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AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben Tel +43 (0) 3842 200-0
www.ats.net
AT&SFirst choice for advanced applications
Investor and Analyst PresentationMay 2018
Investor and Analyst Presentation 1
Table of Contents
Company Overview
Strategy & Market
FY 2017/18 & Outlook
Annex
Investor and Analyst Presentation 2
AT&S – outstanding 2017/18 results
High-end interconnect solutionsfor
Mobile Devices, Automotive, Industrial, Medical
Applications and Semiconductor Industry
Highest revenue
in AT&S history€ 991.8 m (+21.7%)
EBITDA€ 226.0 (+72.6%)
22.8%EBITDA margin
46.5% Equity ratio
9,981employees
Dividend proposal
0.36 €
Investor and Analyst Presentation 3
Market Segments & Product Applications served by AT&S
3
Computer, Communication,
Consumer
Smartphones, Tablets, Wearables, Ultrabooks,
Cameras…
Industrial
Machine-2-Machine Communication,
Robots, Industrial Computer,
X2X Communication
…
Automotive
Advanced Driver Assistance Systems,
Emergency-Call, X2X Communication
…
Medical
Patient Monitoring, Hearing Aids,
Pacemaker, Neurostimulation, Drug
Delivery, Prosthesis
…
IC substrates
High Performance Computer, Microserver
…
Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical
Investor and Analyst Presentation 4
Our competitive advantages
Strategic focus on high-end technologies and applications
Outstanding process know-how and process efficiency
First high-end IC substrates manufacturer in China
Scale innovation and technology leverage between customer segments
Highest quality
Investor and Analyst Presentation 5
AT&S – Key Facts
542590
667
763815
992
102 127168 168
131*
226
31 5490 77*
7*
90
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Revenue EBITDA EBIT
Good track record1 Balanced portfolio/Global customer base2
7%
Split revenue: Business Unit, FY 2017/18
Split revenue: Customer Region, FY 2017/18based on sold to party
+9%+13%
+14%+7%
* Based on ramp-up effects for new plants in China
Revenue growth
€ in millions
66%
34%Mobile Devices & Substrates
Automotive, Industrial, Medical
63%21%
10%6% Americas
Germany/Austria
Asia
Other European countries
+21.7%
Investor and Analyst Presentation 6
Global footprint ensures proximity to supply chain & cost efficiency
1,008* 394* 1,143* 2,361* 4,694* 307*
Plant Shanghai China
Plant AnsanKorea
Plant ChongqingChina
Plant Leoben, HeadquartersAustria
Plant FehringAustria
Plant NanjangudIndia
AT&S plant & sales office
AT&S sales office
AT&S Headquarters
*Staff, Average, FTE, FY 2017/18; 73 employees in other locations
Investor and Analyst Presentation 7
Table of Contents
Company Overview
Strategy & Market
FY 2017/18 & Outlook
Annex
Investor and Analyst Presentation 8
From vision to strategy
Targets/Key PerformanceIndicators
Strategy
Expansion of technology leadership• Leading provider of new interconnect solutions• Innovation revenue rate: > 20%
Focus on high-end technologies and applications Focus on innovative solutions “More than AT&S”
Medium-term profitable growth• Medium-term revenue target of € 1.5 billion• Medium-term EBITDA margin target of 20-25%
Focus on fast-growing and profitable applications Highest service level and customer orientation Operational excellence Focus on cash flow generation
Creation of shareholder value• Long-term ROCE ≥ 12%
Sustainable business development with focus on ROCE Transparent dividend payout
Vision:“First choice for advanced application”
Sustainable Management• Fulfill and further develop standards in the area
