atmega169p
DESCRIPTION
atmega169pTRANSCRIPT
8-bit Microcontroller with 16K Bytes In-SystemProgrammable Flash
ATmega169PATmega169PV
Preliminary
Rev. 8018P–AVR–08/10
Features• High Performance, Low Power Atmel® AVR® 8-Bit Microcontroller• Advanced RISC Architecture
– 130 Powerful Instructions – Most Single Clock Cycle Execution– 32 × 8 General Purpose Working Registers– Fully Static Operation– Up to 16 MIPS Throughput at 16 MHz– On-Chip 2-cycle Multiplier
• High Endurance Non-volatile Memory segments– 16 Kbytes of In-System Self-programmable Flash program memory– 512 Bytes EEPROM– 1 Kbytes Internal SRAM– Write/Erase cycles: 10,000 Flash/100,000 EEPROM– Data retention: 20 years at 85°C/100 years at 25°C(1)
– Optional Boot Code Section with Independent Lock BitsIn-System Programming by On-chip Boot ProgramTrue Read-While-Write Operation
– Programming Lock for Software Security• JTAG (IEEE std. 1149.1 compliant) Interface
– Boundary-scan Capabilities According to the JTAG Standard– Extensive On-chip Debug Support– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
• Peripheral Features– 4 × 25 Segment LCD Driver– Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture
Mode– Real Time Counter with Separate Oscillator– Four PWM Channels– 8-channel, 10-bit ADC– Programmable Serial USART– Master/Slave SPI Serial Interface– Universal Serial Interface with Start Condition Detector– Programmable Watchdog Timer with Separate On-chip Oscillator– On-chip Analog Comparator– Interrupt and Wake-up on Pin Change
• Special Microcontroller Features– Power-on Reset and Programmable Brown-out Detection– Internal Calibrated Oscillator– External and Internal Interrupt Sources– Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and
Standby• I/O and Packages
– 54 Programmable I/O Lines– 64-lead TQFP, 64-pad QFN/MLF and 64-pad DRQFN
• Speed Grade:– ATmega169PV: 0 - 4 MHz @ 1.8V - 5.5V, 0 - 8 MHz @ 2.7V - 5.5V– ATmega169P: 0 - 8 MHz @ 2.7V - 5.5V, 0 - 16 MHz @ 4.5V - 5.5V
• Temperature range:– -40°C to 85°C Industrial
• Ultra-Low Power Consumption– Active Mode:
1 MHz, 1.8V: 330 µA32 kHz, 1.8V: 10 µA (including Oscillator)32 kHz, 1.8V: 25 µA (including Oscillator and LCD)
– Power-down Mode: 0.1 µA at 1.8V
– Power-save Mode:0.6 µA at 1.8V (Including 32 kHz RTC)
ATmega169P
1. Pin Configurations
1.1 Pinout - TQFP/QFN/MLF
Figure 1-1. 64A (TQFP) and 64M1 (QFN/MLF) Pinout ATmega169P
Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be sol-dered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board.
64 63 62
47
46
48
45
44
43
42
41
40
39
38
37
36
35
33
34
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16
15
17
61 60
18
59
20
58
19 21
57
22
56
23
55
24
54
25
53
26
52
27
51
2928
50 49323130
PC0 (SEG12)
VC
C
GN
D
PF
0 (A
DC
0)
PF
7 (A
DC
7/T
DI)
PF
1 (A
DC
1)
PF
2 (A
DC
2)
PF
3 (A
DC
3)
PF
4 (A
DC
4/T
CK
)
PF
5 (A
DC
5/T
MS
)
PF
6 (A
DC
6/T
DO
)
AR
EF
GN
D
AV
CC
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
LCDCAP
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SS/PCINT8) PB0
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC
2A/P
CIN
T15
) P
B7
(T1/
SE
G24
) P
G3
(OC1B/PCINT14) PB6
(T0/
SE
G23
) P
G4
(OC1A/PCINT13) PB5
PC1 (SEG11)
PG0 (SEG14)
(S
EG
15)
PD
7
PC2 (SEG10)
PC3 (SEG9)
PC4 (SEG8)
PC5 (SEG7)
PC6 (SEG6)
PC7 (SEG5)
PA7 (SEG3)
PG2 (SEG4)
PA6 (SEG2)
PA5 (SEG1)
PA4 (SEG0)
PA3 (COM3)
PA
0 (C
OM
0)
PA
1 (C
OM
1)
PA
2 (C
OM
2)
PG1 (SEG13)
(S
EG
16)
PD
6
(SE
G17
) P
D5
(S
EG
18)
PD
4
(S
EG
19)
PD
3
(S
EG
20)
PD
2
(IN
T0/
SE
G21
) P
D1
(IC
P1/
SE
G22
) P
D0
(TO
SC
1) X
TA
L1
(TO
SC
2) X
TA
L2
RE
SE
T/P
G5
GN
D
VC
CINDEX CORNER
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ATmega169P
1.2 Pinout - DRQFN
Figure 1-2. 64MC (DRQFN) Pinout ATmega169P
Top view Bottom view
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
A9
B8
A10
B9
A11
B10
A12
B11
A13
B12
A14
B13
A15
B14
A16
B15
A17
A25
B22
A24
B21
A23
B20
A22
B19
A21
B18
A20
B17
A19
B16
A18
A34
B30
A33
B29
A32
B28
A31
B27
A30
B26
A29
B25
A28
B24
A27
B23
A26
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
A25
B22
A24
B21
A23
B20
A22
B19
A21
B18
A20
B17
A19
B16
A18
A17
B15
A16
B14
A15
B13
A14
B12
A13
B11
A12
B10
A11
B9
A10
B8
A9
A26
B23
A27
B24
A28
B25
A29
B26
A30
B27
A31
B28
A32
B29
A33
B30
A34
Table 1-1. DRQFN-64 Pinout ATmega169P.
A1 PE0 A9 PB7 A18 PG1 (SEG13) A26 PA2 (COM2)
B1 VLCDCAP B8 PB6 B16 PG0 (SEG14) B23 PA3 (COM3)
A2 PE1 A10 PG3 A19 PC0 (SEG12) A27 PA1 (COM1)
B2 PE2 B9 PG4 B17 PC1 (SEG11) B24 PA0 (COM0)
A3 PE3 A11 RESET A20 PC2 (SEG10) A28 VCC
B3 PE4 B10 VCC B18 PC3 (SEG9) B25 GND
A4 PE5 A12 GND A21 PC4 (SEG8) A29 PF7
B4 PE6 B11 XTAL2 (TOSC2) B19 PC5 (SEG7) B26 PF6
A5 PE7 A13 XTAL1 (TOSC1) A22 PC6 (SEG6) A30 PF5
B5 PB0 B12 PD0 (SEG22) B20 PC7 (SEG5) B27 PF4
A6 PB1 A14 PD1 (SEG21) A23 PG2 (SEG4) A31 PF3
B6 PB2 B13 PD2 (SEG20) B21 PA7 (SEG3) B28 PF2
A7 PB3 A15 PD3 (SEG19) A24 PA6 (SEG2) A32 PF1
B7 PB5 B14 PD4 (SEG18) B22 PA4 (SEG0) B29 PF0
A8 PB4 A16 PD5 (SEG17) A25 PA5 (SEG1) A33 AREF
B15 PD7 (SEG15) B30 AVCC
A17 PD6 (SEG16) A34 GND
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ATmega169P
2. Overview
The ATmega169P is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By execut-ing powerful instructions in a single clock cycle, the ATmega169P achieves throughputs approaching 1 MIPS per MHzallowing the system designer to optimize power consumption versus processing speed.
2.1 Block Diagram
Figure 2-1. Block Diagram
PROGRAMCOUNTER
INTERNALOSCILLATOR
WATCHDOGTIMER
STACKPOINTER
PROGRAMFLASH
MCU CONTROLREGISTER
SRAM
GENERALPURPOSE
REGISTERS
INSTRUCTIONREGISTER
TIMER/COUNTERS
INSTRUCTIONDECODER
DATA DIR.REG. PORTB
DATA DIR.REG. PORTE
DATA DIR.REG. PORTA
DATA DIR.REG. PORTD
DATA REGISTERPORTB
DATA REGISTERPORTE
DATA REGISTERPORTA
DATA REGISTERPORTD
TIMING ANDCONTROL
OSCILLATOR
INTERRUPTUNIT
EEPROM
SPIUSART
STATUSREGISTER
Z
Y
X
ALU
PORTB DRIVERSPORTE DRIVERS
PORTA DRIVERSPORTF DRIVERS
PORTD DRIVERS
PORTC DRIVERS
PB0 - PB7PE0 - PE7
PA0 - PA7PF0 - PF7
VCC
GND
AREF
XTA
L1
XTA
L2
CONTROLLINES
+ -
AN
AL
OG
CO
MP
AR
AT
OR
PC0 - PC7
8-BIT DATA BUS
RE
SE
T
AVCC CALIB. OSC
DATA DIR.REG. PORTC
DATA REGISTERPORTC
ON-CHIP DEBUG
JTAG TAP
PROGRAMMINGLOGIC
BOUNDARY- SCAN
DATA DIR.REG. PORTF
DATA REGISTERPORTF
ADC
PD0 - PD7
DATA DIR.REG. PORTG
DATA REG.PORTG
PORTG DRIVERS
PG0 - PG4
UNIVERSALSERIAL INTERFACE
AVR CPU
LCD CONTROLLER/
DRIVER
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ATmega169P
The AVR core combines a rich instruction set with 32 general purpose working registers. All the32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independentregisters to be accessed in one single instruction executed in one clock cycle. The resultingarchitecture is more code efficient while achieving throughputs up to ten times faster than con-ventional CISC microcontrollers.
The ATmega169P provides the following features: 16 Kbytes of In-System Programmable Flashwith Read-While-Write capabilities, 512 bytes EEPROM, 1 Kbyte SRAM, 53 general purpose I/Olines, 32 general purpose working registers, a JTAG interface for Boundary-scan, On-chipDebugging support and programming, a complete On-chip LCD controller with internal step-upvoltage, three flexible Timer/Counters with compare modes, internal and external interrupts, aserial programmable USART, Universal Serial Interface with Start Condition Detector, an 8-channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, an SPI serialport, and five software selectable power saving modes. The Idle mode stops the CPU whileallowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. ThePower-down mode saves the register contents but freezes the Oscillator, disabling all other chipfunctions until the next interrupt or hardware reset. In Power-save mode, the asynchronoustimer and the LCD controller continues to run, allowing the user to maintain a timer base andoperate the LCD display while the rest of the device is sleeping. The ADC Noise Reductionmode stops the CPU and all I/O modules except asynchronous timer, LCD controller and ADC,to minimize switching noise during ADC conversions. In Standby mode, the crystal/resonatorOscillator is running while the rest of the device is sleeping. This allows very fast start-up com-bined with low-power consumption.
The device is manufactured using Atmel’s high density non-volatile memory technology. TheOn-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPIserial interface, by a conventional non-volatile memory programmer, or by an On-chip Boot pro-gram running on the AVR core. The Boot program can use any interface to download theapplication program in the Application Flash memory. Software in the Boot Flash section willcontinue to run while the Application Flash section is updated, providing true Read-While-Writeoperation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on amonolithic chip, the Atmel ATmega169P is a powerful microcontroller that provides a highly flex-ible and cost effective solution to many embedded control applications.
The ATmega169P AVR is supported with a full suite of program and system development toolsincluding: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators,and Evaluation kits.
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2.2 Pin Descriptions
2.2.1 VCC
Digital supply voltage.
2.2.2 GND
Ground.
2.2.3 Port A (PA7:PA0)
Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort A output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port A pins that are externally pulled low will source current if the pull-upresistors are activated. The Port A pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port A also serves the functions of various special features of the ATmega169P as listed on”Alternate Functions of Port A” on page 73.
2.2.4 Port B (PB7:PB0)
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort B output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port B pins that are externally pulled low will source current if the pull-upresistors are activated. The Port B pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port B has better driving capabilities than the other ports.
Port B also serves the functions of various special features of the ATmega169P as listed on”Alternate Functions of Port B” on page 74.
2.2.5 Port C (PC7:PC0)
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort C output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port C pins that are externally pulled low will source current if the pull-upresistors are activated. The Port C pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port C also serves the functions of special features of the ATmega169P as listed on ”AlternateFunctions of Port C” on page 77.
2.2.6 Port D (PD7:PD0)
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort D output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port D pins that are externally pulled low will source current if the pull-upresistors are activated. The Port D pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port D also serves the functions of various special features of the ATmega169P as listed on”Alternate Functions of Port D” on page 79.
68018P–AVR–08/10
ATmega169P
2.2.7 Port E (PE7:PE0)
Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort E output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port E pins that are externally pulled low will source current if the pull-upresistors are activated. The Port E pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port E also serves the functions of various special features of the ATmega169P as listed on”Alternate Functions of Port E” on page 81.
2.2.8 Port F (PF7:PF0)
Port F serves as the analog inputs to the A/D Converter.
Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pinscan provide internal pull-up resistors (selected for each bit). The Port F output buffers have sym-metrical drive characteristics with both high sink and source capability. As inputs, Port F pinsthat are externally pulled low will source current if the pull-up resistors are activated. The Port Fpins are tri-stated when a reset condition becomes active, even if the clock is not running. If theJTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) willbe activated even if a reset occurs.
Port F also serves the functions of the JTAG interface, see ”Alternate Functions of Port F” onpage 83.
2.2.9 Port G (PG5:PG0)
Port G is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). ThePort G output buffers have symmetrical drive characteristics with both high sink and sourcecapability. As inputs, Port G pins that are externally pulled low will source current if the pull-upresistors are activated. The Port G pins are tri-stated when a reset condition becomes active,even if the clock is not running.
Port G also serves the functions of various special features of the ATmega169P as listed onpage 85.
2.2.10 RESET
Reset input. A low level on this pin for longer than the minimum pulse length will generate areset, even if the clock is not running. The minimum pulse length is given in Table 28-4 on page333. Shorter pulses are not guaranteed to generate a reset.
2.2.11 XTAL1
Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
2.2.12 XTAL2
Output from the inverting Oscillator amplifier.
2.2.13 AVCC
AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally con-nected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC
through a low-pass filter.
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ATmega169P
2.2.14 AREF
This is the analog reference pin for the A/D Converter.
2.2.15 LCDCAP
An external capacitor (typical > 470 nF) must be connected to the LCDCAP pin as shown in Fig-ure 23-2 on page 236. This capacitor acts as a reservoir for LCD power (VLCD). A largecapacitance reduces ripple on VLCD but increases the time until VLCD reaches its target value.
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ATmega169P
3. Resources
A comprehensive set of development tools, application notes and datasheets are available fordownload on http://www.atmel.com/avr.
Note: 1.
4. Data Retention
Reliability Qualification results show that the projected data retention failure rate is much lessthan 1 PPM over 20 years at 85°C or 100 years at 25°C.
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ATmega169P
5. About Code Examples
This documentation contains simple code examples that briefly show how to use various parts ofthe device. Be aware that not all C compiler vendors include bit definitions in the header filesand interrupt handling in C is compiler dependent. Please confirm with the C compiler documen-tation for more details.
These code examples assume that the part specific header file is included before compilation.For I/O registers located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI"instructions must be replaced with instructions that allow access to extended I/O. Typically"LDS" and "STS" combined with "SBRS", "SBRC", "SBR", and "CBR".
108018P–AVR–08/10
ATmega169P
6. AVR CPU Core
6.1 Introduction
This section discusses the AVR core architecture in general. The main function of the CPU coreis to ensure correct program execution. The CPU must therefore be able to access memories,perform calculations, control peripherals, and handle interrupts.
6.2 Architectural Overview
Figure 6-1. Block Diagram of the AVR Architecture
In order to maximize performance and parallelism, the AVR uses a Harvard architecture – withseparate memories and buses for program and data. Instructions in the program memory areexecuted with a single level pipelining. While one instruction is being executed, the next instruc-tion is pre-fetched from the program memory. This concept enables instructions to be executedin every clock cycle. The program memory is In-System Reprogrammable Flash memory.
FlashProgramMemory
InstructionRegister
InstructionDecoder
ProgramCounter
Control Lines
32 x 8GeneralPurpose
Registrers
ALU
Statusand Control
I/O Lines
EEPROM
Data Bus 8-bit
DataSRAM
Dire
ct A
ddre
ssin
g
Indi
rect
Add
ress
ing
InterruptUnit
SPIUnit
WatchdogTimer
AnalogComparator
I/O Module 2
I/O Module1
I/O Module n
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ATmega169P
The fast-access Register File contains 32 × 8-bit general purpose working registers with a singleclock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typ-ical ALU operation, two operands are output from the Register File, the operation is executed,and the result is stored back in the Register File – in one clock cycle.
Six of the 32 registers can be used as three 16-bit indirect address register pointers for DataSpace addressing – enabling efficient address calculations. One of the these address pointerscan also be used as an address pointer for look up tables in Flash program memory. Theseadded function registers are the 16-bit X-, Y-, and Z-register, described later in this section.
The ALU supports arithmetic and logic operations between registers or between a constant anda register. Single register operations can also be executed in the ALU. After an arithmetic opera-tion, the Status Register is updated to reflect information about the result of the operation.
Program flow is provided by conditional and unconditional jump and call instructions, able todirectly address the whole address space. Most AVR instructions have a single 16-bit word for-mat. Every program memory address contains a 16-bit or 32-bit instruction.
Program Flash memory space is divided in two sections, the Boot Program section and theApplication Program section. Both sections have dedicated Lock bits for write and read/writeprotection. The SPM instruction that writes into the Application Flash memory section mustreside in the Boot Program section.
During interrupts and subroutine calls, the return address Program Counter (PC) is stored on theStack. The Stack is effectively allocated in the general data SRAM, and consequently the Stacksize is only limited by the total SRAM size and the usage of the SRAM. All user programs mustinitialize the SP in the Reset routine (before subroutines or interrupts are executed). The StackPointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessedthrough the five different addressing modes supported in the AVR architecture.
The memory spaces in the AVR architecture are all linear and regular memory maps.
A flexible interrupt module has its control registers in the I/O space with an additional GlobalInterrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in theInterrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector posi-tion. The lower the Interrupt Vector address, the higher the priority.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control Regis-ters, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as the DataSpace locations following those of the Register File, 0x20 - 0x5F. In addition, the ATmega169Phas Extended I/O space from 0x60 - 0xFF in SRAM where only the ST/STS/STD andLD/LDS/LDD instructions can be used.
6.3 ALU – Arithmetic Logic Unit
The high-performance AVR ALU operates in direct connection with all the 32 general purposeworking registers. Within a single clock cycle, arithmetic operations between general purposeregisters or between a register and an immediate are executed. The ALU operations are dividedinto three main categories – arithmetic, logical, and bit-functions. Some implementations of thearchitecture also provide a powerful multiplier supporting both signed/unsigned multiplicationand fractional format. See the “Instruction Set” section for a detailed description.
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ATmega169P
6.4 Stack Pointer
The Stack is mainly used for storing temporary data, for storing local variables and for storingreturn addresses after interrupts and subroutine calls. Note that the Stack is implemented asgrowing from higher to lower memory locations. The Stack Pointer Register always points to thetop of the Stack. The Stack Pointer points to the data SRAM Stack area where the Subroutineand Interrupt Stacks are located. A Stack PUSH command will decrease the Stack Pointer.
The Stack in the data SRAM must be defined by the program before any subroutine calls areexecuted or interrupts are enabled. Initial Stack Pointer value equals the last address of theinternal SRAM and the Stack Pointer must be set to point above start of the SRAM, see Figure7-2 on page 21.
See Table 6-1 for Stack Pointer details.
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number ofbits actually used is implementation dependent. Note that the data space in some implementa-tions of the AVR architecture is so small that only SPL is needed. In this case, the SPH Registerwill not be present.
Table 6-1. Stack Pointer instructions
Instruction Stack pointer Description
PUSH Decremented by 1 Data is pushed onto the stack
CALLICALLRCALL
Decremented by 2Return address is pushed onto the stack with a subroutine call or interrupt
POP Incremented by 1 Data is popped from the stack
RETRETI
Incremented by 2 Return address is popped from the stack with return from subroutine or return from interrupt
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ATmega169P
6.4.1 SPH and SPL – Stack Pointer
6.5 Instruction Execution Timing
This section describes the general access timing concepts for instruction execution. The AVRCPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for thechip. No internal clock division is used.
Figure 6-2 shows the parallel instruction fetches and instruction executions enabled by the Har-vard architecture and the fast-access Register File concept. This is the basic pipelining conceptto obtain up to 1 MIPS per MHz with the corresponding unique results for functions per cost,functions per clocks, and functions per power-unit.
Figure 6-2. The Parallel Instruction Fetches and Instruction Executions
Figure 6-3 shows the internal timing concept for the Register File. In a single clock cycle an ALUoperation using two register operands is executed, and the result is stored back to the destina-tion register.
Figure 6-3. Single Cycle ALU Operation
Bit 15 14 13 12 11 10 9 8
0x3E (0x5E) – – – – – SP10 SP9 SP8 SPH
0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL
7 6 5 4 3 2 1 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
clk
1st Instruction Fetch
1st Instruction Execute2nd Instruction Fetch
2nd Instruction Execute3rd Instruction Fetch
3rd Instruction Execute4th Instruction Fetch
T1 T2 T3 T4
CPU
Total Execution Time
Register Operands Fetch
ALU Operation Execute
Result Write Back
T1 T2 T3 T4
clkCPU
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ATmega169P
6.6 Reset and Interrupt Handling
The AVR provides several different interrupt sources. These interrupts and the separate ResetVector each have a separate program vector in the program memory space. All interrupts areassigned individual enable bits which must be written logic one together with the Global InterruptEnable bit in the Status Register in order to enable the interrupt. Depending on the ProgramCounter value, interrupts may be automatically disabled when Boot Lock bits BLB02 or BLB12are programmed. This feature improves software security. See the section ”Memory Program-ming” on page 296 for details.
The lowest addresses in the program memory space are by default defined as the Reset andInterrupt Vectors. The complete list of vectors is shown in ”Interrupts” on page 56. The list alsodetermines the priority levels of the different interrupts. The lower the address the higher is thepriority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request0. The Interrupt Vectors can be moved to the start of the Boot Flash section by setting the IVSELbit in the MCU Control Register (MCUCR). Refer to ”Interrupts” on page 56 for more information.The Reset Vector can also be moved to the start of the Boot Flash section by programming theBOOTRST Fuse, see ”Boot Loader Support – Read-While-Write Self-Programming” on page280.
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are dis-abled. The user software can write logic one to the I-bit to enable nested interrupts. All enabledinterrupts can then interrupt the current interrupt routine. The I-bit is automatically set when aReturn from Interrupt instruction – RETI – is executed.
There are basically two types of interrupts. The first type is triggered by an event that sets theInterrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vec-tor in order to execute the interrupt handling routine, and hardware clears the correspondingInterrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s)to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit iscleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag iscleared by software. Similarly, if one or more interrupt conditions occur while the Global InterruptEnable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until theGlobal Interrupt Enable bit is set, and will then be executed by order of priority.
The second type of interrupts will trigger as long as the interrupt condition is present. Theseinterrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before theinterrupt is enabled, the interrupt will not be triggered.
When the AVR exits from an interrupt, it will always return to the main program and execute onemore instruction before any pending interrupt is served.
Note that the Status Register is not automatically stored when entering an interrupt routine, norrestored when returning from an interrupt routine. This must be handled by software.
When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled.No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with theCLI instruction. The following example shows how this can be used to avoid interrupts during thetimed EEPROM write sequence.
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When using the SEI instruction to enable interrupts, the instruction following SEI will be exe-cuted before any pending interrupts, as shown in this example.
6.6.1 Interrupt Response Time
The interrupt execution response for all the enabled AVR interrupts is four clock cycles mini-mum. After four clock cycles the program vector address for the actual interrupt handling routineis executed. During this four clock cycle period, the Program Counter is pushed onto the Stack.The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. Ifan interrupt occurs during execution of a multi-cycle instruction, this instruction is completedbefore the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interruptexecution response time is increased by four clock cycles. This increase comes in addition to thestart-up time from the selected sleep mode.
A return from an interrupt handling routine takes four clock cycles. During these four clockcycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer isincremented by two, and the I-bit in SREG is set.
Assembly Code Example
in r16, SREG ; store SREG value
cli ; disable interrupts during timed sequence
sbi EECR, EEMWE ; start EEPROM write
sbi EECR, EEWE
out SREG, r16 ; restore SREG value (I-bit)
C Code Example
char cSREG;
cSREG = SREG; /* store SREG value */
/* disable interrupts during timed sequence */
__disable_interrupt();
EECR |= (1<<EEMWE); /* start EEPROM write */
EECR |= (1<<EEWE);
SREG = cSREG; /* restore SREG value (I-bit) */
Assembly Code Example
sei ; set Global Interrupt Enable
sleep; enter sleep, waiting for interrupt
; note: will enter sleep before any pending
; interrupt(s)
C Code Example
__enable_interrupt(); /* set Global Interrupt Enable */
__sleep(); /* enter sleep, waiting for interrupt */
/* note: will enter sleep before any pending interrupt(s) */
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6.7 Status Register
The Status Register contains information about the result of the most recently executed arithme-tic instruction. This information can be used for altering program flow in order to performconditional operations. Note that the Status Register is updated after all ALU operations, asspecified in the Instruction Set Reference. This will in many cases remove the need for using thededicated compare instructions, resulting in faster and more compact code.
The Status Register is not automatically stored when entering an interrupt routine and restoredwhen returning from an interrupt. This must be handled by software.
6.7.1 SREG – AVR Status Register
The SREG is defined as:
• Bit 7 – I: Global Interrupt EnableThe Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual inter-rupt enable control is then performed in separate control registers. If the Global Interrupt EnableRegister is cleared, none of the interrupts are enabled independent of the individual interruptenable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set bythe RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared bythe application with the SEI and CLI instructions, as described in the instruction set reference.
• Bit 6 – T: Bit Copy StorageThe Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or desti-nation for the operated bit. A bit from a register in the Register File can be copied into T by theBST instruction, and a bit in T can be copied into a bit in a register in the Register File by theBLD instruction.
• Bit 5 – H: Half Carry FlagThe Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry Is usefulin BCD arithmetic. See the “Instruction Set Description” for detailed information.
• Bit 4 – S: Sign Bit, S = N ⊕ VThe S-bit is always an exclusive or between the Negative Flag N and the Two’s ComplementOverflow Flag V. See the “Instruction Set Description” for detailed information.
• Bit 3 – V: Two’s Complement Overflow FlagThe Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the“Instruction Set Description” for detailed information.
• Bit 2 – N: Negative FlagThe Negative Flag N indicates a negative result in an arithmetic or logic operation. See the“Instruction Set Description” for detailed information.
Bit 7 6 5 4 3 2 1 0
0x3F (0x5F) I T H S V N Z C SREG
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 1 – Z: Zero FlagThe Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “InstructionSet Description” for detailed information.
• Bit 0 – C: Carry FlagThe Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction SetDescription” for detailed information.
6.8 General Purpose Register File
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achievethe required performance and flexibility, the following input/output schemes are supported by theRegister File:
• One 8-bit output operand and one 8-bit result input
• Two 8-bit output operands and one 8-bit result input
• Two 8-bit output operands and one 16-bit result input
• One 16-bit output operand and one 16-bit result input
Figure 6-4 shows the structure of the 32 general purpose working registers in the CPU.
Figure 6-4. AVR CPU General Purpose Working Registers
Most of the instructions operating on the Register File have direct access to all registers, andmost of them are single cycle instructions.
As shown in Figure 6-4, each register is also assigned a data memory address, mapping themdirectly into the first 32 locations of the user Data Space. Although not being physically imple-mented as SRAM locations, this memory organization provides great flexibility in access of theregisters, as the X-, Y- and Z-pointer registers can be set to index any register in the file.
7 0 Addr.
