best practices for stem capstone_07_07_15

Overview of Best Practices for Selecting and Executing STEM Capstone Projects – A guide for

Advisors and Mentors

Art Gooray, PhD

Formerly, Technology Commercialization Program Manager, Eastman

Kodak Co and Xerox Corp

And

Adjunct Technology Based Ventures/Innovation Professor, Wright State

University

• Technology Transfer/Technology Commercialization Focus

• Start to use Common Tools, Metrics and Requirements, in line with R&D Scientists/Engineers and Product Development Partners Commercialization

Capstone Project

Presentation Outline

• Innovation and Tech Commercialization

• Overview of the Time to Market (TTM) End to End

Commercialization Process

• Key Best Practices for Successful Capstone – Staging for

Tech Transfer

Well developed ‘Front End’ to focus R&D - Market, Product, Strategy,

Vision (MAP with VOC, competitive benchmarking, technology and

product platform planning)

Technology Readiness (Maturity) Requirements

Extending the Enterprise (Partnership) Co-development Model - Core

Competencies for Integrated Platform Solution

Capstone Project

Ex: University Partnerships for Effective Capstone Project Execution

School of Business•VOC Analyses

•Market Size, Growth, Trends

•Segmentation

•Competitive

•Analysis

•Core Competencies and Partnership

Analyses

•Business case analyses

•Entrepreneurship/innovation best practices

•Value Proposition

•Vector of Differentiation

•QFD – product specs

• Product Platform

•Technology Platform

•Partnership Plans

•Supply chain plans

•Validate Economic Case

•Technology Commercialization best practices

Market

Analyses

Technology

Solutions

Responses

MAP:

Clarity of Solution roadmap – Technology Platform and Product Platform

Deep Understanding of Market Segments

IP strategy

Initiatives to make the technology set disruptive – Creative thinking

Confirm the Business case analysis – ROI case studies

Evaluate potential issues with the TTM delivery model

Create and implement the various partnership models

All stake holders and value chain partners on the same page early

Accountability

In-depth knowledge of the business – who are the competitors and their strategies, how to gain market share, a long term sustainable plan for growth

Develop benchmarking and performance tracking metrics – time to profitability, slip rate, market share, etc

School of Law- IP

Strategy

Capstone Project

Office of Sponsored Research

Co-Development Commercialization Partners

Schools of Engineering/Arts & Sciences

Benchmarking Companies – Capstone in URQ

Capstone Project

Elements of Capstone Team Integration –I/O/C

Team

Transf.

Function:

-Overcome

Perceptual

Gaps

-Manage focus

-Use

Understandings

-Execute PDM

Input Output

Global

Cross

functional

Incentives

Processes

Capstone Project

KEY INITIATIVES FOR SELECTING AND EXECUTING CAPSTONE PILOT PROJECTS

• Market Attack Plan

• Technology and Product Platform Planning

• Technology Robustness Plan

• Licensing/Tech Transfer

• Partnership Model for Commercialization Integrated Solution

Capstone Project

INNOVATIONAND TECH

COMMERCIALIZATION

Capstone Project

INNOVATION

To Innovate (creating new technologies), first discover things and

then figure out how to put them to good use

Innovation - finding novel solutions to important problems and

as well as the opportunity to create new products and services

Disruptive Innovation –

New applications of existing

means or technologies

R&D Organizations

excellent at the

Discovery Phase

Need to ‘co-develop’

discovery with application

Phases - MAP

Capstone Project focuses on

Successfully Navigating the

Domains

http://www.digitaltonto.com/wp-content/uploads/2013/03/Innovation-Matrix-w-examples.png

http://www.digitaltonto.com/wp-content/uploads/2013/03/Innovation-Matrix-w-examples.png

Commercialization Innovation

Entrepreneurship

• The creation of an enterprise or business that has the chance of profit (or success)

• Creating Solutions for existing problems that have a customer need, using a well disciplined process (TTM, continuous feedback)

Technology Commercializing

• Commercialization -The process by which a new product or service is introduced into the general market

• Disruptive technologies introduce a set of attributes to a marketplace different than the ones that mainstream customers historically have valued

Capstone Project

Typical Capstone Design Steps

Assess EvaluateRecomm

end

Plan/

Design

Brainstor

m

MPSV Robustness

Focus on Best Practices for:

• Market, Product, Strategy, Vision (MPSV) - MAP

• Robustness - Technology Readiness Metrics

• Tech Transfer Requirements for Commercialization –

Partnerships for Integrated Platform Solution

Transfer,

License

Capstone Project

OVERVIEW OF END TO END INNOVATION COMMERCIALIZATION

PROCESS

- THE TIME TO MARKET (TTM) PROCESS- CAPSTONE PROJECT FOLLOW THE TTM PROCESS

Typical University Commercialization Process

Capstone Project

slide # 18

PlatformElementProposals

ProductProposals

ProductProposals

MarketAttackPlans

Corporate PlanningProcess

Portfolio Planning,RD&E Prioritization,

and Pipeline Management

MarketAttackPlans

Commercialize SelectMature

Filter Scan

Research Portfolio

Platform Pipeline

Product Pipeline

Deliver Value in Global Markets

Grow Revenue &Profits in Currentand New Markets

Delight Customers

Re

ve

nu

e

Tim e

$ ProductProposals

PlatformElementProposals

CorpMarketPortfolioStrategyVision

GroupMarketPortfolioStrategyVision

Tools / Engineering Environment / Info systems

Management Systems / Decisioning / Metrics

Voice of the Customer / MarketC

apab

ilit

ies

and L

ear

ning

Com

pan

y /

Team

Org

aniz

atio

n /

Cul

ture

Global Markets

Glo

ba

l Eco

no

my

World-wide Supplier Base

All A

vailab

le T

ech

nolo

gies

Com

peti

tion

End to End TTM Phases

Core Competencies / Skills and Knowledge / Resources

Phases 1 & 2- Technology Maturity

Technology Commercialization

Capstone Project

Confirm

Phase 1

Key Requirements for Technology Transfer – MAP, TPP, PPP and Tech Readiness (Phases 0, 1,2)

