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Japan300mm SemiconductorTechnology Conference

INTERNATIONAL300 mmINITIATIVE

CIM Global Joint Guidancefor

300 mm Semiconductor Factories

Release Five

ISMT and J300EApril 2000

Version 5.0

Page iii

TABLE OF CONTENTS

PREFACE ............................................................................................................................ v

INTRODUCTION ......................................................................................................................... 1PURPOSE .................................................................................................................... 1HISTORY ..................................................................................................................... 2PHASING STRATEGY..................................................................................................... 3

DEFINITIONS ............................................................................................................................ 4

REQUIREMENTS ON IC MANUFACTURERS...................................................................... 5MIGRATION TO LARGER WAFERS SIZES ......................................................................... 5OPTIMIZATION.............................................................................................................. 6

GUIDELINES FOR SUPPLIERS AND SEMI ........................................................................ 10

HISTORY OF RELEASES ........................................................................................................ 10

GUIDELINE OVERVIEW ........................................................................................................ 11

CIM GUIDELINES .................................................................................................................... 131. PRODUCTION EQUIPMENT GUIDELINES ................................................................... 132. LOADPORT GUIDELINES......................................................................................... 173. PRODUCTION EQUIPMENT MATERIAL HANDLING GUIDELINES.................................... 234. PRODUCTION EQUIPMENT MATERIAL MANAGEMENT GUIDELINES.............................. 295. PRODUCTION EQUIPMENT SINGLE WAFER CONTROL GUIDELINES............................. 336. AMHS EQUIPMENT GUIDELINES ............................................................................ 347. FACTORY SYSTEMS GUIDELINES............................................................................ 35

APPENDIX A – REFERENCED SEMI STANDARDS .......................................................... 39SEMI EQUIPMENT AUTOMATION SOFTWARE STANDARDS ............................................. 39SEMI EQUIPMENT AUTOMATION HARDWARE STANDARDS............................................. 39SEMI FACILITIES AND SAFETY STANDARDS ................................................................. 40DRAFT DOCUMENTS ................................................................................................... 40

APPENDIX B – CONTACT INFORMATION........................................................................ 41J300E CIM PLANNING GROUP ................................................................................... 41INTERNATIONAL SEMATECH CIM STUDY GROUP....................................................... 41

APPENDIX C – GLOSSARY .................................................................................................... 42

APPENDIX D – CARRIER TYPES.......................................................................................... 45

APPENDIX E – PRODUCTION EQUIPMENT TYPES........................................................ 46

APPENDIX F – MATERIAL HANDLING EQUIPMENT LIST .......................................... 47

APPENDIX G – PROCESSING START ORDER CONTROL FOR EQUIPMENTBUFFER .......................................................................................................... 51

Page iv

TABLE OF FIGURES

Figure 1. Joint Guidance Target............................................................................................. 1

Figure 2. History of I300I and J300 Interactions ................................................................... 2

Figure 3. How Standards Benefit Manufacturing................................................................... 5

Figure 4. Equipment Output Improves When Idle Time is Eliminated ................................... 7

Figure 5. Single Communication Link .................................................................................. 13

Figure 6. Interface Between Production Equipment and AMHS Equipment........................ 17

Figure 7. Interoperable PGV Example ................................................................................. 18

Figure 8. Carrier Sensors at E15.1 Loadport....................................................................... 19

Figure 9. Carrier ID Reader Timing and Locations............................................................. 21

Figure 10. Exclusive Access Mode.......................................................................................... 23

Figure 11. Example of Access Mode Switch Timing............................................................... 23

Figure 12. Example of the Equivalent Handshaking Sequence .............................................. 24

Figure 13. Example of Independent Control of Material Handling and Processing ofEquipment.............................................................................................................. 25

Figure 14. An Interruption of the Existing Process Queue of a Two Loadport TypeEquipment.............................................................................................................. 26

Figure 15. Example of the Carrier Move Out Sequence......................................................... 27

Figure 16. Slot Number Assignment ....................................................................................... 29

Figure 17. Loadport Number Assignment............................................................................... 29

Figure 18. Carrier Slot Verification ....................................................................................... 30

Figure 20. Slot and Carrier Integrity Exception Handling..................................................... 31

Figure 21. Additional Wafer Control after Processing or Measurement ............................... 32

Figure 22. Process Program or Recipe Change Between Wafers .......................................... 33

Figure 23. Process Parameter Change Between Wafers........................................................ 33

Figure 24. Interoperability of Different Types of AMHS........................................................ 34

Figure D1 Front Opening Unified Pod................................................................................... 45

Figure D2 Open Cassette........................................................................................................ 45

Figure E1 Production Equipment Type Examples (Overhead View)..................................... 46

Figure F1 Intrabay MHS........................................................................................................ 48

Figure F2 Person Rail Guided Vehicle without Electrical Assist .......................................... 48

Figure G1 An Example of Interruption of the Existing Process Queue of a ThreeLoadport Type Equipment..................................................................................... 51

Figure G2 An Example of Interruption of the Existing Process Queue of an InternalBuffer Type Equipment.......................................................................................... 51

Page v

Preface

July 1998

Computer Integrated Manufacturing (CIM) has improved the use of manufacturing assets by controllingproduct flow and information in semiconductor device fabrication. In 300 mm wafer factories, AutomatedMaterial Handling Systems (AMHS) will be required to support both ergonomic issues and greaterefficiency in manufacturing. Achieving this improved productivity requires that CIM be an integratingelement in a broad overall system.

Phase 1 CIM Global Joint Guidance addressed this need by providing information from I300I and J300on how the communications interfaces between fab equipment and AMHS must work with the physicalinterfaces already described in the Global Joint Guidance for 300 mm Semiconductor Factories.

Phase 2 CIM Global Joint Guidance expands the communications interfaces between the equipment andthe factory host to allow for more efficient handling of carriers and wafers. By defining the capabilityrequirements of an integrated system and its components, standards that support end-user needs will beavailable for early system development. The cooperation among I300I, J300, and SEMI continues to drivethe implementation of 300 mm with this further guidance to developers of standards, equipment, andfactory systems.

Frank RobertsonVice President and General Manager

Acting Chief Operating OfficerAustin, Texas SEMATECH

Factory automation is the key issue for realizing cost-effective semiconductor devices through highly-productive 300 mm wafer factories. The combination of efficient equipment together with productiveCIM systems and automatic material handling systems plays a significant role in achieving the goal.However, because the cost of developing such systems is increasing because of the complexity of thesystems needed, standardization is an essential way to solve the problem.

The first step toward standardization was the establishment of a set of global guidelines forsemiconductor factories. Since then, J300 has been working in conjunction with I300I on a one-yearproject since August 1997 to produce a consensus of standard items based on CIM system requirementsfrom semiconductor manufacturers. In addition to the first report, the second summarizes the standarditems related to interfaces and advanced capabilities of AMHS and equipment. Our goal is to establish anew direction by focusing the global activities for standardization. This will prompt SEMI to realizetimely development of international standards.

Toshiaki Masuhara(Hitachi, Ltd.)

ChairpersonTokyo, Japan The Japan 300 mm Semiconductor Technology Conference

Introduction

This document was assembled by the International 300 mm Initiative (I300I) and Japan 300 mmSemiconductor Technology Conference (J300) consortia for the purpose of providing jointconsensus guidelines for and to semiconductor industries and silicon suppliers. This guidance islimited to joint (agreed to) expectations the member semiconductor device companies of theseconsortia have for suppliers in the area of manufacturing equipment and support systems. Thisdocument extends the existing joint consensus guidelines into computer integratedmanufacturing (CIM) and complements those guidelines published for carriers, equipmentconfiguration, equipment operation, and facilities. These CIM guidelines are designed tointegrate automation software systems with other key factory capabilities to ensure that theindustry fully realizes potential 300 mm productivity benefits.

