atotech’s solutions for mlb production using advanced basematerials

Atotech’s Solutions for MLB Production using Advanced Basematerials

Speaker:Jaime Peraza OrdazPMM Atotech Europemobile: +34 606 372 364email: [email protected]

Tobias SponholzGlobal Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80Email: [email protected]

Proprietary and Confidential

Agenda

Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO

Application Guide1

Vertical Electroless CopperPrintoganth PV (E)

3

Direct PlatingNeopactSeleo CP Plus

4

Horizontal Electroless CopperPrintoganth P Plus

2


Application Guide


PTH Process Overview Application and Pricing Guide

PTH PROCESS APPLICATION GUIDELINESegment Application/

TechnologyRecommended Process

Vertical Horizontal Direct Plating

IC Substrate

SAP (GX92, GX13, GX-T31, ..)

Printoganth MV Plus Printoganth SAP Plus n/a

MSAP, AMSAP (BT, BT PCF, ...)

Printoganth MV Plus Printoganth P Plus n/a

HDI & MLB

Advanced Materials (PTFE, BT, High Tg FR4,

Printoganth PV E Printoganth P Plus NeopactSeleo CP Plus

Standard Materials (standard FR4,…)

Noviganth LS Plus Printoganth U Plus or Printoganth U

Seleo CP Plus


Horizontal Electroless CopperPrintoganth P Plus


Market Introduction in Sept. 2009

Target Application Any production with advanced materials where

adhesion or blistering is an issue e.g. flex, rigid-flex, PTFE, BT, PI, etc.

HDI and AMSAP technology

Technical Benefits Extremely good non-blister behavior and coverage

performance Very good reliability Easily adjustable deposit rate 0.35 – 0.5µm / 4 min Enhanced bath stability

Printoganth P Plus enables highest flexibility in production mix

Printoganth P PlusFeatures & Benefits


Printoganth U Printoganth U Plus Printoganth H-DK Printoganth P Printoganth P Plus

Reliability + +++ ++ +++ +++

Deposition rate 0.35 µm in 4 min

0.35 µm in 4 min

0.5 µm in 4 min

0.3 µm in 4 min

0.35-0.5 µm in 4 min

Non-blistering performance

fair on all standard base

materials


materials


materials

excellent even on challenging base

materials

excellent even on challenging base

materials

Bath Stability + ++ + +++ +++

CN-free No No No Yes Yes

Components excl. NaOH 4 5 4 4 4

CN-

Printoganth P Plus is Atotech’s most capable process for HDI manufacturing

Horizontal MLB and HDI ProcessesComparison


Horizontal DesmearUniplate P

SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing.

Optimal desmear attack on a wide variety of base materials.

Process Sequence

Securiganth E Sweller

Securiganth P500

Reduction Cleaner Securiganth E or

Reduction Conditioner Securiganth P500

Sweller

Reducer

Permanganate Etch


Horizontal Activation & E’less CuUniplate LB

Process Sequence

Cleaner Securiganth E

Securiganth SPS

Neoganth Pre-Dip B

Neoganth U Activator

Neoganth WA Reducer S

Printoganth P Plus

Etch Cleaning

E’less Copper

Activator

Pre Dip

Cleaning

Reducer

Neoganth 800


Economic Activator Neoganth 800Features & Benefits

New Ionic activator system for horizontal application running at only 75ppm Pd

Activator U = 225 ppm

Enables significant savings in running costs by less consumed Pd

Fully compatible to established Atotech conditioning system easy drop in solution

Perfect coverage on a wide range of relevant base materials

Same excellent reliability results as Activator U

Robust & easy process

Wide working window

Activator 800 during Alpha site test


relative strain

Printoganth P series

Z

X

Non-blistering performance is related to internal stress within deposited e’less Cu layer

Relevant factors for Cu deposit behavior Stabilizer type & concentration Stabilizer Co-deposits (e.g. Ni) Deposition temperature Baking after electroless Cu deposition

X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering!