Product

Vision

Market Attack

Strategy

Platform Strategy

Ph 2Ph 3 Ph 4

Product Pipeline Strategy

Launch

A

ABCDEF

G

B

CD

E

FG

AB

C

DE

F

GH

I

B C D E F GHI

A

B

C

D E

F GA

B C D E F G

A

B C D E F

GH

I

A

B

C

D E F

GH

I A

Reu

se

Balance &

Select

Deliver

TTM SolutionProposal

-MAP

Ph 5

Technology Maturity

TechnologyReadiness

-Transfer

Phase 0

Time-To-Market OverviewPrinciples and Values

The TTM Program is an empowering framework of action that brings together industry best practices, while encouraging innovation enabling tailored implementations to be adapted to a variety of value-added business models.

Robust market-oriented front end for developing the Market and Product Strategy Vision and Market Attack Plans integrated with technology and value chain strategies and plans are fundamental to strategic management of the company

Customer first... focused on understanding what is needed to delight customers and achieve market success, with strong feedback linkages to the process “front end”.

Technology and Value Chain technology elements are matured and delivered, as reusable offering platform elements, through the use of a defined technology delivery process.

Offering-platform-based offering development, delivery and on-going support of the offering offerings in defined target markets over time .

Offering Programs are to be planned at benchmark or best-in-class schedules based on the TTM newness / complexity matrix.

Extensive, continuous use of customer feedback in each phase of the TTM Process.

Organizational learning and knowledge transfer is captured and applied to improve productivity and performance over time.

Capstone Project

BEST PRACTICES CAPSTONE PROJECT

- Market Attack Plan- Delivering Ready Technology

- Staging for Tech Commercialization – Extended Enterprise Partnership Planning

Technology Delivery/Transfer – Staging for Commercialization

Technical Reviews Market Attack

Plan

MPSV

Develop MAP

Document VOC

Prioritization

Assess Business Process

Change Needs

Plan Business Process Changes

Document Gaps to Requirements

Validate Deployment Plan

Share Lessons Learned

Verify

Performance

Enable Benefits

Plan Deployment Develop MPSV

Phase 1.0

Define

Phase 0

MPSV

Phase 4.0

Demonstrate Phase 3.0 (Gate 2)

Design Phase 2.0 (Gate 1)

Define

Phase 5.0

Deliver and Delight

Complete Business Process

Changes

Validate Business Process Changes

Perform Coherence Activities

Create Plan for end user

Solution

Proposal Solution

Definition

Solution Design

Stability

Solution Deployment

Readiness

Solution Production

Readiness

Document Customer

Business Reqs

Document Detail

Requirements

Assess

Technology

Prove

Technology

Validate Technology

Document Business Case

Update Business Case Validate Business Case

Engage Partners

Select Initial

Metrics

Update

Metrics

Commit

Metrics

Validate and Measure

Metrics

Reliability and Service

business

Metrics

MAP

Ready Technology Commercializing Technology

Extended Enterprise/Partnership

What is the Front End – MAP Output

Front End Is:

• Market-based

• Data-driven

• Integrated framework for cross-

functional planning and

execution

• Intended to deliver increased

profitable growth

• Collection of industry best

practices

• Customizable to fit different

situations/business needs

• Internally created strategy to

ensure buy-in

MAP Questions:

• What are competitors offering

• Is there an opportunity For

your Company

• What do we need to do

to take advantage of this

opportunity

• Is this a profitable business

(TTM metrics QCD’s)

Acquire Voice of the Customer (VOC) – Opportunity Exist?

WHO IS MY

CUSTOMER?

GOAL:

UNDERSTAND

AND FOCUS

ON THE VOICE

OF THE

CUSTOMER

Industry AnalysesCustomer ProfilesProduct PositioningMarket Segmentation

ManagersEngineersSales PeopleService Representatives

HOW CAN I

LISTEN?

Competitive Product AnalysesCustomers Surveys1-on-1 Customer InterviewsFocus Group InterviewsComplaints/Failure Analyses

QFD

HOW DO I

INTERPRET?

WHO SHOULD

LISTEN?

Capstone Project

Three Key Items for the TTM ‘Front End’ (MPSV)

S

AN

AL

Y

I S

RE

S

P

O

NS

E

M A R K E T

STRATEGIC BU PARTNERSHIP

Customer NeedsAnalysis

Size, Growth, TrendsSegmentation

CompetitorAnalysis

CompetencyAnalysis

EconomicCase

Value Chain Planssupply chain, channel& marketing programs

Value PropositionVector of Differentiation

Capstone Project

1.Market Attack

Plan (MAP).

Includes

Partnerships

Plans

2.Technology

Platform Plan

3.Product

Platform Plan

Product Lines& Platforms

Develop Upper Right Quadrants (URQs) – IP & Business Strategies

Ex: Upper Right Quadrant

Capstone Project

Capstone Project

Ex: Upper Right Quadrant

Scanning SET factors Leads to POGs (Product Opportunity Gap)

Ex: SET Factors for Margaritaville Frozen Concoction Maker

Ex: Part Differentiation Matrix (PDM) for a Vehicle

What is SWOT

SWOT is a summary of your

Strengths

Weaknesses

Opportunities

Threats

Internal

External

Capstone Project

Develop SWOT

Capstone Project

Develop Lean Canvas Project NameDate:

Iteration #x

Cost Structure

Customer Acquisition costs

Distribution costs

Partnerships Integration

People, etc.

