out

RF Port

Prescaler_out

TX

PrescaleCounter

Phase / Freq detector

Charge Pump VCO

RF Port

Source

LO IN

LO

RX LO

FeedbackDivider


Test TechniqueTest Technique• PLL is programmed to given mode using digital control

RF i d t id i t f t PLL• RF source is used to provide input frequency to PLL • Digitizer is used to capture the output frequency divided by the prescaler• Time domain averaging of capture used to reduce noise• Windowed fft built-in function used to determine frequency of signal after prescalerg p• Difference between the highest and lowest extremes tested


Time domain and frequency domain (phase noise performance)

IDEAL SIGNAL REAL WORLD SIGNAL

V(t) = A sin 2π f t

IDEAL SIGNAL REAL WORLD SIGNAL

V(t) = A sin 2π f to o oV (t) = [A + E(t)] sin [2 π f t + φ(t)]o

E(t)

φ(t)φ(t)


RF transceiver block

DUT

DPS module TX TEST

AnalogAWG

Diff.

Diff

IQ input

RF measure

RFoutput

DUT

Diff.

90°

p

DPS module

RF Pure clock

Digitalmodule

DiffRF source

Diff.

Diff.

IQoutput

AnalogDGT

RFInput

90°

RF

DUT

DigitalRX TEST


RF Pure clock

Digitalmodule

RX TEST

Common Transmitter TestsCommon Transmitter Tests• DC Tests

– Current consumption

• Supplies and internal referencesRF T t• RF Tests– Measure Output Power

– TX -ACPR

– TX EVM

– TX Compression point


RFTX - Output PowerRFTX Output PowerPower

Test Description

Baseband signal

FreqRF

RF measure

(modulated signal or single tone) is added to IQ pin of DUT.

DUT

RF measure

Analog AWG

The Output Power of RF signal is measured. I

Voltage

I

Q

RF R di F

Time

Q

Time

Voltage

RF : Radio FrequencyCW: Continuous Wave


RFTX - ACPRRFTX ACPR

Test Description

Power Channel Power Adjacent Channel

Test Description

Baseband signal (modulated signal ) is FreqRF

RF measure

added to IQ pin of DUT.

The Adjacent Channel Power of RF signal is

DUT

RF measure

Power of RF signal is measured.

Voltage

Analog AWG

I

Q

Time

IVoltage

V lt

Q

ACPR : Adjacent Channel PowerACLR : Adjacent Channel Leakage Power Ratio

Q

Time

Voltage


RFTX - EVMRFTX EVMEVM: Error Vector Magnitude(I0, Q0) : Ideal Symbol(I, Q) : Measured Symbol I

Q

(I, Q) : Measured Symbol

Measured symbolQ

Magnitudeerror

(I,Q)Ideal symbol

measured symbolRF

RF measure

Error vector

Ideal Symbol

Phaseerror (I0,Q0)

DUT

RF measure

I

φ Analog AWG

I

QTest Description

Baseband signal (modulated signal) is

Time

IVoltage

Q

(modulated signal) is added to IQ pin of DUT.

The error vector magnitude

Q

Time

Voltage


of RF signal is measured.

Transmitter CompressionTransmitter Compression• Goal of the test:

– To determine the amount of compression seen on the I and Q

signals at the RF output when the level of modulating I and Q signals

are increased

– The I and Q signal should not compress by an amount greater than

specified


Gain Comperssion-P1dBpLinear area Non-linear area

DPSRF Signal

de ude

ude

ude

RF IN RF OUT

Time

Am

plitu

d

Am

plitu

Am

plitu

Am

plitu

Time

TimeTimeMeasurement DetailsDefinition of TermDefinition of Term

In a low input level area (a small signal area), the output level for an amp increases at a specific slope as the input level increases (linear area). With further increases in the input level, the amp begins to show non-linear characteristics, and the actual output level comes to be lower than that expected from the gain in the linear area. There would not be any problem with this if only the outputexpected from the gain in the linear area. There would not be any problem with this if only the output level were the decrease to less than the expected value, but the effect of this non-linear behavior appears as a distortion of the amplified signal. If this value exceeds P1dB, the gain will drop rapidly, and the output level will come to saturation. The output power for when gain decreases by 1 dB as compared to the gain in a linear area where the signal input is low is defined as “output power when

PurposeThis measurement is taken in order to evaluate the usable input/output range (linear area) of an amp.

compared to the gain in a linear area where the signal input is low is defined as output power when gain is compressed to 1 dB (P1 dB).” The unit of measurement is [dBm].


