cmc laboratories client presentation 2009
DESCRIPTION
CMC company presentation.TRANSCRIPT
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CMC Laboratories, Inc.Client Presenta4on March 2009
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Friday, September 11, 2009
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• CMC Laboratories was founded in 2003 by a group of packaging industry veterans.• Today, CMC has over 200 clients ranging from start-‐ups to Fortune 100 companies.• CMC supports clients across North America, Europe, and throughout Asia including China, Taiwan, Singapore, and Malaysia.
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CMC Laboratories provides a high level of technical service focussed on advanced materials within the electronic industry.
Innova&ve Materials Solu&ons for Electronics
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Technical Exper4se
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• Advanced electronic packaging materials
• Micro-‐structural Characteriza:on
• Failure Analysis and Destruc:ve Physical Analysis
• Electrical, Thermal and Mechanical Test and Proper:es of Packaging Materials
• Custom Reliability Tes:ng: Test Development and Implementa:on
• Thin and Thick FIlm Metalliza:on
• Electro and Electro-‐less pla:ng for electronic applica:ons
Technical Exper4se
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CMC Business Focus
•Materials Analysis
•Electrical and Thermal Tes:ng
• Technology Development and Prototype/ Low Volume Fabrica:on
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Business Sectors
CMC Client Industries
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Military and Aerospace
Medical Device
Telecommunications
Photovoltaic
Advanced Materials
Semiconductor
Business Sectors
CMC Client Industries
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Technical Support to Medical Device Manufacturers
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• Reliability evalua:on and failure mode analysis.• Device and component construc:on analysis for supplier
qualifica:on.• Microstructural analysis in support of process op:miza:on
and verifica:on.• Design, development and FA support to assist clients with
FDA submissions.
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Technical Support to Medical Device Manufacturers
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Medical Device Manufacturers: Recent Projects
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1. Electronic reliability and failure mode evalua:on of a PCB assembly used in a hand held medical device.
2. Evalua:on of Pb and Pb-‐free solder processing parameters and rework limita:ons for high reliability implantable devices.
3. Assisted in the development of an improved herme:c feed-‐thru for an implantable device.
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Medical Device Manufacturers: Recent Projects
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Experience Base in Op4cal Applica4ons for Semiconductors
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•Solar cells, high brightness LEDs, Laser Diodes•Thin film, thick film and direct bond copper metalliza:on
•Material structure, composi:on and defect characteriza:on in Opto-‐electronic assemblies
• Ceramic packages including alumina and AlN• Cu pla:ng
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Experience Base in Op4cal Applica4ons for Semiconductors
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Optoelectronics and Photovoltaics: Recent Projects
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1. Characteriza:on and op:miza:on of high thermal demand packaging for cuUng edge solar concentrator technology.
2. Thick Cu pla:ng process development for an HBLED package
3. New material selec:on and assembly process development for a high frequency MEMs op:cal transmiWer.
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Optoelectronics and Photovoltaics: Recent Projects
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Experience in RF and Microwave Device Packaging
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TELECOMUNICATIONSTELECOMUNICATIONS
• Cellular base-‐sta:on power amplifier packages including GaAs and Silicon LDMOS
• Microwave communica:on devices • Packaging materials and processing for high frequency applica:ons
• Alumina, LTCC and LCP
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Experience in RF and Microwave Device Packaging
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RF and Microwave Device Packaging: Recent Projects
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TELECOMUNICATIONSTELECOMUNICATIONS
1. Working with a leading edge advanced packaging material supplier to introduce a new genera:on of RF packages for cellular base-‐sta:on applica:ons.
2. Supported the introduc:on to market of a new high frequency passive component technology with enhanced performance from 20-‐100 GHz.
3. Assisted in the development of a novel, low stress die aWach technology for RF devices which enhances thermal managment. Supported client patent submissions.
