BGA means a Ball Grid Array.

Invented in the early 1990.

BGA packages are used to permanently mount devices such as Microprocessors or Processors or CPU.

Provide more interconnection pins than can be put on dual in-line or flat package

It is use for various applications such as hand held electronics to computing to automotive environments.

Small package area.

Greater functions and more pins.

More Reliable.

Good conductivity and low overall cost.

Self - Centerize while PCB puddle welding, easy to put on tin.

Compared with TSOP, BGA is much smaller and better at radiating and conducting electricity.

What is the Re-works ?

BGA Re-works process as following Steps :

Step 1:

BGA Removal from circuit board:

Step 2:

Circuit board site cleaning:

Step 3:

BGA Reballing :

Step 4:

Component Attach/Re-soldering:

Away from inflammable and explosives.

Away from water and other liquids

Ventilated, dry place.

Less dust.

No heavy objects on the controlling box.

Not affected by airflow of air conditioner, heater or ventilator.

Use a power supply with little fluctuations in voltage

Fluctuation : 220V +-10.

Frequency fluctuation : 50Hz+-3

It is used to replace the faulty north bridge IC or south bridge IC.

It is also use to repair Mobile, Laptop, Servers, Desktop boards.

It is safely removed any IC from motherboard without damaging any thing.

Upgradation of on board or motherboard functionality.