Cemal Basaran

Department of Civil, Structural

and Environmental Engineering

243 Ketter Hall

University at Buffalo, SUNY

Buffalo, NY 14260

Tel: (716) 645-4375

E-mail: cjb@buffalo.edu

Web page: www.packaging.buffalo.edu

Citizenship

United States of America.

Education

Ph.D. Dept. of Civil Engineering and Engineering Mechanics, University of Arizona,

Tucson, AZ, December 22, 1994. Cum. G.P.A. 4.00/4.00

M.S. Dept. of Civil Engineering, M.I.T., Cambridge, MA, May 27, 1988. Cum. G.P.A.

4.80/5.00

Honors and Awards

Young Investigator Award, Department of Defense ONR, 1997, ($500,000.0). In 1997 one of

the 29 junior faculty members and the only Civil Engineering faculty in the U.S. to receive the

award.)

Riefler Award, State University of New York at Buffalo, 1997.

Associate Editor of the Year Award, ASME Journal of Electronic Packaging, , 2005.

Fellow of ASME, May 1, 2008

Excellence in Mechanics Award, ASME, Electronic & Photonic Packaging Division, 2011.

Outstanding Paper Award, Itherm 2012 Mechanics Track, 13th Intersociety Conference on

Thermal and Thermomechanical Phenomenon in Electronic Systems, San Diego, CA May30-

June 1, 2012

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National and International Press Coverage of Research Contributions

http://www.packaging.buffalo.edu/news.html

Journal Editorships

Associate Editor, IEEE Components, Packaging and Manufacturing Tech., January 2011-

present

Associate Editor, ASCE Journal of Nanomechanics and Micromechanics, March 2011 - present

Associate Editor, ASME Journal of Electronic Packaging, October 2003- June 2012.

Associate Editor, IEEE Trans. On Advanced Packaging, July 2003 –December 2010

Editorial Board, International Journal of Technology and Management, March 2012- March

2013

Regional Editor for Americas, Int. Journal of Materials and Structural Integrity, 2006-present

Editorial Advisory Board, The Open Civil Engineering Journal, 2007 – 2015.

Editorial Board, J. of Recent Patents On Electrical Engineering, January 2008 – March

2012

Editorial Advisory Board, The Open Numerical Methods Journal, September 2, 2008 –July

2014.

Editorial Board, ISRN Mechanical Engineering, October 2010 – 2014

Editorial Board, International Scholarly Research Notices, Mechanical Engineering October

2014 – present.

Editorial Board, ISRN Electronics, November 2011- June 2014.

Guest Editor, International Journal of Damage Mechanics. (Special issues on Electronic

Packaging April 2001, July 2001

Guest Co-Editor, International Journal of Materials and Production Technology, special issue

on Micro/Nano Electronics, NEMS and MEMS Packaging, vol. 34 No1/2, 2009

Guest-Editor, ASME Journal of Electronic Packaging, Special Issue on Carbon Nano Tube and

Graphene in Electronics, and NEMS, June 2011

Guest Editor, ASCE Journal of Nanomechanics and Micromechanics Inaugural issue on recent

Advances in Nanomechanics and Micromechanics, March 2011

Professional Experience (academia)

University at Buffalo, SUNY

Professor and Director 8/2005 – present

Electronic Packaging Lab

Assoc. Professor and Director 1/1999 – 7/2005

Electronic Packaging Lab

Assistant Professor 9/1995 - 12/1998

Visiting Assistant Professor 10/1994 - 9/1995.

University of Arizona

Research Assistant 1/1992 - 8/1994.

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M.I.T.

Teaching Assistant 8/1986 - 6/1988

Consulting (academia)

Senior Adviser (=Provost) to the Founding Chancellor of October 2008- June 2015

University of Tabuk System, Saudi Arabia

I was responsible for establishing the six campus comprehensive university system in Tabuk

region of Saudi Arabia. Comparable job title in the US is Founding-Provost.

Ph.D. Dissertations Supervised as the Primary Advisor

1- Cheng-yong Yan, "A Damage Mechanics Based General Purpose Interface/Contact

Element," February, 1998, Senior Engineer, PICO Design Corp., Detroit, MI.

2- Rumpa Chandaroy, "Damage Mechanics of Microelectronics Packaging Under

Combined Dynamic & Thermal Loading" August 1998, Project Engineer, Altair

Engineering, Detroit, MI.

3- Ying Zhao," Mechanics of Ball Grid Array Packages: Testing and Modeling,” December

2000. Senior reliability Engineer, Analog Devices Inc., Norwood, MA.

4- Hong Tang, “A Thermodynamic Damage Mechanics Theory and Experimental

Verification: For Thermomechanical Fatigue Life Prediction of Microelectronics”

November 2002, Senior Mechanical Engineer, Honda Electronics, Detroit MI.

5- Heng Liu,”Phase Reconstruction of Phase Shifted Moire Interferograms Using

Continuous Wavelet Transforms,” July 2003, Senior Engineer, KLA-Tencor, San Jose,

CA.

6- Yujun Wen, “Thermomechanical Analysis of Multilayered Microelectronic Packaging:

Modeling and testing” December 2003, Vice-Chief Engineer, Shanghai Shentong

Holdings Co., Ltd.

7- Hua Ye ”Mechanical Behavior of Microelectronics and Power Electronics Solder Joints

Under High Current Density: Analytical Modeling and Experimental Investigation”,

March 2004. Received International Microelectronics and Packaging Society (IMAPS)

2002 Award, $15,000, for his PhD work. One of four chosen internationally. Reliability

and Component Engineer, Microsoft, Redmond, WA.

8- Shihua Nie,” A Micromechanical Study on Damage Mechanics of Acrylic Particulate

Composites Under Thermomechanical Loadings” May 2005, Structural Engineer,

CalTrans, San Francisco, CA

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9- Juan Gomez “A Thermodynamic Framework for Damage Mechanics of Electronic

Packaging Solder Joints Including Size Effects”, February, 2006. Professor, Escuela De

Ingenieria, University of EAFIT, Medellin, Colombia.

10- Minghui Lin,” A Thermodynamic Framework for Damage Mechanics of

Electromigration and Thermomigration”, September, 2006, Structural Engineer, L&W

Engineering Group, Linden, NJ.

11- Mohammed Abdulhamid, “Thermomigration; An Experimental Damage Mechanics

Study on Nanoelectronics Lead-free Solder Alloys ”, May 2008. Lecturer, Faculty of

Mechanical Engineering, Universiti Teknologi, Johor, Malaysia

12- Shidong Li, ” A Multi-Scale Damage Mechanics Framework for Nanoelectronics

Interconnects and Solder Joints”, May 2009, Staff Engineer/Scientist, IBM Fishkill, NY.

13- Tarek Ragab, “A Multi-Scale Electro-Thermo-Mechanical Analysis of Single Walled

Carbon Nanotubes, May 2010, Assistant Professor, Dept. of Civil Engineering, Arkansas

State University.

14- Michael Sellers, “Atomistic Modeling Of The Microstructure And Transport Properties

Of Lead-Free Solder Alloys”, September 2010, Research Associate, US Army National

Labs, Aberdeen, MD.

15- Mustafa Eray Gunel, “Large Deformation Micromechanics of Particle Filled Acrylics at

Elevated Temperatures” , September, 2010. Consultant, Terra Technology, Norwalk,

CT.

16- Bicheng Chen, “High Sensitivity Moiré Interferometry with Phase Shifting at Nano

Resolution”, May 2011, Mechanical Engineer III, Tyco Electronics, Harrisburg, PA.

17- Yongchang Lee, “A Multi-Scale Modeling Technique for Bridging Molecular Dynamics

with Finite Element Method” May 2013, Senior R& D Engineer, SK Hynix, S. Korea.

18- Wei Yao, ”Damage Mechanics of Electromigration and Thermomigration in Electronic

Packaging Solder Joints under Under Time Varying Current Loading”. May 2013

Packaging Engineer, Avago Technologies, San Jose, CA

19- Pierre Gautreau, “Using Graphene and SWCNT for Next Generation Power Electronics:

A Multi-Scale Analysis Framework” February 2014. Vice-President, M & T Bank,

Buffalo, NY

20- Yanbiao Chu, “Quantum Mechanics of High Current Density Induced Damage in

Graphene “, August 2015. Q & R Engineer, Intel Corp. Chandler, AZ.

21- Tingyue Lan, ”Multi-Scale Modeling of Transport in Copper at 50K” expected

graduation May 2017

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22- Weixiang Zhang” Development of a Graphene Nano Ribbon Based Power Electronics”

expected graduation May 2018.

23- Ji Zhang “Development of a Graphene Nano Ribbon Based Power Electronics,” expected

graduation May 2018.

Ph.D. Dissertations Supervised as a Committee Member

1- Zongrong Liu, “Electrically Conductive and Thermally Conductive Materials for

Electronic Packaging” September 2004, Primary Advisor Prof. Deborah D.L. Chung of

MAE Dept.

2- Sang Kyu Kwak, “Studies of Point Defects in Strained Solids By Molecular Simulation,”

May 2005, Primary Advisor David Kofke of CBE

3- Chia-Ken Leong, “Improving Materials for Thermal Interface and electrical Conduction

by Carbon” May 2007, Primary Advisor Prof. Deborah D.L. Chung of MAE Dept.

4- Dong Keon Kim,” A Cyclic Viscoplastic Damage Model with Application to Seismic

Response of Metallic Dampers,” May 2010, Primary Advisor, Prof. Gary Dargush of

MAE Dept.

Post-Doctoral Fellows and Senior Research Scientists Advised

1- Hale Ergun,PhD, Damage Mechanics of Infilled Composites, September 2004 - August

2005.

2- Tarek Ragab, PhD, August 2015- present.

MS Theses Supervised as the Primary Advisor

1- Rumpa Chandaroy, “Nonlinear Dynamic Analysis of Microelectronic Packaging

Interconnects “, 12/1996.

2- Joseph Ball, "3-D Building Design,” 12/97, (Staff Engineer, ATSI Inc. Buffalo, NY.)

3- Jianbin Jiang,”Size Effect for Pb/Sn Solder Alloys and Its Measurement by Nano

Indentation” May 2002.

4- Minghui Lin, “Electromigration Caused Damage in Microelectronics Pb/Sn Solder

Joints”, May 2002.

5- Shihua Nie,”Fatigue Behavior of Particle Filled Composites, December 2002,

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MS Theses Supervised as a Committee Member

1- Mathew Blaczak,”Using Twyman-Green Interferometry for Measuring Material

Properties” Co-Advisor with Dr. Alex Cartwright of EE Dept, April 2001.

2- Kyu-Dong Kim, “Reliability of Soldered and Conductive Adhesive Joints in Electronics,”

April 2002, Primary Advisor Prof. D. L. Chung of MAE Dept.

3- Chia Ken Leong,”Development of Thermal Pastes for High Thermal Contact

Conductance,” May 2003, Primary Advisor, Prof. D.L. Chung of MAE

4- Bhanu Jaiswal,”Innovative Circuit Board-Level Routing Designs for BGA Packages,”

5- May 2003, Primary Advisor Prof. A. Titus of EE (Funding Advisor Prof. Basaran)

6- 5 – Yuanbo Guo, “Development of a High Current High Temperature SiC MOSFET

Based Solid-State Power Controller” December 2010, Primary advisor, Prof. DC

Hopkins

Undergraduate Research Assistants

1- Stacey Serafin, (Physics major) “Optical Diffraction Grating Manufacturing

Methodologies,” Spring 2001.

2- Tom Downes, (EE major)” Digital Image Processing for Moiré Interferometry Fringes,”

Spring 2001.

3- Jigar Patel,(EE major)” Moiré Interferometry Grating Replication, Fall 2001.

4- Shun Wu, (EE major)“Optical Diffraction Grating Replication for Moiré Interferometry”

Fall 2001, Spring 2002, Summer 2002

5- Julia Johnson, (Park High School Senior) “Fatigue Testing Particle Infilled Composites”

Summer 2002. Sponsored by Minorities in Engineering Program (BEAM)

6- Frankie Jones, (EE major),” Moire Interferometry Grating Replication,” Summer 2002,

Fall 2002

7- Fanor Balderrama, (Computer Science major) Moire Interferometry Grating Replication,

Fall 2002, Spring 2003, Summer 2003

8- Tushar Bansal, (CSE Major, Honors program),” Pathfinding in printed circuit boards,

Fall 2002

9- Jonathan Davis, (Park High School Senior), Testing Particle Infilled Composites,”

Summer 2003, Sponsored by Minorities in Engineering Program (BEAM).

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10- Faaiza Ansari, (Biology and MAE major) Moire Interferometry Grating Replication,

Summer 2003, Fall 2003, Spring 2004, Fall 2004, Spring 2005.

11- Eli Dickinson (Computer Science and English major), Software Development, Fall 2003,

Spring 2004.

12- Maureen West (Buffalo City Honors Senior) Software Development, Summer 2006

13- Yiwei Jin, CSEE Senior Scholar) Deformation behavior of CarbonNanoTubes, Spring

2009

14- Julia McDonalds, Nichols High School Senior, Size Effect in GNR under Shear , July

2016

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Funding (Not including Consulting)

1- "Unholtz-Dickie Vibration System", University at Buffalo Equipment Challenge Grant

Program, March 20, 1997, Principal Investigator/PD Cemal Basaran, $25,000.