of quality, environment, health & safety…
Human resource development Uphold business ethics
Investor and Analyst Presentation 9
Strategic focus on high-end technologies
AT&S Revenue structure in FY 2017/18 – based on technologies
High-endHDI PCBs andIC substrates
~ 30%
Single-sided (SS), double-sided (DS), multilayer- (ML), flex and rigid-flex (RF) PCBs
~ 70%
High-end technology share > 75% HDI and any-layer PCBs, Embedding, IC
Substrates
Complementary technology share: < 25% SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies
Source: Prismark PCB Report 2Q17/ August 2017; AT&S Controlling
Investor and Analyst Presentation 10
Market trendsMiniaturization and modularization still the main trends
10
Yole , AT&S AG (2018)
Mobile Phone
Desktop
Notebook
Smartphone
Tablet
Convertible
Internet
of
Things
AR&VR
Virtual
Reality
Artificial
Intelligence
(AI)
Smart Home
Smart Cities
Smart Speaker
Smartwatch
Datacenter/
ServerVehicle
electrificationAutonomous
driving
“real time”
Connectivity
(5G)
~ 2000 ~ 2010
COMPUTING &
CONNECTIVITY
+ SENSING + ACTUATING
~ 2020+
Investor and Analyst Presentation 11
PCB & IC substrates market – Overview
15.3 16.4
18.621.4
8.3
9.85.5
6.43.9
4.42.5
2.75.6
6.1
2018 2022
IC Substrates
Military/Aerospace
Industrial/Medical
Automotive
Consumer
Communication
Computing
3.1%
3.9%
4.3%
1.8%
3.5%
2.3%
59.7
67.2
Forecast for the total PCB & IC substrates marketuntil 2022: CAAGR of 3.0%
2.2%
USD in billions
11
AT&S outperformed a flat market in the past 6 years and is set to continue to do so also in the future.
100.8 103.2 96.4 94.6 103.2
108.9123.1
140.8 150.4
183.0
6080
100120140160180200
2012* 2013 2014 2015 2016 2017
Index (2012 = 100)*
PCB & substrates market AT&S revenue
* Basis 2012:PCB & substrates market: USD 55.7bn AT&S revenue: € 542m
AT&S outperformed the market by scaling high-end any-layer technology and by leveraging HDI technology to the Computer-, Consumer-, Automotive-, Industrial and Medical market.
Source: Prismark, February 2018, Yole April 2017
Investor and Analyst Presentation 12
Driving the industry: miniaturization & modularization
?
2003/04 2013 2017 202X
TYPE Mobile Phone Smartphone Smartphone All in One
PCB 125x55mm 85x20mm 80x20mm 25x25mm?
FORM FACTOR 1 0.25 0.23 0.06?
LINE/SPACE 100/100µm 40/40µm 30/30µm 10/10µm
TECHNOLOGY 1-n-1 Any-layer mSAP – Any-layer FO/SAP/mSAP
Investor and Analyst Presentation 13
Future positioning as leading high-end interconnect solutions provider
Core businessNew technologies and interconnect
solutions
Extended technology toolbox
Additional customers
Additional applications
Broader positioning in the value chain
+
Mo
re t
han
AT&
S
Overview of the transformation from a high-endPCB manufacturer to a high-end interconnect solutions provider:
Investor and Analyst Presentation 14
Table of Contents
Company Overview
Strategy & Market
FY 2017/18 & Outlook
Annex
Investor and Analyst Presentation 15
Highlights in the financial year 2017/18
Very successful year 2017/18
Growth in all business segments above market average
High operating performance (utilization, yield, efficiency)
Position as technology leader in a challenging industry strengthened
Ramp-up of the new mSAP lines in record time
Operational improvement in the area of IC substrates
Successful positioning in the high-frequency segment
Balance sheet structure significantly strengthened through hybrid bond (€ 173.0 million)
AT&S again listed on the Austrian lead index ATX
Among the top performers of the Vienna Stock Exchange with share price gaining 113.8 % in FY 2017/18