Purpose

MARKETand

BUSINESS

SUPPLIERS

STANDARDS

IC FABSCONSENSUSGUIDANCE

(RECOMMENDATIONS)

REQUIREMENTS

FULFILLMENT - Products

RESPONSE - Equipment - Materials - Services

USERSPEC

REFERENCEDocuments

IC COMPANY INTERNALREQUIREMENTS

Revenue

Revenue

Figure 1. Joint Guidance Target

History

April–June, 1997I300I CIM Study Group

Study of CIM AMHS Items for

April–June, 1997J300 CIM Planning Group

Study of CIM AMHS Items for

I300I CIM GuidelinesRev. 0

J300 Planning GroupReport

July 17, 1997 – J300 Proposal to I300I for Joint work on CIM AMHS

August 18, September 12, 1997 – I300I/J300 Video Conference; Agreement to Develop Phase-I

September–November, 1997 – Several I300I/J300 Guidance Development Meetings; Agreement on

Final Approval ofPhase-I CIM Joint Guideance

December 2, 1997 – Publish CIM Global Joint Guidance for Phase-I in Japan (Tokyo Hall)

December 3, 1997 – I300I/J300 Face-to-Face Meeting; Agreement to Develop Phase-II

January–June, 1998 – Several I300I/J300 Guideline Development Meetings; Agreement on

Final Approval ofPhase-II CIM Joint Guideance

July 14, 1998 – Publish CIM Global Joint Guidance for Phase-II in US (SEMICON)July 23, 1998 – Publish CIM Global Joint Guidance for Phase-II in Japan (Tojo)

July 17, 1998 – I300I/J300 Face-to-Face Meeting; Agreement to Develop Phase-III

July–December, 1998 – Several I300I/J300 Guideline Development Meetings; Agreement on

Final Approval ofPhase-III CIM Joint Guidance

December 1, 1998 – Publish CIM Global Joint Guidance for Phase-III in Japan (Tojo)

December 1998 – I300I/J300 Face-to-Face Meetings; Agreement to Develop Phase-IV

December, 1998–June, 1999 – Several I300I/J300 Guideline Development Meetings; Agreement on Phase-IV

Final Approval ofPhase-IV CIM Joint Guidance

Figure 2. History of I300I and J300 Interactions

Phasing Strategy

The overall IC factory control system was too large and complex to address all guidance needs in1997. However, guidance was required in several areas as soon a possible to have a constructiveimpact on the industry. The approach adopted by the I300I CIM Study Group and J300 CIMWorking Group was to first establish consensus on the CIM areas directly affected by and at thegreatest risk for the 300 mm conversion. This need has helped to prioritize and sequenceactivities and produced a multi-phase strategy to CIM guidance development.

The first phase of activities was focused on standardizing interfaces, driven by the increasedautomation required for 300 mm semiconductor processing. Standards and guidelines for Phase 1deal with interfaces for AMHS and production equipment. These interfaces include electrical,mechanical, and communications/control. Areas were defined for SEMI standards development.Development of the intrabay scanning electron microscope (SEM) began at this time. The secondphase of activities was also focused on standardizing interfaces, driven again by the increasedautomation required for 300 mm semiconductor processing. Standards and guidelines for Phase 2also dealt with interfaces for AMHS and production equipment. These interfaces include manualmaterial handling, production equipment carrier handling, and production equipment wafer levelcontrol. Areas were defined for SEMI standards development. Development for severalstandards began at this time.

The third phase of guidance development began in June 1998. Phase 3 focused on SEMIstandardization, AMHS framework guidelines, guideline compliance test plan development, andstandards integration into a 300 mm factory. The intrabay SEM standard was accepted at theSEMICON Japan meeting in December of 1998.

Phase 4 began in December of 1998. Phase 4 concentrated on SEMI standardization, factorysystems guidelines, guideline compliance test plan development, and standards integration into a300 mm factory.

In 1999, I300I completed its charter and the CIM Study Group continued under the 300 mmprogram in International SEMATECH (ISMT). The J300 CIM Working Group was limited toJapanese IC manufacturers and became J300E. The ISMT and J300E CIM Study Groupscontinued development of phase 5 guidance for production equipment performance andmanagement and AMHS performance information.

Definitions

The following key words are used in this document with very specific meanings:

Requirements Business drivers that determine what the device manufacturing companiesmust accomplish in their operations to meet cost and technology goals.

Guidelines Statements that define device companies’ intended and/or projectedconfigurations and modes of operations for factories and equipment.

Standards Voluntary technical agreement between suppliers and customers to ensurecompatibility and interoperability of goods and services to reduce overallcost.

Note 1: It is the responsibility of the user of this document to be aware ofcurrent version(s) of referenced SEMI Standards.

Note 2: This document refers to certain preferred standards and optionsthat support the required capabilities for 300 mm factories. Otherstandards and options may also exist.

References Other readily available documents and statements containing additionalinformation regarding the subject. Does not necessarily imply authority ofthese documents and statements.

Recommendations Preferred approaches for design consideration, but supplier may proposeequivalent or better design or approach.

Note that this section is the same as in the original Global Joint Guidance documentpublished in July 1997.

Requirements on IC Manufacturers

The next two sections describe the shared requirements on J300 and I300I IC manufacturers.These requirements are in terms of business drivers for IC manufacturers as defined above. Theyfall into several categories, but are primarily divided between what is required for ICmanufacturers to migrate to larger wafer sizes and what is required to optimize the factory.

Migration to Larger Wafers Sizes

Historically, IC manufacturers have migrated to larger wafer sizes to gain productivityimprovements. As they transition to larger silicon wafers, they must meet the following keyrequirements to receive the needed gain from the investment and strategic risks involved.

1. Decrease Cost/cm2

For an IC manufacturer to remain continuously competitive, the cost per unit area ofmanufacturing semiconductor devices must decrease continuously. It is the expectation of all ICmakers that a wafer size increase will result in a reduction in cost/cm2 of silicon. To achieve this,the equipment and factory costs should not increase as much as the wafer area increases, and theequipment throughput (or output) in wafers/hour should be equal to or greater than the previouswafer size generation.

2. Learn from Past Conversions

2.1 Early standardization reduces options which suppliers must develop and support.

See Figure 3 below.

ProcessEquipment Metrology

Equipment

Intrabay Vehicleinterfaces & standards

ada a;;ldkaaddd’;ad’adkd;da[

Wafer & Carrierstandards

Operator interface& stds to CIM systems

Intrabay Vehiclesafety stds

Utility interfaces &stds

Chemical and Gasinterfaces & stdsExhaust

interfaces & stds

Drainsinterfacestandards

Interbaytransportstandards

Operatorinterface toEquipment

stds

Standards for safety countermeasures:(Gases, Chemicals, and Fire)

Lot IDstandard

Cleanroom floor interface stds

Cleanroom wallsinterface stds

Cleanroom

Maintenance & sparesstds

Facilities &Hook-up stds

Cleanroom standards:• Environment:• Temp, humidity• Equipment height• Max weight, size• Others ..

Stocker

Overhead Transport (OHT)interface standards

Protection from Earthquake & Glitchesi.e., power, exhaust, compressed air, process and cooling water, etc.

Figure 3. How Standards Benefit Manufacturing

2.2 First 300 mm pilot line production equipment set should have full production levelmaturity.

This eliminates the need for IC manufacturers to upgrade or replace equipment when going from300 mm startup phase to full volume production.

3. International Participation is Essential

3.1 Participation from the international IC semiconductor industry is essential ingiving clear, uniform, and global direction to equipment suppliers. This synergywill minimize the number of different options that equipment makers have todevelop and test, reduce development cost and time, and provide equipment to theIC manufacturers at the right time.

Optimization

Every IC manufacturer must optimize various resources and costs according to their individualbusiness direction or strategy.

The principle of optimization applies at all levels (i.e., equipment, factory, business principles,etc.). Therefore, the process of optimization demands balancing several parameters. This requiressome parameters to be increased while others must be decreased, which forms a structure for thefollowing requirements. Therefore, IC manufacturers must do the following (4–23).

4. Increase Investment Effectiveness

4.1 A fab shall be upgradeable to produce the next generation technology withminimum introduction of new equipment and with minimum impact to layout andmaterial logistics.

4.2 Capital outlay shall be optimized with respect to increasing production capacityrequirements and be commensurate with market growth during the ramp to fullvolume production.

5. Increase Equipment Utilization

In general, IC manufacturers will desire to continually increase the equipment utilization andreduce processing delay that results from queuing in their factories to increase the return on theequipment and other factory resource investment. The key requirement is to maximize factoryproductivity. This may require balancing the cost of ownership (COO) of constraint equipmentagainst the equipment utilization of the non-constraint equipment. Therefore, these non-constraint equipment may not require additional buffering beyond the two standard loadports(see Figure 4).

6. Increase Uninterrupted Production

The amount of factory output is generally proportional to the amount of uninterrupted productiontime. This is similar to equipment utilization in that the IC manufacturer will desire to maximizethe investment placed in the equipment and factory. This can be accomplished when the factoryis able to run with the highest production support systems and equipment reliability available(see Figure 4).

Time

Time

Lot 1 Lot 2 Lot 3 Lot 4

Lot 1 Lot 2 Lot 3 Lot 4

Time delay before2nd lot starts

No time delay

Improvement

WithoutContinuousProcessing

WithContinuousProcessing

Lot 5

Figure 4. Equipment Output Improves When Idle Time is Eliminated

7. Increase Factory OutputIn a volume market, an IC manufacturer will need to produce as much good product as possible.The factory output required to meet the market demand is critical for a company to maintainprofitability and market share. This is accomplished through meeting the following threerequirements.

7.1 Increase Throughput

Increase the quantity of wafers that can be processed through the factory in a given time period.

7.2 Increase Wafer Yield

Increase the percentage of wafers that successfully complete the processing route.

7.3 Increase Die Yield

Increase the percentage of good die produced on each wafer.

