cld-ap25 rev 21b cree xlamp xp family leds 2008-2018 cree, inc. all rights reserved. the information...

Soldering & handling

Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com.

Cree, Inc.4600 Silicon Drive

Durham, NC 27703USA Tel: +1.919.313.5300

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Cree® XLamp® XP Family LEDs

IntroDuCtIon

This application note applies to XLamp® XP Family LeDs,

which have order codes in the following formats.

XPCxxx-xx-xxxx-xxxxxx

XPexxx-xx-xxxx-xxxxxx

XPGxxx-xx-xxxx-xxxxxx

XPLxxx-xx-xxxx-xxxxxxxxx

This application note explains how XLamp XP Family LeDs

and assemblies containing these LeDs should be handled

during manufacturing. Please read the entire document to

understand how to properly handle XLamp XP Family LeDs.

tabLE oF ContEnts

Handling XLamp® XP Family LeDs ..........................................2

Circuit Board Preparation & Layouts ........................................5

Case Temperature (Ts) Measurement Point ............................6

Notes on Soldering XLamp® XP Family LeDs .........................6

Moisture Sensitivity ..................................................................8

Low Temperature Operation .....................................................8

XLamp® XP Family LED Reflow Soldering Characteristics .....9

Chemicals & Conformal Coatings ......................................... 10

Assembly Storage & Handling ............................................... 11

Tape and Reel ......................................................................... 12

Packaging & Labels ............................................................... 15

http://www.cree.com/Xlamp


2

XLamP® XP FamILy LED soLDErIng & HanDLIng

HanDLIng XLamP® XP FamILy LEDs

manual HandlingUse tweezers to grab XLamp XP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do

not push on the lens.

Do not apply more than 500 g of shear force directly onto the lens. Excessive force on the lens could damage the LED.

Cree recommends the following at all times when handling XLamp XP Family LeDs or assemblies containing these LeDs:

• Avoid putting mechanical stress on the LeD lens.

• Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect

the optical performance of the LeD.

• Cree recommends always handling XP Family LeDs with appropriate eSD grounding.

• Cree recommends handling XP Family LeDs wearing clean, lint-free gloves.

Use tweezers with wide, not pointed, tips to grab XLamp XP-L High Intensity LeDs at the base.

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X Wrong


3


Pick & Place nozzleThe following diagram shows an example of a pick & place tool to remove XLamp XP-C, XP-e and XP-G LeDs from the factory tape & reel

packaging.

All dimensions in mm

Tolerance: ±0.01

The following diagram shows an example of a pick & place tool to remove XLamp XP-e2, XP-G2 and XP-G3 LeDs from the factory tape &

reel packaging. The nozzle is implemented in urethane.


Tolerance: ±0.01

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATEDATEDATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558

4600 Silicon DriveDurham, N.C 27703

UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY ANDCREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5°.XXX ± .010.XX ± .03.X ± .06FOR SHEET METAL PARTS ONLY

.XX ± .01.XXX ± .005X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESAND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 63

Ø 0.5

Ø 4

Ø 3.06

0.439

Conical120°

1/110.000--12001405

Pickup Tool #1

PEEK

10/15/09D. Seibel

REVISONSREV DESCRIPTION BY DATEAPP'D

SECTION A-A

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATEDATEDATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5°.XXX ± .010.XX ± .03.X ± .06FOR SHEET METAL PARTS ONLY

.XX ± .01.XXX ± .005X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESAND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 63

Ø 0.5

Ø 4

Ø 3.06

0.439

Conical120°

1/110.000--12001405

Pickup Tool #1

PEEK

10/15/09D. Seibel

REVISONSREV DESCRIPTION BY DATEAPP'D

SECTION A-A

top View

side View

top View

A A

3.3020.130

1.0160.040

3.7340.147

SECTION A-A

A

B

C

D

CAD GENERATED DRAWING,DO NOT MANUALLY UPDATE

SCALE

SIZE

CAD FILE:

DWG. NO.A

SHEET OF

REV.