2- "Damage Mechanics of Semiconductor Devices with Emphasis on Interfaces".

Department of Defense, Office of Naval Research Young Investigator Award, June 1,

1997 – May 31, 2001. Principal Investigator/PD Cemal Basaran. The award amount (not

including the equipment grant and UB matching funds) is $350,000; including the UB

matching funds (cash plus in kind) but not including equipment grant the total project

budget is $724,400. 00

3- University at Buffalo, SEAS EngiNET Long Distance Learning Program Equipment

Grant, March 20, 1997, $950.0

4- Riefler Award, UB School of Engineering and Applied Sciences, June 1997, $1000.0

5- University of California SanDiego, Institute for Mechanics and Materials Fellowship for

Fifth Annual Meeting of IMM Young Investigators '97, $250.0+ conference expenses.

6- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0 April

16, 1998.

7- University at Buffalo, PDQWL Individual Development Awards Program, $1,000.0

November 4, 1998.

8- "Reliability of Interfaces in Microelectronics Packaging", National Science Foundation-

GOALI Program/ Intel Corporation, Principal Investigator/PD Cemal Basaran, Co-PI,

Alexander Cartwright and Dr. Terry Dishongh of Intel Corp., October 1, 1999, -

September 30, 2003, $247,323.0 [including the matching money from Intel Corporation

and UB the total budget of the project is $602,000.0].

9- “An Explicit FEM Code for Damage Mechanics of Solder Joints”, Principal

Investigator/PD Cemal Basaran, Intel Corp. Hillsboro, OR, September 1999-September

2000, $28,000.0 plus a four Xeon processor Intel server. (Approx. worth $100,000.0)

10- “Thermomechanical Behavior of BGA Solder Joints “, Principal Investigator/PD Cemal

Basaran, Intel Corp. Hillsboro, OR, January 2000-September 2000, $30,000.0

11- “Laser Mechanics and Damage Imaging Laboratory” Defense University Research

Instrumentation grant DURIP, Department of Defense Co-PI, Alexander Cartwright

February 2000. $325,000.0 (including the UB equipment challenge matching funds)

12- “Grain Size Effect in Solder Joints,” Principal Investigator/PD Cemal Basaran, Intel

Corp. Hillsboro, OR, May 2000- April 2001, $25,000.0

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13- “Reliability of Power Electronic Devices” Office of Naval Research, Principal

Investigator/PD Cemal Basaran, May 2000-April 2004. $300,000.0

14- Research Education for Undergraduates National Science Foundation Supplemental

Grant, May 2000-April 2001, $10,000.0

15- UUP Individual Development Awards Program, May 2000, $462.0

16- Unrestricted Grant, DuPont Corporation, September 2000, $15,000.0

17- “Thermomechanical Behavior of Flip Chip DRAM Packaging” Micron Technology,

November 2000-May 2002, $12,500.

18- IT Collaboratory, NY Science Technology and Research Office, $6,000,000.0, PI: Paras

Prasad, of Chemistry, Co-PIs: Cemal Basaran of Civil Engineering, Alex Cartwright and

Pao-Lo Liu of Electrical Engineering, Bruce McCombe and Hong Luo of Physics, May

2002- May 2005 [This is an equipment grant]

19- “Damage Mechanics of BGA Solder Balls Under High Electrical Current Density”,

International Microelectronics And Packaging Society, Co-PI Doug Hopkins, October

2001- September 2002. [Graduate student fellowship award], $15,000.0.

20- Reliability of Solder Joint-Metallization Interfaces, AG Communications, October 2001-

December 2001, $9,000.0

21- Equipment Donation, MTS 858 material characterization hydraulic grip components,

DuPont Corp, December 2001, $23,000.0.

22- Research Education for Undergraduates National Science Foundation Supplemental

Grant, December 2001-November 2002, $10,043.0

23- Evaluation of Alternate I/O Routing for Bumpless BGA-Printed Circuit Boards”, Intel

Corporation, Co-PI Alex Cartwright, and Albert Titus of EE, February 2002 –August

2004, $86,092.0

24- Damage In BGA Solder Joints Under Vibrations, Intel Corporation, April 2002- March

2003, $25,000.0

25- Damage Mechanics of Composite Structural Systems, DuPont Corporation, August 2002-

July 2003, $25,000.0.

26- University at Buffalo, UUP Professional Development Award, June 2002, $510.0

27- Micromechanics of Particle Infilled Composites, DuPont Corporation, , July 2003-

January 2004. $22,000 (including $7,000 in Equipment)

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28- Advanced SiC Converter for Embedded Applications, US Navy, PI Dr. D. Hopkins of

DC Hopkins & Assoc., February 2004 - September 2004, $76,000.0, Co-PI Dr. C.

Basaran.

29- Determination of Micromechanical Material Parameters for Particle Infilled Composites,

DuPont Corp., March 20004 - October 2004, $15,000.0

30- Experimental Validation of Damage Mechanics Models for Different Compositions of

Corian, DuPont Corp., October 2004- June 2004, $20,000.

31- Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration,

Thermal and High Power Loads,” ONR, $ 445,409.00 September 1, 2004 –October,

2007.)

32- Damage Mechanics of Next Generation Nanoelectronics and Power Electronics

Packaging, NY State CAT for Microelectronics Packaging, $40,000, July 1 2005 – June

30, 2006.

33- Damage Mechanics of NanoElectronics Packaging Solder Joints, $284,500, NSF, CO-PI

David Kofke of Chemical and Biological Engineering, August 1, 2005 – July 31, 2009.

34- Material Properties of Acrylic Particle Filled Composites. DuPont Corporation,

$40,000.0 January 1, 2006- December 2006.

35- Thermomechanical behavior of Inkjet MEMS, Kodak Corp., October 2006 – December

2006, $5000.

36- Damage Mechanics of Particle Filled Composites During Thermoforming, DuPont,

Corp., $90,000, January 1, 2008, -December 31, 2010.

37- Solder Joint Quality Inspection, Northrop-Grumman, Amherst Systems, January, 2007,

$2,500.

38- Multi-Scale Damage Mechanics of High Temperature and High Power Density Power

Electronics, May 2008- May 2011, ONR, $498, 678.00

39- Electromigration in lead-free solder joints for wireless systems, $17,500, April 2008-

June 2008, STMicroelectronics, Grenoble, France.

40- Extrusion in Al Interconnects in Analog Devices, Texas Instruments, Dallas, TX, June

2008-December 2008, $34,000.

41- Multi-Scale Modeling of Electromigration and Thermomigration in Nanoelectronics and Power

Electronics, $200,826, May 2009-May 2012, Semiconductor Research Corporation.

42- Determination of Fatigue Life of Gull-Wing Solder Joints, WatchFireSigns, $3,900

December 2009

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Nanotechnology Research Laboratory Setup, University of Tabuk, $40,000, January 2011

43- The Framework for Next Generation Power Electronics Using Nanomaterials, ONR,

$650,191.00 June 2011-June 2014.

44- Solder Sealing Atomic Clock, Symmetricom, $10,000, November 1, 2012-December ,1

2012.

45- Bending in Composite Electronic Package TE Corp., $4,900, February 18, 2013- March

2, 2013

46- Reliability of Power Electronics in Extreme Cold Temperatures, Office of Naval

Research, $50,000, May 16, 2014 – August 15, 2015

47- “Development of a Graphene Nano Ribbon Based Power Electronics, Office of Naval

Research, March 26, 2015 – March 25, 2019, $785,792

48- “Mechanics of Nano-electronics Packaging” , Ministry of Human Resource

Development, Government of India, June 16, 2016, for one week long workshop

December 5- 9, 2016 to held at IIT Madras., $7,000.00

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Books and Book Chapters:

1- Basaran, C, Nie, S and Gunel, E.M.” Damage Coupled Viscoplastic Modeling of

Particulate Composites With Imperfect Interphase”, Chapter in, Encyclopedia of

Composites, 5 Volume Set, 2nd Edition, Luigi Nicolais (Editor), Assunta Borzacchiello

(Editor), Stuart M. Lee (Editor) ,ISBN: 978-0-470-12828-2, Hardcover, 3025

pages, John Wiley & Sons, Inc., Hoboken, New Jersey, 2012.

2- Basaran, C. and Gunel, E.M. “Damage Mechanics Unified Constitutive Modeling for

Polymers” DOI 10.1007/978/-1-4614-8968-9_28-1 Chapter in Handbook of Damage

Mechanics, Springer Science Business media New York 2014 ISBN 978-1-4614-5588-2

3- Cemal Basaran*, Shihua Nie, Juan Gomez, Eray Gunel, Shidong Li, Minghui Lin, Hong

Tang, Chengyong Yan,Wei Yao and Hua Ye “Thermodynamic Theory for Damage

Evolution in Solids” DOI 10.1007/978-1-4614-8968-9_31-1 Chapter in Handbook of

Damage Mechanics, Springer Science+Business Media New York 2014, Springer Science

+ Business media New York 2014, ISBN 978-1-4614-5588-2

Citation Analysis as of 11/29/206 http://scholar.google.com/citations?user=WfqDDksAAAAJ&hl=en&oi=ao

All Since 2011

Citations 3006* 1432

h-index 30* 18

i10-index 80* 50

*85% of my journal publications are single senior author papers published with my PhD students or

Post Docs.

Publications in Refereed Archival Journals

1- Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh Dependence in

the Disturbed State Concept," Int. Journal for Numerical Methods in Engineering, Vol.

40, 3059-3083, 1997.

2- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of

Problems in Electronic Packaging Using the Disturbed State Concept Part I: Theory and

Formulation " Trans. of ASME, Journal of Electronic Packaging, Vol. 120, No. 1, pp. 41-

47, 1998.

3- Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of

Problems in Electronic Packaging Using the Disturbed State Concept Constitutive

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Models: Part II: Verification and Application ", Trans. of ASME, Journal of Electronic

Packaging, Vol. 120, No. 1, pp. 48-53, 1998.

4- Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical Analysis in

Electronic Packaging with Unified Constitutive Models for Materials and Joints,” IEEE

Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on Advanced Packaging, Vol. 21,

No. 1, 87-97, 1998.

5- Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature Cycling

Tests," IEEE, Transactions on Components Packaging and Manufacturing Technology -

Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3

6- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount

Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging, Vol.

121, Number 1, pp. 8-12, March 1999. #7a

7- Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount

Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic Packaging,

Vol. 121, No 1, pp. 12-17, March 1999. #7b

8- Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder Alloys

Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol. 22, pp. 601-

627, 1998, #8.

9- Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics of

Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120, 379-384,

1998. #12

10- Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount Technology

Solder Joints Under Concurrent Thermal and Dynamic Loadings," Trans. of ASME,

Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999.

11- Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests on Solder

Joints in Microelectronics Packaging,” Computers & Structures, Vol. 74, Issue 2, pp.

215-231, November, 1999. #9

12- Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated

Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179, 1999. #5

13- Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical Behavior of

Micron Scale Solder Joints: An Experimental Observation,” Journal of the Mechanical

Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13

14- Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical Behavior of

Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of Materials, Vol. 32,

Issue 3, pp. 161-173, 2000. #14

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15- Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of Thermodynamic

Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000. Review article.#17

16- Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical Behavior

of Materials Vol. 10, No. 5-6, pp. 279-311, 2000.

17- Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic

Packaging,” Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp. 218-224,

September 2001. #22

18- Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of

Microelectronics Solder Joints Under Concurrent Vibration and Thermal Loading,” Int. J.

of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001. #15

19- Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of Solder

Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May 2001.Review

article. #27

20- Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History for

Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of Thermal Stresses,

Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20

21- Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under

Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic Packaging, Vol.

124, No 1, pp. 60-67, March 2002. #24

22- Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for Inspecting BGA

Solder Balls for Manufacturing Defects,” Journal of Global SMT and Packaging, Vol. 2,

No. 2, pp. 9-14, May 2002. #33

23- Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on Thermomechanical

Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal of Damage Mechanics,

Vol. 10, No 3, pp. 235-255, July 2001. #29

24- Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for Damage

Mechanics of Solder Interconnects in Microelectronic Packaging,” International Journal

of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January 2002. #17

25- Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under Bump

Metallization – Solder Ball Interfaces by SEM, EDX and Moire Interferometry,” TAP

Technology, Vol. 4, pp. 23-27, 2002, Review article.#31

26- Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power Electronic

Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7, pp. 601-612, May

2002. #25

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27- Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder Alloys,”

Mechanics of Materials, 34, pp. 349-362, 2002, #26

28- Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder Bumps”,

Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52

29- Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and Liu, H., “Impact of Temperature

Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions on Advanced

Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35

30- Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction Model,”

Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 120-125, March

2003. #21

31- Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered Microelectronic

Packaging,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 134-

138, March 2003. #23

32- Ye, H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints Under

Joule Heating During Electric Current Stressing, Applied Physics Letters, Vol. 82, No 8,

February 2003, #38.