R0 0x00
R1 0x01
R2 0x02
…
R13 0x0D
General R14 0x0E
Purpose R15 0x0F
Working R16 0x10
Registers R17 0x11
…
R26 0x1A X-register Low Byte
R27 0x1B X-register High Byte
R28 0x1C Y-register Low Byte
R29 0x1D Y-register High Byte
R30 0x1E Z-register Low Byte
R31 0x1F Z-register High Byte
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6.8.1 The X-register, Y-register, and Z-register
The registers R26..R31 have some added functions to their general purpose usage. These reg-isters are 16-bit address pointers for indirect addressing of the data space. The three indirectaddress registers X, Y, and Z are defined as described in Figure 6-5.
Figure 6-5. The X-, Y-, and Z-registers
In the different addressing modes these address registers have functions as fixed displacement,automatic increment, and automatic decrement (see the instruction set reference for details).
15 XH XL 0
X-register 7 0 7 0
R27 (0x1B) R26 (0x1A)
15 YH YL 0
Y-register 7 0 7 0
R29 (0x1D) R28 (0x1C)
15 ZH ZL 0
Z-register 7 0 7 0
R31 (0x1F) R30 (0x1E)
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7. AVR Memories
This section describes the different memories in the ATmega169P. The AVR architecture hastwo main memory spaces, the Data Memory and the Program Memory space. In addition, theATmega169P features an EEPROM Memory for data storage. All three memory spaces are lin-ear and regular.
7.1 In-System Reprogrammable Flash Program Memory
The ATmega169P contains 16 Kbytes On-chip In-System Reprogrammable Flash memory forprogram storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as 8K× 16. For software security, the Flash Program memory space is divided into two sections, BootProgram section and Application Program section.
The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATmega169PProgram Counter (PC) is 13 bits wide, thus addressing the 8K program memory locations. Theoperation of Boot Program section and associated Boot Lock bits for software protection aredescribed in detail in ”Boot Loader Support – Read-While-Write Self-Programming” on page280. ”Memory Programming” on page 296 contains a detailed description on Flash data serialdownloading using the SPI pins or the JTAG interface.
Constant tables can be allocated within the entire program memory address space (see the LPM– Load Program Memory instruction description).
Timing diagrams for instruction fetch and execution are presented in ”Instruction Execution Tim-ing” on page 14.
Figure 7-1. Program Memory Map
0x0000
0x1FFF
Program Memory
Application Flash Section
Boot Flash Section
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7.2 SRAM Data Memory
Figure 7-2 shows how the ATmega169P SRAM Memory is organized.
The ATmega169P is a complex microcontroller with more peripheral units than can be sup-ported within the 64 locations reserved in the Opcode for the IN and OUT instructions. For theExtended I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instruc-tions can be used.
The lower 1,280 data memory locations address both the Register File, the I/O memory,Extended I/O memory, and the internal data SRAM. The first 32 locations address the RegisterFile, the next 64 location the standard I/O memory, then 160 locations of Extended I/O memory,and the next 1024 locations address the internal data SRAM.
The five different addressing modes for the data memory cover: Direct, Indirect with Displace-ment, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the RegisterFile, registers R26 to R31 feature the indirect addressing pointer registers.
The direct addressing reaches the entire data space.
The Indirect with Displacement mode reaches 63 address locations from the base address givenby the Y- or Z-register.
When using register indirect addressing modes with automatic pre-decrement and post-incre-ment, the address registers X, Y, and Z are decremented or incremented.
The 32 general purpose working registers, 64 I/O Registers, 160 Extended I/O Registers, andthe 1,024 bytes of internal data SRAM in the ATmega169P are all accessible through all theseaddressing modes. The Register File is described in ”General Purpose Register File” on page18.
Figure 7-2. Data Memory Map
32 Registers64 I/O Registers
Internal SRAM(1024 x 8)
0x0000 - 0x001F0x0020 - 0x005F
0x04FF
0x0060 - 0x00FF
Data Memory
160 Ext I/O Reg.0x0100
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7.2.1 Data Memory Access Times
This section describes the general access timing concepts for internal memory access. Theinternal data SRAM access is performed in two clkCPU cycles as described in Figure 7-3.
Figure 7-3. On-chip Data SRAM Access Cycles
clk
WR
RD
Data
Data
Address Address valid
T1 T2 T3
Compute Address
Rea
dW
rite
CPU
Memory Access Instruction Next Instruction
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7.3 EEPROM Data Memory
The ATmega169P contains 512 bytes of data EEPROM memory. It is organized as a separatedata space, in which single bytes can be read and written. The EEPROM has an endurance of atleast 100,000 write/erase cycles. This section describes the access between the EEPROM andthe CPU, specifying the EEPROM Address Registers, the EEPROM Data Register, and theEEPROM Control Register.
For a detailed description of SPI, JTAG and Parallel data downloading to the EEPROM, see”Serial Downloading” on page 310, ”Programming via the JTAG Interface” on page 316, and”Parallel Programming Parameters, Pin Mapping, and Commands” on page 299 respectively.
7.3.1 EEPROM Read/Write Access
The EEPROM Access Registers are accessible in the I/O space.
The write access time for the EEPROM is given in Table 7-1 on page 24. A self-timing function,however, lets the user software detect when the next byte can be written. If the user code con-tains instructions that write the EEPROM, some precautions must be taken. In heavily filteredpower supplies, VCC is likely to rise or fall slowly on power-up/down. This causes the device forsome period of time to run at a voltage lower than specified as minimum for the clock frequencyused. See ”Preventing EEPROM Corruption” on page 27 for details on how to avoid problems inthese situations.
In order to prevent unintentional EEPROM writes, a specific write procedure must be followed.
When the EEPROM is read, the CPU is halted for four clock cycles before the next instruction isexecuted. When the EEPROM is written, the CPU is halted for two clock cycles before the nextinstruction is executed.
The following procedure should be followed when writing the EEPROM (the order of steps 3 and4 is not essential). See ”EEPROM Register Description” on page 28 for supplementary descrip-tion for each register bit:
1. Wait until EEWE becomes zero.
2. Wait until SPMEN in SPMCSR becomes zero.
3. Write new EEPROM address to EEAR (optional).
4. Write new EEPROM data to EEDR (optional).
5. Write a logical one to the EEMWE bit while writing a zero to EEWE in EECR.
6. Within four clock cycles after setting EEMWE, write a logical one to EEWE.
The EEPROM can not be programmed during a CPU write to the Flash memory. The softwaremust check that the Flash programming is completed before initiating a new EEPROM write.Step 2 is only relevant if the software contains a Boot Loader allowing the CPU to program theFlash. If the Flash is never being updated by the CPU, step 2 can be omitted. See ”Boot LoaderSupport – Read-While-Write Self-Programming” on page 280 for details about Bootprogramming.
Caution: An interrupt between step 5 and step 6 will make the write cycle fail, since theEEPROM Master Write Enable will time-out. If an interrupt routine accessing the EEPROM isinterrupting another EEPROM access, the EEAR or EEDR Register will be modified, causing theinterrupted EEPROM access to fail. It is recommended to have the Global Interrupt Flag clearedduring all the steps to avoid these problems.
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When the write access time has elapsed, the EEWE bit is cleared by hardware. The user soft-ware can poll this bit and wait for a zero before writing the next byte. When EEWE has been set,the CPU is halted for two cycles before the next instruction is executed.
The user should poll the EEWE bit before starting the read operation. If a write operation is inprogress, it is neither possible to read the EEPROM, nor to change the EEAR Register.
The calibrated Oscillator is used to time the EEPROM accesses. Table 7-1 lists the typical pro-gramming time for EEPROM access from the CPU.
Table 7-1. EEPROM Programming Time
SymbolNumber of CalibratedRC Oscillator Cycles Typical Programming Time
EEPROM write (from CPU) 27 072 3.3 ms
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The following code examples show one assembly and one C function for writing to theEEPROM. To avoid that interrupts will occur during execution of these functions, the examplesassume that interrupts are controlled (for example by disabling interrupts globally). The exam-ples also assume that no Flash Boot Loader is present in the software. If such code is present,the EEPROM write function must also wait for any ongoing SPM command to finish.
Assembly Code Example
EEPROM_write:
; Wait for completion of previous write
sbic EECR,EEWE
rjmp EEPROM_write
; Set up address (r18:r17) in address register
out EEARH, r18
out EEARL, r17
; Write data (r16) to Data Register
out EEDR,r16
; Write logical one to EEMWE
sbi EECR,EEMWE
; Start eeprom write by setting EEWE
sbi EECR,EEWE
ret
C Code Example
void EEPROM_write(unsigned int uiAddress, unsigned char ucData)
{
/* Wait for completion of previous write */
while(EECR & (1<<EEWE))
;
/* Set up address and Data Registers */
EEAR = uiAddress;
EEDR = ucData;
/* Write logical one to EEMWE */
EECR |= (1<<EEMWE);
/* Start eeprom write by setting EEWE */
EECR |= (1<<EEWE);
}
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The next code examples show assembly and C functions for reading the EEPROM. The exam-ples assume that interrupts are controlled so that no interrupts will occur during execution ofthese functions.
Assembly Code Example
EEPROM_read:
; Wait for completion of previous write
sbic EECR,EEWE
rjmp EEPROM_read
; Set up address (r18:r17) in address register
out EEARH, r18
out EEARL, r17
; Start eeprom read by writing EERE
sbi EECR,EERE
; Read data from Data Register
in r16,EEDR
ret
C Code Example
unsigned char EEPROM_read(unsigned int uiAddress)
{
/* Wait for completion of previous write */
while(EECR & (1<<EEWE))
;
/* Set up address register */
EEAR = uiAddress;
/* Start eeprom read by writing EERE */
EECR |= (1<<EERE);
/* Return data from Data Register */
return EEDR;
}
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7.3.2 EEPROM Write During Power-down Sleep Mode
When entering Power-down sleep mode while an EEPROM write operation is active, theEEPROM write operation will continue, and will complete before the Write Access time haspassed. However, when the write operation is completed, the clock continues running, and as aconsequence, the device does not enter Power-down entirely. It is therefore recommended toverify that the EEPROM write operation is completed before entering Power-down.
7.3.3 Preventing EEPROM Corruption
During periods of low VCC, the EEPROM data can be corrupted because the supply voltage istoo low for the CPU and the EEPROM to operate properly. These issues are the same as forboard level systems using EEPROM, and the same design solutions should be applied.
An EEPROM data corruption can be caused by two situations when the voltage is too low. First,a regular write sequence to the EEPROM requires a minimum voltage to operate correctly. Sec-ondly, the CPU itself can execute instructions incorrectly, if the supply voltage is too low.
EEPROM data corruption can easily be avoided by following this design recommendation:
Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This canbe done by enabling the internal Brown-out Detector (BOD). If the detection level of the internalBOD does not match the needed detection level, an external low VCC reset Protection circuit canbe used. If a reset occurs while a write operation is in progress, the write operation will be com-pleted provided that the power supply voltage is sufficient.
7.4 I/O Memory
The I/O space definition of the ATmega169P is shown in ”Register Summary” on page 373.
All ATmega169P I/Os and peripherals are placed in the I/O space. All I/O locations may beaccessed by the LD/LDS/LDD and ST/STS/STD instructions, transferring data between the 32general purpose working registers and the I/O space. I/O Registers within the address range0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, thevalue of single bits can be checked by using the SBIS and SBIC instructions. Refer to theinstruction set section for more details. When using the I/O specific commands IN and OUT, theI/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space usingLD and ST instructions, 0x20 must be added to these addresses. The ATmega169P is a com-plex microcontroller with more peripheral units than can be supported within the 64 locationreserved in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 -0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used.
For compatibility with future devices, reserved bits should be written to zero if accessed.Reserved I/O memory addresses should never be written.
Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike mostother AVRs, the CBI and SBI instructions will only operate on the specified bit, and can thereforebe used on registers containing such Status Flags. The CBI and SBI instructions work with reg-isters 0x00 to 0x1F only.
The I/O and peripherals control registers are explained in later sections.
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7.5 General Purpose I/O Registers
The ATmega169P contains three General Purpose I/O Registers. These registers can be usedfor storing any information, and they are particularly useful for storing global variables and Sta-tus Flags. General Purpose I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions.
7.5.1 GPIOR2 – General Purpose I/O Register 2
7.5.2 GPIOR1 – General Purpose I/O Register 1
7.5.3 GPIOR0 – General Purpose I/O Register 0
7.6 EEPROM Register Description
7.6.1 EEARH and EEARL – EEPROM Address Register
• Bits 15:9 – Res: Reserved BitsThese bits are reserved and will always read as zero.
• Bits 8:0 – EEAR8:0: EEPROM AddressThe EEPROM Address Registers – EEARH and EEARL specify the EEPROM address in the512 bytes EEPROM space. The EEPROM data bytes are addressed linearly between 0 and511. The initial value of EEAR is undefined. A proper value must be written before the EEPROMmay be accessed.
Bit 7 6 5 4 3 2 1 0
0x2B (0x4B) MSB LSB GPIOR2
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x2A (0x4A) MSB LSB GPIOR1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x1E (0x3E) MSB LSB GPIOR0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 15 14 13 12 11 10 9 8
0x22 (0x42) – – – – – – – EEAR8 EEARH
0x21 (0x41) EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 EEARL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R/W
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 X
X X X X X X X X
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7.6.2 EEDR – EEPROM Data Register
• Bits 7:0 – EEDR7:0: EEPROM DataFor the EEPROM write operation, the EEDR Register contains the data to be written to theEEPROM in the address given by the EEAR Register. For the EEPROM read operation, theEEDR contains the data read out from the EEPROM at the address given by EEAR.
7.6.3 EECR – EEPROM Control Register
• Bits 7..4 – Res: Reserved BitsThese bits are reserved and will always read as zero.
• Bit 3 – EERIE: EEPROM Ready Interrupt EnableWriting EERIE to one enables the EEPROM Ready Interrupt if the I-bit in SREG is set. WritingEERIE to zero disables the interrupt. The EEPROM Ready interrupt generates a constant inter-rupt when EEWE is cleared.
• Bit 2 – EEMWE: EEPROM Master Write EnableThe EEMWE bit determines whether setting EEWE to one causes the EEPROM to be written.When EEMWE is set, setting EEWE within four clock cycles will write data to the EEPROM atthe selected address. If EEMWE is zero, setting EEWE will have no effect. When EEMWE hasbeen written to one by software, hardware clears the bit to zero after four clock cycles. See thedescription of the EEWE bit for an EEPROM write procedure.
• Bit 1 – EEWE: EEPROM Write EnableThe EEPROM Write Enable Signal EEWE is the write strobe to the EEPROM. When addressand data are correctly set up, the EEWE bit must be written to one to write the value into theEEPROM. The EEMWE bit must be written to one before a logical one is written to EEWE, oth-erwise no EEPROM write takes place.
• Bit 0 – EERE: EEPROM Read EnableThe EEPROM Read Enable Signal EERE is the read strobe to the EEPROM. When the correctaddress is set up in the EEAR Register, the EERE bit must be written to a logic one to trigger theEEPROM read. The EEPROM read access takes one instruction, and the requested data isavailable immediately. When the EEPROM is read, the CPU is halted for four cycles before thenext instruction is executed.
Bit 7 6 5 4 3 2 1 0
0x20 (0x40) MSB LSB EEDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x1F (0x3F) – – – – EERIE EEMWE EEWE EERE EECR
Read/Write R R R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 X 0
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8. System Clock and Clock Options
8.1 Clock Systems and their Distribution
Figure 8-1 presents the principal clock systems in the AVR and their distribution. All of the clocksneed not be active at a given time. In order to reduce power consumption, the clocks to modulesnot being used can be halted by using different sleep modes, as described in ”Power Manage-ment and Sleep Modes” on page 40. The clock systems are detailed below.
Figure 8-1. Clock Distribution
8.1.1 CPU Clock – clkCPU
The CPU clock is routed to parts of the system concerned with operation of the AVR core.Examples of such modules are the General Purpose Register File, the Status Register and thedata memory holding the Stack Pointer. Halting the CPU clock inhibits the core from performinggeneral operations and calculations.
8.1.2 I/O Clock – clkI/O
The I/O clock is used by the majority of the I/O modules, like Timer/Counters, SPI, and USART.The I/O clock is also used by the External Interrupt module, but note that some external inter-rupts are detected by asynchronous logic, allowing such interrupts to be detected even if the I/Oclock is halted. Also note that start condition detection in the USI module is carried out asynchro-nously when clkI/O is halted, enabling USI start condition detection in all sleep modes.
8.1.3 Flash Clock – clkFLASH
The Flash clock controls operation of the Flash interface. The Flash clock is usually active simul-taneously with the CPU clock.
General I/OModules
AsynchronousTimer/Counter
CPU Core RAM
clkI/O
clkASY
AVR ClockControl Unit
clkCPU
Flash andEEPROM
clkFLASH
Source clock
Watchdog Timer
WatchdogOscillator
Reset Logic
ClockMultiplexer
Watchdog clock
Calibrated RCOscillator
Timer/CounterOscillator
CrystalOscillator
Low-frequencyCrystal Oscillator
External Clock
LCD Controller
System Clock
Prescaler
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8.1.4 Asynchronous Timer Clock – clkASY
The Asynchronous Timer clock allows the Asynchronous Timer/Counter and the LCD controllerto be clocked directly from an external clock or an external 32 kHz clock crystal. The dedicatedclock domain allows using this Timer/Counter as a real-time counter even when the device is insleep mode. It also allows the LCD controller output to continue while the rest of the device is insleep mode.
8.1.5 ADC Clock – clkADC
The ADC is provided with a dedicated clock domain. This allows halting the CPU and I/O clocksin order to reduce noise generated by digital circuitry. This gives more accurate ADC conversionresults.
8.2 Clock Sources
The device has the following clock source options, selectable by Flash Fuse bits as shownbelow. The clock from the selected source is input to the AVR clock generator, and routed to theappropriate modules.
Note: 1. For all fuses “1” means unprogrammed while “0” means programmed.
The various choices for each clocking option is given in the following sections. When the CPUwakes up from Power-down or Power-save, the selected clock source is used to time the start-up, ensuring stable Oscillator operation before instruction execution starts. When the CPU startsfrom reset, there is an additional delay allowing the power to reach a stable level before com-mencing normal operation. The Watchdog Oscillator is used for timing this real-time part of thestart-up time. The number of WDT Oscillator cycles used for each time-out is shown in Table 8-2. The frequency of the Watchdog Oscillator is voltage dependent as shown in ”Typical Charac-teristics” on page 338.
Table 8-1. Device Clocking Options Select(1)
Device Clocking Option CKSEL3:0
External Crystal/Ceramic Resonator 1111 - 1000
External Low-frequency Crystal 0111 - 0110
Calibrated Internal RC Oscillator 0010
External Clock 0000
Reserved 0011, 0001, 0101, 0100
Table 8-2. Number of Watchdog Oscillator Cycles
Typ Time-out (VCC = 5.0V) Typ Time-out (VCC = 3.0V) Number of Cycles
4.1 ms 4.3 ms 4K (4,096)
65 ms 69 ms 64K (65,536)
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8.3 Default Clock Source
The device is shipped with CKSEL = “0010”, SUT = “10”, and CKDIV8 programmed. The defaultclock source setting is the Internal RC Oscillator with longest start-up time and an initial systemclock prescaling of 8. This default setting ensures that all users can make their desired clocksource setting using an In-System or Parallel programmer.
8.4 Calibrated Internal RC Oscillator
B default, the Internal RC Oscillator provides an approximate 8 MHz clock. Though voltage andtemperature dependent, this clock can be very accurately calibrated by the user. See Table 28-2on page 332 and ”Internal Oscillator Speed” on page 365 for more details. The device is shippedwith the CKDIV8 Fuse programmed. See ”System Clock Prescaler” on page 37 for more details.
This clock may be selected as the system clock by programming the CKSEL Fuses as shown inTable 8-3. If selected, it will operate with no external components. During reset, hardware loadsthe pre-programmed calibration value into the OSCCAL Register and thereby automatically cali-brates the RC Oscillator. The accuracy of this calibration is shown as Factory calibration in Table28-2 on page 332.
By changing the OSCCAL register from SW, see ”OSCCAL – Oscillator Calibration Register” onpage 38, it is possible to get a higher calibration accuracy than by using the factory calibration.The accuracy of this calibration is shown as User calibration in Table 28-2 on page 332.
When this Oscillator is used as the chip clock, the Watchdog Oscillator will still be used for theWatchdog Timer and for the Reset Time-out. For more information on the pre-programmed cali-bration value, see the section ”Calibration Byte” on page 299.
Notes: 1. The device is shipped with this option selected.2. The frequency ranges are preliminary values. Actual values are TBD.3. If 8 MHz frequency exceeds the specification of the device (depends on VCC), the CKDIV8
Fuse can be programmed in order to divide the internal frequency by 8.
When this Oscillator is selected, start-up times are determined by the SUT Fuses as shown inTable 8-4.
Note: 1. The device is shipped with this option selected.
Table 8-3. Internal Calibrated RC Oscillator Operating Modes(1)(3)
Frequency Range(2) (MHz) CKSEL3:0
7.3 - 8.1 0010
Table 8-4. Start-up times for the internal calibrated RC Oscillator clock selection
Power ConditionsStart-up Time from Power-
down and Power-saveAdditional Delay from
Reset (VCC = 5.0V) SUT1:0
BOD enabled 6 CK 14CK 00
Fast rising power 6 CK 14CK + 4.1 ms 01
Slowly rising power 6 CK 14CK + 65 ms(1) 10
Reserved 11
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8.5 Crystal Oscillator
XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can be con-figured for use as an On-chip Oscillator, as shown in Figure 8-2. Either a quartz crystal or aceramic resonator may be used.
C1 and C2 should always be equal for both crystals and resonators. The optimal value of thecapacitors depends on the crystal or resonator in use, the amount of stray capacitance, and theelectromagnetic noise of the environment. Some initial guidelines for choosing capacitors foruse with crystals are given in Table 8-5. For ceramic resonators, the capacitor values given bythe manufacturer should be used.
Figure 8-2. Crystal Oscillator Connections
The Oscillator can operate in three different modes, each optimized for a specific frequencyrange. The operating mode is selected by the fuses CKSEL3:1 as shown in Table 8-5.
Notes: 1. This option should not be used with crystals, only with ceramic resonators.
Table 8-5. Crystal Oscillator Operating Modes
CKSEL3:1 Frequency Range (MHz)Recommended Range for Capacitors C1 and
C2 for Use with Crystals (pF)
100(1) 0.4 - 0.9 –
101 0.9 - 3.0 12 - 22
110 3.0 - 8.0 12 - 22
111 8.0 - 12 - 22
XTAL2 (TOSC2)
XTAL1 (TOSC1)
GND
C2
C1
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The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in Table8-6.
Notes: 1. These options should only be used when not operating close to the maximum frequency of the device, and only if frequency stability at start-up is not important for the application. These options are not suitable for crystals.
2. These options are intended for use with ceramic resonators and will ensure frequency stability at start-up. They can also be used with crystals when not operating close to the maximum fre-quency of the device, and if frequency stability at start-up is not important for the application.
8.6 Low-frequency Crystal Oscillator
The Low-frequency Crystal Oscillator is optimized for use with a 32.768 kHz watch crystal.When selecting crystals, load capacitance and crystal’s Equivalent Series Resistance, ESRmust be taken into consideration. Both values are specified by the crystal vendor. ATmega169Poscillator is optimized for very low power consumption, and thus when selecting crystals, seeTable 8-7 for maximum ESR recommendations on 9 pF and 6.5 pF crystals.
Table 8-7. Maximum ESR Recommendation for 32.768 kHz Watch Crystal
Note: 1. Maximum ESR is typical value based on characterization
The Low-frequency Crystal Oscillator provides an internal load capacitance, see Table 8-8 onpage 35 at each TOSC pin.
Table 8-6. Start-up Times for the Crystal Oscillator Clock Selection
CKSEL0 SUT1:0
Start-up Time from Power-down and
Power-save
Additional Delay from Reset (VCC = 5.0V) Recommended Usage
0 00 258 CK(1) 14CK + 4.1 msCeramic resonator, fast rising power
0 01 258 CK(1) 14CK + 65 msCeramic resonator, slowly rising power
0 10 1K CK(2) 14CKCeramic resonator, BOD enabled
0 11 1K CK(2) 14CK + 4.1 msCeramic resonator, fast rising power
1 00 1K CK(2) 14CK + 65 msCeramic resonator, slowly rising power
1 01 16K CK 14CKCrystal Oscillator, BOD enabled
1 10 16K CK 14CK + 4.1 msCrystal Oscillator, fast rising power
1 11 16K CK 14CK + 65 msCrystal Oscillator, slowly rising power
Crystal CL (pF) Max ESR [kΩ](1)
6.5 60
9 35
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The capacitance (Ce + Ci) needed at each TOSC pin can be calculated by using:
where
Ce - is optional external capacitors as described in Figure 8-2 on page 33.Ci - is is the pin capacitance in Table 8-8.CL - is the load capacitance for a 32.768 kHz crystal specified by the crystal vendor.CS - is the total stray capacitance for one TOSC pin.
Crystals specifying load capacitance (CL) higher than the ones given in the Table 8-8, requireexternal capacitors applied as described in Figure 8-2 on page 33.
The Low-frequency Crystal Oscillator must be selected by setting the CKSEL Fuses to “0110” or“0111” as shown in Table 8-10. Start-up times are determined by the SUT Fuses as shown inTable 8-9.
Note: 1. This option should only be used if frequency stability at start-up is not important for the application
Table 8-8. Capacitance for Low-Frequency Crystal Oscillator
Device 32 kHz Osc. Type Cap (Xtal1/Tosc1) Cap (Xtal2/Tosc2)
ATmega169PSystem Osc. 16 pF 6 pF
Timer Osc. 16 pF 6 pF
Table 8-9. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection
SUT1..0 Additional Delay from Reset (VCC = 5.0V) Recommended Usage
00 14 CK Fast rising power or BOD enabled
01 14 CK + 4 ms Slowly rising power
10 14 CK + 65 ms Stable frequency at start-up
11 Reserved
Table 8-10. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection
CKSEL3..0Start-up Time from
Power-down and Power-save Recommended Usage
0110(1) 1K CK
0111 32K CK Stable frequency at start-up
Ce Ci+ 2 CL⋅ Cs–=
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8.7 External Clock
To drive the device from an external clock source, XTAL1 should be driven as shown in Figure8-3. To run the device on an external clock, the CKSEL Fuses must be programmed to “0000”.
Figure 8-3. External Clock Drive Configuration
When this clock source is selected, start-up times are determined by the SUT Fuses as shown inTable 8-12.
When applying an external clock, it is required to avoid sudden changes in the applied clock fre-quency to ensure stable operation of the MCU. A variation in frequency of more than 2% fromone clock cycle to the next can lead to unpredictable behavior. It is required to ensure that theMCU is kept in Reset during such changes in the clock frequency.
Note that the System Clock Prescaler can be used to implement run-time changes of the internalclock frequency while still ensuring stable operation. Refer to ”System Clock Prescaler” on page37 for details.
Table 8-11. Crystal Oscillator Clock Frequency
CKSEL3..0 Frequency Range
0000 0 - 16 MHz
Table 8-12. Start-up Times for the External Clock Selection
SUT1..0Start-up Time from Power-
down and Power-saveAdditional Delay from
Reset (VCC = 5.0V) Recommended Usage
00 6 CK 14CK BOD enabled
01 6 CK 14CK + 4.1 ms Fast rising power
10 6 CK 14CK + 65 ms Slowly rising power
11 Reserved
NC
EXTERNALCLOCKSIGNAL
XTAL2
XTAL1
GND
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8.8 Timer/Counter Oscillator
ATmega169P uses the same crystal oscillator for Low-frequency Oscillator and Timer/CounterOscillator. See ”Low-frequency Crystal Oscillator” on page 34 for details on the oscillator andcrystal requirements.