DATEAPPROVALS

DRAWN

CHECKED

RESP ENG

MFG ENG

QUAL ENG

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:DECIMALS ANGLES

XX = <MOD-PM>.002XXX = <MOD-PM>.001

MATERIAL

FINISH

32DO NOT SCALE DRAWING

ITEMNO.

PART ORIDENTIFYING NO.

NOMENCLATUREOR DESCRIPTION

MATERIAL SPECIFICATION

QTYREQD

PARTS LIST

12345678

THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OFCOUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTTHE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED.

A

B

C

D

12345678

XXXX = <MOD-PM>.0002

<MOD-PM> 1/2<MOD-DEG>

REVISIONSRev. DESCRIPTION DATE APPROVED

A PRINT RELEASE JDL

10/11/2011

HEW Led and Tip

10/11/2011

Tuesday, October 11, 2011 1:16:44 PM

.9573.734

3.734

3.734

.957O

3.230O

R1.8673.734

3.734

4.734

1.016

3.230

30.00�

3.062

.9573.734

3.734

3.734

.957O

3.230O

R1.8673.734

3.734

4.734

1.016

3.230

30.00�

3.062

side View

HanDLIng XLamP® XP FamILy LEDs - ContInuED


4


The following diagram shows an example of a pick & place tool to remove XLamp XP-L High Density and XP-L2 LeDs from the factory tape

& reel packaging. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane. The following

pick & place tool, designed in conjunction with Count On Tools, is specific to the XP-L High Density and XP-L2 LEDs.

All dimensions in mm [in]

Tolerance: ±0.025 [0.001]

The following diagram shows an example of a pick & place tool to remove XLamp XP-L High Intensity LeDs from the factory tape & reel

packaging. Cree recommends using a spring-relieved pick and place nozzle with a spring constant of 0.05 lb-ft (0.07 N-m). Cree has had

good success using nozzles fabricated from 95a urethane. The following pick & place tool is specific to the XP-L High Intensity LED.


Tolerance: ±0.001

3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

top View side View

side View

3.175[ø0.125]

3.683[ø0.145]

1.016[ø0.040]

A

A

5

[0.197]

118°

0.188[0.007]

SECTION A-A

.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400

.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400

top View side View

.500 3.400

3.400

.500

Ø 1.000

3.300

.300

2.400

HanDLIng XLamP® XP FamILy LEDs - ContInuED

http://www.cree.com/LED-Components-and-Modules/Tools-and-Support/Solution-Providers/Pick-Place


5


CIrCuIt boarD PrEParatIon & Layouts

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or

soldering XLamp XP Family LeDs onto the PCB.

The diagrams below shows the recommended PCB solder pad layout for XLamp XP-G2, XP-G3, XP-L and XP-L2 LeDs.


Notes:• Cree recommends using thermal pad kickouts to maximize component thermal performance.• Cree recommends using white solder mask material to minimize system optical loss.* This stencil has been tested and optimized for the avoidance of voiding when using ALPHA® LUMeT® P30 Maxrel solder paste. For

other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local Cree Field Applications Engineer for consultation regarding your specific application.

The diagrams below show the recommended PCB solder pad layout for XLamp XP Family LeDs, except for XP-G2, XP-G3, XP-L and XP-L2

LeDs.

recommended stencil openings*recommended solder Pad (solder mask Pattern)

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5°.XXX ± .25.XX ± .75.X ± 1.5FOR SHEET METAL PARTS ONLY

.XX ± .25.XXX ± .125X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6

3.30

3.30

.73

2.26

R 1.531.30

.50

2.30.50

3.45

3.45

.58

3.30 REF.

3.30 REF.

3.50

.70

.30

1.50

.30

3.50

3.30

.50

.50

1.30

.503.30

.43.29.83

.18 .56

.18

.50

.50

.56.56

.19

3.30

3.30

.09

.18

1/122.000E2610-00066

OUTLINE DRAWING XPG G3

10/6/15D. CRONIN

REVISONSREV DESCRIPTION BY DATE APP'D

RECOMMENDED SOLDER PAD (SOLDER RESIST PATTERN)

ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED

PRIMARY ALTERNATIVE

OPTICAL REFERENCE

RECOMMENDED COPPER LAYOUTRECOMMENDED STENCIL OPENINGS

OPTICALREFERENCE

recommended Copper Layout

SIZE

TITLE

OF

REV.