8. Increase Yield LearningThe rate at which the factory acquires knowledge about the process/technology during theprocess development and ongoing problem solving must be increased to allow for fasterincreases in both yield and throughput.

9. Increase Control of Factory Logistics and Production SchedulingWith the increased demand for IC products and the ever faster changes in the market place, afactory’s speed and flexibility are key to meeting the market at the right time. For IC factories toaccomplish this, they must have increased control over the operations (logistics) and productionschedules.

10. Increase Die per WaferIncreased demand for IC products require IC manufacturers to produce greater quantities ofproduct at a reduced cost while increasing the complexity of the chip. This increased complexityrequires larger die sizes at least initially. One of the largest leverages to accomplish both of theserequirements is to increase the number of die that can be manufactured on a wafer.

11. Increase Worker Productivity and Product Safety

11.1 Ergonomics

The weight of twenty-five 300 mm diameter wafers plus a front opening unified pod (FOUP)carrier is approximately 8 kg. This is difficult for humans to repeatedly lift and carry. Because ofthis ergonomic limitation, 300 mm factories will require essentially automated or mechanizedcarrier handling.

11.2 Product Safety

The value of twenty-five 300 mm diameter processed wafers could exceed $1,000,000 (U.S.).Because of this high value, 300 mm factories will require precision controlled and highly reliableautomated carrier handling.

11.3 Factory Automation

The technological solution to increasing productivity while addressing the above ergonomicissues is to provide an increase in factory automation both in wafer and carrier handling.

12. Decrease Time to Volume ProductionTo meet the ever faster market changes and demands, a factory rampup time to full volumeproduction must be decreased.

13. Decrease Equipment Installation/Start-up Time and CostTo support faster factory ramps, equipment installation and startup time must be decreased.

14. Decrease Operational CostFor an IC factory to maintain profitability, the ongoing operational cost must continue todecrease as the products’ market value continues to decline.

15. Decrease Inventory (work-in-process and final product)A factory must reduce its risks and liabilities associated with work in process (WIP) inventory inthe line and final product waiting at the backdoor.

16. Decrease Factory FootprintThe footprint of a factory directly corresponds to several costs (i.e., building capital costs andassociated depreciation, operational facilities costs in clean air supply, temperature and humiditycontrol, etc.). To control costs, the cleanroom space of a factory should be reduced as much aspossible while maintaining a balance between demand for output and costs. This reduction canbe realized by increasing the throughput of each equipment set while maintaining or reducing thefootprint, allowing for more throughput per factory footprint.

17. Decrease Equipment Costs

The cost of equipment versus the equipment throughput, both in initial capital cost andoperational costs, can directly impact the available profit a product can provide. Theseequipment costs must be reduced on a per-wafers-processed per hour basis.

18. Decrease Cost to Configure Equipment

Flexibility is a key requirement for factories to maintain cost effectiveness. The cost to configureequipment to a variety of processing situations must be reduced to maintain this flexibility.

19. Decrease Material Consumption

To reduce the cost of IC manufacturing, the level of material (i.e., silicon, chemicals, gases, andliquids) consumed by the processing equipment must be continually reduced per wafersprocessed per hour.

20. Decrease Turnaround Time

The time for a wafer to travel through and complete all process steps in a route depends on theindividual processing time required at each equipment, plus material logistics (e.g., scheduling,staging, handling, etc.) and equipment idle time. To optimize the use of equipment, people, andother resources and to reduce response time to the market and customers, this turnaround timemust be continually decreased.

21. Decrease Lead Time from Order to Equipment Delivery

The time for an equipment to arrive from the time it is ordered must be reduced to decrease thetime it takes an IC manufacturer to ramp a factory to full production level. Equipment deliverytime should also be reduced to less that the time it takes to build a factory.

22. Address Safety and Ergonomics

IC manufacturers must provide a safe fab working environment. This includes providingequipment and procedures for operators and process and maintenance personnel that areengineered for safety and ergonomics.

23. Address Environmental Issues

IC manufacturers must design factories and processes such that they do not impact theenvironment. This includes not only controlling, but continually reducing the amount of effluentand wastes released into the environment.

Note that this section is the same as the original Global Joint Guidance document published in July 1997.

Guidelines for Suppliers and SEMI

The following section lists CIM guidelines from IC manufacturers to their suppliers and requestsfor SEMI standards development. For each guideline, the relevant REQUIREMENTS on the ICmanufacturers (listed in the previous section) are noted. These indicate the driving forces for theguideline. Related SEMI and other standards are listed under the STANDARDS heading.Additional information on the guideline topic (from the perspective of each group) is listed asREFERENCES.

History of ReleasesThe first release of the CIM Global Joint Guidance for 300 mm Semiconductor Factoriescontained 14 guidelines, number C1 through C14.

Release 2 contained 18 new guidelines and modifications to three of the first release guidelines.The guidelines were reorganized into topical areas.

Release 3 contains two new guidelines.

Release 4 added a new section: Section 7, Factory Systems guidelines. The AMHS frameworkguideline (guideline 6.2) was moved to this section and is now guideline 7.1. In addition, twoother factory systems guidelines were added. A third new guideline was added to the productionequipment guidelines. The document was also updated to reflect changes to the referenced SEMIdocuments.

Release 5 adds three new guidelines, 1.8, 1.9, and 6.2, and renumbers the Section 7 guidelines tomatch the numbering scheme used elsewhere. New terms from the new sections were added tothe glossary, and all references to standards were updated. E99 was added as a referencedstandard in 2.6, 2.7, and 2.8.

The following convention is used to indicate revisions to the current release of CIM guidelines:

[NEW] New guidelines in the current release

Summary of Guideline Revisions in this Release

Guideline Title

1.8 Production Equipment Performance by Type1.9 Actual Processing Time

6.2 AMHS Equipment Performance Information7.1 → 7.1 Factory Systems

7.1 → 7.2 AMHS Framework7.2 → 7.3 Production Equipment Integration

7.3 → 7.4 Scheduler/Dispatcher

Guideline Overview

The phase 2 Global Joint Guidelines have focused on the coordination of carrier and individualwafer handling within 300 mm production equipment. The guidelines have been organized intocategories to facilitate clearer understanding of how the guidelines interrelate. Taken as a whole,the phase 1 and 2 guidelines are categorized below.

One should use this document as a way to understand what needs to be designed into 300 mmproduction and AMHS equipment. Further, specific standards must be developed to standardizeequipment implementations and optimize the construction and operation of 300 mm factories. Itis suggested that the reader first go through the individual guidelines in a specific category tocomprehend the scope of the category. The reader should then revisit the individual guidelines tounderstand the individual guidelines in detail. We have attempted to place these guidelines in anorder that presents concepts and terminology in stepwise building blocks.