33- Wen , Y.and Basaran, C. “Analysis of Multi-layered Microelectronic Packaging Under

Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345, International. J. of Solids

and Structures, May 2003, #45

34- Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the Moire

Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May 2003, Review

article. #46

35- Ye, H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics Solder

Joints Under High Current Densities,” International Journal of Solids and Structures, Vol.

40, No. 15, pp. 4021-4032, July 2003. #34

36- Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and Experimental

Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125, No. 3, pp. 426-430,

September 2003, #30

37- Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase Shifted

Moiré Interferograms Using 1-D Continuous Wavelet Transform Image Processing”,

Optical Engineering 42(09), pp. 2646-2652, September 2003, #50

38- Ye, H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current Density

Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp. 13-16,

September 2003, Review Article.#69

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39- Ye, H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution During

Electromigration in IC Interconnect Lines,” IEEE Trans. On Comp. Packaging Tech.

Vol. 26, No. 3 pp.673-681, September 2003.#43

40- Basaran, C., Lin, M. and Ye. H. “A Thermodynamic Model for Electrical Current

Induced Damage”, Int. Journal of Solids and Structures Vol. 40, No 26 pp. 7315-7327,

November 2003 #37

41- Ye, H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics

Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures, Vol 40 No

26, pp 7269-7284, November 2003 #40

42- Ye, H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current Density

Effects in Solder Joints,” Microelectronics Reliability, Vol. 43, issue 12, pp. 2021-2029,

December 2003. #42

43- Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of Multi-

layered Microelectronic Packaging,” Mechanics of Materials, 36, pp. 369-385, 2004. #47

44- Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré Interferometry

to Determine Strain Fields and Debonding of Solder Joints in BGA Packages, IEEE

Transactions on Components and Packaging Technologies, Vol. 27, No 1, pp. 217- 223,

March 2004. #28

45- Ye, H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip chip

solder joint under electrical current stressing,,” Int. J. of Solids and Structures, 41, pp.

2743-2755, 2004. #48

46- Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A Ridge

Detection Algorithm Based on Continuous Wavelet Transform” Applied Optics, Vol. 43,

No. 4/1, pp.850-857, February 2004, #51.

47- Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of Improvement of

Phase Shifting Moire Interferometry and Wavelet-Based Image Processing,” Optical

Engineering, 43 (05) pp. 1206-1214, May 2004, #56

48- Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of Microelectronics

Solder Joints Under Fatigue Loading,” Mechanics of Materials, 36, pp. 1111-1121,

August 2004, #36

49- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under

Current Stressing and Numerical Simulation I,” International Journal of Solids and

Structures, vol. 41, pp. 4939-4958, September 2004. #59

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50- Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under

Current Stressing and Numerical Simulation II,” International Journal of Solids and

Structures, vol. 41, pp. 4959-4973, September 2004, #60

51- Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage Mechanics

of Solids,” International Journal of Damage Mechanics, vol. 13, No 3, pp 205-224, July

2004, #41

52- Ye, H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current

Densities in Flip Chip Solder Joints,” International Journal of Damage Mechanics, Vol.

13, No. 4, pp 335-346, October 2004, #58

53- Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics Constitutive

Model for Low Cycle Fatigue Analysis of Microelectronics Solder Joints Incorporating

Size Effect,” International Journal of Solids and Structures, Vol. 42, issue 13, pp. 3744-

3772, (2005) #67.

54- Nie, S., and Basaran, C. “A Micromechanical Model for Effective Elastic Properties of

Particulate Composites with Imperfect Interfacial Bonds,” International Journal of Solids

and Structures Vol. 42, pp 4179-4191, 2005, #62

55- Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully Coupled

Mechanical-Diffusion Equations With Nonlinear Material Properties,” Computational

Materials Science, Vol. 34/1 pp. 82-98, May 2005, #64

56- Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip Chip

Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of Electronic

Packaging, vol. 127, pp. 157-163, June 2005 #53

57- Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based Unified

Constitutive Model for Solder Alloys,” Trans of ASME, Journal of Electronic Packaging,

Vol. 127, issue 3, pp. 208-214, September 2005 . #18

58- Ye, H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of Micro/Power

Electronics Solder Joints Under Electrical Current Stresses,” Int. J. of Damage

Mechanics, vol. 15, pp. 41-68, January 2006, #65

59- Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys; Experimental and

Finite Element Simulation Results”, Int. J. of Solids and Structures, vol. 43, (2006), pp.

1505-1527, 2006, #77

60- Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn Solder

Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent Effects Using a

Return Mapping Integration Algorithm,” Mechanics of Materials, 38 (2006), 585-598.

#72

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61- Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent

Thermal And Vibration Loading On Electronics Packaging” Multidiscipline Modeling in

Materials and Structures, Vol.2, No.3, pp. 309-326, July 2006. #71.

62- Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in PMMA/ATH

Acrylic Casting Dispersion,” Journal of Mechanical Behavior of Materials, Vol. 17, No

2, 2006, pp. 79-95, #39

63- Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for

Particulate Composites,” International Journal of Solids and Structures, 44, (2007) 1099-

1114. #63

64- Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging Under

Thermal Gradient Loading,” IEEE Trans. On Components and Packaging Technologies,

vol. 29, no 4, pp. 850-855, December 2006, #75.

65- Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on Thermomechanical

Stresses in Multilayered Microelectronic Packaging,” IEEE Trans. On Advanced

Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61

66- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in Microelectronics

Copper Interconnects,” International Journal of Materials and Structural Integrity, vol. 1,

Nos1/2/3, 16-39, 2007, #76

67- Basaran, C. and Lin, M. “Electromigration Induced Strain Field Simulations for

Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures, 44, (2007),

4909-4924. #68.

68- Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length Scale for

Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic Packaging,

ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128, June 2007. #66

69- Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced Failure,”

Mechanics of Materials, 40 (2008) 66-79, #74

70- Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond Strength

on Fatigue Life and Mechanical Behavior of a Particulate Composite: An Experimental

Study, Int. J. of Damage Mechanics, Vol. 17, No. 2, 123-148, March 2008 #54.

71- Chen, B. and Basaran, C. “Automatic Full Strain Field Moiré

Interferometry Measurement with Nano-scale Resolution” Experimental Mechanics, vol.

48, no 5, October 2008, pp. 665-673. #83

72- Abdulhamid, M., Li, S., Basaran, C. “Thermomigration in lead-free solder joints, Int. J.

of Materials and Structural Integrity, Vol. 2, Nos 1 / 2, pp. 11-34, 2008, #87

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73- Basaran, C., Li, S., Abdulhamid, M.,” Thermomigration Induced Degradation in Solder

Alloys,”, Journal of Applied Physics, 103, 123520 (2008), # 86

74- Basaran, C., Nie, S. and Hutchins, C., Time Dependent Behavior of a Particle Filled

Composite PMMA/ATH at Elevated Temperatures” Journal of Composite Materials,

Vol. 42, No. 19, pp. 2003-2025, 2008, #55

75- Li, S., Abdulhamid, M. and Basaran, C. “Simulating Damage Mechanics of

Electromigration and Thermomigration,” Simulation: Transactions of the Society for

Modeling and Simulation International Vol. 84, Number 8/9, pp. 391-401,

August/September 2008, #91

76- Gomez, J. and Basaran, C. “Computational Implementation of Cosserat Continuum,”,

International Journal of Materials and Production Technology, Vol. 34, No 1 / 2, pp 3-36,

January 2009, #78

77- Abdulhamid, M. , Basaran, C,” Influence Of Thermomigration On Lead-Free Solder Joint

Mechanical Properties”. Trans of the ASME Journal of Electronic Packaging,, March

2009, Vol. 131 / 011002-1-011002-12, #80

78- Li, S. and Basaran, C. “A Computational Damage Mechanics Model for

Thermomigration,” Mechanics of Materials, vol. 41, issue 3, pp. 271-278, March 2009,

#82

79- Li, S., Abdulhamid, M., Basaran, C. and Lai, Y.S. “Damage Mechanics of Low

Temperature Electromigration and Thermomigration” IEEE Trans. On Advanced

Packaging, Vol. 32, No 2, pp., 478-485, May 2009, #85

80- Li, S., Sellers, Basaran, C., M. Schultz, A.,. and Kofke, D., ”Lattice Strain Due to an

Atomic Vacancy,” Int. J. of Molecular Sciences, 2009, 10, 2798-2808, #81

81- Basaran, C. , Li, S. ,Hopkins D.C. and Veychard, D.”Electromigration Time To Failure of

SnAgCuNi Solder Joints” Journal of Applied Physics, 106, 013707, (2009) # 92

82- Abdulhamid, M., Basaran, C., and Lai, Y.S., ”Thermomigration vs. Electromigration in

Microelectronics Solder Joints” IEEE Transactions on Advanced Packaging, Vol. 32, No

3, pp. 627-635, August 2009, #79

83- Ragab, T. and Basaran, C. “A Framework for Stress Computation in Single-Walled

Carbon Nanotubes Under Uniaxial Tension” Computational Material Science, 46, 1135-

1143, (2009) #89

84- Ragab, T. and Basaran, C.,” Joule heating in single-walled carbon nanotubes,” Journal of

Applied Physics, 106, 063705, (2009), #95

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85- Basaran, C., Abdulhamid, M.” Low Temperature Electromigration and Thermomigration

in Lead-Free Solder Joints,” Mechanics of Materials, 41, (2009) 1223-1241, #88

86- Ragab, T., Basaran, C. “A Quantum Mechanical Formulation of Electron Transport

Induced Wind Forces in Metallic Single Walled Carbon Nanotubes:” Carbon 48 ( 2010)

47-53, #96

87- Li, S. and Basaran, C. ”Effective Diffusivity of Lead-Free Solder Alloys”

Computational Materials Science 47, (2009) 71-78, #90

88- Gunel, E.M., Basaran, C. Micro-deformation mechanisms in thermoformed alumina

trihydrate reinforced poly (methyl methacrylate) Materials Science and Engineering: A,

523 (2009) 160-172, #99

89- Seller, M. Schultz, A. Basaran, C. and Kofke, D, "Atomistic Modeling of beta-Sn Surface

Energies and Adatom Diffusivity" , Applied Surface Science, 256, (2010) 4402-4407.

#93

90- Ragab, T. and Basaran, C. “Semi-classical transport for predicting joule heating in

carbon nanotubes" Physics Letters A, Vol.374 Issue 24 (2010) pp. 2475-2479, #102

91- Seller, M., Schultz, A., Basaran, C. and Kofke, D., “Sn Grain Boundary Structure and

Self-Diffusivity via Molecular Dynamics Simulation” Physical Review B, 81, 134111

(2010) #103

92- Gunel, E.M., and Basaran, C. “Stress Whitening Quantification in Thermoformed of

Mineral Filled Acrylics”, ASME Journal of Engineering Materials and Technology, July

2010, Vol. 132, 031002-11, #100

93- Ragab, T and Basaran, C. “The prediction of the effective charge number in single walled

carbon nanotubes using Monte Carlo simulation " Carbon, 49, (2011) 425-434, #104

94- Chen, B. and Basaran, C. “Statistical Phase Shifting Step Estimation Algorithm Based on

the Continuous Wavelet Transform for High Resolution Interferometry Metrology”

Applied Optics, Vol. 50, No 4, 586-593, February 2011 # 98

95- Sellers, M., Schultz, A. J., Kofke, D., and Basaran , C ” Solute Effects on Sn Grain

Boundary Energy and Shear Stress,” ASCE J. of Nanomechanics and Micromechanics

,Vol. 1, Number 1, pp. 41-50, March 2011, #109

96- Chen, B. and Basaran, C. Measuring Joule Heating and Strain Induced by Electrical

Current with Moiré Interferometry” Journal of Applied Physics, 109, 074908 (2011) # 97

97- Ragab, T. and Basaran, C. “The Unraveling of Open-Ended Single Walled Carbon

Nanotubes Using Molecular Dynamics Simulation,” ASME Journal of Electronic

Packaging, June 2011, Vol. 133, 020903-1- 7, #107

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98- Lee, Y. and Basaran, C. “A Creep Model for Solder Alloys” Trans. Of ASME, J. of

Electronic Packaging, vol. 133, issue 4, 044501-1, December 2011,#101 99- Sellers, M., Schultz, A. J., Basaran , C. and Kofke, D.,” Effect of Cu and Ag Solute

Segregation on Sn Grain Boundary Diffusivity,” Journal of Applied Physics, 110,

013528-1 (2011) #110

100- Chen, B. and Basaran, C., ”Near Field Modeling of the Moiré Interferometry for

Nanoscale Strain Measurement,” Journal of Optics and Lasers in Engineering, 50 (2012)

976-984, #111.

