board adapter us8 or xson8u packages with pitch = 0,5mm

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US8 / XSON8U BOARD ADAPTER 1. Package US8 dimensions 2. Other packages that have the same pad layout: SOT765; XSON8U VSSOP8 is also compatible if have a 0,5mm pitch Links: http://ics.nxp.com/support/documents/logic/pdf/an10161.pdf 3. Our PCB board DIL compatible Pitch Spacing: 2.54mm Distance between connectors 7,61 mm Board Material: FR4 Epoxy Fibreglass Hole Diameter: 0,95 mm Board Height: 11mm Board Width: 11mm Board Thickness: 1.5mm Copper Coating : chem. Niquel Gold Copper Thickness: 35µm No. of Copper Sides: 2 Solder mask yes ROHS Conform US8 p (pitch) 0,50 mm HE 2,9 – 3,1 mm E 2,9 – 3,1 mm D 1,9 – 2,1 mm b (pad width) 0,15 – 0,35 mm

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Board adapter for prototyping with devices with US8 or XSON8U packages.Pitch = 0,5mm. Have a ground plane ( bottom copper) and solder mask.

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Page 1: Board adapter US8 or XSON8U packages with pitch = 0,5mm

US8 / XSON8U BOARD ADAPTER

1. Package US8 dimensions

2. Other packages that have the same pad layout: SOT765; XSON8U VSSOP8 is also compatible if have a 0,5mm pitch Links:

http://ics.nxp.com/support/documents/logic/pdf/an10161.pdf

3. Our PCB board DIL compatible

Pitch Spacing: 2.54mmDistance between connectors 7,61 mmBoard Material: FR4 Epoxy FibreglassHole Diameter: 0,95 mmBoard Height: 11mmBoard Width: 11mmBoard Thickness: 1.5mmCopper Coating : chem. Niquel Gold Copper Thickness: 35µmNo. of Copper Sides: 2Solder mask yesROHS Conform

US8p (pitch) 0,50 mmHE 2,9 – 3,1 mmE 2,9 – 3,1 mmD 1,9 – 2,1 mmb (pad width) 0,15 – 0,35 mm

Page 2: Board adapter US8 or XSON8U packages with pitch = 0,5mm

CAD drawing with top and bottom layers Note: bottom copper layer have a pad for easy ground connection

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