changing the way you buy circuit boards · 1. orbotech paragon 8800 ldi 2. orbotech sprint 120 ink...
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Providing Interconnection Solutions Through Innovative Products
Changing The Way You Buy Circuit Boards Midwest Printed Circuit Services, Inc.
Providing Interconnection Solutions Through Innovative Products
Who Are We?
A Value Add Printed Circuit Board Supplier
Established in 1984
American Owned and Operated
Entirely Manufactured in the USA
2 Locations Located in Round Lake Beach, IL (47,000 SqFt)
A “Trusted” Source of Supply
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
What do we do?
Manufacture both Prototype and Full Volume High Reliability PCB’s
Offer Manufacturing Solutions for all PCB Product Lines
Provide Experienced Engineering and Unparalleled Customer Support from First Contact Through Delivery
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Why do we do it?
We value our relationships above all else
We take great pride in being a trusted and valued American supplier to numerous companies in your industry
We care about making your buying process easy
Dedicated to Total Customer Satisfaction!
Other
3%
Transportation
7%
Power Supply
10%
Military /
Aerospace
27%Telecom
8%
Medical
20%Industrial
Controls
25%
Providing Interconnection Solutions Through Innovative Products
Who do we serve?
Automotive
Defense Medical Aerospace Industrial
Consumer Telecom Computer
Providing Interconnection Solutions Through Innovative Products
How do we do it?
We dedicate ourselves to making the PCB buying and receiving process an easy and seamless transaction
We offer total customer support from First Contact through Delivery
Our management team averages over 31 years of manufacturing experience with an average employee tenure of 11 years
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
What can we offer you?
Single sided to high layer count multi-layers, including Flex, Rigid-Flex, and Heat Sinks/Metal Cores
Both low and high volume lots at competitive prices
Standard lead times of 3 weeks
Quick Turn/Prototypes as fast as 2 days
Tailored Pricing options to fit your needs
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Value Add Services
Printed bar-coding and multiple serialization options utilizing our Inkjet Legend Printer
Front end engineering analysis & DFM with new orders
Real time job tracking utilizing our M2M Enterprise Management System
Raw material stocking programs
Kanban
Dedicated to Total Customer Satisfaction!
New Orbotech Sprint 120 Inkjet Legend Printer
Providing Interconnection Solutions Through Innovative Products
Capabilities
Via in Pad LPI and Dry Film Soldermask NASA – Meets or Exceeds Outgassing Requirements Fully Automated CAM Carbon Ink Peelable Solder Mask Raised Profile Plating Deep Ni/Au, Immersion Gold (ENiG), Silver, OSP Solder Stencils
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Technologies
Blind and Buried Vias
Sequential Lamination and Controlled Depth Drill/Plating Capability
Controlled Impedance (+/- 10% Standard)
Copper Weights up to 4 Ounces
High Speed Epoxy / Teflon Hybrids
Dedicated to Total Customer Satisfaction!
Blind Thermal Via plated to internal copper core
Buried Via through internal copper core
Providing Interconnection Solutions Through Innovative Products
Technology Roadmap
Current Future Minimum Drill Size Blind/Buried Via 0.006” 0.006” Through Via 0.010” 0.008”
Line Width / Space (Half Oz Copper)
Inner Layers 0.003”/0.003” 0.002”/0.002” Outer Layers 0.004”/0.004” 0.003”/0.003”
Laser Vias – Stacked 2 each 4 each
Laser Vias – Filled Yes Yes
Aspect Ratio 0.5:1 0.75:1
Metal Core Filling 100% In House 100% In House
Metal Core Machining 100% In House 100% In House
Impedance Control
Standard 10% 10% Advanced 8% 7.5%
Testing Capability 250V In House 250V In House
Pitch 0.004” 0.004” High Pot Up to 5KV Up to 5KV
Providing Interconnection Solutions Through Innovative Products
Thermal Management Solutions
Heat sinks Metal cores Metal Backed Thermagon Construction: (10x thermally conductive substrates & pre-pregs)
Exotic Material Multilayer Mixed Dielectric Multilayer Various Bonding Capabilities Blind & Buried Vias
Dedicated to Total Customer Satisfaction!