ATmega169P share the Timer/Counter Oscillator Pins (TOSC1 and TOSC2) with XTAL1 andXTAL2. When using the Timer/Counter Oscillator, the system clock needs to be four times theoscillator frequency. Due to this and the pin sharing, the Timer/Counter Oscillator can only beused when the Calibrated Internal RC Oscillator is selected as system clock source.
Applying an external clock source to TOSC1 can be done if EXTCLK in the ASSR Register iswritten to logic one. See ”Asynchronous operation of the Timer/Counter” on page 150 for furtherdescription on selecting external clock as input instead of a 32.768 kHz watch crystal.
8.9 Clock Output Buffer
When the CKOUT Fuse is programmed, the system Clock will be output on CLKO. This mode issuitable when chip clock is used to drive other circuits on the system. The clock will be outputalso during reset and the normal operation of I/O pin will be overridden when the fuse is pro-grammed. Any clock source, including internal RC Oscillator, can be selected when CLKOserves as clock output. If the System Clock Prescaler is used, it is the divided system clock thatis output when the CKOUT Fuse is programmed.
8.10 System Clock Prescaler
The ATmega169P system clock can be divided by setting the ”CLKPR – Clock Prescale Regis-ter” on page 38. This feature can be used to decrease the system clock frequency and powerconsumption when the requirement for processing power is low. This can be used with all clocksource options, and it will affect the clock frequency of the CPU and all synchronous peripherals.clkI/O, clkADC, clkCPU, and clkFLASH are divided by a factor as shown in Table 8-13.
When switching between prescaler settings, the System Clock Prescaler ensures that noglitches occur in the clock system and that no intermediate frequency is higher than neither theclock frequency corresponding to the previous setting, nor the clock frequency corresponding tothe new setting.
The ripple counter that implements the prescaler runs at the frequency of the undivided clock,which may be faster than the CPU’s clock frequency. Hence, it is not possible to determine thestate of the prescaler – even if it were readable, and the exact time it takes to switch from oneclock division to another cannot be exactly predicted. From the time the CLKPS values are writ-ten, it takes between T1 + T2 and T1 + 2 × T2 before the new clock frequency is active. In thisinterval, 2 active clock edges are produced. Here, T1 is the previous clock period, and T2 is theperiod corresponding to the new prescaler setting.
To avoid unintentional changes of clock frequency, a special write procedure must be followedto change the CLKPS bits:
1. Write the Clock Prescaler Change Enable (CLKPCE) bit to one and all other bits in CLKPR to zero.
2. Within four cycles, write the desired value to CLKPS while writing a zero to CLKPCE.
Interrupts must be disabled when changing prescaler setting to make sure the write procedure isnot interrupted.
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8.11 Register Description
8.11.1 OSCCAL – Oscillator Calibration Register
• Bits 7:0 – CAL7:0: Oscillator Calibration ValueThe Oscillator Calibration Register is used to trim the Calibrated Internal RC Oscillator toremove process variations from the oscillator frequency. A pre-programmed calibration value isautomatically written to this register during chip reset, giving the Factory calibrated frequency asspecified in Table 28-2 on page 332. The application software can write this register to changethe oscillator frequency. The oscillator can be calibrated to frequencies as specified in Table 28-2 on page 332. Calibration outside that range is not guaranteed.
Note that this oscillator is used to time EEPROM and Flash write accesses, and these writetimes will be affected accordingly. If the EEPROM or Flash are written, do not calibrate to morethan 8.8 MHz. Otherwise, the EEPROM or Flash write may fail.
The CAL7 bit determines the range of operation for the oscillator. Setting this bit to 0 gives thelowest frequency range, setting this bit to 1 gives the highest frequency range. The two fre-quency ranges are overlapping, in other words a setting of OSCCAL = 0x7F gives a higherfrequency than OSCCAL = 0x80.
The CAL6..0 bits are used to tune the frequency within the selected range. A setting of 0x00gives the lowest frequency in that range, and a setting of 0x7F gives the highest frequency in therange.
8.11.2 CLKPR – Clock Prescale Register
• Bit 7 – CLKPCE: Clock Prescaler Change EnableThe CLKPCE bit must be written to logic one to enable change of the CLKPS bits. The CLKPCEbit is only updated when the other bits in CLKPR are simultaneously written to zero. CLKPCE iscleared by hardware four cycles after it is written or when CLKPS bits are written. Rewriting theCLKPCE bit within this time-out period does neither extend the time-out period, nor clear theCLKPCE bit.
• Bits 3:0 – CLKPS3:0: Clock Prescaler Select Bits 3 - 0These bits define the division factor between the selected clock source and the internal systemclock. These bits can be written run-time to vary the clock frequency to suit the applicationrequirements. As the divider divides the master clock input to the MCU, the speed of all synchro-nous peripherals is reduced when a division factor is used. The division factors are given inTable 8-13 on page 39.
The CKDIV8 Fuse determines the initial value of the CLKPS bits. If CKDIV8 is unprogrammed,the CLKPS bits will be reset to “0000”. If CKDIV8 is programmed, CLKPS bits are reset to
Bit 7 6 5 4 3 2 1 0
(0x66) CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 OSCCAL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value Device Specific Calibration Value
Bit 7 6 5 4 3 2 1 0
(0x61) CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 CLKPR
Read/Write R/W R R R R/W R/W R/W R/W
Initial Value 0 0 0 0 See Bit Description
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“0011”, giving a division factor of 8 at start up. This feature should be used if the selected clocksource has a higher frequency than the maximum frequency of the device at the present operat-ing conditions. Note that any value can be written to the CLKPS bits regardless of the CKDIV8Fuse setting. The Application software must ensure that a sufficient division factor is chosen ifthe selected clock source has a higher frequency than the maximum frequency of the device atthe present operating conditions. The device is shipped with the CKDIV8 Fuse programmed.
Table 8-13. Clock Prescaler Select
CLKPS3 CLKPS2 CLKPS1 CLKPS0 Clock Division Factor
0 0 0 0 1
0 0 0 1 2
0 0 1 0 4
0 0 1 1 8
0 1 0 0 16
0 1 0 1 32
0 1 1 0 64
0 1 1 1 128
1 0 0 0 256
1 0 0 1 Reserved
1 0 1 0 Reserved
1 0 1 1 Reserved
1 1 0 0 Reserved
1 1 0 1 Reserved
1 1 1 0 Reserved
1 1 1 1 Reserved
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9. Power Management and Sleep Modes
Sleep modes enable the application to shut down unused modules in the MCU, thereby saving-power. The AVR provides various sleep modes allowing the user to tailor the powerconsumption to the application’s requirements.
9.1 Sleep Modes
Figure 8-1 on page 30 presents the different clock systems in the ATmega169P, and their distri-bution. The figure is helpful in selecting an appropriate sleep mode. Table 9-1 shows thedifferent sleep modes and their wake up sources.
Notes: 1. Only recommended with external crystal or resonator selected as clock source.2. If either LCD controller or Timer/Counter2 is running in asynchronous mode.3. For INT0, only level interrupt.
To enter any of the sleep modes, the SE bit in SMCR must be written to logic one and a SLEEPinstruction must be executed. The SM2, SM1, and SM0 bits in the SMCR Register select whichsleep mode will be activated by the SLEEP instruction. See Table 9-2 on page 45 for asummary.
If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The MCUis then halted for four cycles in addition to the start-up time, executes the interrupt routine, andresumes execution from the instruction following SLEEP. The contents of the Register File andSRAM are unaltered when the device wakes up from sleep. If a reset occurs during sleep mode,the MCU wakes up and executes from the Reset Vector.
Table 9-1. Active Clock Domains and Wake-up Sources in the Different Sleep Modes.
Active Clock Domains Oscillators Wake-up Sources
Sleep Mode cl
k CP
U
clk F
LA
SH
clk I
O
clk A
DC
clk A
SY
Mai
n C
lock
S
ou
rce
En
able
d
Tim
er O
scE
nab
led
INT
0 an
d
Pin
Ch
ang
e
US
I Sta
rtC
on
dit
ion
LC
DC
on
tro
ller
Tim
er2
SP
M/ E
EP
RO
MR
eady
AD
C
Oth
erI/O
Idle X X X X X(2) X X X X X X X
ADC NRM X X X X(2) X(3) X X(2) X(2) X X
Power-down
X(3) X
Power-save
X X X(3) X X X
Standby(1) X X(3) X
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9.2 Idle Mode
When the SM2..0 bits are written to 000, the SLEEP instruction makes the MCU enter Idlemode, stopping the CPU but allowing LCD controller, the SPI, USART, Analog Comparator,ADC, USI, Timer/Counters, Watchdog, and the interrupt system to continue operating. Thissleep mode basically halts clkCPU and clkFLASH, while allowing the other clocks to run.
Idle mode enables the MCU to wake up from external triggered interrupts as well as internalones like the Timer Overflow and USART Transmit Complete interrupts. If wake-up from theAnalog Comparator interrupt is not required, the Analog Comparator can be powered down bysetting the ACD bit in the Analog Comparator Control and Status Register – ACSR. This willreduce power consumption in Idle mode. If the ADC is enabled, a conversion starts automati-cally when this mode is entered.
9.3 ADC Noise Reduction Mode
When the SM2..0 bits are written to 001, the SLEEP instruction makes the MCU enter ADCNoise Reduction mode, stopping the CPU but allowing the ADC, the external interrupts, the USIstart condition detection, Timer/Counter2, LCD Controller, and the Watchdog to continue operat-ing (if enabled). This sleep mode basically halts clkI/O, clkCPU, and clkFLASH, while allowing theother clocks to run.
This improves the noise environment for the ADC, enabling higher resolution measurements. Ifthe ADC is enabled, a conversion starts automatically when this mode is entered. Apart form theADC Conversion Complete interrupt, only an External Reset, a Watchdog Reset, a Brown-outReset, an LCD controller interrupt, USI start condition interrupt, a Timer/Counter2 interrupt, anSPM/EEPROM ready interrupt, an external level interrupt on INT0 or a pin change interrupt canwake up the MCU from ADC Noise Reduction mode.
9.4 Power-down Mode
When the SM2..0 bits are written to 010, the SLEEP instruction makes the MCU enter Power-down mode. In this mode, the external Oscillator is stopped, while the external interrupts, theUSI start condition detection, and the Watchdog continue operating (if enabled). Only an Exter-nal Reset, a Watchdog Reset, a Brown-out Reset, USI start condition interrupt, an external levelinterrupt on INT0, or a pin change interrupt can wake up the MCU. This sleep mode basicallyhalts all generated clocks, allowing operation of asynchronous modules only.
Note that if a level triggered interrupt is used for wake-up from Power-down mode, the changedlevel must be held for some time to wake up the MCU. Refer to ”External Interrupts” on page 61for details.
When waking up from Power-down mode, there is a delay from the wake-up condition occursuntil the wake-up becomes effective. This allows the clock to restart and become stable afterhaving been stopped. The wake-up period is defined by the same CKSEL Fuses that define theReset Time-out period, as described in ”Clock Sources” on page 31.
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9.5 Power-save Mode
When the SM2..0 bits are written to 011, the SLEEP instruction makes the MCU enter Power-save mode. This mode is identical to Power-down, with one exception:
If Timer/Counter2 and/or the LCD controller are enabled, they will keep running during sleep.The device can wake up from either Timer Overflow or Output Compare event fromTimer/Counter2 if the corresponding Timer/Counter2 interrupt enable bits are set in TIMSK2,and the Global Interrupt Enable bit in SREG is set. It can also wake up from an LCD controllerinterrupt.
If neither Timer/Counter2 nor the LCD controller is running, Power-down mode is recommendedinstead of Power-save mode.
The LCD controller and Timer/Counter2 can be clocked both synchronously and asynchronouslyin Power-save mode. The clock source for the two modules can be selected independent ofeach other. If neither the LCD controller nor the Timer/Counter2 is using the asynchronousclock, the Timer/Counter Oscillator is stopped during sleep. If neither the LCD controller nor theTimer/Counter2 is using the synchronous clock, the clock source is stopped during sleep. Notethat even if the synchronous clock is running in Power-save, this clock is only available for theLCD controller and Timer/Counter2.
9.6 Standby Mode
When the SM2..0 bits are 110 and an external crystal/resonator clock option is selected, theSLEEP instruction makes the MCU enter Standby mode. This mode is identical to Power-downwith the exception that the Oscillator is kept running. From Standby mode, the device wakes upin six clock cycles.
9.7 Power Reduction Register
The Power Reduction Register (PRR), see ”PRR – Power Reduction Register” on page 45, pro-vides a method to stop the clock to individual peripherals to reduce power consumption. Thecurrent state of the peripheral is frozen and the I/O registers can not be read or written.Resources used by the peripheral when stopping the clock will remain occupied, hence theperipheral should in most cases be disabled before stopping the clock. Waking up a module,which is done by clearing the bit in PRR, puts the module in the same state as before shutdown.
Module shutdown can be used in Idle mode and Active mode to significantly reduce the overallpower consumption. See ”Supply Current of I/O modules” on page 343 for examples. In all othersleep modes, the clock is already stopped.
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9.8 Minimizing Power Consumption
There are several issues to consider when trying to minimize the power consumption in an AVRcontrolled system. In general, sleep modes should be used as much as possible, and the sleepmode should be selected so that as few as possible of the device’s functions are operating. Allfunctions not needed should be disabled. In particular, the following modules may need specialconsideration when trying to achieve the lowest possible power consumption.
9.8.1 Analog to Digital Converter
If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should be dis-abled before entering any sleep mode. When the ADC is turned off and on again, the nextconversion will be an extended conversion. Refer to ”ADC - Analog to Digital Converter” on page216 for details on ADC operation.
9.8.2 Analog Comparator
When entering Idle mode, the Analog Comparator should be disabled if not used. When enteringADC Noise Reduction mode, the Analog Comparator should be disabled. In other sleep modes,the Analog Comparator is automatically disabled. However, if the Analog Comparator is set upto use the Internal Voltage Reference as input, the Analog Comparator should be disabled in allsleep modes. Otherwise, the Internal Voltage Reference will be enabled, independent of sleepmode. Refer to ”AC - Analog Comparator” on page 212 for details on how to configure the Ana-log Comparator.
9.8.3 Brown-out Detector
If the Brown-out Detector is not needed by the application, this module should be turned off. Ifthe Brown-out Detector is enabled by the BODLEVEL Fuses, it will be enabled in all sleepmodes, and hence, always consume power. In the deeper sleep modes, this will contribute sig-nificantly to the total current consumption. Refer to ”Brown-out Detection” on page 50 for detailson how to configure the Brown-out Detector.
9.8.4 Internal Voltage Reference
The Internal Voltage Reference will be enabled when needed by the Brown-out Detection, theAnalog Comparator or the ADC. If these modules are disabled as described in the sectionsabove, the internal voltage reference will be disabled and it will not be consuming power. Whenturned on again, the user must allow the reference to start up before the output is used. If thereference is kept on in sleep mode, the output can be used immediately. Refer to ”Internal Volt-age Reference” on page 51 for details on the start-up time.
9.8.5 Watchdog Timer
If the Watchdog Timer is not needed in the application, the module should be turned off. If theWatchdog Timer is enabled, it will be enabled in all sleep modes, and hence, always consumepower. In the deeper sleep modes, this will contribute significantly to the total current consump-tion. Refer to ”Watchdog Timer” on page 51 for details on how to configure the Watchdog Timer.
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9.8.6 Port Pins
When entering a sleep mode, all port pins should be configured to use minimum power. Themost important is then to ensure that no pins drive resistive loads. In sleep modes where boththe I/O clock (clkI/O) and the ADC clock (clkADC) are stopped, the input buffers of the device willbe disabled. This ensures that no power is consumed by the input logic when not needed. Insome cases, the input logic is needed for detecting wake-up conditions, and it will then beenabled. Refer to the section ”Digital Input Enable and Sleep Modes” on page 69 for details onwhich pins are enabled. If the input buffer is enabled and the input signal is left floating or havean analog signal level close to VCC/2, the input buffer will use excessive power.
For analog input pins, the digital input buffer should be disabled at all times. An analog signallevel close to VCC/2 on an input pin can cause significant current even in active mode. Digitalinput buffers can be disabled by writing to the Digital Input Disable Registers (DIDR1 andDIDR0). Refer to ”DIDR1 – Digital Input Disable Register 1” on page 215 and ”DIDR0 – DigitalInput Disable Register 0” on page 233 for details.
9.8.7 JTAG Interface and On-chip Debug System
If the On-chip debug system is enabled by the OCDEN Fuse and the chip enter Power down orPower save sleep mode, the main clock source remains enabled. In these sleep modes, this willcontribute significantly to the total current consumption. There are three alternative ways toavoid this:
• Disable OCDEN Fuse.
• Disable JTAGEN Fuse.
• Write one to the JTD bit in MCUCSR.
The TDO pin is left floating when the JTAG interface is enabled while the JTAG TAP controller isnot shifting data. If the hardware connected to the TDO pin does not pull up the logic level,power consumption will increase. Note that the TDI pin for the next device in the scan chain con-tains a pull-up that avoids this problem. Writing the JTD bit in the MCUCSR register to one orleaving the JTAG fuse unprogrammed disables the JTAG interface.
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9.9 Register Description
9.9.1 SMCR – Sleep Mode Control Register
The Sleep Mode Control Register contains control bits for power management.
• Bits 3, 2, 1 – SM2:0: Sleep Mode Select Bits 2, 1, and 0These bits select between the five available sleep modes as shown in Table 9-2.
Note: 1. Standby mode is only recommended for use with external crystals or resonators.
• Bit 1 – SE: Sleep EnableThe SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEPinstruction is executed. To avoid the MCU entering the sleep mode unless it is the programmer’spurpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution ofthe SLEEP instruction and to clear it immediately after waking up.
9.9.2 PRR – Power Reduction Register
• Bit 7:5 - Res: Reserved bitsThese bits are reserved and will always read as zero.
• Bit 4 - PRLCD: Power Reduction LCDWriting logic one to this bit shuts down the LCD controller. The LCD controller must be disabledand the display discharged before shut down. See ”Disabling the LCD” on page 244 for detailson how to disable the LCD controller.
Bit 7 6 5 4 3 2 1 0
0x33 (0x53) – – – – SM2 SM1 SM0 SE SMCR
Read/Write R R R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 9-2. Sleep Mode Select
SM2 SM1 SM0 Sleep Mode
0 0 0 Idle
0 0 1 ADC Noise Reduction
0 1 0 Power-down
0 1 1 Power-save
1 0 0 Reserved
1 0 1 Reserved
1 1 0 Standby(1)
1 1 1 Reserved
Bit 7 6 5 4 3 2 1 0
(0x64) – – – PRLCD PRTIM1 PRSPI PRUSART0 PRADC PRR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 3 - PRTIM1: Power Reduction Timer/Counter1Writing a logic one to this bit shuts down the Timer/Counter1 module. When the Timer/Counter1is enabled, operation will continue like before the shutdown.
• Bit 2 - PRSPI: Power Reduction Serial Peripheral InterfaceWriting a logic one to this bit shuts down the Serial Peripheral Interface by stopping the clock tothe module. When waking up the SPI again, the SPI should be re initialized to ensure properoperation.
• Bit 1 - PRUSART0: Power Reduction USART0Writing a logic one to this bit shuts down the USART by stopping the clock to the module. Whenwaking up the USART again, the USART should be re initialized to ensure proper operation.
• Bit 0 - PRADC: Power Reduction ADCWriting a logic one to this bit shuts down the ADC. The ADC must be disabled before shut down.The analog comparator cannot use the ADC input MUX when the ADC is shut down.
Note: The Analog Comparator is disabled using the ACD-bit in the ”ACSR – Analog Comparator Control and Status Register” on page 214.
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10. System Control and Reset
10.1 Resetting the AVR
During reset, all I/O Registers are set to their initial values, and the program starts executionfrom the Reset Vector. The instruction placed at the Reset Vector must be a JMP – AbsoluteJump – instruction to the reset handling routine. If the program never enables an interruptsource, the Interrupt Vectors are not used, and regular program code can be placed at theselocations. This is also the case if the Reset Vector is in the Application section while the InterruptVectors are in the Boot section or vice versa. The circuit diagram in Figure 10-1 on page 48shows the reset logic. Table 28-4 on page 333 defines the electrical parameters of the resetcircuitry.
The I/O ports of the AVR are immediately reset to their initial state when a reset source goesactive. This does not require any clock source to be running.
After all reset sources have gone inactive, a delay counter is invoked, stretching the internalreset. This allows the power to reach a stable level before normal operation starts. The time-outperiod of the delay counter is defined by the user through the SUT and CKSEL Fuses. The dif-ferent selections for the delay period are presented in ”Clock Sources” on page 31.
10.2 Reset Sources
The ATmega169P has five sources of reset:
• Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset threshold (VPOT).
• External Reset. The MCU is reset when a low level is present on the RESET pin for longer than the minimum pulse length.
• Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the Watchdog is enabled.
• Brown-out Reset. The MCU is reset when the supply voltage VCC is below the Brown-out Reset threshold (VBOT) and the Brown-out Detector is enabled.
• JTAG AVR Reset. The MCU is reset as long as there is a logic one in the Reset Register, one of the scan chains of the JTAG system. Refer to the section ”IEEE 1149.1 (JTAG) Boundary-scan” on page 259 for details.
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Figure 10-1. Reset Logic
10.2.1 Power-on Reset
A Power-on Reset (POR) pulse is generated by an On-chip detection circuit. The detection levelis defined in ”System and Reset Characteristics” on page 333. The POR is activated wheneverVCC is below the detection level. The POR circuit can be used to trigger the start-up Reset, aswell as to detect a failure in supply voltage.
A Power-on Reset (POR) circuit ensures that the device is reset from Power-on. Reaching thePower-on Reset threshold voltage invokes the delay counter, which determines how long thedevice is kept in RESET after VCC rise. The RESET signal is activated again, without any delay,when VCC decreases below the detection level.
Figure 10-2. MCU Start-up, RESET Tied to VCC
MCU StatusRegister (MCUSR)
Brown-outReset CircuitBODLEVEL [2..0]
Delay Counters
CKSEL[3:0]
CKTIMEOUT
WD
RF
BO
RF
EX
TR
F
PO
RF
DATA BUS
ClockGenerator
SPIKEFILTER
Pull-up Resistor
JTR
F
JTAG ResetRegister
WatchdogOscillator
SUT[1:0]
Power-on ResetCircuit
V
RESET
TIME-OUT
INTERNALRESET
tTOUT
VPOT
VRST
CC
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Figure 10-3. MCU Start-up, RESET Extended Externally
10.2.2 External Reset
An External Reset is generated by a low level on the RESET pin. Reset pulses longer than theminimum pulse width (see ”System and Reset Characteristics” on page 333) will generate areset, even if the clock is not running. Shorter pulses are not guaranteed to generate a reset.When the applied signal reaches the Reset Threshold Voltage – VRST – on its positive edge, thedelay counter starts the MCU after the Time-out period – tTOUT – has expired.
Figure 10-4. External Reset During Operation
RESET
TIME-OUT
INTERNALRESET
tTOUT
VPOT
VRST
VCC
CC
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10.2.3 Brown-out Detection
ATmega169P has an On-chip Brown-out Detection (BOD) circuit for monitoring the VCC levelduring operation by comparing it to a fixed trigger level. The trigger level for the BOD can beselected by the BODLEVEL Fuses. The trigger level has a hysteresis to ensure spike freeBrown-out Detection. The hysteresis on the detection level should be interpreted as VBOT+ =VBOT + VHYST/2 and VBOT- = VBOT - VHYST/2.When the BOD is enabled, and VCC decreases to avalue below the trigger level (VBOT- in Figure 10-5), the Brown-out Reset is immediately acti-vated. When VCC increases above the trigger level (VBOT+ in Figure 10-5), the delay counterstarts the MCU after the Time-out period tTOUT has expired.
The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level for lon-ger than tBOD given in ”System and Reset Characteristics” on page 333.
Figure 10-5. Brown-out Reset During Operation
10.2.4 Watchdog Reset
When the Watchdog times out, it will generate a short reset pulse of one CK cycle duration. Onthe falling edge of this pulse, the delay timer starts counting the Time-out period tTOUT. Refer to”Watchdog Timer” on page 51 for details on operation of the Watchdog Timer.
Figure 10-6. Watchdog Reset During Operation
VCC
RESET
TIME-OUT
INTERNALRESET
VBOT-VBOT+
tTOUT
CK
CC
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10.3 Internal Voltage Reference
ATmega169P features an internal bandgap reference. This reference is used for Brown-outDetection, and it can be used as an input to the Analog Comparator or the ADC.
10.3.1 Voltage Reference Enable Signals and Start-up Time
The voltage reference has a start-up time that may influence the way it should be used. Thestart-up time is given in ”System and Reset Characteristics” on page 333. To save power, thereference is not always turned on. The reference is on during the following situations:
1. When the BOD is enabled (by programming the BODLEVEL [2..0] Fuse).
2. When the bandgap reference is connected to the Analog Comparator (by setting the ACBG bit in ACSR).
3. When the ADC is enabled.
Thus, when the BOD is not enabled, after setting the ACBG bit or enabling the ADC, the usermust always allow the reference to start up before the output from the Analog Comparator orADC is used. To reduce power consumption in Power-down mode, the user can avoid the threeconditions above to ensure that the reference is turned off before entering Power-down mode.
10.4 Watchdog Timer
The Watchdog Timer is clocked from a separate On-chip Oscillator which runs at 1 MHz. This isthe typical value at VCC = 5V. See characterization data for typical values at other VCC levels. Bycontrolling the Watchdog Timer prescaler, the Watchdog Reset interval can be adjusted asshown in Table 10-2 on page 55. The WDR – Watchdog Reset – instruction resets the Watch-dog Timer. The Watchdog Timer is also reset when it is disabled and when a Chip Reset occurs.Eight different clock cycle periods can be selected to determine the reset period. If the resetperiod expires without another Watchdog Reset, the ATmega169P resets and executes from theReset Vector. For timing details on the Watchdog Reset, refer to Table 10-2 on page 55.
To prevent unintentional disabling of the Watchdog or unintentional change of time-out period,two different safety levels are selected by the fuse WDTON as shown in Table 10-1 Refer to”Timed Sequences for Changing the Configuration of the Watchdog Timer” on page 52 fordetails.
Table 10-1. WDT Configuration as a Function of the Fuse Settings of WDTON
WDTONSafety Level
WDT Initial State
How to Disable the WDT
How to Change Time-out
Unprogrammed 1 Disabled Timed sequence Timed sequence
Programmed 2 Enabled Always enabled Timed sequence
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Figure 10-7. Watchdog Timer
10.4.1 Timed Sequences for Changing the Configuration of the Watchdog Timer
The sequence for changing configuration differs slightly between the two safety levels. Separateprocedures are described for each level.
10.4.1.1 Safety Level 1
In this mode, the Watchdog Timer is initially disabled, but can be enabled by writing the WDE bitto 1 without any restriction. A timed sequence is needed when changing the Watchdog Time-outperiod or disabling an enabled Watchdog Timer. To disable an enabled Watchdog Timer, and/orchanging the Watchdog Time-out, the following procedure must be followed:
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written to WDE regardless of the previous value of the WDE bit.
2. Within the next four clock cycles, in the same operation, write the WDE and WDP bits as desired, but with the WDCE bit cleared.
10.4.1.2 Safety Level 2
In this mode, the Watchdog Timer is always enabled, and the WDE bit will always read as one. Atimed sequence is needed when changing the Watchdog Time-out period. To change theWatchdog Time-out, the following procedure must be followed:
1. In the same operation, write a logical one to WDCE and WDE. Even though the WDE always is set, the WDE must be written to one to start the timed sequence.
Within the next four clock cycles, in the same operation, write the WDP bits as desired, but withthe WDCE bit cleared. The value written to the WDE bit is irrelevant.
WATCHDOGOSCILLATOR
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Note: 1. See ”About Code Examples” on page 10.
