btw 2010 an ieee 1149.7 update : standard reduced-pin and enhanced-functionality test access port...
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BTW 2010
An IEEE 1149.7 Update:Standard Reduced-pin and Enhanced-functionality Test Access Port and Boundary-Scan Architecture
Adam W Ley
ASSET InterTech, Inc.
2010 Sep 15
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Acknowledgements
the P1149.7 working group Stephen Lau of Texas Instruments Gary Swoboda of Texas Instruments
• who shall be recognized as the technical architect and principal author of 1149.7
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Outline
What is IEEE 1149.7? IEEE 1149.7 Key Objectives How it Works
• Selection Hierarchy• Capability Classes
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What is IEEE 1149.7?
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What is IEEE 1149.7 ?
Formally,
Standard for Reduced-pin and Enhanced-functionality Test Access Port and Boundary-Scan Architecture
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What is IEEE 1149.7 ?
NOT a replacement for IEEE 1149.1• rather, an adaptation and extension of it, built upon
it’s foundation and legacy Preserves
• the original Boundary-Scan Architecture- particularly for use in test and in-system configuration
Maintains compatibility with the standard Test Access Port while offering• Reduced Pin Count
- absolute minimum of 2 pins (down from 4)
• Enhanced Functionality- particularly for use in applications debug
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What is IEEE 1149.7 ?
Scope• Link between 1149.1-based Debug and Test Systems and
Target Systems• Additional layer adapts for new functionality and features• Link behavior includes timing, protocols, and functionality of the
adapters• Does not modify or create inconsistencies with IEEE 1149.1
(JTAG)• A compliant superset the IEEE 1149.1
Status• Formally adopted by IEEE-SA Standards Board 2009 Dec• Published by IEEE on 2010 Feb 10
Sightings• Adopted by MIPI and NEXUS 5001• Design and Validation support from IPextreme and Globetech• Semiconductor support announced by TI, Freescale, ST
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Adaptation of 1149.1 to 1149.7
1149.1IC
1149.7 chip
1149.1 “core”
1149.7adapter
“before” “after”
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IEEE 1149.7 Key Objectives
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IEEE 1149.7 Key Objectives
For Test• Maintain compliance with 1149.1 to preserve the
industry test infrastructure For Applications Debug
• Extend/ Advance capability to provide:- Reduced Power Modes
– Defined test logic power down- Improved Performance
– Shortened multi-chip chains– Glueless “star” configuration
- Reduced Pins- Links to “Instrumentation”
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SiP
die 1
die 2
die 3
TCKC TMSC
Through-silicon vias
Star topology for a 3-die SIP
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How it Works
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TDI
TDO
TCKTMS
Conventional series topology - highlighting the star wiring for TCK/TMS
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Notional view of the 1149.7 architecture
APU
PSL
EPU STL
RSU
TAP.7
TDI(C)TDO(C)
nTRSTTCK(C)TMS(C)
TAP.7 Controller
Advanced Protocol Unit
Pin Sharing Logic
Extended Protocol Unit
System Test Logic
Reset and Selection Unit
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Selection Hierarchy
Technology• Where the 1149.7 technology can be placed offline, the TAP.7 signaling
can be shared with other technologies Topology
• Where the constituent 1149.7 devices can be placed offline (a function required for T3 and above), the TAP.7 signaling can be shared among any topology branches, whether series, star-2, or star-4
Adapter (i.e., ADTAPC)• 1149.7 devices comprising a selected topology branch will share TAP.7
signaling and, where the topology branch is star-2 or star-4, a given device may be selected for a given operation
Chip (i.e., CLTAPC)• For a selected ADTAPC, the CLTAPC may be offline and will require
selection when it must be operated Core (i.e., EMTAPC)
• For a selected CLTAPC, given EMTAPC(s) of interest may be offline and will require selection when it (they) must be operated
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Key Features of the Capability Classes
Six classes of 1149.7 test access ports (TAP.7s), T0 - T5 Incremental capability, each higher builds upon the lower Class T0 – foundation
• 1149.1 behavior from start-up, even where multiple on-chip TAPs Class T1 – commands and registers
• common debug functions, features to minimize power consumption Class T2 – scan formats
• improved scan performance, optional hot-connection capability Class T3 – direct addressability
• operation in four-wire Series or Star Scan Topology Class T4 – packetization of scan data (2-pin scan formats)
• two-pin or four-pin interface; two-pin operation serializes 1149.1 transactions and provides for higher test clock rates
Class T5 – transport of non-scan data (2-pin mode)• data transfers concurrent with scan, utilization of functions other than
scan, and control of TAP.7 pins for custom debug technologies
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IEEE 1149.7 hierarchy of classes
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Test-Logic-Reset
10
Run-Test-Idle0
1 Select-DR-Scan
Capture-DR
Exit1-DR
Exit2-DR
Update-DR
Shift-DR0
Pause-DR0
1
1
0
1
0
0
0
1
1
1
1 0
Select-IR-Scan
Capture-IR
Exit1-IR
Exit2-IR
Update-IR
Shift-IR0
Pause-IR0
1
1
0
1
0
0
0
1
1
1
1 0
ab
T1, TAP FSM trajectories for Zero-Bit Scans
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T1, Zero-Bit Scans Create Control Levels
• Count the number of Zero-Bit-Scans (ZBS) to change the definition of BYPASS instruction.