SHEETC

DRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5°.XXX ± .25.XX ± .75.X ± 1.5FOR SHEET METAL PARTS ONLY

.XX ± .25.XXX ± .125X° ± .5°

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6

3.30

3.30

.73

2.26

R 1.531.30

.50

2.30.50

3.45

3.45

.58

3.30 REF.

3.30 REF.

3.50

.70

.30

1.50

.30

3.50

3.30

.50

.50

1.30

.503.30

.43.29.83

.18 .56

.18

.50

.50

.56.56

.19

3.30

3.30

.09

.18

1/122.000E2610-00066

OUTLINE DRAWING XPG G3

10/6/15D. CRONIN

REVISONSREV DESCRIPTION BY DATE APP'D

RECOMMENDED SOLDER PAD (SOLDER RESIST PATTERN)


PRIMARY ALTERNATIVE

OPTICAL REFERENCE

RECOMMENDED COPPER LAYOUTRECOMMENDED STENCIL OPENINGS

OPTICALREFERENCE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX ± .125X° ± .5 °

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH: 1.6

3.45

3.45

2.60

2.00

.73

2.30

.50

3.30

1.30

3.30

.50

3.30

2.30

.50.64

1.01

3.30

.75

.25

3.30

3.30

.50

1.30

.50

3.30

3.30

1/124.000

B2610-00008

OUTLINE DRAWING XPG

--

--

----

----

6/17/15D. CRONIN

REVISONS

REV DESCRIPTION BY DATE APP'D

RECOMMENDED PCB SOLDER PAD

RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)


PRIMARY ALTERNATIVE

recommended PCb solder Pad

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6

3.45

3.45

2.60

2.00

.73

2.30

.50

3.30

1.30

3.30

.50

3.30

2.30

.50.64

1.01

3.30

.75

.25

3.30

3.30

.50

1.30

.50

3.30

3.30

1/124.000

B2610-00008

OUTLINE DRAWING XPG

--

--

----

----

6/17/15D. CRONIN

REVISONS


RECOMMENDED PCB SOLDER PAD

RECOMMENDED STENCIL PATTERN(HATCHED AREA IS OPENING)


PRIMARY ALTERNATIVE

recommended stencil Pattern(Hatched area is open)


6


CasE tEmPEraturE (ts) mEasurEmEnt PoInt

XLamp XP Family LeD case temperature (Ts) should be measured on the PCB surface, as close to the LeD’s thermal pad as possible. This

measurement point is shown in the picture below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XP Family LeD itself. In testing, Cree has found

such a solder pad to have insignificant impact on the resulting Ts measurement.

notEs on soLDErIng XLamP® XP FamILy LEDs

XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB

on a hotplate and following the reflow soldering profile listed on page 9.

Do not wave solder XLamp XP Family LeDs. Do not hand solder XLamp XP Family LeDs.

X Wrong

PCorrECt

PCorrECt


7


solder Paste typeCree strongly recommends using “no clean” solder paste with XLamp XP Family LeDs so that cleaning the PCB after soldering is not

required. Cree uses Kester® R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

solder Paste thicknessThe choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated

dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil

(102-μm) bond line, i.e., the solder joint thickness after reflow soldering.

notEs on soLDErIng XLamP® XP FamILy LEDs - ContInuED

after solderingAfter soldering, allow XLamp XP Family LeDs to return to room temperature before subsequent handling. Premature handling of the

device, especially around the lens, could result in damage to the LeD.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After

shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder

areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCbs after solderingCree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary,

Cree recommends the use of isopropyl alcohol (IPA).