Assembly Code Example(1)
WDT_off:
; Reset WDT
wdr
; Write logical one to WDCE and WDE
in r16, WDTCR
ori r16, (1<<WDCE)|(1<<WDE)
out WDTCR, r16
; Turn off WDT
ldi r16, (0<<WDE)
out WDTCR, r16
ret
C Code Example(1)
void WDT_off(void)
{
/* Reset WDT */
__watchdog_reset();
/* Write logical one to WDCE and WDE */
WDTCR |= (1<<WDCE) | (1<<WDE);
/* Turn off WDT */
WDTCR = 0x00;
}
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10.5 Register Description
10.5.1 MCUSR – MCU Status Register
The MCU Status Register provides information on which reset source caused an MCU reset.
• Bit 4 – JTRF: JTAG Reset FlagThis bit is set if a reset is being caused by a logic one in the JTAG Reset Register selected bythe JTAG instruction AVR_RESET. This bit is reset by a Power-on Reset, or by writing a logiczero to the flag.
• Bit 3 – WDRF: Watchdog Reset FlagThis bit is set if a Watchdog Reset occurs. The bit is reset by a Power-on Reset, or by writing alogic zero to the flag.
• Bit 2 – BORF: Brown-out Reset FlagThis bit is set if a Brown-out Reset occurs. The bit is reset by a Power-on Reset, or by writing alogic zero to the flag.
• Bit 1 – EXTRF: External Reset FlagThis bit is set if an External Reset occurs. The bit is reset by a Power-on Reset, or by writing alogic zero to the flag.
• Bit 0 – PORF: Power-on Reset FlagThis bit is set if a Power-on Reset occurs. The bit is reset only by writing a logic zero to the flag.
To make use of the Reset Flags to identify a reset condition, the user should read and thenReset the MCUSR as early as possible in the program. If the register is cleared before anotherreset occurs, the source of the reset can be found by examining the Reset Flags.
10.5.2 WDTCR – Watchdog Timer Control Register
• Bits 7:5 – Res: Reserved BitsThese bits are reserved and will always read as zero.
• Bit 4 – WDCE: Watchdog Change EnableThis bit must be set when the WDE bit is written to logic zero. Otherwise, the Watchdog will notbe disabled. Once written to one, hardware will clear this bit after four clock cycles. Refer to thedescription of the WDE bit for a Watchdog disable procedure. This bit must also be set whenchanging the prescaler bits. See ”Timed Sequences for Changing the Configuration of theWatchdog Timer” on page 52.
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) – – – JTRF WDRF BORF EXTRF PORF MCUSR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 See Bit Description
Bit 7 6 5 4 3 2 1 0
(0x60) – – – WDCE WDE WDP2 WDP1 WDP0 WDTCR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 3 – WDE: Watchdog EnableWhen the WDE is written to logic one, the Watchdog Timer is enabled, and if the WDE is writtento logic zero, the Watchdog Timer function is disabled. WDE can only be cleared if the WDCE bithas logic level one. To disable an enabled Watchdog Timer, the following procedure must befollowed:
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written to WDE even though it is set to one before the disable operation starts.
2. Within the next four clock cycles, write a logic 0 to WDE. This disables the Watchdog.
In safety level 2, it is not possible to disable the Watchdog Timer, even with the algorithmdescribed above. See ”Timed Sequences for Changing the Configuration of the WatchdogTimer” on page 52.
• Bits 2:0 – WDP2, WDP1, WDP0: Watchdog Timer Prescaler 2, 1, and 0The WDP2, WDP1, and WDP0 bits determine the Watchdog Timer prescaling when the Watch-dog Timer is enabled. The different prescaling values and their corresponding Timeout Periodsare shown in Table 10-2.
Note: Also see Figure 29-54 on page 366.
The following code example shows one assembly and one C function for turning off the WDT.The example assumes that interrupts are controlled (for example by disabling interrupts globally)so that no interrupts will occur during execution of these functions.
Table 10-2. Watchdog Timer Prescale Select
WDP2 WDP1 WDP0Number of WDT Oscillator Cycles
Typical Time-out at VCC = 3.0V
Typical Time-out at VCC = 5.0V
0 0 0 16K cycles 15.4 ms 14.7 ms
0 0 1 32K cycles 30.8 ms 29.3 ms
0 1 0 64K cycles 61.6 ms 58.7 ms
0 1 1 128K cycles 0.12 s 0.12 s
1 0 0 256K cycles 0.25 s 0.23 s
1 0 1 512K cycles 0.49 s 0.47 s
1 1 0 1,024K cycles 1.0 s 0.9 s
1 1 1 2,048K cycles 2.0 s 1.9 s
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11. Interrupts
This section describes the specifics of the interrupt handling as performed in ATmega169P. Fora general explanation of the AVR interrupt handling, refer to ”Reset and Interrupt Handling” onpage 15.
11.1 Interrupt Vectors in ATmega169P
Notes: 1. When the BOOTRST Fuse is programmed, the device will jump to the Boot Loader address at reset, see ”Boot Loader Support – Read-While-Write Self-Programming” on page 280.
2. When the IVSEL bit in MCUCR is set, Interrupt Vectors will be moved to the start of the Boot Flash Section. The address of each Interrupt Vector will then be the address in this table added to the start address of the Boot Flash Section.
Table 11-1. Reset and Interrupt Vectors
VectorNo.
ProgramAddress(2) Source Interrupt Definition
1 0x0000(1) RESETExternal Pin, Power-on Reset, Brown-out Reset, Watchdog Reset, and JTAG AVR Reset
2 0x0002 INT0 External Interrupt Request 0
3 0x0004 PCINT0 Pin Change Interrupt Request 0
4 0x0006 PCINT1 Pin Change Interrupt Request 1
5 0x0008 TIMER2 COMP Timer/Counter2 Compare Match
6 0x000A TIMER2 OVF Timer/Counter2 Overflow
7 0x000C TIMER1 CAPT Timer/Counter1 Capture Event
8 0x000E TIMER1 COMPA Timer/Counter1 Compare Match A
9 0x0010 TIMER1 COMPB Timer/Counter1 Compare Match B
10 0x0012 TIMER1 OVF Timer/Counter1 Overflow
11 0x0014 TIMER0 COMP Timer/Counter0 Compare Match
12 0x0016 TIMER0 OVF Timer/Counter0 Overflow
13 0x0018 SPI, STC SPI Serial Transfer Complete
14 0x001A USART, RX USART0, Rx Complete
15 0x001C USART, UDREn USART0 Data Register Empty
16 0x001E USART, TX USART0, Tx Complete
17 0x0020 USI START USI Start Condition
18 0x0022 USI OVERFLOW USI Overflow
19 0x0024 ANALOG COMP Analog Comparator
20 0x0026 ADC ADC Conversion Complete
21 0x0028 EE READY EEPROM Ready
22 0x002A SPM READY Store Program Memory Ready
23 0x002C LCD LCD Start of Frame
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Table 11-2 on page 57 shows reset and Interrupt Vectors placement for the various combina-tions of BOOTRST and IVSEL settings. If the program never enables an interrupt source, theInterrupt Vectors are not used, and regular program code can be placed at these locations. Thisis also the case if the Reset Vector is in the Application section while the Interrupt Vectors are inthe Boot section or vice versa.
Note: 1. The Boot Reset Address is shown in Table 26-6 on page 292. For the BOOTRST Fuse “1” means unprogrammed while “0” means programmed.
The most typical and general program setup for the Reset and Interrupt Vector Addresses inATmega169P is:
Address Labels Code Comments
0x0000 jmp RESET ; Reset Handler
0x0002 jmp EXT_INT0 ; IRQ0 Handler
0x0004 jmp PCINT0 ; PCINT0 Handler
0x0006 jmp PCINT1 ; PCINT0 Handler
0x0008 jmp TIM2_COMP ; Timer2 Compare Handler
0x000A jmp TIM2_OVF ; Timer2 Overflow Handler
0x000C jmp TIM1_CAPT ; Timer1 Capture Handler
0x000E jmp TIM1_COMPA ; Timer1 CompareA Handler
0x0010 jmp TIM1_COMPB ; Timer1 CompareB Handler
0x0012 jmp TIM1_OVF ; Timer1 Overflow Handler
0x0014 jmp TIM0_COMP ; Timer0 Compare Handler
0x0016 jmp TIM0_OVF ; Timer0 Overflow Handler
0x0018 jmp SPI_STC ; SPI Transfer Complete Handler
0x001A jmp USART_RXCn ; USART0 RX Complete Handler
0x001C jmp USART_DRE ; USART0,UDRn Empty Handler
0x001E jmp USART_TXCn ; USART0 TX Complete Handler
0x0020 jmp USI_STRT ; USI Start Condition Handler
0x0022 jmp USI_OVFL ; USI Overflow Handler
0x0024 jmp ANA_COMP ; Analog Comparator Handler
0x0026 jmp ADC ; ADC Conversion Complete Handler
0x0028 jmp EE_RDY ; EEPROM Ready Handler
0x002A jmp SPM_RDY ; SPM Ready Handler
0x002C jmp LCD_SOF ; LCD Start of Frame Handler
;
0x002E RESET: ldi r16, high(RAMEND); Main program start
0x002F out SPH,r16 Set Stack Pointer to top of RAM
0x0030 ldi r16, low(RAMEND)
Table 11-2. Reset and Interrupt Vectors Placement(1)
BOOTRST IVSEL Reset Address Interrupt Vectors Start Address
1 0 0x0000 0x0002
1 1 0x0000 Boot Reset Address + 0x0002
0 0 Boot Reset Address 0x0002
0 1 Boot Reset Address Boot Reset Address + 0x0002
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0x0031 out SPL,r160x0032 sei ; Enable interrupts
0x0033 <instr> xxx
... ... ... ...
When the BOOTRST Fuse is unprogrammed, the Boot section size set to 2 Kbytes and theIVSEL bit in the MCUCR Register is set before any interrupts are enabled, the most typical andgeneral program setup for the Reset and Interrupt Vector Addresses is:
Address Labels Code Comments
0x0000 RESET: ldi r16,high(RAMEND); Main program start
0x0001 out SPH,r16 ; Set Stack Pointer to top of RAM
0x0002 ldi r16,low(RAMEND)
0x0003 out SPL,r160x0004 sei ; Enable interrupts
0x0005 <instr> xxx
;
.org 0x1C02
0x1C02 jmp EXT_INT0 ; IRQ0 Handler
0x1C04 jmp PCINT0 ; PCINT0 Handler
... ... ... ;
0x1C2C jmp SPM_RDY ; Store Program Memory Ready Handler
When the BOOTRST Fuse is programmed and the Boot section size set to 2 Kbytes, the mosttypical and general program setup for the Reset and Interrupt Vector Addresses is:
Address Labels Code Comments
.org 0x0002
0x0002 jmp EXT_INT0 ; IRQ0 Handler
0x0004 jmp PCINT0 ; PCINT0 Handler
... ... ... ;
0x002C jmp SPM_RDY ; Store Program Memory Ready Handler
;
.org 0x1C000x1C00 RESET: ldi r16,high(RAMEND); Main program start
0x1C01 out SPH,r16 ; Set Stack Pointer to top of RAM
0x1C02 ldi r16,low(RAMEND)
0x1C03 out SPL,r160x1C04 sei ; Enable interrupts
0x1C05 <instr> xxx
When the BOOTRST Fuse is programmed, the Boot section size set to 2 Kbytes and the IVSELbit in the MCUCR Register is set before any interrupts are enabled, the most typical and generalprogram setup for the Reset and Interrupt Vector Addresses is:
Address Labels Code Comments
;
.org 0x1C000x1C00 jmp RESET ; Reset handler0x1C02 jmp EXT_INT0 ; IRQ0 Handler
0x1C04 jmp PCINT0 ; PCINT0 Handler
... ... ... ;
0x1C2C jmp SPM_RDY ; Store Program Memory Ready Handler
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;
0x1C2E RESET: ldi r16,high(RAMEND); Main program start
0x1C2F out SPH,r16 ; Set Stack Pointer to top of RAM
0x1C30 ldi r16,low(RAMEND)
0x1C31 out SPL,r160x1C32 sei ; Enable interrupts
0x1C33 <instr> xxx
11.2 Moving Interrupts Between Application and Boot Space
The General Interrupt Control Register controls the placement of the Interrupt Vector table, see”MCUCR – MCU Control Register” on page 60.
To avoid unintentional changes of Interrupt Vector tables, a special write procedure must be fol-lowed to change the IVSEL bit:
a. Write the Interrupt Vector Change Enable (IVCE) bit to one.
b. Within four cycles, write the desired value to IVSEL while writing a zero to IVCE.
Interrupts will automatically be disabled while this sequence is executed. Interrupts are disabledin the cycle IVCE is set, and they remain disabled until after the instruction following the write toIVSEL. If IVSEL is not written, interrupts remain disabled for four cycles. The I-bit in the StatusRegister is unaffected by the automatic disabling.
Note: If Interrupt Vectors are placed in the Boot Loader section and Boot Lock bit BLB02 is programmed, interrupts are disabled while executing from the Application section. If Interrupt Vectors are placed in the Application section and Boot Lock bit BLB12 is programed, interrupts are disabled while executing from the Boot Loader section. Refer to the section ”Boot Loader Support – Read-While-Write Self-Programming” on page 280 for details on Boot Lock bits.
The following example shows how interrupts are moved.
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11.2.1 MCUCR – MCU Control Register
• Bit 1 – IVSEL: Interrupt Vector SelectWhen the IVSEL bit is cleared (zero), the Interrupt Vectors are placed at the start of the Flashmemory. When this bit is set (one), the Interrupt Vectors are moved to the beginning of the BootLoader section of the Flash. The actual address of the start of the Boot Flash Section is deter-mined by the BOOTSZ Fuses. Refer to the section ”Boot Loader Support – Read-While-WriteSelf-Programming” on page 280 for details.
• Bit 0 – IVCE: Interrupt Vector Change EnableThe IVCE bit must be written to logic one to enable change of the IVSEL bit. IVCE is cleared byhardware four cycles after it is written or when IVSEL is written. Setting the IVCE bit will disableinterrupts, as explained in the description in ”Moving Interrupts Between Application and BootSpace” on page 59. See Code Example.
Assembly Code Example
Move_interrupts:
; Get MCUCR
in r16, MCUCR
mov r17, r16
; Enable change of Interrupt Vectors
ori r16, (1<<IVCE)
out MCUCR, r16
; Move interrupts to Boot Flash section
ori r17, (1<<IVSEL)
out MCUCR, r17
ret
C Code Example
void Move_interrupts(void)
{
uchar temp;
/* Get MCUCR*/
temp = MCUCR;
/* Enable change of Interrupt Vectors */
MCUCR = temp | (1<<IVCE);
/* Move interrupts to Boot Flash section
*/ MCUCR = temp | (1<<IVSEL);
}
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) JTD - - PUD – – IVSEL IVCE MCUCR
Read/Write R/W R R R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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12. External Interrupts
The External Interrupts are triggered by the INT0 pin or any of the PCINT15..0 pins. Observethat, if enabled, the interrupts will trigger even if the INT0 or PCINT15..0 pins are configured asoutputs. This feature provides a way of generating a software interrupt. The pin change interruptPCI1 will trigger if any enabled PCINT15..8 pin toggles. Pin change interrupts PCI0 will trigger ifany enabled PCINT7..0 pin toggles. The PCMSK1 and PCMSK0 Registers control which pinscontribute to the pin change interrupts. Pin change interrupts on PCINT15..0 are detected asyn-chronously. This implies that these interrupts can be used for waking the part also from sleepmodes other than Idle mode.
The INT0 interrupts can be triggered by a falling or rising edge or a low level. This is set up asindicated in the specification for the External Interrupt Control Register A – EICRA. When theINT0 interrupt is enabled and is configured as level triggered, the interrupt will trigger as long asthe pin is held low. Note that recognition of falling or rising edge interrupts on INT0 requires thepresence of an I/O clock, described in ”Clock Systems and their Distribution” on page 30. Lowlevel interrupt on INT0 is detected asynchronously. This implies that this interrupt can be usedfor waking the part also from sleep modes other than Idle mode. The I/O clock is halted in allsleep modes except Idle mode.
Note that if a level triggered interrupt is used for wake-up from Power-down, the required levelmust be held long enough for the MCU to complete the wake-up to trigger the level interrupt. Ifthe level disappears before the end of the Start-up Time, the MCU will still wake up, but no inter-rupt will be generated. The start-up time is defined by the SUT and CKSEL Fuses as describedin ”System Clock and Clock Options” on page 30.
12.1 Pin Change Interrupt Timing
An example of timing of a pin change interrupt is shown in Figure 12-1.
Figure 12-1. Pin Change Interrupt
clk
PCINT(n)
pin_lat
pin_sync
pcint_in_(n)
pcint_syn
pcint_setflag
PCIF
PCINT(0)
pin_syncpcint_syn
pin_latD Q
LE
pcint_setflagPCIF
clk
clkPCINT(0) in PCMSK(x)
pcint_in_(0) 0
x
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12.2 Register Description
12.2.1 EICRA – External Interrupt Control Register A
The External Interrupt Control Register A contains control bits for interrupt sense control.
• Bit 1, 0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corre-sponding interrupt mask are set. The level and edges on the external INT0 pin that activate theinterrupt are defined in Table 12-1. The value on the INT0 pin is sampled before detectingedges. If edge or toggle interrupt is selected, pulses that last longer than one clock period willgenerate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If low levelinterrupt is selected, the low level must be held until the completion of the currently executinginstruction to generate an interrupt.
12.2.2 EIMSK – External Interrupt Mask Register
• Bit 7 – PCIE1: Pin Change Interrupt Enable 1When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pinchange interrupt 1 is enabled. Any change on any enabled PCINT15..8 pin will cause an inter-rupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1Interrupt Vector. PCINT15:8 pins are enabled individually by the PCMSK1 Register.
• Bit 6 – PCIE0: Pin Change Interrupt Enable 0When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pinchange interrupt 0 is enabled. Any change on any enabled PCINT7..0 pin will cause an interrupt.The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Inter-rupt Vector. PCINT7:0 pins are enabled individually by the PCMSK0 Register.
• Bit 0 – INT0: External Interrupt Request 0 EnableWhen the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the exter-nal pin interrupt is enabled. The Interrupt Sense Control0 bits 1/0 (ISC01 and ISC00) in theExternal Interrupt Control Register A (EICRA) define whether the external interrupt is activatedon rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an
Bit 7 6 5 4 3 2 1 0
(0x69) – – – – – – ISC01 ISC00 EICRA
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 12-1. Interrupt 0 Sense Control
ISC01 ISC00 Description
0 0 The low level of INT0 generates an interrupt request.
0 1 Any logical change on INT0 generates an interrupt request.
1 0 The falling edge of INT0 generates an interrupt request.
1 1 The rising edge of INT0 generates an interrupt request.
Bit 7 6 5 4 3 2 1 0
0x1D (0x3D) PCIE1 PCIE0 – – – – – INT0 EIMSK
Read/Write R/W R/W R R R R R R/W
Initial Value 0 0 0 0 0 0 0 0
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interrupt request even if INT0 is configured as an output. The corresponding interrupt of ExternalInterrupt Request 0 is executed from the INT0 Interrupt Vector.
12.2.3 EIFR – External Interrupt Flag Register
• Bit 7 – PCIF1: Pin Change Interrupt Flag 1When a logic change on any PCINT15..8 pin triggers an interrupt request, PCIF1 becomes set(one). If the I-bit in SREG and the PCIE1 bit in EIMSK are set (one), the MCU will jump to thecorresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alter-natively, the flag can be cleared by writing a logical one to it.
• Bit 6 – PCIF0: Pin Change Interrupt Flag 0When a logic change on any PCINT7:0 pin triggers an interrupt request, PCIF0 becomes set(one). If the I-bit in SREG and the PCIE0 bit in EIMSK are set (one), the MCU will jump to thecorresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alter-natively, the flag can be cleared by writing a logical one to it.
• Bit 0 – INTF0: External Interrupt Flag 0When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set(one). If the I-bit in SREG and the INT0 bit in EIMSK are set (one), the MCU will jump to the cor-responding Interrupt Vector. The flag is cleared when the interrupt routine is executed.Alternatively, the flag can be cleared by writing a logical one to it. This flag is always clearedwhen INT0 is configured as a level interrupt.
12.2.4 PCMSK1 – Pin Change Mask Register 1
• Bit 7:0 – PCINT15:8: Pin Change Enable Mask 15..8Each PCINT15:8-bit selects whether pin change interrupt is enabled on the corresponding I/Opin. If PCINT15:8 is set and the PCIE1 bit in EIMSK is set, pin change interrupt is enabled on thecorresponding I/O pin. If PCINT15..8 is cleared, pin change interrupt on the corresponding I/Opin is disabled.
Bit 7 6 5 4 3 2 1 0
0x1C (0x3C) PCIF1 PCIF0 – – – – – INTF0 EIFR
Read/Write R/W R/W R R R R R R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0x6C) PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 PCMSK1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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12.2.5 PCMSK0 – Pin Change Mask Register 0
• Bit 7:0 – PCINT7:0: Pin Change Enable Mask 7:0Each PCINT7:0 bit selects whether pin change interrupt is enabled on the corresponding I/O pin.If PCINT7:0 is set and the PCIE0 bit in EIMSK is set, pin change interrupt is enabled on the cor-responding I/O pin. If PCINT7:0 is cleared, pin change interrupt on the corresponding I/O pin isdisabled.
Bit 7 6 5 4 3 2 1 0
(0x6B) PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 PCMSK0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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13. I/O-Ports
13.1 Overview
All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports.This means that the direction of one port pin can be changed without unintentionally changingthe direction of any other pin with the SBI and CBI instructions. The same applies when chang-ing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured asinput). Each output buffer has symmetrical drive characteristics with both high sink and sourcecapability. The pin driver is strong enough to drive LED displays directly. All port pins have indi-vidually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins haveprotection diodes to both VCC and Ground as indicated in Figure 13-1 on page 65. Refer to”Electrical Characteristics” on page 329 for a complete list of parameters.
Figure 13-1. I/O Pin Equivalent Schematic
All registers and bit references in this section are written in general form. A lower case “x” repre-sents the numbering letter for the port, and a lower case “n” represents the bit number. However,when using the register or bit defines in a program, the precise form must be used. For example,PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Regis-ters and bit locations are listed in ”Register Description for I/O-Ports” on page 88.
Three I/O memory address locations are allocated for each port, one each for the Data Register– PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input PinsI/O location is read only, while the Data Register and the Data Direction Register are read/write.However, writing a logic one to a bit in the PINx Register, will result in a toggle in the correspond-ing bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables thepull-up function for all pins in all ports when set.
Using the I/O port as General Digital I/O is described in ”Ports as General Digital I/O” on page66. Most port pins are multiplexed with alternate functions for the peripheral features on thedevice. How each alternate function interferes with the port pin is described in ”Alternate PortFunctions” on page 71. Refer to the individual module sections for a full description of the alter-nate functions.
Note that enabling the alternate function of some of the port pins does not affect the use of theother pins in the port as general digital I/O.
Cpin
Logic
Rpu
See Figure"General Digital I/O" for
Details
Pxn
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13.2 Ports as General Digital I/O
The ports are bi-directional I/O ports with optional internal pull-ups. Figure 13-2 shows a func-tional description of one I/O-port pin, here generically called Pxn.
Figure 13-2. General Digital I/O(1)
Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports.
13.2.1 Configuring the Pin
Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in ”RegisterDescription for I/O-Ports” on page 88, the DDxn bits are accessed at the DDRx I/O address, thePORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O address.
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one,Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an inputpin.
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor isactivated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has tobe configured as an output pin. The port pins are tri-stated when reset condition becomes active,even if no clocks are running.
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is drivenhigh (one). If PORTxn is written logic zero when the pin is configured as an output pin, the portpin is driven low (zero).
clk
RPx
RRx
RDx
WDx
PUD
SYNCHRONIZER
WDx: WRITE DDRx
WRx: WRITE PORTxRRx: READ PORTx REGISTERRPx: READ PORTx PIN
PUD: PULLUP DISABLE
clkI/O: I/O CLOCK
RDx: READ DDRx
D
L
Q
Q
RESET
RESET
Q
QD
Q
Q D
CLR
PORTxn
Q
Q D
CLR
DDxn
PINxn
DATA
BU
S
SLEEP
SLEEP: SLEEP CONTROL
Pxn
I/O
WPx
0
1
WRx
WPx: WRITE PINx REGISTER
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13.2.2 Toggling the Pin
Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn.Note that the SBI instruction can be used to toggle one single bit in a port.
13.2.3 Switching Between Input and Output
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn}= 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or outputlow ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully accept-able, as a high-impedant environment will not notice the difference between a strong high driverand a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable allpull-ups in all ports.
Switching between input with pull-up and output low generates the same problem. The usermust use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn}= 0b11) as an intermediate step.
Table 13-1 summarizes the control signals for the pin value.
13.2.4 Reading the Pin Value
Independent of the setting of Data Direction bit DDxn, the port pin can be read through thePINxn Register bit. As shown in Figure 13-2 on page 66, the PINxn Register bit and the preced-ing latch constitute a synchronizer. This is needed to avoid metastability if the physical pinchanges value near the edge of the internal clock, but it also introduces a delay. Figure 13-3 onpage 68 shows a timing diagram of the synchronization when reading an externally applied pinvalue. The maximum and minimum propagation delays are denoted tpd,max and tpd,min
respectively.
Table 13-1. Port Pin Configurations
DDxn PORTxnPUD
(in MCUCR) I/O Pull-up Comment
0 0 X Input No Tri-state (Hi-Z)
0 1 0 Input Yes Pxn will source current if ext. pulled low.
0 1 1 Input No Tri-state (Hi-Z)
1 0 X Output No Output Low (Sink)
1 1 X Output No Output High (Source)
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Figure 13-3. Synchronization when Reading an Externally Applied Pin value
Consider the clock period starting shortly after the first falling edge of the system clock. The latchis closed when the clock is low, and goes transparent when the clock is high, as indicated by theshaded region of the “SYNC LATCH” signal. The signal value is latched when the system clockgoes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indi-cated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayedbetween ½ and 1½ system clock period depending upon the time of assertion.
When reading back a software assigned pin value, a nop instruction must be inserted as indi-cated in Figure 13-4. The out instruction sets the “SYNC LATCH” signal at the positive edge ofthe clock. In this case, the delay tpd through the synchronizer is 1 system clock period.
Figure 13-4. Synchronization when Reading a Software Assigned Pin Value
The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and definethe port pins from 4 to 7 as input with pull-ups assigned to port pins 6 and 7. The resulting pin
XXX in r17, PINx
0x00 0xFF
INSTRUCTIONS
SYNC LATCH
PINxn
r17
XXX
SYSTEM CLK
tpd, max
tpd, min
out PORTx, r16 nop in r17, PINx
0xFF
0x00 0xFF
SYSTEM CLK
r16
INSTRUCTIONS
SYNC LATCH
PINxn
r17tpd
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values are read back again, but as previously discussed, a nop instruction is included to be ableto read back the value recently assigned to some of the pins.
Note: 1. For the assembly program, two temporary registers are used to minimize the time from pull-ups are set on pins 0, 1, 6, and 7, until the direction bits are correctly set, defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers.
13.2.5 Digital Input Enable and Sleep Modes
As shown in Figure 13-2 on page 66, the digital input signal can be clamped to ground at theinput of the Schmidt Trigger. The signal denoted SLEEP in the figure, is set by the MCU SleepController in Power-down mode, Power-save mode, and Standby mode to avoid high powerconsumption if some input signals are left floating, or have an analog signal level close to VCC/2.
SLEEP is overridden for port pins enabled as external interrupt pins. If the external interruptrequest is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by variousother alternate functions as described in ”Alternate Port Functions” on page 71.
If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as“Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interruptis not enabled, the corresponding External Interrupt Flag will be set when resuming from theabove mentioned Sleep mode, as the clamping in these sleep mode produces the requestedlogic change.