P1dBout=P1dBinput + G – 1dB

Gain Comperssion-P1dBpm

)w

er (d

Bm Sweep Input power and

measure output power

O1 dB i

Out

put P

ow Plot Output Power Vs Input Power

Fi d th i t h t l

1 dB compression

O Find the point where actual Output Power is 1dB less than projected Output Power

Input Power when this Output Power “shrink” by 1dB is P1dB

Input Power (dBm)


Third Order Intercept - ConceptThird Order Intercept Concept


Intercept Point Third Harmonics-IP3p

DPSRF Signal

Bm Δf

dBm

RF IN RF OUT

d Δf

f f 2f f2f f Freq encf1 f2 Frequency

f1 f2 2f2 - f12f1 - f2

Third-order distortion

Third-order distortion

Frequency

Measurement DetailsDefinition of Term

Refers to two-signal third-order distortion. Input two signals of the same level (possibly with some difference between the levels of the two) and with a frequency difference of Δf into the DUT, measure the third-order distortion that appears in a side band of the DUT output and calculate the IP3 of thethe third-order distortion that appears in a side band of the DUT output, and calculate the IP3 of the DUT output power (OIP3) and the IP3 of the DUT input power (IIP3) from the point of intersection in the figure shown on the right. The unit of measurement is [dBm].

PurposePurposeUnlike a distant distortion as in harmonics, adjacent distortion appearing in modulated wave exerts

undesirable effects on adjacent frequency bands. Therefore, it must be evaluated. Cause adjacent distortion to be generated in output by inputting two signals, and measure adjacent distortion characteristics of the DUT


characteristics of the DUT. OIP3=Pout + △IM/2

Third Order Intercept - DerivationThird Order Intercept Derivation• For any harmonic we have :

HD ( 1 )( HIP P )HDn = ( n –1 )( HIPn – Po )where n = harmonic number.

• Consider the second-order products resulting from two input signals having the same magnitudes.• The frequencies are f1 + f2 and f1 – f2. Both components are proportional to V1V2 = V1

2 = V22.p p 1 2 1 2

• If both input signals are increased x dBs, then both second-order products increase by 2x dBs.


Third Order InterceptThird Order Intercept• Consider the third-order products resulting from two input i l h i th it dsignals having the same magnitudes.

• The components at frequencies 3f1, 3f2, and 3f1- f2 are normally out of band and are not considered here.• The components at frequencies 2f1- f2 and 2f2 - f1 are normally of interest to the RF engineer. These components have magnitudes proportional to V1

2V2 and V1V22respectively.g p p 1 2 1 2 p y

• If both signals are increased by x dBs, then both third-order components increase by 3x dBs. Thus we have:• IMD3 = 2( IP3 – P0 )IMD3 2( IP3 P0 )


RFTX - IP3 PowerRFTX IP3

Freq

Power

f1 f2(2f1-f2) (2f2-f1)

∆IM

Test DescriptionBaseband signal (two tones) is added to IQ pin

Freqf1 f2(2f1 f2) (2f2 f1)

RF

RF measure

tones) is added to IQ pin of DUT.

The 3rd intermodulation

DUT

RF measure

Analog AWG

distortion (IM3) which is generated by output RF signal is measured. I

Voltage

I

Q

The 3rd order Intercept Point (IP3) is calculated by IM3. OIP3 = Power(output) + ∆IM/2

Time

QVoltage

IP3 : 3rd order Intercept PointIIP3/OIP3: Input IP3 / Output IP3IM3 3 d d I t d l ti Di t ti

OIP3 Power(output) + ∆IM/2 ∆IM = Power(output) – Power(IM3) Time


IM3: 3rd order Intermodulation Distortion

Power Output FlatnessPower Output Flatness• Measurement of the output levels across the various modes or b d t d b th d ibands supported by the device.• Since the previous test for carrier suppression, output level, and unwanted sideband suppression provide all the information. It is not necessary to repeat measurements.• Simple calculations are used to determine the flatness of the output levels. p

