atmi overview q3 2012

Copyright 2012 ATMI, Inc. All Rights Reserved.Copyright 2012 ATMI, Inc. All Rights Reserved.

Presenter NamePresenter TitleDate

ATMI Company Overview

Copyright 2012 ATMI, Inc. All Rights Reserved.

2

ATMI’s Strategic Intent

To be The Source of Process Efficiency Solutions

for technology-driven customers by providing innovative materials and related delivery systems

and technologies, incorporated in sustainable business models.


3

ATMI at a Glance

Founded in 1986NASDAQ: ATMI$390M 2011 RevenuesGlobal CapabilityOver 775 Employees

Over 170 in Technology Development Disciplines

High Productivity Development CentersATMI Locations

$445M invested in technology development throughout 25 years


ATMI Quarterly Revenues

1Q

03

3Q

03

1Q

04

3Q

04

1Q

05

3Q

05

1Q

06

3Q

06

1Q

07

3Q

07

1Q

08

3Q

08

1Q

09

3Q

09

1Q

10

3Q

10

1Q

11

3Q

11

1Q

12

$0

$20

$40

$60

$80

$100

$120

Million

s

4


2003

2004

2005

2006

2007

2008

2009

2010

2011

$0

$50

$100

$150

$200

$250

$300

$350

$400

$450

Million

s

5

ATMI Annual Revenues


6

Leading Edge Markets

Bio PharmaceuticalUltra-Pure Mixing

Flat Panel DisplayPressure Dispense and Gas Management for FPD and IC

Bio-pharmaceutical applications shown

Innovation Extends Beyond the Molecule

SemiconductorLiquid & Solids Delivery

CVDALD


7

CultureThe way we work with leadership, creativity, and values

Customer CentricDeliver value to our customers in the context of their business

CapabilitiesAssembly of the right methodologies, tools, and business models

Company


8

Depth of Core Competency

Material development and synthesis

Packaging and delivery technology

High volume manufacturing scale-up

Delivery in different form factors

Strong application engineering

Strong analytical capability

Interface science expertise


DisplayLifeSciences

Process Efficiency

Interfacial Science

High Productivity Development

CoreCompetencies

CoreCompetenciesNew

Markets

Diagram for illustrative purposes only. Not drawn to scale.

Semiconductor


Broad Portfolio of Innovative Solutions

10

ATMIProcess

Efficiency™

NOWPak

iCleaner

ErgoNOW

BrightPak

Lithography

Implant

B2F4

BF3 VAC

AsH3 SDSPH3 SDS

BF3 SDS

enGeF4 VAC

AutoCleanenGeF4 SDS

TitaN Klean

Surface Prep

Contact Cleans

High Dose Implant Strip

AlCu Cleans

TSV

Cu EtchBack

RegenSi

CMPDeposition

Cu Plating

PlanarClean

Cu Post CMP Clean

W Post CMP Clean Oxide Post

CMP Clean

Precursors, TiCl4, 4MS, TDMAT, OMCTS, ZrCl4, HfCl4, TEOS, TEB, TEPO, others

Delivery Systems, UniChem, ProE-Vap, SAGE

ViaForm

ViaForm Extreme

ViaForm Addatives

ATMI, The ATMI Logo, The source of Process Efficiency, PlanarClean, UniChem, ProE-Vap, Viaform, ViaForm Extreme, BrightPak, ErgoNow, NOWPak, SAGE, iCleanger, VAC, AutoClean, RegenSi, TitnaN Klean are trademarks or registered trademarks of Advanced Technology Materials, Inc. SDS is a Regestered trademark of ATMI and Matheson Tri-Gas, Inc.


11

Sustained Leadership Positions

#1 in Implant Gases

#1 in Photo Resist Packaging

#1 in Cu Plating

#1 in Post-Etch Cleans

#1 in Post-CMP Cleans

#1 in ALD High-k Technologies1


12

Track Record of Major InnovationsSafe Material Handling

Revolutionary gas adsorbent technology eliminates accidental releasesCritical packaging for liquids protects valuable, high purity materialsFirst to receive EPA’s Designed for the Environment label for semiconductor manufacturing materials

Process EfficiencyAutomatic gas cleaning minimizes scheduled downtimeOptimized liquid purge and continuous refill maximize productive uptimeAward winning designs in solid source delivery enable advanced materials

Developmental EfficiencyProven parallel processing adapted from Pharma & BioPharma industriesFirst to deploy Combinatorial Screening world-wide in semiconductorsMassive cycles of learning results in faster development of better solutions

Consistently providing new technologies to enable the safe and efficient use of the most

advanced materials in production


13

Collaborative Engagement Model

Product Development Schematic

Customer Engagement

Identity Material

Attributes

SampleArray

SelectedOptimization Commercialized

Sample ArrayProcess

Screening


14

Key Semiconductor Process Steps *ATMI Provides the semiconductor industry chemistries in “Yellow”

