camera module 2017 - system plus consulting...©2017 by system plus consulting | camera module...

©2017 by System Plus Consulting | Camera Module Industry 2017 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Camera Module 2017Physical Analyses OverviewImaging report by Audrey LAHRACHNovember 2017


Table of Contents

Overview / Introduction 4o Executive Summaryo Reverse Costing Methodology

Physical Analysis 6

o Consumer smartphones 7

Rear-Facing 15

Standard

Samsung Galaxy S7

Samsung Galaxy S8

Sony Xperia XZs Dual

iPhone 7 Plus

Huawei P9 Huawei P10 Xiaomi Mi6 LG G6

3D Lenovo Phab 2 Pro

Front-Facing 184 Standard

Samsung Galaxy S7 iPhone 7 Plus Huawei P9 Huawei P10 Xiaomi Mi6

LG G6 Sony Xperia XZs Lenovo Phab 2 Pro

Dual/Iris Scanner Samsung Galaxy S8 Fujitsu Iris Scanner Arrows NX F-04G

o Automotive 291 TRW Bosch Continental Nissan Range Rover

Company services 352


Overview / Introduction/ Market

Physical Analysis

About System Plus

Executive Summary

This comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules(CCM) released in flagship smartphones from the major brands. In this report, rear and front-facing compact camera modules(including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structuraloverview, module integration, lens number and dimensions, CIS resolution, and pixel size. Indeed, OIS and dual-cameras arethe big new trends for mobile camera modules.

Since our last report in 2015, the automotive camera module has changed completely. Manufacturers have rationalized theircomponents in terms of size and number of boards and connectors, expressing their desire to get closer to the mobile cameramodule’s structure in order to reduce their manufacturing cost. Also, an analysis of five automotive camera modules (threeforwards and two surrounds) was realized to highlight the main differences.

Mobile is the main driver for technology, asking for more performance in a constrained footprint. Sensor technology has beentransformed by stacked BSI technologies.

This report explains the main players’ technology choices and provides a comparison between competitors.



Physical Analysis

About System Plus

The reverse costing analysis is conducted in 2 phases:

Component choice

•Teardown of the smartphone in order to have access to the Consumer Camera Module.•Automotive Camera Module are studied.

Physical analysis

•Package is analyzed and measured• Module are opened and dies are extracted to get data on dimensions, marking• Cross-section is made to have access to module structure

Executive Summary



Physical AnalysisConsumer

Rear-Facingo Standard

Samsung Galaxy S7Samsung Galaxy S8Sony Xperia XZs

o DualiPhone 7 PlusHuawei P9Huawei P10Xiaomi Mi6LG G6

o 3DLenovo Phab 2 Pro

Front-Facing

Automotive

About System Plus

Mobile CCM Analyzed – Rear Facing - Standard








Front-Facing

Automotive

About System Plus

Mobile CCM Analyzed – Rear Facing – Dual/3D








Front-Facing

Automotive

About System Plus

Mobile CCM Analyzed – Front Facing








Front-Facing

Automotive

About System Plus

Samsung Galaxy S7

Samsung Galaxy S7Rear-Facing

For more details, complete report is available !

http://www.systemplus.fr/fr/reverse-costing-reports/samsung-galaxy-s7-rear-camera-module/









Front-Facing

Automotive

About System Plus

Samsung Galaxy S7 Specs (from DeviceSpecifications)Samsung Galaxy S7

Rear-Facing

http://www.devicespecifications.com/en/model/29883c73











Front-Facing

Automotive

About System Plus

Camera Module with FlexSamsung Galaxy S7

Rear-Facing

Camera Module with Flex Top View

Camera Module with Flex Back View

Flex Marking Camera Module with Flex Global View

Connector xxxx Positions

Flex PCB

xxxx

mm

xxxx mm








Front-Facing

Automotive

About System Plus

Camera Module with FlexSamsung Galaxy S7

Rear-Facing

Marking: 601 2NWT

Gyro 2-Axis ST Microelectronics

LGA 16-pin

2.3x2.3x0.7mm

Marking: RAYOG

WLP 30-pin

3.7x3.2x0.45mm

Marking: Winbond

Q32FWXGIG

XSON

4x4x0.45mm








Front-Facing

Automotive

About System Plus

Camera Module Dimensions

• Dimensions without Flex : xxmm x xxmm x xxmm


Camera Module Side View

Camera Module Top View Disassembly

xxmm

xxmm

xxxmm

Connector xxx Positions








Front-Facing

Automotive

About System Plus

Camera Module TeardownSamsung Galaxy S7

Rear-Facing

Plastic Plate withIR Filter

Camera Module Disassembly overview

Camera Module Disassembly : top part (optic)