1. PRODUCTION EQUIPMENT GUIDELINES

1.1 SINGLE COMMUNICATION LINK

1.2 COMPLIANCE TO COMMUNICATION STANDARDS

1.3 UTILIZATION AND RELIABILITY MANAGEMENT

1.4 RELIABLE DATA COLLECTION

1.5 VARIABLE PARAMETER SUPPORT

1.6 FAULT-FREE DATE TRANSITIONS (i.e., YEAR 2000)

1.7 MECHANICAL DRY RUN

1.8 [NEW] PRODUCTION EQUIPMENT PERFORMANCE BY TYPE

1.9 [NEW] ACTUAL PROCESSING TIME

2. LOADPORT GUIDELINES

2.1 BI-DIRECTIONAL LOADPORT

2.2 INTERFACE BETWEEN PRODUCTION EQUIPMENT AND AMHS EQUIPMENT

2.3 CARRIER HANDOFF INTERFACE ENHANCEMENT

2.4 PGV (PERSON GUIDED VEHICLE) DOCKING STANDARD

2.5 CARRIER SENSORS AT E15.1 LOADPORT

2.6 CARRIER ID READER AT E15.1 LOADPORT

2.7 CARRIER ID READER FOR INTERNAL BUFFER EQUIPMENT

2.8 CARRIER ID READER FOR FIXED BUFFER EQUIPMENT

2.9 LOADPORT BACKWARD COMPATIBILITY

3. PRODUCTION EQUIPMENT MATERIAL HANDLING GUIDELINES

3.1 EXCLUSIVE ACCESS MODE AND MODE CHANGE TIMING

3.2 EQUIVALENT HANDSHAKING FOR CARRIER HANDOFF

3.3 SOFTWARE-BASED INTERLOCKING TO PREVENT SIMULTANEOUS OHT AND PGV OPERATION

3.4 INDEPENDENT CONTROL OF MATERIAL HANDLING AND WAFER PROCESSING

3.5 PROCESSING ORDER CONTROL FOR EQUIPMENT BUFFER

3.6 CARRIER TRANSFER CONTROL OF INTERNAL BUFFER EQUIPMENT

3.7 INTERNAL BUFFER CAPACITY NOTIFICATION

3.8 FOUP OPEN AND CLOSE NOTIFICATION

4. PRODUCTION EQUIPMENT MATERIAL MANAGEMENT GUIDELINES

4.1 SLOT NUMBER AND LOADPORT NUMBER ASSIGNMENT

4.2 EMPTY CARRIER MANAGEMENT

4.3 CARRIER SLOT VERIFICATION

4.4 HOST CONTROL OF WAFER PROCESS ORDER

4.5 SLOT AND CARRIER INTEGRITY

4.6 ADDITIONAL WAFER CONTROL AFTER PROCESSING OR MEASUREMENT

4.7 MULTI-MODULE WAFER TRACKING EVENTS

5. PRODUCTION EQUIPMENT SINGLE WAFER CONTROL GUIDELINES

5.1 RECIPE AND VARIABLE PARAMETER CHANGE BETWEEN WAFERS

5.2 PROCESS PARAMETER CHANGE BETWEEN WAFERS

6. AMHS EQUIPMENT GUIDELINES

6.1 INTEROPERABLE AMHS EQUIPMENT (INTERBAY AND INTRABAY]

6.2 [NEW] AMHS EQUIPMENT PERFORMANCE INFORMATION

7. FACTORY SYSTEMS GUIDELINES

7.1 FACTORY SYSTEMS

7.2 AMHS FRAMEWORK

7.3 PRODUCTION EQUIPMENT INTEGRATION

7.4 SCHEDULER/DISPATCHER

CIM Guidelines

1. Production Equipment Guidelines

1.1 Single Communication Link

A single physical communication connection must link the production equipment to the host. Asingle physical communication connection means that the Equipment Front End Module (EFEM)is integrated through the production equipment rather than connected directly to the host.

The supplier must provide hardware on the equipment to connect to the factory Local AreaNetwork (LAN) per IC manufacturer’s requirement. This communication connection mustcomply with HSMS protocol and be able to transmit and receive all SECS-II messages.

REQUIREMENTS: 9. Increase Control of Factory Logistics and Production Scheduling11.3 Factory Automation

STANDARDS: SEMI E5, E37, E37.1

REFERENCES: I300I Factory Guideline 2.13

RECOMMENDATIONS: Goal is for equipment suppliers to deliver and support fully integratedequipment with a single communication link to the host

Host

ProductionEquipment

HSMS/SECS-II

Equipment Controller

Single EquipmentCommunicationConnection to Host

E15.1 LoadPort(s)

PIOInterface

CarrierOpener

InternalBuffer

Carrier IDReader

EFEM

EFEM = Equipment Front End Module

Figure 5. Single Communication Link

1.2 Compliance to Communication Standards

Production equipment must comply with the Semiconductor Equipment CommunicationsStandard 2 (SECS-II) standard messages to communicate with the host. Production equipmentmust also use standard state models for control and data processing. Automation softwareproducts must comply with these same standard messages and state models when communicatingwith and controlling production equipment. High speed messaging services (HSMS) singlesession mode is a minimum requirement.

REQUIREMENTS: 3. International Participation is Essential9. Increase Control of Factory Logistics and Production Scheduling11.3 Factory Automation

STANDARDS: SEMI E5, E30, E37, E37.1


RECOMMENDATIONS: Process equipment should be fully (100%) GEM capable. Metrologyequipment should be fully GEM capable with the exception of TraceData Collection and Limits Monitoring.

1.3 Utilization and Reliability Management

Production equipment must communicate utilization and reliability data to host systems usingstandard messages and state models. This is required to enhance data collection and analysis ofequipment performance.

REQUIREMENTS: 5. Increase Equipment Utilization17. Decrease Equipment Costs

STANDARDS: SEMI E10, E58, and E58.1.

REFERENCES: Not Applicable

1.4 Reliable Data Collection

Data collected by production equipment must be time-stamped at the time of collection and notat the time of transmission.

REQUIREMENTS: 3. International Participation is Essential11.3 Factory Automation

STANDARDS: SEMI E5, E30. .


RECOMMENDATION: The collection of the data should not interfere with the equipment’sprocessing capability. Equipment with Trace Data Collection shouldsupport collection of data on deterministic time intervals

1.5 Variable Parameter Support

Production equipment must support variable parameters sent by the host or set from the operatorinterface.


STANDARDS: SEMI E5, E42. Action required for SEMI to review existing standardsand modify or supplement as required.


NOTE: Variable parameter addressed here is the one in recipe.

1.6 Fault-Free Date Transitions (i.e., Year 2000)

Production and AMHS equipment must be capable of fault-free performance in processing dateand date-related data in the 20th and 21st centuries. An example of this correct date managementis fault-free processing for the year 2000 date transition.

REQUIREMENTS: 2. Learn from Past Conversions

STANDARDS: SEMI E5


1.7 Mechanical Dry Run

Production equipment must support the capability to perform a mechanical dry run that allowsthe material handling and software capabilities of the equipment to be exercised withoutrequiring full facilities hookups and without changing the physical state of the wafers.Environmental control subsystems should not be affected by a mechanical dry run, and processconsumables are not used.

REQUIREMENTS: 8. Increase Yield Learning9. Increase Control of Factory Logistics and Production Scheduling;11.3 Factory Automation21. Decrease Lead Time from Order to Equipment Delivery

STANDARDS: Action may be required for SEMI to develop a new standard.

REFERENCE: CIM Global Joint Guidance For 300 mm Semiconductor Factories

RECOMMENDATION: No process-driven functions, hardware or software will be tested duringa mechanical dry run. However, it should be possible to test the softwareby simulating the equipment’s process. Mechanical dry run should beimplemented as a special recipe or separate class of recipe. The suppliershould document the method used for each type of equipment.Environmental subsystems include vacuum, nitrogen purge, and particledetection.

1.8 [NEW] Production Equipment Performance by Type

To precisely monitor and manage the production equipment performance, accurate and detailedproduction equipment performance information should be formally defined by equipment typeand standardized.

REQUIREMENTS 3. International Participation is Essential5. Increase Equipment Utilization11.3 Factory Automation

STANDARDS: SEMI E10, E58, E58.1, E79, Doc 2825

Action may be required for SEMI to review existing standards andmodify or supplement as required.

REFERENCE: CIM GJG

Note: production equipment type may need to be defined according to the structure of equipmentsuch as multi-module type, in-line type, internal buffer type, and fixed buffer type. Majorcomponents of EFEM must be monitored including load ports and internal buffers.

1.9 [NEW] Actual Processing Time

To analyze and improve processing capability and throughput, actual processing time ofproduction equipment should be monitored automatically. To realize this requirement, actualprocessing status and non-processing status of production equipment should be formally definedand standardized.

REQUIREMENTS 3. International Participation is Essential5. Increase Equipment Utilization5. Increase Equipment Utilization11.3 Factory Automation

STANDARDS: SEMI E10

Action may be required for SEMI to develop new standards.

REFERENCE: CIM GJG 1.8.

2. Loadport Guidelines

2.1 Bi-directional Loadport

The E15.1 loadport must be bi-directional for loading and unloading carriers at both fixed bufferand internal buffer production equipment.

REQUIREMENTS: 11.3 Factory Automation

STANDARDS: SEMI E1.9, E15.1, E47.1, E57, E84


2.2 Interface between Production Equipment and AMHS Equipment

Production equipment must include an interface to communicate directly with automatedmaterial handling systems (AMHS) equipment. This communication handshake will helpfacilitate safe carrier transfer between production and AMHS equipment.

REQUIREMENTS: 3. International Participation is Essential11.2 Product Safety11.3 Factory Automation

STANDARDS: SEMI E84


RECOMMENDATIONS: Infrared is preferred; however, IC manufacturers will specify tosuppliers whether infrared or wire link is required.

NOTE: Use of SEMI E23 and E84 are currently under review by SEMI due topotential issues with patents held by Texas Instruments.

POD

300 mm OverheadMono-rail Vehicle (OHV)

Ceiling

Raised Floor

Bay wall orEquipment side

Equipment(Side View)

SEMI E84Infra-red device(Location for OHV)

SEMI E84Infra-red device(Location for AGV/RGV)

Floorrunning

AGV/RGV

300 mm Automated or RailGuided Vehicle (AGV/RGV)

Wiring toEquipment

Figure 6. Interface Between Production Equipment and AMHS Equipment

2.3 Carrier Handoff Interface Enhancement

Production equipment and AMHS equipment must allow both continuous and simultaneoushandoff (see Appendix C for further definition) of up to two carriers at load ports and allowrecovery from time-outs and handoff errors.


STANDARDS: SEMI E84

2.4 Person Guided Vehicle (PGV) Docking Standard

Any PGV must be able to dock mechanically at any standard-compliant loadport through astandard PGV docking interface.


STANDARDS: SEMI E1.9, E15.1, E47.1, E57, E62, E64, E83.