Tungsten Contact Plug

CVD Tungsten (WF6)Liner/Barrier (TDMAT)Post-Etch Wet Cleaners

Tungsten Contact Plug

CVD Tungsten (WF6)Liner/Barrier (TDMAT)Post-Etch Wet Cleaners

Cu Conductor with Barrier/Nucleation Layer

CVD of ALT TiN, TaN, and TaSiN Barrier ChemicalsPVD SeedPost-Etch CleanersCu Deposition MaterialsCu CMP SlurriesPost Cu CMP Cleans

Cu Conductor with Barrier/Nucleation Layer

CVD of ALT TiN, TaN, and TaSiN Barrier ChemicalsPVD SeedPost-Etch CleanersCu Deposition MaterialsCu CMP SlurriesPost Cu CMP Cleans

Intermetal / Interlayer Dielectric

Low-K Dielectrics Low-K Dielectric EtchPost-Etch CleanersCMP Slurries Post-CMP Cleaners

Intermetal / Interlayer Dielectric

Low-K Dielectrics Low-K Dielectric EtchPost-Etch CleanersCMP Slurries Post-CMP Cleaners

Passivation

CVD DielectricsLow-K DielectricsEtch MaterialsPost Etch Cleaners

Passivation

CVD DielectricsLow-K DielectricsEtch MaterialsPost Etch Cleaners

Gate/Junction Region

CVD DopantsSDS Implant MaterialsALD technology (met/diel) Etch Materials Post-Etch Wet CleanersSTI CMP SlurriesPhotochemistry Packaging

Gate/Junction Region

CVD DopantsSDS Implant MaterialsALD technology (met/diel) Etch Materials Post-Etch Wet CleanersSTI CMP SlurriesPhotochemistry Packaging

Pre-Metal Dielectric

PMD film and DopantsEtch MaterialsPost-etch Wet Cleaners

Pre-Metal Dielectric

PMD film and DopantsEtch MaterialsPost-etch Wet Cleaners


1515

New Material and Integration Issues in Semiconductor Production

Need to rapidly solve leading-edge materials and process integration problemsWhile there is a “roadmap”, integration issues are customer specific; each customer can require an intense and complex relationship

Technology Roadmaps

Nan

om

ete

rs


16

More than 500 transistors could fit on a surface the size of a human blood cell.

SST “Fun Facts” about Intel’s 45nm chips:

The original transistor built by Bell Labs in 1947 could fit in your hand, while hundreds of the 22nm transistors can fit on the surface of a single red blood cell.


17

Toshiba Flash

Samsu

ng Flash

Nvidia GPU

Intel M

PU

Samsu

ng DRAM

Cockro

ach B

rain

Frog B

rain

Human B

rain

34B

17B

3B 2.3B 2.1B 1B

16B

100B

NeuronsTransistors

Source: ATMI Marketing, IC Insights


18

The Burden of Advanced Technology

<2000

90nm

65nm

45/40nm

32/28nm

22/20nm

14nm

0 25 50 75 100 125

Total Materials Required

65nm 45/40nm 32/28nm 22/20nm 14nm0

0.51

1.52

2.53

3.54

4.5

Relative Gain in Per-formance

Materials

Design

Scaling

600700800900

100011001200130014001500

Logic Process Steps

Source: ATMI Marketing, Semico Research


19

19701980

1990 2000

2012

Ion

Im

pla

nt

Pro

jecti

on

Pri

nti

ng

Ste

p/R

ep

eat

Lit

ho

Mu

lti-

Meta

l Layers

CM

P &

STI

Ste

p/S

can

Lit

ho

Deep

UV

LIt

ho

Cop

per

Inte

rcon

nects

Silic

on

-on

-In

su

lato

r (S

oI)

SiG

eS

train

En

gin

eeri

ng

Low

-K

Die

lectr

ics

Imm

ers

ion

Lit

ho

Hig

h K

Gate

O

xid

es

Meta

l G

ate

sTh

rou

gh

Si

Via

sD

ou

ble

Patt

ern

Lit

ho

EU

V

Lit

ho

Air

G

ap

sG

e &

/or

III-

V

Ch

an

nels

Mu

lti-

Gate

Tr

an

sis

tors

NN

ocarb

on

Te

ch

nolo

gie

s

Innovation Pile-Up in Semiconductors

Innovation Pile-Up in Semiconductors

Source: IC Insights


20

Year 1993 1995 1997 1999 2001 2003 2005

2007 2009 2011

Node .5µ .35µ .25µ .18µ .13µ 90nm

65nm 45nm 32nm 22nm

Metal Al → → →

Cu → → →

→ →

ILD SiO2 → SiOF →

→ CDO → → →

→

Gate OxSiO2 → → → →

→ SiON High K → →

Gate El Poly → → → →

→ → →

→

ChannelSi → → →

→ → →

→ →

Litho 365nm 248nm → → →

193nm →

→

Strained Si

Dual Metal

Double Pattern i193nm

Source: IC Insights

Material Technology EvolutionMaterial Technology Evolution


21

Process Condition

100’s of Test Wafers


22

100’s of Process Conditions

1 Test Wafer


23

Time

Data

/ I

nfo

rmati

on

High-Productivity DevelopmentReduced Risk through Increased Learning

High Productivity Development Learning Rate

Development Engineering Freeze

Required Manufacturing Data Set

Conventional R&D Learning Rate

PrimaryScreening

SecondaryScreening

TertiaryScreening

Materials DiscoveryMaterials Discovery

Unit Process DevelopmentUnit Process Development

Integration andScale-upIntegration andScale-up

QualificationQualification

PilotMfg.PilotMfg.