Do not use ultrasonic cleaning.

PCorrECt

X Wrong

http://www.kester.com/products/product/R276-Solder-Paste/


8


moIsturE sEnsItIVIty

Cree recommends keeping XLamp LeDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.

Unopened MBPs that contain XLamp LeDs do not need special storage for moisture sensitivity. Bare XLamp LeDs have a storage

temperature range of -40 °C to 100 °C. However, the MBP, reel, tape and box have a more limited storage temperature range.

Once the MBP is opened, XLamp XP Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life

in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs

in the original MBP.

LoW tEmPEraturE oPEratIon

The minimum operating temperature of these XLamp components is -40 °C. To maximize lifetime, Cree recommends avoiding applications

where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.


9


XLamP® XP FamILy LED rEFLoW soLDErIng CHaraCtErIstICs

In testing, Cree has found XLamp XP Family LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed below. As a

general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder

paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature Lead-Free solder

Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second

Preheat: Temperature Min (Tsmin) 120 °C

Preheat: Temperature Max (Tsmax) 170 °C

Preheat: Time (tsmin to tsmax) 65-150 seconds

Time Maintained Above: Temperature (TL) 217 °C

Time Maintained Above: Time (tL) 45-90 seconds

Peak/Classification Temperature (Tp) 235 - 245 °C

Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds

Ramp-Down Rate 1 - 6 °C/second

Time 25 °C to Peak Temperature 4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JeDeC J-STD-020C

TP

TL

Tem

pera

ture

Timet 25˚C to Peak

Preheatts

tS

tP

25

Ramp-down

Ramp-up

Critical ZoneTL to TP

Tsmax

Tsmin


10


CHEmICaLs & ConFormaL CoatIngs

Below are representative lists of chemicals and materials to be used or avoided in LeD manufacturing activities. For a complete and

current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application

Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of

chemicals and materials with LeDs. You should also consult your regional Cree Field Applications engineer.

recommended ChemicalsIn testing, Cree has found the following chemicals to be safe to use with XLamp XP Family LeDs.

• Water

• Isopropyl alcohol (IPA)

Chemicals tested as HarmfulIn general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to

XLamp XP Family LeDs. Cree recommends not using these chemicals anywhere in an LeD system containing XLamp XP Family LeDs.

The fumes from even small amounts of the chemicals may damage the LeDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack® Precision electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive)

Hermetically sealing LuminairesFor proper LeD operation and to avoid potential lumen depreciation and/or color shift, LeDs of all types must operate in an environment

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically

sealing LeDs in an enclosed space is not recommended.

http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/XLamp%20Application%20Notes/XLamp_Chemical_Comp.pdf


http://www.youtube.com/watch?v=t24bf9D_1SA



11


assEmbLy storagE & HanDLIng

Do not stack PCBs or assemblies containing XLamp XP Family LeDs so that anything rests on the LeD lens. Force applied to the LeD lens

may result in the lens being knocked off. PCBs or assemblies containing XLamp XP Family LeDs should be stacked in a way to allow at

least 1-cm clearance above the LeD lens.

Do not use bubble wrap directly on top of XLamp XP Family LeDs. Force from the bubble wrap can potentially damage the LeD.

PCorrECt

X Wrong

PCorrECt


12


taPE anD rEEL

All Cree carrier tapes conform to eIA-481D, Automated Component Handling Systems Standard.

except as noted, all dimensions in mm.

XP-C, XP-E, XP-E High Efficiency White, XP-G, XP-L High Density, XP-L High Intensity, XP-L2

XP-E2, XP-E2 Torch, XP-G2, XP-G3

Loaded Pockets(1,000 Lamps) Leader

400mm (min) ofempty pockets with

at least 100mmsealed by tape

(50 empty pockets min.)

Trailer160mm (min) ofempty pockets

sealed with tape(20 pockets min.)