Equipment(Side View)

PGV fromSupplier A

PG

V fr

omS

up

plie

r B

SEMI E64Cart Docking Interface

SEMI E47.1 E57 E62 E1.9FOUP Specifications

SEMI E15.1300mm Loadport

A standard is required to allowPGV’s from different suppliers todock at the same or any E15.1loadport

Figure 7. Interoperable PGV Example

2.5 Carrier Sensors at E15.1 Loadport

Carrier presence and placement sensors, integrated to the equipment control system, must belocated at each E15.1 loadport to indicate whether or not a carrier is in the port area and properlyplaced, respectively. These sensors must be logically and physically independent of each other.They must also have externally viewable light-emitting diodes (LEDs) that are turned on whenthe carrier is present and properly placed. These sensors should be integrated to facilitate safecarrier transfer between production equipment and AMHS equipment.

REQUIREMENTS : 11.3 Factory Automation

STANDARDS: SEMI E1.9, E15.1, E47.1, E57, E84.

REFERENCES: I300I Factory Guideline #4

Equipment body

2

Externally viewableLED’s show status ofpresence andplacement sensors

Separate placementand presence sensorsto detect FOUP’s onload ports

E15.1 Load Port

Figure 8. Carrier Sensors at E15.1 Loadport

2.6 Carrier ID Reader at E15.1 Loadport

There must be a carrier ID reader at each E15.1 loadport. The ID reader type (infrared [IR], barcode, radio frequency [RF], etc.) will be determined by the IC manufacturer. The carrier ID mustbe in a standard location on the carrier. A standard exclusion zone on the E15.1 loadport must bedefined for the carrier ID reader. ID data must be communicated through the equipment’s singlecommunication connection per CIM GJG 1.1.

REQUIREMENTS: 11.2 Product Safety11.3 Factory Automation

STANDARDS: SEMI E1.9, E15.1, E47.1, E87, E99.


2.7 Carrier ID Reader for Internal Buffer Equipment

Internal buffer production equipment must support the capability to read the carrier ID at theload/unload position on the E15.1 loadport. Carrier ID writing must be supported by internalbuffer equipment at all internal front-opening interface mechanical standard (FIMS) portlocations. While writing data to an ID tag, the carrier must be physically locked relative to theread/write device. Read/write functions must be outside of handoff transactions.


STANDARDS: SEMI E15.1. E87.

REFERENCES: CIM Global Joint Guidance for 300 mm Semiconductor Factories[Release Two] Guideline 2.6

NOTE: To realize desired flexibility, IC manufacturers may require the option ofusing writeable identification tags on product carriers. IC manufacturerswill select which carrier ID read/write system, if any, will be used.

2.8 Carrier ID Reader for Fixed Buffer Equipment

IC manufacturers will use either read-only or read/write carrier ID technologies based onoperational requirements. The carrier must be located at a different position on the loadportduring an ID operation depending on the technology used.

When read-only carrier ID is specified, fixed buffer equipment must support the capability toread the carrier ID at the load/unload position on the E15.1 loadport. When the read/write carrierID is specified, fixed buffer equipment must support the capability to read/write the carrier ID atthe FIMS position on the E15.1 loadport. While data is being written to an ID tag, the carriermust be physically locked relative to the read/write device.


STANDARDS: SEMI E15.1, E87, E99. Carrier ID read and write should be done outsideof E84 transactions.

REFERENCES: CIM Global Joint Guidance For 300 mm Semiconductor Factories[Release Two] Guidelines 2.6 and 2.7

RECOMMENDATION: Read/Write and Read only ID devices should mount in the sameexclusion zone on an E15.1 Loadport. Loadport, carrier, and ID read andwrite device suppliers should be involved in the standards development.

NOTE: This Guideline should not impact current Loadport delivery schedules.First Loadport deliveries, therefore, may be accepted with read only andread/write carrier ID capabilities when the carrier is at either theLoad/Unload or the FIMS position.

ReadRead and/or Write Position

Side

Vie

wT

op V

iew

Fixed Load Twist Load Internal Buffer

LoadPosition

Tool

FIMS

ReadOnly

Options for load ports:

Read Here forInternal Buffer

Read & Write Herefor Internal BufferRead & Write Here

Read

Figure 9. Carrier ID Reader Timing and Locations

2.9 Loadport Backward Compatibility

Production equipment suppliers are encouraged to implement innovative ways to minimize thequantity of loadports carried as spares with the objective of reducing overall equipment andfactory costs of ownership.

REQUIREMENTS: 14. Decrease Operational Cost

STANDARDS: SEMI E15.1

RECOMMENDATION: Providing new loadports that have standardized backward compatibilitywith earlier generations and ensuring quick change-out is one approachto meet this guideline’s objective.

NOTE: Production equipment suppliers are responsible to provide the equipmentwith the same quick maintainability as the independent type loadportseven if it has an integrated loadport type front end. Production equipmentsuppliers are not required to achieve backward compatibility through theuse of only one type of third-party loadport for all future generations ofequipment.

3. Production Equipment Material Handling Guidelines

3.1 Exclusive Access Mode and Mode Change Timing

Production equipment must accept only one access mode (RGV/AGV/OHT or PGV/operator) ata time and allow the access mode to change at any time except during carrier handoff. The modeshall be applied by equipment, and not by individual loadports, and the production equipmentmust reject all requests other than requests within the accepted mode. Production equipment thathas physically separated loadport groups must allow different access modes for the differentloadport groups.

REQUIREMENTS: 11.2 Product Safety11.3 Factory Automation22. Address Safety and Ergonomics

STANDARDS: SEMI E87

REFERENCE: CIM Global Joint Guidance For 300 mm Semiconductor Factories[Release Two] Guideline 3.3

NOTE: Access mode includes both automatic access mode and manual accessmode. Carrier handoff is the period in which carrier is being transferredbetween production equipment and AMHS or PGV/operator. Individualloadports that are non-operational must not affect the operation of otherloadports on the equipment.

PGV

OHT

PGV

OHTPGV Mode

OHT Mode

Figure 10. Exclusive Access Mode

OHT Transfer Mode PGV Transfer Mode OHT Transfer Mode

• OHT Delivery OK• PGV Delivery Not Allowed• Switch to PGV Mode OK

• PGV Delivery Not Allowed• Switch to PGV Mode Not Allowed

• PGV Delivery OK• OHT Delivery Not Allowed• Switch to OHT Mode OK

PGVHandoff

• OHT Delivery Not Allowed• Switch to OHT Mode Not Allowed

• OHT Delivery OK• PGV Delivery Not Allowed• Switch to PGV Mode OK

OHTHandoff

Switch to PGV Mode Switch to OHT Mode

Figure 11. Example of Access Mode Switch Timing

3.2 Equivalent Handshaking for Carrier Handoff

Switching between manual access mode and automatic access mode must be smooth and manualcarrier handoff must be safe. Production equipment must have the capability of handshakingduring manual carrier handoff in a manner similar to automated handoff. In the manualhandshaking procedure, the equipment must provide a simple input method of manual handoffcompletion.

REQUIREMENTS: 11.2 Product Safety11.3 Factory Automation22. Address Safety and Ergonomics

STANDARDS: SEMI E84, E87, S2

REFERENCE: CIM Global Joint Guidance For 300 mm Semiconductor Factories[Release Two] Guideline 3.3

NOTE: Manual Access Mode is the mode for PGV or operator access.

Automatic Access Mode is the mode for AMHS (OHT/AGV/RGV).

AMHS OperatorEquip. EquipHOSTLoad Complete - E84

Carrier ID

Cmd

Start

Complete

Unload Complete - E84

Carrier ID

Cmd

Start

Complete

Load Complete - Manual

Unload Complete - Manual

Figure 12. Example of the Equivalent Handshaking Sequence

3.3 Software-Based Interlocking to Prevent Simultaneous OHT and PGV Operation

A software-based interlock between the PGV/operator handling and OHT equipment must existto prevent simultaneous access of the same loadport to enhance human safety and preventproduct damage. Production equipment and stockers should comprehend the access mode anddecide whether it should be accessed by the OHT or PGV/operator handling. Based on thedecision, the production equipment and stockers must reject all other requests other than theauthorized mode.

REQUIREMENTS : 11.3 Factory Automation22. Address Safety and Ergonomics

STANDARDS: SEMI E84, E87, S2


RECOMMENDATIONS: The method of software-based interlocking should be standardized tomake interface and operation common across all production equipmentand stockers.

3.4 Independent Control of Material Handling and Wafer Processing

Effective manufacturing in 300 mm factories requires the use of AMHS delivery to productionequipment even when the production equipment is operated by the operator. Therefore,production equipment must support automated and manual material handling interactionsindependent of wafer processing and measurement operations.

REQUIREMENTS: 11.3 Factory Automation12. Decrease Time to Volume Production

STANDARDS: Action required for SEMI to develop new standard to implement thisguideline.