– Look for the difference between each measurement

– Determine if the extreme values exceed the specification for flatnessp


Typical Receiver TestsTypical Receiver Tests• RX IP3

RX EVM• RX EVM• RX Gain• I/Q Phase and Gain • AGC Tests• Noise Figure• Receiver Blockers• Filter Bandwidth and Ripple• Image Rejection


I/Q Phase and GainI/Q Phase and Gain• Identify any mismatch in phase or gain of the I and Q d d l tidemodulation.• I and Q signals should have the same amplitude• I and Q signals should have the 90 degree phase shift preserved


RFRX - IP3RFRX IP3Power

Δ f

OIP3

Output Power

3rd order

Freq

OIP3

Fundamental

3 orderIntercept Point

3rd order

RF source

IIP3 Input Power

IntermodulationDistortion

DUT

RF measure

Analog DGT

RF

Test DescriptionRF signal (two tones) is added to RF input pin of DUT. I

Power

Δ IMI

p p

The 3rd intermodulation distortion (IM3) which is generated by analog IQ

Q

Freqf1 f2(2f1-f2) (2f2-f1)Power

Δ IMQ

DC

generated by analog IQ signal is measured.

The 3rd order intercept point (IP3) i l l t d b IM3

IIP3 = Power(input) + ∆IM/2 ∆IM = Power(output) – Power(IM3)

IP3 : 3rd order Intercept PointIIP3/OIP3: Input IP3 / Output IP3


Freqf1 f2(2f1-f2) (2f2-f1)DC(IP3) is calculated by IM3. IIP3/OIP3: Input IP3 / Output IP3

IM3: 3rd order Intermodulation Distortion

RFRX - EVMRFRX EVMPower Modulated Signal

Measured symbolQ

Magnitudeerror

(I,Q)

FreqError vector

Ideal Symbol

Phaseerror (I0,Q0)

RF source

I

φDUT

RF measure RF

Test DescriptionRF signal (modulated signal) is added to RF

Analog DGT

I

Q

g )input pin of DUT.

The error vector magnitude of analog IQ

I

Q

I

Ideal symbolmeasured symbol

magnitude of analog IQ signal is measured.


measured symbol

RFRX - GainRFRX GainPower

Test Description

RF signal (single tone) is added to RF input

FreqRF source

is added to RF input pin of DUT and output IQ signal is measured.

G i i l l t d b

DUT

RF measure RF

Gain is calculated by RF input signal and analog output signal.

Analog DGT

I

Voltage

I

Q

Freq

I

Q

VoltageDC


FreqDC

Automatic Gain Control (AGC) Testsuto at c Ga Co t o ( GC) ests• Device gain should maintain baseband output level

D i h l i l l t b t t d• Device may have several gain levels to be tested• Production testing may not require all ranges be tested• Typical test:

– Low signal amplitude gain

– High signal amplitude attenuation• May include AGC off test


Noise FigureNoise Figure• Derived from Noise Factor:

– Defined as the ratio of the input signal-to-noise and the output

signal-to-noiseN i Fi i N i F t i d ib l• Noise Figure is Noise Factor in decibels

• Values for Noise Figure range from:– 0 ≤ NF < ∞0 ≤ NF <

• Calculated by:– NF = 10 log (F)

• Where F = (Sin/Nin)/ (Sout/Nout)


Receiver BlockingReceiver Blocking• Measurement of the ability of the receiver to capture the wanted i l i th f t d i lsignal in the presence of unwanted signals.

• The unwanted signals are those other than adjacent channel signals.• Apply signal with a blocker as two-tone

– RF + blocker = tone1

– RF + Baseband = tone 2• Apply signal without blocker as two-tone• Measure the difference in the gain with and without blockerMeasure the difference in the gain with and without blocker• Subtract gain with blocker from gain without blocker


Filter Bandwidth and RippleFilter Bandwidth and Ripple• Measure the bandwidth of the receiver input

M th f i d i l i th t f th• Measure the power of a received signal in the center of the receiver’s band.• Measure the power of a signal of the same amplitude when the frequency is varied across the band of the receiver.• Observe the difference in amplitude at specific frequencies and determine ripple.pp• Observe the amplitude at bins outside the passband


Image Rejection

• Apply two inputs to the DUT– Desired channel with Baseband signal

– Image offset from channel center frequency• Device down-converts the RF to IF• IF is down-converted to baseband• Baseband spectrum is examined to see if Image channelBaseband spectrum is examined to see if Image channel present• Rejection ratio = IFsignal/IF image


Test Challenges

• Device high performance require high Spec for ATE instruments.B d id h f d l i i l LTE( 60MH 120MH )- Bandwidth for modulation signals. LTE( 60MHz,120MHz)

- Short settling time for DC, digitizer, RF instruments on ATE tester.- Better noise floor ,better phase noise performance is needed.