STARTEND

Cathode Side

Anode Side(denoted by + and circle)

160.0

A

A

B

2.5±.1

SECTION A-A SCALE 2 : 1

1.5±.1

8.0±.1

4.0±.1

1.75±.10

12.0 .0+.3

DETAIL B SCALE 2 : 1

13mm7"

Cover Tape

Pocket Tape

User Feed Direction

User Feed Direction

Ø13

Ø61 ± 0.5

12.40 0+2.00

MEASURED AT HUB

12.40MEASURED AT INSIDE EDGE

16.40

SHEET 1 OF 11:2

2400-00005SIZE

TITLE

REV.

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


.X ± 0.3

X° ± 2°

.XX ± .10

.X ± .25FOR SHEET METAL PARTS ONLY

.XX ± .13

X° ± 1°


MILLIMETERS & BEFORE FINISH.TOLERANCE UNLESS SPECIFIED:

SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 361-4770


NOTICECREE CONFIDENTIAL. THIS PLOT AND THE INFORMATIONCONTAINED WITHIN ARE THE PROPRIETARY ANDCONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOTMAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANYUNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENTOF CREE, INC.

Reel, 7" x 12mm Wide

B

LIUDEZHI 2012/5/25

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Ø190

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13


taPE anD rEEL - ContInuED

XP-C, XP-E, XP-g

XP-E High Efficiency White, XP-E2, XP-E2 Torch, XP-G2, XP-G3 SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

123456

6 5 4 3 2 1

A

B

C

D

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6

BB

+.10/-001.50

2.10 +.10/-.00

3.75 +.10/-.004.39 +.10/-.00

8.7°

8.00 ±.10

4.00 ±.10

2.00 ±.10

+.10/-.001.50

+.10/-.001.50

.30 ± .10

3.75 +.10/-.00

4.39 +.10/.00

12.00 Nominal12.30 Max

5.50 ±.10

1.75 ±.10

10.25 ±.10

REVISONS


A Released J.L. 6/30/09

C Match supplier drawing DDS 10/21/10 Y.Gan

D Zone A6, 2.15 was 2.1, tolerance was ± .10 .Zone C2, Added pocket dimensions. DDS 12/2/10 Y.Gan

E Zone A6, 2.10 was 2.15 DDS 1/3/11 J.M.

F Zone B5, Added tolerance to 4.39 and 3.75.

DDS 8/26/11 J.M.

G ADDED CATHODE AND ANODE NOTE DC 2/27/12

1/14.000

G2402-00003

Carrier Tape, XPE

6/30/09 D. Seibel

Notes:1. 10 sprocket hole pitch cumulative tolerance ± 0.2mm

CATHODE SIDE

ANODE SIDE

B-BSECTION

Note:1. 10 sprocket hole pitch cumulative tolerance ±0.2 mm

Y

Y

X X

REF 0.59

W

F(III)

P1D11.5 MIN.

Bo

Ao

R0.2TYPICAL

REF 4.375

Ko

Other material available.(IV)

(III)

(II)

(I)

hole to centerline of pocket.Measured from centerline of sprocketholes is ± 0.20.Cumulative tolerance of 10 sprocketto centerline of pocket.Measured from centerline of sprocket hole

SECTION Y-Y

SECTION X-X

2.0 ±0.05 (I)P2

1.55 ±0.05Do

4.0 ±0.1 (II)Po

1.75

±0.1

E1

0.30 ±0.05T

REF R2.24

2.40Ko +0.0/-0.13.70

1W

F

P

+/- 0.05

+/- 0.1+0.3/-0.1

5.508.00

12.00

Ao 3.70 +/- 0.1

Bo +/- 0.1

Y

Y

X X

REF 0.59

W

F(III)

P1D11.5 MIN.