REFERENCE: Not Applicable

RECOMMENDATIONS: To avoid collisions between carriers delivered manually and carriersbeing output to the E15.1 loadport by the equipment, an interlock methodmust be developed.

HOST

AMHSManualOperation

Console

AGVOHTRGV

Equipment

ProcessPart

Equip. Controller

Lo

ad P

ort

Figure 13. Example of Independent Control of Material Handling and Processingof Equipment

3.5 Processing Order Control for Equipment Buffer

The order of processing for a carrier or batch in the equipment buffer is independent of the orderof its delivery. Production equipment must be able to set and change the order of processing asdirected by the host and the operator interface. Equipment must always maintain the associationbetween a carrier or batch and its processing instructions. This capability is especially importantfor supporting quick turnaround time (QTAT) for a hot lot by putting it at the top of the order.

REQUIREMENTS: 5. Increase Equipment Utilization9. Increase Control of Factory Logistics and Production Scheduling20. Decrease Turnaround Time

STANDARDS: SEMI E5, E94.


NOTE: The default processing order is first-in, first-out (FIFO) based on theorder of delivery of processing instructions by the host to the equipment.

Start HoldHold

NextIncomingHot Lot

OutgoingCompleted

InProcessing

Next

IncomingHot

NextHot

OutgoingCompleted

Hold

Skip

Hold

Queue

Figure 14. An Interruption of the Existing Process Queue of a Two Loadport TypeEquipment

3.6 Carrier Transfer Control of Internal Buffer Equipment

To achieve consistent carrier handling within internal buffer equipment, standard carrierhandling commands (sent from the host to the equipment) must be supported by the equipment.When the equipment’s carrier handling is controlled by the host,

a) Carrier movement must be controlled by using these commands.

b) Carrier movement between the internal buffer and the loadport must remain under hostcontrol until further specified by the host or from operator interface.


STANDARDS: SEMI E5, E87.


RECOMMENDATION: When changing from host control of carrier handling to operatorcontrol, privileged command is recommended

Process Completion (4 carrier IDs)

Carrier-out Command (2 carrier IDs)

Unload request (first carrier)

Unload request (second carrier)

Equipment

Unload the first carrierUnload the first carrier

Unload the second carrierUnload the second carrier

Host

Repeat Twice

Carrier-out: Move carrier(s) from the internal buffer to the loadport(s)Carrier-in: Move carrier(s) from the loadport(s) into internal bufferLoad: Put a carrier on the loadportUnload: Take away a carrier from the loadportLoad Request: Message that equipment sends to host when loadport has become

available for loading.Unload Request: Message that equipment sends to host when loadport has become

available for unloading

Figure 15. Example of the Carrier Move Out Sequence

3.7 Internal Buffer Capacity Notification

Internal Buffer Equipment must report the available buffer capacity to the host whenever theavailable capacity changes and when requested by the host.


STANDARDS: SEMI E5, E87


3.8 FOUP Open and Close Notification

Production equipment that supports the FOUP must control the FOUP opening and closing andhave the capability to send corresponding event notification to the host through standard eventmessages. This does not apply to equipment that supports open cassette carrier interfaces only.

REQUIREMENTS: 5. Increase Equipment Utilization11.2 Product Safety11.3 Factory Automation

STANDARDS: SEMI E5, E37, E37.1, E87


4. Production Equipment Material Management Guidelines

4.1 Slot Number and Loadport Number Assignment

A slot number for each carrier must be assigned incrementally from the bottom, starting with“1.” Loadport number must be assigned incrementally from the left facing to equipment front,starting with “1.”


STANDARDS: SEMI E1.9, E15.1, E87


Wafer #1

Wafer #25

25 FOUP

Figure 16. Slot Number Assignment

Equipment body

2

Port Numbers startingat the left from 1 andincreasing to the right

Port #1

Port #2

1 n

Figure 17. Loadport Number Assignment

4.2 Empty Carrier Management

All carriers that are at the E15.1 loadport or within an internal buffer must be managed by theproduction equipment. The production equipment is responsible for managing and storing theempty carrier while its associated wafers are being processed.


STANDARDS: Not Applicable


4.3 Carrier Slot Verification

Prior to processing wafers, production equipment must have the capability to detect which slotswithin a carrier have wafers. This information is used to verify the carrier/slot map.




Wafer detection

Pre-Processing

Processing

Post-Processing

Figure 18. Carrier Slot Verification

4.4 Host Control of Wafer Process Order

Single wafer production equipment must be able to process some or all of the wafers in a carrieras specified by both the host and the operator interface. Single wafer process equipment must beable to process wafers based on an order specified by both the host and the operator interface.

REQUIREMENTS: 3. International Participation is Essential8. Increase Yield Learning9. Increase Control of Factory Logistics and Production Scheduling11.3 Factory Automation


REFERENCES: I300I Factory Guideline 2.8, 2.13

Slot No.

ProcessSequence

25...321

8...21216

Sampling operation for Inspection/MeasurementSpecifying wafer processing sequence

Figure 19. Host Control of Wafer Process Order

4.5 Slot and Carrier Integrity

Production equipment must have the minimum capability of loading wafers to and from the sameslot in the same carrier to maintain wafer slot-to-slot integrity. If slot integrity is lost, theequipment must send an event message to the host. Wafer sorters or equipment that splits lotsinto multiple carriers by design are an exception to the slot-to-slot and carrier integrity.

REQUIREMENTS: 9. Increase Control of Factory Logistics and Production Scheduling

STANDARDS: Action required for SEMI to develop new standard to implement thisguideline.


Event Notification

Pre-Processing

Processing

Post-Processing

Figure 20. Slot and Carrier Integrity Exception Handling

4.6 Additional Wafer Control after Processing or Measurement

In addition to the minimum slot and carrier integrity capability, specific single wafer productionequipment must be able to output wafers to a specific slot in a specific carrier different than theone from which it was taken.

REQUIREMENTS: 3. International Participation is Essential5. Increase Equipment Utilization9. Increase Control of Factory Logistics and Production Scheduling11.3 Factory Automation


REFERENCES: I300I Factory Guidelines 2.8, 2.13

NOTE: Typically the destination carrier will be present at a loadport differentfrom the originator carrier. The primary equipment affected by thisguideline includes, 2-port metrology, litho track, plasma etch, chemical-mechanical planarization (CMP), single wafer clean, electrical-test/prober, and wafer sorters.

Pre-processing

Processing

Post-processing

LOADPORT 1

LOADPORT 1

LOADPORT 2

Figure 21. Additional Wafer Control after Processing or Measurement

4.7 Multi-Module Wafer Tracking Events

Multi-module single wafer processing equipment must track the movement of each waferthrough the modules and report this information to the host. The equipment must be capable ofassociating data collected at a module with the wafer being processed at that module.


STANDARDS: SEMI E5, E37, E37.1, E90.


5. Production Equipment Single Wafer Control Guidelines

5.1 Recipe and Variable Parameter Change Between Wafers

300 mm manufacturing requires wafer level process control and management for higherproduction efficiency, development speed, and fine process control. To realize this requirementwith cost effectiveness, single wafer production equipment must support the capability to setdifferent recipes and/or variable parameters associated with subsets of wafers within a carrier ina standard way. Standardizing concepts, state models, and communication interfaces arenecessary to fulfill this goal.


STANDARDS: SEMI E5, E40, E94.


NOTE: Recipe is a generic term and may include process program (Processprograms are a kind of recipe defined in E5, E30, E42)

Event Notification

Pre-Processing

Processing

Post-Processing

Figure 22. Process Program or Recipe Change Between Wafers

5.2 Variable Parameter Change Between Wafers

Single wafer process equipment may optionally need to support runtime variable parametermodification by the host. When implemented, it must be done in a standard way.




Modify variable process parameter



Figure 23. Process Parameter Change Between Wafers

6. AMHS Equipment Guidelines

6.1 Interoperable AMHS Equipment (Interbay and Intrabay)

IC manufacturers want to ensure the optimal AMHS solution for the overall factory to realizedesired bay throughput, layout flexibility, and cost effectiveness. 300 mm factories require thecombination of different types of AMHS components from different suppliers to meet differentmaterial handling requirements. Standard communication protocols, state models, and interfacesare required to achieve these goals.


STANDARDS: SEMI E5, E30, E37, E37.1, E82, E84, E88


RECOMMENDATIONS: AMHS equipment suppliers should be involved in the standardsdevelopment.

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8VERWJIV 7]WXIQ 'SRXVSPPIV

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4VSGIWW )UYMTQIRX

9XMPMX] 9RMX

1EXIVMEP %+:

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Figure 24. Interoperability of Different Types of AMHS

6.2 [NEW] AMHS Equipment Performance Information

To precisely monitor and manage AMHS equipment performance, accurate and detailed AMHSequipment performance information should be formally defined and standardized.

