car_audio tch-m100 seminario

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 S E R V I    C E M A N  U A L M  O D E L :  T  C H - M 1  0  0  0 T  C H - M 1  0  0  0 R DET ACHABLE FRONT PANEL CAR CD RECEIVER SERVICE MANUAL MODEL : TCH-M1000 , TCH-M1000R CAUTION BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS” IN THIS MANUAL.

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Page 1: Car_audio Tch-m100 Seminario

8/4/2019 Car_audio Tch-m100 Seminario

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 S E RV I    C E MAN UAL 

M ODE L :  T  C H- M1  0  0  0  , T  C H- M1  0  0  0 R

DETACHABLE FRONT

PANEL CAR CD RECEIVER

SERVICE MANUAL

MODEL : TCH-M1000 , TCH-M1000R

CAUTION

BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS”

IN THIS MANUAL.

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❍ SECTION 1. SUMMARY

• SERVICING PRECAUTIONS .......................................................................................................... 1-2

• ESD PRECAUTIONS....................................................................................................................... 1-3

• SPECIFICATIONS........................................................................................................................... 1-4

❍ SECTION 2. ELECTRICAL

• ELECTRICAL TROUBLESHOOTING GUIDE ................................................................................. 2-1

• CD PART TROUBLESHOOTING GUIDE......................................................................................... 2-3

• WAVEFORMS OF MAJOR CHECK POINT .................................................................................. 2-11

• INTERNAL BLOCK DIAGRAM of ICs............................................................................................ 2-13

• BLOCK DIAGRAM......................................................................................................................... 2-25

• SCHEMATIC DIAGRAM................................................................................................................ 2-27

• MAIN SCHEMATIC DIAGRAM ...................................................................................................... 2-29

• CDP SCHEMATIC DIAGRAM ....................................................................................................... 2-31

• PRINTED CIRCUIT DIAGRAM...................................................................................................... 2-33

[CONTENTS]

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❏ SERVICING PRECAUTIONS� Always disconnect the power source before:

1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.

2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.

3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result inan explosion hazard.

� Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service

manual might be equipped.

❸ Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state

device heat sinks are correctly installed.

❹ Always connect a test instrument’s ground lead to the instrument chassis ground before

connecting the test instrument positive lead. Always remove the test instrument ground lead last.

1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,

follow the printed or indicated service precautions and service materials.

2) The Components used in the unit have a specified conflammability and dielectric strength. When

replacing any components, use components which have the same ratings. Components marked in

SECTION 1. SUMMARY

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❏ ESD PRECAUTIONS

[Electrostatically Sensitive Devices (ESD)]Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents

commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are

integrated circuits and some field-effect transistors and semiconductor chip components. The following

techniques should be used to help reduce the incidence of component damage caused by static electricity.

1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and

wear a commercially available discharging wrist strap device, which should be removed for potential

shock reasons prior to applying power to the unit under test.

2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4) Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static”

can generate electrical charges sufficient to damage ESD devices.

5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD

devices.

6) Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together

by conductive foam, aluminum foil or comparable conductive material).

7) Immediately before removing the protective material from the leads of a replacement ESD device, touchthe protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless

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1. GENERAL

Power requirements ..................................................................................................................... DC12V~15V

Ground system ................................................................................................................................... Negative

Dimensions(W x H x D) ...................................................................................................... 188 x 58 x 166mm

Weight .............................................................................................................................................. Net: 1.3kg

2. RADIO SECTION

FM AM(MW)

Frequency range 65.0~74.0MHz(Optional), 522~1,620kHz87.5~108MHz (Optional:530~1,710kHz/ 520~1,620kHz)

Intermediate frequency 10.8MHz 450kHz

Usable sensitivity 10dBµV 28dBµVSignal to noise ratio 55dB 45dB

3. COMPACT DISC SECTION

Frequency response..................................................................................................................... 40Hz~20kHz

Channel separation ...................................................................................................................... 50dB(1kHz)

Signal to noise ratio .................................................................................................................................. 60dB

❏ SPECIFICATIONS

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SECTION 2. ELECTRICAL

❏ ELECTRICAL TROUBLESHOOTING GUIDE

Any Key power on.

Is power turnd on?

DISC loading?

Does initial reading occur?

Check power supply circuitry.

Q260, Q380, Q381, IC401 Pin3

IC201 Pin2

Check loading supply circuitry.

Q350,Q351,PN505, IC401 Pin1

Check laser circuitry.