Record levels for revenue, EBITDA and EBIT
15
Investor and Analyst Presentation 16
Preliminary results for the financial year 2017/18
Revenue up 21.7% to € 991.8 million
High-end printed circuit boards for mobile devices, especially mSAP and IC substrates, contributed to revenue growth
Strong demand in the automotive, industrial, medical segments
Negative exchange rate effects amounting to €-46.8 million had an impact on revenue
Generally high operating performance and product mix improve earnings
EBITDA margin: 22.8% (PY: 16.1%)
EBIT margin: 9.1% (PY: 0.8%)
EPS improved from €-0.59 to €1.38
Capex of € 141.7 million financed from cash flow from operating activities
Equity ratio increased to 46.5% due to issue of hybrid bond
Debt repayment period (net debt/EBITDA) improved to 0.9 years
Dividend of € 0.36 (PY: € 0.1) proposed
Record levels for revenue and EBITDA
16
Investor and Analyst Presentation 17
Revenue and EBITDA development
€ in millions
17
Split revenue FY 2017/18: Business Unit
Split revenue FY 2017/18: Customer Region
17
66%
34%Mobile Devices & Substrates
Automotive, Industrial,Medical
63%21%
10%6%
Americas
Germany/Austria
Asia
Other European countries
Revenue: YoY: + 21.7%: very good product mix, high demand and additional revenue from all plantsEBITDA: YoY: + 72.6 %: expansion capex, high operational performance, successful introduction & optimization of mSAP
199.8 199.6
286.0 280.2225.9
814.9
991.8
28.8 29.774.7 85.9
35.7
130.9
226.0
Q42016/17
Q12017/18
Q22017/18
Q32017/18
Q42017/18
FY2016/17
FY2017/18
Revenue EBITDA and margin
16.1%30.7%26.1%14.9%14.4% 15.8% 22,8%
Investor and Analyst Presentation 18
Net CAPEX & Staff
Net CAPEXFY 2017/18: CAPEX at a high level due to mSAP upgrade and Chongqing phase 1
€ in millions
90.3
164.8
254.3240.7
141.7
2013/14 2014/15 2015/16 2016/17 2017/18
* incl. contractors, FTE, average for the period
Staff*Increase in number of employees by more than 2,900
7,0277,638
8,7599,526
9,981
2013/14 2014/15 2015/16 2016/17 2017/18
Investor and Analyst Presentation 19
Business Development – Mobile Devices & Substrates
113.7 113.6
197.6 199.6
137.2
486.5
648.0
12.4 20.959.4 75.0
23.768.5
179.0
Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 Q4 2017/18 FY 2016/17 FY 2017/18
Revenue EBITDA
Successful introduction of mSAP technology
Operational improvements in IC substrates
EBITDA improvements as a result of product mix
Very strong Q2 and Q3, seasonality in Q4
Price pressure on IC substrates remains
€ in millions (unless otherwise indicated)
FY 2016/17 FY 2017/18 Change in %
Revenue 573.0 738.9 29.0%
Revenue with external customers
486.5 648.0 33.2%
EBITDA 68.5 179.0 161.3%
EBITDA margin 12.0% 24.2% -
€ in millions; * Revenue with external customers
Revenue* and EBITDA
Investor and Analyst Presentation 20
84.9 85.0 87.3 79.3 87.7
324.1 339.3
14.5 9.7 13.2 9.3 14.551.5 46.8
Q4 2016/17 Q1 2017/18 Q2 2017/18 Q3 2017/18 Q4 2017/18 FY 2016/17 FY 2017/18
Revenue EBITDA
Business Development – Automotive, Industrial, Medical Continued growth path in all sub-segments,
particularly in Industrial and Medical
EBITDA 2016/17: € 44.3 m (included a reversal of provision of € 7.2 m)
EBITDA margin impacted by negative FX effects, higher raw material prices
€ in millions (unless otherwise indicated)
FY 2016/17 FY 2017/18 Change in %
Revenue 351.5 364.9 3.8%
Revenue with external customers
324.1 339.3 4.7%
EBITDA 51.5 46.8 (9.1%)
EBITDA margin 14.6% 12.8% -
Revenue* and EBITDA
€ in millions; * Revenue with external customers
