ceramic microsystems
DESCRIPTION
A look at mltilayer ceramic enabled microsystemsTRANSCRIPT
MRS Fall Meeting: Symposium
Multilayer Ceramic Microsystems:
applications in wireless, energy and
life sciences
Micro-Technologies Research Lab
Solid State Research Center
Motorola Labs
Tempe, Arizona
OUTLINE
• MST definitions and technologies
• Ceramic “MEMS” technology
• Ceramic “MEMS” applications
– Integration of RF-Wireless Functions
– Miniaturization of Fuel Cell Systems
• Direct Methanol
• Reformed Hydrogen
– Life Science Devices/Appliances
• MHD pumping
• DNA Amplification
• DNA Hybridization & Detection
• UV Light Source
• Conceptual Life Science Integrated Appliance
MicroSystem Technology (MST)*
Micromirrors
SiCeramic,Glass, Plastic,
Microsensors/detectorsMicrogrippers
Microactuators
Micromixers
Micropumps
Microvalves
Microreactors
Microheaters
Packaging Modular MEMS
Micropneumatics
Microplasma
System in/on a
Package (SIP) MOEMSLab-on-
Chip
MicroSystem Technologies
System Miniaturization and Integration of
Device Functions Based on:
PhotonicsElectronics MicroFluidics ThermonicsMechatronics
Microswitches
Enabled By 3D Multilayer
Integration/Fabrication Technologies:
*Source: M. Riester and D.L. Wilcox
Definition of MST
Any device or unit made up of a number of micro-
engineered components/devices.
An intelligent miniaturized monolithic and/or hybrid
integrated system comprising sensing, processing
and/or actuating devices utilizing two or more of the
following technologies: electronic, mechatronic,
microfluidic, thermonic, and photonic.
Microsystems Technology Driving
Forces
• Integration and Miniaturization of
Multifunctional Appliances
• Enabled by Integration of fluidics,
electronics, photonics, and “thermonics”
• Market Opportunities:
– Wireless – multiband and multimode phones
requiring more components
– Micro-scale energy sources for portable
appliances
– Emerging life science fluidic based devices
– “Lab on a chip”; Micro-reactor; etc.
Important Microsystem Integration
Technologies
• Ceramic - MEMS
• Si – MEMS
• Other Glass and Plastic (PCB) Technologies
• Electronic Packaging and Interconnect
Technologies
• Materials, Process and Device Modeling and
System Architecture/Partitioning and
Technology Selection Protocols
• Tools for managing cross-discipline, cross-
function teams!
Ceramic MEMS: Technologies & Applications
5 mm
15 m
m
Methanol Reformer
NEW
MATERIALS &
PROCESSES
MICROSYSTEM FUNCTIONS
pumps
chemical reactors
temperature control
on-chipICs
sensors
lightsources
ENERGY
WIRELESS
COMMUNICATIONS
LIFE
SCIENCES
fuel cells
fuel reformers
integrated modules
power amplifiers
filters
E-chipPCR
cell sorting
Integrated
BioChip
Technology
Pumping/
Mixing
Micro Hollow Cathode
Discharge (MHCD)
UV light source
V
Direct
Methanol
Fuel Cell
8 mm
8.5 mm
Power Amplifier
Cell Phone
Receiver
DNA
amplification
Sintering
Stacking
Layer 1 Layer 2 Layer n
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Inspection
SingulationLamination
Attach Devices
Fluidic microchannels( X,Y)
Electrical interconnect (Z)
Or Fluidic Microchannels (Z)
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Electrical interconnect
SensorIntegrated
Passive component
Integrated active
component
Processing of Ceramic MEMS Microsystems
mechanical punching
100 mmVIA
FORMATION
VIA
FILL
LATERAL
FEATURES
(interconnects,
