axis p1375-e network camera - system plus · 2021. 1. 13. · ©2021 by system plus consulting |...

©2021 by System Plus Consulting | Axis P1375-E Network Camera | Sample 1

22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Axis P1375-E Network CameraDiscover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.

SP20573 - System report by Benjamin PussatCost Analysis : Benjamin Pussat, Florian Rousseau, Audrey LahrachLaboratory : Youssef El Gmili, Peggy GalloisDecember 2020 – Sample

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4

o Executive Summary

o Main Chipset

o Supply Chain

o Specifications

o Block Diagram

o Reverse Costing Methodology

Company Profile 13

o Axis Communications

Teardown Analysis 18

o Views and Dimensions of the System

o System Opening

o Electronic Boards

✓ Top Side – High Resolution photos

✓ Top Side – PCB markings

✓ Top Side – Main components markings

✓ Top Side – Main components identification

✓ Top Side – Other components markings

✓ Top Side – Other components identification

✓ Bottom Side – High Resolution photos

✓ Bottom Side – PCB markings

✓ Bottom Side – Main components markings

✓ Bottom Side – Main components identification

✓ Bottom Side – Other components markings

✓ Bottom Side – Other components identification

o Lens Module

Cost Analysis 91

o Accessing the BOM

o PCB Cost

o ICs Cost

o Mechanicals Cost

o BOM Cost – Main Electronic Board

o BOM Cost - Mechanicals

o Material Cost Breakdown by Sub-Assembly

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Board Manufacturing Flow

o Details of the Main Electronic Board AV Cost

o Details of the System Assembly AV Cost

o Added-Value Cost Breakdown

o Manufacturing Cost Breakdown

Estimated Manufacturer Price Analysis 130

o Estimation of the Manufacturer Price

Feedbacks 121

System Plus Consulting Services 135


O V E R V I E WMETHODOLOGY


Overview / Introductiono Executive Summaryo Block Diagramo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Teardown Analysis

Cost Analysis

Manufacturer Price Analysis

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the P1375-E V1 NetworkCamera supplied by Axis (website).

For the calculations, for each reference, we estimate the following parameters :

Manufacturing quantity : 100,000 units

Manufacturing years: 2020

Manufacturing country : Thailand

Manufacturer Reference Description

AXIS ARTPEC-7 IC, SoC for Professional HD IP Camera, FCBGA633

SONY IMX327LQRx IC, CMOS Solid-State Image Sensor for Color Cameras, BGA110

MICRON MT53E128M32D2DS-053 IT:A IC, DRAM LPDDR4 4Gb (128Mbx32), WFBGA200 (Qty : 2)

TOSHIBA TH58NVG2S3HBAI4 IC, Flash Memory 4Gb (512Mb x 8) 25ns Parallel, BGA63

BROADCOM B50212EB1IMLG IC, 10/100/1000BASE-T Gigabit Ethernet Transceiver, QFN48

ANALOG DEVICES ADAU1361BCPZ-RL IC, 96kHz 24-Bit Audio Codec with Integrated PLL, VFQFN32

ON SEMICONDUCTOR LC89091JA-AH IC, Digital Audio Interface Receiver, SSOP16

Main Chipset

The main chipset summarizes the main integrated circuit functions found in the system.

https://www.axis.com/





Teardown Analysis

Cost Analysis


Related Reports

About System Plus

System Specifications

Source : Axis.com

https://www.axis.com/files/datasheet/ds_p1375e_t10129633_en_2010.pdf





Teardown Analysis

Cost Analysis


Related Reports

About System Plus


Source : Axis.com






Teardown Analysis

Cost Analysis


Related Reports

About System Plus

Block Diagram – Main Board (Board 1)The block diagram of the Network Camera is estimated in the following schematics:

P-Iris/Focus CTRL

* : ARTPEC-7 Key Specifications are assumptions





Teardown Analysis

Cost Analysis


Related Reports

About System Plus

The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modelized with the SYScost+ software.

The assembly and tests costs are estimated.

• Manufacturing cost & manufacturer price

Estimation of the manufacturing cost & manufacturer price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.

http://www.systemplus.fr/costing-tools/syscost_plus/

https://www.systemplus.fr/

http://www.systemplus.fr/





Teardown Analysis

Cost Analysis


Related Reports

About System Plus

Glossary

Acronym Definition

Al Aluminum

FPGA Field-Programmable Gate Array

ASIC Application Specific Integrated Circuit

IC Integrated Circuit

CMOS Complementary Metal–Oxide–Semiconductor

EDX Energy Dispersive X-ray spectroscopy

G&A General & Administrative

R&D Research & Development

BGA Ball Grid Array

LGA Land Grid Array

Ge Germanium

MEMS MicroElectroMechanical Systems

OEM Original Equipment Manufacturer

PCB Printed Circuit Board

ENIG Electroless Nickel Immersion Gold

HASL LF Hot Air Solder Leveling Lead-Free

Se Selenium

Si Silicon

As Arsenic

IR Infrared


COMPANYP R O F I L E


Overview / Introduction


Teardown Analysis

Cost Analysis


Related Reports

About System Plus

COMPANY PROFILE – AXIS COMMUNICATIONS

• 2019 Axis Financial Highlights (source):

o Sales revenues : 1 298 649 000 USD

o Gross margin : 630 201 000 USD (48.53%)

o Operating Profit : 176 836 000 USD (13.62%)

