coming challenges and opportunities for mems … · 2018-06-11 · coming challenges and...
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Coming Challenges and Opportunities for MEMS Testing Supply Chain
Wendy Chen Sr. Director of KYEC RD center
“The Challenges - Past, Present and Future”
MEMS Testing - Supply Chain
Challenges from Market Demand
15.8 Billion units
~ 2.2 X 16 Billion units
2011 YOLE report 2015 YOLE report
~ 2 X 30 Billion units
2011 YOLE report
19.5 Billion
14% CAGR 14 Billion
21 Billion 8.9% CAGR
2015 YOLE report
Market Volume Forecast is on Track Market Value Forecast is Difference
Unit Price Drop Dramatically
13 Billion
18 Billion
ASP Drop Down Dramatically
Challenges - Cost Reduction
May 2016 YOLE report update
MEMS Fusion Sensor Trend
2010 2016 2020
IMU senor
Accelerometer
Gyro
Magnetic sensor
Microphone
Pressure sensor
High acceleration
Shaking
Angular rotation
Sinusoidal velocity
Sound generator
Wide range, High SPL
Magnetic field
3 axis, high precious
Air Pressure
Barometer
E-Compass
Air Pressure -Precious resolution
Angular rotation -Constant velocity
Acceleration - Gravity
Acceleration –Gravity
Magnetic field - 1 axis + Geomagnetic
In-Door Navigation
Humidity
Temperature
Environment Sensor
Humidity generator
Thermal control,
VOC gas generator
Particle generator
Gas Sensor
Particle Sensor
Ambient light sensor
FIR / Thermopiles
Micro bolometer
Optical Sensor
Microfluidics
Bio-Chip
Force Sensor
Microphone Sound generator
Wider frequency range,
High SPL, High S/N
Ultrasonic Sensor
2011 2013
500
0
1.500
1,000
2,000
2,500
The Cost Trend of Test Equipment
Pri
ce/s
et
(K U
S$)
2015 2017
Test equipment
3 DOF
6 DOF
9 DOF
10 DOF
Source from ITRS 2011 MEMS edition
Challenges - The Test Complexities Raise Up Cost of Test Equipment and Test Procedure
Fusion Sensor Increase Test Complexity
Combo Sensor increase sensor value and slow down ASP erosion
Gyro, Accelerometer combine to IMU fusion sensor.
Environment sensor continually combine more and more sensors such as Barometer, Humidify, Thermal, Gas, Particle…. microphone in the near future.
Testing Bio-MEMS device for Healthcare application increase the criteria level of Reliability and Safety concern. The consumer Healthcare Bio-MEMS sensor such as Accelerometer、Gyro、 Microphone、
Pressure and Temperature sensor also need to consider Reliability 、Lower Power Consumption (uA)、Higher S/N ratio 、 and Miniaturized size of device.
Testing Emerging implantable Bio-MEMS sensor , Reliability is more severe and Burn In Test and test environment Safety level & GMP Certification become needed.
Another Blooming Application of MEMS Sensor is Automotive. The Burn In Test is necessary test procedure for Reliability.
There are diffident Reliability quality level requirement of MEMS Sensor for Passive-Safety and NON-Safety such as Navigation assistance、Anti-theft systems、 Infotainment.
Reliability & Burn In Test is getting Important
Time
Failu
re R
ate
Infant Mortality
Useful life Low Failure Rate
End of Life Increasing Failure Rate
Early Failure Period
Wear-Out Period
Product History Reliability “ Bathtub cure “
MEMS Sensor Fail Mechanism
Mechanical Defect
Electromechanical break-down
Thermal stresses by mismatch of CTE
Excessive intrinsic stress
Packaging problem
Local stress
Surface roughness
Thermal stress
Mismatch of CTE
Delamination
of thin layers
Challenges – MEMS Sensor Burn In Test still lack of Standard
“The Opportunities “ of
MEMS Testing - Supply Chain
Share Investment Risk IDM and New Start up Design companies started to outsource to manufacture
supply chain to reduce investment risk.
Outsource to Supply Chain Trend - Fab-light or Fabless
- MEMS manufacture industry follow
Semiconductor Vertical Integration Supply Chain ( Wafer Foundry, Testing Service, Assembly & Packaging)
MEMS Sensor Vendor
IDM Design House
Design House
Design House
Design House
KYEC MEMS Sensor Test Service
• KYEC started MEMS Sensor test service from 2008.
• KYEC MEMS Sensor test services are various such as Accelerometer, Gyro, Magnetic
sensor , Microphone, Light sensor, Pressure sensor ... Continually grow.
• Over 200 million units MEMS sensor were testing in KYEC factories during 2015.
• The MEMS sensor testing capacity is continually growing in Taiwan and China factory.
KYEC Allocated Special MEMS Testing Floor
KYEC built new factory and reserved Basement floor for testing MEMS Sensor in 2014
We done a lot of efforts to prepare Test Environment for Sensor testing.
The capacity of test system is growing Rapidly.