Investor and Analyst Presentation 21
Outlook for 2018/19
Seasonality expected for mobile devices segment, especially in Q1
Technology development projects in CHQ I as preparation of second phase in implementation
Further expansion in CHQ II depending on market development – next evaluation in mid-2018
Technology expansion and capacity increase in the area of autonomous driving at the sites in Nanjangud (India) and Fehring (Austria) currently implemented
Maintenance investments and minor technology upgrades of roughly € 70 to 100 million
Investments in capacity and technology expansion by another € 100 million depending on market development
Outlook 2018/19: Revenue growth by up to 6% and EBITDA margin at 20 to 23%
Core business with stable and growing demand in a competitive environment
Investor and Analyst Presentation 22
Medium-term strategy – More than AT&S
Path of value-added growth will be pursued consistently
Focus on leading position in terms of technology, quality and results
New revenue target of € 1.5 billion
EBITDA margin of 20 to 25%
Positioning as a leading high-end interconnect provider
Investor and Analyst Presentation 23
Table of Contents
Company Overview
Strategy & Market
FY 2017/18 & Outlook
Annex
Investor and Analyst Presentation 24
AT&S – Stock ProfileListing: Vienna Stock Exchange,
Prime Standard
Indices: ATX Prime, WBI
Thomson Reuters (A): ATSV.VI
Bloomberg (A): ATS:AV
Publication of the Annual Report 2017/18 06 June 2018
Record date Annual General Meeting 25 June 2018
24th Annual General Meeting 05 July 2018
Ex-dividend day 24 July 2018
Record date dividend 25 July 2018
Dividend payment day 26 July 2018
Results for the first quarter 2018/19 31 July 2018
Results for the second quarter 2018/19 31 July 2018
Financial Calendar Shareholder structure
# of shares outstanding 38.85m
Average daily volume*: ~ 115,000 shares
Performance 1 year*: +107%
Dividend proposal 2017/18: € 0.36 per share
* 02/05/2017 – 30/04/2018
Investor and Analyst Presentation 25
Market development
Communication
Decline in smartphone sales volume by 2.3% for the first time in 2017
2018 – 2020 5G-capable smartphones provide for above-average growth of 2.8% p.a.
Computer
Slight decline of overall market by approx. 2.5% in 2017
Slight increase forecast for servers in 2018, while tablet sales stagnate
2018 – 2020 average growth of roughly 1.8% p.a.
Consumer
Market trend is the interconnection of devices (“Connected Devices”, “Internet of Things” – “IoT”)
2018 – 2020 average annual growth of roughly 4.3% p.a.
IC substrates
2017 slight growth with a total market volume of $ 5.4 billion
“System-in-package” or “all-in-one” modules for the integration of functions are the growth drivers for the future
2018 – 2020 growth rate of 2.8% p.a.
Development in the customer segments in the calendar year 2017
Investor and Analyst Presentation 26
Market development
Automotive electronics
Strong growth due to continuous increase in the proportion of electronics in vehicles
Electrification, interconnection and autonomous driving are the growth drivers
2018 – 2020 growth of 3.9% p.a.
Industrial electronics
Stable growth in 2017 at 2.9% due to automation and energy efficiency
Driven by robotics, automation and Industry 4.0 activities
2018 – 2020 growth by up to 3.4% p.a.
Medical electronics
Growth in 2017 by roughly 4.8% in mobile diagnostic equipment and therapy devices
High complexity in applications such as diagnostic and imaging devices, mobile devices on and in the body
2018 – 2020 growth rates of 2.1% p.a.