1 SEK = 0.11 USD

https://www.axis.com/files/brochure/Axis_Annual_Review_and_Sustainability_Report_2019.pdf




Teardown Analysis

Cost Analysis


Related Reports

About System Plus


Source : Axis.com

List of articles : https://www.axis.com/newsroom/press-release/axis-releases-new-network-video-chip-to-boost-security-solutionshttps://www.eit.lth.se/fileadmin/eit/courses/eitf35/slides/vlsi_lth_speakernotes_2017_for_distribution.pdf

Source : eit.lth.se

https://www.axis.com/files/brochure/axis_annual_review_and_sustainability_report_2019.pdf

https://www.axis.com/newsroom/press-release/axis-releases-new-network-video-chip-to-boost-security-solutions

https://www.eit.lth.se/fileadmin/eit/courses/eitf35/slides/vlsi_lth_speakernotes_2017_for_distribution.pdf

https://www.eit.lth.se/fileadmin/eit/courses/eitf35/slides/vlsi_lth_speakernotes_2017_for_distribution.pdf




Teardown Analysis

Cost Analysis


Related Reports

About System Plus


Source : Axis.com

https://www.axis.com/files/brochure/axis_annual_review_and_sustainability_report_2019.pdf




Teardown Analysis

Cost Analysis


Related Reports

About System Plus

Electronic components (ASIC/ASSP)

Supplier : AXISFoundry : TSMC (Taiwan)

PCBs

Manufacturing Country : ChinaPCBs manufacturer(s) : SUNTAK CCTC

Mechanicals (Plastics/Metal)

Manuf. country : ThailandMechanicals manufacturer: N/A

PCB assembly & tests

Assembly country : ThailandProduct assembler : N/A

Final product assembly

Assembly country : ThailandProduct assembler : N/A

Final product functional test

Assembly country : ThailandProduct tester : N/A

- In order to deliver a manufacturing price, we propose a simplified supply chain as below. For each section, assumptions about manufacturer or manufacturing country can be made if no information about manufacturing is founded (PCB, mechanicals, etc).

Supply chain

Electronic components (General)

Suppliers : Broadcom / Micron / Nexperia / Analog Devices / Texas Instruments / Hirose / Epson / Etc - Confirmed information (S+C)

- Not confirmed information (S+C)

- No information

COLOR LEGEND :

N/A - Not Applicable

M13VP288IR

Manuf. country : JapanLens Module manufacturer: TAMRON

Sensors (CIS)

Manuf. country : JapanSensor manufacturer: Sony

http://en.suntakpcb.com/

http://www.cctc-pcb.com/

https://www.tamron.co.jp/


TEARDOWNA N A LY S I S




Teardown Analysis o Views & Dimensionso System Openingo Electronic Boardo Lenses

Cost Analysis


Related Reports

About System Plus

Global View

Global views of the Network Camera

Total Weight: 2235 g





Cost Analysis


Related Reports

About System Plus

System Opening – Optical Part Removing

Board Cover130x105x38mm (1.5mm Av. Thick)

PC+ABS, 33.6g

IK10 Tool64x31.4x3mm (3mm Av. Thick)

ABS (estimated), 1.85g





Cost Analysis


Related Reports

About System Plus

Electronic Board 1 – Top Side – Angled View – High Resolution Photo





Cost Analysis


Related Reports

About System Plus

Electronic Board 1 – Top Side – Main Components Identification





Cost Analysis


Related Reports

About System Plus

Electronic Board 1 – Bottom Side – PCB Markings





Cost Analysis


Related Reports

About System Plus

Lens Module 1 - Dimensions

23.3 mm 15.3 mm

Lens material : GlassHousing Material : PC-GF30





Cost Analysis


Related Reports

About System Plus

Lens Module 1 – Cross-Section

xx mm

xx mm

xx mm

xx m

mxx

mm

xx m

m

Lens material : GlassHousing Material : PC-GF30


C O S TANALYSIS




Teardown Analysis

Cost Analysiso Assessing the BOMo PCB Costo IC Costo BOM Cost – Electronicso Material Cost Breakdowno Added-Value Cost


Related Reports

About System Plus

Assessing the BOM

The material cost corresponds to the purchasing price of the components (either electronic or not), as well asthe mechanical parts, composing the electronic system.