Assembly Code Example(1)
...
; Define pull-ups and set outputs high
; Define directions for port pins
ldi r16,(1<<PB7)|(1<<PB6)|(1<<PB1)|(1<<PB0)
ldi r17,(1<<DDB3)|(1<<DDB2)|(1<<DDB1)|(1<<DDB0)
out PORTB,r16
out DDRB,r17
; Insert nop for synchronization
nop
; Read port pins
in r16,PINB
...
C Code Example
unsigned char i;
...
/* Define pull-ups and set outputs high */
/* Define directions for port pins */
PORTB = (1<<PB7)|(1<<PB6)|(1<<PB1)|(1<<PB0);
DDRB = (1<<DDB3)|(1<<DDB2)|(1<<DDB1)|(1<<DDB0);
/* Insert nop for synchronization*/
__no_operation();
/* Read port pins */
i = PINB;
...
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13.2.6 Unconnected Pins
If some pins are unused, it is recommended to ensure that these pins have a defined level. Eventhough most of the digital inputs are disabled in the deep sleep modes as described above, float-ing inputs should be avoided to reduce current consumption in all other modes where the digitalinputs are enabled (Reset, Active mode and Idle mode).
The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up.In this case, the pull-up will be disabled during reset. If low power consumption during reset isimportant, it is recommended to use an external pull-up or pull-down. Connecting unused pinsdirectly to VCC or GND is not recommended, since this may cause excessive currents if the pin isaccidentally configured as an output.
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13.3 Alternate Port Functions
Most port pins have alternate functions in addition to being general digital I/Os. Figure 13-5shows how the port pin control signals from the simplified Figure 13-2 on page 66 can be over-ridden by alternate functions. The overriding signals may not be present in all port pins, but thefigure serves as a generic description applicable to all port pins in the AVR microcontrollerfamily.
Figure 13-5. Alternate Port Functions(1)
Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O, SLEEP, and PUD are common to all ports. All other signals are unique for each pin.
Table 13-2 on page 72 summarizes the function of the overriding signals. The pin and portindexes from Figure 13-5 on page 71 are not shown in the succeeding tables. The overridingsignals are generated internally in the modules having the alternate function.
clk
RPx
RRxWRx
RDx
WDx
PUD
SYNCHRONIZER
WDx: WRITE DDRx
WRx: WRITE PORTxRRx: READ PORTx REGISTER
RPx: READ PORTx PIN
PUD: PULLUP DISABLE
clkI/O: I/O CLOCK
RDx: READ DDRx
D
L
Q
Q
SET
CLR
0
1
0
1
0
1
DIxn
AIOxn
DIEOExn
PVOVxn
PVOExn
DDOVxn
DDOExn
PUOExn
PUOVxn
PUOExn: Pxn PULL-UP OVERRIDE ENABLEPUOVxn: Pxn PULL-UP OVERRIDE VALUEDDOExn: Pxn DATA DIRECTION OVERRIDE ENABLEDDOVxn: Pxn DATA DIRECTION OVERRIDE VALUEPVOExn: Pxn PORT VALUE OVERRIDE ENABLEPVOVxn: Pxn PORT VALUE OVERRIDE VALUE
DIxn: DIGITAL INPUT PIN n ON PORTxAIOxn: ANALOG INPUT/OUTPUT PIN n ON PORTx
RESET
RESET
Q
Q D
CLR
Q
Q D
CLR
Q
QD
CLR
PINxn
PORTxn
DDxn
DAT
A B
US
0
1DIEOVxn
SLEEP
DIEOExn: Pxn DIGITAL INPUT-ENABLE OVERRIDE ENABLEDIEOVxn: Pxn DIGITAL INPUT-ENABLE OVERRIDE VALUESLEEP: SLEEP CONTROL
Pxn
I/O
0
1
PTOExn
WPx
PTOExn: Pxn, PORT TOGGLE OVERRIDE ENABLE
WPx: WRITE PINx
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The following subsections shortly describe the alternate functions for each port, and relate theoverriding signals to the alternate function. Refer to the alternate function description for furtherdetails.
Table 13-2. Generic Description of Overriding Signals for Alternate Functions
Signal Name Full Name Description
PUOEPull-up Override Enable
If this signal is set, the pull-up enable is controlled by the PUOV signal. If this signal is cleared, the pull-up is enabled when {DDxn, PORTxn, PUD} = 0b010.
PUOVPull-up Override Value
If PUOE is set, the pull-up is enabled/disabled when PUOV is set/cleared, regardless of the setting of the DDxn, PORTxn, and PUD Register bits.
DDOEData Direction Override Enable
If this signal is set, the Output Driver Enable is controlled by the DDOV signal. If this signal is cleared, the Output driver is enabled by the DDxn Register bit.
DDOVData Direction Override Value
If DDOE is set, the Output Driver is enabled/disabled when DDOV is set/cleared, regardless of the setting of the DDxn Register bit.
PVOEPort Value Override Enable
If this signal is set and the Output Driver is enabled, the port value is controlled by the PVOV signal. If PVOE is cleared, and the Output Driver is enabled, the port Value is controlled by the PORTxn Register bit.
PVOVPort Value Override Value
If PVOE is set, the port value is set to PVOV, regardless of the setting of the PORTxn Register bit.
PTOEPort Toggle Override Enable
If PTOE is set, the PORTxn Register bit is inverted.
DIEOEDigital Input Enable Override Enable
If this bit is set, the Digital Input Enable is controlled by the DIEOV signal. If this signal is cleared, the Digital Input Enable is determined by MCU state (Normal mode, sleep mode).
DIEOVDigital Input Enable Override Value
If DIEOE is set, the Digital Input is enabled/disabled when DIEOV is set/cleared, regardless of the MCU state (Normal mode, sleep mode).
DI Digital Input
This is the Digital Input to alternate functions. In the figure, the signal is connected to the output of the schmitt trigger but before the synchronizer. Unless the Digital Input is used as a clock source, the module with the alternate function will use its own synchronizer.
AIOAnalog Input/Output
This is the Analog Input/output to/from alternate functions. The signal is connected directly to the pad, and can be used bi-directionally.
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13.3.1 Alternate Functions of Port A
The Port A has an alternate function as COM0:3 and SEG0:3 for the LCD Controller.
Table 13-4 and Table 13-5 on page 74 relates the alternate functions of Port A to the overridingsignals shown in Figure 13-5 on page 71.
Table 13-3. Port A Pins Alternate Functions
Port Pin Alternate Function
PA7 SEG3 (LCD Front Plane 3)
PA6 SEG2 (LCD Front Plane 2)
PA5 SEG1 (LCD Front Plane 1)
PA4 SEG0 (LCD Front Plane 0)
PA3 COM3 (LCD Back Plane 3)
PA2 COM2 (LCD Back Plane 2)
PA1 COM1 (LCD Back Plane 1)
PA0 COM0 (LCD Back Plane 0)
Table 13-4. Overriding Signals for Alternate Functions in PA7..PA4
Signal Name PA7/SEG3 PA6/SEG2 PA5/SEG1 PA4/SEG0
PUOE LCDEN LCDEN LCDEN LCDEN
PUOV 0 0 0 0
DDOE LCDEN LCDEN LCDEN LCDEN
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOE LCDEN LCDEN LCDEN LCDEN
DIEOV 0 0 0 0
DI – – – –
AIO SEG3 SEG2 SEG1 SEG0
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13.3.2 Alternate Functions of Port B
The Port B pins with alternate functions are shown in Table 13-6.
The alternate pin configuration is as follows:
• OC2A/PCINT15, Bit 7OC2, Output Compare Match A output: The PB7 pin can serve as an external output for theTimer/Counter2 Output Compare A. The pin has to be configured as an output (DDB7 set (one))to serve this function. The OC2A pin is also the output pin for the PWM mode timer function.
PCINT15, Pin Change Interrupt source 15: The PB7 pin can serve as an external interruptsource.
Table 13-5. Overriding Signals for Alternate Functions in PA3..PA0
Signal Name PA3/COM3 PA2/COM2 PA1/COM1 PA0/COM0
PUOELCDEN • (LCDMUX>2)
LCDEN • (LCDMUX>1)
LCDEN • (LCDMUX>0)
LCDEN
PUOV 0 0 0 0
DDOELCDEN • (LCDMUX>2)
LCDEN • (LCDMUX>1)
LCDEN • (LCDMUX>0)
LCDEN
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOELCDEN • (LCDMUX>2)
LCDEN • (LCDMUX>1)
LCDEN • (LCDMUX>0)
LCDEN
DIEOV 0 0 0 0
DI – – – –
AIO COM3 COM2 COM1 COM0
Table 13-6. Port B Pins Alternate Functions
Port Pin Alternate Functions
PB7OC2A/PCINT15 (Output Compare and PWM Output A for Timer/Counter2 or Pin Change Interrupt15).
PB6OC1B/PCINT14 (Output Compare and PWM Output B for Timer/Counter1 or Pin Change Interrupt14).
PB5OC1A/PCINT13 (Output Compare and PWM Output A for Timer/Counter1 or Pin Change Interrupt13).
PB4OC0A/PCINT12 (Output Compare and PWM Output A for Timer/Counter0 or Pin Change Interrupt12).
PB3 MISO/PCINT11 (SPI Bus Master Input/Slave Output or Pin Change Interrupt11).
PB2 MOSI/PCINT10 (SPI Bus Master Output/Slave Input or Pin Change Interrupt10).
PB1 SCK/PCINT9 (SPI Bus Serial Clock or Pin Change Interrupt9).
PB0 SS/PCINT8 (SPI Slave Select input or Pin Change Interrupt8).
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• OC1B/PCINT14, Bit 6OC1B, Output Compare Match B output: The PB6 pin can serve as an external output for theTimer/Counter1 Output Compare B. The pin has to be configured as an output (DDB6 set (one))to serve this function. The OC1B pin is also the output pin for the PWM mode timer function.
PCINT14, Pin Change Interrupt Source 14: The PB6 pin can serve as an external interruptsource.
• OC1A/PCINT13, Bit 5OC1A, Output Compare Match A output: The PB5 pin can serve as an external output for theTimer/Counter1 Output Compare A. The pin has to be configured as an output (DDB5 set (one))to serve this function. The OC1A pin is also the output pin for the PWM mode timer function.
PCINT13, Pin Change Interrupt Source 13: The PB5 pin can serve as an external interruptsource.
• OC0A/PCINT12, Bit 4OC0A, Output Compare Match A output: The PB4 pin can serve as an external output for theTimer/Counter0 Output Compare A. The pin has to be configured as an output (DDB4 set (one))to serve this function. The OC0A pin is also the output pin for the PWM mode timer function.
PCINT12, Pin Change Interrupt Source 12: The PB4 pin can serve as an external interruptsource.
• MISO/PCINT11 – Port B, Bit 3MISO: Master Data input, Slave Data output pin for SPI. When the SPI is enabled as a Master,this pin is configured as an input regardless of the setting of DDB3. When the SPI is enabled asa Slave, the data direction of this pin is controlled by DDB3. When the pin is forced to be aninput, the pull-up can still be controlled by the PORTB3 bit.
PCINT11, Pin Change Interrupt Source 11: The PB3 pin can serve as an external interruptsource.
• MOSI/PCINT10 – Port B, Bit 2MOSI: SPI Master Data output, Slave Data input for SPI. When the SPI is enabled as a Slave,this pin is configured as an input regardless of the setting of DDB2. When the SPI is enabled asa Master, the data direction of this pin is controlled by DDB2. When the pin is forced to be aninput, the pull-up can still be controlled by the PORTB2 bit.
PCINT10, Pin Change Interrupt Source 10: The PB2 pin can serve as an external interruptsource.
• SCK/PCINT9 – Port B, Bit 1SCK: Master Clock output, Slave Clock input pin for SPI. When the SPI is enabled as a Slave,this pin is configured as an input regardless of the setting of DDB1. When the SPI is enabled asa Master, the data direction of this pin is controlled by DDB1. When the pin is forced to be aninput, the pull-up can still be controlled by the PORTB1 bit.
PCINT9, Pin Change Interrupt Source 9: The PB1 pin can serve as an external interrupt source.
• SS/PCINT8 – Port B, Bit 0SS: Slave Port Select input. When the SPI is enabled as a Slave, this pin is configured as aninput regardless of the setting of DDB0. As a Slave, the SPI is activated when this pin is driven
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low. When the SPI is enabled as a Master, the data direction of this pin is controlled by DDB0.When the pin is forced to be an input, the pull-up can still be controlled by the PORTB0 bit.
PCINT8, Pin Change Interrupt Source 8: The PB0 pin can serve as an external interrupt source.
Table 13-7 and Table 13-8 on page 77 relate the alternate functions of Port B to the overridingsignals shown in Figure 13-5 on page 71. SPI MSTR INPUT and SPI SLAVE OUTPUT consti-tute the MISO signal, while MOSI is divided into SPI MSTR OUTPUT and SPI SLAVE INPUT.
Table 13-7. Overriding Signals for Alternate Functions in PB7..PB4
Signal Name
PB7/OC2A/PCINT15
PB6/OC1B/PCINT14
PB5/OC1A/PCINT13
PB4/OC0A/PCINT12
PUOE 0 0 0 0
PUOV 0 0 0 0
DDOE 0 0 0 0
DDOV 0 0 0 0
PVOE OC2A ENABLE OC1B ENABLE OC1A ENABLE OC0A ENABLE
PVOV OC2A OC1B OC1A OC0A
PTOE – – – –
DIEOE PCINT15 • PCIE1 PCINT14 • PCIE1 PCINT13 • PCIE1 PCINT12 • PCIE1
DIEOV 1 1 1 1
DI PCINT15 INPUT PCINT14 INPUT PCINT13 INPUT PCINT12 INPUT
AIO – – – –
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ATmega169P
13.3.3 Alternate Functions of Port C
The Port C has an alternate function as the SEG5:12 for the LCD Controller.
Table 13-8. Overriding Signals for Alternate Functions in PB3..PB0
Signal Name
PB3/MISO/PCINT11
PB2/MOSI/PCINT10
PB1/SCK/PCINT9
PB0/SS/PCINT8
PUOE SPE • MSTR SPE • MSTR SPE • MSTR SPE • MSTR
PUOV PORTB3 • PUD PORTB2 • PUD PORTB1 • PUD PORTB0 • PUD
DDOE SPE • MSTR SPE • MSTR SPE • MSTR SPE • MSTR
DDOV 0 0 0 0
PVOE SPE • MSTR SPE • MSTR SPE • MSTR 0
PVOV SPI SLAVE OUTPUT SPI MSTR OUTPUT SCK OUTPUT 0
PTOE – – – –
DIEOE PCINT11 • PCIE1 PCINT10 • PCIE1 PCINT9 • PCIE1 PCINT8 • PCIE1
DIEOV 1 1 1 1
DIPCINT11 INPUT
SPI MSTR INPUT
PCINT10 INPUT
SPI SLAVE INPUT
PCINT9 INPUT
SCK INPUT
PCINT8 INPUT
SPI SS
AIO – – – –
Table 13-9. Port C Pins Alternate Functions
Port Pin Alternate Function
PC7 SEG5 (LCD Front Plane 5)
PC6 SEG6 (LCD Front Plane 6)
PC5 SEG7 (LCD Front Plane 7)
PC4 SEG8 (LCD Front Plane 8)
PC3 SEG9 (LCD Front Plane 9)
PC2 SEG10 (LCD Front Plane 10)
PC1 SEG11 (LCD Front Plane 11)
PC0 SEG12 (LCD Front Plane 12)
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ATmega169P
Table 13-10 and Table 13-11 relate the alternate functions of Port C to the overriding signalsshown in Figure 13-5 on page 71.
Table 13-10. Overriding Signals for Alternate Functions in PC7..PC4
Signal Name PC7/SEG5 PC6/SEG6 PC5/SEG7 PC4/SEG8
PUOE LCDEN LCDEN LCDEN LCDEN
PUOV 0 0 0 0
DDOE LCDEN LCDEN LCDEN LCDEN
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOE LCDEN LCDEN LCDEN LCDEN
DIEOV 0 0 0 0
DI – – – –
AIO SEG5 SEG6 SEG7 SEG8
Table 13-11. Overriding Signals for Alternate Functions in PC3..PC0
Signal Name PC3/SEG9 PC2/SEG10 PC1/SEG11 PC0/SEG12
PUOE LCDEN LCDEN LCDEN LCDEN
PUOV 0 0 0 0
DDOE LCDEN LCDEN LCDEN LCDEN
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOE LCDEN LCDEN LCDEN LCDEN
DIEOV 0 0 0 0
DI – – – –
AIO SEG9 SEG10 SEG11 SEG12
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ATmega169P
13.3.4 Alternate Functions of Port D
The Port D pins with alternate functions are shown in Table 13-12.
The alternate pin configuration is as follows:
• SEG15 - SEG20 – Port D, Bit 7:2SEG15-SEG20, LCD front plane 15-20.
• INT0/SEG21 – Port D, Bit 1INT0, External Interrupt Source 0. The PD1 pin can serve as an external interrupt source to theMCU.
SEG21, LCD front plane 21.
• ICP1/SEG22 – Port D, Bit 0ICP1 – Input Capture pin1: The PD0 pin can act as an Input Capture pin for Timer/Counter1.
SEG22, LCD front plane 22.
Table 13-12. Port D Pins Alternate Functions
Port Pin Alternate Function
PD7 SEG15 (LCD front plane 15)
PD6 SEG16 (LCD front plane 16)
PD5 SEG17 (LCD front plane 17)
PD4 SEG18 (LCD front plane 18)
PD3 SEG19 (LCD front plane 19)
PD2 SEG20 (LCD front plane 20)
PD1 INT0/SEG21 (External Interrupt0 Input or LCD front plane 21)
PD0 ICP1/SEG22 (Timer/Counter1 Input Capture pin or LCD front plane 22)
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ATmega169P
Table 13-13 and Table 13-14 relates the alternate functions of Port D to the overriding signalsshown in Figure 13-5 on page 71.
Table 13-13. Overriding Signals for Alternate Functions PD7..PD4
Signal Name PD7/SEG15 PD6/SEG16 PD5/SEG17 PD4/SEG18
PUOELCDEN • (LCDPM>1)
LCDEN • (LCDPM>1)
LCDEN • (LCDPM>2)
LCDEN • (LCDPM>2)
PUOV 0 0 0 0
DDOELCDEN • (LCDPM>1)
LCDEN • (LCDPM>1)
LCDEN • (LCDPM>2)
LCDEN • (LCDPM>2)
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOELCDEN • (LCDPM>1)
LCDEN • (LCDPM>1)
LCDEN • (LCDPM>2)
LCDEN • (LCDPM>2)
DIEOV 0 0 0 0
DI – – – –
AIO SEG15 SEG16 SEG17 SEG18
Table 13-14. Overriding Signals for Alternate Functions in PD3..PD0
Signal Name PD3/SEG19 PD2/SEG20 PD1/INT0/SEG21 PD0/ICP1/SEG22
PUOELCDEN • (LCDPM>3)
LCDEN • (LCDPM>3)
LCDEN • (LCDPM>4)
LCDEN • (LCDPM>4)
PUOV 0 0 0 0
DDOELCDEN • (LCDPM>3)
LCDEN • (LCDPM>3)
LCDEN • (LCDPM>4)
LCDEN • (LCDPM>4)
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOELCDEN • (LCDPM>3)
LCDEN • (LCDPM>3)
LCDEN + (INT0 ENABLE)
LCDEN • (LCDPM>4)
DIEOV 0 0LCDEN • (INT0 ENABLE)
0
DI – – INT0 INPUT ICP1 INPUT
AIO – –
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ATmega169P
13.3.5 Alternate Functions of Port E
The Port E pins with alternate functions are shown in Table 13-15.
• PCINT7 – Port E, Bit 7PCINT7, Pin Change Interrupt Source 7: The PE7 pin can serve as an external interrupt source.
CLKO, Divided System Clock: The divided system clock can be output on the PE7 pin. Thedivided system clock will be output if the CKOUT Fuse is programmed, regardless of thePORTE7 and DDE7 settings. It will also be output during reset.
• DO/PCINT6 – Port E, Bit 6DO, Universal Serial Interface Data output.
PCINT6, Pin Change Interrupt Source 6: The PE6 pin can serve as an external interrupt source.
• DI/SDA/PCINT5 – Port E, Bit 5DI, Universal Serial Interface Data input.
SDA, Two-wire Serial Interface Data:
PCINT5, Pin Change Interrupt Source 5: The PE5 pin can serve as an external interrupt source.
• USCK/SCL/PCINT4 – Port E, Bit 4USCK, Universal Serial Interface Clock.
SCL, Two-wire Serial Interface Clock.
PCINT4, Pin Change Interrupt Source 4: The PE4 pin can serve as an external interrupt source.
• AIN1/PCINT3 – Port E, Bit 3AIN1 – Analog Comparator Negative input. This pin is directly connected to the negative input ofthe Analog Comparator.
PCINT3, Pin Change Interrupt Source 3: The PE3 pin can serve as an external interrupt source.
Table 13-15. Port E Pins Alternate Functions
Port Pin Alternate Function
PE7PCINT7 (Pin Change Interrupt7)CLKO (Divided System Clock)
PE6 DO/PCINT6 (USI Data Output or Pin Change Interrupt6)
PE5 DI/SDA/PCINT5 (USI Data Input or TWI Serial DAta or Pin Change Interrupt5)
PE4USCK/SCL/PCINT4 (USART External Clock Input/Output or TWI Serial Clock or Pin Change Interrupt4)
PE3 AIN1/PCINT3 (Analog Comparator Negative Input or Pin Change Interrupt3)
PE2XCK/AIN0/ PCINT2 (USART External Clock or Analog Comparator Positive Input or Pin Change Interrupt2)
PE1 TXD/PCINT1 (USART Transmit Pin or Pin Change Interrupt1)
PE0 RXD/PCINT0 (USART Receive Pin or Pin Change Interrupt0)
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ATmega169P
• XCK/AIN0/PCINT2 – Port E, Bit 2XCK, USART External Clock. The Data Direction Register (DDE2) controls whether the clock isoutput (DDE2 set) or input (DDE2 cleared). The XCK pin is active only when the USART oper-ates in synchronous mode.
AIN0 – Analog Comparator Positive input. This pin is directly connected to the positive input ofthe Analog Comparator.
PCINT2, Pin Change Interrupt Source 2: The PE2 pin can serve as an external interrupt source.
• TXD/PCINT1 – Port E, Bit 1TXD0, UART0 Transmit pin.
PCINT1, Pin Change Interrupt Source 1: The PE1 pin can serve as an external interrupt source.
• RXD/PCINT0 – Port E, Bit 0RXD, USART Receive pin. Receive Data (Data input pin for the USART). When the USARTReceiver is enabled this pin is configured as an input regardless of the value of DDE0. When theUSART forces this pin to be an input, a logical one in PORTE0 will turn on the internal pull-up.
PCINT0, Pin Change Interrupt Source 0: The PE0 pin can serve as an external interrupt source.
Table 13-16 and Table 13-17 on page 83 relates the alternate functions of Port E to the overrid-ing signals shown in Figure 13-5 on page 71.
Note: 1. CKOUT is one if the CKOUT Fuse is programmed
Table 13-16. Overriding Signals for Alternate Functions PE7:PE4
Signal Name PE7/PCINT7
PE6/DO/PCINT6
PE5/DI/SDA/PCINT5
PE4/USCK/SCL/PCINT4
PUOE 0 0 USI_TWO-WIRE USI_TWO-WIRE
PUOV 0 0 0 0
DDOE CKOUT(1) 0 USI_TWO-WIRE USI_TWO-WIRE
DDOV 1 0(SDA + PORTE5) • DDE5
(USI_SCL_HOLD • PORTE4) + DDE4
PVOE CKOUT(1) USI_THREE-WIRE
USI_TWO-WIRE • DDE5
USI_TWO-WIRE • DDE4
PVOV clkI/O DO 0 0
PTOE – – 0 USITC
DIEOE PCINT7 • PCIE0 PCINT6 • PCIE0(PCINT5 • PCIE0) + USISIE
(PCINT4 • PCIE0) + USISIE
DIEOV 1 1 1 1
DI PCINT7 INPUT PCINT6 INPUTDI/SDA INPUT
PCINT5 INPUT
USCKL/SCL INPUT
PCINT4 INPUT
AIO – – – –
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ATmega169P
Note: 1. AIN0D and AIN1D is described in ”DIDR1 – Digital Input Disable Register 1” on page 215.
13.3.6 Alternate Functions of Port F
The Port F has an alternate function as analog input for the ADC as shown in Table 13-18. Ifsome Port F pins are configured as outputs, it is essential that these do not switch when a con-version is in progress. This might corrupt the result of the conversion. If the JTAG interface isenabled, the pull-up resistors on pins PF7(TDI), PF5(TMS) and PF4(TCK) will be activated evenif a reset occurs.
• TDI, ADC7 – Port F, Bit 7ADC7, Analog to Digital Converter, Channel 7.
TDI, JTAG Test Data In: Serial input data to be shifted in to the Instruction Register or Data Reg-ister (scan chains). When the JTAG interface is enabled, this pin can not be used as an I/O pin.
Table 13-17. Overriding Signals for Alternate Functions in PE3:PE0
Signal Name
PE3/AIN1/PCINT3
PE2/XCK/AIN0/PCINT2
PE1/TXD/PCINT1 PE0/RXD/PCINT0
PUOE 0 0 TXENn RXENn
PUOV 0 0 0 PORTE0 • PUD
DDOE 0 0 TXENn RXENn
DDOV 0 0 1 0
PVOE 0 XCK OUTPUT ENABLE TXENn 0
PVOV 0 XCK TXD 0
PTOE – – – –
DIEOE(PCINT3 • PCIE0) + AIN1D(1)
(PCINT2 • PCIE0) + AIN0D(1) PCINT1 • PCIE0 PCINT0 • PCIE0
DIEOV PCINT3 • PCIE0 PCINT2 • PCIE0 1 1
DI PCINT3 INPUT XCK/PCINT2 INPUT PCINT1 INPUT RXD/PCINT0 INPUT
AIO AIN1 INPUT AIN0 INPUT – –
Table 13-18. Port F Pins Alternate Functions
Port Pin Alternate Function
PF7 ADC7/TDI (ADC input channel 7 or JTAG Test Data Input)
PF6 ADC6/TDO (ADC input channel 6 or JTAG Test Data Output)
PF5 ADC5/TMS (ADC input channel 5 or JTAG Test mode Select)
PF4 ADC4/TCK (ADC input channel 4 or JTAG Test ClocK)
PF3 ADC3 (ADC input channel 3)
PF2 ADC2 (ADC input channel 2)
PF1 ADC1 (ADC input channel 1)
PF0 ADC0 (ADC input channel 0)
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ATmega169P
• TDO, ADC6 – Port F, Bit 6ADC6, Analog to Digital Converter, Channel 6.
TDO, JTAG Test Data Out: Serial output data from Instruction Register or Data Register. Whenthe JTAG interface is enabled, this pin can not be used as an I/O pin. In TAP states that shift outdata, the TDO pin drives actively. In other states the pin is pulled high.
• TMS, ADC5 – Port F, Bit 5ADC5, Analog to Digital Converter, Channel 5.
TMS, JTAG Test mode Select: This pin is used for navigating through the TAP-controller statemachine. When the JTAG interface is enabled, this pin can not be used as an I/O pin.
• TCK, ADC4 – Port F, Bit 4ADC4, Analog to Digital Converter, Channel 4.
TCK, JTAG Test Clock: JTAG operation is synchronous to TCK. When the JTAG interface isenabled, this pin can not be used as an I/O pin.
• ADC3 - ADC0 – Port F, Bit 3:0Analog to Digital Converter, Channel 3-0.