Development in the customer segments in the calendar year 2017
26
Investor and Analyst Presentation 27
Financials FY 2017/18
Hybrid bond issue (€ 173.0m)
Full Capex financed from operating cash flow
€ in thousands01 Apr 2016 – 31 Mar 2017 01 Apr 2017 – 31 Mar 2018
Change
YoY
STATEMENT OF CASH FLOWS
Operating result (EBIT) 6,649 90,286 >100%
Paid/received interests (15,962) (13,875) 13.1%
Income taxes paid (12,370) (26,015) (>100%)
Non cash bearing of profit or loss 112,207 141,705 26.3%
Cash flow from operating activities
before changes in working capital90,524 192,101 >100%
Changes in working capital 45,892 (48,910) (>100%)
Cash flow from operating activities 136,416 143,191 5.0%
Cash flow from investing activities (161,148) (193,389) (20.0%)
Cash flow from financing activities 54,872 135,547 >100%
Change in cash and cash equivalents 30,140 85,349 >100%
Operating free cash flow1) (104,253) 1,492 >100%
Free cash flow2) (24,732) (50,198) (>100%)
1) Cash flow from operating activities minus Net CAPEX2) Cash flow from operating activities minus cash flow from investing activities
Investor and Analyst Presentation 28
Financials FY 2017/18
Increase as a result of hybrid bond issue and net profit
Negative FX effects (mainly RMB-EUR and USD-EUR) of € 53.5 m. Positive: Hybrid bond issue (€ 173.0m)
In 2016/17 special net debt optimization program
Hybrid bond issue (€ 173.0m)
€ in thousands (unless otherwise stated)31 Mar 2017 31 Mar 2018 Change
STATEMENT OF FINANCIAL
POSITION
Non-current assets 1,029,363 944,267 (8.3%)
Current assets 407,331 586,172 43.9%
Equity 540,094 711,391 31.7%
Non-current liabilities 569,849 515,276 (9.6%)
Current liabilities 326,751 303,772 (7.0%)
Total assets 1,436,694 1,530,439 6.5%
Net debt 380,549 209,237 (45.0%)
Net debt/EBITDA 2.9x 0.9x (2.0pp)
Net gearing 70.5% 29.4% (41.1pp)
Net working capital 24,374 72,437 >100%
Net working capital per revenue 3.0% 7.3% 4.3pp
Equity ratio 37.6% 46.5% 8.9pp
Investor and Analyst Presentation 29
Financials FY 2017/18
High demand, additional revenue contribution mainly from both plants in Chongqing, Negative FX impact of € 46.8 m.
Generally high operational performance, successful implementation & optimization of mSAP technology
Further reduction mainly due to positive FX impact
Significantly higher earningsCapitalization of deferred taxes in AustriaReduced tax scheme in Shanghai effected
€ in thousands (unless otherwise stated)01 Apr 2016 – 31 Mar 2017 01 Apr 2017 – 31 Mar 2018
Change
YoY
STATEMENT OF PROFIT OR LOSS
Revenue 814,906 991,843 21.7%
produced in Asia 82% 84% 2pp
produced in Europe 18% 16% (2pp)
EBITDA 130,933 225,977 72.6%
EBITDA margin 16.1% 22.8% 6.7pp
EBIT 6,649 90,286 >100%
EBIT margin 0.8% 9.1% 8.3pp
Finance costs – net (17,499) (14,775) 15.6%
Income taxes (12,047) (18,992) (57.6%)
Profit/(loss) for the year (22,897) 56,519 >100%
Cash earnings 101,764 192,211 88.9%
Earnings per share (€ 0.59) € 1.38 >100%
Investor and Analyst Presentation 30
Key credit figures
299
372405
523
593540
82
261 274
260212
331
217
111131
263
381
209
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Gross debt Financial assets and cash Net debt
0.9 0.8
1.6
2.9
0.9
2013/14 2014/15 2015/16 2016/17 2017/18
Target: < 3x
Net debt/EBITDA
Net debt decrease based on lower net capex (Chongqing phase I finished) & Hybrid bond issue
€ in millions
Gross debt, financial assets and cash, net debt
Multiple
Investor and Analyst Presentation 31
Net Working Capital Management
€ in millions; % of revenue
Net Working Capital development
103
92 95
88
24
72
19.0%
15.6%14.3%
11.6%
3.0%
7.3%
2012/13 2013/14 2014/15 2015/16 2016/17 2017/18
Net working capital Net working capital per revenue
Investor and Analyst Presentation 32
AT&S Product Portfolio – I
ECP®:Embedded Component Packaging IC substrates Substrate-like printed circuit boards
mSAP
Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the layers of a PCB – contributes to miniaturization.