Revenue Streams

Revenue Model

Life Time Value

Revenue

Gross Margin

Problem

Top 3 problems

Solution

Top 3 features

Key MetricsKey activities you

measure

Unique Value

PropositionSingle, clear,

compelling message

that states why you are

different and worth

paying attention

Unfair AdvantageCan’t be easily copied

or bought

Channels/Partnershi

psPath to customers

Customer

SegmentsTarget customers

PRODUCT MARKET

Capstone Project

DefinitionsProduct Platform Planning

The PPP is our roadmap for a set of related products with common elements and architecture. They are a way of

organizing thoughts about products and the technologies they contain. Product platforms provide a

meaningful level of aggregation of individual product and technology projects.

Technology Platform Planning

The TPP is our roadmap for core technologies and innovations required to support the PPP and the

MAP. The TPP is a set of projects and initiatives for the development of a technology that will provide the

technical basis for building and sustaining a competitive advantage.

Capstone MAP Table of Contents

Section A: Summary

Section B: Background

I. Strategic Objectives

II. Market Analysis

III. Technology Analysis

IV. Value Chain Analysis

V. Related Initiatives

Section C: Recommendations

I. Target Segments and Vector of Differentiation

II. Product Alternatives

III. Product Offerings

IV. Supporting Value Chain Strategies & Plans

V. Skills and Resources

Section D: Economic Case

Section E: Monitoring Plan

Capstone Project

Identify Technology Delivery Requirements

Requirements for Technology Transfer for Commercialization

• Technology Capability Demonstration Best Practices

• Technology Readiness (Maturity) Best Practices

Capstone Project

DEVELOP TECHNOLOGY ROBUSTNESS PLAN AND METRICS

• Identify all Failure Modes and Control Factors for Failure Modes

• Identify Integration Requirements

• Identify Key Manufacturing Requirements

• Prototype Planning - Description of Integration Performance Testing

Capstone Project

Technology Readiness /

Manufacturing Readiness

Design and Mfg.

Process Stability

Product QCDs

Productivity

Supply Assurance

3Design

& Specify Product

4

Demonstrate Product

6

DelightCustomers

5

Deliver Product

1Define

Product Platform & Technology

3.3 Define

Product

2Define

Product & Deliver

Technology

0

MPSV

Focus:

TTM Technology Delivery Phases

R&D Portfolio Management focuses on Phases 0,

1, 2

(do not preclude concurrent activity in the

technology commercialization delivery process)

Tech Transfer for Commercialization

Capstone Project

Technology Delivery/Transfer – Staging for Commercialization

Technical Reviews Market Attack

Plan

MPSV

Develop MAP

Document VOC

Prioritization

Assess Business Process

Change Needs

Plan Business Process Changes

Document Gaps to Requirements

Validate Deployment Plan

Share Lessons Learned

Verify

Performance

Enable Benefits

Plan Deployment Develop MPSV

Phase 1.0

Define

Phase 0

MPSV

Phase 4.0

Demonstrate Phase 3.0 (Gate 2)

Design Phase 2.0 (Gate 1)

Define

Phase 5.0

Deliver and Delight

Complete Business Process

Changes

Validate Business Process Changes

Perform Coherence Activities

Create Plan for end user

Solution

Proposal Solution

Definition

Solution Design

Stability

Solution Deployment

Readiness

Solution Production

Readiness

Document Customer

Business Reqs

Document Detail

Requirements

Assess

Technology

Prove

Technology

Validate

Technology

Document Business Case

Update Business Case Validate Business Case

Engage Partners

Select Initial

Metrics

Update

Metrics

Commit

Metrics

Validate and Measure

Metrics

Reliability and Service

business

Metrics

MAP

Ready Technology Commercializing Technology

Extended Enterprise/Partnership – Most important Subprocess

Technology Readiness What is Technology Readiness? Do I know how to manufacture a

product capable of the required performance levels at the lowest cost?

Not just an assessment of the goodness of a technology but also how well is it understood, and how the understanding yields lowest cost manufacturing methods. In other words, Technology readiness implies that the centerline of the design capability is centered on the manufacturing variability and the distribution of manufacturing variability remains within the design latitude.

Technology Readiness implies that the assessment of the problems set has been completed and there is no indication that a solution must be invented (beyond normal design engineering practice) for either the design or manufacturing process to achieve the specified performance.

ManufacturingVariability

Design Latitude that YieldsAcceptance Performance

PerformanceFailure

PerformanceFailure

Capstone Project

Tech Readiness Requirements Best Practices

CRITERIA Phase 0 –

Analysis &

Experiments

Phase 1–

Technology

Capability

Demonstrated

Phase 2a -

Technology

Maturity

Capability

Demonstrated

Phase 2b –

Technology

Robustness

Verified

LOW

RISK

CRITERIA

MET

1. Failure

Modes

Modes

Projected.

Test plans

approved

Failure modes

observed under

Nominal short-

run

test conditions

Failure modes

identified under

initial system/

subsystem

life test and stress

conditions

Failure modes

confirmed and

initial testing of

fixes completed

on Integrated

Test Rig (ITR)

Failure mode

solutions

validated

on product intent

hardware.

Criteria and

measurements

met.