• Low Cost - Sequence control to eliminate overhead.Sequence control to eliminate overhead.- In site parallel testing- Multi-site Interlacing- Smart-Calculation ( multi-thread handle data and calculation) ( )


SmarTest 8 Instrument

RF Meas

RF Stim

RF VNA Digitizer AWG DCVI digInOutInstrument

WSRF

Meas Stim VNA

WSMX PS1600

g

DPS128

Instrument

HW Cards

A ifi d t t h d• A unified way to setup hardware resources.• An abstract layer between SmarTest test programs and the

hardware resources of V93000 system.

2017/11/15

362017/12/15 All Rights Reserved - ADVANTEST CORPORATION

WSRF ‐ Card and RFIM Showing the 32 Ports

90101 90108

WSRF Card RFIM

90101 - 90108

90109 90116WSRF C d RFIM90109 - 90116WSRF Card RFIM

90201 - 90208

90209 - 90216


Instruments spec improvement benefit testing• TX Test Results Summary

– WSRF/MX vs Previous Generation

Previous Generation WSRF/MXIQ Phase stability Limited by digitizer's uncertainty

5nsWSMX uncertainty is only 300ps5ns 300ps

TX EVM & ACLR (Band 01, 2xCCA, 20MHz-20MHz), BW=120MHz

• Limited by instrument BW (~22MHz)• 24 captures (6 captures/test

• Up to 200MHz BW

• 4 captures (1 captures/test mode x 4 modes) mode x 4 modes)

TX EVM & ACLR (Band 39, 1xCCA, 20MHz), BW=60MHz

• Limited by instrument BW (~22MHz)• 12 captures (3 captures/test

• Up to 200MHz BW

• 4 captures (1 captures/testBW 60MHz 12 captures (3 captures/test mode x 4 modes)

4 captures (1 captures/test mode x 4 modes)

CIM3 compared with LAB’s MXA

Limited by digitizer noise floor Better noise floor

RF and Baseband IQ test Need to test RF and BB separately (resource limitation)

Able to do RF and BB measurement in parallel


Operating Sequence• An operating sequence is an arrangement of calls of patterns, actions, and

transaction sequences to be executed.• The arrangement can be serial, parallel, or a combination of both.

sequential {actionCall DC;parallel {

sequential {actionCall AWG; }sequential {

sequential {actionCall DC;parallel {

sequential {actionCall AWG; }sequential {

DCsequential {

transactionCall Condition1;parallel {

sequential{actionCall meas1portA; }sequential{actionCall meas1portB; }

}

sequential { transactionCall Condition1;parallel {

sequential{actionCall meas1portA; }sequential{actionCall meas1portB; }

}

Mixed

PA

RF…

}}

}

…}

} }

• Straightforward and descriptive • All domains supported

RF

• Straightforward and descriptive All domains supported• Precise synchronization


• Operating SequenceSmarTest 8 Key Features

Operating Sequence

Protocol DGT capture

RF stim

– Easy to program with using Device Setup API• In previous test program, there are 27 RX BASIC Test Suites

(27 RX Path) • In WSRF, we can test all 27 test suites in one test suite

– Multiple test suites can be combined with Operating Sequence to save test timeq

– Stop point can be set in the Operating Sequence during debugging• Easy to debug with using Spectrum Analyzer or Oscilloscope• Easy to debug with using Spectrum Analyzer or Oscilloscope• No need to modify any codes


Site Interlacing• In case of limit resources, Site Interlacing is automatically arranged• Site Interlacing is based on DUT board description.

i 1&

PA PA

PA

RF power

PA site 1&5

site 2&6

it 3&7RF power

RF power

RF power

site 3&7

site 4&8

RF power

RF powerIndependent resources

Shared resources


RF transceiverLTE CAT 10, traditional „serial“ test flow (shared source architecture)