IC substrates serve as interconnection platform withhigher density (Line/Space < 15 micron) between semiconductors (Chips) & PCBs .
Substrate-like PCBs (mSAP technology) are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron.
Production siteLeoben, Shanghai Chongqing Chongqing, Shanghai
ApplicationsDevices such as smartphones, tablets, digitalcameras and hearing aids
High-end processors for Computer, Communication, Automotive, Industrial
Mobile applications like smartphones
Investor and Analyst Presentation 33
HDI any-layer printed circuit
boards
HDI microvia printed circuit boards – high density interconnect
Multilayer printed circuit boards
Double-sided printed circuit boards
IMS printed circuit boards – insulated metal
substrate
Further technological enhancement to HDI microvia: All electrical connections in HDI any-layer boards consist of laser-drilled microvias. Advantage: further miniaturization, and higher performance and reliability. AT&S produces HDI any-layer in 4 to 12 layers.
HDI: high density interconnect, meaninglaser-drilled connections (microvias). HDI is first step towards miniaturization.AT&S can produce 4-layerlaser PCBs up to 6-n-6HDI multi layer PCBs.
Found in almost every area of industrial electronics. AT&S produces printed circuit boards with 4 to 28 layers, in quantities from individual prototypes to small batches and mass production.
Used in all areas of electronics. AT&S focuses on double-sided printed circuit boards with thicknesses in the range of 0.1-3.2mm.
IMS: insulated metal substrate. Primary function: heat dissipation for use mainly with LEDs and power components.
Production siteShanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
ApplicationsSmartphones, Tablets, Notebooks
Mobile phones and nearly all electronic applications including automotive (navigation, infotainment and driver assistance systems)
Used in all electronic applications including touch panels, and in products ranging from aircraft to motorcycles, from storage power plants to solar arrays
Primarily industrial and automotive applications
Lighting industry
AT&S Product Portfolio – II
Investor and Analyst Presentation 34
Flexible printed circuit boards
Semi-flexible printed circuit boards
Rigid-flex printed circuit boards
Flexible printed circuitboards on aluminum
AT&S patentedtechnologies
Used to replace wiring and connectors, allowing for connections and geometries that are not possible with rigid printed circuit boards.
More limited bend radius than flexible printed circuitboards. The use of astandard thin laminatemakes them a cost-effective alternative.
Combine theadvantages of flexibleand rigid printed circuitboards, yielding benefitsfor signal transmission,size and stability.
Used when installing LEDsin car headlights, forexample, where theprinted circuit board isbonded to an aluminumheat sink to which theLEDs are then attached.
Production siteAnsan, Fehring Fehring Leoben, Ansan Ansan
ApplicationsNearly all areas ofelectronics, includingmeasuring devices andmedical applications
Automotive applications Industrial electronics,such as productionmachines and industrialrobots
Lighting, automotive,building lighting
AT&S Product Portfolio – III
ECP®: Embedded Component PackagingECP® is a patented AT&S packaging
technology used to embed active and passive electronic components in the inner layers of a printed circuit
board. ECP® technology is used in ever smaller, more efficient and more powerful devices, such as
smartphones, tablets, digital cameras and hearing aids.Production sites: Leoben, Shanghai
2.5D® Technology PlatformCombines mechanical and electronic miniaturization, and enables partial reduction of the thickness of a
circuit board. Advantage: populated assemblies have a thinner profile. Can be also used to make cavities in
the printed circuit board, e.g. for acoustic channels. Major application for this technology is the 2.5D® rigid-
flex printed circuit board, a lower cost alternative for flex-to install applications.