2. Critical

Parameter

Development

Parameters

projected

Sensitivity

studies

and optimization

initiated

Critical parameterfirst optimization andsensitivity studiescompleted. Failuremodes controlled indesign intent integrated hardware

Critical parameter

second

optimization

completed and

fixes

to defined failure

modes confirmed.

Critical

parameter

verified on

ITR test.

Criteria and

measurements

met.

3. Latitudes Latitudes

projected

and approach

defined

Process

demonstrated

at nominal set

point

Control parameter

operating windows

defined through

test and analysis

Control parameter

latitude

demonstrated under

environmental and

life stress

conditions.

Control

parameter

latitude verified

on ITR test.

Criteria and

measurements

met.

4.

Manufacturabilit

y

-

manufacturability

confirmed with

partner

Preliminary parts

manufacturability

projected, UMC

goals

concurrence

Evaluate critical

parts

manufacturability

with partner

involvement. New

Mfg. capability

requirements

identified.

Preliminary

evaluation of

projected critical

specification

tolerances

completed.

Process capability

projected.

Tolerance and

variance analysis

of design intent

drawings

completed.

Supplier

confirmation of

manufacturability

of critical

specifications

completed.

Criteria and

measurements

met.

5. Prototype

Performance

Integrated

technology

robustness

demonstrated

Integrated

technology rig

requirements

listed. Hardware

designed.

Hardware built anddebugged. Operability,safety, consumables and environmental plansapproved.

Initial integrated

test complete.

Architecture

stable.

Prototype layout

approved.

Integrated test.

Verification and

tolerance tests

completed under

environmental

stresses.

ITR tests & life

assessment

completed.

Criteria and

measurements

met.

Key Phase 1 Requirements – Technology Capability Demonstration

•Demonstrate key product technical requirements attributes can be achieved

•Demonstrate ‘sustained performance’ with 70% confidence with typical ‘customer

applications’

•Integrated technology operating window developed

•100% of the CP’s nominal & 80% of the CP latitudes defined.

•Tolerance allocations defined for all process critical components.

•Mfg. Processes capabilities for critical components confirmed based on prototype

database.

•Life tests performed to project performance against targets.

•System integration requirements documented.

•Diagnostics for key/critical failure modes defined.

•Performance projected against quality, cost and delivery schedule requirements

•Technology operating document documented

•Extended Enterprise Partner (s) identified for specific subsystem (s).

• Integration design developed.

•Environmental, health and safety requirements documented. Serviceability assessed

•IP’s and right to use completed.

Technology Readiness Development Steps

1. Develop Big Picture of selected technology set

2. Select subsystem design concepts

3. Complete failure mode analysis of each subsystem- Select critical parameters and noises

4. Define initial critical parameter set points for design intent

5. Define life testing requirements, input parameters, stress tests

6. Complete subsystem latitude development hardware design

7. Complete design analysis and drawing audit that demonstrates critical parameter conformance of hardware to design intent (Critical Parameter Drawing Audit)

8. Build latitude hardware and audit conformance of hardware to design intent (Critical Parameter Hardware Audit)

9. Build life testing hardware and start life testing

10. Complete first optimization using Taguchi latitude testing and operating windows- Optimize S/N ratio and define CP ranges

11. Upgrade failure mode analysis and CP set points and ranges

12. Complete integrated breadboard system design

13. Complete CP drawing audit, build. Complete CP hardware audit

14. Upgrade subsystem latitude hardware

15. Start production intent design (using all TTM design practices)

16. Complete system latitude testing

17. Complete second subsystem latitude optimization

18. Continue life testing

19. Upgrade production intent design (using all TTM design practices)

20. Upgrade failure mode analysis, CP set points and ranges- Final design intent

21. Complete CP manufacturability analysis- Demonstrate CP latitudes can be enabled by normal manufacturing process

22. Complete performance analysis- Predict performance compared to goals

23. Performance and manufacturability analysis are positive- Start design phase- If not, go back to step 12

Capstone Project

Use Lean Six Sigma Tools

MeasureMeasure

• Operational

Definitions

• Data Collection

Plan

• Pareto Chart

• Histogram

• Box Plot

• Statistical Sampling

• Measurement

System Analysis

• Setup Reduction

• Generic Pull

• Kaizen

• Control Charts

• Process Capability,

Cp & Cpk

AnalyzeAnalyze

• DOE Full &

Fractional Factorial

• Conjoint Analysis

• RSM

• Taguchi

• Scorecards

• Pareto Charts

• C&E Matrix

• Fishbone Diagrams

• Brainstorming

• Supply Chain

Accelerator Analysis

• Non Value-Added

Analysis

• Hypothesis Testing

• Confidence Intervals

• FMEA

• Simple & Multiple

Regression

• ANOVA

• Queuing Theory

• Analytical Batch Size

ImproveImprove

• Brainstorming

• Benchmarking

• Process

Improvement

Techniques

• Line Balancing

• Process Flow

Improvement

• Constraint

Identification

• Replenishment Pull

• Sales & Operations

Planning

• Poka-Yoke

• FMEA

• Pugh Matrix

• TRIZ

• ‘To-Be’ Process

Maps

• Piloting and

Simulation

ControlControl

• Control Charts

• Standard

Operating

Procedures

(SOP’s)