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RF and Microwave Device Packaging: Recent Projects
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CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide
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• CMC provides clients cri4cal exper4se for advanced materials development
• CMC assists in market introduc4on for advanced materials in electronic applica4ons
• High thermal performance materials
• Expansion matched systems
• Advanced solder systems
• Specialized thick film and thin film metalliza4on
• Polymer composites
• High frequency materials
• LTCC, HTCC, and AlN
• Pla4ng layers
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CMC Supports The Worlds Most Innova4ve Advanced Materials Suppliers Worldwide
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Advanced Materials: Recent Projects
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1. Process development to reclaim/rework high-‐end specialty components preven:ng mul:-‐million dollar yield loss.
2.Valida:on of material proper:es and market opportuni:es for advanced polymer composites used in high thermal demand packaging applica:ons.
3.Licensing of CMC developed AlN mul:layer ceramic technology for military, space, medical, wafer tes:ng, and telecommunica:ons.
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Advanced Materials: Recent Projects
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Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons
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• Ceramic packaging technologies including LTCC, AlN and HTCC
• Thin film metalliza4on
• High performance organic packaging solu4ons
• High thermal demand packaging materials including AlSiC and other composite metal solu4ons
• Herme4c package sealing technologies
• Custom, aerospace focussed reliability test development
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Core Exper4se in Specialized Technology for Military and Aerospace Applica4ons
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Military and Aerospace Applica4ons: Recent Projects
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1. Developed and implemented custom electrical test program for power components for space under environmental stress condi:ons.
2. LTCC component op:miza:on and failure analysis for next genera:on short wave military communica:ons.
3. Root cause analysis of wirebond failures in guidance system control module.
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Military and Aerospace Applica4ons: Recent Projects
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Technology Services
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Failure Analysis Reliability and Test
Materials Characterization Process Development
AlN Licensing Market Analysis
Technology Services
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Failure Analysis and Material Characteriza4on Capabili4es
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• Package deconstruc4on• Interfacial structure• Elemental analysis and
mapping• Microstructure and phase
analysis• Grain structure and size
distribu4on• Failure interface
iden4fica4on
• Electrical resis4vity• Dielectric constant and loss• Surface roughness• Adhesion Tes4ng• Mechanical Tes4ng• Thermal conduc4vity• Interfacial thermal
resistance• Micro-‐hardness
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Failure Analysis and Material Characteriza4on Capabili4es
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Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued
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• IC Level Analysis• Metal Fractography
• Acous4c Microscopy (CSAM)
• Secondary Ion Mass Spectroscopy (SIMS)
• SEM with SE and BSE imaging
• Energy Dispersive Spectrometry
• Metallographic Evalua4on
• X-‐Ray Radiography• XRF Thickness Measurement
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Failure Analysis and Material Characteriza4on Capabili4es-‐ Con4nued
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Failure Analysis and Material Characteriza4on: Recent Projects
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1. Failure determina:on of a herme:c feed-‐thru in an implantable medical device.
2. Construc:on evalua:on of a discrete device for patent infringement li:ga:on.
3. Compe::ve analysis of advanced graphics processor including the device, package/substrate and graphics board.
4. Advanced solder process evalua:on and op:miza:on for major medical device manufacturer.
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Failure Analysis and Material Characteriza4on: Recent Projects
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Metal Fractography
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IC Level Cross Sec4on Analysis
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X-‐ray Radiography and Acous4c Microscopy
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Custom Design for Specialized Tes4ng Requirements
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• Micro-‐Controllers
• High-‐Speed Data Acquisi:on
• Lab View Programming
• Environmental Test Chambers
• Mechanical Tes:ng
• Air to air thermal stress
• HAST Chamber
• Wide range of electrical test equipment from DC to GHz
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Custom Design for Specialized Tes4ng Requirements
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Custom Design for Specialized Tes4ng Requirements: Recent Projects
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1. System design and development to test and capture extremely short :me scale events in an advanced satellite component while undergoing environmental stress.