2014_1 2014_3 2014_6 2015 2016
Window Tour
Increase test parallelism
Reduce test time
Innovative way to overcome upcoming challenges
New Innovation for Test Cost Reduction
Not Enough
MEMS sensors + ASIC + MCU
ASIC + MCU function include
Convertor : I to V or C to V
Multiplex + PGA (Programmable Gain Amplifier)
Noise Filter + A/D (analog to digital converter)
DSP ( Digital Signal Processor ) + I/O Protocol
Circuit Integration Innovative Concept
ASIC + Multi-MCU + Smart Firmware open new opportunity for BISX
12
Sensor
Sensor
sensor
Sensor
ASIC
Multi-MCU
+ DFT ( BIST + BISD+ BISC )
Process Integration Innovative Concept
MEMS SOC manufacture by CMOS process
3DS Process integration:
Multi- MEMS Sensors integrate ASIC CMOS wafer through 3DS process
I/O communication such as optical or RF integrated into MEMS sensor through 3DS process.
SOC ( System On Chip ) platform by CMOS process
MEMS devices and ASIC manufacture by CMOS process
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3DS Process Integration
Test Innovative Concept
The Innovative Circuit and Process Integration achieve MEMS sensor DFT
( Design For Test ) to Come True.
Build In Self Test Cell include physical stimulus structure and control circuit.
The imitated Physical Stimulation signal be generated from ASIC to enable BIST cell.
Not all of MEMS sensor design could apply DFT which be limited by sensor structure.
CX
CX
Self-test
Proof mass
sp
rin
g
With Built-In Actuator
Accelerometer Magnetic sensor
Built-In
Coil
MEMS sensor DFT is getting important , but still long way to go
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Enable BIST Cell
Physical Stimulation
generate electrical signal
Sensing signal
A/D
Modulation
D/A
Calibration ENG
MC
U +
Mem
ory
15
Off
Physical Stimulus
Firmware in Test Innovative Concept Develop Smart Firmware to enable BISD ( Build In Self Diagnostic ) and BISC
( Build In Self Calibration/ Compensation ) for MEMS Sensor
During testing, Smart Firmware could be implanted into BIST cell of device.
Device’s performance could be improved through self compensation.
After working on application system, device could do self diagnostic and self correlation with
compensation to increase device’s reliability.
BISD and BISC provide Effective Reliability Solution MEMS sensor
BIST
MCU Memory
BISD BISC
New Test Skill for MEMS Sensor Testing Traceability :
Record device’s ID into chip during probing SOC or 3DS wafer then trace test result of device before
and after packaging process to monitor failure mechanism for yield improvement.
Central system could Tracking Sensor Performance after working on application system through device’s ID and monitor the information from self diagnostic and self correlation.
Intelligent data mining :
Functional test is not enough. Intelligent data mining could predict and analysis process variation such as Adaptive testing concept.
Testing play an important role as a Hub of data mining and reconfigure sensor gene with smart firmware.
Burn In Test :
DFT ( Design For Test ) is Key skill to enable Cost Effective Wafer Level Burn In. Designer should design suitable self-test structure fulfill testing strategy to apply parametric test on wafer level reliability testing.
The Package level Burn In Test will depend on the strategy of quality. Some strategies apply Build In Self-Diagnostic、Calibration/ Compensation skill after work on application system to overcome
the coverage rate of Package level Burn In test by standard IC Burn In solution.
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Smart Sensing system
Change the Game Rule !!
Test budget for probing ASIC wafer is getting more then MEMS sensing structure
MEMS Sensor performance could be optimized by written parameter into ASIC during Testing
Share Test Capacity of Semiconductor Supply Chain could reduce Cost of Test
ASIC
MEMS Sensor
ASIC
MEMS Sensor
MEMS Sensor Testing Game Rule also be Changed
Tester Numbers Over 2000 Sets And
Continuously Growing
China (Suzhou) Mass Production center
Japan
R&D and Biz Center
Singapore Biz Center
USA
Biz Center
Taiwan Center of Excellence
Chu-Nan, Hsin -Chu , Tong-Lo Factory
KYEC Testing Service KYEC founded in May 1st ,1987 and IPO in May 9,2001.
KYEC test service coverage Wafer Probe、Final Test 、 Burn In Test、 Pre- Assembly、
Test Solution Development、 Global Logistics.
KYEC Group pure test service is ranking 2nd in 2015.
KYEC Testing Service KYEC Test System Capacity :
ATE auto Test Equipment over 3000 sets ↑
Prober > 2000 sets (8” : 12” ~= 50% ↓ : 50% ↑)
Handler > 1000 sets
The Image Sensor Testing Service: Clean level of Test Environment : Wafer probing class10 , Final test class 100.
Probing capacity up to 850,000 pcs wafer shipment during 2015.
Burn In Test Service: KYEC all of Burn In Overs developed by KYEC RD and also sale out to Failure analysis company.
Over 400 sets of Burn In systems operated by Networking Solution.
19
KYEC RD
Core
Technology
Test system Design
Technology
Automation Control
Technology
Strong R&D Test Team provide Flexible Test solution
20
Tool/ Modeling
Technology
Summary
Consumer MEMS Sensor drive 1st wave of Evolution
The 2nd wave of Evolution is coming ---Smart Sensing System
Cost Reduction Change Supply Chain Model.
New Innovation of Design and Process benefit Test Cost
Reduction.
DFT open new solutions for upcoming Reliability Challenges.
21
22
Changes and Challenges
give us
Opportunities.