Aurore Savoy-Navarro

LPNHE-Universités de Paris 6&7

SilC Collaboration

R&D Advances since St Malo

Si-Envelope design

Mechanics

Electronics

Future Prospects

SiLC COLLABORATIONSiLC COLLABORATION Status: International Collaboration started early 2002 [ChicagoWorkshop]

Aim: To pursue R&D on Si detectors for tracking at future LC

Who: Santa Cruz (Dorfan et al), SLAC (Jaros et al), Colorado, Tokyo, Wayne(Bellwied et al), MIT (Fisher), LPNHE, BNL; Several European & Asian (Japan, Korea and Taiwan) Institutes are also joining

Most of these groups have already a large or even sometime

proeminent expertise in this R&D domain.

Two detectors are considered:

The all-Si-tracker (SD)

The Si-envelope (LD or TESLA)

See: http://lpnhe-lc.in2p3.fr

http://blueox.uoregon.edu/~lc/randd.html

Si-Tracking concepts:

All-Si-tracker (SD)

Si-envelope

The SiLC Collaboration is pursuing independently of the detector concept, a generic R&D that focuses on:

Various sensor technologies

Short µstrips, long µstrips, SDD(contacts with Canberra, Hamamatsu, ST

Microelectronics)

R&D on Electronics FEE for each sensor case

Digitization, trigger logic,

Timing info(SDD)

Cabling & packaging

Power cycling issues

R&D on MechanicsTransparency, hermeticity, architecture,

support modularity, rigidity, deformation studies, cabling, cooling, alignement

Simulation studiesDeveloping the necessary tools:

Full simulation (GEANT4-based)

Fast simulation, Pattern recognition,

Tracking reconstruction algorithm(s)

Studies on Physics issues and needs (precision, dE/dX…), Detector

performance studies, including

comparisons between different

detector techniques and concepts.

A lot is underway in the Collaboration,

with many different tools available

(legacy from previous experiments)

WE BENEFIT FROM:WE BENEFIT FROM:

the already existing expertise gained by:the already existing expertise gained by:

Precursors: Precursors: The LEP Microvertex detectors (6 µstrip sensors/ladder)

STAR (SDD µvertex) ALICE

Larger area Si-tracking:

CDF at Run II: 3.5 m2 µstrip detectors

AMS with about 6 m2 µstrip ladders [up to 15x4.2cm length]

ATLAS and CMS very large area Si-trackers

[the next generation: ~ 200 m2]

Working in collaboration with these experiments . OUR PURPOSE is to start from the present state-of-the-art to push further this R&D for outcomes not only for the LC, but also for:

upgrades of the LHC experiments

developments of trackers for astro particle experiments

!!!!!!!!!!!!!THINNESS!!!!!!!!!!!Long µstrips/ladders

Long shaping time FEEPower cycling

Passive cooling (ultimate?!)Fine granularity (pitch size)

high precision (centroid) Thin detectors (<or = 300µm)

ratio width/pitch!Reduced cost

Sadrozinsky ‘s lawThin mechanical structure

If B-field = 5 T (compact detector), demanding magnet design

R&D ADVANCES since St MALO

J.E Augustin,M. Baubillier, M. Berggren, B. Canton, C. Carimalo, C. Chapron, W. DaSilva, D. Imbault, F. Kapusta, H. Lebbolo, F. Rossel, A. Savoy-

Navarro, D. Vincent [LPNHE-Paris]

1) Setting up the Lab Test bench:

Contacts with AMS and CMS Collaboration and Hamamatsu

2) Pursuing R&D on mechanics:

EUCLID CATIA (Detailed design)

Progress on the Si-FCH design

Studies of cooling issues:

on a mechanical prototype of the drawer

with appropriate software packages

First realizations of C-fiber prototypes, to test feasibility of drawers &

honeycomb structure

1)1) TEST BENCH for Si-SENSORS & FEETEST BENCH for Si-SENSORS & FEE

SCIPP+SLAC:SCIPP+SLAC:

Currently developing the simu of the Si-detector pulse development to begin to understand questions associated with high B-field, diffusion, pulse sharing etc… that will affect the design of the FEE chip.

Present scope: to demonstrate low-noise and power switching for the FEE amplifier of a long shaping time readout system.

Testing a 2m long ladder made with 10cm long sensors, 250µm pitch (GLAST)

LPNHE Paris:LPNHE Paris:

Currently installing the test bench:

1st ladder prototype = 5 AMS sensors (4.2 cm long, 56 µm pitch, 200 µm width, bonding allowing to test: 20, 40, 60, 80 cm… long µstrips and various RO pitch sizes)

2nd ladder prototype = 6 CMS-TOB sensors, > or = 9.45 x 6 cm long µstrips (183 µm pitch, 500 µm width)

Objectives:Objectives: 6 ‘’ 12 ‘’ wafers

500 µm 300 µm width

183 µm 50 to 100 µm pitch

Double-sided (double metalisation)

Better yield (> 50%) & cheaper

Preliminary FEE studies: Preliminary FEE studies: characterizing output signals on test bench, looking for low noise preamp on the market & developing one.