Q501, IC502

Check focusing circuitry

YES

YES

YES

NO

NO

NO

(1) No Power.

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YES

YES

YES

(2) LCD light abnornal.

Any Key power on.

(without DISC)

Do display LCD then light?Check voltage in the power

supply circuitry.

Power supply circuitry

defective.

Q380,Q381,IC403

Reset circuit defective.

IC201 Surrounding circuit

defective.

X401, C413,C414 defective.

Is u-com IC401 reset circuitnormal? Pin10

Is u-com IC401X1, X2 terminal

Pin38, 39 input?

OSC : 9.8304MHz

NO NO

NO

NO

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❏ WAVEFORMS OF MAJOR CHECK POINT

#1. MICOM INTERFACE WAVEFORM

(CN503 1 9,2 1 ,1 8,20) during normal play

#2. SLED DRIVE AND MOTOR WAVEFORM

(IC504 pin5, 1 4) when focus search

#3. FOCUS DRIVE AND MOTOR WAVEFORM

(R5 1 3, IC504 pin 1 5)

• When focus search failed or there is no disc on the

tray

• There is disc on tray and focus search success

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#4. SPINDLE DRIVE AND MOTOR WAVEFORM

(IC504 pin6, 1 2) when TOC reading

#5. TRACK DRIVE AND MOTOR WAVEFORM

(R508, IC504 pin23) during normal play

#6. RF, TRACKING AND FOCUS ERROR WAVEFORM

(IC502 pin8, 2 1 , 23) during normal play

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 Pin I/O

26   I 

27  O

28 O

29 O

30 O

31  I 

32 O

33 O

34 O

35 I 

36 O

37 O

38 O

39 I 

40 O

41 I 

42 O

43 O

44 -

45 -

46 O

P34

P33

PCD_MUTE  CD s audio signal mute output 

PDSP_ODA

 In MD, motor driver s power save command ouput 

Power Save Mode(High), Normal Mode(Low)

 In MD, all motor s output "cut off" command ouput 

Cut Off Mode(High), Normal Mode(Low)

Constant velocity signal input 

Ok(High), Not Ok(Low)

 DSP chip enable output 

 In MD, load motor "forward" command output 

To DSP, data output 

From DSP, data input 

Clock output for interface with DSP

 In MD, SW2 state input. Refer to CD Player.

 DSP power suppler ON ouptut 

 Description

 Beep sound (2KHz) output 

To LCD driver, data output 

 Not to be used 

Clock output for interface with LCD driver 

 Not to be used 

 Not to be used 

 Not to be used 

Power supply (+5V)

Ground 

PLL IC bl

P32

PCD_FWD

 Name in Model  Name in Micom

PCD_SW2P31

PCD_PWR

P10/SO0

PDSP_IDAP11/SI0/SB0

PDSP_OCLK P12/SCK0

PDRV_OPSP13/SO1

PDRV_OMUTE P14/SI1/SB1

PDSP_IFSEQP15/SCK1

PDSP_OCEN P16/T1PWML

PBEEPP17/T1PWMH/BUZ 

PFRT_DOSI2P0/SO2

 N.C SI2P1/SI2/SB2

PFRT_CLK SI2P2/SCK2

 N.C SI2P3/SCK20

 N.C PWM1

 N.C PWM0

VDDVDD2

GNDVSS2

PPLL CEP00

ForwardLowHigh

Break modeHighHigh

ReverseHighLow

Open modeLowLow

FunctionPCD_RPCD_F

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I IC501 MN6627933

1) PORT ASSIGNMENT

Pin I /O

73 O

74 O

75 O

76 O

77 I

78 I

79 O

80 I

PC0/A0

PA0/CS2#

PC4/A4

PC3/A3

PC2/A2

PC1/A1

PFRT_DET Front pannel existence signal input

Front Pannel Ok(High), Absent(Low)

Clock for interface with volume controller

System Power supplier ON outputOn(High), Off(Low)

Description

To volume controller, data output

To power amp, "MUTE" command output

Mute(High), Sound(Low)

Name in Micom

PPWR_MUTEPC6/A6

PEV_CLKPC5/A5

PPWR

Name in Model

PEV_DO

From ISO jack, ACC signal input

ACC On(Low), ACC Off(High)

Not to be used

CD changer power supplier ON output

CDC On(High), CDC Off(Low)

PACC

N.C

PCDC_PWR

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2) Block Diagram

 

