az 3300-f photoresist
TRANSCRIPT
8/18/2019 Az 3300-f Photoresist
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The information contained herein is, as far as we are aware, true and accurate. However, no representations
or warranties, either express or implied, whether of merchantable quality, fitness for any particularpurpose or of any other nature are hereby made in respect of the information con tained in thispresentation or the product or products which are the subject of it. In providing this material, no license orother rights, whether express or implied, are given with respect to any existing or pending patent, patentapplication, trademarks, or other intellectual property right.
AZ 3300-F Photoresist
Data Package
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3300-F Photoresist AZ 3312-F AZ 3330-F
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3300-F Photoresist
AZ 3312-F
Very fast resist
High resolution ( i-line 0.6µm, g-line 0.8µm)Excellent for contact holes, vias, implants, andnon critical gates
AZ 3330-F Great for pad layer applicationsCan be coated from 2.5 to 5µm
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
0
1
2
3
4
5
6
0 1000 2000 3000 4000 5000 6000 7000
rpm
F
i l m T
h i c k n e s s
[ µ m
]
AZ 3312-F AZ 3330-F
AZ 3300-F PhotoresistSpin Curves
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
Features & Benefits
◊
Why AZ ® 3300 Cross-over Resist?
⇒
Global infrastructure to support yourworldwide business with expanding localsupport networks
⇒ Excellent Performance and Value inall our products and services⇒ Wide selection of solutions to yourproblems
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
Features & Benefits
◊
Sensitivity to g , h , and i-line wavelengths◊
Process relatively insensitive to bake conditions,develop times, and develop temperatures
◊
Compatible with inorganic and organic (w/ & w/o
surfactant) developers◊
Thermal stability to 125°
◊
Good depth of focus, linearity, and photospeedfor crossover applications
◊
Very high stability against particle generation
◊ Excellent value for performance
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistSuggested Process Conditions
⇒ Spray/Puddle Process: – Softbake 90° -110° C,
– 60 - 90 sec – Expose: g -line, h -line, i-line
stepper or broadbandexposure source
– Where necessary, PEB:110°C, 60 - 90 sec.
– Develop: AZ 300 MIFdeveloper, 60 sec. spray-puddle
⇒ Double Puddle Process: – Softbake 90° -110°C,
– 60 - 90 sec – Expose: g -line, h -line, i-
line stepper or broadbandexposure source
– Where necessary, PEB:110°C, 60 - 90 sec.
– Develop: AZ 917 MIFdeveloper, 52 sec. doublepuddle
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistOptical Parameters
◊
Refractive Index
Bleached 365nm 405nm 435nmn 1.7006 1.6752 1.6611k 0.00805 0.00433 0.00331
Unbleachedn 1.7046 1.6872 1.6908
k 0.03251 0.03369 0.02028
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistOptical Parameters
◊
Dill Parametersi-line: g-line:
A = 1.0870 (µm-1) A= 0.6750 (µm-1)B = 0.0700 (µm-1) B= 0.0150 (µm-1)C = 0.0260 (cm 2/mJ) C= 0.0188 (cm 2/mJ)
◊
Cauchy Coefficients
A B CBleached 1.6217 0.01156 µm² 7.77E-07 µm 4
Unbleached 1.6200 0.00705 µm² 1.64E-03 µm 4
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F Photoresistg-line Swing Curve
30
35
40
45
50
55
60
0.950 1.000 1.050 1.100 1.150 1.200 1.250 1.300 1.350 1.400 1.450
Thickness ( m)
D o s e
( m J / c m
2 )
SB: 90°C, 60sec PEB 110°C, 60sec
AZ300MIF developer, spray puddle,60sec @ 23°C
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F Photoresisti-line Swing Curve
25
27
29
31
33
35
37
39
41
43
45
1.050 1.075 1.100 1.125 1.150 1.175 1.200 1.225 1.250 1.275 1.300 1.325 1.350
Thickness( m)