passives)
laser drilling
50 mm
stencil
100 mm
screen printing
50 mm
green sheet thickness
50-250 mm
photo-defined
50 mm
print thickness
5-20 mm
MLC Feature Forming Technologies
Microfluidic Structures Requiring Support
CMEMS Tape Texturing Technologies
Embossing Cast-on-Photoresist Fugitive
Paste
Advanced Microchannel Forming Technologies
Ceramic
Sheet Ceramic
Sheet
8 mm x 8 mm
channels10 mm channels heights
for rapid diffusive mixing
Applications of the Ceramic MEMS
• Integration of RF-Wireless Functions (SIP)
• Miniaturization of Fuel Cell Systems– Direct Methanol
– Reformed Hydrogen
• Life Science Devices/Appliances– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– UV light source
– Conceptual integrated life science appliance
Conceptual Diagram for Wireless Communication
Device
• Low RF Signal Loss Critical
• Need High Frequency Stability
• High Functional Integration:
Medium K (7-200) Dielectric
• Low L,C,R Values
RF Frontend
Mainly Analog
Circuit
IF &
Baseband
Mainly Digital
Circuit
Auxiliary
Functions
• High Interconnect Density:
Fine Line, Pitch and Pad
• High Speed and Low Cross
Talk: Low K ( < 4) Dielectric
• High L,C,R Values
TX RX
C1
Z1
D1Z2
D2C2 C3
ANT
Z3
Z4
C4
C5
C6
C8
C7
BIAS
Vertically Coiled
Transmission Line
Horizontally Coiled
Transmission Line
Multilayer Capacitor
Capacitor
Metal
MetalDielectric
Substrate
RF Device Elemental Structures
Conceptual MCIC Structure
GSM LEAP:
TRI-BAND Tx VCO
GSM KRAMER:
DUAL BAND PA MATCH,
HARMONIC FILTER,
COUPLER
ANT
ACC Rx / Tx - ANT / ACC
RF SWITCH
IRIDIUM:
LNA AND SWITCH
GSM LEAP:
TRI-BAND Rx VCOTUNABLE DUPLEXER
PCS / DCS
MCIC FILTER
Power Amp
MCIC Integration Efforts
•
•
~~
AntennaTransmit
From Amplifier
To Amplifier
To Mixer
Switch Bias Image Reject Filter
Bandpass Filter
Switch w/ Harmonic
Filter
Trap Filter
Bias Circuit
Impedance
Matching Line
Power and BiasLNA Bypass Capacitors
Example of RF Front-End Functional Integration
1 cm X 1 cm
41 components per sq. cm.
Synthesis Strategy of T2000 Dielectric*
Near Zero Temp. Coef. of Resonator Frequency
Low Dielectric Loss Tangent
Lead (Pb) Free Formulation
Ceramic Filler
Al2O3
Tf
Adjuster
TiO2
Sintering
850~ 900 °C
Glass
K2O, B2O3
(SiO2)
20 vol %
Crystalline Phases
CaAl2Si2O8 (35 vol%)
SrAl2Si2O8 (10 vol%)
BaAl2Si2O8 (5 vol%)
Al2O3
Glass: K2O, B2O3, SiO2
CaO, SrO, BaO
60 vol % 35 vol % 5 vol %
25 vol %
Tita-
nates5 vol %
50 vol%
7.0
8.0
9.0
10.0
600
700
800
900
1000
1100
1200
K
Q
800 825 900850 875 925 950 975
Temperature (°C)
Formation of High Q Dielectric
• Sintering T > 850 °C is necessary for high Q
• Self Limiting Crystallization - Wide Sintering Window
QK
1.232
1.234
1.236
1.238
1.24
1.242
1.244
1.246
1.248
-40 -20 0 20 40 60 80
Tf Measurement
TiO2 added
No TiO2
Res
onan
t fre
quen
cy (10
9 H
z)
Temperature (°C)
Tf=4.2 ppm/°C
Tf=-78.5 ppm/°C
Compensation of Tf:
TiO2: TK =-750 ppm/°C
CaTiO3: TK =-1850 ppm/°C
SrTiO3: TK =-3000 ppm/°C
• Tf of T2000 is ~ 80 ppm/°C
without compensation
• Can be continuously tuned
to ~ 0 ppm/°C
Compensation of Tf in T2000 Dielectric
Tf Measurement
0.994
0.996
0.998
1.000
1.002
1.004
1.006
-50 -30 -10 10 30 50 70 90
Temperature (C)
No
rma
lize
d F
req
ue
nc
y
T2000: 0.6 ppm/C
FerroA6: -48 ppm/C
DuPont 943: -58 ppm/C
DuPont 951: -69 ppm/C
Hereaus: -76 ppm/C
Example of Tf Influence on Filter
Performance
850 900 MHz 950
0
10
20
30
40
50
Attn
.