101- Yao, W. and Basaran, C., ” Electromigration Analysis of Solder Joints under AC Load: a

Mean Time to Failure Model” J. of Applied Physics, 19 March 2012, Journal of Applied

Physics , Vol.111, Issue 6, #115

102- Chen, B. and Basaran, C., ”Far-Field Modeling of Moiré Interferometry using Scalar

Diffraction Theory,” 50 (2012) 1168-1176, Journal of Optics and Lasers in Engineering,

#112

103- Yao, W., Basaran. C., “Reduced Impedance and Super Conductivity of Lead-free Solder

Alloys at Very High Frequencies,” Volume 8, No 5 (2012) 503-505, DOI:

10.1007/s13391-012-2054-6 Electronic Materials Letters, #118

104- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal Stretching of

Acrylics: Part I Theory” Mechanics of Materials, Volume 43, Issue 12, December 2011,

Pages 979–991 #105

105- Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal Stretching of

Acrylics: Part II Experimental Validation, Mechanics of Materials , Volume 43, Issue 12,

December 2011, Pages 992–1012 #106

106- Basaran, C and Gunel, E.M., “Predicting Elastic Modulus of Particle Filled Composites,”

Int. J of Materials and Structural Integrity , pp. 100-108, Vol. 7, Nos1/2/3, 2013 #120

107- Lee, Y. and Basaran, C., “Molecular Dynamics of Visco-Plasticity in Tin Lattice and

Grain Boundary.” Computational Material Science, 68, (2013) 290-296 .#116

108- Gautreau, P., Ragab, T., Basaran, C.,” Hot Phonons Contribution to Joule Heating in

Single-Walled Carbon Nanotubes”, Journal of Applied Physics, 112, 103527 (2012)

doi:10.1063/1.4766901 #119

109- Gunel, E. and Basaran, C., ”Influence of Filler Content and Interphase properties on Large

Deformation Micromechanics of Particle Filled Acrylics,” 57, (2013) 134-146 , Mechanics

of Materials #108

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110- Lee, Y. and Basaran, C., ”Atomic Level Shear Stress-Strain Behavior of Sn” ASCE J.

of Nanomechanics and Micromechanics, vol. 3, No 4, December 2013, #123

111- Yao, W., and Basaran, C., ” Electromigration in Lead-Free Solder Joints under High

Frequency Pulsed Current: an Experimental Study, Int. J. of Damage Mechanics, Volume

22 Issue 8 November 2013 pp. 1127 - 1143 #122

112- Gautreau, P. ,Ragab, T., Basaran, C,” Influence of Hot Phonons on Wind Forces in

Metallic Single Walled Carbon Nanotubes,” Carbon, 57, (2013), 59-64 #126

113- Yao, W. and Basaran, C., ”Electromigration Damage Mechanics of Lead-Free Solder

Joints Under Pulsed DC Loading: A Computational Model” Computational Material

Science, 71, (2013) 76-88 #113

114- Yao, W. and Basaran, C. ”Electrical Pulse Induced Impedance and Material Degradation

in IC Chip Packaging,” Electronic Materials Letters, Vol. 9, No. 5, (2013), pp. 565-568

#125

115- Yao, W. and Basaran, C.” Damage Mechanics of Electromigration and Thermomigration

in Lead-free Solder Alloys under AC: An Experimental Study, “Int. J. of Damage

Mechanics, Vol. 23 Issue 2 March 2014, pp. 203-221. #121

116- Dongkeon Kim, Gary Dargush, Cemal Basaran, “A cyclic two-surface thermoplastic

damage model with application to metallic plate dampers”, Engineering Structures

Volume 52, July 2013, Pages 608–620. #132

117- Lee, Y. and Basaran, C.,”A Multi-scale Modeling Approach for Bridging Molecular

Dynamics with Finite Element Analysis,” Journal of Computational Physics, 253

(November 2013) 64-85. #114

118- Yao, W. and Basaran, C. “Computational Damage Mechanics of Electromigration and

Thermomigration” J. of Applied Physics, 114, 103708, (2013), #129

119- Chu, Y., Ragab, T. and Basaran, C., ”Size Effect in Graphene Nano Ribbon,”

Computational Materials Science, 81 (2014) 269-274 #117

120- Lee, Y. and Basaran, C. “Effect of Ni Solute on Grain Boundary Diffusivity and

Structure of βSn”,” Computational Materials Science 92 (2014) 1-7 #128

121- Gautreau, P., Ragab, T. Chu, Y. and Basaran, C. “Phonon Dispersion and Quantization

Tuning of Strained Carbon Nanotubes for Flexible Electronics” J. Of Applied Physics,

115, 243702 (2014) #133

122- Chu, Y., Ragab, T., Gautreau, P., Basaran, C., Mechanical Properties of Hydrogen-Edge-

Passivated Chiral Graphene Nanoribbons (ASCE Journal of Nanomechanics and

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Micromechanics, 04015001-1, March 2015 . DOI: 10.1061/(ASCE)NM.2153-

5477.0000101 #131

123- Chu, Y., Gautreau, P., Ragab, T. and Basaran, C.,”An accelerated algorithm for full band

electron phonon scattering rate computation,” Computer Physics Communications, 185,

(2014) 3392-3397 #135

124- Chu, Y., Gautreau, P., Basaran, C.” Parity Conservation in Electron-Phonon Scattering of

Zigzag Graphene Nanoribbon” Applied Physics Letter, issue 11, volume 105, 113112,

Sep-2014. #136

125- Gautreau, P., Chu, Y. Ragab, T., Basaran, C,” , Phonon-Phonon Scattering Rates in

Carbon Nanotubes, Computational Materials Science, 103, (2015) 151-156 # 130

126- Chu, Y., Gautreau, P., Ragab, T. and Basaran, C., “Temperature Dependence of Joule

Heating in Zigzag Graphene Nanoribbon,” Carbon, 89, (2015) 169-175 #137

127- Therence Temfack, Cemal Basaran, “Experimental Verification of a Thermodynamic

Fatigue Life Prediction Model” Materials Science and Technology, Volume 31, Issue 13,

2015, # 138

128- Chu, Y., Gautreau, P., Ragab, T.. and Basaran, C. “Strained Phonon-Phonon Scattering

Rates in Carbon Nanotubes”, Computational Materials Science 112 (2016) 87–91, #134

129- Ji Zhang, J., Ragab, T., Basaran, C. “Influence of Vacancy Defects on the Damage

Mechanics of Graphene Nano Ribbons”, Int. J. of Damage Mechanics (Published online

before print April 27, 2016, doi: 10.1177/1056789516645645 #140

130- Fu, Y., Ragab, T. , Basaran, C., The Effect of Stone-Wales Defects on the Mechanical

Behavior of Graphene Nano-Ribbons". Computational Materials Science 124 (2016),

142-150, #142

131- Zhang, J., Ragab, T., Basaran, C. “Damage Mechanics of Defective Zigzag

Graphene Nanoribbons,”, Int. J. of Damage Mechanics, September 2016, DOI:

10.1177/1056789516671795, #143

Archival Journal Papers under Review Process

132- Lan, T., Ragab, T., Basaran, C. “Electron-Phonon Scattering and Joule Heating in

Copper at Extreme Cold Temperatures, (submitted to Proc. Of the Royal Society ,

May 5, 2016) #139

133- Zhang, W., Ragab, T., Basaran, C “Unraveling Properties in Armchair and

Zigzag Graphene Nanoribbon (submitted to Int. J of Damage Mechanics, April 2016)

# 141

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134- Ragab, T. , Basaran, C.,” Shear strength of graphene nanoribbons beyond wrinkling”

Submitted to Int. J. of Solids and Structures June 7, 2016 #144

135- Ragab, T. , McDonald, J., Basaran, C.,” Aspect ratio effect on shear modulus and

ultimate shear strength of graphene nanoribbons” submitted to Carbon August 4,

2016 #145

136- Zhang, W., Ragab, T., Basaran, C , “Fracture mechanics of double vacancy defective

graphene nanoribbons” #147 submitted to AIMS Materials Science, November 28,

2016.

Publications: Book Review

1- Basaran, C., Solving Large-Scale Problems In Mechanics: The Development and

Application of Computational Solution Methods, editor Papadrakakis, P., John Wiley &

Sons, Int. J. for Numerical and Analy. Meth. In Geomechanics, Vol.18, 139-140, 1994.

Plenary and Key Note Lectures

1. "Disturbed State Concept", VIII International Conference on Computer Methods and

Advances in Geomechanics, Prof. C.S. Desai Honorary Session, May 22-28, 1994,

University of West Virginia, Morgantown, WV.

2. “Disturbed State Concept Constitutive Models for Surface Mount Technology

Interconnects", Dept. of Mechanical Engineering, University of Maryland, at College

Park, September 9, 1994.

3. “Damage Mechanics of Semiconductor Interconnects" Dept. of Mechanical Engineering,

Virginia Commonwealth University, Richmond, VA, June 2, 1997.

4. “Damage Mechanics of Surface Mount Technology Solder Joints”, Dept. of Mechanical

Engineering, Texas A&M University, College Station, TX, April 13, 1998.

5. “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics

Packaging,” Dept. of Mechanical Engineering, Aeronautical Engineering and Mechanics,

Rensselaer Polytechnic Institute, Troy, NY, May 11, 1998.

6. “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics

Packaging,” Dept. of Aerospace Engineering and Engineering Mechanics, Iowa State

University at Ames, September 21, 1998.

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7. “Damage Mechanics of Solder Joints in Surface Mount Technology Microelectronics

Packaging,” Dept. of Mechanical Engineering and Applied Mechanics, University of

Michigan at Ann Arbor, September 30, 1998.

8. “Experimental Mechanics of Electronic Packaging Using Moiré Interferometry”, Dept. of

Mechanical Engineering, Polytechnic University, Brooklyn, NY November 4, 1999.

9. “A Thermodynamic Framework for Damage Mechanics of Microelectronics”, Dept. of

Civil and Environmental Engineering, Cornell University, Ithaca, NY April 2, 2002.

10. “Damage Mechanics of Next Generation Electronics”, Dept. of Mechanical Engineering,

Florida State University, Tallahassee, FL, February 16, 2004.

11. “Damage Mechanics of Nanoelectronics”, Dept of Mechanical Engineering, Northeastern

University, Boston, MA March,2, 2007.

12. “Multi-Scale Damage Mechanics of Nanoelectronics Solder Joints”, POSTECH, Pohang

University of Science and Technology, Dept. of Mechanical Engineering, Pohang, South

Korea, May 29, 2007

13. Key Note Lecture, Damage Mechanics of Solder Joints under High Current Density, 10th

Int. Conf. On Mechanical Behavior of Materials, May 27-30, 2007, Busan, South Korea.

14. Key Note Lecture, Modeling Damage Mechanics of Particle Filled Composites: with

Micromechanics and Thermodynamics,” 15th Int. Symposium on Plasticity & Its Current

Applications, St Thomas, U.S. Virgin islands, January 3-8, 2009.

15. Key Note Lecture, Using Single Walled Carbon Nano Tubes for Electronics, ASME Int.

Mechanical Engineering Congress and Exposition IMECE 2009, Orlando, FL November

13-19, 2009.

16. “Electromigration and Thermomigration in Nanoelectronics” Dept. of Chemical

Engineering, University of Massachusetts, at Lowell April 15, 2011.

17. “Electromigration and Thermomigration in Nanoelectronics” Binghamton University,

The Center of Excellence, Small Scale Systems Integration and Packaging (S³IP), June

22, 2011

18. Bridging Molecular Dynamics with Finite Element Method, Hanyang University, South

Korea, International Mini-Symposium Honoring professor George Voyiadjis, (By

invitation Only) April 8-12, 2012.

19. Key Note Lecture, Solder Joint Grain Boundary Structure and Self‐Diffusivity via

Molecular Dynamics Simulations, “ 13th IEEE Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San Diego, CA

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May 30 - June 1, 2012. Outstanding Paper Award, Mechanics Track, Basaran, C.,

Sellers, M., Schultz, A., Kofke, D.A.and Lee Y.

20. Key Note Lecture “Mean Time to Failure of SnAgCuNi Solder Joints under DC “, 13th

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, ITherm 2012, San Diego, CA May 30 - June 1, 2012.

21. Key Note Lecture - Modeling Electromigration and Thermomigration under DC, AC

and Pulse: , ASME IMECE 2012, November 9-15, 2012, Houston TX

22. Invited Lecture, “ Nano Materials for Next Generation Electronics”, Universidad Major

San Simon, Cochabamba, Bolivia, August 12, 2013.

23. Invited Lecture, “Past, Present and Future of Electronics Packaging” Microelectronics

Technology, Circuits, and Systems for Space Applications Workshop

June 15-17 2015 Sabanci University Istanbul Turkey.

24. Professor C S Krishnamoorthy Memorial Lecture, Indian Institute of Technology

Madras “Computational Mechanics at Nanoscale” December 8, 2015. Madras, India.

25. Plenary Lecture ,” Graphene Nanoribbon for Power Electronics” ICAMPE Int.

Conference on Advanced Materials for Power Engineering” 11-13 December 2015,

Mahatma Gandhi University, Kottayam, Kerala, India

26. Workshop, “Mechanics of Nanoelectronics Packaging” December 5-9, 2016 Indian

Institute of Technology Madras. Sponsored by GIAN, Ministry of Human Resources

Development, and Government of India.

Conference/Workshop Papers/Abstracts/Presentations

27. "Soil-Structure Interaction Effects on Recorded Strong Ground Motion Data," the

Seventh European Conference on Earthquake Engineering September 7 - 12, 1986,

Lisbon, Portugal. Erdik, M., Basaran, C. and Guler, F.