Bo

Ao

R0.2TYPICAL

REF 4.375

Ko


(III)

(II)

(I)


SECTION Y-Y

SECTION X-X

2.0 ±0.05 (I)P2

1.55 ±0.05Do

4.0 ±0.1 (II)Po

1.75

±0.1

E1

0.30 ±0.05T

REF R2.24

2.40Ko +0.0/-0.13.70

1W

F

P

+/- 0.05

+/- 0.1+0.3/-0.1

5.508.00

12.00

Ao 3.70 +/- 0.1

Bo +/- 0.1

Y

Y

X X

REF 0.59

W

F(III)

P1D11.5 MIN.

Bo

Ao

R0.2TYPICAL

REF 4.375

Ko


(III)

(II)

(I)


SECTION Y-Y

SECTION X-X

2.0 ±0.05 (I)P2

1.55 ±0.05Do

4.0 ±0.1 (II)Po

1.75

±0.1

E1

0.30 ±0.05T

REF R2.24

2.40Ko +0.0/-0.13.70

1W

F

P

+/- 0.05

+/- 0.1+0.3/-0.1

5.508.00

12.00

Ao 3.70 +/- 0.1

Bo +/- 0.1

CATHODe SIDe

ANODe SIDe


14


taPE anD rEEL - ContInuED

All dimensions in mm [in]

XP-L High Density, XP-L2

XP-L High Intensity

Anode Side

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °



SURFACE FINISH: 1.6 1/11.000

A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]

Ko - 3.00 mm [.118"]CATHODE SIDE

ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE

SIZE

TITLE

OF

REV.

SHEET

CDRAWING NO.

DATE

DATE

DATE

CHECK


MATERIAL

APPROVED

DRAWN BY


SCALE

A

B

C

D

3456

6 5 4 3 2 1

A

B

C

Phone (919) 313-5300Fax (919) 313-5558



OF CREE INC.

NOTICE

X° ± .5 °.XXX ± .25.XX ± .75.X ± 1.5


.XX ± .25

.XXX ± .125X° ± .5 °




A2402-00040

Carrier Tape, XPL

5/16/14 D. CRONIN

.30 [.012]T

Ao3.60 [.142]

3.00 [.118]Ko

3.0 °

3.0 °

3.60 [.142]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø1.50+.10-.00

Ø1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZE

Ao - 3.60 mm [.142"]

Bo - 3.60 mm [.142"]


ANODE SIDE

XP-L High Density,

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P

POCKET SIZEAo - 3.70 mm [.146"]Bo - 3.70 mm [.146"]Ko - 1.20 mm [.047"]

ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

.30 [.012]T

Ao3.70 [.146]

1.20 [.047]Ko

3.0°

3.0°

3.70 [.146]Bo

10.25[.404]

E2

P22.00 [.079]

Po4.00 [.157]

Ø 1.50 +.10 +.0039 -.00[.0591-.0000]Do

Ø 1.50[.059]D1MIN

12.00 [.472]NOMINAL

12.30 [.484]

MAXW

1.75 [.069]E1

5.50 [.217]F

8.00 [.315]P


ANODE SIDE

CATHODE SIDE

Anode Side


15


PaCkagIng & LabELs

The diagrams below show the packaging and labels Cree uses to ship XLamp XP Family LeDs. XLamp XP Family LeDs are shipped in tape

loaded on a reel. each box contains only one reel in a moisture barrier bag.

Patent Label(on bottom of box)

Label with Cree Bin Code, Quantity, Reel ID


Label with Cree Order Code, Quantity, Reel ID, PO #

Label with Cree Order Code, Quantity, Reel ID, PO #


Unpackaged Reel

Packaged Reel

Boxed Reel

CREE Bin Code& Barcode Label

Vacuum-SealedMoisture Barrier Bag

Label with CustomerP/N, Qty, Lot #, PO #

Label with Cree Bin Code, Qty, Lot #

Label with Cree Bin Code, Qty, Lot #

Vacuum-Sealed Moisture Barrier Bag

Patent Label

Label with Customer Order Code, Qty, Reel ID, PO #

cld-ap25 rev 21b cree xlamp xp family leds 2008-2018 cree, inc. all rights reserved. the information...

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