Pass
Band
Stop
Band
Filter
response at
room
temperature
Tf = 0 , Q=1000
Tf = - 60, Q=1000
Tf = -(1/2)Tk - Tk: T coefficient of dielectric constant
: linear CTE, 3~15 ppm/°C
Example of Tf Influence on Filter
Performance
850 900 MHz 950
0
10
20
30
40
50
Attn
.
Pass
Band
Stop
Band
Filter
response at
room
temperature
Tf = 0 , Q=1000
Tf = - 60, Q=1000
Tf = -(1/2)Tk - Tk: T coefficient of dielectric constant
: linear CTE, 3~15 ppm/°C
Example of Tf Influence on Filter
Performance
850 900 MHz 950
0
10
20
30
40
50
Attn
.
Pass
Band
Stop
Band
Filter
response at
room
temperature
Tf = 0 , Q=1000
Tf = - 60, Q=1000
Tf = -(1/2)Tk - Tk: T coefficient of dielectric constant
: linear CTE, 3~15 ppm/°C
Tf Impact on Embedded Filter Performance
Applications of the Ceramic MEMS
• Integration of RF-Wireless Functions
• Miniaturization of Fuel Cell Systems
– Direct Methanol
– Reformed Hydrogen
• Life Science Appliances
– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– Photonic light source
– Conceptual integrated life science appliance
LOCAL
DISTRIBUTED
MOBILEFIXEDCentral
Utilities
Mobile
Power
Luggable
Power
Distributed
Utilities
Large ApplicationsSmall Portable
Applications
A Fuel Cell is a System
Stack
Fuel Supply
Fuel Delivery System
Fuel Processing/Reforming
MicroSystem Fuel Cell & Applications
Methanol Fuel Cells
Two Approaches
Direct Methanol Fuel Cells (DMFC)
Direct Methanol Fuel cell
CH3OH + H2O CO2 + 3H2O
_Proton Conducting
Membrane+CH3OH Air (O2)
6H+
Loade-
Pt-Ru Catalyst
ElectrodePt Catalyst
CO2
Reformed Hydrogen (Methanol H2) Fuel Cells (RHFC)
Hydrogen Fuel cell
2H2 + O2 2H2O
_+
H2 Air (O2)
2H+
Loade-
Pt Catalyst
ElectrodePt Catalyst
Proton Conducting
Membrane
- Initial Product Target:
100 mw system for Portables
- Liquid handling
- Room Temperature Operation
- Low Power Density
- Initial Focus on miniature reformer
- High Power Density
- Reformer Operating Temp ~200ºC
- Gas handling
Higher wattage systems
Direct Methanol Fuel Cell System
DC-DC
Converter
Cell
PhoneRechargeable
Battery
Water
Cartridge
Mixing
Chamber
Methanol Concentration
Temperature
Flow
Fuel
Cell
Stack
Control
circuitry
Fuel (Methanol)
CartridgeSensors
Water Recovery
& Recirculation
MEMS Pumps
CO2 Separation
& Venting
Flow Field
(anode side)
Gold
Current
Collector Air Holes
(cathode side)
Gaskets
MEA
DMFC Fuel Cell Assembly
Assembled Fuel Cell Working Fuel Cell
Concept for Fuel Cell with integrated
pumping and control
Reformed Hydrogen Fuel Cell System
Water
Cartridge
DC-DC
Converter
Cell
Phone
Rechargeable
Battery
Fuel (Methanol)
Cartridge
Steam Reformer- Catalyst
- Temperature 250C
Heat Exchanger
Capture waste heat from FC feed
Fuel
Cell
Stack
Preferential
Oxidation
Reactor
(CO cleanup)
Temperature &
Po2 Sensors
Control
Circuitry
Fuel Vaporizer (chemical heat)
or Electric Heat
Reformed Hydrogen Fuel Cell System
CH3OH + H2O
CO2 + H2 + CO (about 1%)
CH3OH H2O
CuO-ZnO
Catalyst
Steam
Reformer
Preferential
Oxidation
Catalyst
CO
Clean upCO + 1/2O2 CO2
250 °C
(Endothermic Reaction)
H2 gas to fuel cell
Fuel Reformer
Air inChemical Combustor
Fuel Reformer
Insulator
Insulator
Insulation
Insulation
Methanol/Water (1:1 mole ratio)
H2 in
MeOH in
Reformer
Output to Fuel
Cell and Gas
analysis
Fuel Vaporizer/Heat Exchanger
Exhaust
out
Liquid Feed Pump: 10- 25 uL/min
Miniature Fuel Reformer with Integrated
Chemical Combustor Using Ceramics MEMS
Technology (Conceptual Design)
catalyst
Fuel Inlet(Methanol + Water)Fuel Vaporizer
Steam reformer
Gas Outlet(H2 , CO and CO2)
Reformer Test Data
0%
20%
40%
60%
80%
100%
180 200 230
Temperature (C)V
olu
me
%
H2
H2
H2
CO2
CO2CO2
MeOH
CO
(MeOH/ Water :1/1.05, 5 ul/min inlet fuel)
>90% MeOH Conversion @ 200C
~ 1 micro-liter/min total liquid in
produces
~ 1 milli-liter/min total gas out.