Table 13-19. Overriding Signals for Alternate Functions in PF7:PF4
Signal Name PF7/ADC7/TDI PF6/ADC6/TDO PF5/ADC5/TMS PF4/ADC4/TCK
PUOE JTAGEN JTAGEN JTAGEN JTAGEN
PUOV 1 1 1 1
DDOE JTAGEN JTAGEN JTAGEN JTAGEN
DDOV 0 SHIFT_IR + SHIFT_DR 0 0
PVOE 0 JTAGEN 0 0
PVOV 0 TDO 0 0
PTOE – – – –
DIEOE JTAGEN JTAGEN JTAGEN JTAGEN
DIEOV 0 0 0 1
DI – – – –
AIOTDIADC7 INPUT
ADC6 INPUTTMSADC5 INPUT
TCKADC4 INPUT
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ATmega169P
13.3.7 Alternate Functions of Port G
The alternate pin configuration is as follows:
Note: 1. Port G, PG5 is input only. Pull-up is always on. See Table 27-3 on page 297 for RSTDISBL fuse.
The alternate pin configuration is as follows:
• RESET – Port G, Bit 5RESET: External Reset input. When the RSTDISBL Fuse is programmed (‘0’), PG5 will functionas input with pull-up always on.
• T0/SEG23 – Port G, Bit 4T0, Timer/Counter0 Counter Source.
SEG23, LCD front plane 23
• T1/SEG24 – Port G, Bit 3T1, Timer/Counter1 Counter Source.
SEG24, LCD front plane 24
Table 13-20. Overriding Signals for Alternate Functions in PF3:PF0
Signal Name PF3/ADC3 PF2/ADC2 PF1/ADC1 PF0/ADC0
PUOE 0 0 0 0
PUOV 0 0 0 0
DDOE 0 0 0 0
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOE 0 0 0 0
DIEOV 0 0 0 0
DI – – – –
AIO ADC3 INPUT ADC2 INPUT ADC1 INPUT ADC0 INPUT
Table 13-21. Port G Pins Alternate Functions(1)
Port Pin Alternate Function
PG5 RESET
PG4 T0/SEG23 (Timer/Counter0 Clock Input or LCD Front Plane 23)
PG3 T1/SEG24 (Timer/Counter1 Clock Input or LCD Front Plane 24)
PG2 SEG4 (LCD Front Plane 4)
PG1 SEG13 (LCD Front Plane 13)
PG0 SEG14 (LCD Front Plane 14)
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ATmega169P
• SEG4 – Port G, Bit 2SEG4, LCD front plane 4
• SEG13 – Port G, Bit 1SEG13, Segment driver 13
• SEG14 – Port G, Bit 0SEG14, LCD front plane 14
Table 13-21 on page 85 and Table 13-22 relates the alternate functions of Port G to the overrid-ing signals shown in Figure 13-5 on page 71.
Table 13-22. Overriding Signals for Alternate Functions in PG4
Signal Name PG4/T0/SEG23
PUOE LCDEN • (LCDPM>5)
PUOV 0
DDOE LCDEN • (LCDPM>5)
DDOV 1
PVOE 0
PVOV 0
PTOE – – – –
DIEOE LCDEN • (LCDPM>5)
DIEOV 0
DI T0 INPUT
AIO SEG23
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ATmega169P
Table 13-23. Overriding Signals for Alternate Functions in PG3:0
Signal Name PG3/T1/SEG24 PG2/SEG4 PG1/SEG13 PG0/SEG14
PUOELCDEN • (LCDPM>6)
LCDENLCDEN • (LCDPM>0)
LCDEN • (LCDPM>0)
PUOV 0 0 0 0
DDOELCDEN • (LCDPM>6)
LCDENLCDEN • (LCDPM>0)
LCDEN • (LCDPM>0)
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOELCDEN • (LCDPM>6)
LCDENLCDEN • (LCDPM>0)
LCDEN • (LCDPM>0)
DIEOV 0 0 0 0
DI T1 INPUT – – –
AIO SEG24 SEG4 SEG13 SEG14
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ATmega169P
13.4 Register Description for I/O-Ports
13.4.1 MCUCR – MCU Control Register
• Bit 4 – PUD: Pull-up DisableWhen this bit is written to one, the pull-ups in the I/O ports are disabled even if the DDxn andPORTxn Registers are configured to enable the pull-ups ({DDxn, PORTxn} = 0b01). See ”Con-figuring the Pin” on page 66 for more details about this feature.
13.4.2 PORTA – Port A Data Register
13.4.3 DDRA – Port A Data Direction Register
13.4.4 PINA – Port A Input Pins Address
13.4.5 PORTB – Port B Data Register
13.4.6 DDRB – Port B Data Direction Register
13.4.7 PINB – Port B Input Pins Address
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) JTD - - PUD – – IVSEL IVCE MCUCR
Read/Write R/W R R R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x02 (0x22) PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 PORTA
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x01 (0x21) DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 DDRA
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x00 (0x20) PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 PINA
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
Bit 7 6 5 4 3 2 1 0
0x05 (0x25) PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 PORTB
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x04 (0x24) DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 DDRB
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x03 (0x23) PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 PINB
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
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ATmega169P
13.4.8 PORTC – Port C Data Register
13.4.9 DDRC – Port C Data Direction Register
13.4.10 PINC – Port C Input Pins Address
13.4.11 PORTD – Port D Data Register
13.4.12 DDRD – Port D Data Direction Register
13.4.13 PIND – Port D Input Pins Address
13.4.14 PORTE – Port E Data Register
13.4.15 DDRE – Port E Data Direction Register
Bit 7 6 5 4 3 2 1 0
0x08 (0x28) PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 PORTC
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x07 (0x27) DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 DDRC
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x06 (0x26) PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 PINC
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
Bit 7 6 5 4 3 2 1 0
0x0B (0x2B) PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 PORTD
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x0A (0x2A) DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 DDRD
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x09 (0x29) PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 PIND
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
Bit 7 6 5 4 3 2 1 0
0x0E (0x2E) PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 PORTE
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x0D (0x2D) DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 DDRE
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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ATmega169P
13.4.16 PINE – Port E Input Pins Address
13.4.17 PORTF – Port F Data Register
13.4.18 DDRF – Port F Data Direction Register
13.4.19 PINF – Port F Input Pins Address
13.4.20 PORTG – Port G Data Register
13.4.21 DDRG – Port G Data Direction Register
13.4.22 PING – Port G Input Pins Address
Bit 7 6 5 4 3 2 1 0
0x0C (0x2C) PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 PINE
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
Bit 7 6 5 4 3 2 1 0
0x11 (0x31) PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 PORTF
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x10 (0x30) DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 DDRF
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x0F (0x2F) PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 PINF
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value N/A N/A N/A N/A N/A N/A N/A N/A
Bit 7 6 5 4 3 2 1 0
0x14 (0x34) – – PORTG4 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 PORTG
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x13 (0x33) – – DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 DDRG
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x12 (0x32) – – PING5 PING4 PING3 PING2 PING1 PING0 PING
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 N/A N/A N/A N/A N/A
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ATmega169P
14. 8-bit Timer/Counter0 with PWM
14.1 Features
• Single Compare Unit Counter• Clear Timer on Compare Match (Auto Reload)• Glitch-free, Phase Correct Pulse Width Modulator (PWM)• Frequency Generator• External Event Counter• 10-bit Clock Prescaler• Overflow and Compare Match Interrupt Sources (TOV0 and OCF0A)
14.2 Overview
Timer/Counter0 is a general purpose, single compare unit, 8-bit Timer/Counter module. A simpli-fied block diagram is shown in Figure 14-1. For the actual placement of I/O pins, refer to Figure1-1 on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold.The device-specific I/O Register and bit locations are listed in the ”8-bit Timer/Counter RegisterDescription” on page 102.
Figure 14-1. 8-bit Timer/Counter Block Diagram
14.2.1 Registers
The Timer/Counter (TCNT0) and Output Compare Register (OCR0A) are 8-bit registers. Inter-rupt request (abbreviated to Int.Req. in the figure) signals are all visible in the Timer InterruptFlag Register (TIFR0). All interrupts are individually masked with the Timer Interrupt Mask Reg-ister (TIMSK0). TIFR0 and TIMSK0 are not shown in the figure.
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source onthe T0 pin. The Clock Select logic block controls which clock source and edge the Timer/Counteruses to increment (or decrement) its value. The Timer/Counter is inactive when no clock sourceis selected. The output from the Clock Select logic is referred to as the timer clock (clkT0).
Timer/Counter
DAT
A B
US
=
TCNTn
WaveformGeneration
OCn
= 0
Control Logic
= 0xFF
BOTTOM
count
clear
direction
TOVn(Int.Req.)
OCRn
TCCRn
Clock Select
TnEdge
Detector
( From Prescaler )
clkTn
TOP
OCn(Int.Req.)
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The double buffered Output Compare Register (OCR0A) is compared with the Timer/Countervalue at all times. The result of the compare can be used by the Waveform Generator to gener-ate a PWM or variable frequency output on the Output Compare pin (OC0A). See ”OutputCompare Unit” on page 93. for details. The compare match event will also set the Compare Flag(OCF0A) which can be used to generate an Output Compare interrupt request.
14.2.2 Definitions
Many register and bit references in this section are written in general form. A lower case “n”replaces the Timer/Counter number, in this case 0. A lower case “x” replaces the Output Com-pare unit number, in this case unit A. However, when using the register or bit defines in aprogram, the precise form must be used, that is, TCNT0 for accessing Timer/Counter0 countervalue and so on.
The definitions in Table 14-1 are also used extensively throughout the document.
14.3 Timer/Counter Clock Sources
The Timer/Counter can be clocked by an internal or an external clock source. The clock sourceis selected by the Clock Select logic which is controlled by the Clock Select (CS02:0) bitslocated in the Timer/Counter Control Register (TCCR0A). For details on clock sources and pres-caler, see ”Timer/Counter0 and Timer/Counter1 Prescalers” on page 135.
14.4 Counter Unit
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure14-2 shows a block diagram of the counter and its surroundings.
Figure 14-2. Counter Unit Block Diagram
Table 14-1. Timer/Counter Definitions
BOTTOM The counter reaches the BOTTOM when it becomes 0x00.
MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255).
TOP The counter reaches the TOP when it becomes equal to the highest value in thecount sequence. The TOP value can be assigned to be the fixed value 0xFF(MAX) or the value stored in the OCR0A Register. The assignment is dependenton the mode of operation.
DATA BUS
TCNTn Control Logic
count
TOVn(Int.Req.)
Clock Select
top
TnEdge
Detector
( From Prescaler )
clkTn
bottom
direction
clear
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Signal description (internal signals):
count Increment or decrement TCNT0 by 1.
direction Select between increment and decrement.
clear Clear TCNT0 (set all bits to zero).
clkTn Timer/Counter clock, referred to as clkT0 in the following.
top Signalize that TCNT0 has reached maximum value.
bottom Signalize that TCNT0 has reached minimum value (zero).
Depending of the mode of operation used, the counter is cleared, incremented, or decrementedat each timer clock (clkT0). clkT0 can be generated from an external or internal clock source,selected by the Clock Select bits (CS02:0). When no clock source is selected (CS02:0 = 0) thetimer is stopped. However, the TCNT0 value can be accessed by the CPU, regardless ofwhether clkT0 is present or not. A CPU write overrides (has priority over) all counter clear orcount operations.
The counting sequence is determined by the setting of the WGM01 and WGM00 bits located inthe Timer/Counter Control Register (TCCR0A). There are close connections between how thecounter behaves (counts) and how waveforms are generated on the Output Compare outputOC0A. For more details about advanced counting sequences and waveform generation, see”Modes of Operation” on page 96.
The Timer/Counter Overflow Flag (TOV0) is set according to the mode of operation selected bythe WGM01:0 bits. TOV0 can be used for generating a CPU interrupt.
14.5 Output Compare Unit
The 8-bit comparator continuously compares TCNT0 with the Output Compare Register(OCR0A). Whenever TCNT0 equals OCR0A, the comparator signals a match. A match will setthe Output Compare Flag (OCF0A) at the next timer clock cycle. If enabled (OCIE0A = 1 andGlobal Interrupt Flag in SREG is set), the Output Compare Flag generates an Output Compareinterrupt. The OCF0A Flag is automatically cleared when the interrupt is executed. Alternatively,the OCF0A Flag can be cleared by software by writing a logical one to its I/O bit location. TheWaveform Generator uses the match signal to generate an output according to operating modeset by the WGM01:0 bits and Compare Output mode (COM0A1:0) bits. The max and bottom sig-nals are used by the Waveform Generator for handling the special cases of the extreme valuesin some modes of operation (See ”Modes of Operation” on page 96.).
Figure 14-3 on page 94 shows a block diagram of the Output Compare unit.
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Figure 14-3. Output Compare Unit, Block Diagram
The OCR0A Register is double buffered when using any of the Pulse Width Modulation (PWM)modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the double buff-ering is disabled. The double buffering synchronizes the update of the OCR0 Compare Registerto either top or bottom of the counting sequence. The synchronization prevents the occurrenceof odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.
The OCR0A Register access may seem complex, but this is not case. When the double buffer-ing is enabled, the CPU has access to the OCR0A Buffer Register, and if double buffering isdisabled the CPU will access the OCR0A directly.
14.5.1 Force Output Compare
In non-PWM waveform generation modes, the match output of the comparator can be forced bywriting a one to the Force Output Compare (FOC0A) bit. Forcing compare match will not set theOCF0A Flag or reload/clear the timer, but the OC0A pin will be updated as if a real comparematch had occurred (the COM0A1:0 bits settings define whether the OC0A pin is set, cleared ortoggled).
14.5.2 Compare Match Blocking by TCNT0 Write
All CPU write operations to the TCNT0 Register will block any compare match that occur in thenext timer clock cycle, even when the timer is stopped. This feature allows OCR0A to be initial-ized to the same value as TCNT0 without triggering an interrupt when the Timer/Counter clock isenabled.
OCFnx (Int.Req.)
= (8-bit Comparator )
OCRnx
OCnx
DATA BUS
TCNTn
WGMn1:0
Waveform Generator
top
FOCn
COMnx1:0
bottom
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14.5.3 Using the Output Compare Unit
Since writing TCNT0 in any mode of operation will block all compare matches for one timer clockcycle, there are risks involved when changing TCNT0 when using the Output Compare unit,independently of whether the Timer/Counter is running or not. If the value written to TCNT0equals the OCR0A value, the compare match will be missed, resulting in incorrect waveformgeneration. Similarly, do not write the TCNT0 value equal to BOTTOM when the counter is downcounting.
The setup of the OC0A should be performed before setting the Data Direction Register for theport pin to output. The easiest way of setting the OC0A value is to use the Force Output Com-pare (FOC0A) strobe bits in Normal mode. The OC0A Register keeps its value even whenchanging between Waveform Generation modes.
Be aware that the COM0A1:0 bits are not double buffered together with the compare value.Changing the COM0A1:0 bits will take effect immediately.
14.6 Compare Match Output Unit
The Compare Output mode (COM0A1:0) bits have two functions. The Waveform Generatoruses the COM0A1:0 bits for defining the Output Compare (OC0A) state at the next comparematch. Also, the COM0A1:0 bits control the OC0A pin output source. Figure 14-4 shows a sim-plified schematic of the logic affected by the COM0A1:0 bit setting. The I/O Registers, I/O bits,and I/O pins in the figure are shown in bold. Only the parts of the general I/O port control regis-ters (DDR and PORT) that are affected by the COM0A1:0 bits are shown. When referring to theOC0A state, the reference is for the internal OC0A Register, not the OC0A pin. If a SystemReset occur, the OC0A Register is reset to “0”.
Figure 14-4. Compare Match Output Unit, Schematic
The general I/O port function is overridden by the Output Compare (OC0A) from the WaveformGenerator if either of the COM0A1:0 bits are set. However, the OC0A pin direction (input or out-put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data DirectionRegister bit for the OC0A pin (DDR_OC0A) must be set as output before the OC0A value is vis-ible on the pin. The port override function is independent of the Waveform Generation mode.
PORT
DDR
D Q
D Q
OCnPinOCnx
D QWaveformGenerator
COMnx1
COMnx0
0
1
DAT
A B
US
FOCn
clkI/O
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The design of the Output Compare pin logic allows initialization of the OC0A state before theoutput is enabled. Note that some COM0A1:0 bit settings are reserved for certain modes ofoperation. See ”8-bit Timer/Counter Register Description” on page 102.
14.6.1 Compare Output Mode and Waveform Generation
The Waveform Generator uses the COM0A1:0 bits differently in Normal, CTC, and PWMmodes. For all modes, setting the COM0A1:0 = 0 tells the Waveform Generator that no action onthe OC0A Register is to be performed on the next compare match. For compare output actionsin the non-PWM modes refer to Table 14-3 on page 103. For fast PWM mode, refer to Table 14-4 on page 103, and for phase correct PWM refer to Table 14-5 on page 103.
A change of the COM0A1:0 bits state will have effect at the first compare match after the bits arewritten. For non-PWM modes, the action can be forced to have immediate effect by using theFOC0A strobe bits.
14.7 Modes of Operation
The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins,is defined by the combination of the Waveform Generation mode (WGM01:0) and Compare Out-put mode (COM0A1:0) bits. The Compare Output mode bits do not affect the countingsequence, while the Waveform Generation mode bits do. The COM0A1:0 bits control whetherthe PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM0A1:0 bits control whether the output should be set, cleared, or toggled ata compare match (See ”Compare Match Output Unit” on page 95.).
For detailed timing information refer to Figure 14-8, Figure 14-9, Figure 14-10 and Figure 14-11in ”Timer/Counter Timing Diagrams” on page 100.
14.7.1 Normal Mode
The simplest mode of operation is the Normal mode (WGM01:0 = 0). In this mode the countingdirection is always up (incrementing), and no counter clear is performed. The counter simplyoverruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bot-tom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV0) will be set in the sametimer clock cycle as the TCNT0 becomes zero. The TOV0 Flag in this case behaves like a ninthbit, except that it is only set, not cleared. However, combined with the timer overflow interruptthat automatically clears the TOV0 Flag, the timer resolution can be increased by software.There are no special cases to consider in the Normal mode, a new counter value can be writtenanytime.
The Output Compare unit can be used to generate interrupts at some given time. Using the Out-put Compare to generate waveforms in Normal mode is not recommended, since this willoccupy too much of the CPU time.
14.7.2 Clear Timer on Compare Match (CTC) Mode
In Clear Timer on Compare or CTC mode (WGM01:0 = 2), the OCR0A Register is used tomanipulate the counter resolution. In CTC mode the counter is cleared to zero when the countervalue (TCNT0) matches the OCR0A. The OCR0A defines the top value for the counter, hencealso its resolution. This mode allows greater control of the compare match output frequency. Italso simplifies the operation of counting external events.
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The timing diagram for the CTC mode is shown in Figure 14-5. The counter value (TCNT0)increases until a compare match occurs between TCNT0 and OCR0A, and then counter(TCNT0) is cleared.
Figure 14-5. CTC Mode, Timing Diagram
An interrupt can be generated each time the counter value reaches the TOP value by using theOCF0A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updatingthe TOP value. However, changing TOP to a value close to BOTTOM when the counter is run-ning with none or a low prescaler value must be done with care since the CTC mode does nothave the double buffering feature. If the new value written to OCR0A is lower than the currentvalue of TCNT0, the counter will miss the compare match. The counter will then have to count toits maximum value (0xFF) and wrap around starting at 0x00 before the compare match canoccur.
For generating a waveform output in CTC mode, the OC0A output can be set to toggle its logicallevel on each compare match by setting the Compare Output mode bits to toggle mode(COM0A1:0 = 1). The OC0A value will not be visible on the port pin unless the data direction forthe pin is set to output. The waveform generated will have a maximum frequency of fOC0 =fclk_I/O/2 when OCR0A is set to zero (0x00). The waveform frequency is defined by the followingequation:
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle that thecounter counts from MAX to 0x00.
14.7.3 Fast PWM Mode
The fast Pulse Width Modulation or fast PWM mode (WGM01:0 = 3) provides a high frequencyPWM waveform generation option. The fast PWM differs from the other PWM option by its sin-gle-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. Innon-inverting Compare Output mode, the Output Compare (OC0A) is cleared on the comparematch between TCNT0 and OCR0A, and set at BOTTOM. In inverting Compare Output mode,the output is set on compare match and cleared at BOTTOM. Due to the single-slope operation,the operating frequency of the fast PWM mode can be twice as high as the phase correct PWMmode that use dual-slope operation. This high frequency makes the fast PWM mode well suitedfor power regulation, rectification, and DAC applications. High frequency allows physically smallsized external components (coils, capacitors), and therefore reduces total system cost.
TCNTn
OCn(Toggle)
OCnx Interrupt Flag Set
1 4Period 2 3
(COMnx1:0 = 1)
fOCnxfclk_I/O
2 N 1 OCRnx+( )⋅ ⋅--------------------------------------------------=
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In fast PWM mode, the counter is incremented until the counter value matches the MAX value.The counter is then cleared at the following timer clock cycle. The timing diagram for the fastPWM mode is shown in Figure 14-6. The TCNT0 value is in the timing diagram shown as a his-togram for illustrating the single-slope operation. The diagram includes non-inverted andinverted PWM outputs. The small horizontal line marks on the TCNT0 slopes represent comparematches between OCR0A and TCNT0.
Figure 14-6. Fast PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches MAX. If the inter-rupt is enabled, the interrupt handler routine can be used for updating the compare value.
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC0A pin.Setting the COM0A1:0 bits to two will produce a non-inverted PWM and an inverted PWM outputcan be generated by setting the COM0A1:0 to three (See Table 14-4 on page 103). The actualOC0A value will only be visible on the port pin if the data direction for the port pin is set as out-put. The PWM waveform is generated by setting (or clearing) the OC0A Register at the comparematch between OCR0A and TCNT0, and clearing (or setting) the OC0A Register at the timerclock cycle the counter is cleared (changes from MAX to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
The extreme values for the OCR0A Register represents special cases when generating a PWMwaveform output in the fast PWM mode. If the OCR0A is set equal to BOTTOM, the output willbe a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0A equal to MAX will resultin a constantly high or low output (depending on the polarity of the output set by the COM0A1:0bits).
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-ting OC0A to toggle its logical level on each compare match (COM0A1:0 = 1). The waveformgenerated will have a maximum frequency of fOC0 = fclk_I/O/2 when OCR0A is set to zero. This
TCNTn
OCRnx Update andTOVn Interrupt Flag Set
1Period 2 3
OCn
OCn
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Interrupt Flag Set
4 5 6 7
fOCnxPWMfclk_I/O
N 256⋅------------------=
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feature is similar to the OC0A toggle in CTC mode, except the double buffer feature of the Out-put Compare unit is enabled in the fast PWM mode.
14.7.4 Phase Correct PWM Mode
The phase correct PWM mode (WGM01:0 = 1) provides a high resolution phase correct PWMwaveform generation option. The phase correct PWM mode is based on a dual-slope operation.The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC0A) is cleared on the compare matchbetween TCNT0 and OCR0A while upcounting, and set on the compare match while down-counting. In inverting Output Compare mode, the operation is inverted. The dual-slope operationhas lower maximum operation frequency than single slope operation. However, due to the sym-metric feature of the dual-slope PWM modes, these modes are preferred for motor controlapplications.
The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correctPWM mode the counter is incremented until the counter value matches MAX. When the counterreaches MAX, it changes the count direction. The TCNT0 value will be equal to MAX for onetimer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 14-7.The TCNT0 value is in the timing diagram shown as a histogram for illustrating the dual-slopeoperation. The diagram includes non-inverted and inverted PWM outputs. The small horizontalline marks on the TCNT0 slopes represent compare matches between OCR0A and TCNT0.
Figure 14-7. Phase Correct PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOTTOM. TheInterrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOMvalue.
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on theOC0A pin. Setting the COM0A1:0 bits to two will produce a non-inverted PWM. An invertedPWM output can be generated by setting the COM0A1:0 to three (See Table 14-5 on page 103).The actual OC0A value will only be visible on the port pin if the data direction for the port pin is
TOVn Interrupt Flag Set
OCnx Interrupt Flag Set
1 2 3
TCNTn
Period
OCn
OCn
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Update
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set as output. The PWM waveform is generated by clearing (or setting) the OC0A Register at thecompare match between OCR0A and TCNT0 when the counter increments, and setting (orclearing) the OC0A Register at compare match between OCR0A and TCNT0 when the counterdecrements. The PWM frequency for the output when using phase correct PWM can be calcu-lated by the following equation:
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
The extreme values for the OCR0A Register represent special cases when generating a PWMwaveform output in the phase correct PWM mode. If the OCR0A is set equal to BOTTOM, theoutput will be continuously low and if set equal to MAX the output will be continuously high fornon-inverted PWM mode. For inverted PWM the output will have the opposite logic values.
At the very start of period 2 in Figure 14-7 on page 99 OCn has a transition from high to loweven though there is no Compare Match. The point of this transition is to guarantee symmetryaround BOTTOM. There are two cases that give a transition without Compare Match.
• OCR0A changes its value from MAX, like in Figure 14-7 on page 99. When the OCR0A value is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match.
• The timer starts counting from a value higher than the one in OCR0A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up.
14.8 Timer/Counter Timing Diagrams
The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore shown as aclock enable signal in the following figures. The figures include information on when InterruptFlags are set. Figure 14-8 contains timing data for basic Timer/Counter operation. The figureshows the count sequence close to the MAX value in all modes other than phase correct PWMmode.
Figure 14-8. Timer/Counter Timing Diagram, no Prescaling
Figure 14-9 on page 101 shows the same timing data, but with the prescaler enabled.
fOCnxPCPWMfclk_I/O
N 510⋅------------------=
clkTn(clkI/O/1)
TOVn
clkI/O
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
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Figure 14-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)
Figure 14-10 shows the setting of OCF0A in all modes except CTC mode.
Figure 14-10. Timer/Counter Timing Diagram, Setting of OCF0A, with Prescaler (fclk_I/O/8)
Figure 14-11 shows the setting of OCF0A and the clearing of TCNT0 in CTC mode.
Figure 14-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Pres-caler (fclk_I/O/8)
TOVn
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
clkI/O
clkTn(clkI/O/8)
OCFnx
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
clkI/O
clkTn(clkI/O/8)
OCFnx
OCRnx
TCNTn(CTC)
TOP
TOP - 1 TOP BOTTOM BOTTOM + 1
clkI/O
clkTn(clkI/O/8)
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14.9 8-bit Timer/Counter Register Description
14.9.1 TCCR0A – Timer/Counter Control Register A
• Bit 7 – FOC0A: Force Output Compare AThe FOC0A bit is only active when the WGM00 bit specifies a non-PWM mode. However, forensuring compatibility with future devices, this bit must be set to zero when TCCR0A is writtenwhen operating in PWM mode. When writing a logical one to the FOC0A bit, an immediate com-pare match is forced on the Waveform Generation unit. The OC0A output is changed accordingto its COM0A1:0 bits setting. Note that the FOC0A bit is implemented as a strobe. Therefore it isthe value present in the COM0A1:0 bits that determines the effect of the forced compare.
A FOC0A strobe will not generate any interrupt, nor will it clear the timer in CTC mode usingOCR0A as TOP.
The FOC0A bit is always read as zero.
• Bit 6, 3 – WGM01:0: Waveform Generation ModeThese bits control the counting sequence of the counter, the source for the maximum (TOP)counter value, and what type of waveform generation to be used. Modes of operation supportedby the Timer/Counter unit are: Normal mode, Clear Timer on Compare match (CTC) mode, andtwo types of Pulse Width Modulation (PWM) modes. See Table 14-2 and ”Modes of Operation”on page 96.
Note: 1. The CTC0 and PWM0 bit definition names are now obsolete. Use the WGM01:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer.
• Bit 5:4 – COM0A1:0: Compare Match Output ModeThese bits control the Output Compare pin (OC0A) behavior. If one or both of the COM0A1:0bits are set, the OC0A output overrides the normal port functionality of the I/O pin it is connectedto. However, note that the Data Direction Register (DDR) bit corresponding to the OC0A pinmust be set in order to enable the output driver.