2) R&D on Mechanics: Basic elements of the detector design2) R&D on Mechanics: Basic elements of the detector designLadder

drawer

Honeycomb structure

Moving from EUCLID to CATIA

The long drawer is made of 5 ladders; each ladder is made of 6 CMS-TOB sensors. The drawer is about 2.5 m long.

Ladder: 6 sensors

R&D on Mechanics con’td: Si-FCH DESIGN

Modularity: ladders with 4,5or 6 sensors

4 Quadrants

4 XUV made of 6 2-sided sensors: 4 XU & 2 VV

XUVVUXXUVVUX

The Si-Envelope, CATIA-CAD design

CATIA design of the outside central part of the Si-Envelope: SET

CATIA design of the Si-FCH honeycomb structure

The Si-envelope components in a few numbers:

Si-envelope Component Items Total Number

Si-FCH (XUV) Nb of layers

Nb of ladders , 4 sensors

Nb of ladders, 5 sensors

Nb of ladders, 6 sensors

Nb of RO channels/endcap

Power dissipation

4 XU + 2 VV

192

480

288

983,000

393 Watts

SET Nb of layers

Nb of ladders

Nb of RO channels

Power dissipation

2 1-sided + 1 2-sided

4480

2,293,760

920 Watts

SIT Nb of layers

Nb of ladders

Nb of RO channels

Power dissipation

2 2-sided

38 + 94 =132

270,336

110 Watts

R&D on Mechanics cont’d: C-FIBER PROTOTYPES

Honeycomb structure: Several French firms contacted No pb foreseen to realize the proposed honeycomb structure within the required dimensions

C-fiber structure for drawers: Mechanical studies, design and fabrication of tools + cast of C-fiber structure drawer section done at LPNHE-PCC

1st prototype drawer structure: 2 mm thick & 20 cm long. Need to go to 1 mm thick & 2.5m long Doable but easier by cutting structure into 2 pieces.

R&D on Mechanics cont’d: COOLING STUDIES & TESTS on PROTOS

Entre les résistances

27

27,2

27,4

27,6

27,8

28

28,2

28,4

28,6

28,8

0 50 100 150 200

abscisse ( cm )

tem

pér

atu

re (

° C

)

60 V

82,5 V

Résistances 1 2 3 4 5Température

( ° C )38,2 40,0 39,9 38,8 37,0

Température en fonction de la résistance

36,5

37

37,5

38

38,5

39

39,5

40

40,5

0 1 2 3 4 5 6

résistance

tem

péra

ture

( °

C )

60 V

Aim: Test if water cooling at end of the 2.5 m long drawer OK vs FEE power dissipation (0.2watt/ladder)

Modelling of 2.5 m drawer with C-fiber board, made of 5 parts, each one =60cm ladder. FEE = resistor (0.8 or 1.4 Watt). Higher power dissipation & very localized so much worse than anticipated.

Natural air convection: T°C varies at most 8°C

Nord 40,7 33,6 29,7 28,8Est 44,1 32,7 29,6 28,7Sud 37,2 31,4 29,9Ouest 45,5 33,8 30,1 29,1

Température ( °C )

Peripherie d'une résistance

25

30

35

40

45

50

0 1 2 3 4 5 6

Eloignement par rapport à la résistance ( cm )

Tem

per

atu

re (

° C

)

NORD

EST

SUD

OUEST

A simple water cooling at the edge of the drawer looks sufficient

Measuring temperature decrease in the resistor neighbourhood rapid decrease

Measuring Temperature without naturalconvection (~80% suppressed), T(coolingwater=19degC) results similar to natural convection, so Grad T<<10 degC

Simulation studies: developing full GEANT4-based simu. The detailed CAD mechanical design = instrumental to define the geometry DB = 1st step

Tokyo is developing a full GEANT4 simu for the SD tracker

So full simulation work is really starting now.

All these issues are underway. A lot has been achieved since the first ECFA-DESY Extended Studies Workshop at Cracow in September ‘01

First results on long ladder characterization & FEE developments (next ECFA-DESY Workshop)

R&D on Mechanics aiming on:

Detailed CAD Design, CATIA-based of the Si-Envelope.

Building realistic prototypes of: a long ladder (Lab), a long

drawer(Lab) a piece of honeycomb support structure(Industry)

Cooling tests on realistic mechanical proto & comparison with software computations (ACORD, SAMCEF)

Simulation studies: Main aim = developing a GEANT4-based detailed simulation (including pattern recognition)

Further developments of the SiLC Collaboration