Production sites: Leoben, Shanghai
Investor and Analyst Presentation 35
Management
Andreas Gerstenmayer, CEO
Joined AT&S as CEO in 2010
Previous positions include:
18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008
Partner at FOCUSON Business Consulting GmbH after leaving Siemens
Education:
Degree in Production Engineering from Rosenheim University of Applied Sciences
Monika Stoisser-Göhring, CFO
CFO since 2017 Previous positions include:
Since 2011 with AT&S in seniorpositions in Finance and Human Resources
Various positions at international accounting and tax consulting companies
Education: Training as Tax Consultant Degree in Business Administration
from Karl-Franzens University Graz
Heinz Moitzi, COO
COO since 2005; with AT&S since 19811)
Previous positions include: Various management positions
within AT&S Measurement engineer with Leoben
University of Mining and Metallurgy Education:
Degree from Higher Technical College of Electrical Engineering
1)He was already with the founding company of AT&S
Investor and Analyst Presentation 36
Milestones in the Group’s history
1987Founding of the Group, emerging
from several companies owned by
the Austrian State Owned
Industries
1994Privatization and
acquisition by Messrs
Androsch, Dörflinger, Zoidl
1999Initial public offering on Frankfurt Stock Exchange
(„Neuer Markt“). Acquisition of Indal Electronics
Ltd., largest Indian printed circuit board plant
(Nanjangud) – today, AT&S India Private Limited
2002Start of production at new Shanghai
facility – one of the leading HDI
production sites in the world
2010Start of production
at plant II in India
2009New production direction: Austrian
plants produce for high-value niches
in the automotive and industrial
segment; Shanghai focuses on the
high-end mobile devices segment
2008AT&S change
to Vienna Stock
Exchange 2006Acquisition of Korean
flexible printed circuit
board manufacturer,
Tofic Co. Ltd. – today,
AT&S Korea Co., Ltd.
2015AT&S again achieves record high sales and earnings for
financial year 2014/15 and decides to increase the investment
program in Chongqing from € 350 million to € 480 million
2011 Construction starts on new
plant in Chongqing, China
Capacity increase in
Shanghai by 30%
2013AT&S enters the IC substrate
market in cooperation with a
leading manufacturer of
semiconductors 2016AT&S starts serial production of
IC substrates at the plant in
Chongqing
Investor and Analyst Presentation 37
A sustainability benchmark in the industry
37
“Highest resourceefficiency“
“Highest standards at all locations worldwide“
“Highesttransparency“
* Basis for CO2 output: 2015/16
Sustainability reporting since 2012/13 Gold recognition from the Responsible
Business Alliance Conflict minerals reporting Public CDP reporting on climate change
(C score) and water (B score)
Resourceconsumptionstable/declining
Revenue growth Environment: ISO 14001 Safety: OHSAS 18001 Energy: ISO 50001 Quality: ISO 9001, ISO/TS 16949
AS/EN 9100, DS/EN 13485
Investor and Analyst Presentation 38
AT&S – First choice for advanced applications
IR contactGerda Königstorfer
Tel: +43 3842 200 5925Mobile: +43 676 8955 5925Fax: +43 3842 200 [email protected]
Johannes Mattner
Tel: +43 3842 200 5450Mobile: +43 676 8955 6093
Fabriksgasse 13, 8700 Leoben/Austriawww.ats.netVisit: www.ats.net; @AT&S IR_PR; AtundS
Investor and Analyst Presentation 39
DisclaimerThis presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria (“AT&S”), and thecontents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and noreliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are expressly cautioned notto place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s expectationsand assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual developments, results, performanceor events may vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or otherwise) for anyloss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether asa result of changed assumptions or expectations, new information or future events.
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