• 50 ul/min fuel can produce sufficient H2 for a Fuel Cell to produce 3W power
operating at 30% efficiency
Miniature Steam Reformer To Produce
Hydrogen Gas from Liquid Methanol Fuel
RHFC Fuel Processor
Applications of Ceramic MEMS
• Integration of RF-Wireless Functions
• Miniaturization of Fuel Cell Systems
– Direct Methanol
– Reformed Hydrogen
• Life Science Appliances
– MHD pumping
– DNA amplification
– DNA hybridizatin and detection
– Photonic light source
– Conceptual integrated life science appliance
Piezo-driven LTCC Micropump
• Multilayer ceramic design
• Cofired ball check valves
• Piezoelectrically driven, PZT unimorph
Cofired balls inside
0
50
100
150
200
0 10 20 30 40
Vp-p
Flo
w R
ate
(m
icro
lit
re/m
in)
10~30 Hz
5 Hz
50 Hz
1 Hz
0
50
100
150
200
0 20 40 60
Frequecy (Hz)F
low
Rate
(m
icro
lit
re/m
in)
Vp-p=20 V
Vp-p=10 V
Vp-p= 30 V
Magnetohydrodynamic (MHD) Pumping
MHD Pumping Video
Impact: No moving parts, bi-directional, non-pulsating flow
INLET
OUTLETExternal mini-electromagnet
for B-field
Initial Pump Design
B
I
v
2
2
)(8 hwL
hIBwv
m
Basic MHD Theory
Inlet
Outlet Electrodes for E-field
“channel for pumping”
View Channel 1 mm
First Generation MHD
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0 2.0 4.0 6.0 8.0 10.0 12.0
Current (mA)
Flo
w R
ate
(u
L/m
in)
Model Prediction
Measured Data
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
0 30 60 90 120 150 180
Phase Angle (Degrees)
Flo
w R
ate
(u
L/m
in)
Model Prediction
Measured Data
MHD Experimental Data (100 mM NaCl solution)
95 C 55 C 72 C
Model Predictions Experimental Validation
DESIGN
AIR
GA
P
AIR
GA
P
AIR
GAP
AIR
GAP
CH
AN
NE
L 2
CH
AN
NE
L 1
CH
AN
NE
L 3
Inlet
Outlet
DNA amplification
DNA
AMPLFICATION
THERMAL PROFILELTCC DEVICE
CONTINUOUS FLOW POLYMERASE CHAIN REACTION (PCR)
Generation 1
Generation 2Second generation design completed
with reduction in dead volume from
75% to 25% of the reactor
DNA hybridization & detection
Ag-Pd Heater
Gold Pad & Via Microwell
Plane
Heater: Ag-Pd strip of 80 squares
Resistance: 30 mW/square x 80 squares = 2.4W
Energy Input: 160 mW
Heat loss: Natural Convection at device boundary
Schematic of E-chip
Temperature Profile across Sensor Pads
MODELING OBJECTIVE:
less than 1C temperature variation
across the array
FABRICATED DEVICES
Sensing Electrodes
Sensor pads Temperature sensor
Heater
PCB-based array
Ceramic arrays
DT < 0.5 C
Colu
mn
1
Co
lum
n 2
Colu
mn
3
DT ~ 0.5 C
Ro
w 1
Ro
w 2
Ro
w 3
Ro
w 4
Predicted
Measured
Heater Resistance: 2.6 W
Current: 250 mA
Energy Input (expt.): 0.1625 W
Energy Input (model): 0.16 W
Experimental Details
Temperature Profile along X-axis Temperature Profile along Y-axis
Model Validation of Thermal Profile
0
200
400
600
800
1000
200 250 300 350 400Wavelength (nm)
Inte
nsit
y (
a.u
.)