• Training Plan

• Communication

Plan

• Control Plan

• Visual Process

Control

• Mistake-Proofing

• Process Control

Plans

• Project

Commissioning

• Project

Replication

• Plan-Do-Check-

Act Cycle

* Tool Array, based on LSS for

Service by Michael George

• Value Stream

Map

• Various Financial

Analysis

• Charter Form

• Multi-Generational

Plan

• Stakeholder

Analysis

• Communication

Plan

• SIPOC Map

• High-Level

Process Map

• Non-Value Added

Analysis

• VOC and Kano

Analysis

• QFD

• Pareto Charts

• RACI & Quad

Charts

DefineDefine MeasureMeasure

• Operational

Definitions

• Data Collection

Plan

• Pareto Chart

• Histogram

• Box Plot


• Measurement

System Analysis

• Setup Reduction

• Generic Pull

• Kaizen

• Control Charts


Cp & Cpk

MeasureMeasure

• Operational

Definitions

• Data Collection

Plan

• Pareto Chart

• Histogram

• Box Plot


• Measurement

System Analysis

• Setup Reduction

• Generic Pull

• Kaizen

• Control Charts


Cp & Cpk

AnalyzeAnalyze

• DOE Full &



• RSM

• Taguchi

• Scorecards

• Pareto Charts

• C&E Matrix


• Brainstorming

• Supply Chain


• Non Value-Added

Analysis



• FMEA


Regression

• ANOVA

• Queuing Theory


AnalyzeAnalyze

• DOE Full &



• RSM

• Taguchi

• Scorecards

• Pareto Charts

• C&E Matrix


• Brainstorming

• Supply Chain


• Non Value-Added

Analysis



• FMEA


Regression

• ANOVA

• Queuing Theory


ImproveImprove

• Brainstorming

• Benchmarking

• Process

Improvement

Techniques

• Line Balancing

• Process Flow

Improvement

• Constraint

Identification



Planning

• Poka-Yoke

• FMEA

• Pugh Matrix

• TRIZ


Maps

• Piloting and

Simulation

ImproveImprove

• Brainstorming

• Benchmarking

• Process

Improvement

Techniques

• Line Balancing

• Process Flow

Improvement

• Constraint

Identification



Planning

• Poka-Yoke

• FMEA

• Pugh Matrix

• TRIZ


Maps

• Piloting and

Simulation

ControlControl

• Control Charts

• Standard

Operating

Procedures

(SOP’s)

• Training Plan

• Communication

Plan

• Control Plan

• Visual Process

Control


• Process Control

Plans

• Project

Commissioning

• Project

Replication

• Plan-Do-Check-

Act Cycle

ControlControl

• Control Charts

• Standard

Operating

Procedures

(SOP’s)

• Training Plan

• Communication

Plan

• Control Plan

• Visual Process

Control


• Process Control

Plans

• Project

Commissioning

• Project

Replication

• Plan-Do-Check-

Act Cycle

* Tool Array, based on LSS for

Service by Michael George

• Value Stream

Map


Analysis

• Charter Form


Plan

• Stakeholder

Analysis

• Communication

Plan

• SIPOC Map

• High-Level

Process Map

• Non-Value Added

Analysis

• VOC and Kano

Analysis

• QFD

• Pareto Charts

• RACI & Quad

Charts

DefineDefine

• Value Stream

Map


Analysis

• Charter Form


Plan

• Stakeholder

Analysis

• Communication

Plan

• SIPOC Map

• High-Level

Process Map

• Non-Value Added

Analysis

• VOC and Kano

Analysis

• QFD

• Pareto Charts

• RACI & Quad

Charts

• Value Stream

Map


Analysis

• Charter Form


Plan

• Stakeholder

Analysis

• Communication

Plan

• SIPOC Map

• High-Level

Process Map

• Non-Value Added

Analysis

• VOC and Kano

Analysis

• QFD

• Pareto Charts

• RACI & Quad

Charts

DefineDefine

Ex: Image Quality Variability - Root Cause Analysis

Machine -Media &

Transport Environment -Aerodynamics

Material/Machine – Jets Within PH

Machine - Tiled JM

Overlap Method - Image Data

Algorithm

PH stitched drops fail to

meet cross track spec of

+/-10 mm

In Track

error

Media to brush

roll height

Cross Track

error

Tach

and

Cue

Drier air flow

PH airflow with image

content

Web speed

JM to JM

positioning

Neighboring

drop flight

interactions

DC servo variation

Silicon rev

Ink

concentration

control

DC airflow

with end jets

DC servo variation

JM to JM

Error in data

collection –

cameras, cue

sensors,

Stitch

Correction

Algo

Nozzle diameter variation

Pressure

comp

Measurement_- Test Target,

Data collection, Analysis

Representative test

target

Image data

(pixel shift)

algorithm

Data analysisMedia

dimensional

change

BP Temp

effects

DC position variation

Ink/Media surface energy changes

5 Why’s

Fishbone (cause/effect) Diagram:

The fishbone diagram helps with exploring all potential or real causes that result in a single

defect or failure mode.

Once inputs are established on the fishbone, can use the 5 Whys technique to drill down to the

root causes.

The 5 Whys is a technique used in the Analyze phase of the Six Sigma DMAIC

(Define, Measure, Analyze, Improve, Control) methodology. By repeatedly asking the

question “Why” (five is a good rule of thumb), you can peel away the layers of

symptoms which can lead to the root cause of a problem.

Step 1:

Example: Long start up time for a product defines the issues (Head of the fish).

Agreement on the issue definition is needed to solve it (the various bones for the

fish).

Step2:

Ask why; what is causing that issue (the various issues on the bone of the fish).

Write down the symptom (most direct reason) for that issue and get agreement

before proceeding. Ask why again and agree on the cause of the issue. Repeat this

until you have asked why typically 5 times to get to the root cause.