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3) PORT DESCRIPTION

Pin No. Symbol I/O Function

1 D11 I/O DRAM data signal I/O 112 D10 I/O DRAM data signal I/O 10

3 D9 I/O DRAM data signal I/O 9

4 D8 I/O DRAM data signal I/O 8

5 UDQM O SDRAM upper byte data mask signal output

6 SDRCK O SDRAM clock signal output

7 A11 O DRAM address signal output 11

8 A9 O DRAM address signal output 9

9 A8 O DRAM address signal output 8

10 A7 O DRAM address signal output 7

11 A6 O DRAM address signal output 612 A5 O DRAM address signal output 5

13 A4 O DRAM address signal output 4

14 LDQM O SDRAM lower byte data mask signal output

15 NWE O DRAM write enable signal output

16 NCAS O DRAM CAS control signal output

17 NRAS O DRAM RAS control signal output

18 NCS O SDRAM chip select signal output19 A3 O DRAM address signal output 3

20 A2 O DRAM address signal output 2

21 A1 O DRAM address signal output 122 A0 O DRAM address signal output 0

23 DRVDD1 I Power supply 1 for DRAM interface I/O

24 DVSS1 I Ground 1 for digital circuits

25 A10 O DRAM address signal output 10

26 *BA1 O SDRAM bank selection signal output 1

27 *BA0 O SDRAM bank selection signal output 0

28 DVDD1 I Power supply 1 for internal digital circuits

29 SPOUT O Spindle drive signal output (absolute value)

30 *SPPOL O S i dl d i i l t t ( l it )

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Pin No. Symbol I/O Function

60 LOOUTR O R-ch audio output for line-out output61 LOVDD1 I Power supply for line-out output

62 N.C. - -

63 TMON1 O Test monitor output 1

64 N.C. - -

65 N.C. - -

66 TMON2 O Test monitor output 2

67 DVDD3 I Power supply 3 for digital circuits

68 DVSS2 I Ground 2 for digital circuits

69 *EXT0 I/O Expansion I/O port 0

70 *EXT1 I/O Expansion I/O port 171 *EXT2 I/O Expansion I/O port 2

72 MCLK I Microcontroller command clock signal input

73 MDATA I Microcontroller command data signal input

74 MLD I Microcontroller command load signal input

75 *STAT O Status signal output

76 *BLKCK O Subcode block clock signal output

77 *SMCK O 4.2336-/8.4672-MHz clock signal output

78 *PMCK O 88.2-kHz clock signal output

79 *TX O Digital audio interface signal output

80 *FLAG O Flag signal output81 NRST I LSI reset signal input

82 NTEST I Test mode setting input

83 DVSS3 I Ground 3 for digital circuits

84 X1 I Crystal oscillator circuit input

85 X2 O Crystal oscillator circuit output

86 IOVDD2 I Power supply 2 for digital I/O

87 DVDD2 I Power supply 2 for internal digital circuits

88 D2 I/O DRAM data signal I/O 2

89 D1 I/O DRAM data signal I/O 1

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I IC503 M12L16161A

1) PORT ASSIGNMENT

2) BLOCK DIAGRAM

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Pin Name Input Function

CLK System Clock Active on the positive going edge to sample all inputs.

CS Chip SelectDisables or enables device operation by masking or enabling all inputs except

CLK, CKE and L(U)DQM.

Masks system clock to freeze operation from the next clock cycle. CKE

CKE Clock Enable should be enabled at least one cycle prior to new command. Disable input

buffers for power down in standby.

A0~A10/AP AddressRow/Column addresses are multiplexed on the same pins. Row address:

RA0~RA10, column address: CA0~CA7

BA Bank Select AddressSelects bank to be activated during row address latch time. Selects bank for

read/write during column address latch time.

RAS Row Address Strobe Latches row addresses on the positive going edge of the CLK with RAS low.Enables row access & precharge.

CAS Column Address StrobeLatches column addresses on the positive going edge of the CLK with CAS

low. Enables column access.

WE Write EnableEnables write operation and row precharge. Latches data in starting from

CAS, WE active.

L(U)DQM Data Input / Output MaskMakes data output Hi-Z, tSHZ after the clock and masks the output. Blocks

data input when L(U)DQM active.DQ0~15 Data Input / Output Data inputs/outputs are multiplexed on the same pins.

VDD/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.

VDDQ/VSSQ Data Output Power/Ground Isolated power supply and ground for the output buffers to provide improvednoise immunity.