28. "Constitutive Modeling for Thermomechanical Response of Semiconductor Chip-

Substrate Systems," the Joint ASCE-ASME-SES Meeting on Applied Mechanics in

Electronic Packaging, Charlottesville, Virginia, June 1993. Desai, C.S., Chia, J., Kundu,

T., Basaran, C., and Prince, J.

29. Unified Constitutive Modeling of Interfaces and Materials in Semiconductor Devices", in

Structural Analysis in Microelectronics and Fiber Optics, editor E. Suhir, Vol.7, 113-126,

1993, Trans. of ASME-EEP. Desai, C.S., Chia, J., Kundu, T., Basaran, C. and Prince, J.,

30. "Constitutive Modeling of Mechanical Response of Semiconductor Devices with

Emphasis on Interface Behavior," Proc. of the NSF Design and Manufacturing Systems

Cemal Basaran

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Conference, Charlotte, NC, December 1993. Desai, C.S., Chia, J., Basaran, C., Kundu, T.

and Prince, J.,

31. , "Disturbed State Constitutive Models for Thermo-Viscoplastic Behavior of Solids and

Interfaces - Computational Aspects," Invited Key Note Paper, Proc. of the III World

Congress on Computational Mechanics, Chiba, Japan, 1 - 5 August, 1994. Desai, C.S.,

Basaran, C., Chia, J. and Kundu, T.

32. "Disturbed State Concept for Cycling Behavior: Computer Implementation," Invited Key

Note Paper, Proc. of the Int. Conf. on Computational Methods in Structural and

Geotechnical Engineering, Hong Kong, December 12-14, 1994. Desai, C.S., Chia, J.,

Basaran, C., and Kundu, T.,

33. "Unified Constitutive Modeling, Testing and Computer Design of Semiconductor

Devices with Emphasis on Interface Behavior," Proc. of the National Science Foundation

Manufacturing and Industrial Innovation Conf., University of California San Diego, CA,

January 4-6, 1995 Desai, C., Kundu, T., Chia, J., Basaran, C. and Prince, J. ,

.

34. ,"Disturbed State Modeling of Materials and Interfaces and Computer Implementation,"

Invited Key Note Paper, Int. Conf. on Comp. Eng. Science, Mauna Lani, Hawaii, July 30-

August 3, 1995. Desai, C.S. and Basaran, C.

35. "A Constitutive Model for Sand,” IACMAG 94 - VIII International Conference on

Computer Methods and Advances in Geomechanics, May 22-28, 1994, Morgantown,

West Virginia.

36. “Computer Simulation of the Temperature Cycling Tests,” ASME, International

Mechanical Engineering Congress and Exposition, San Francisco, CA, Nov 12-17, 1995.

Basaran, C., Desai, C., Kundu, T. and Prince, J.

37. "A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder

Alloys," ASME, Int. Mechanical Engineering Congress and Exposition, Atlanta, GA,

November 17-22, 1996. C. Basaran

38. "An Interface Constitutive Model for Surface Mount Interconnects,” 1997 Joint

ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.

Basaran, C., and Yan, C.Y

39. "Concurrent Dynamic and Thermal Analysis of Surface Mount Solder Joints,” 1997 Joint

ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July 2, 1997.

Basaran, C. and Chandaroy, R.,"

40. "Material Nonlinear Dynamic Analysis of a Pb40/Sn60 Solder Joint,” ASME, Int.

Mechanical Engineering Congress and Exposition, Dallas, TX, November 16-21, 1997.

Basaran, C., and Chandaroy, R.

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41. "Damage Mechanics of a SMT Package Under Thermal & Dynamic Loading,” Symp. on

Mechanics of Surface Mount Assemblies, ASME, Int. Mechanical Engineering Congress

and Exposition, Dallas, TX, November, 16-21, 1997. Chandaroy, R., and Basaran, C.

42. “A Boundary Element Analysis of Multilayered Structures in Electronics Packaging,"

1997 Joint ASME/ASCE/SES Summer Meeting, Northwestern University June 29- July

2, 1997. Henry, D., Basaran, C., and Banerjee, P.K.

43. “Numerical Analysis of Stacks with Very Thin and Very Thick Layers,”13th US National

Congress of Applied Mechanics University of Florida, Gainsville, FL, June 21-June26,

1998. Basaran, C., and Zhao, Y.,”

44. "A Damage Criterion Based on Entropy for Pb40/Sn60 Solder Alloys," ASME, Int.

Mechanical Engineering Congress and Exposition, Anaheim, CA November 15-20, 1998.

Basaran, C. and Yan, C.Y.,

45. “Entropy as a Damage Metric for Fatigue Life Predictions,", 98-WA/EEP-13, ASME

publication individual paper. Basaran, C, Yan, Y., and Zhao, Y. ,”

46. "A Damage Criterion Based on Entropy,” 12th ASCE Engineering Mechanics

Conference, San Diego, CA, May 17-20, 1998. Basaran, C. and Yan, C.Y.,"

47. Influence of Grain Size and Microstructure on Dynamic Response of Solder Joints,” 98-

WA/EEP-12 ASME publication individual paper. Basaran, C., Chandaroy, R., and Zhao,

48. Thermomechanical Analysis of Solder Joints Under Concurrent and Dynamic Loading,”

ASME, Int. Mechanical Engineering Congress and Exposition, Anaheim, CA November,

15-20, 1998. Basaran, C., and Chandaroy, R.,”

49. "A Thermodynamic Framework for Determination of Solder Fatigue Life," ASME, Int.

Mechanical Engineering Congress and Exposition, Anaheim, CA November 15-20, 1998.

50. ”Mechanics of Solder Joints Under Concurrent and Dynamic Loading,”“ Int. Mechanical

Engineering Congress and Exposition, Anaheim, CA November, 15-20, 1998.

51. "Power Electronics Module Reliability," Office of Naval Research PEBB Conference,

Wilkes-Barre, PA, October 21-23, 1999.

52. ”Thermomechanical Analysis of Solder Joints Under Concurrent Dynamic and Thermal

Loading,” ASME- InterPACK ’99 International Electronic & Photonic Packaging

Conference Lahaina, Hawai’I, June 12-18, 1999. Basaran, C. and Chandaroy, R.,”

53. ”Mesh Sensitivity and FEM Modeling for Multilayered Stacks,” ASME- InterPACK ’99

International Electronic & Photonic Packaging Conference Lahaina, Hawaii, June 12-18,

1999. Basaran, C. and Zhao, Y.

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54. “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloys”, ASME, Int.

Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19,

1999. Basaran, C. and Chandaroy, R

55. ”Mechanical Behavior of BGA During Vibrations by Moiré Interferometry and FEM

Simulation,” ASME, Int. Mechanical Engineering Congress and Exposition, Nashville,

TN November 14-19, 1999. Basaran, C., and Zhao, Y.

56. “Closed Form vs. Finite Element Analysis of Laminated Stacks in Electronic Packaging,”

ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November,

14-19, 1999. Basaran, C. and Zhao, Y..

57. “Creep Behavior of BGA During Thermal Cycling by Moiré Interferometry”,

ASME/IEEE InterPACK 99 June 13-19, 1999 Maui, Hawaii. Zhao, Y., Dishongh, T.,

Cartwright, A. and Basaran, C.

58. ”A Damage Mechanics Based Interface Element for Multilayered Packages,” ASME, Int.

Mechanical Engineering Congress and Exposition, Nashville, TN November 14-19,

1999. Basaran, C., and Yan, C.Y

59. “Damage Mechanics of BGA Solder Joints under Combined Loading and Mini Temp

Cycles” Intel Corporation, Hillsboro, OR March 16, 2000.

60. ”A Constitutive Model for Pb/Sn Solder Alloys,” Surface Mount Technology Assoc.

International Assembly Technology Expo. Sept. 24-28, 2000, Rosemont, IL. Basaran, C.

and Zhao, Y

61. “A Damage Mechanics Based Constitutive Model for Pb/Sn Solder Alloy,” ASME, Int.

Mechanical Engineering Congress and Exposition, November 2000 Orlando, FL.

62. ”Influence of Minicyles on Fatigue Life,”“ASME, Int. Mechanical Engineering Congress

and Exposition, Orlando, FL, November 2000.

63. ”Inelastic Behavior of Microelectronics Solder Joints Under Concurrent Vibration and

Thermal Cycling,” Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in

Electronic Systems, Vol. II, pp. 349-355, Las Vegas, NV May 23-26, 2000. Zhao, Y.,

Dishongh, T., Cartwright, A. and Basaran, C.

64. ”Thermomechanical Behavior of BGA Solder Joints Under Vibrations; An Experimental

Observation,” Itherm 2000, VIIth Thermal and Thermomechanical Phenomena in

Electronic Systems, Vol. I, pp.174-180, Las Vegas, NV May 23-26, 2000. Zhao, Y.,

Dishongh, T., Cartwright, A. and Basaran, C.,

65. A Damage Mechanics based Approach to Fatigue Life Prediction of Electronic Packaging,

Micron Technology, Q&R Engineering, Boise, ID, May 2001.

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66. “A Moiré Interferometry Technology for Thermomechanical Fatigue Reliability of

Solder Joints”, SMTA Advanced Packaging Technologies Conference, Boston, MA June

12, 2001.

67. “Reliability of BGA Under Vibrations”, Proc. Of the Surface Mount Technology

International Conference September 30 – October 4 2001. Chicago, IL

68. “Using Moiré Interferometry for Fatigue Reliability of Solder Joints, ASME/ASCE/SES

Mechanics and Materials Conference, San Diego, CA June 26-29 2001.

69. A Moiré Interferometry Technique for Fatigue Reliability of Microelectronics Interfaces,

Inter. Mechanical Engineering Congress and Exposition, November 11, 2001, NY City,

NY.

70. “Analysis of Multilayered Electronic Packaging,” InterPACK 2001, July 8-13 Kauai,

Hawaii. Wen, Y. and Basaran, C.,”

71. ”Thermomechanical Analysis of Solder Joints using Thermodynamics,” InterPACK

2001, July 8-13 Kauai, Hawaii. Tang, H. Basaran, C. Dishongh, T. and Searls, D.

72. “Selecting Elastic Modulus for Pb/Sn Solder Joints; Is it Art or Science? ” InterPACK

2001, July 8-13 Kauai, Hawaii. Basaran, C. and Jiang, J.

73. ”Failure Modes in Power Electronic Packaging,” InterPACK 2001, July 8-13 Kauai,

Hawaii. Ye, H., Lin M. and Basaran, C.,

74. “A Constitutive Model for Eutectic Pb/Sn Solder, InterPACK 2001, July 8-13 Kauai,

Hawaii. Zhao, Y. and Basaran, C.

75. ”Evaluating Solder Joint Fatigue Reliability by Moiré Interferometry,” Advanced

Packaging Technologies in the Electronics Industry, SMTA, June 12-13, 2001 Boston,

MA, Basaran, C., Zhao, Y., Cartwright, A., Dishongh, T.

76. “Degradation of Solder Joint under Fatigue Loading,” VIIIth Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002,

San Diego, CA.

77. “”Moiré Interferometry for Microelectronics Packaging Interface Fatigue Reliability”

ManTech 2002, San Diego, April 8-11 2002, Heng, Liu, Basaran, C. Cartwright, A. and

Casey, W.

78. ”Experimental Study on Reliability of Solder Joints Under Electrical Stressing,” ICAPS,

Int. Conf. On Adv. Packag. Systems March 10-13, 2002, Reno, NV, Ye, H. Basaran, C.,

Hopkins, D.

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79. ”Experimental Characterization of Material Degradation of Solder Joint under Fatigue

Loading,” The VIIIth Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems, May 29 June1 2002, San Diego, CA. Basaran, C.

Tang, H. and Dishong, T.,”

80. “Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints”, The VIIIth Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May

29 June1 2002, San Diego, CA. Wen. Y. and Basaran, C.

81. “Reliability of Solder Joints Under Electrical Stressing, The VIIIth Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May

29 June1 2002, San Diego, CA. Ye, H., Basaran, C and Hopkins, D.

82. “Experimental Study of Failure Mechanics in Particle Filled Acrylic Composites,” VIIIth

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems, May 29 June1 2002, San Diego, CA. Nie, S., Basaran, C. and Hutchins, C.

83. “Measurement and Effects of High Electrical Current Stress in Solder Joints,”

International Microelectronics and Packaging Society, Symposium, Denver, Colorado

September 4-6, 2002. IMAPS 2002 Best Student Paper Honorable Mention. Ye, H.,

Hopkins, D., Basaran, C.

84. “A Damage Mechanics Theory without a Potential Surface” Society of Engineering

Science 39th Annual Meeting, Penn State, October 13-16, 2002.

85. “Thermo-Electro-Mechanical Reliability of Microelectronics”, Delphi-Delco Electronics

Inc., Kokomo, IN October 18, 2002.

86. “Damage Mechanics of Microelectronics Solder Joints Under High Current Density,

ASME IMECE, New Orleans, LA, November, 17-22, 2002. Ye, H., Basaran, C., and

Hopkins, D.

87. “Irreversible Thermodynamics for Damage Mechanics of Elastic-Brittle Materials,

ASME IMECE, New Orleans, LA, November, 17-22, 2002. Basaran, C., Nie, S.

