combating reverse engineering through transience · 16/08/2016 · demo: trigger initiates rapid...
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COMBATING REVERSE ENGINEERING THROUGH TRANSIENCE
Dr. Troy Olsson, DARPA/MTO Program Manager
August 16, 2016
DISTRIBUTION A. Approved for public release: distribution unlimited.
NDIA Trusted Microelectronics Workshop
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The DARPA solution is to provide a menu of hardware security options that can be selectively applied based on need
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VAPR will help protect intellectual property in DoD microelectronics.
DISTRIBUTION A. Approved for public release: distribution unlimited.
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VAPR program objective
High Performance CMOS electronics
Sensors
Vanishing Substrate and Packaging Materials
RF Materials
Power Sources
Develop a toolkit that allows for microelectronic systems to vanish in a controlled manner on command
High performance microsystems that physically disappear resulted from the program
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VAPR vanishing requirements
Loud Noises
Smoke or Fire
Toxic Remnants
Incendiary Chemicals
white phosphorus
USFWS, Credit Catherine Hibbard
Maine Government
U.S. Forest and Wildlife Service (USFWS)
Wikipedia/Creative Commons
• Requirements were placed on the vanishing modality to ensure clandestine operations and environmental safety
• Camouflage was not considered vanishing
4DISTRIBUTION A. Approved for public release: distribution unlimited.
travel.aol.co.uk, Credit Graham McGeorge
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VAPR transient glass substrate
Prince Rupert’s drop• Formed by rapidly cooling molten
glass• Compressive stress on the surface
and tensile stress at the core• Stress gradient results in high
toughness • Surface damage results in rapid
disintegration into fine particles
PARC’s transient substrate• Stress gradient formed by ion
exchange of glass• Similar to Gorilla Glass process• Highly controlled stress profile
5DISTRIBUTION A. Approved for public release: distribution unlimited.
awesci.com
ceramics.org
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VAPR glass substrate demonstration
Extremely Reliable and Stable until Triggered to
Vanish!
Demo: Trigger initiates rapid heating and cooling above resistor to initiate
crack formation
Demo: Robustness during handling and storage
6DISTRIBUTION A. Approved for public release: distribution unlimited.
Video not included here
Video not included here
Image Courtesy: PARC
Image Courtesy: PARC
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VAPR glass substrate fragmentationTi
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(U) 0.25 mA hr, peak current of 1 A7DISTRIBUTION A. Approved for public release: distribution unlimited.
Video not included here
Image Courtesy: PARC
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VAPR functional vanishing chips
• Enhanced security through vanishing electronics
• Strain energy transferred from PARC substrate to COTs chips
• Fragmentation of ICs and substrates to particle sizes < 250 μm
• Goal to achieve no visible remnants after triggering
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Image Courtesies: PARC
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Summary
• DARPA VAPR Program has demonstrated a frangible glass substrate that can fracture into < 250 μm particle upon triggering
• Robust handling and storage of the frangible glass has been shown
• Fracture propagation through diverse set of chips has been demonstrated
• Functional devices have been produced that demonstrate use of COTS devices, these devices can monitor temperature and receive RF signals
9DISTRIBUTION A. Approved for public release: distribution unlimited.
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www.darpa.mil
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