The price search of each reference is realized on the basis of catalogues and web sites of electroniccomponents distributors and manufacturers. It is often necessary to ask for specific quotations for sometargeted references.

Prices found during our researches among distributors and manufacturers are associated to quantities whichmay vary from a few units to several thousands or millions of pieces.

It is therefore mandatory to have reliable simulation rules that can be used for this type of extrapolation. Thesimulation rules used in this study come from previous analyses that have been conducted by System PlusConsulting and take into account parameters such as quantities, different types of distributors andmanufacturers, average profit margin on several types of products. These simulation rules have beenintegrated in the SYScost+ software to conduct the calculations.

The report details BOM cost for 100,000 units.

Note : All the prices of components can be modified using the Excel file associated to this report to see theirinfluences on results.




Teardown Analysis



Related Reports

About System Plus

Copper foils 0.0078$ 14.6%

Prepregs 0.0090$ 16.8%

Cores 0.0340$ 63.6%

Material overheads 0.0027$ 5.0%

Total substrate cost 0.0534$ 22.7%

Lamination 0.0046$ 3.8%

Mechanical drilling 0.0212$ 17.7%

Desmear 0.0010$ 0.8%

V-Scoring 0.0004$ 0.4%

Routing 0.0046$ 3.8%

Imaging 0.0228$ 19.1%

PTH metalization 0.0151$ 12.6%

Soldermask 0.0076$ 6.4%

Finishing 0.0312$ 26.1%

Electrical tests 0.0061$ 5.1%

AVI 0.0022$ 1.8%

Visual inspections 0.0013$ 1.1%

Final Quality Control 0.0011$ 0.9%

Packing 0.0005$ 0.4%

Total Process Costs 0.1196$ 50.9%

IPC Class 3 overcosts -$ #DIV/0!

Non-recurring expenses #DIV/0!

Total Other Costs -$

Quantity factor x 1.18

Total Manufacturing Cost 0.2042$ 87.0%

Warranty -$

Indirect OH 0.0041$ 1.7%

Direct OH -$

SG&A 0.0061$ 2.6%

Profit 0.0204$ 8.7%

Estimated Price 0.2348$ per board

Cost

2020

Cost

Substrate costs

Process costs

Other manufacturing costs

Selling price

2020

Cost

2020

Cost

2020

PCB Cost – Electronic Board 2




Teardown Analysis



Related Reports

About System Plus

Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.

Die Structure :Technology : CMOS active pixel solid-stateDie dimensions : 8.23mm x 5.33mmDiagonal : 6.46mmPad number : 117Wire bonding number : 116

Pixels Structure :Pixel area : 5.74mm x 3.34mmPixel Pitch : 2.9µmTotal Number : 1979(H)x1115(V) approx. 2.20M pixels

Estimation of the cost of the SONY IMX327LQRx




Teardown Analysis



Related Reports

About System Plus


Estimation of the cost of the SONY IMX327LQRx

Cost Breakdown

CIS Die cost $1.45 43.7%

Packaging cost (WB BGA) $0.43 12.9%

Ceramic Cost $0.80 24.1%

Glass substrate $0.15 4.6%

Final test & Calibration cost $0.42 12.7%

Yield losses cost $0.07 2.0%

Component Cost $3.3 100%

Sony Gross Profit $2.72 +45%

Component price $6.03

Final Test Yield 98.00%

Gross Margin 45.0%

2020

Sony

• The component price of the xxxx xxxxxxxxxxx is estimated at $xx.xx for 100K units in 2020.




Teardown Analysis



Related Reports

About System Plus

The circuit includes 1 Silicon die assembled into the package.

Die + parts of the substrate.(X-Ray top view)

Component opening(Top view)

Die + parts of the substrate.(X-Ray side view)

Estimation of the cost of the AXIS ARTPEC-7




Teardown Analysis



Related Reports

About System Plus

Estimation of the Main blocks: Digital, Analog, SRAM, Flash.Estimation of the Technology: CMOS 22nm, 11 Metal layers, 2 Polysilicon layers.Lithography steps : 55Wafer fab unit: TSMC Fab 15 – wafers 300mm, located in Taichung, Taiwan.


Die dimensions: 6.05mm x6.05mm = 36.6mm²Pad number : 1507

Estimation of the cost of the AXIS ARTPEC-7




Teardown Analysis



Related Reports

About System Plus

BOM Cost – Electronic Board 1 (1/4)




Teardown Analysis



Related Reports

About System Plus

Material Cost Breakdown by Component Categories (Details)

M à J


MANUFACTURINGPROCESS FLOW




Teardown Analysis



Related Reports

About System Plus

Assessing the Added-Value (AV) Cost

Assessing hypothesis :

The AV Cost, or Added Value Cost, corresponds to the assembly and test costs of sub-systems as well as electronic cards, with theircomponents, by taking into account :

• The depreciation cost of the machines used in the production line,

• The cost of the operators, technicians and of the production line manager directly linked to the production line of the studiedsystem,

• The cost of consumables, energy expenses, ground occupation and of the machines maintenance.