N.C/RFU No Connection/ This is recommended to be left No Connection on the

Reserved for Future Use device.

I PIN Function table

I IC504 BA5810FM

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I IC505 AMC1117

I BLOCK DIAGRAM

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I IC601 PT2313L

RB

RB

TREB_RBIN_RBOUT_RLOUDRINROUTREFAGNDVDD

RIN1

RIN1RIN2

RIN2RIN3

RIN3

LIN3LIN3

Input

Selector

& Gain

Control

LIN2LIN2

LIN1

LOUT LIN LOUD_L BOUT_L BIN_L TREB_L

LFOUT

Mute

Mute

Mute

Mute

SpeakerATT

SpeakerATT

SpeakerATT

SpeakerATT

LROUT

CLK

DATA

DGND

RFOUT

RROUT

LIN1

2

11

10

9

13

14

15

17 16 12 19 18 4

25

23

28

27

26

24

22

3 1 7 6 8 21 20 5

Supply

Bass

Serial Bus Decoder & Latches

Bass

Treble

Treble

Voume

&

Loudness

Voume &

Loudness

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I IC801 TDA8571J

+

-

+

-

+

-

+

-

+

-

+

-

+

-

+

OUT4-

OUT4+

OUT3+

DIAGNOSTIC

OUT2+

V

OUT1+

OUT3-

OUT2-

OUT1-

20

22

19

17

9

5

7

4

2

2316

10

11

12

13

14

30 K¥  

30 K¥  

30 K¥  

30 K¥  

IN1

MODE

IN2

SGND

IN3

IN4

8115

ref

VP1

VP2

VP3

VP4

Vref

VDIAG

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2-25 2-26

❏ BLOCK DIAGRAM

TU10111,12

CET85XX

20 4,14

16,17,

18,19

2(LR)

9.4V 14V

24

72, 73, 74,

75, 76, 81

58, 60

29, 31, 35, 37

9,10,11,

12,13,14 7,8,20

1,2

4

5,6,23,26 15,16,17,18

10,14

13,1967

27

28

24,25

22,23

10,142

11,14

12,15

7,9

21,23

17,19

3, 52, 8, 18, 24

22

Q720,721,722,723

69~72

1~50

77~80

29

14, 19

73,74,75,33,34,7

71,69,68,70

32 2 55 10

1124 3 90 5 91 4

43

56, 57

66, 6788, 89

9.8304MHz

39

3841 42

32.768

15, 16, 17, 18

PICK-UP

CD MECHA

(4404R-C004A)

MOTOR

DRIVE IC(BA5810FM)

DSP IC

(MN6627933)

RF IC

AN22004A

OP AMP

S4560

RADIO VCCQ350,ZD313

LINE SW/E.VOLUME

9.4V REG

Q360,ZD361

POWER 5V

Q282,Q283

7.5V REG

Q310,Q351

3.3V REG

IC805

U-COM

uPD789166

KEY MATRIX

RESISTOR

RADER

RESETIC201

5V CONVERT

Q260, ZD261, D201

REG 10V

IC403

LCD DRIVER

LC75811W

LCD DISPLAY

PHONE MUTE

Q280,281

ACC DETECTORQ230,D231,D232

REMOTE

CONTROL

Q320,321

ANT CONTROL

Q390,391

POWER ONQ380,381

MUTE

CCNTROL

POWER AMP

TA8275H

L-SPEAKER

L-SPEAKER

FRONT

R-SPEAKER

REAR

R-SPEAKER

LINE-OUT

(OPTION)

CDC SIGNAL

PN801 #16BACK_UP

PN801 #10PWR_ANT

PN801 #6REMOTE

PN801 #14

ACC

PN801 #5PHONE

PN801 #11DIMMER

2(FL,FR)

2(RL,FR)

      2      (      R      L ,      R

      R

      )

4-CH

(FL,FR,RL,RR)

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❏ MAIN SCHEMATIC DIAGRAM

2-27 2-28

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2-29 2-30

❏ FRONT SCHEMATIC DIAGRAM

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2-31 2-32

❏ CDP SCHEMATIC DIAGRAM

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❏ PRINTED CIRCUIT DIAGRAM

1. LED P.C.BOARD

(COMPONENT SIDE)

2. FRONT P.C. BOARD

(COMPONENT SIDE)

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2-35 2-36

3. MAIN P.C. BOARD

(SOLDER SIDE)

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2-37 2-38

4. CDP P.C. BOARD(COMPONENT SIDE)

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