5 Why’s

Project Name Failure Analysis for long start up

Research #4 Team Date

Issue Description

Enter the agreed upon issue description. Ex: Engine will not start when cold

1. Why is it happening?

Enter the most direct symptom/cause of the issue: Ex: Lubricant viscosity too large


Enter the direct symptom/cause of the answer listed in the box above


Enter the direct cause of the answer listed in the box above


Enter the direct cause of the answer listed in the box above


Enter the root cause of the answer listed in the box above

Ex: Problem Management Process (PMP) - Definition

PROGRAM ASSESSMENT MATRIX

DESCRIPTIONS

PROBLEM

SOLVING

PROCESS

1Identifying

&SelectingProblem

4Selecting

&PlanningSolution

3GeneratingPotentialSolutions

2AnalyzingProblem

6Evaluating

Solution

5Implementing

Solution

Problem identified. No proposed solution.

Problem not understood.Hypothesis proposed.

Problem understood.Solution set proposed.

Solution set defined.Verification tests incomplete.

Verification tests complete.

Solution set demonstrated

PROGRESS

Issue Category

Critical

Major

Ordinary

Impact

Show Stopper Now!

Could Become AShow Stopper

An Annoyance

RequiredActions(s)

Issue must be resolved, replan required

Issue requires approved, corrective action plan, with an assessment of its achieveability when integrated with other

corrective action plans into overall program plan (s)

Manageable within normal day-to-day activites

PHASE TRANSFER

IMPLICATIONS

I

M

P

A

C

T

Critical

Major

Ordinary

1 2 3 4 5 6

PROGRESS AND IMPACT

SatisfactoryDiscretionaryAdditional actions required

Capstone Project

Ex: Problems / Issues Severity –IJ PH

IMPACT 1. Identifying

& Selecting

Problem

2. Analyzing

Problem

3. Generating

Potential

Solutions

4. Selecting &

Planning

Solution

5.

Implementin

g Solution

6. Evaluating

Solution

Critical

(Show Stopper

“Now”)

Ink Handling

Design

Initial Fill ,

time t =0

performance

Ink Cp’s

optimization

(ES process

physics)

Major

(Potential barrier to

subsequent phase

transfer – could

become a show

stopper)

Drop

formation

CP’s

identification

& modeling

verification,

design for

energy

efficiency

Print head

packaging

design (mech.,

elect.,

fluidics)

Ordinary

(Minimal impact on

QCDs)

Capstone Project

P- Diagram (Input Output Constraint Transformation Function)

OUTPUTS (O) LATITUDEINPUTS (I)

Primary

Dysfunctional

From a Subsystem or Manufacturing Process:

Failure Mode

Failure Mode

Main Function: The purpose of the subsystem / system

Primary Inputs: Any action, physical object, or energy that needs to be supplied for the main

function to perform its intended purpose

Dysfunctional Inputs: Any action, physical object, or energy which may limit or prevent the subsystem from

performing its intended purpose

The variation in all inputs are termed external noises

Primary Outputs: Measurable performance the subsystem is intended to provide. Also called the ‘Primary

Response’

Dysfunctional Output: By-products from the subsystem performance which may be Dysfunctional Inputs to

other subsystems

Constraints: Key program requirements that impact the design

Latitude : The output variation remains within the boundary of the failure modes when the

design is subjected to expected levels of input variation (from noise factors)

Failure Mode: The deficiency which occurs when the output performance no longer meets the reqmnts

CONSTRAINTS (C)

MAIN

FUNCTION

Capstone Project

EX: IJ Printer Maintenance Station I/O/CMS INPUTS

From Maintenance

Vacuum pressure, 50 – 200 mm Hg

(gage)

Vacuum Dwell time, 2 – 10 s

Capping Force, 25 – 50 gF/cm

Wiper blade force, 25 - 100 gF/cm

Spitting Wave form, 100 – 150% WS

threshold

OTHER SUBSYS INPUTS

Printer:

Carriage Scan Speed, 15 – 30 IPS

Carriage Acceleration < 2 g’s

Ink:

Surface Tension, 20-45 dynes/cm

pH 7 – 9.5

Viscosity, 1 – 2.5 CP @ 24 0 C, 50RH

Re-dissolution 2 (scale 1-5)

% Pigments, Humectants –ref. Ink

design

Print Head:

Nozzle dia 10 – 20 um

# of nozzles/col, native res – 640/1200

DPI

Ink/PH front face wetting angle, 10 – 75o

Ink tank:

Static pressure < 0.25” water vacuum

(gage)

MAIN FUNCTIONS:

Maintain Printhead health over 5year

at 4 corners temp 150C - 350C, RH

20%-80%

•Initial ink install

•Ink tank / PH replacement

•Remove clogged/crusted inks in

nozzles

•Spitting for Latency

•Wiping to maintain PH nozzle face

•Capping of print head during

standby/storage

•Waste ink management

SECONDARY FUNCTION

•Protect PH and prevent waste ink spill

after printer install

OUTPUTS:

To IQ:

Dot size back to WS spec

Drop Directionality back to WS spec

To PH :

Recover missing nozzles due to ink clogs

and crust w/ 99% confidence on first clean

operation

Recover misdirected nozzles due to front

face contamination w/ 99% confidence

Remove debris & paper fiber from PH face

To Firmware:

Ref. MS algorithms document

UNDESIRED OUTPUTS:

•MS induced cross contamination & air

bubbles

•PH front face wear

•MS induced noise <45 dB ?