Bit 7 6 5 4 3 2 1 0
0x24 (0x44) FOC0A WGM00 COM0A1 COM0A0 WGM01 CS02 CS01 CS00 TCCR0A
Read/Write W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 14-2. Waveform Generation Mode Bit Description()
ModeWGM01(CTC0)
WGM00(PWM0)
Timer/Counter Mode of Operation TOP
Update of OCR0A at
TOV0 Flag Set on
0 0 0 Normal 0xFF Immediate MAX
1 0 1 PWM, Phase Correct 0xFF TOP BOTTOM
2 1 0 CTC OCR0A Immediate MAX
3 1 1 Fast PWM 0xFF BOTTOM MAX
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When OC0A is connected to the pin, the function of the COM0A1:0 bits depends on theWGM01:0 bit setting. Table 14-3 shows the COM0A1:0 bit functionality when the WGM01:0 bitsare set to a normal or CTC mode (non-PWM).
Table 14-4 shows the COM0A1:0 bit functionality when the WGM01:0 bits are set to fast PWMmode.
Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the com-pare match is ignored, but the set or clear is done at BOTTOM. See ”Fast PWM Mode” on page 97 for more details.
Table 14-5 shows the COM0A1:0 bit functionality when the WGM01:0 bits are set to phase cor-rect PWM mode.
Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the com-pare match is ignored, but the set or clear is done at TOP. See ”Phase Correct PWM Mode” on page 99 for more details.
• Bit 2:0 – CS02:0: Clock SelectThe three Clock Select bits select the clock source to be used by the Timer/Counter.
Table 14-3. Compare Output Mode, non-PWM Mode
COM0A1 COM0A0 Description
0 0 Normal port operation, OC0A disconnected.
0 1 Toggle OC0A on compare match
1 0 Clear OC0A on compare match
1 1 Set OC0A on compare match
Table 14-4. Compare Output Mode, Fast PWM Mode(1)
COM0A1 COM0A0 Description
0 0 Normal port operation, OC0A disconnected.
0 1 Reserved
1 0Clear OC0A on compare match, set OC0A at BOTTOM(non-inverting mode)
1 1Set OC0A on compare match, clear OC0A at BOTTOM(inverting mode)
Table 14-5. Compare Output Mode, Phase Correct PWM Mode(1)
COM0A1 COM0A0 Description
0 0 Normal port operation, OC0A disconnected.
0 1 Reserved
1 0Clear OC0A on compare match when up-counting. Set OC0A on compare match when down counting.
1 1Set OC0A on compare match when up-counting. Clear OC0A on compare match when down counting.
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If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock thecounter even if the pin is configured as an output. This feature allows software control of thecounting.
14.9.2 TCNT0 – Timer/Counter Register
The Timer/Counter Register gives direct access, both for read and write operations, to theTimer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes) the comparematch on the following timer clock. Modifying the counter (TCNT0) while the counter is running,introduces a risk of missing a compare match between TCNT0 and the OCR0A Register.
14.9.3 OCR0A – Output Compare Register A
The Output Compare Register A contains an 8-bit value that is continuously compared with thecounter value (TCNT0). A match can be used to generate an Output Compare interrupt, or togenerate a waveform output on the OC0A pin.
14.9.4 TIMSK0 – Timer/Counter 0 Interrupt Mask Register
Table 14-6. Clock Select Bit Description
CS02 CS01 CS00 Description
0 0 0 No clock source (Timer/Counter stopped)
0 0 1 clkI/O/(No prescaling)
0 1 0 clkI/O/8 (From prescaler)
0 1 1 clkI/O/64 (From prescaler)
1 0 0 clkI/O/256 (From prescaler)
1 0 1 clkI/O/1024 (From prescaler)
1 1 0 External clock source on T0 pin. Clock on falling edge.
1 1 1 External clock source on T0 pin. Clock on rising edge.
Bit 7 6 5 4 3 2 1 0
0x26 (0x46) TCNT0[7:0] TCNT0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x27 (0x47) OCR0A[7:0] OCR0A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0x6E) – – – – – – OCIE0A TOIE0 TIMSK0
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 1 – OCIE0A: Timer/Counter0 Output Compare Match A Interrupt EnableWhen the OCIE0A bit is written to one, and the I-bit in the Status Register is set (one), theTimer/Counter0 Compare Match A interrupt is enabled. The corresponding interrupt is executedif a compare match in Timer/Counter0 occurs, that is, when the OCF0A bit is set in theTimer/Counter 0 Interrupt Flag Register – TIFR0.
• Bit 0 – TOIE0: Timer/Counter0 Overflow Interrupt EnableWhen the TOIE0 bit is written to one, and the I-bit in the Status Register is set (one), theTimer/Counter0 Overflow interrupt is enabled. The corresponding interrupt is executed if anoverflow in Timer/Counter0 occurs, that is, when the TOV0 bit is set in the Timer/Counter 0 Inter-rupt Flag Register – TIFR0.
14.9.5 TIFR0 – Timer/Counter 0 Interrupt Flag Register
• Bit 1 – OCF0A: Output Compare Flag 0 AThe OCF0A bit is set (one) when a compare match occurs between the Timer/Counter0 and thedata in OCR0A – Output Compare Register0. OCF0A is cleared by hardware when executingthe corresponding interrupt handling vector. Alternatively, OCF0A is cleared by writing a logicone to the flag. When the I-bit in SREG, OCIE0A (Timer/Counter0 Compare match InterruptEnable), and OCF0A are set (one), the Timer/Counter0 Compare match Interrupt is executed.
• Bit 0 – TOV0: Timer/Counter0 Overflow FlagThe bit TOV0 is set (one) when an overflow occurs in Timer/Counter0. TOV0 is cleared by hard-ware when executing the corresponding interrupt handling vector. Alternatively, TOV0 is clearedby writing a logic one to the flag. When the SREG I-bit, TOIE0 (Timer/Counter0 Overflow Inter-rupt Enable), and TOV0 are set (one), the Timer/Counter0 Overflow interrupt is executed. Inphase correct PWM mode, this bit is set when Timer/Counter0 changes counting direction at0x00.
Bit 7 6 5 4 3 2 1 0
0x15 (0x35) – – – – – – OCF0A TOV0 TIFR0
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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15. 16-bit Timer/Counter1
15.1 Features
• True 16-bit Design (that is, allows 16-bit PWM)• Two independent Output Compare Units• Double Buffered Output Compare Registers• One Input Capture Unit• Input Capture Noise Canceler• Clear Timer on Compare Match (Auto Reload)• Glitch-free, Phase Correct Pulse Width Modulator (PWM)• Variable PWM Period• Frequency Generator• External Event Counter• Four independent interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1)
15.2 Overview
The 16-bit Timer/Counter unit allows accurate program execution timing (event management),wave generation, and signal timing measurement. Most register and bit references in this sec-tion are written in general form. A lower case “n” replaces the Timer/Counter number, and alower case “x” replaces the Output Compare unit number. However, when using the register orbit defines in a program, the precise form must be used, that is, TCNT1 for accessingTimer/Counter1 counter value and so on.
A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 15-1 on page 107. Forthe actual placement of I/O pins, refer to Figure 1-1 on page 2. CPU accessible I/O Registers,including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-tions are listed in the Section 15.11 ”16-bit Timer/Counter Register Description” on page 128.
The PRTIM1 bit in Section 9.9.2 ”PRR – Power Reduction Register” on page 45 must be writtento zero to enable Timer/Counter1 module.
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Figure 15-1. 16-bit Timer/Counter Block Diagram(1)
Note: 1. Refer to Figure 1-1 on page 2, Table 13-5 on page 74, and Table 13-11 on page 78 for Timer/Counter1 pin placement and description.
15.2.1 Registers
The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Regis-ter (ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16-bit registers. These procedures are described in the section ”Accessing 16-bit Registers” onpage 109. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have noCPU access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are allvisible in the Timer Interrupt Flag Register (TIFR1). All interrupts are individually masked withthe Timer Interrupt Mask Register (TIMSK1). TIFR1 and TIMSK1 are not shown in the figure.
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source onthe T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counteruses to increment (or decrement) its value. The Timer/Counter is inactive when no clock sourceis selected. The output from the Clock Select logic is referred to as the timer clock (clkT1).
The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Coun-ter value at all time. The result of the compare can be used by the Waveform Generator togenerate a PWM or variable frequency output on the Output Compare pin (OC1A/B). See ”Out-
Clock Select
Timer/CounterD
ATA
BU
S
OCRnA
OCRnB
ICRn
=
=
TCNTn
WaveformGeneration
WaveformGeneration
OCnA
OCnB
NoiseCanceler
ICPn
=
FixedTOP
Values
EdgeDetector
Control Logic
= 0
TOP BOTTOM
Count
Clear
Direction
TOVn(Int.Req.)
OCnA(Int.Req.)
OCnB(Int.Req.)
ICFn (Int.Req.)
TCCRnA TCCRnB
( From AnalogComparator Ouput )
TnEdge
Detector
( From Prescaler )
clkTn
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put Compare Units” on page 115. The compare match event will also set the Compare MatchFlag (OCF1A/B) which can be used to generate an Output Compare interrupt request.
The Input Capture Register can capture the Timer/Counter value at a given external (edge trig-gered) event on either the Input Capture pin (ICP1) or on the Analog Comparator pins (See ”AC- Analog Comparator” on page 212.) The Input Capture unit includes a digital filtering unit (NoiseCanceler) for reducing the chance of capturing noise spikes.
The TOP value, or maximum Timer/Counter value, can in some modes of operation be definedby either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When usingOCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating aPWM output. However, the TOP value will in this case be double buffered allowing the TOPvalue to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be usedas an alternative, freeing the OCR1A to be used as PWM output.
15.2.2 Definitions
The following definitions are used extensively throughout the section:
15.2.3 Compatibility
The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bitAVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier versionregarding:
• All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt Registers.
• Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers.
• Interrupt Vectors.
The following control bits have changed name, but have same functionality and register location:
• PWM10 is changed to WGM10.
• PWM11 is changed to WGM11.
• CTC1 is changed to WGM12.
The following bits are added to the 16-bit Timer/Counter Control Registers:
• FOC1A and FOC1B are added to TCCR1C.
• WGM13 is added to TCCR1B.
The 16-bit Timer/Counter has improvements that will affect the compatibility in some specialcases.
BOTTOM The counter reaches the BOTTOM when it becomes 0x0000.
MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535).
TOP
The counter reaches the TOP when it becomes equal to the highest value in the count sequence. The TOP value can be assigned to be one of the fixed values: 0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCR1A or ICR1 Register. The assignment is dependent of the mode of operation.
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15.3 Accessing 16-bit Registers
The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU viathe 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations.Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16-bitaccess. The same temporary register is shared between all 16-bit registers within each 16-bittimer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a16-bit register is written by the CPU, the high byte stored in the temporary register, and the lowbyte written are both copied into the 16-bit register in the same clock cycle. When the low byte ofa 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the tempo-rary register in the same clock cycle as the low byte is read.
Not all 16-bit accesses uses the temporary register for the high byte. Reading the OCR1A/B 16-bit registers does not involve using the temporary register.
To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the lowbyte must be read before the high byte.
The following code examples show how to access the 16-bit Timer Registers assuming that nointerrupts updates the temporary register. The same principle can be used directly for accessingthe OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bitaccess.
Note: 1. See ”About Code Examples” on page 10.
The assembly code example returns the TCNT1 value in the r17:r16 register pair.
It is important to notice that accessing 16-bit registers are atomic operations. If an interruptoccurs between the two instructions accessing the 16-bit register, and the interrupt codeupdates the temporary register by accessing the same or any other of the 16-bit Timer Regis-ters, then the result of the access outside the interrupt will be corrupted. Therefore, when both
Assembly Code Examples(1)
...
; Set TCNT1 to 0x01FFldi r17,0x01
ldi r16,0xFF
out TCNT1H,r17out TCNT1L,r16; Read TCNT1 into r17:r16in r16,TCNT1Lin r17,TCNT1H...
C Code Examples(1)
unsigned int i;
...
/* Set TCNT1 to 0x01FF */TCNT1 = 0x1FF;/* Read TCNT1 into i */i = TCNT1;...
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the main code and the interrupt code update the temporary register, the main code must disablethe interrupts during the 16-bit access.
The following code examples show how to do an atomic read of the TCNT1 Register contents.Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle.
Note: 1. See ”About Code Examples” on page 10.
The assembly code example returns the TCNT1 value in the r17:r16 register pair.
Assembly Code Example(1)
TIM16_ReadTCNT1:; Save global interrupt flag
in r18,SREG
; Disable interrupts
cli
; Read TCNT1 into r17:r16in r16,TCNT1Lin r17,TCNT1H; Restore global interrupt flag
out SREG,r18
ret
C Code Example(1)
unsigned int TIM16_ReadTCNT1( void ){
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Read TCNT1 into i */i = TCNT1;/* Restore global interrupt flag */
SREG = sreg;
return i;
}
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The following code examples show how to do an atomic write of the TCNT1 Register contents.Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle.
Note: 1. See ”About Code Examples” on page 10.
The assembly code example requires that the r17:r16 register pair contains the value to be writ-ten to TCNT1.
15.3.1 Reusing the Temporary High Byte Register
If writing to more than one 16-bit register where the high byte is the same for all registers written,then the high byte only needs to be written once. However, note that the same rule of atomicoperation described previously also applies in this case.
15.4 Timer/Counter Clock Sources
The Timer/Counter can be clocked by an internal or an external clock source. The clock sourceis selected by the Clock Select logic which is controlled by the Clock Select (CS12:0) bitslocated in the Timer/Counter control Register B (TCCR1B). For details on clock sources andprescaler, see ”Timer/Counter0 and Timer/Counter1 Prescalers” on page 135.
Assembly Code Example(1)
TIM16_WriteTCNT1:; Save global interrupt flag
in r18,SREG
; Disable interrupts
cli
; Set TCNT1 to r17:r16out TCNT1H,r17out TCNT1L,r16; Restore global interrupt flag
out SREG,r18
ret
C Code Example(1)
void TIM16_WriteTCNT1( unsigned int i ){
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Set TCNT1 to i */TCNT1 = i;/* Restore global interrupt flag */
SREG = sreg;
}
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15.5 Counter Unit
The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit.Figure 15-2 shows a block diagram of the counter and its surroundings.
Figure 15-2. Counter Unit Block Diagram
Signal description (internal signals):
Count Increment or decrement TCNT1 by 1.
Direction Select between increment and decrement.
Clear Clear TCNT1 (set all bits to zero).
clkT1 Timer/Counter clock.
TOP Signalize that TCNT1 has reached maximum value.
BOTTOM Signalize that TCNT1 has reached minimum value (zero).
The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNT1H) con-taining the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eightbits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does anaccess to the TCNT1H I/O location, the CPU accesses the high byte temporary register (TEMP).The temporary register is updated with the TCNT1H value when the TCNT1L is read, andTCNT1H is updated with the temporary register value when TCNT1L is written. This allows theCPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus.It is important to notice that there are special cases of writing to the TCNT1 Register when thecounter is counting that will give unpredictable results. The special cases are described in thesections where they are of importance.
Depending on the mode of operation used, the counter is cleared, incremented, or decrementedat each timer clock (clkT1). The clkT1 can be generated from an external or internal clock source,selected by the Clock Select bits (CS12:0). When no clock source is selected (CS12:0 = 0) thetimer is stopped. However, the TCNT1 value can be accessed by the CPU, independent ofwhether clkT1 is present or not. A CPU write overrides (has priority over) all counter clear orcount operations.
The counting sequence is determined by the setting of the Waveform Generation mode bits(WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B).There are close connections between how the counter behaves (counts) and how waveformsare generated on the Output Compare outputs OC1x. For more details about advanced countingsequences and waveform generation, see ”Modes of Operation” on page 118.
TEMP (8-bit)
DATA BUS (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit)Control Logic
Count
Clear
Direction
TOVn(Int.Req.)
Clock Select
TOP BOTTOM
TnEdge
Detector
( From Prescaler )
clkTn
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The Timer/Counter Overflow Flag (TOV1) is set according to the mode of operation selected bythe WGM13:0 bits. TOV1 can be used for generating a CPU interrupt.
15.6 Input Capture Unit
The Timer/Counter incorporates an Input Capture unit that can capture external events and givethem a time-stamp indicating time of occurrence. The external signal indicating an event, or mul-tiple events, can be applied via the ICP1 pin or alternatively, via the analog-comparator unit. Thetime-stamps can then be used to calculate frequency, duty-cycle, and other features of the sig-nal applied. Alternatively the time-stamps can be used for creating a log of the events.
The Input Capture unit is illustrated by the block diagram shown in Figure 15-3. The elements ofthe block diagram that are not directly a part of the Input Capture unit are gray shaded. Thesmall “n” in register and bit names indicates the Timer/Counter number.
Figure 15-3. Input Capture Unit Block Diagram
When a change of the logic level (an event) occurs on the Input Capture pin (ICP1), alternativelyon the Analog Comparator output (ACO), and this change confirms to the setting of the edgedetector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter(TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set atthe same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (ICIE1 = 1),the Input Capture Flag generates an Input Capture interrupt. The ICF1 Flag is automaticallycleared when the interrupt is executed. Alternatively the ICF1 Flag can be cleared by softwareby writing a logical one to its I/O bit location.
Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the lowbyte (ICR1L) and then the high byte (ICR1H). When the low byte is read the high byte is copiedinto the high byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it willaccess the TEMP Register.
The ICR1 Register can only be written when using a Waveform Generation mode that utilizesthe ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Genera-
ICFn (Int.Req.)
AnalogComparator
WRITE ICRn (16-bit Register)
ICRnH (8-bit)
NoiseCanceler
ICPn
EdgeDetector
TEMP (8-bit)
DATA BUS (8-bit)
ICRnL (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit)
ACIC* ICNC ICESACO*
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tion mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1Register. When writing the ICR1 Register the high byte must be written to the ICR1H I/O locationbefore the low byte is written to ICR1L.
For more information on how to access the 16-bit registers refer to ”Accessing 16-bit Registers”on page 109.
15.6.1 Input Capture Trigger Source
The main trigger source for the Input Capture unit is the Input Capture pin (ICP1).Timer/Counter1 can alternatively use the Analog Comparator output as trigger source for theInput Capture unit. The Analog Comparator is selected as trigger source by setting the AnalogComparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register(ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flagmust therefore be cleared after the change.
Both the Input Capture pin (ICP1) and the Analog Comparator output (ACO) inputs are sampledusing the same technique as for the T1 pin (Figure 16-1 on page 135). The edge detector is alsoidentical. However, when the noise canceler is enabled, additional logic is inserted before theedge detector, which increases the delay by four system clock cycles. Note that the input of thenoise canceler and edge detector is always enabled unless the Timer/Counter is set in a Wave-form Generation mode that uses ICR1 to define TOP.
An Input Capture can be triggered by software by controlling the port of the ICP1 pin.
15.6.2 Noise Canceler
The noise canceler improves noise immunity by using a simple digital filtering scheme. Thenoise canceler input is monitored over four samples, and all four must be equal for changing theoutput that in turn is used by the edge detector.
The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit inTimer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces addi-tional four system clock cycles of delay from a change applied to the input, to the update of theICR1 Register. The noise canceler uses the system clock and is therefore not affected by theprescaler.
15.6.3 Using the Input Capture Unit
The main challenge when using the Input Capture unit is to assign enough processor capacityfor handling the incoming events. The time between two events is critical. If the processor hasnot read the captured value in the ICR1 Register before the next event occurs, the ICR1 will beoverwritten with a new value. In this case the result of the capture will be incorrect.
When using the Input Capture interrupt, the ICR1 Register should be read as early in the inter-rupt handler routine as possible. Even though the Input Capture interrupt has relatively highpriority, the maximum interrupt response time is dependent on the maximum number of clockcycles it takes to handle any of the other interrupt requests.
Using the Input Capture unit in any mode of operation when the TOP value (resolution) isactively changed during operation, is not recommended.
Measurement of an external signal’s duty cycle requires that the trigger edge is changed aftereach capture. Changing the edge sensing must be done as early as possible after the ICR1Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be
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cleared by software (writing a logical one to the I/O bit location). For measuring frequency only,the clearing of the ICF1 Flag is not required (if an interrupt handler is used).
15.7 Output Compare Units
The 16-bit comparator continuously compares TCNT1 with the Output Compare Register(OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the OutputCompare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Com-pare Flag generates an Output Compare interrupt. The OCF1x Flag is automatically clearedwhen the interrupt is executed. Alternatively the OCF1x Flag can be cleared by software by writ-ing a logical one to its I/O bit location. The Waveform Generator uses the match signal togenerate an output according to operating mode set by the Waveform Generation mode(WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signalsare used by the Waveform Generator for handling the special cases of the extreme values insome modes of operation (See ”Modes of Operation” on page 118.)
A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (thatis, counter resolution). In addition to the counter resolution, the TOP value defines the periodtime for waveforms generated by the Waveform Generator.
Figure 15-4 shows a block diagram of the Output Compare unit. The small “n” in the register andbit names indicates the device number (n = 1 for Timer/Counter 1), and the “x” indicates OutputCompare unit (A/B). The elements of the block diagram that are not directly a part of the OutputCompare unit are gray shaded.
Figure 15-4. Output Compare Unit, Block Diagram
The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation(PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, thedouble buffering is disabled. The double buffering synchronizes the update of the OCR1x Com-pare Register to either TOP or BOTTOM of the counting sequence. The synchronization
OCFnx (Int.Req.)
= (16-bit Comparator )
OCRnx Buffer (16-bit Register)
OCRnxH Buf. (8-bit)
OCnx
TEMP (8-bit)
DATA BUS (8-bit)
OCRnxL Buf. (8-bit)
TCNTn (16-bit Counter)
TCNTnH (8-bit) TCNTnL (8-bit)
COMnx1:0WGMn3:0
OCRnx (16-bit Register)
OCRnxH (8-bit) OCRnxL (8-bit)
Waveform GeneratorTOP
BOTTOM
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prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the out-put glitch-free.
The OCR1x Register access may seem complex, but this is not case. When the double bufferingis enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is dis-abled the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare)Register is only changed by a write operation (the Timer/Counter does not update this registerautomatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high bytetemporary register (TEMP). However, it is a good practice to read the low byte first as whenaccessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Reg-ister since the compare of all 16 bits is done continuously. The high byte (OCR1xH) has to bewritten first. When the high byte I/O location is written by the CPU, the TEMP Register will beupdated by the value written. Then when the low byte (OCR1xL) is written to the lower eight bits,the high byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x CompareRegister in the same system clock cycle.
For more information of how to access the 16-bit registers refer to ”Accessing 16-bit Registers”on page 109.
15.7.1 Force Output Compare
In non-PWM Waveform Generation modes, the match output of the comparator can be forced bywriting a one to the Force Output Compare (FOC1x) bit. Forcing compare match will not set theOCF1x Flag or reload/clear the timer, but the OC1x pin will be updated as if a real comparematch had occurred (the COMx1:0 bits settings define whether the OC1x pin is set, cleared ortoggled).
15.7.2 Compare Match Blocking by TCNT1 Write
All CPU writes to the TCNT1 Register will block any compare match that occurs in the next timerclock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to thesame value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled.
15.7.3 Using the Output Compare Unit
Since writing TCNT1 in any mode of operation will block all compare matches for one timer clockcycle, there are risks involved when changing TCNT1 when using any of the Output Compareunits, independent of whether the Timer/Counter is running or not. If the value written to TCNT1equals the OCR1x value, the compare match will be missed, resulting in incorrect waveformgeneration. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP values. Thecompare match for the TOP will be ignored and the counter will continue to 0xFFFF. Similarly,do not write the TCNT1 value equal to BOTTOM when the counter is down counting.
The setup of the OC1x should be performed before setting the Data Direction Register for theport pin to output. The easiest way of setting the OC1x value is to use the Force Output Com-pare (FOC1x) strobe bits in Normal mode. The OC1x Register keeps its value even whenchanging between Waveform Generation modes.
Be aware that the COM1x1:0 bits are not double buffered together with the compare value.Changing the COM1x1:0 bits will take effect immediately.
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15.8 Compare Match Output Unit
The Compare Output mode (COM1x1:0) bits have two functions. The Waveform Generator usesthe COM1x1:0 bits for defining the Output Compare (OC1x) state at the next compare match.Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 15-5 shows a simplifiedschematic of the logic affected by the COM1x1:0 bit setting. The I/O Registers, I/O bits, and I/Opins in the figure are shown in bold. Only the parts of the general I/O Port Control Registers(DDR and PORT) that are affected by the COM1x1:0 bits are shown. When referring to theOC1x state, the reference is for the internal OC1x Register, not the OC1x pin. If a system resetoccur, the OC1x Register is reset to “0”.
Figure 15-5. Compare Match Output Unit, Schematic
The general I/O port function is overridden by the Output Compare (OC1x) from the WaveformGenerator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or out-put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data DirectionRegister bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visi-ble on the pin. The port override function is generally independent of the Waveform Generationmode, but there are some exceptions. Refer to Table 15-1 on page 128, Table 15-2 on page 128and Table 15-3 on page 129 for details.
The design of the Output Compare pin logic allows initialization of the OC1x state before the out-put is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes ofoperation. See ”16-bit Timer/Counter Register Description” on page 128.
The COM1x1:0 bits have no effect on the Input Capture unit.
PORT
DDR
D Q
D Q
OCnxPinOCnx
D QWaveformGenerator
COMnx1
COMnx0
0
1D
ATA
BU
SFOCnx
clkI/O
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15.8.1 Compare Output Mode and Waveform Generation
The Waveform Generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes.For all modes, setting the COM1x1:0 = 0 tells the Waveform Generator that no action on theOC1x Register is to be performed on the next compare match. For compare output actions in thenon-PWM modes refer to Table 15-1 on page 128. For fast PWM mode refer to Table 15-2 onpage 128, and for phase correct and phase and frequency correct PWM refer to Table 15-3 onpage 129.
A change of the COM1x1:0 bits state will have effect at the first compare match after the bits arewritten. For non-PWM modes, the action can be forced to have immediate effect by using theFOC1x strobe bits.
15.9 Modes of Operation
The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins,is defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Out-put mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence,while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM out-put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modesthe COM1x1:0 bits control whether the output should be set, cleared or toggle at a comparematch. (See ”Compare Match Output Unit” on page 117.)
For detailed timing information refer to ”Timer/Counter Timing Diagrams” on page 126.
15.9.1 Normal Mode
The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the countingdirection is always up (incrementing), and no counter clear is performed. The counter simplyoverruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from theBOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set inthe same timer clock cycle as the TCNT1 becomes zero. The TOV1 Flag in this case behaveslike a 17th bit, except that it is only set, not cleared. However, combined with the timer overflowinterrupt that automatically clears the TOV1 Flag, the timer resolution can be increased by soft-ware. There are no special cases to consider in the Normal mode, a new counter value can bewritten anytime.
The Input Capture unit is easy to use in Normal mode. However, observe that the maximuminterval between the external events must not exceed the resolution of the counter. If the intervalbetween events are too long, the timer overflow interrupt or the prescaler must be used toextend the resolution for the capture unit.
The Output Compare units can be used to generate interrupts at some given time. Using theOutput Compare to generate waveforms in Normal mode is not recommended, since this willoccupy too much of the CPU time.
15.9.2 Clear Timer on Compare Match (CTC) Mode
In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Registerare used to manipulate the counter resolution. In CTC mode the counter is cleared to zero whenthe counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 =12). The OCR1A or ICR1 define the top value for the counter, hence also its resolution. Thismode allows greater control of the compare match output frequency. It also simplifies the opera-tion of counting external events.
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The timing diagram for the CTC mode is shown in Figure 15-6. The counter value (TCNT1)increases until a compare match occurs with either OCR1A or ICR1, and then counter (TCNT1)is cleared.