88. “Experimental Damage Mechanics of Microelectronics Solder Joints, ASME IMECE,

New Orleans, LA, November, 17-22, 2002.Basaran, C, Tang, H.

89. “Implementation of a Thermodynamic Framework for Damage Mechanics of Solder

Interconnects, ASME IMECE, New Orleans, LA, November, 17-22, 2002. Basaran, C,

Tang, H.

90. “Elastic Modulus of Pb/Sn Solder Joints in Microelectronics, ASME IMECE, New

Orleans, LA, November, 17-22, 2002, Basaran, C., Jiang, J.

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91. “Microstructural Evolution in Microelectronics Solder Joints Under High Electrical

Current Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ

June 17-20 2003

92. “A Thermodynamic Model for Damage Mechanics of Solids Under High Current

Densities, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-20

2003

93. “Damage Mechanics of Particle Infilled Composites: Model and Experimental

Verification, ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June 17-

20 2003

94. “An Analytical Model for Thermomechanical Analysis of Layered Microelectronic

Packaging,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June

17-20 2003

95. “Damage Mechanics of Microelectronics Solder Joints: Modeling and Experimental

Verification,” ,” ASME, 2003 Mechanics and Materials Conference, Scottsdale, AZ June

17-20 2003

96. “Improvement on moiré interferometry with phase shifting technique and wavelet

transform image processing” ASME, 2003 Mechanics and Materials Conference,

Scottsdale, AZ June 17-20 2003.

97. “Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered

Microelectronic Packaging,” The 54th Electronic Components and Technology Conf.

June 1-4, 2004, Las Vegas, NV. Wen, Y. and Basaran, C.,”

98. “Thermodynamic Model for Electrical Current Induced Damage in Microelectronics

Solder Joints,” The 54th Electronic Components and Technology Conf. June 1-4, 2004,

Las Vegas, NV. Poster session. Basaran, C., Lin, M. and Ye, H.

99. ”Damage Mechanics of Microelectronics Solder Joints Under High Current Density,”

The 54th Electronic Components and Technology Conf. June 1-4, 2004, Las Vegas, NV.

Ye, H., Basaran. C and Hopkins, D.,

100. ”Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered

Microelectronic Packaging,” The 54th Electronic Components and Technology Conf.

June 1-4, 2004, Las Vegas, NV.

101. ”Deformation of Solder Joints Under Current Stressing: Experimental Measurement and

Numerical Simulation” 21st International Congress of Theoretical and Applied

Mechanics, August 15-21, 2004, Warsaw, Poland. Basaran, C. Ye, H. and Hopkins D.

102. ”A Damage Mechanics Based Constitutive Model for Low Cycle Fatigue Analysis,”

IMAPS Congress 2004, Anaheim, CA Gomez, J. and Basaran, C.

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103. “Measuring and Modeling the Deformation of BGA Lead-free Solder Joints under High

Current Density,”IMAPS Congress 2004, Anaheim, CA Ye, H., Basaran, C. and

Hopkins, D.C.

104. Electromigration Induced Strain Field Simulation for Microelectronic Lead Free Solder

Joints,” IMAPS Congress 2004, Anaheim, CA Lin, M. and Basaran, C.,”

105. “Failure Modes of Micro/Nano Electronics Solder Joints Under High Current Density”,

ASME International Mechanical Engineering Congress and Expo, Orlando , FL

November 6-11, 2005

106. “Modeling Deformation in Micro/Nano Electronics Solder Joints Under High Current

Density: Simulation and Testing,”, ASME International Mechanical Engineering

Congress and Expo, Orlando , FL November 6-11, 2005.

107. “Experimental Damage Mechanics of Microelectronics Solder Joints Under Fatigue

Loading,” The 55th Electronic Components and Technology Conference May 31- June 3,

2005 Lake Buena Vista, Florida Nie, S. and Basaran, C. and Tang, H.,

108. “Low Cycle Fatigue Analysis of Microelectronics Solder Joints Incorporating Damage

and Size Effects Using a Thermodynamic Based Rate Dependent Constitutive Model,”

The 55th Electronic Components and Technology Conference May 31- June 3, 2005 Lake

Buena Vista, Florida Gomez, J. and Basaran, C.

109. “Modeling Deformation in Microelectronics BGA Solder Joints Under High Current

Density: Simulation and Testing,” The 55th Electronic Components and Technology

Conference May 31- June 3, 2005 Lake Buena Vista, Florida, Basaran, C. Ye, H, and

Hopkins, D. “

110. " An Experimental Study on the influence of Filler-Matrix Interfacial Bond Strength and

Temperature in a Composite Material", XIV. National Mechanics Congress, 12-16

September 2005, Antakya, Turkey. C.Basaran, S.Nie, C.S. Hutchins ve H.Ergun,

111. “High Temperature High Density Packaging of a 60kW Converter for 200C Embedded

Operation,” IEEE Power Electronics Conference (APEX), Dallas, TX March 19-23,

2006. Hopkins, D., Kellerman, D., Wunderlich, R.,Basaran, C and Gomez, J.

112. “Electrical Current Induced Stress Analysis in Nanowires,” 15th US National Congress of

Theoretical and Applied Mechanics, Boulder, CO 25-30 June 2006. Basaran, C. and Lin,

M.

113. “Experimental Study of Thermomigration in Lead-Free nanoelectronics Solder Joints,

ASME IMECE November 5-10, 2006 Chicago, IL. Abdulhamid, M., Basaran, C.,

Hopkins, H.

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114. “Thermomigration Induced Strain Field Simulation for Microelectronics Lead-Free

Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL. Li, S., Lin., M.,

Abdulhamid, M. and Basaran, C.

115. “Length Scale in Solder Joints, ASME IMECE November 5-10, 2006 Chicago, IL,

Gomez, J. and Basaran. C.

116. “Molecular Dynamics Modeling of Grain Boundary Diffusion in Sn-Ag-Cu Solder”

AIChe Annual Meeting, Salt Lake City, Utah, November 4-9, 2007. M. S. Sellers, A. J.

Schultz, D. A. Kofke, C. Basaran.

117. “Techniques for Investigation of Solder interconnect Electromigration under Time

Varying Current Stressing, IMAPS 2007 November 13-15, 2007 San Jose CA Kevin E.

Enser, Douglas C. Hopkins, C. Basaran.

118. “Computational Simulation of Electromigration Induced Damage in Copper

Interconnects” Proc. Of the Summer Simulation Multiconference 2007, Organized by

Society for Modeling and Simulation July 14-18, 2007, San Diego, CA, 32-C. Basaran,

M. Lin and S. Li,

119. “Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading On

Electronics Packaging” Summer Simulation Multiconference 2007, Organized by Society

for Modeling and Simulation July 14-18, 2007, San Diego, CA, 32- C. Basaran, J.

Gomez, M. Lin, and S. Li ,

120. “Strain energy change due to an atomic defect in solder alloy lattice,” Summer

Simulation Multiconference 2007, Organized by Society for Modeling and Simulation

July 14-18, 2007, San Diego, CA, (Poster Session)

121. “Modeling High Current Density Induced Strain Field in Led Free Solder Joints” ASME

Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,

2007.

122. ”Atomistic Modeling of Grain Boundary Diffusion in Lead Free Solder Alloys,” ASME

Int. Mechanical Engineering Congress and Expo Seattle, Washington, November 10-15,

2007.

123. “Deterministic Calculations of Lattice Strain Due to Atomistic Defect in Solder Alloys,”

ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November

10-15, 2007

124. “Thermomigration in Lead-Free Solder Joints,” ASME Int. Mechanical Engineering

Congress and Expo Seattle, Washington, November 10-15, 2007

Cemal Basaran

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125. ”A Micromechanics Based Damage Mechanics Model for Particle Filled Composites,”

ASME Int. Mechanical Engineering Congress and Expo Seattle, Washington, November

10-15, 2007

126. “Simulating Degradation in High Density Power Electronics Packaging”,,Int. Simulation

Conference, Edinburgh, Scotland, June 16-19, 2008

127. “Molecular Dynamic Simulations of an Atom Vacancy in FCC Metal” Int. Simulation

Conference, Edinburgh, Scotland, June 16-19, 2008

128. “Simulating Low Temperature Electromigration and Thermomigration in Power

Electronics Packaging”, ,,Int. Simulation Conference, Edinburgh, Scotland, June 16-19,

2008.

129. “Low Temperature Electromigration and Thermomigration in Lead Free Solder Alloy,”

33rd Int. Electronics Manufacturing Technology Conference, Penang, Malaysia, 4-6

November, 2008 Mohd F. AbdulHamid, C. Basaran

130. ”Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints,”

ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA. C.

Basaran and Mohd F. AbdulHamid,

131. “Automatic Full Strain Field Moiré Interferometry measurement with Nanoscale

Resolution, ASME Int. Mech Engineering Congress and Expo, November 1-6, 2008,

Boston, MA.

132. “Quantitative Plane Strain Field measurement of Solder Joint under Electrical Field with

Quasi-Isothermal Condition using Automatic Moiré Interferometry,” ASME Int. Mech

Engineering Congress and Expo, November 1-6, 2008, Boston, MA

133. “Thermomigration Induced Degradation Analysis with Fully Coupled

Thermomechanical-Diffusion Equations using Nonlinear Material Properties,” ASME

Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA

134. “Thermomigration in Lead Free Solder Joints, ASME Int. Mech Engineering Congress

and Expo, November 1-6, 2008, Boston, MA

135. “Atomistic Modeling of Grain Boundary Diffusion in Sn-Ag-Cu Solder Alloys,” ASME

Int. Mech Engineering Congress and Expo, November 1-6, 2008, Boston, MA

136. “Stress Calculations in Carbon Nano Tubes” ASME Int. Mech Engineering Congress and

Expo, November 1-6, 2008, Boston, MA

137. “Multi-Scale Electromigration and Thermomigration Analysis of Nanoelectronics and

Power electronics” Semiconductor Research Corporation Summer review, Georgia Tech,

Atlanta, GA June 16-18, 2009

Cemal Basaran

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138. “Electromigration Damage Mechanics of Interconnects”, ASME/Pacific Rim Technical

Conference and Exhibition on Packaging and Integration of Electronics and Photonic

Systems, MEMS and NEMS, Inter PACK ’09, July 19-23, 2009 San Francisco, CA

C. Basaran and M. Lin

139. “An Empirical Electromigration Time to Failure Equation for Lead-Free Solder Joints”,

ASME/Pacific Rim Technical Conference and Exhibition on Packaging and Integration

of Electronics and Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23,

2009 San Francisco, CA

140. “Damage Mechanics of Carbon nano Tubes under Uniaxial Tension”, ASME/Pacific Rim

Technical Conference and Exhibition on Packaging and Integration of Electronics and

Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San Francisco,

CA C. Basaran and T. Ragab

141. “Quantum Mechanical Formulation For the Joule Heating in Single-walled Carbon

Nanotubes, ASME International Mechanical Engineering Congress and Exposition,

November 13-196, 2009, Orlando, FL

142. “Prediction of Current-induced Forces in Single-walled Carbon Nanotubes” , ASME

International Mechanical Engineering Congress and Exposition, November 13-196, 2009,

Orlando, FL

143. “An Experimental Electromigration Study on SnAgCuNi Solder Joints”, ASME

International Mechanical Engineering Congress and Exposition, November 13-196, 2009,

Orlando, FL

144. “Simulating Single Walled Carbon NanoTube Failure Under Tension”, ASME

International Mechanical Engineering Congress and Exposition, November 13-196, 2009,

Orlando, FL

145. “A Computational Damage Mechanics Model for Thermomigration”, ASME

International Mechanical Engineering Congress and Exposition, November 13-196, 2009,

Orlando, FL

146. “Full Field Joule Heating Measurement of Copper Plate using Phase Shifting Moiré

Interferometry in Microscopic Scale”, ASME International Mechanical Engineering

Congress and Exposition, November 13-19, 2009, Orlando, FL

147. “Statistical Phase shifting Step Estimation based on Continuous Wavelet Transform for

High Resolution Interferometry Metrology”, ASME International Mechanical

Engineering Congress and Exposition, November 13-196, 2009, Orlando, FL

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148. “Modeling of the Moiré Interferometer for the Applications of Nano-scale Measurement

in the Reliability Testing of the Electronic Packaging”, ASME International Mechanical

Engineering Congress and Exposition, November 13-19, 2009, Orlando, FL

149. “Atomistic Modeling of Tin Surface and Grain Boundary Diffusion”, ASME

International Mechanical Engineering Congress and Exposition, November 13-19, 2009,

Orlando, FL

150. “A Study on Stress Whitening in Thermoformed Mineral Filled Acrylics” , ASME

International Mechanical Engineering Congress and Exposition, November 13-19, 2009,

Orlando, FL

151. “Damage Mechanics of Next Generation Power Electronics”, Summer Simulation Multi-

Conference, July 11-14, 2010 Ottawa, Canada

152. “Statistical Phase Shifting Step Estimation Based on Continuous Wavelet Transform For

High resolution Interferometry Metrology,” Itherm Int. Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems Conf. 2010, Las

Vegas NV, Chen, B., Basaran, C.