Non-Blistering PerformanceTheoretical Explanation


Flex-Rigid Board FR4 Production Board

No Blistering due to excellent stress characteristicsBright deposition color

Printoganth P PlusApplications


Quick Via Pull test, 3-6 mil – all passed.

Solder Shock Test (6x 288°C, 10s floating) – No ICDs, passed.with THs and BMVs

Solder Shock Test (9x 326°C, 10s), THs & BMVs– few ICDs, ok.with THs and BMVs

IST (+150°C / RT @ 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed.

Various E-tests (daisy chains) – all passed.

Printoganth P Plus fulfills all reliability requirements for high-end HDI production.

ReliabilitySummary


Customer Country Lines Capacity [Tm²/ yr]

Panel Type Remark

AT&S Austria 2 240 FR4

KCC Korea 5 1000 FR4, RCC

INTERFLEX Korea 3 700 PI

SI FLEX Korea / China 3 720 PI, Rigid-Flex R2R

LGIT Korea 3 640 BT, FR4 AMSAP

Youngpoon Korea 2 480 PI, Rigid-Flex

Daisho Japan 1 180 Rigid-Flex

Shennan China 1 180 BT, FR4 AMSAP

Founder China 1 240 FR4,..

Foxconn China 2 620 High Tg FR4

ASE Taiwan 1 120 BT AMSAP

Simmtech Korea 1 320

Unimicron Taiwan 1

TOTAL 26

Printoganth P PlusCustomer References


Vertical Electroless CopperPrintoganth PV (E)


Products Temp. (°C)

Time (min)

Securiganth Cleaner 902 60 4

SPS 30 1

Neoganth LS Pre Dip RT 1

Neoganth LS Activator Plus(75 ppm Pd) 40 4

Neoganth LS Reducer 30 3

Printoganth PV (E) 34 8-20

Etch Cleaning

E’less Copper

Activator

Pre Dip

Cleaning

Reducer

Desmear

Neoganth V8 (60 ppm) 50

Process SequenceActivation & E‘less Cu


Ionic Activator for vertical application

Optimal coverage at low running cost (75ppm Pd)

Fine & homogeneous distribution of Pd particles

No tooling hole issues

Not corrosive

Improved robustness, no precipitations during manual replenishment

Easy handling, no premixing

100% compatible to established conditioning concept

Activator

Pre Dip

Reducer

Activation Series Neoganth LS PlusFeatures & Benefits


New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd

Enables significant savings in running costs by less consumed Pd

Modified complexing agents Ensures good coverage despite low palladium content ‘Locking’ copper ions in a stable complex enhances bath lifetime

Less alkaline Improved bath stability by reduced carbonate formation

Perfect coverage on a wide range of relevant base materialsFully compatible to established Atotech conditioning system

Easy drop in solution

Robust & easy process No additional NaOH dosing required by optimized replenishment concept Wide working window

Activator Neoganth V8 – full power ionic activation at low cost

Economic Activator EXPT Neoganth V8Features & Benefits


Etch Cleaning

E’less Copper

Activator

Pre Dip

Cleaning

Reducer

…Printoganth PV Printoganth PV E

Printoganth V Copper Printoganth V Copper E

Printoganth V Basic

Printoganth PV Stabilizer

Cu Reduction Solution

NaOH

Identical stabilizer system

Same bath performance

Different Cu source (CuSO4, CuCl) to be more flexible in supply chain

PV E potentially more cost-effective due to higher concentrated Cu additive

Printoganth PV vs PV EComparison


Versatile vertical e’less Cu process for advanced MLB/HDI applications

Superior adhesion on most materials including PI, PTFE, BT... due to optimal internal stress characteristics of the copper deposit:

No blistering No pull away

Highly reliable process Fulfills all standard reliability requirements such as SST, IST, TCT No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as

9x 326ºC

Low to high build deposit possible Deposition speed 0.3 - 0.6µm in 10 min

Environmentally friendly Tartrate based Cyanide free

Printoganth PV (E)Features and Benefits


Pos.1

Pos.2

Pos.3

Pos.4

Pos.5

Pos.6

Pos.7

Pos.8

Pos.9

Pos.10

Printoganth PV ECoverage in Through Holes


Excellent BMV coverage despite strong glass fiber protrusion!