•Ink spatter or aerosol in maintenance

areas

•MS ink leakage from storage areas, 0 cc

over life

MS CONSTRAINTS:

UMC < $5

Life of components ~ 5 years

Standby/storage mode - no

maintenance

Waste ink usage <15% printable ink

Waste ink diaper size < 800 cc

SYSTEM CONSTRAINTS

Ink Re-dissolution < 2 (scale 1-5)

Ink Latency > 5 sec

PH front face flatness < 0.25 mm

HSE Compliance

Contamination from Mfg. & PH usage

<5 ppm, 2 um size internal)

EX: Ink Subsystem DesignInputs:

Drop Ejector Requirements

Colorant concentration ( all colors)

Surface tension

Viscosity

Density

pH

Contact Angle wrt front face

Dissolved gas

Ink Delivery (Ink tank) Requirements

Viscosity

Gas permeability

Surface Tension

Solubility

Maintenance Requirements

Solubility

Viscosity

Media Set Requirements

Photo reqmnts

Plain Paer reqmnts

Ambient Drying Requirements

Surface Tension

% water by wt

% co-solvent

Viscosity

Duplex Requirements

% water, % co-solvent

Usage conditions & Design Noise

Standby/ sleep mode

Ink supply variation during printing

Machine RH, Temperature

Ink Raw Materials variability

Outputs:

Measuring and monitoring to ensure product goals are met.

Jettability Performance

Drop volume, velocity, Jitter, FMax

Maintainability Performance

Latency, washability, solubility,

Recoverability

IQ Perfromance

Spot size,Dmax, Dmin, Raggedness, , ICB, Mottle, Gamut, Cockle, Curl, Smear (wet & dry), misting, W’fast, L’fast

Drying Performance

Ambient Dry Time

Duplex Performance

Strike-thru

Properties Stability

Shelf Aging

Ink composition in device over time

Ink properties over time in ink delivery subsystem

Materials life:

Components life exposed to ink

Main Functions:

Deliver ink set that achieves the following in Printer System Architecture: jetting performance, IQ performance on media set, acceptable life of all materials in ink path, acceptable print head maintainability and operability

Constraints:RTU

HSE

Materials Compatibility

Properties stability at operating temperature

Stability over life

UMC

Time To Ink Flush (design nominal)

Manufacturability

Supply Assurance/ Quality

Ex: Process Physics, Drop FormationCP’s INPUT

From Drop Formation

Amplitude. Nom +/- V

pulse width

# of pulses

pulse position odd vs even

odd-even phase shift (static &

dynamic)

From DC

•Pos excess air

•Neg air

•Catcher vacuum

From WSO

Ink pressure,

From Ink

Viscosity, ? CP @ 24 0 C, 50RH

From System

Ambient, 150C - 400C, RH 20%-

80%

DOE TO VERIFY:

Quality of catch drops and print

drops

•Small drops in catch

•Large drops exit PH

•Large drops momentum

MEASURED OUTPUT RESPONSEDrop Formation Response

•1x

l/d , Nom 4.5, +/- 0.3 (Typically 3.9 to 4.2)

• Small Drop Merge : At 2.5 mm below the nozzle

plate, the merge rate should be less than 1 out of

1,000,000 drops

•3x

Large Drop Formation Length ( <1200 microns)

1x to 3x merges (no merges before 2.5 mm)

Satellites: (Distances from Nozzle Plate)

Sat. Merge Distance (< 700 microns )

Sat. Flight Time ( < 110 microns)

Sat. Volume ( > 0.1 pL)

Measurement: no satellite filter collection after 30

minutes of continuous running

6 hour runability test

No Print window degradation

No Ink accumulation on Condensation Shield

Drop Control:

PW, > 1.5 inches of Water

Spits, <# 0,25 mm/1000 prints

IQ Response (Measured)

Horizontal line quality

Vertical line quality

Spot size, 56 +/- 5mm

IQ Response (Qualitative Measure)

•Pattern dependent X-talk, <? (see 1x above)

•Air flow defects

DYSFUNCTIONAL OUTPUT:

•Pepper Spray, Less than 2 per square inch at 656 ft/min

•Catcher spitting, <0.5x0.5 mm

NOISE:From Ink

Viscosity, 1.5 +/- CP

Surface tension

% solids

pH 7, 9.5+/-?

From JM

NP hole size

From Customer Job

•Image type

•Pattern

From Mfg

•Contamination

•Parts tolerance

From Service

•Parts positioning

System Config Constraints

•Test with Condensation solution

•ASV box

•Air system

•Web at speed

•Drier set points

From Environment

•Temp range

•RH range

•Contamination

Ex: Critical Parameter (CP) Tracking List

CP = Critical Parameter to monitor process function not found on a drawing

CS = Critical Specification found on drawings monitored at new build or audits

CRITICAL PARAMETER DEVELOPMENT CRITICAL PARAMETER IMPLEMENTATION

S/S Parameter DescriptionCP orCS

1

Units

Critical ParameterValue

Set Range

Comment / FailureModes/Outlook/Schedule/Technical

Testing Capability

Nom Range

CurrentNom/(Date)

2

Capstone Project

Catcher film thickness CP micron

s

400 +/-20 Stray drops on media

Drop volume CP picoL 9.5 +/-0.25 White space, DD

• Parts variability

• Resources to qualify for IQ defects

• Correlation between test stands

• Spitting

• Parts scheduled delivery next week,

• IQ Artifact

• Tests Completed on test stand

• Analyzed Service Calls Data & Identified

Contributors to IQ

• Reviewed Manufacturing data

• Top integration issues identified

• Integration initiatives priority

o Process Physics Development

oSpitting

o IQ defects

o

• Continue Process Physics Development

• Testing of modified parts

• Fabricate and test DOE parts

• Gather more failures from customer sites

Ex: Integration Robustness MBF

Key Deliverables

Recent Accomplishments Plan (next 30 days)