Camera Module Disassembly : bottom part








Front-Facing

Automotive

About System Plus


Rear-Facing

Camera Module Disassembly : bottom part

Passives components








Front-Facing

Automotive

About System Plus


Rear-Facing

Camera Module Disassembly : CMOS Image Sensor

Microlenses – SEM View








Front-Facing

Automotive

About System Plus

CIS View and Dimensions

Die Area: xx mm²(xx x xx mm)

Nb of PGDW per 12-inch wafer: xxx

Pad number: xxx

CIS top view (microlenses and color filters removed)

Xxx

mm

Xxx mm

xxxmm

Xxx m

m

Pixel array: xxx mm²(xx x xx mm)

CIS resolution: 4032x3024 (12.2Mp)

Pixel area: xx µm²

Pixel size: xx µm

Pixel Array









Front-Facing

Automotive

About System Plus

Camera Module Cross-Section - OverviewSamsung Galaxy S7

Rear-Facing

1

2

Cross-Section Planes

1

2

1

2








Front-Facing

Automotive

About System Plus

Camera Module Cross-SectionSamsung Galaxy S7

Rear-Facing

Camera Module Cross-Section – Optical View

Xx mm Xxx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm

Xx mm








Front-Facing

Automotive

About System Plus

Camera Module Cross-SectionSamsung Galaxy S7

Rear-Facing

Camera Module Cross-Section – Optical View

• All lenses are in xxxx.



Physical Analysis

About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

MEMS & SENSORS• Status of the CMOS Image Sensor Industry 2017• 3D Imaging and Sensing 2017

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

• Iris Scanner Samsung Galaxy S8• Sony IMX400 Tri-stacked Image Sensor• Lenovo Phab2Pro 3D Time of Flight Camera• Samsung Galaxy S7 Rear-Facing• Apple iPhone 7 Plus Rear-Facing Dual Camera Module• Huawei P9 Rear Facing Dual Camera Module• Fujitsu Iris Authentication IR Camera Module & IR LED• Camera Module Industry 2015 – Mobile CCM Technology Review

http://www.systemplus.fr/fr/reverse-costing-reports/camera-module-industry-2015/


http://www.systemplus.fr/fr/reverse-costing-reports/fujitsu-f-04g-iris-scan-authentication-ir-camera-module-ir-led/


https://www.i-micronews.com/category-listing/product/status-of-the-cmos-image-sensor-industry-2017.html?utm_source=Yole&utm_medium=email&utm_campaign=w_3DIMG_IRLaser_clients_2017

https://www.i-micronews.com/category-listing/product/p3d-imaging-and-sensing-2017.html?utm_source=Yole&utm_medium=email&utm_campaign=w_3DIMG_IRLaser_clients_2017

http://www.systemplus.fr/fr/reverse-costing-reports/samsung-galaxy-s8-iris-scanner/

http://www.systemplus.fr/fr/reverse-costing-reports/sony-imx400-tri-layer-stacked-cmos-image-sensor-cis-with-integrated-dram-and-dsp/

http://www.systemplus.fr/fr/reverse-costing-reports/lenovo-phab2pro-3d-tof-camera/


http://www.systemplus.fr/fr/reverse-costing-reports/dual-camera-apple-iphone-7-plus/

http://www.systemplus.fr/fr/reverse-costing-reports/huawei-p9-rear-facing-dual-camera-module/
















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Reports(>40 reports per year)

Costing Tools

Trainings



Physical Analysis


Contact

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camera module 2017 - system plus consulting...©2017 by system plus consulting | camera module...

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