D o s e ( m J / c m
2 )
SB: 90°C, 60sec PEB 110°C, 60sec
AZ300MIF developer, spray puddle,60sec @ 23°C
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AZ 3312-F PhotoresistWith AZ 300 MIF Developer
Nikon i-line Stepper
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistExposure Latitude for 0.6µm Dense Lines, FT = 1.184 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @ 23°C
Nikon 0.54 NA i-line
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
44 48 52 56 60 64 68 72 76 80
Exposure Dose [mJ/cm²]
M e a s u r e d
L i n e w i d t h [ µ m ]
Nominal: 62mJ/cm²Exposure Latitude: 28%
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistExposure Latitude for 0.7µm Dense Lines, FT = 1.184 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @ 23°C
Nikon 0.54 NA i-line
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
45 50 55 60 65 70 75 80 85
Exposure Dose [mJ/cm²]
M e a s u r e d
L i n e w i d t h [ µ m ]
Nominal Energy: 63mJ/cm²Exposure Latitude: 34%
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistExposure Latitude for 0.8µm Dense Lines, FT = 1.184 µm
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
50 55 60 65 70 75 80 85
Exposure Dose [mJ/cm²]
M e a s u r e d
L i n e w i d t h [ µ m
Nominal Energy: 62 mJ/cm²Exposure Latitude: 35%
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @ 23°C
Nikon 0.54 NA i-line
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistExposure Latitude for 0.9µm Dense Lines, FT = 1.184 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @ 23°C
Nikon 0.54 NA i-line
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
50 55 60 65 70 75 80 85
Exposure Dose [mJ/cm²]
M e a s u r e d
L i n e w i d t h [ µ m ]
Nominal Energy: 62mJ/cm²Exposure Latitude: 39%
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistExposure Latitude for 1.0µm Dense Lines, FT = 1.184 µm
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
50 55 60 65 70 75 80 85
Exposure Dose [mJ/cm²]
M e a s u r e d
L i n e w i d t h [ µ m ]
Nominal Energy: 64 mJ/cm²Exposure Latitude: 48%
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @ 23°C
Nikon 0.54 NA i-line
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10Nominal Linewidth [µm]
M e a s u r e d
L i n e w i d t h [ µ
AZ®3312-F, 61mJ/cm²
AZ 3312-F PhotoresistLinearity for Dense Lines, Focus = - 0.20 µm, FT = 1.188 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle, 60sec @23°C
Nikon 0.54 NA i-line
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistBossung Curve; 0.7µm Dense Lines; FT = 1.18 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-2 -1.5 -1 -0.5 0 0.5 1 1.5
Focus
C D
46
495255586164
677073767982
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistDOF 0.7µm Dense Lines, FT = 1.18 µm , 61 mJ/cm 2
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
+0.2µm 0.0µm -0.2µm -0.4µm
-0.6µm
-0.8µm-1.0µm-1.2µm-1.4µm
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistBossung Curve; 0.8µm Dense Lines, FT = 1.18 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
-2 -1.5 -1 -0.5 0 0.5 1 1.5
Focus
C D
46495255586164
677073767982
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistDOF 0.8µm Dense Lines, FT = 1.18 µm, 61 mJ/cm 2
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
-0.8µm-1.0µm-1.2µm-1.4µm
+0.2µm 0.0µm -0.2µm -0.4µm+0.4µm
-1.6µm
-0.6µm
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistBossung Curve; 0.9µm Dense Lines, FT = 1.18 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-2 -1.5 -1 -0.5 0 0.5 1 1.5Focus
C D
46
495255586164
677073767982
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistDOF 0.9µm Dense Lines, FT = 1.18 µm, 61 mJ/cm 2
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
-0.8µm-1.0µm-1.2µm-1.4µm-1.6µm