Issues / Risks / Help or Decision Needed

Capstone Project

- Open Innovation Model for Tech Transfer

Develop Strategy for Tech Transfer -Extending the R&D Enterprise through

Partnerships

Extended Enterprise Relationship to other TTM Sub-processes

Program Planning & Management

3.1 3.2 3.3 3.4 3.5 3.6

Customer Input & Validation

Platform Planning & Management

Economic & Business Case Financials

Requirements & Specifications

Technology

Systems Engineering

Integrated Testing - Internal / External

Standards & Regulatory Compliance

Globalization

Performance Metrics & Measurements

Marketing / Sales & Distribution

Manufacturing & Logistics

Third Party Arrangements (OEM and JV)

Launch

Customer Services & Support

Skills & Resource Planning

3 Customer Satisfaction & Loyalty

MPSV

3.2

DefineProduct &

Deliver

Technology

3.1DefineMarket Attack

Plan &

Technology

3.3

DesignProduct

3.4

Demon-

strateProduct

3.5

DeliverProduct

3.6

DelightCustomers

Market &

Product

Strategy

Vision

Sub-Processes

Core

Process

Subsystems Engineering

Extended Enterprise

7

5

1

2

4

6

8

9

10

11

12

13

14

15

16

18

19

20

17

(HW/SW, Supplies, FW/Elex)

Capstone Project

Extending The Enterprise -Partnership/Open Innovation Model for R&D and Design and Manufacturing

Former approaches:

Product development has used several approaches:

•Complete build-to-print

•Sourcing to original equipment manufacturers (OEMs)

•Joint Ventures (JVs) with other manufacturers

The Extended Enterprise is . . .

•The utilization of global supplier relationships for component, subsystem, and

module design and manufacturing

•R&D Tech Transfer to enable maximum leverage of expertise and significant

improvements in product cost and TTM factors

Close existing gaps with existing enterprise:

•Engage appropriate partners

•Optimize partner value contribution

•Leverage unique product and process capabilities

•Access production and purchasing scale

•Retain ownership of proprietary technologies and critical product

development areasCapstone Project

Extended Enterprise PartnershipExtended Enterprise is not “outsourcing”

Extended Enterprise retains strategic internal control over:

• Areas that are critical to sustainable competitive advantage

• Product strategy, development, and execution

• Product synthesis

• Product development management

• Systems engineering and integration

Capstone Project

Extended Enterprise: A TTM sub-process

Extended Enterprise Deployment through out TTM

3210 54MPSV

Company defines:

• Market / business strategy

• Core competencies and

strategic enabling

technologies

• Market Attack Plans and

Product Strategies

• All sources of technology

(internal and external)

• Company specifies product (core

competencies)

• Company develops a set of strategic

partners that:

Deliver technology

Design non-strategic elements

Manufacture those elements

• Company designs strategic elements

and modules

• Company becomes world class in:

Systems Design

Systems Architecture

Systems Engineering

and Integration

Company controls (core

competencies)

• Launch

• Final integration

at Company or

non-Company sites

Company optimizes back

end Extended Enterprise

partnerships:

• Distribution

• Order fulfillment

• Service and support

Capstone Project

CRITERIA COMMENTSEX: PARTNER RATING FOR

SELECTION

Low

1 2 3 4

Hig

h 5(Quantify where possible)

TECHNICAL CAPABILITIESDevice Research, Design &

Development

• Number of RD&E personnel

(researchers, engineers, technicians,

designers, etc.)

X - approximately 60-70 people working on MEMS

development at any one time (analysis, design,

prototyping, testing / characterization)

- other skilled supporting resources available

(expertise, tools, etc.)

•Skills & experience base of RD&E personnel X - MEMS capabilities include; Surface

micromachining process (SUMMit), Micromolding

(High Aspect Ratio Structures), Integrated

Electronics / Mechanics, Sealed Diaphragm,

Phtonics / MEMS

- Skills, breadth of capabilities, experience

appears very high ….. analysis, design, test and

prototype fabrication;

- Ph.D. & Master level engineers & scientists

– microelectronic & micromachining process

development

– equipment design

– materials engineering

– device physics

– chemical engineering

– failure analysis & reliability physics

– circuit design, computer science, etc.

• Development Process

- Definition & Documentation

- Cycle Time & Resource Guidelines

- Project Planning Process

- Process Flexibility

- Design & Development Practices

X Typically uses gov’t / MIL–Std type of requirements

and phased development processes, relatively high

level of documentation … appears OK but such

processes have not typically been known for

benchmark TTM resultsCapstone Project

Capstone Project Desired Outcome

• Carefully Manage the TTM Front end and Technology Delivery Phases

• Monitoring Top Problems (Root Cause analysis, CA’s, etc)

Managing for Results – Meet VOCs and QCDs

Effective Knowledge Transfer for Licensing, Tech Transfer and for Commercialization – Technology Readiness

Capstone Project

Tech Positioning- Upper Right Quadrant (URQ)

Existing New

Market

Te

ch

no

log

y

Su

sta

inin

gD

isru

pti

ve

Highest

Risk

Lowest

Risk

Capstone Project

Capstone

Summary: MAP Partnership Teams Integration –I/O/C

Team

Co-Dev

Function:

-Overcome

Perceptual

Gaps

-Focus on VOC

-Use TR

knowledge

-Execute TTM

Input Output

Global

Cross

functional

Incentives

Processes

Competition

Tech Comm Best Practices

Co-Development

4/19/2016

Successful Today’s Innovators – Capstone Team

best practices for stem capstone_07_07_15

Documents