153. “A Viscoplastic Model For Solder Alloys” , ASME International Mechanical

Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada,

Lee, Y., Basaran, C

154. “Electromigration Behavior of Solder under Single Pulsed Load”, ASME International

Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,

B.C., Canada

155. “The effect of Temperature on the Mechanical Behavior of Defected Single-Walled

Carbon Nanotubes Using Molecular Dynamics Simulations” , ASME International

Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,

B.C., Canada

156. “Molecular Dynamics Simulations of the Unraveling of Carbon Nanotubes due Field

Emission Forces”, ASME International Mechanical Engineering Congress and

Exposition, November 12-18, 2010, Vancouver, B.C., Canada

157. “Damage Mechanics of Electronic Packaging Solder Joints Under AC”, ASME

International Mechanical Engineering Congress and Exposition, November 12-18, 2010,

Vancouver, B.C., Canada

158. “Modeling of Moiré Interferometer for the Applications of Nano-scale Measurement in

Reliability Testing of Electronic Packaging”, ASME International Mechanical

Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada

Cemal Basaran

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159. “Near Field Multi-physics Modeling of the Moiré Interferometer for the Applications of

High Resolution for Thermomechanical Testing of Electronic Packaging” , ASME

International Mechanical Engineering Congress and Exposition, November 12-18, 2010,

Vancouver, B.C., Canada

160. “Damage Evolution in Non-Isothermal Stretching of Acrylics across Glass Transition” ,

ASME International Mechanical Engineering Congress and Exposition, November 12-18,

2010, Vancouver, B.C., Canada

161. “Non-Isothermal Stretching of Acrylics across Glass Transition” , ASME International

Mechanical Engineering Congress and Exposition, November 12-18, 2010, Vancouver,

B.C., Canada

162. “Atomistic Modeling of Copper Dopant Grain Boundary Stabilization in Tin”, ASME

International Mechanical Engineering Congress and Exposition, November 12-18, 2010,

Vancouver, B.C., Canada

163. “Theory Of Entropy Based Damage Mechanics”, ASME International Mechanical

Engineering Congress and Exposition, November 12-18, 2010, Vancouver, B.C., Canada

164. “Molecular Dynamics Simulation of Grain Boundary Structure Evolution and Self-

Diffusivity” , International Simulation Multiconference, World Forum, The Hague,

Netherlands, June 27 - 30, 2011

165. “A Multiscale Analysis Method to Connect MDS with FEA”, Society for Engineering

Sciences Annual Conference, Northwestern University October 12-14, 2011

166. “Unraveling in Field Emitter SWCNT”, Society for Engineering Sciences Annual

Conference, Northwestern University October 12-14, 2011

167. “Electromigration Analysis of Solder under Alternating Current Load”, ASME

International Mechanical Engineering Congress and Exposition, November 11-17, 2011,

Denver, CO

168. “Electromigration Analysis of Solder under Time Varying Current Load”, ASME

International Mechanical Engineering Congress and Exposition, November 11-17, 2011,

Denver, CO

169. “Modeling of Moiré Interferometer for the Applications of Nano-scale Measurement in

Reliability Testing of Electronic Packaging”, ASME International Mechanical

Engineering Congress and Exposition, November 11-17, 2011, Denver, CO

170. “Near Field Multi-physics Modeling of the Moiré Interferometer for the Applications of

High Resolution Thermomechanical Testing of Electronic Packaging”, ASME

International Mechanical Engineering Congress and Exposition, November 11-17, 2011,

Denver, CO

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171. “The Unraveling of Open-ended Double Walled Carbon Canotubes Using Molecular

Dynamics Simulations,” ASME International Mechanical Engineering Congress and

Exposition, November 11-17, 2011, Denver, CO

172. “Joule Heating in Graphene”, ASME International Mechanical Engineering Congress and

Exposition, November 11-17, 2011, Denver, CO

173. “Molecular Dynamics Simulation For Strain Rate Effects On Tin,” ASME International

Mechanical Engineering Congress and Exposition, November 11-17, 2011, Denver, CO

174. “Multi-scale Analysis For Solder Alloys”, ASME International Mechanical Engineering

Congress and Exposition, November 11-17, 2011, Denver, CO

175. “Quantum Mechanics of Electron Transport in Metallic Single Walled Carbon

Nanotubes”, ASME International Mechanical Engineering Congress and Exposition,

November 11-17, 2011, Denver, CO

176. “Joule Heating in Carbon Nanotubes”, ASME International Mechanical Engineering

Congress and Exposition, November 11-17, 2011, Denver, CO

177. “A Velocity Averaging Method for Bridging Molecular Dynamics with Finite Element

Analysis, 13th IEEE Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems, ITherm 2012, San Diego, CA May 30 - June 1, 2012

Lee, Y., “Basaran , C.

178. “Damage of SAC405 Solder Joint under Pulsed DC, 13th IEEE Intersociety Conference

on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San

Diego, CA May 30 - June 1, 2012. 166. Yao, W. , Basaran, C.

179. “Skin Effect and Material Degradation of Lead‐free Solder Joint under AC, 13th IEEE

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems, ITherm 2012, San Diego, CA May 30 - June 1, 2012.

180. “Review of Joule heating in graphene nano‐ribbon”, The 13th IEEE Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,

ITherm 2012, San Diego, CA May 30 - June 1, 2012. Chu, Y., Basaran, C., Chu, Y.

Ragab, T

181. , “Modeling Joule Heating in Carbon Nanotubes with Monte Carlo Simulation,” The 13th

IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, ITherm 2012, San Diego, CA May 30 - June 1, 2012. Ragab, T. , and

Basaran, C.

182. “Joule Heating in Graphene” ASME IMECE 2012, November 9-15, 2012 Houston TX

Chu, Y., Basaran, C., Chu, Y. Ragab, T

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183. “Multi-Scale Electro-Thermo-Mechanical Hot Phonon Analysis of Carbon Nanotubes for

Power Electronics Applications “ASME IMECE 2012, November 9-15, 2012 Houston

TX Gautreau, P. Basaran, C.,. Ragab, T

184. “Electromigration Mean Time to Failure of Lead-free Solder Joint under AC “ASME

IMECE 2012, November 9-15, 2012 Houston TX Basaran, C. Yao, W.

185. “Electromigration Analysis of Solder Joints under AC Load: a Mean Time to Failure

Model “ASME IMECE 2012, November 9-15, 2012 Houston TX Basaran, C. Yao, W.

186. “Uniaxial tension of graphene nanoribbon” ASME IMECE 2012, November 9-15, 2012

Houston TX Yao, Ragab, T. , Basaran, C.

187. “Hot Phonons Influence on the Scattering Rates and Joule Heating of Carbon Nanotubes

for Power Electronics Applications “ASME IMECE 2012, November 9-15, 2012

Houston TX Gautreau, P. Ragab, T. Basaran, C.

188. “Edge scattering effects on Joule heating and wind force in graphene nanoribbon”

Chu, Y. and Basaran, C., Society for Engineering Science, 50 th Annual Meeting,

Brown University, RI, July 28-31, 2013

189. Influence of phonon-phonon interactions on the Joule heating of metallic single

walled carbon nanotubes,” Gautreau, P., Chu, Y. and Basaran, C. , Society for

Engineering Science, 50th Annual Meeting, Brown University, RI, July 28-31, 2013

190. “Influence of phonon-phonon interactions on the Joule heating of metallic single walled

carbon nanotubes” ASME IMECE 2013, November 15-21, 2013 San Diego, CA

Gautreau, P., Ragab, T. Basaran, C.

191. “Multi-scale analysis at finite temperature using a weighted averaging momentum

method” Lee, Y. and Basaran, C. ASME IMECE 2013, November 15-21, 2013 San

Diego, CA Lee, Y., Basaran, C.

192. “Modelling the Mechanical Molecular Unravelling in Carbon Nanotubes during Field

Emission”, ASME IMECE 2013, November 15-21, 2013 San Diego, CA Ragab, T. and

Basaran, C.

193. “Multi-physics Damage of Flip-chip Package under Pulse Current Loading “ASME

IMECE 2013, November 15-21, 2013 San Diego, CA Yao, W. and Basaran, C.

194. “Electromigration Analysis of Solder Joints under Alternating Current Load: a

Theoretical Procedure “,ASME IMECE 2013, November 15-21, 2013 San Diego, CA

Yao, W. and Basaran, C.

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195. “Effect of Ni addition on beta-Sn Grain Boundary Diffusivity “, ASME IMECE 2013,

November 15-21, 2013 San Diego, CA Lee, Y., Basaran, C.

196. “Effects of edge scattering on Joule heating and wind force in graphene nanoribbon” ,

Chu, Y. and Basaran, C. ASME IMECE 2013, November 15-21, 2013 San Diego, CA

197. “Phonon-phonon interactions in metallic single walled carbon nanotubes” Gautreau, P.,

Ragab, T. Basaran, C., ASME IMECE 2013, November 15-21, 2013 San Diego, CA

198. “The Strain Dependence of Electronic Transport in carbon nanotubes for Flexible

Electronics,” Gautreau, P. and Basaran, C. 2014 US National Congress of Theoretical

and Applied Mechanics, Michigan State University, June 15-20, 2014 East Lansing , MI

199. “Mechanical properties of Chiral Graphene Nanoribbon with and without Hydrogen

Passivation,” Chu, Y., Ragab, T. Basaran, C. 2014 US National Congress of Theoretical

and Applied Mechanics, Michigan State University, June 15-20, 2014 East Lansing , MI

200. “Using Entropy Production Rate as a Metric for a Universal Damage Model B” 2nd

International Conference on Damage Mechanics (ICDM2) University of Technology of

Troyes (France), from 8 to 11 July 2015.

201. “Experimental Verification of a Thermodynamic Fatigue Life Prediction Model” 2nd

International Conference on Damage Mechanics (ICDM2) University of Technology of

Troyes (France), from 8 to 11 July 2015.

202. “Strain tuning of phonon dispersion relations in Single Walled Carbon Nanotubes” 2016

MRS Spring Meeting & Exhibit March 28-April 1, 2016 Phoenix, AZ

203. Effect of Single Vacancy Defects on the Mechanical Behavior of Graphene Nano

Ribbons, Society for Engineering Sciences 53rd Annual Meeting, College Park, MD,

October 2- 5, 2016

204. “Mechanics Unravelling in Armchair and Zigzag Graphene Nanoribbons”, Society for

Engineering Sciences 53rd Annual Meeting, College Park, MD, October 2- 5, 2016

205. “Temperature dependence of Joule heating in Zigzag Graphene Nanoribbon”, Society for

Engineering Sciences 53rd Annual Meeting, College Park, MD, October 2- 5, 2016

206. “Effect of Stone-Wales Defects on the Mechanical Behavior of Graphene Nano Ribbons”

Society for Engineering Sciences 53rd Annual Meeting, College Park, MD, October 2- 5,

2016

207. “Electron-phonon Scattering Rates and Joule Heating in Copper at Extreme Low

Temperatures” ASME IMECE November 11-17, 2016 Phoenix AZ.

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208. “Influence of Defects on Graphene Nano Ribbon Properties” ASME IMECE November

11-17, 2016 Phoenix AZ.

209. “The Size Effect in Graphene Nanoribbon”, ASME IMECE November 11-17, 2016

Phoenix AZ.

210. “Unraveling Properties in Graphene Nano Ribbon”, ASME IMECE November 11-17,

2016 Phoenix AZ.

211. “Temperature dependence of Joule heating in Zigzag Graphene Nanoribbon” ASME

IMECE November 11-17, 2016 Phoenix AZ.

212. “Fatigue Life Prediction Model Using Entropy as a Damage Metric”, ASME IMECE

November 11-17, 2016 Phoenix AZ.

213. “Effect of Stone-Wales Defects on the Mechanical Behavior of Graphene Nano

Ribbons”, ASME IMECE November 11-17, 2016 Phoenix AZ.

214. Panel Session: Thermal Management Challenges in Energy Conversion & Conservation,

“Eliminating Joule Heating”, ASME IMECE November 11-17, 2016 Phoenix AZ.

Professional Affiliations

Fellow, American Society of Mechanical Engineers

Member, IEEE

Member, IEEE Components, Packaging and Manufacturing Technology Society

Assoc. Member, American Society of Civil Engineers

Technical Reviewer For

Nature

Acta Materialia

Journal of the Mechanics and Physics of Solids

Philosophical Magazine

Mechanics of Materials

Geophysical Journal International

Engineering Fracture Mechanics

Experimental Mechanics

Materials Science and Engineering A

International Journal of Solids & Structures

International Journal of Damage Mechanics

International Journal for Numerical Methods in Engineering

International Journal of Mechanical Sciences

Journal of Engineering Mechanics, Trans. Of ASCE

Journal of Electronic Packaging, Trans. Of ASME

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Journal of Comp. Pack. Manuf. Tech. Part A, Trans. Of IEEE

Journal of Advanced Packaging, Trans. Of IEEE

Journal of Electronic Materials

Mechanics Research Communication

Journal of Alloys and Compounds

Microelectronics Reliability

Engineering Fracture Mechanics

Fatigue and Fracture of Engineering Materials and Structures

AWS, Welding Journal

Prentice Hall, Engineering Text Books.