SEM picture

Printoganth PV ECoverage in Blind Micro Via


Base material Tg °C phenolic Halogen-free

Lead-free compatible

Poly-imide

Backlight PV E

Backlight PV

Isola Duraver 104

135 x D8 D9

Matsushita R1566

150 x x D7-8 D7-8

Hitachi MCL-BE-67G

150 x x x D9-10 D9-10

DuPont Pyralux AP

195 x D8-9 D8-9

Isola Duraver 114

150 D8 D8

Isola Duraver 117

170 D9 D8

Nan-Ya NP-175-TL

170 x D10

PIC DF-170 170 x x D7-8 D7

standard pth process without 902 Flex Cleaner or Reduction Conditioner

Printoganth PV ECoverage


Excellent adhesion on exposed polyimide

Outstanding adhesion with Printoganth PV E !

Printoganth PV ESurface Adhesion


Korean Customer for military application

Fe oxide pow-der

EPDM Rubber

Final Product

Printoganth PV EProduction Example – Exotic Materials


Solder dip conditions ICDInspected Inner layer % ICD

6 x 10 sec @288°C 0 203 0%

9 x 10 sec @288°C 0 202 0%

12 x 10 sec @288°C 0 182 0%

15 x 10 sec @288°C 0 102 0%

18 x 10 sec @288°C 1 99 1%

Printoganth PV E fulfills highest reliability requirements

Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)

Printoganth PV ESolder Shock Results


6x IR reflow + 1x solder shock

no pull away

no ICD

Solder shock tests

Test conditions ICD Inspected Inner layer % ICD

6 x 10 sec @288°C 0 36 0%10 x 10 sec @288°C 0 36 0%14 x 10 sec @288°C 0 34 0%18 x 10 sec @288°C 0 34 0%

customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC)

Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)

Printoganth PV ESolder Shock Results

Proprietary and Confidentialstatus 2012-10

Customer Country Lines Capacity Base Materials ApplicationBoardtek Taiwan 4 650.000 High Tg FR4, Teflon high frequency

New Flex Korea 1 120.000 PI, FR-4 PC Chipset, Graphic chipset, Mobile

Jiang Nan Institute China 1 100.000 FR4, RCC, HTg military

ChangSung Korea 1 60.000 Special military

ACB Europe 1 25.000 FR4, HTG, PI, PTFE Military, automotive

Exception Europe 1 23.000 FR4, HighTg, BT, various

Others - 4 30.000 various various

Customer Country Lines Capacity [m²/year]

Base Materials Application

Sonic India 1 72.000 FR4

Arktron India 1 15.000 FR4

Meadville (DMC) China 1 400.000 FR-4 High Tg, High-layer MLB

Meadville (MAS) China 1 350,000 FR-4 High Tg, HF

MEIKO China 1 760.000 FR-4, HF HDI

Mutual-Tek Taiwan 1 240.000 FR4, PI Flex-Rigid

Printoganth PV E and PVReferences


Printoganth PV (E) vertical e’less Cu process for MLB/HDI applications outstanding non-blistering performance

on any kind of base materials highly reliable

Optimal performance in conjunction with Securiganth BLG desmear Neoganth LS Plus activation

Outlook Neoganth V8 Activator for lower running cost

Deposit structure of Printoganth PV E

Plated BMV with Printoganth PV E

Printoganth PV (E)Summary

atotech’s solutions for mlb production using advanced basematerials

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