bottom-up module reliability studies at asu - … · bottom-up module reliability studies at asu...

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Introduction Pilot Lines Bo#om-up Module Reliability Studies at ASU Mariana Bertoni, Govindasamy Tamizhmani, Stuart Bowden, Chris9ana Honsberg Ira A. Fulton Schools of Engineering, Arizona State University, Tempe, AZ, 85287 Characterization @ PRL Ø 6” Silicon process line for diffused and heterojunc9on cells ØBoEom-up Evalua9on of: ØMaterials ØProcessing steps ØEncapsulants ØLamina9on Advanced Processing Ø Copper, Nickel and Tin pla9ng Ø 20% Cells Ø 18% Modules Ø SunsV oc characteriza9on ØStandard and Unconven9onal Modules Band-to-band Emission at 1.1 µm V oc (mV) J sc (mA/cm 2 ) FF(%) Eff. (%) Area (cm 2 ) 727 38.7 78.2 22.0 239 V oc (mV) J sc (mA/cm 2 ) FF(%) Eff. (%) Area (in) 362 36.7 79.8 18.6 6x6 ØFlexible Silicon Cells ØHIT Cell Line ØDiffused Junc9on Cell Line Lamination Ø Indoor Tes9ng DSC, TGA Cell QE in a Module Cell IV in a Module Ø Outdoor Tes9ng Field Tes9ng Soiling Loss Monitoring Equipment ØAccelerated Tes9ng and Modeling Accelerated Tes,ng Field Tes,ng Pre-characteriza,on Post-characteriza,on Modeling Life,me Predic,on Walk-in Environmental Chamber UV weathering PRL Mission PID Test sta9on: Module and Cell Modeling: ReliaSoc, Pvsyst,Minitab, Tableau, SAS, JMP Walk-in UV chamber (a) IV Bifacial Electroplated Cell, (b) SEM, (c) EL, (d) PL Encapsulated using Fluoropolymer foil Front-to-front and front-to-back intercon. (a) EQE 125um and 60um cell (b) Absorp9on depth in Si (c) 60 um-thick cell before and acer encapsula9on

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Page 1: Bottom-Up Module Reliability Studies at ASU - … · Bottom-Up Module Reliability Studies at ASU Subject The poster was presented during the Identifying Synergies DuraMAT Workshop,

Introduction

Pilot Lines

Bo#om-upModuleReliabilityStudiesatASUMarianaBertoni,GovindasamyTamizhmani,StuartBowden,Chris9anaHonsbergIraA.FultonSchoolsofEngineering,ArizonaStateUniversity,Tempe,AZ,85287

Characterization @ PRL

Ø 6”Siliconprocesslinefordiffusedandheterojunc9oncellsØ BoEom-upEvalua9onof:Ø MaterialsØ ProcessingstepsØ EncapsulantsØ Lamina9on

Advanced Processing

Ø Copper,NickelandTinpla9ng

Ø 20%CellsØ 18%ModulesØ SunsVoccharacteriza9on

Ø StandardandUnconven9onalModules

Band-to-bandEmissionat1.1µm

Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(cm2)

727 38.7 78.2 22.0 239

Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(in)

362 36.7 79.8 18.6 6x6

Ø FlexibleSiliconCells

Ø HITCellLine

Ø DiffusedJunc9onCellLine

Lamination

Ø IndoorTes9ngDSC,TGA

CellQEinaModuleCellIVinaModule

Ø OutdoorTes9ngFieldTes9ng

SoilingLossMonitoringEquipment

Ø AcceleratedTes9ngandModeling

AcceleratedTes,ngFieldTes,ng

Pre-characteriza,on

Post-characteriza,on

Modeling

Life,mePredic,on

Walk-inEnvironmentalChamberUVweathering

PRLMissionPIDTeststa9on:ModuleandCellModeling:ReliaSoc,Pvsyst,Minitab,Tableau,SAS,JMPWalk-inUVchamber

(a)IVBifacialElectroplatedCell,(b)SEM,(c)EL,(d)PL

EncapsulatedusingFluoropolymerfoilFront-to-frontandfront-to-backintercon.

(a)  EQE125umand60umcell

(b)  Absorp9ondepthinSi(c)  60um-thickcellbefore

andacerencapsula9on