In House Milling Dept.
*Finishing done at NADCAP approved suppliers.
Providing Interconnection Solutions Through Innovative Products
Commitment to Quality
ISO 9001:2008 MIL-PRF-31032/1 and 2 GF and GI Materials MIL-PRF-31032/3 and 4 MIL-PRF-55110 GF and GI Materials MIL-PRF-50884 IPC-6012 Class 3 and 3A (Space and Military Avionics) IPC-6013 Class 3 (Flex & Rigid Flex) Approved for Manned Space Flight UL Listed ITAR Registered AS9100D (in process) NADCAP 7119 (in process)
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Cross Sections
Coupons Conform to IPC-2221 Thermal Stress IPC-TM-650, 2.6.8 Added to all Panels Exceeds IPC 6012 for Space & Military Avionics
Inspected to • MIL-PRF-31032 • MIL-PRF-55110 • MIL-PRF-50884 • IPC-6012 • IPC-6013
9 Ounce
Surface Copper
3 Ounce all Layers
Providing Interconnection Solutions Through Innovative Products
Common Materials
FR4 – 370HR/185HR, VT-47, ITEQ 180A Flexible and Rigid/Flex Hybrids *Getek *FR408 *Rogers *BT Epoxy *Polyimide *Teflon/Duroid/PTFE And more *These materials are not commonly stocked but stocking programs are available
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Thermal Materials
Thermagon Aisimalibar Cobritherm
ITEQ IT-859TA
Ventec VT-44 Series
These materials are not commonly stocked but stocking programs are available
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
RoHS Compliance
Finishes ENiG Lead Free Solder Silver OSP
Materials HR370 HR185 VT-47 ITEQ 180A
Dedicated to Total Customer Satisfaction!
Providing Interconnection Solutions Through Innovative Products
Recent Capital Improvements
1. Orbotech Paragon 8800 LDI 2. Orbotech Sprint 120 Ink Jet Legend Printer 3. Mach3 Labs Antares 700x Precision X-ray Drill 4. Camtek Phoenix HDI AOI 5. TMP 4 Opening Vac Lam Press (hot and cold) 6. Multiline OPE 9000 4 Camera Automatic Post
Etch Punch 7. Polar CIT S880s Controlled Impedance Test
System 8. Two Portable Clean rooms with HEPA Filters 9. Perkin Elmer PinAAcle 500 AA Unit 10. Glenbrook TRX-113VAV X-Ray System 11. Chemcut 547 Xli 30’ Ammonia Etcher
Continuous
Improvement Plan:
To Further Enhance our
Capabilities
Continue Improving Quality
Improve Efficiencies
Ensure on-time delivery
Exceed the demands of the
ever changing industry
Providing Interconnection Solutions Through Innovative Products
Notable Customers
Providing Interconnection Solutions Through Innovative Products
Organizational Chart
President & CEO
Joseph
Fehsenfeld
Wet Processing
Manager
Larry Mikel
Human Resource /
Purchasing
Linda Hutton
Process
Engineering
Manager
Dave Sennett
Production
Manager
Chuck Hutton
Customer Support
Manager
Robert Denbo
Facilities Manager
Don Lackey
Quality Assurance
Manager
Kathy Phelan
Director of
West Coast Sales
Dave Pearson
Director of
East Coast Sales
Pete Codella
Customer Support
Carol Main
Business
Development
Matt Fehsenfeld
Providing Interconnection Solutions Through Innovative Products
Contact Us
Main Office: 1741 Circuit Drive Round Lake Beach, IL 60073 Phone: (847) 740-4120 Fax: (847) 740-4187
www.midwestpcb.com
Bob Denbo – Customer Support Manager [email protected] Dave Pearson – Dir. of West Coast Sales [email protected] Pete Codella – Dir. of East Coast Sales [email protected] Kathy Phelan – Quality Assurance Manager [email protected] Carol Main – Customer Support [email protected] Chuck Hutton – Production Manager [email protected] Dave Sennett – Process Engineering Manager [email protected] Larry Mikel – Wet Processing Manager [email protected] Matthew Fehsenfeld – Business Development [email protected]
Joe Fehsenfeld – President & CEO [email protected]