Dia. =250 mm
Separation = 190 mm
Gas: XeI
V = 300 V
I = 150 mA
Pressure = 20-60 Torr
Ceramic Micro Hollow Cathode Discharge
Integrated UV
Light Source
VCollaboration with G. Eden, B. Vojak,
Univ. of Illinois, Urbana, Illinois
XeI*B-X
253 nm
Iodine
206 nm
XeI*B-A
320 nmI*2
342 nm
Electromagnetic
coil
Coil High-mu material
CMEMS Enabled Devices and Functions
Fluidic well fill sensor
Capacitor
plate
Conductor
trace
Channel flow sensor
Integrated coil heaterFluid heating
Integrated EM coils Enable:-Magnetic microsphere manipulation
-Magnetic-based stirring
-Magnetic pumping concepts
Electromagnetic-Coil Integration
Capacitive sensing of fluids Capacitive sensing of fluids:-Channel flow sensor
-Fluidic-well fill sensor
-Precise metering of fluids
-’Macro-to-micro’ fluid metering
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5
Heater-Coil Power (Watts)
Temperature region
of interest for “PCR”
-250
-200
-150
-100
-50
0
50
-0.5 0 0.5 1 1.5 2 2.5
Power (Watts)
Polymer “Mag-Spheres”
attracted to embedded
electromagnetic coil
Tem
pera
ture
(d
eg
C)
Mag
neti
c F
lux (
Gau
ss)
MST-INTEGRATION
TECHNOLOGIES
examples:
- Si-MEMS
- Ceramic-MEMS
- PCB/HDI/Plastics
- Si ICs
- RFIC
- LTCC 3D Interconnect
- Micro Displays- Wafer Scale Ass’y
- Known Good Parts
ELECTRONIC
2-way Wireless Signaling& Networks (ANTENNA)
RFICuC
MST-ENABLED
FEATURES
- uP & Memory
- Thermal Cycles
- Photon Sources
- Photo Imager/Det
- uFluidic Channels
- uBio Chemistry
- uPumping
- Dense Packing
- Low Cost
uPump
uPump
Ceramic-MEMS
uC
neuRFon™3D LTCC Smart Substrate
MST Integrated Bio-Analysis Appliance
Input Blood Sample -- cell sort -- lysing -- DNA amplify --
DNA signal detection -- DNA analysis -- Transmission --
Medical Network Database -- Medical Network Response
Miniature Blood Analyser
P. Roberts-SSRC
Summary
• A Microsystems Technology is Emerging
– Enabling integration/miniaturization of bench top appliances
– Enabling devices that are multifunction integrating electronic,
microfluidic, mechatronic, thermonic and photonic devices
• These appliances will impact the electronic, energy, life
science and micro-reactor related markets
• A Ceramic – “MEMS” or MST technology is emerging as
an important multifunction micro-systems 3D integration
technology:
• Building on the multilayer “packaging/interconnect”
and capacitor technologies and infrastructure
• A true 3D integration technology with a rich menu of
integrateable materials for Device opportunities
• Provides dimension gap system tradeoff: SOC vs SIP
Summary
CMEMS Applications will accelerate with:
•Advances in simulation and modeling tools
•Advances in materials integration, and feature forming
technologies
•Expanded Research at Universities and National Labs
• Establishment of CMEMS User Facilities
• Establishing Standards for Materials and Processes
• Emulating PCB and Silicon Foundry Infrastructure ..
Cost, Cycle Times, Multiple Sources
Material and Process Challenges
Material challenges:
• Dielectrics
• Ceramics (e.g., high K dielectrics)
• Glass-ceramics (LTCC)
• Glasses (encapsulation, sealing etc)
• Conductors
Au, Ag, Ag/Pd, Pt, Cu, base metals,…
• Resistors (internal cofired, post fired, etc)
• Magnetic Materials (ferrites, permanent magnets, etc)
• Ferroelectric and Piezoelectric Materials
Process Challenges• Tape and Thick film processes
• Thin film process
• Interconnect technologies
Looking for collaborations in the above fields!