Note : The added-value cost calculation of oneBoard and the Final are detailed in the next pages. For details about the added- value ofthe other electronic boards, please see the Excel spreadsheet associated to this report.




Teardown Analysis



Related Reports

About System Plus

Step n° Step name Step Code Inline step? Side Auto/Manual Step Time (s) Equipment number Equip. Price (USD) Remark

1 Material preparation MP No - M 30s / reference 1 5,000

2 Storage buffer SB Yes - - 5s / board 1 20,000

3 PCB Cleaning C Yes - A 7s / panel 1 20,000

4 Stencil printing SP Yes 1 A 14.9s / panel 1 75,000

5 Solder paste inspection SPI Yes 1 A 10.25s / panel 1 110,000

6 Pick and place SMT x4 P&P Yes 1 A 45k SMT/hour 4 450,000 x4

7 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000

8 Reflow RF Yes 1 A 240s Cycle 1 125,000

9 Automated optical inspection AOI Yes 1 A 12s / panel 1 170,000

10 Storage buffer SB Yes - - 5s / board - 20,000

11 Automated X-Ray Inspection AXI No 1 A 29s / panel 1 400,000

12 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°2

13 PCB Cleaning C Yes - A 7s / panel 1 - Same machine as step n°3

14 Stencil printing SP Yes 2 A 14.9s / panel - - Same machine as step n°4

15 Solder paste inspection SPI Yes 2 A 10.25s / panel 1 - Same machine as step n°5

16 Pick and place SMT x4 P&P Yes 2 A 45k SMThour 4 - Same machines as step n°6

17 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°7

18 Reflow RF Yes 2 A 240s Cycle - - Same machine as step n°8

19 Automated optical inspection AOI Yes 2 A 12s / panel - - Same machine as step n°9

20 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°10

21 Automated X-Ray Inspection AXI No 2 A 14s / panel 1 - Same machine as step n°11

22 In-situ test ICT No 1+2 A 43.46s / panel 1 200,000

23/27 Storage buffer SB Yes - - 5s / board 1 20,000

24/28 Automatic THT Insertion ATI Yes 1+2 A 40s / panel 1 200,000

25/29 Selective Wave Soldering SWS Yes 1+2 A 240s Cycle 1 180,000

26/30 Automated optical inspection AOI Yes 1+2 A 21 / panel 1 170,000

31 Storage buffer SB Yes - - 5s / board 1 20,000

32 Depaneling DP No 1+2 A 20s / panel 1 120,000

33 Functional test FCT No 1+2 A 25s / board 1 300,000

34 Board conditioning BC No - M 5s / board 1 3,000

Panel size : 3 Boards Total equipment price : $ 4,128,000

Details of Electronic Board 1 Added-Value (AV) Cost

Details of the Electronic Board assembly process.




Teardown Analysis



Related Reports

About System Plus

Added-Value Cost Breakdown


MANUFACTURERP R I C E




Teardown Analysis

Cost Analysis

Manufacturer Price Analysiso Manufacturer Price

Related Reports

About System Plus

Estimation of the Manufacturer Price




Teardown Analysis

Cost Analysis


Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• Cameras and Computing for Surveillance and Security 2020• Status of CMOS Image Sensor Industry 2020

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• SP20574 - Hikvision Intelligent Thermal Network Camera

(DS-2TD2166-15 V1) • IRay Technology 12µm and 17µm Thermal Sensors

https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/

https://www.i-micronews.com/products/cameras-and-computing-for-surveillance-and-security-2020/

https://www.i-micronews.com/products/status-of-cmos-image-sensor-industry-2020/

https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/

https://www.systemplus.fr/reverse-costing-reports/iray-12%c2%b5m-and-17%c2%b5m-thermal-sensors/

https://www.systemplus.fr/reverse-costing-reports/iray-12%c2%b5m-and-17%c2%b5m-thermal-sensors/

https://www.i-micronews.com/products/cameras-and-computing-for-surveillance-and-security-2020/

https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/


COMPANYSERVICES




Teardown Analysis

Cost Analysis


Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings




Teardown Analysis

Cost Analysis


Related Reports

About System Pluso Company serviceso Contact

Contact

www.systemplus.fr

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 [email protected]

America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]

mailto:[email protected]




axis p1375-e network camera - system plus · 2021. 1. 13. · ©2021 by system plus consulting |...

Documents