2.Burn-‐in and precision electrical monitoring of military components under rigid temperature condi:ons.
3.Design and development of a custom op:cal reflectometer to set laser weld condi:ons for high reliability.
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Custom Design for Specialized Tes4ng Requirements: Recent Projects
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Technology Development and Fabrica4on
• Pla:ng metalliza:on development
• Low volume electro-‐pla:ng, electro-‐less pla:ng and barrel pla:ng
• Fabrica:on and assembly process development– Solder profiles
– Braze profiles
– Die aWach processes
• Low volume fabrica:on and assembly capability
• Thick film metalliza:on produc:on facility
• Module re-‐work for military and medical applica:ons
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Pla4ng Process Development
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• Development of custom pla4ng processes– Evaluate pla4ng chemistry op4ons– Create prototypes for func4onal and reliability tes4ng
– Detailed documenta4on of pla4ng procedures– Transfer to high volume processors
• Small volume, fully func4onal pla4ng facility– Rack and barrel pla4ng– DC and pulsed rec4fica4on
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Pla4ng Process Development
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Pla4ng Process Development
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• CMC’s Pla4ng Development Customers:– Semiconductor manufacturers– Electronic Package fabricators– Specialty materials manufacturers
• Cu, Ni, Au, Sn and co-‐deposited alloys• Cleaning and etching chemistry
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Pla4ng Process Development
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Technology Development and Fabrica4on-‐ Recent Projects
• Fabricate specialized direct bond copper substrates
• Plate Al-‐SiC flanges over wide composi:on range
• Re-‐work and re-‐assemble module used for medical imaging
• Produce range of high temperature thick film metalliza:on pastes for AlN ceramics
• Assemble MEMs diode laser switching module for telecommunica:ons applica:ons
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CMC Wireless Packaging Experience
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Mul4layer, Co-‐Fire AlN Technology Licenses
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ALUMINUM NITRIDE TECHNOLOGY LICENSINGALUMINUM NITRIDE TECHNOLOGY LICENSING
• Non-‐exclusive Licensing of CMC’s proprietary co-‐fired, mul4layer AlN process– Thermal conduc:vity as high as 190 W/m-‐K– Up to 20 metalliza:on layers – Required materials, processes and equipment details transferred to licensees
• Process has been u4lized for high volume produc4on• Applica4ons in telecommunica4ons infrastructure, power electronics, op4cal communica4ons, HBLED and industrial equipment.
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Mul4layer, Co-‐Fire AlN Technology Licenses
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Technology Market Analysis
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Technology Market Analysis• Technical Market Studies focused on Electronic
Interconnect, Packaging, New Materials, Assembly Technology, or Passive Components
• Compe44ve Analysis including Compe4tor’s Technical Performance, Target Markets, Key Strengths/Weaknesses and Product Roadmaps
• Iden4fica4on of Acquisi4on Candidates to fit Client’s Growth Objec4ves.
• Industry Wide Surveys and Survey Data Analysis
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Technology Market Analysis-‐ Recent Projects
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1. Developed a customized market analysis for a large advanced materials company, evalua:ng the market poten:al of a new polymer-‐based product line used in high thermal demand electronic applica:ons. Developed a market strategy and iden:fied poten:al customers throughout the US and Asia (2008).
2. Introduced a small advanced materials company specializing in new polymer formula:ons for packaging applica:ons to poten:al strategic partners to assist in scale-‐up and marke:ng of this technology (2008).
3. Performed a detailed market analysis for an advanced electronic materials company in China, delinea:ng commercial market opportuni:es for ceramic products. Created a technology roadmap for this client based on the study. Provided technical support to implement the roadmap (2007, 2008).
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Technology Market Analysis-‐ Recent Projects
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CMC Laboratories, Inc.7755 South Research Drive
Tempe, AZ 85284(480) 496-‐5000
Contact Us:
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