• Lock control level when the Shift-DR state is reached.
Key:
1….
2….
Lock Control Level at 2.
BYPASSIR Register
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T1, Commands & Registers
Accepted at Control Level 2 Controller commands are 10-bit values. They consist of 2
consecutive DR scans while the controller is locked at control level 2.
Command Part 1 (CP1) provides the command Command part 2 (CP2) provides the immediate operand or
lower 5 bits of the command
Can create a three-part command• Can send/receive data values other than values embedded in CP2. • Crated by appending an additional DR Scan after the CP1 and CP2 to
transport a data value.
5-bit op-code
2 part Command
1st DR Scan
creates
X bits
3 part Command
3rd DR Scan
Access an EPU scan path
CP1
5-bit operand
2nd DR Scan
creates
CP2
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T2, Scan Formats
Adds 3 Scan Formats: Change the operation of scan• JSCAN0: Provides compliant IEEE 1149.1 operation• JSCAN1: Provides “Hot” connection and disconnection
protection• JSCAN2: Improved performance for Series connected
devices. • Write only register is used to specify the scan format
These 3 formats use two features:• Chip Level Bypass• TAP Selection
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TCK(C)TMS(C)
TDICTDOC
T3, Star-4 Topology
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T3, Elements of the TAP.7 Controller Address (TCA)
MSB LSB
34 27 26 11 10 00
NODE_ID[7:0] DEVICE_ID[27:12] Part Number
DEVICE_ID[11:0] Manufacturer
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TCKC
nTDI TMS TDOnTDI TMS TDO nTDI TMS TDOTMSC
state
T4, Scan packet serialization, OScan1
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TCKC
nTDI nTDI nTDInTDI nTDI nTDI nTDI nTDI nTDITMSC
Shift-xRstate
T4, Scan packet serialization, OScan7
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T5, Transport
Transport packet type is added to support:• Background Data Transfers (BDX)• Custom Data Transfers (CDX)
When BDX is enabled:• During link IDLE time, instrumentation data is transmitted• Transport packets are attached to the IDLE, PAUSE, or UPDATE states• DTC to target, target to DTC , Bi-Directional or custom transfers• Non-scan data is transferred (ex: instrumentation data)
When CDX is enabled:• Instead of SCAN, an alternate protocol is allowed to use the link during
SHIFT-DR TAP states • Transport packets are attached to the IDLE, PAUSE, or UPDATE states• Custom transfers on a clock by clock basis• Non-scan data is transferred
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Conclusion
IEEE 1149.7 is a complementary superset of IEEE 1149.1 (JTAG)• Reduced pins and enhanced functionality
Built on the foundation of 1149.1• rapid adoption possible/ expected
Compatibility for test Interfacing multiples
• cores on SOC• die in SIP• packages for POP
Debug improvements• hot-plug immunity• power management• optimization of scan throughput• access to debug instrumentation• access to custom debug technologies
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Further Discussion
Where have you seen 1149.7 chips on your boards?
Where will you see 1149.7 chips on your boards?
Where would you like to see 1149.7 chips on your boards?