REQUIREMENTS 3. International Participation is Essential5. Increase Equipment Utilization11.3 Factory Automation

STANDARDS: SEMI E10, E58, E58.1, E79, E82, E88, Doc 2824A, Doc 2825

Action may be required for SEMI to develop a new standard.


7. Factory Systems Guidelines

7.1 Factory Systems

300 mm semiconductor factories will move toward open standards-based factory systems torealize flexibility and cost effectiveness. Software solutions and components from differentsuppliers need to be interchangeable and interoperable. To achieve this goal, software solutionsand components for factory systems must conform to standard functionality, framework,interfaces, and communication protocols.


STANDARDS: SEMI E5, E30, E37, E37.1, E40, E81, E82, E87, E88, E94, E97, Doc2824A. Action required for SEMI to develop and define standardcommunication protocols, state models, and interfaces between systemcomponents.

REFERENCES: None

IBSEM orStocker SEM

E84

AMHSEquipmentAMHS

EquipmentAMHSEquipment

AMHS IntegrationSystem

ProductionEquipmentProduction

EquipmentProductionEquipment

Production EquipmentIntegration System

CMS, STS,CJM, PJM

Other Factory SystemsScheduler/Dispatcher

System

Factory Network

Figure 25. Conceptual View of the Factory System

7.2 AMHS Framework

Semiconductor factories that have AMHS require an integration software system to realizeautomated material movement. The AMHS integration system must be interoperable withAMHS equipment controller and host systems from different suppliers. To achieve this goal, theAMHS integration system must conform to standard communication protocols, state models andinterfaces. This includes coordination and integration of AMHS equipment as well as integrationwith the factory host systems.


STANDARDS: SEMI E5, E30, E37, E37.1, E81, E88, E96, Doc 2824A. Action requiredfor SEMI to develop standard communication interfaces between AMHSIntegration Systems and Host System software layers.

REFERENCES: None

RECOMMENDATIONS: The minimum recommended functionality of the AMHS integrationsystem is to determine AMHS routes and issue transfer commands to theAMHS equipment. AMHS equipment suppliers, AMHS integrationsystem suppliers and host system suppliers should be involved in thestandard’s development.

AMHS Framework Guideline

ProductionEquipment

Host System (Supervisor)

AMHS Integration System

Intrabay TransportSystem Controller

StockerSystem Controller

Interbay TransportSystem Controller

Intrabay TransportEquipment

StockerEquipment

Interbay TransportEquipment

Standard CommunicationProtocols, Messages, StateModels, and Functions mustbe defined

MES FunctionsProduction Equipment Control

IBSEMProductionEquipment

Control Commands

Stocker SEM TSSEM

AMHS Framework

Phase 3 GJG

Interoperable AMHS

Equipment

Phase 1 and 2 GJGE84 E84E84

Figure 26. AMHS Framework Guideline

7.3 Production Equipment Integration

300 mm factory production equipment integration software must be interoperable with allproduction equipment. To achieve this goal, this integration software must conform toproduction equipment communication standards. In addition, this integration software must beinteroperable with the factory system. Production equipment integration software must conformto standard functionality, framework, interfaces, and communication protocols.


STANDARDS: SEMI E5, E30, E37, E37.1, E40, E81, E87, E90, E94, E97. Actionrequired for SEMI to develop and define standard interfaces for factorysystems.

REFERENCES: None

NOTES: Commercial software that controls and coordinates productionequipment must comply with Global Joint Guidance (GJG) and thestandards within this document.

7.4 Scheduler / Dispatcher

300 mm factory scheduler/dispatcher software must be interoperable with the factory system. Toachieve this goal, scheduler/dispatcher software must conform to standard functionality,framework, interfaces, and communication protocols with the factory system.


STANDARDS: SEMI E81, E97, Document 2827. Action required for SEMI to developand define standard interfaces for factory systems.

REFERENCES: None

Appendix A – Referenced SEMI Standards

Note: Equipment suppliers must use the most recent revision of standards that they implement.In all cases, revisions should not be earlier than those cited below.

SEMI Equipment Automation Software Standards

E5-0200 SEMI Equipment Communications Standard 2 Message Content (SECS-II)

E30-0200 Generic Model for Communications and Control of SEMI Equipment (GEM)

E37-0298 High-Speed SECS Message Services (HSMS) Generic Services

E37.1-96 HSMS – Single Session Mode

E39-0697 Object Services Standard

E40-00200 Standard for Processing Management

E42-0299 Recipe Management Standard (RMS)

E58-0697 Automated Reliability, Availability, and Maintainability Standard (ARAMS)

E58.1-0697 SECS-II Support for ARAMS

E79 Standard for Definition and Measurement of Equipment Productivity

E81-0699 Provisional Specification for CIM Framework Domain Architecture

E82-0999 Specification for Interbay/Intrabay AMHS SEM (IBSEM)

E87-0200 Provisional Specification for Carrier Management (CMS)

E88-0999 Specification for AMHS Storage SEM (Stocker SEM)

E90-0200 Specification for Substrate Tracking (STS)

E94-0200 Provisional Specification for Control Job Management (CJM)

E96-0200 Guide for CIM Framework Technical Architecture

E97-0200 CIM Framework Global Declarations and Abstract Interfaces

E99-0200 Carrier ID Reader/Writer Functional Standard

SEMI Equipment Automation Hardware Standards

E1.9-0699 Provisional Mechanical Specification for Cassettes Used to Transport and Store 300 mmWafers

E10-0699E Standard for Definition and Measurement of Equipment Reliability, Availability, andMaintainability (RAM)

E15.1-0200 Provisional Specification for 300 mm Tool Loadport

E47.1-0200 Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store300 mm Wafers

E57-0299 Provisional Mechanical Specification for Kinematic Couplings Used to Align andSupport 300 mm Carriers

E62-0999 Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard(FIMS)

E64-0698 Provisional Specification for 300 mm Cart to E15.1 Docking Interface Port

E84-0200A Specification for Enhanced Carrier Handoff Parallel I/O

E99-0200 The Carrier ID Reader/Writer Functional Standard

SEMI Facilities and Safety Standards

S2-0200 Safety Guidelines for Semiconductor Manufacturing Equipment

Draft Documents

These documents may be in different stages of completion. Some have been balloted, and copiesare available from SEMI. Some are still in task force. One or more contacts have been provided.

The following document is endorsed in principle as being required for 300 mm. Activeparticipation in document review and balloting is recommended.

2824A Provisional Specification for CIM Framework Material Transport and StorageComponent

2825 Provisional Specification for Equipment Tracking and Maintenance

2827 Provisional Specification for CIM Framework Scheduling Component

Appendix B – Contact Information

For more information about this document or referenced material, please contact the following:

J300E CIM Planning Group

J300E (Secretary - EIAJ)

Address: Electronic Industries Association of Japan (EIAJ)3-2-2 Marunouchi, Chiyoda-kuTokyo 100 Japan

Phone: 81-3-3213-1065Fax: 81-3-3211-0993

Name Company Phone Fax Michio Honma NEC 81-42-771-1342 81-427-71-1493

Giichi Inoue Toshiba 81-45-770-3273 81-45-770-3284

Tadashi Kiriseko Fujitsu 81-44-754-3423 81-44-754-3579

Koji Kitajima Toshiba 81-45-770-3273 81-45-770-3284

Satoshi Kono Fujitsu 81-44-754-3423 81-44-754-3579

Tomoyuki Masui Hitachi 81-45-881-1241 81-45-860-1637

Junji Iwasaki Mitsubishi Electric 81-727-84-7058 81-727-80-2561

International SEMATECH CIM Study Group

Address: International SEMATECH2706 Montopolis DriveAustin, Texas 78741

Phone: (512) 356-3232Fax: (512) 356-7080

Name Company Phone ______Blaine Crandell TI (972) 927-5844

Karl Gartland IBM (802) 769-2529

Randy Goodall International Sematech (512) 356-7622

Harald Linde Siemens 49-351-886-2072

Jeffrey Pettinato Intel (480) 554-4077

Margaret Pratt International SEMATECH (512) 356-3107

Semiconductor Equipment and Materials International (SEMI)W. Murray Bullis Vice President of International Standards

Phone: (650) 940-7980 Fax: (650) 940-7943

SEMI - JapanNaoko Tani Vice President of Japan Standards

Phone 81-3-3222-5755 Fax: 81-3-3222-5757

Appendix C – Glossary

Access Mode — the way in which carriers can be loaded or unloaded from a loadport.This can be either automatic or manual.

Actual Processing Status — indicates if the production equipment is activelyprocessing material or not. It is not considered to be actually processing unless ithas material and has achieved all required preconditions at the processingstation(s).

Actual Processing Time — the time spent once required preconditions, such astemperature setpoint or gas flow setpoint, have been met until the material isremoved from the processing station.

Automatic Guided Vehicle (AGV) — Floor based Vehicle with Robot Arm, operates without

the need for operator assistance.

