bottom-up module reliability studies at asu - … · bottom-up module reliability studies at asu...
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Introduction
Pilot Lines
Bo#om-upModuleReliabilityStudiesatASUMarianaBertoni,GovindasamyTamizhmani,StuartBowden,Chris9anaHonsbergIraA.FultonSchoolsofEngineering,ArizonaStateUniversity,Tempe,AZ,85287
Characterization @ PRL
Ø 6”Siliconprocesslinefordiffusedandheterojunc9oncellsØ BoEom-upEvalua9onof:Ø MaterialsØ ProcessingstepsØ EncapsulantsØ Lamina9on
Advanced Processing
Ø Copper,NickelandTinpla9ng
Ø 20%CellsØ 18%ModulesØ SunsVoccharacteriza9on
Ø StandardandUnconven9onalModules
Band-to-bandEmissionat1.1µm
Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(cm2)
727 38.7 78.2 22.0 239
Voc(mV) Jsc(mA/cm2) FF(%) Eff.(%) Area(in)
362 36.7 79.8 18.6 6x6
Ø FlexibleSiliconCells
Ø HITCellLine
Ø DiffusedJunc9onCellLine
Lamination
Ø IndoorTes9ngDSC,TGA
CellQEinaModuleCellIVinaModule
Ø OutdoorTes9ngFieldTes9ng
SoilingLossMonitoringEquipment
Ø AcceleratedTes9ngandModeling
AcceleratedTes,ngFieldTes,ng
Pre-characteriza,on
Post-characteriza,on
Modeling
Life,mePredic,on
Walk-inEnvironmentalChamberUVweathering
PRLMissionPIDTeststa9on:ModuleandCellModeling:ReliaSoc,Pvsyst,Minitab,Tableau,SAS,JMPWalk-inUVchamber
(a)IVBifacialElectroplatedCell,(b)SEM,(c)EL,(d)PL
EncapsulatedusingFluoropolymerfoilFront-to-frontandfront-to-backintercon.
(a) EQE125umand60umcell
(b) Absorp9ondepthinSi(c) 60um-thickcellbefore
andacerencapsula9on