BB stimIQ

BB measureIQ

BB stimIQ

BB measureIQ

Site 8Site 1

x M YA B Cx M YA B C

x M YA B CRF stim

RF measureRF stim

RF measure

x M YA B CTest time


RF transceiverLTE CAT 10, choice for max parallelism (independent RF subsystem architecture)

BB stimIQ

BB measureIQ

BB stimIQ

BB measureIQ Parallel

RF test

MY

Site 8Site 1 flow

Test time benefit b hit t

xM

Cx M YA B C

x M YA B Cby architecture

ABC

x M YA B CSerial RF test flow

ATest timeRF stim

RF measureRF stim

RF measure

x M YA B C


Architectural differences Shared stim source vs independent RF subsystem A B C

LTE-A CAT 10 Transceiver 3 DL / 2 UL

XXShared stim source vs independent RF subsystem A B C

f

XXmisc

RF architecture based on a fanout architecture with shared stim sources

MM YYRF architecture based onindependent RF subsystems and true parallel stim / measure ports

WSRFTraditional ATE shared source architecture

Engineering efficiency• Faster TTM SmarTest 8 and WSRF architecture

MMYY

MM YY Improved fault coverage• Mission mode parallelism spurs, harmonics, ...xxxx

BC

BC Test time benefits

• Higher parallelism shorter test time

Test time benefit by architecture

At

A

FDD


WSRF Brief IntroductionWSRF Brief Introduction


• RF Performance:Performance

˗ Frequency coverage: 10 MHz – 6 GHz˗ RX Bandwidth: 200 MHz, 350 MHz

(undersampling)

802.11ac 160MHz signal 5.8GHz 1024 QAM 0.55% EVM

(undersampling)˗ TX Modulated Bandwidth: 200MHz˗ Dynamic range: 145 dB

Settling Time˗ Settling Time˗ Frequency change - 560 us˗ Power change - 80 us

• SmarTest 8: TTQ and early competitive throughput

Consistent intuitive test oriented Up to 200 MHz bandwidth˗ Consistent, intuitive, test oriented (‘instruments’), debug, & reuse

˗ Operating sequence: actions (synced with digital DPS MX RF)

Up to 200 MHz bandwidth

digital, DPS, MX, RF)˗ Unified tools, GUIs and APIs for digital, DC,

analog, and RFAuto handling of Upload + Background˗ Auto handling of Upload + Background processing


WSMX Brief IntroductionWSMX Brief Introduction


Architecture• A Wave Scale MX card consists of 32 instruments contained in 16 HW Units

• High Speed Unit:‒ High Speed AWG‒ High Speed Digitizer

• High Resolution Unit:• High Resolution Unit:‒ High Resolution AWG‒ High Resolution Digitizer

• PMU Per Pogo

• Test Processor Controlled Synchronization

• Large Memory Pool

• Hardware Signal Processing Unit (SPU)• 32 instruments per card• 16 Units per Wave Scale MX card• All can be used in parallel,

independent, full pattern controlled• 64 bidirectional analog pogos incl. PMU

48All Rights Reserved - Advantest Corporation2017/12/15

Wave Scale MX Key Values• 4x density, 32 parallel instruments• All 32 instruments are fully independent

All functionality is sequencer controlled no trigger pins exact repeatablity• All functionality is sequencer controlled, no trigger pins, exact repeatablity• Flexibility via licensing of units• Dramatically simplified use-model (SmarTest 8)y p ( )• Overall improved performance• Larger and flexible memory

216 Msamples shared btw 4 instruments (Digitizer)– 216 Msamples shared btw. 4 instruments (Digitizer)

• All pogos can be connected to either AWG or Digitizer (bidirectional)• Flexible I/O Matrix for simplified loadboard design• PMU per pogo• No dedicated analog calibration equipment needed

‒ Except in case of tight IQ requirementsExcept in case of tight IQ requirements


Summary• Wider bandwidth on WSRF (200MHz)

• Better & more user friendly software (SmarTest 8)– Easier to burst test together (Operating Sequence)– Operating sequence debug with stop point– Multisite data handlingg

• Measurement stability – Very good SDEV across all tests– Good repeatability

• No averaging needed

• WSMX better noise floor

• Minimum effort on test time reduction (TTR)

• Outstanding COT


谢谢谢谢


common rf test on ate.ppt [兼容模式]

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