Physics. Status Solidi B

Journal of Composites : A

Proceedings of the Royal Society: A

International Journal of Reliability and Safety

Materials Chemistry and Physics

ASCE J of Nanomechanics and Micromechanics

Intermetallics

International Professional Service

Proposal Reviewer for The Deutsche Forschungsgemeinschaft (DFG) German Research

Foundation Kennedyallee 40 53175 Bonn March 15, 2016

2015 ASME InterPack Achievement Award selection committee. ASME International

Technical Conference and Exhibition on Packaging and Integration of Electronic and

Photonic Microsystems (InterPACK) July 6-9 2015 San Francisco, CA

Senior Advisor to the Chancellor, University of Tabuk System, Kingdom of Saudi

Arabia, October 2009 – June 2005. Responsible for establishing the new university

system (50, 000 students) according to US accreditation standards.

Proposal Reviewer for The Austrian Research Promotion Agency (FFG) COMET

(Competence Centres for Excellent Technologies) Austrian Ministry for Transport,

Innovation and Technology (BMVIT) and the Ministry of Economic Affairs and Labour

(BMWA) November 2013

Expert Advisor to Canada Foundation for Innovation for $65 million microelectronics

and photonics research infrastructure grants, September 13-14, 2001, Toronto, Canada.

Proposal Reviewer for Northern Ireland, UK Higher Education Authority, North South

Research Program, June 2003,

Proposal Reviewer Hong Kong Science and Technology Commission, Research Grants

Council, May 2000, March 2003, October 2005, February 2009, October 2013.

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Proposal Reviewer for, Science Foundation Ireland, Republic of Ireland, February 2004.

Reviewer, Chateaubriand Fellowship, French Embassy, Office for Science and

Technology, March 2007

Proposal Reviewer, U.S. State Department, International Science and Technology Center,

Nonproliferation Program for non-weapons opportunities for scientists and engineers in

the New Independent States (NIS) of the former Soviet Union, January 2008.

Proposal Reviewer for Department of Defense SERDP Weapons Systems and Platforms

program, April 2009.

University and Community Service

Dept. of Civil, Structural and Environmental Engineering

Member, Materials Faculty Search Committee, Spring 2014

Chair, Teaching Laboratories Committee, 2013/2014 - present

Director of Graduate Studies, July 2004 –July 2007.

Chair, Dept. of CSEE Computer Committee, March 2003 - September 2004.

Member, Construction Engineering Faculty Search Committee, 2000-2001.

Member, Structures Faculty Search Committee, 1999-2000.

Coordinator, Geotechnical Division Master of Engineering Program, 1996-1997, 1997-

1998.

Member, Graduate Studies Committee, 1995-1999, 2002-present

Member, Master of Engineering Committee, 1997-1998.

Coordinator, Geotechnical and Computational Mechanics Divisions Graduate

Admissions, 1996-1997, 1997-1998, 1998-1999.

Member, Computer Committee, 1995 to 2004.

Member, Geotechnical Faculty Search Committee, Spring 1996.

Coordinator, Dept. of Civil Engineering Weekly Seminar Series, Spring 1996.

Faculty Advisor, Civil Engineering Dept. Graduate Student Association, 1996 to present.

Freshmen Academic Advisor to SEAS Students 2000- present

Member, Structural Mechanics Faculty Search Committee, 1998-1999.

Faculty mentor, mentoring one junior faculty member, Prof. Aref. 1999-2002.

Coordinator, Dept. of Civil Engineering Computational Simulation Group Weekly

Seminar Coordinator, Spring 2004

School of Engineering and Applied Sciences

Director, Electronic Packaging Laboratory, 1997-present.

National Society of Black Engineers UB chapter Volunteer, Oratorical Contest Judge,

Fall 1996.

Advisor and host for NSF- SUNY Alliance for Minority Participation Research

Internship Program. Mr. Emanuel St. Pierre, Summer 1997.

Member, Provost Advisory Committee for Doubling Research Dollars at UB, 2000.

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BEAM/SEAS Honors Research Summer Program Faculty Advisor since 1996-present

University at Buffalo

Member, SUNY Faculty Senate, Ethics and Institutional Integrity Committee, 2016-

2017.

Senator, SUNY-Wide Faculty Senate 2015-2016, 2016-2019. Representing University at

Buffalo Academic Core Units.

Member, Faculty Senate Executive Committee, 2004-2005, 2005-2006.

Member, Schaumburg Minority Graduate Fellowship Review Committee, Spring 2005

Senator, University at Buffalo, Faculty Senate, July 1, 2004 – June 30, 2006.

Alternate Senator, University at Buffalo, Faculty Senate 1998-1999, 2003-2004.

SUNY Alliance for Graduate Education and Professoriate NSF Grant Advisory

Committee Member, 2000-2004

National Level Service

1. Member, ASME Electronic Packaging Division, 1995 to present.

2. Member, American Society of Mechanical Engineers, Electrical & Electronic Packaging

Division, Manufacturing Subcommittee 11/1995-11/1996.

3. Vice-Chair, Session EEP-11: Stress/Strain Modeling in Microelectronics, ASME

International Mechanical Engineering Winter Annual Congress & Exposition, November

12-17, 1995.

4. Chair, session on Applications of FEM and BEM to Electronic Packaging 1997

Joint ASME/ASCE/SES Meeting June 29 - July 2, 1997 Northwestern University,

Evanston, IL

5. Chair, Track 3/ Session 3.2 Modeling of Solder Solidification and Fatigue, ASME

InterPACK Conference Maui, Hawaii, June 13-17, 1999.

6. Member, ASME Materials and Applied Mechanics Divisions Joint Constitutive Modeling

Executive Committee 1999 to present.

7. Invited Panelist, National Science Foundation- SUNY Alliance for Minority Participation

Minority Graduate School Awareness Conference, Buffalo, NY, October 11, 1997, and

October 30, 1999 and October 14, 2000. November 2002.

8. National Science Foundation CAREER Award Panel, 1999, 2000.

9. National Science Foundation, Unsolicited Proposal Reviewer, 2000.

10. Chair, Symposium on Plasticity at Small Scale for Emerging Technologies, ASME Int.

Congress and Exposition, November 5-10, 2000 Orlando, FL.

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11. Chair, Symposium on Advances in Applied Mechanics for New Technologies,

International Mechanical Engineering Congress and Exposition November 12-16, 2001,

NY City, NY

12. Chair, session on Failure Mechanics,” VIIIth Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems, May 29 June1 2002, San Diego,

CA.

13. Chair, Symposium (8 sessions) on Recent Advances Damage Mechanics, ASME,

International Congress and Expo, November, 18-22, 2002, New Orleans, LA.

14. Lead Reviewer & Panelist, NSF, Division of Materials Research, Major Research

Instrumentation (MRI) infrastructure funding program, May 7- 8, 2003,

15. Panel Chair, NSF, Division of DMII Materials Processing and Manufacturing Program,

Unsolicited Proposals, December 15, 2003.

16. Chair, Symposium on Reliability, Electronics Packaging Division, ASME International

Mechanical Engineering Congress and Expo, Orlando , FL November 6-11, 2005

17. NSF, Panelist, Division of DMII Materials Processing and Manufacturing Program

Unsolicited Proposals, January 10, 2006.

18. Chair, Session on Mechanics of Next generation Nanoelectronics and Power Electronics,

15th US National Congress of Theoretical and Applied Mechanics, Boulder, CO 25-30

June 2006.

19. Chair, Session on Mechanical Behavior of Joints, 10th Int. Conf. On the Mechanical

Behavior of Materials, Busan, Korea, May 27-30 2007.

20. External faculty mentor, Prof. Rashid Abu Al-Rub, Zachary Dept. of Civil Engineering,

Texas A&M University, College Station, TX

21. Topic Co-Organizer, Symposium on Multi-Physics Issues in Electronic/Photonic

Packaging, Symposium Quality and Reliability of Electronic/Photonic Packaging,

Symposium Organizer on Multi-Scale Constitutive Modeling, ASME Int. Mechanical

Engineering Congress and Exposition, October 31- November 6, 2008, Boston, MA

22. Chair, Session on Packaging Reliability I and Failure Mechanisms-II, ASME/Pacific Rim

Technical Conference and Exhibition on Packaging and Integration of Electronics and

Photonic Systems, MEMS and NEMS, InterPACK ’09, July 19-23, 2009 San Francisco,

CA

23. Chair, Symposium on Atomistic Level Modeling, ASME ASME International

Mechanical Engineering Congress and Exposition 2009

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24. Co-Chair, ASME International Mechanical Engineering Congress and Exposition 2010

Electronic & Photonic Packaging Track Co-Chair, Vancouver, Canada

25. Chair, ASME International Mechanical Engineering Congress and Exposition 2011

Electronic & Photonic Packaging Track, Denver, Colorado, November 11-17, 2011

26. Session Chair, MT3- Microscale and Nanoscale Mechanics, 13th IEEE Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,

ITherm 2012, San Diego, CA May 30 - June 1, 2012.

27. InterPACK Award Committee Member April 2013.

28. Chair, Symposium on Multi-Scale Analysis of Graphene and Carbon Nanotubes, 2014

US National Congress of Theoretical and Applied Mechanics, Michigan State

University, June 15-20, 2014 East Lansing , MI

29. Session Organizer/Chair, Symposium on Nanomechanics and Nanomaterials, ASME

IMECE November 11-17/2016 Phoenix, AZ

Community Service

1- Volunteer Interpreter and Translator at the International Institute of Buffalo, which is a

nonprofit organization providing assistance to refugees, and new immigrants.

2- Volunteer Consultant Civil Engineer "Westfield Cooperative Farm" Construction, 1996.

3- Volunteer 4-H Leader Cornell Cooperative Extension in Chautauqua County, 1997, 1998.

4- Volunteer Speaker at Albion Central Schools, 2002.

5- Vice-President, Empower Orleans December 2006 – February 2008

6- Chairman, Orleans County Legislature’s Citizens Advisory Board, August 2008 – August

2009

Professional Experience (industry)

Cygna Energy Services, Boston, MA

Staff Engineer 6/1988-1/1992.

Group leader for structural analysis.

Started the computer aided design tradition by initiating the use of MathCAD and

AutoCAD for designing nuclear pipe supports and steel structures. Initiated the tradition

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of using Databases for power plant structural component inventory control. Trained

engineers on using finite element packages.

Worked as a consultant structural engineer in the nuclear industry. Some of the

consulting projects undertaken are;

1- Toledo Edison's Davis Besse Nuclear Station, seismic analysis of piping systems, ( 6

months in 1991)

2- New York Consolidated Edison's Indian Point 2, seismic analysis for snubber reduction

effort for the auxiliary coolant lines, (3 months in 1990)

3- Boston Edison Pilgrim Nuclear Power Plant Unit 1 Independent Design Review of the

main steam piping stress analysis, (2 months in 1988)

4- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of the demineralized

water transfer and storage piping system (4 months in 1990)

5- Yankee Rowe Nuclear Station, seismic analysis of bleed drain piping system. (4 months,

in 1989)

6- California Transportation Authority' (CALTRANS), seismic analysis and evaluation of

the Interstate 280 Highway China Basin section (San Francisco) viaduct soil-structure

system. (4 months in 1990)

7- CALTRANS, parametric study of finite element modeling of the two level elevated

highways for seismic analysis. (3 months in 1989)

8- Toledo Edison Davis-Besse Nuclear Power Plant, station blackout diesel generator

building, equipment, piping and pipe supports seismic analysis. (4 months in 1991)

9- Grand Gulf Nuclear Power Station, Drywell Valve Handling crane seismic analysis. (2

months in 1988)

10- Toledo Edison's Davis-Besse Nuclear Power Plant, seismic analysis of existing/new pipe

support associated with auxiliary and main steam cooling piping systems. (3 months in

1989)

11- System Energy Resources Grand Gulf Nuclear Power Plant Unit 1, standby service water

piping nonstandard pipe supports and penetrations load reconciliation/evaluation

project.(2 months in 1988)

12- Boston Edison Pilgrim Nuclear Power Station, TIP room platform seismic analysis.(2

months in 1988)

13- System Energy Resources, Grand Gulf Nuclear Station Unit-1, the seismic design of

instrument air system filter station.(3 months in 1989)

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14- System Energy Resources Grand Gulf Nuclear Power Station Unit-1, seismic analysis. (3

months in 1991)

15- Boston Edison's Pilgrim Nuclear Station, finite element analysis of the main steam

piping gangways.(2 months in 1988)

16- Tennessee Valley Authority’s Browns Ferry Nuclear Power Plant for motor control

center enclosure design and seismic analysis. (2 months in 1989)

Workshops and Institutes Attended

American Society for Engineering Education, The National Effective Teaching Institute,

Milwaukee, WI, June 12-14, 1997.

American Society for Engineering Education/National Science Foundation Visiting

Scholars Effective Teaching Workshop, Buffalo, NY, February, 16 & 17, April 27 1998.

Power Electronics Packaging, University at Buffalo, SUNY, May 17, 2007