+0.2µm 0.0µm -0.2µm -0.4µm+0.4µm
-0.6µm
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistBossung Curve; 1.0µm Dense Lines, FT = 1.18 µm
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
0.7
0.8
0.9
1.0
1.1
1.2
1.3
-2 -1.5 -1 -0.5 0 0.5 1 1.5
Focus
C D
46495255586164677073767982
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312-F PhotoresistDOF 1.0µm Dense Lines, FT = 1.18 µ, 64 mJ/cm 2
SB: 90°C, 60sec PEB 110°C, 60sec AZ 300MIFDeveloper, spray puddle,60sec @ 23°C
Nikon 0.54 NA i-line
-0.8µm-1.0µm-1.2µm-1.4µm-1.6µm
+0.2µm 0.0µm -0.2µm -0.4µm+0.4µm
-0.6µm
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3312- F PhotoresistThermal Flow
No Bake 115°C 120°C 125°C 130°C
Processing Conditions:
Film Thickness: 1.188µmSoft bake: 90°C/60sec, PEB: 110°C/60sec
Nikon i-line stepper, 0.54NA, AZ 300MIF Developer, 60sec spray/puddle @23°C
10 µm
1 µm
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AZ 3330-F PhotoresistWith AZ 300 MIF Developer
ASML i-line Stepper
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
200 220 240 260 280 300
AZ 3330-F PhotoresistExposure Latitude for 1.50µm Dense Lines, FT = 2.99µm
Exposure (mJ/cm²)
249 mJ/cm²21% Exposure Latitude
M e a
s u r e
d C D ( µ m
)
SB : 110°C for 60sec contactExposure : ASML/250 i-line , Conventional NA=0.60 sigma=0.75PEB : 110°C for 60sec contact
Develop: AZ 300 MIF developer / Single puddle for 60 sec @ 23°C
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3330-F PhotoresistExposure Latitude for 1.50 µm Dense Lines, FT = 2.99µm
SB : 110°C for 60sec contactExposure : ASML/250 i-line , Conventional NA=0.60 sigma=0.75PEB : 110°C for 60sec contact
Develop: AZ 300 MIF developer / Single puddle for 60 sec @ 23°C
200 mJ/cm² 210 mJ/cm² 220 mJ/cm² 230 mJ/cm² 240 mJ/cm²
300 mJ/cm² 290 mJ/cm² 280 mJ/cm² 270 mJ/cm² 260 mJ/cm²
250 mJ/cm²
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
0.5
0.75
1
1.25
1.5
1.75
2
0.5 0.75 1 1.25 1.5 1.75 2
AZ 3330-F PhotoresistLinearity for Dense Lines @ 250 mJ/cm², FT = 2.99µm
M e a s u r e
d C D ( µ m
)
Mask CD (µm)SB : 110°C for 60sec contactExposure : ASML/250 i-line , Conventional NA=0.60 sigma=0.75PEB : 110°C for 60sec contact
Develop: AZ 300 MIF developer / Single puddle for 60 sec @ 23°C
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
AZ 3330-F PhotoresistLinearity for Dense Lines, FT = 2.99µm
SB : 110°C for 60sec contactExposure : ASML/ 250 i-line , Conventional NA=0.60 sigma=0.75, 250mJ/cm²PEB : 110°C for 60sec contact
Develop: AZ 300 MIF developer / Single puddle for 60 sec @ 23°C
2.00 µm 1.80 µm 1.70 µm 1.60 µm 1.50 µm
0.80 µm 1.00 µm 1.10 µm 1.20 µm 1.30 µm
1.40 µm
8/18/2019 Az 3300-f Photoresist
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil areregistered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,SWG, and TARP are trademarks of AZ Electronic Materials.
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
-1.5 -1.25 -1 -0.75 -0.5 -0.25 0 0.25 0.5 0.75 1 1.25 1.5
SB : 110°C for 60sec contactExposure : ASML/250 i-line , Conventional NA=0.60 sigma=0.75PEB : 110°C for 60sec contact
Develop: AZ 300 MIF developer/ Single puddle for 60 sec @ 23°C
AZ 3330-F PhotoresistDOF for 1.50 µm Dense Lines, FT = 2.99µm
Focus (µm)
M e a s u r e
d C D ( µ m
)
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AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
AZ 3330-F PhotoresistDOF for 1.50 µm Dense Lines, FT = 2.99µm
1.00 µm 0.80 µm 0.60 µm 0.40 µm 0.20 µm
SB : 110°C for 60sec contactExposure : ASML/250 i-line , Conventional NA=0.60 sigma=0.75, 250mJ/cm²PEB : 110°C for 60sec contact
Develop: AZ 300 MIF Developer / Single puddle for 60 sec @ 23°C
-1.00 µm -0.80 µm -0.60 µm -0.40 µm -0.20 µm
0.00 µm