Reduced

Risk


24

Green Principles

The 12 Principles of Green Chemistry

1. Prevention. 2. Atom Economy. 3. Less Hazardous Chemical Synthesis. 4. Designing Safer Chemicals. 5. Safer Solvents and Auxiliaries. 6. Design for Energy Efficiency. 7. Use of Renewable Feedstocks. 8. Reduce Derivatives. 9. Catalysis. 10. Design for Degradation. 11. Real-time Analysis for Pollution

Prevention. 12. Inherently Safer Chemistry for

Accident Prevention. Anastas, P. T.; Waner, J. C. Green Chemistry: Theory and Practice; Oxford University Press Inc., New York 1998.

The 12 Principles of Green Engineering

1. Inherent Rather Than Circumstantial2. Prevention Instead of Treatment

3. Design for Separation4. Maximize Efficiency5. Output-Pulled Versus Input-Pushed6. Conserve Complexity7. Durability Rather Than Immortality

8. Meet Need, Minimize Excess9. Minimize Material Diversity10. Integrate Material and Energy Flows11. Design for Commercial “Afterlife”12. Renewable Rather Than Depleting

Anastas, P.T., and Zimmerman, J.B., Env. Sci. Tech. 2003, 37, 94A.


Industry “Sustainability” is a Long Way Off*

Total 45 grams of Chemicals Consumed (solids/liquids)0.01 gram dopant 14 grams in photolithography process 0.23 gram etchants31 grams of acids/bases

Total 556 grams of Chemicals Consumed (Elemental gases)

N2, He, Ar, H2, O2

Total Energy Consumed1600 grams of secondary fossil

fuel

Total Water Consumed20 liters

Total Substrate Consumed (775 µm thick 300 mm Si wafers)

16 grams/cm2

DeviceManufacturing

Waste Water 17 kilograms

Solid Waste7.8 kilograms

Air Emissions

25* Williams, E. D.; Ayres, R. U.; Heller, M. Environ. Sci. Technol., 2002, 36,

5504

2 grams of 32MB DRAM chip


26

A Semiconductor Industry Firstfrom ATMI: DfE

iCleanerTM Formulated Cleaning Chemistry used in the semiconductor fabrication process

Highly engineered for sustainability

EnvironmentalEconomicalSocial

http://www.epa.gov/dfe/


DisplayLifeSciences

Process Efficiency

Interfacial Science

High Productivity Development

CoreCompetencies

CoreCompetenciesNew

Markets

Diagram for illustrative purposes only. Not drawn to scale.

Semiconductor


28

ATMI…and Life Sciences…

ATMI’s semiconductor materials packaging expertise fits Life Sciences

Life Sciences one-time use/disposable market about a decade behind semiconductor

Expertise handling, storing, delivering critical materials reliably

Understand interactions of materials with packaging

Know how to implement value of disposables into risk-averse industry


29

Upstream Downstream

ATMI has the Largest Installed Single-Use Mixer Base

Buffer 3B

PTBBuffe

r 3B

PTBBuffe

r 3A

PTB

Buffer 2B

PTBBuffe

r 2B

PTBBuffe

r 2AP

TBBuffe

r 1C

PTBBuffe

r 1B

PTBBuffe

r 1A

PTB

Hold 2

Fill Tank

Hold 3

Ult

ra

Filt

er

Vialed Product

Filte

r

Formulation Tank

Hold 1

PTB

1

PTB

2

PTB

Media 1

PTB

Media 2

Cells

Supplements (3X – 5X)

Seed 1

Seed 2

Production

Bioreactor

PTB

3


30

Single-Use Technologies: Efficient & Sustainable

Water footprint is 46% less for Single Use based plant. 1

Carbon Footprint is 35% less for Single Use based plant. 1

SUTs plastics largely recyclableAstraZeneca’s Westborough, MA sold plastic waste for $600,000 and saved $600,000 disposal costs. 2

1: Leveen, Cox, IBC Conference, 11/23/082: Genetic Engineering News, Vol 29, #7, April 1, 2009.


ATMI and the ATMI logo are trademarks or registered trademarks of Advanced Technology Materials, Inc. in the United States, other countries or both.

Other company, product, or service names may be trademarks or service marks of others.

atmi overview q3 2012

Business