Automated Material Handling System (AMHS) — an automated system to store andtransport materials within the factory.

Automation — the capability of managing material and data within the factory.

Automatic Access Mode — the state in which the AMHS (OHT/AGV/RGV) mayaccess the loadport.

Available Buffer Capacity — the number of additional carriers the equipment is able toaccept.

Batch — a group of product that is processed simultaneously. Depending on theprocess technology and equipment architecture, the size of the batch may begreater or less than the size of a carrier.

Bi-directional Loadport — a loadport used for loading and unloading carriers.

Buffer — a set of one or more locations for holding carriers at the productionequipment.

Carrier — a FOUP or Open cassette used to hold wafers for transport or duringprocess.

Carrier ID — a readable and unique identifier for the carrier.

Carrier/Slot Map — a map showing which slot in a carrier has a wafer present.

Chemical Mechanical Polishing (CMP) — Process used in semiconductormanufacturing for planarizing wafers or removing excess material from thesurface of the wafer

Continuous Handoff — two or more carrier movements occurring in immediatesequence between AMHS and /or production equipment. For example, onecarrier is unloaded from a production equipment loadport, and then anothercarrier is loaded to the same loadport.

Equipment Front End Module (EFEM) — a subsystem of production equipment thatincludes loadports, carrier ID readers, internal buffers, carrier openers, and E84interfaces. This provides the primary interface to the factory material handlingsystem.

Dry Run (mechanical dry run) — a complete equipment cycle that uses no processconsumables, does not change the process state of the physical wafer, and requires nochanges in settings other than time, used to exercise and test mechanical and softwarefunctionality without requiring full facility hookups. It is used to evaluate mechanical andsoftware capabilities in preparation for, and during, demonstrations and acceptance testsand later to verify performance following repairs or preventive maintenance.

Environmental Subsystem — a subsystem of equipment with the purpose ofmonitoring or maintaining one or more specific environmental conditions or usedto handle product or durables. Environmental subsystems include vacuumsystems, particle detection systems, and nitrogen purge systems.

Fixed Buffer Equipment — production equipment that has only fixed loadports and nointernal buffer for carrier storage. Wafers are loaded and unloaded directly fromthe carrier at the loadport for processing. Refer to Figure E3.

FIMS Position — the position on a loadport where a front-opening carrier carrier isdocked to the production equipment.

Front Opening Unified Pod (FOUP) — SEMI standard closed structure used forholding wafers. Refer to Figure D1.

Fully GEM Capable — use definition from the GEM specification.

Handoff — the act of moving a carrier between a loadport and a material handlingsystem. A handoff is normally associated with the transfer of ownership andresponsibility for the carrier.

Host — the factory computer system, or an intermediate system, that represents thefactory and the user to the equipment [SEMI E58].

ID Tag — a readable and writeable device attached to the carrier.

Internal Buffer — locations within the equipment to store carriers. These locationsexclude loadports.

Internal Buffer Equipment — equipment that uses an internal buffer. Refer to FigureE3.

Loadport —the interface location on the equipment where carriers are delivered.

Lot — a group of product that is traced as a unit of work that moves through asequence of process steps in the factory.

Metrology Equipment — equipment used to inspect or measure wafers. This excludesprocess and material handling equipment.

Multi-Module Equipment — production equipment that consists of multiple processmodule, such as wetsink(s) and/or chamber(s).

Open Cassette (OC) — an open structure that holds one or more wafers. Refer toFigure D2.

Operator Interface — the terminal on the equipment which the operator can use tosupply instructions to the equipment.

Overhead Hoist Shuttle (OHS) — rail guided vehicle, overhead mounted with shuttle.

Overhead Hoist Transport (OHT) — rail guided vehicle, overhead mounted with hoist.

Overhead Vehicle (OHV) — vehicle used to transport Material above the factory floorand the heads of fab personnel. These vehicles are on rail system.

Performance Information — reports and data related to what the equipment is actually doing(processing, setup, service functions, idle), its alarm status, wafer movement, and related statetransitions, at the levels of both the equipment and the equipment's modules.

Person Guided Vehicle (PGV) — ground based Vehicle, without Electrical Assist, directed

and moved by Fab personnel.

Person Rail Guided Vehicle (PRV) — ground based Vehicle guided by rails but moved by FabPersonnel without Electrical Assist.

Process Equipment — equipment used to make semiconductor devices. This excludesmetrology and material handling equipment.

Processing Instructions — host direction on which wafers to process with whichrecipe.

Processing Station — an internal location where product is held while it is processed.

Production Equipment — equipment used to produce semiconductor devices,including wafer sorting, process, and metrology equipment and excludingmaterial handling equipment.

Quick Turn Around Time Lots (QTAT) —material in the fab meant to moved rapidlythrough it’s process routing. These may be product, pilot or send ahead wafers,or monitors.

Railguided Vehicle (RGV) — vehicle guided with rails with Robot, floor mounted.

Recipe — the predefined and reusable portion of the set of instructions, settings, andparameters on equipment that determine the processing environment seen bythe wafers. It may be subject to change between runs or processing cycles.

Simultaneous Handoff — two or more carrier movements occurring in parallelbetween AMHS and /or production equipment. For example, two carriers areloaded at the same time to a piece of production equipment.

Single Wafer Process Equipment — equipment used to make semiconductor devicesin which wafers are handled and processed individually. This excludesmetrology, wafer sorting, and material handling equipment.

Single Wafer Production Equipment — equipment used to produce semiconductordevices in which wafers are handled and processed individually. This includeswafer sorting, process, and metrology equipment and excludes material handlingequipment. The wafers are handled and processed individually.

Slot-to-slot Integrity — all wafers removed from a carrier are returned to the same slotin the same carrier from which they were originally removed.

Total Buffer Capacity — the total number of carrier locations of internal buffer.

Variable Parameter — a formally defined setting (parameter) included in the body of arecipe which permits the actual value to be supplied externally.

Appendix D – Carrier Types

Wafer #1

Wafer #25

25 FOUP

Figure D1 Front Opening Unified Pod

Figure D2 Open Cassette

Appendix E – Production Equipment Types

Process Chamber

I n Ou t

Process ChamberProcess Bath

Internal Buffer

Internal Buffer

Bi-direction Uni-directionBi-direction

Loadport

Uni-directional Type

Internal BufferEquipment

Bi-directional Type

Internal BufferEquipment

Fixed BufferEquipment

Figure E1 Production Equipment Type Examples (Overhead View)

Appendix F – Material Handling Equipment List

Components Definitions/SEMI Standards Figure

1. Transport Equipment Made up of transport and storage hardware —

1.1 AMHS Equipment Automated equipment to deliver materials —

- AGV Automated Guided Vehicle with Robot Arm,floor mounted

F4

- RGV Rail Guided Vehicle with Robot,floor mounted

F4

- OHT Rail guided vehicle, over head mounted withhoist

F4

- OHS Rail guided vehicle, over head mounted with

shuttle

F6

1.2 Manual Handling Equipment Person operational machines to delivermaterials

—

- PGV Person Guided Vehicle withoutelectrical Assist

F4

- PRV Person Rail Guided Vehicle withoutElectrical Assist

F5

2. Stocker

2.1 Central Stocker Carrier storage shared/centralized in a production line F7

2.2 Bay Stocker Carrier storage distributed in each bay F8

2.3 Table Stocker Small storage to put carriers temporarily F9

OHT AGV RGV PGV

OHV

Equ i p

Equ i p

Arm

Ra i l

Ra i lArm

Equ i p

Do c k I / F

Ha nd Of fUn i t

Ho i s t

Ha nd

Ha nd

Figure F1 Intrabay MHS

HandleCarrier

Cart

Docking I/F

Rail

Figure F2 Person Rail Guided Vehicle without Electrical Assist

Hanging

Figure F3 Interbay AMHS

1st Floor

FA Deck

OHS

Moving Stage

Handling UnitLifter

Stocker Crane

Carrier

Figure F4 Central Stocker Example

Manua l Por t

OHS

Pass i ve Veh i c l e

She l f

Hand-of f Un i t

ID Reader

Stocker Crane

Bay-Out Por t

Bay- In Por t

#1 #2

#3

#4

#5

#6

Manua l Por t

OHS

Ac t i ve Veh i c l e

She l fID Reader

Stocker Crane

Bay-Out Por t

Bay- In Por t

#1 #2

#3

#4

#5

#6

(A) for Pass i ve Veh i c l e Type OHS (B) for Act i ve Veh i c l e Type OHS

Figure F5 Bay Stocker Examples

Carrier

AGV/RGV Port

AGV/RGV Track

Figure F6 Table Stocker Example

Appendix G – Processing Start Order Control for Equipment Buffer

Figure G1 An Example of Interruption of the Existing Process Queue of a ThreeLoadport Type Equipment

Figure G2 An Example of Interruption of the Existing Process Queue of an InternalBuffer Type Equipment