Figure 15-6. CTC Mode, Timing Diagram
An interrupt can be generated at each time the counter value reaches the TOP value by eitherusing the OCF1A or ICF1 Flag according to the register used to define the TOP value. If theinterrupt is enabled, the interrupt handler routine can be used for updating the TOP value. How-ever, changing the TOP to a value close to BOTTOM when the counter is running with none or alow prescaler value must be done with care since the CTC mode does not have the double buff-ering feature. If the new value written to OCR1A or ICR1 is lower than the current value ofTCNT1, the counter will miss the compare match. The counter will then have to count to its max-imum value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur.In many cases this feature is not desirable. An alternative will then be to use the fast PWM modeusing OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered.
For generating a waveform output in CTC mode, the OC1A output can be set to toggle its logicallevel on each compare match by setting the Compare Output mode bits to toggle mode(COM1A1:0 = 1). The OC1A value will not be visible on the port pin unless the data direction forthe pin is set to output (DDR_OC1A = 1). The waveform generated will have a maximum fre-quency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency isdefined by the following equation:
The N variable represents the prescaler factor (1, 8, 64, 256, or 1024).
As for the Normal mode of operation, the TOV1 Flag is set in the same timer clock cycle that thecounter counts from MAX to 0x0000.
TCNTn
OCnA(Toggle)
OCnA Interrupt Flag Setor ICFn Interrupt Flag Set(Interrupt on TOP)
1 4Period 2 3
(COMnA1:0 = 1)
fOCnAfclk_I/O
2 N 1 OCRnA+( )⋅ ⋅---------------------------------------------------=
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15.9.3 Fast PWM Mode
The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides ahigh frequency PWM waveform generation option. The fast PWM differs from the other PWMoptions by its single-slope operation. The counter counts from BOTTOM to TOP then restartsfrom BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is clearedon the compare match between TCNT1 and OCR1x, and set at BOTTOM. In inverting CompareOutput mode output is set on compare match and cleared at BOTTOM. Due to the single-slopeoperation, the operating frequency of the fast PWM mode can be twice as high as the phase cor-rect and phase and frequency correct PWM modes that use dual-slope operation. This highfrequency makes the fast PWM mode well suited for power regulation, rectification, and DACapplications. High frequency allows physically small sized external components (coils, capaci-tors), hence reduces total system cost.
The PWM resolution for fast PWM can be fixed to 8-bit, 9-bit, or 10-bit, or defined by either ICR1or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and themaximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can becalculated by using the following equation:
In fast PWM mode the counter is incremented until the counter value matches either one of thefixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 =14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timerclock cycle. The timing diagram for the fast PWM mode is shown in Figure 15-7. The figureshows fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in thetiming diagram shown as a histogram for illustrating the single-slope operation. The diagramincludes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag willbe set when a compare match occurs.
Figure 15-7. Fast PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In additionthe OC1A or ICF1 Flag is set at the same timer clock cycle as TOV1 is set when either OCR1A
RFPWMTOP 1+( )log
2( )log-----------------------------------=
TCNTn
OCRnx / TOP Update and TOVn Interrupt Flag Set and OCnA Interrupt Flag Set or ICFn Interrupt Flag Set (Interrupt on TOP)
1 7Period 2 3 4 5 6 8
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
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or ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt han-dler routine can be used for updating the TOP and compare values.
When changing the TOP value the program must ensure that the new TOP value is higher orequal to the value of all of the Compare Registers. If the TOP value is lower than any of theCompare Registers, a compare match will never occur between the TCNT1 and the OCR1x.Note that when using fixed TOP values the unused bits are masked to zero when any of theOCR1x Registers are written.
The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOPvalue. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a lowvalue when the counter is running with none or a low prescaler value, there is a risk that the newICR1 value written is lower than the current value of TCNT1. The result will then be that thecounter will miss the compare match at the TOP value. The counter will then have to count to theMAX value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur.The OCR1A Register however, is double buffered. This feature allows the OCR1A I/O locationto be written anytime. When the OCR1A I/O location is written the value written will be put intothe OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the valuein the Buffer Register at the next timer clock cycle the TCNT1 matches TOP. The update is doneat the same timer clock cycle as the TCNT1 is cleared and the TOV1 Flag is set.
Using the ICR1 Register for defining TOP works well when using fixed TOP values. By usingICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1Aas TOP is clearly a better choice due to its double buffer feature.
In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins.Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM outputcan be generated by setting the COM1x1:0 to three (see Table 15-2 on page 128). The actualOC1x value will only be visible on the port pin if the data direction for the port pin is set as output(DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register atthe compare match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register atthe timer clock cycle the counter is cleared (changes from TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCR1x Register represents special cases when generating a PWMwaveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the out-put will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOPwill result in a constant high or low output (depending on the polarity of the output set by theCOM1x1:0 bits).
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-ting OC1A to toggle its logical level on each compare match (COM1A1:0 = 1). This applies onlyif OCR1A is used to define the TOP value (WGM13:0 = 15). The waveform generated will havea maximum frequency of fOC1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). This feature issimilar to the OC1A toggle in CTC mode, except the double buffer feature of the Output Com-pare unit is enabled in the fast PWM mode.
fOCnxPWMfclk_I/O
N 1 TOP+( )⋅-----------------------------------=
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15.9.4 Phase Correct PWM Mode
The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3,10, or 11) provides a high resolution phase correct PWM waveform generation option. Thephase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then fromTOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) iscleared on the compare match between TCNT1 and OCR1x while upcounting, and set on thecompare match while down counting. In inverting Output Compare mode, the operation isinverted. The dual-slope operation has lower maximum operation frequency than single slopeoperation. However, due to the symmetric feature of the dual-slope PWM modes, these modesare preferred for motor control applications.
The PWM resolution for the phase correct PWM mode can be fixed to 8-bit, 9-bit, or 10-bit, ordefined by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A setto 0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM reso-lution in bits can be calculated by using the following equation:
In phase correct PWM mode the counter is incremented until the counter value matches eitherone of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1(WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached theTOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clockcycle. The timing diagram for the phase correct PWM mode is shown on Figure 15-8. The figureshows phase correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1value is in the timing diagram shown as a histogram for illustrating the dual-slope operation. Thediagram includes non-inverted and inverted PWM outputs. The small horizontal line marks onthe TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x Inter-rupt Flag will be set when a compare match occurs.
Figure 15-8. Phase Correct PWM Mode, Timing Diagram
RPCPWMTOP 1+( )log
2( )log-----------------------------------=
OCRnx/TOP Update andOCnA Interrupt Flag Setor ICFn Interrupt Flag Set(Interrupt on TOP)
1 2 3 4
TOVn Interrupt Flag Set(Interrupt on Bottom)
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
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The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. Wheneither OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 Flag is set accord-ingly at the same timer clock cycle as the OCR1x Registers are updated with the double buffervalue (at TOP). The Interrupt Flags can be used to generate an interrupt each time the counterreaches the TOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is higher orequal to the value of all of the Compare Registers. If the TOP value is lower than any of theCompare Registers, a compare match will never occur between the TCNT1 and the OCR1x.Note that when using fixed TOP values, the unused bits are masked to zero when any of theOCR1x Registers are written. As the third period shown in Figure 15-8 on page 122 illustrates,changing the TOP actively while the Timer/Counter is running in the phase correct mode canresult in an unsymmetrical output. The reason for this can be found in the time of update of theOCR1x Register. Since the OCR1x update occurs at TOP, the PWM period starts and ends atTOP. This implies that the length of the falling slope is determined by the previous TOP value,while the length of the rising slope is determined by the new TOP value. When these two valuesdiffer the two slopes of the period will differ in length. The difference in length gives the unsym-metrical result on the output.
It is recommended to use the phase and frequency correct mode instead of the phase correctmode when changing the TOP value while the Timer/Counter is running. When using a staticTOP value there are practically no differences between the two modes of operation.
In phase correct PWM mode, the compare units allow generation of PWM waveforms on theOC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an invertedPWM output can be generated by setting the COM1x1:0 to three (See Table 15-3 on page 129).The actual OC1x value will only be visible on the port pin if the data direction for the port pin isset as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1xRegister at the compare match between OCR1x and TCNT1 when the counter increments, andclearing (or setting) the OC1x Register at compare match between OCR1x and TCNT1 whenthe counter decrements. The PWM frequency for the output when using phase correct PWM canbe calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCR1x Register represent special cases when generating a PWMwaveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM theoutput will be continuously low and if set equal to TOP the output will be continuously high fornon-inverted PWM mode. For inverted PWM the output will have the opposite logic values. IfOCR1A is used to define the TOP value (WGM13:0 = 11) and COM1A1:0 = 1, the OC1A outputwill toggle with a 50% duty cycle.
fOCnxPCPWMfclk_I/O
2 N TOP⋅ ⋅----------------------------=
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15.9.5 Phase and Frequency Correct PWM Mode
The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWMmode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM wave-form generation option. The phase and frequency correct PWM mode is, like the phase correctPWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM(0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, theOutput Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x whileupcounting, and set on the compare match while down counting. In inverting Compare Outputmode, the operation is inverted. The dual-slope operation gives a lower maximum operation fre-quency compared to the single-slope operation. However, due to the symmetric feature of thedual-slope PWM modes, these modes are preferred for motor control applications.
The main difference between the phase correct, and the phase and frequency correct PWMmode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 15-8 on page 122 and Figure 15-9 on page 125).
The PWM resolution for the phase and frequency correct PWM mode can be defined by eitherICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), andthe maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits canbe calculated using the following equation:
In phase and frequency correct PWM mode the counter is incremented until the counter valuematches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). Thecounter has then reached the TOP and changes the count direction. The TCNT1 value will beequal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequencycorrect PWM mode is shown on Figure 15-9 on page 125. The figure shows phase and fre-quency correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is inthe timing diagram shown as a histogram for illustrating the dual-slope operation. The diagramincludes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1slopes represent compare matches between OCR1x and TCNT1. The OC1x Interrupt Flag willbe set when a compare match occurs.
RPFCPWMTOP 1+( )log
2( )log-----------------------------------=
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Figure 15-9. Phase and Frequency Correct PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1xRegisters are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1is used for defining the TOP value, the OC1A or ICF1 Flag set when TCNT1 has reached TOP.The Interrupt Flags can then be used to generate an interrupt each time the counter reaches theTOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is higher orequal to the value of all of the Compare Registers. If the TOP value is lower than any of theCompare Registers, a compare match will never occur between the TCNT1 and the OCR1x.
As Figure 15-9 shows the output generated is, in contrast to the phase correct mode, symmetri-cal in all periods. Since the OCR1x Registers are updated at BOTTOM, the length of the risingand the falling slopes will always be equal. This gives symmetrical output pulses and is thereforefrequency correct.
Using the ICR1 Register for defining TOP works well when using fixed TOP values. By usingICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A asTOP is clearly a better choice due to its double buffer feature.
In phase and frequency correct PWM mode, the compare units allow generation of PWM wave-forms on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM andan inverted PWM output can be generated by setting the COM1x1:0 to three (See Table 15-3 onpage 129). The actual OC1x value will only be visible on the port pin if the data direction for theport pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing)the OC1x Register at the compare match between OCR1x and TCNT1 when the counter incre-ments, and clearing (or setting) the OC1x Register at compare match between OCR1x andTCNT1 when the counter decrements. The PWM frequency for the output when using phaseand frequency correct PWM can be calculated by the following equation:
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
OCRnx/TOP UpdateandTOVn Interrupt Flag Set(Interrupt on Bottom)
OCnA Interrupt Flag Setor ICFn Interrupt Flag Set(Interrupt on TOP)
1 2 3 4
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
fOCnxPFCPWMfclk_I/O
2 N TOP⋅ ⋅----------------------------=
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The extreme values for the OCR1x Register represents special cases when generating a PWMwaveform output in the phase and frequency correct PWM mode. If the OCR1x is set equal toBOTTOM the output will be continuously low and if set equal to TOP the output will be set tohigh for non-inverted PWM mode. For inverted PWM the output will have the opposite logic val-ues. If OCR1A is used to define the TOP value (WGM13:0 = 9) and COM1A1:0 = 1, the OC1Aoutput will toggle with a 50% duty cycle.
15.10 Timer/Counter Timing Diagrams
The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as aclock enable signal in the following figures. The figures include information on when InterruptFlags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only formodes utilizing double buffering). Figure 15-10 shows a timing diagram for the setting of OCF1x.
Figure 15-10. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling
Figure 15-11 shows the same timing data, but with the prescaler enabled.
Figure 15-11. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8)
Figure 15-12 on page 127 shows the count sequence close to TOP in various modes. Whenusing phase and frequency correct PWM mode the OCR1x Register is updated at BOTTOM.The timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by
clkTn(clkI/O/1)
OCFnx
clkI/O
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
OCFnx
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
clkI/O
clkTn(clkI/O/8)
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BOTTOM+1 and so on. The same renaming applies for modes that set the TOV1 Flag atBOTTOM.
Figure 15-12. Timer/Counter Timing Diagram, no Prescaling
Figure 15-13 shows the same timing data, but with the prescaler enabled.
Figure 15-13. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)
TOVn (FPWM)and ICFn (if used
as TOP)
OCRnx(Update at TOP)
TCNTn(CTC and FPWM)
TCNTn(PC and PFC PWM)
TOP - 1 TOP TOP - 1 TOP - 2
Old OCRnx Value New OCRnx Value
TOP - 1 TOP BOTTOM BOTTOM + 1
clkTn(clkI/O/1)
clkI/O
TOVn (FPWM)and ICFn (if used
as TOP)
OCRnx(Update at TOP)
TCNTn(CTC and FPWM)
TCNTn(PC and PFC PWM)
TOP - 1 TOP TOP - 1 TOP - 2
Old OCRnx Value New OCRnx Value
TOP - 1 TOP BOTTOM BOTTOM + 1
clkI/O
clkTn(clkI/O/8)
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15.11 16-bit Timer/Counter Register Description
15.11.1 TCCR1A – Timer/Counter1 Control Register A
• Bit 7:6 – COM1A1:0: Compare Output Mode for Unit A
• Bit 5:4 – COM1B1:0: Compare Output Mode for Unit BThe COM1A1:0 and COM1B1:0 control the Output Compare pins (OC1A and OC1B respec-tively) behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A outputoverrides the normal port functionality of the I/O pin it is connected to. If one or both of theCOM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of theI/O pin it is connected to. However, note that the Data Direction Register (DDR) bit correspond-ing to the OC1A or OC1B pin must be set in order to enable the output driver.
When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is depen-dent of the WGM13:0 bits setting. Table 15-1 shows the COM1x1:0 bit functionality when theWGM13:0 bits are set to a Normal or a CTC mode (non-PWM).
Table 15-2 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the fastPWM mode.
Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In this case the compare match is ignored, but the set or clear is done at TOP. See ”Fast PWM Mode” on page 120. for more details.
Bit 7 6 5 4 3 2 1 0
(0x80) COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 TCCR1A
Read/Write R/W R/W R/W R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 15-1. Compare Output Mode, non-PWM
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B disconnected.
0 1 Toggle OC1A/OC1B on Compare Match.
1 0Clear OC1A/OC1B on Compare Match (Set output to low level).
1 1Set OC1A/OC1B on Compare Match (Set output to high level).
Table 15-2. Compare Output Mode, Fast PWM(1)
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B disconnected.
0 1
WGM13:0 = 14 or 15: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected.
1 0Clear OC1A/OC1B on Compare Match, set OC1A/OC1B at BOTTOM (non-inverting mode)
1 1Set OC1A/OC1B on Compare Match, clear OC1A/OC1B at BOTTOM (inverting mode)
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Table 15-3 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phasecorrect or the phase and frequency correct, PWM mode.
Note: 1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. See ”Phase Correct PWM Mode” on page 122. for more details.
• Bit 1:0 – WGM11:0: Waveform Generation ModeCombined with the WGM13:2 bits found in the TCCR1B Register, these bits control the countingsequence of the counter, the source for maximum (TOP) counter value, and what type of wave-form generation to be used, see Table 15-4 on page 130. Modes of operation supported by theTimer/Counter unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode,and three types of Pulse Width Modulation (PWM) modes. (See ”Modes of Operation” on page118.)
Table 15-3. Compare Output Mode, Phase Correct and Phase and Frequency Correct PWM(1)
COM1A1/COM1B1 COM1A0/COM1B0 Description
0 0 Normal port operation, OC1A/OC1B disconnected.
0 1
WGM13:0 = 9 or 11: Toggle OC1A on Compare Match, OC1B disconnected (normal port operation). For all other WGM1 settings, normal port operation, OC1A/OC1B disconnected.
1 0Clear OC1A/OC1B on Compare Match when up-counting. Set OC1A/OC1B on Compare Match when down counting.
1 1Set OC1A/OC1B on Compare Match when up-counting. Clear OC1A/OC1B on Compare Match when down counting.
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Note: 1. The CTC1 and PWM11:0 bit definition names are obsolete. Use the WGM12:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer.
15.11.2 TCCR1B – Timer/Counter1 Control Register B
• Bit 7 – ICNC1: Input Capture Noise CancelerSetting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler isactivated, the input from the Input Capture pin (ICP1) is filtered. The filter function requires foursuccessive equal valued samples of the ICP1 pin for changing its output. The Input Capture istherefore delayed by four Oscillator cycles when the noise canceler is enabled.
• Bit 6 – ICES1: Input Capture Edge SelectThis bit selects which edge on the Input Capture pin (ICP1) that is used to trigger a captureevent. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, andwhen the ICES1 bit is written to one, a rising (positive) edge will trigger the capture.
Table 15-4. Waveform Generation Mode Bit Description(1)
Mode WGM13WGM12(CTC1)
WGM11(PWM11)
WGM10(PWM10)
Timer/Counter Mode of Operation TOP
Update of OCR1x at
TOV1 Flag Set on
0 0 0 0 0 Normal 0xFFFF Immediate MAX
1 0 0 0 1 PWM, Phase Correct, 8-bit 0x00FF TOP BOTTOM
2 0 0 1 0 PWM, Phase Correct, 9-bit 0x01FF TOP BOTTOM
3 0 0 1 1 PWM, Phase Correct, 10-bit 0x03FF TOP BOTTOM
4 0 1 0 0 CTC OCR1A Immediate MAX
5 0 1 0 1 Fast PWM, 8-bit 0x00FF BOTTOM TOP
6 0 1 1 0 Fast PWM, 9-bit 0x01FF BOTTOM TOP
7 0 1 1 1 Fast PWM, 10-bit 0x03FF BOTTOM TOP
8 1 0 0 0PWM, Phase and Frequency Correct
ICR1 BOTTOM BOTTOM
9 1 0 0 1PWM, Phase and Frequency Correct
OCR1A BOTTOM BOTTOM
10 1 0 1 0 PWM, Phase Correct ICR1 TOP BOTTOM
11 1 0 1 1 PWM, Phase Correct OCR1A TOP BOTTOM
12 1 1 0 0 CTC ICR1 Immediate MAX
13 1 1 0 1 (Reserved) – – –
14 1 1 1 0 Fast PWM ICR1 BOTTOM TOP
15 1 1 1 1 Fast PWM OCR1A BOTTOM TOP
Bit 7 6 5 4 3 2 1 0
(0x81) ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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When a capture is triggered according to the ICES1 setting, the counter value is copied into theInput Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and thiscan be used to cause an Input Capture Interrupt, if this interrupt is enabled.
When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in theTCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Cap-ture function is disabled.
• Bit 5 – Reserved BitThis bit is reserved for future use. For ensuring compatibility with future devices, this bit must bewritten to zero when TCCR1B is written.
• Bit 4:3 – WGM13:2: Waveform Generation ModeSee TCCR1A Register description.
• Bit 2:0 – CS12:0: Clock SelectThe three Clock Select bits select the clock source to be used by the Timer/Counter, see Figure15-10 on page 126 and Figure 15-11 on page 126.
If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock thecounter even if the pin is configured as an output. This feature allows software control of thecounting.
15.11.3 TCCR1C – Timer/Counter1 Control Register C
• Bit 7 – FOC1A: Force Output Compare for Unit A
• Bit 6 – FOC1B: Force Output Compare for Unit BThe FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode.However, for ensuring compatibility with future devices, these bits must be set to zero whenTCCR1A is written when operating in a PWM mode. When writing a logical one to theFOC1A/FOC1B bit, an immediate compare match is forced on the Waveform Generation unit.The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the
Table 15-5. Clock Select Bit Description
CS12 CS11 CS10 Description
0 0 0 No clock source (Timer/Counter stopped).
0 0 1 clkI/O/1 (No prescaling)
0 1 0 clkI/O/8 (From prescaler)
0 1 1 clkI/O/64 (From prescaler)
1 0 0 clkI/O/256 (From prescaler)
1 0 1 clkI/O/1024 (From prescaler)
1 1 0 External clock source on T1 pin. Clock on falling edge.
1 1 1 External clock source on T1 pin. Clock on rising edge.
Bit 7 6 5 4 3 2 1 0
(0x82) FOC1A FOC1B – – – – – – TCCR1C
Read/Write R/W R/W R R R R R R
Initial Value 0 0 0 0 0 0 0 0
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FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in theCOM1x1:0 bits that determine the effect of the forced compare.
A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timeron Compare match (CTC) mode using OCR1A as TOP.
The FOC1A/FOC1B bits are always read as zero.
15.11.4 TCNT1H and TCNT1L – Timer/Counter1
The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give directaccess, both for read and for write operations, to the Timer/Counter unit 16-bit counter. Toensure that both the high and low bytes are read and written simultaneously when the CPUaccesses these registers, the access is performed using an 8-bit temporary High Byte Register(TEMP). This temporary register is shared by all the other 16-bit registers. See ”Accessing 16-bitRegisters” on page 109.
Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a com-pare match between TCNT1 and one of the OCR1x Registers.
Writing to the TCNT1 Register blocks (removes) the compare match on the following timer clockfor all compare units.
15.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
15.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
The Output Compare Registers contain a 16-bit value that is continuously compared with thecounter value (TCNT1). A match can be used to generate an Output Compare interrupt, or togenerate a waveform output on the OC1x pin.
The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes arewritten simultaneously when the CPU writes to these registers, the access is performed using an8-bit temporary High Byte Register (TEMP). This temporary register is shared by all the other16-bit registers. See ”Accessing 16-bit Registers” on page 109.
Bit 7 6 5 4 3 2 1 0
(0x85) TCNT1[15:8] TCNT1H
(0x84) TCNT1[7:0] TCNT1L
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0x89) OCR1A[15:8] OCR1AH
(0x88) OCR1A[7:0] OCR1AL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0x8B) OCR1B[15:8] OCR1BH
(0x8A) OCR1B[7:0] OCR1BL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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15.11.7 ICR1H and ICR1L – Input Capture Register 1
The Input Capture is updated with the counter (TCNT1) value each time an event occurs on theICP1 pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capturecan be used for defining the counter TOP value.
The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are readsimultaneously when the CPU accesses these registers, the access is performed using an 8-bittemporary High Byte Register (TEMP). This temporary register is shared by all the other 16-bitregisters. See ”Accessing 16-bit Registers” on page 109.
15.11.8 TIMSK1 – Timer/Counter1 Interrupt Mask Register
• Bit 5 – ICIE1: Timer/Counter1, Input Capture Interrupt EnableWhen this bit is written to one, and the I-flag in the Status Register is set (interrupts globallyenabled), the Timer/Counter1 Input Capture interrupt is enabled. The corresponding InterruptVector (See ”Interrupts” on page 56.) is executed when the ICF1 Flag, located in TIFR1, is set.
• Bit 2 – OCIE1B: Timer/Counter1, Output Compare B Match Interrupt EnableWhen this bit is written to one, and the I-flag in the Status Register is set (interrupts globallyenabled), the Timer/Counter1 Output Compare B Match interrupt is enabled. The correspondingInterrupt Vector (See ”Interrupts” on page 56.) is executed when the OCF1B Flag, located inTIFR1, is set.
• Bit 1 – OCIE1A: Timer/Counter1, Output Compare A Match Interrupt EnableWhen this bit is written to one, and the I-flag in the Status Register is set (interrupts globallyenabled), the Timer/Counter1 Output Compare A Match interrupt is enabled. The correspondingInterrupt Vector (See ”Interrupts” on page 56.) is executed when the OCF1A Flag, located inTIFR1, is set.
• Bit 0 – TOIE1: Timer/Counter1, Overflow Interrupt EnableWhen this bit is written to one, and the I-flag in the Status Register is set (interrupts globallyenabled), the Timer/Counter1 Overflow interrupt is enabled. The corresponding Interrupt Vector(See ”Interrupts” on page 56.) is executed when the TOV1 Flag, located in TIFR1, is set.
Bit 7 6 5 4 3 2 1 0
(0x87) ICR1[15:8] ICR1H
(0x86) ICR1[7:0] ICR1L
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0x6F) – – ICIE1 – – OCIE1B OCIE1A TOIE1 TIMSK1
Read/Write R R R/W R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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15.11.9 TIFR1 – Timer/Counter1 Interrupt Flag Register
• Bit 5 – ICF1: Timer/Counter1, Input Capture FlagThis flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register(ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 Flag is set when the coun-ter reaches the TOP value.
ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively,ICF1 can be cleared by writing a logic one to its bit location.
• Bit 2 – OCF1B: Timer/Counter1, Output Compare B Match FlagThis flag is set in the timer clock cycle after the counter (TCNT1) value matches the OutputCompare Register B (OCR1B).
Note that a Forced Output Compare (FOC1B) strobe will not set the OCF1B Flag.
OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is exe-cuted. Alternatively, OCF1B can be cleared by writing a logic one to its bit location.
• Bit 1 – OCF1A: Timer/Counter1, Output Compare A Match FlagThis flag is set in the timer clock cycle after the counter (TCNT1) value matches the OutputCompare Register A (OCR1A).
Note that a Forced Output Compare (FOC1A) strobe will not set the OCF1A Flag.
OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is exe-cuted. Alternatively, OCF1A can be cleared by writing a logic one to its bit location.
• Bit 0 – TOV1: Timer/Counter1, Overflow FlagThe setting of this flag is dependent of the WGM13:0 bits setting. In Normal and CTC modes,the TOV1 Flag is set when the timer overflows. Refer to Table 15-4 on page 130 for the TOV1Flag behavior when using another WGM13:0 bit setting.
TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed.Alternatively, TOV1 can be cleared by writing a logic one to its bit location.
Bit 7 6 5 4 3 2 1 0
0x16 (0x36) – – ICF1 – – OCF1B OCF1A TOV1 TIFR1
Read/Write R R R/W R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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16. Timer/Counter0 and Timer/Counter1 Prescalers
Timer/Counter1 and Timer/Counter0 share the same prescaler module, but the Timer/Counterscan have different prescaler settings. The description below applies to both Timer/Counter1 andTimer/Counter0.
16.1 Prescaler Reset
The prescaler is free running, that is, operates independently of the Clock Select logic of theTimer/Counter, and it is shared by Timer/Counter1 and Timer/Counter0. Since the prescaler isnot affected by the Timer/Counter’s clock select, the state of the prescaler will have implicationsfor situations where a prescaled clock is used. One example of prescaling artifacts occurs whenthe timer is enabled and clocked by the prescaler (6 > CSn2:0 > 1). The number of system clockcycles from when the timer is enabled to the first count occurs can be from 1 to N+1 systemclock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024).
It is possible to use the prescaler reset for synchronizing the Timer/Counter to program execu-tion. However, care must be taken if the other Timer/Counter that shares the same prescaleralso uses prescaling. A prescaler reset will affect the prescaler period for all Timer/Counters it isconnected to.
16.2 Internal Clock Source
The Timer/Counter can be clocked directly by the system clock (by setting the CSn2:0 = 1). Thisprovides the fastest operation, with a maximum Timer/Counter clock frequency equal to systemclock frequency (fCLK_I/O). Alternatively, one of four taps from the prescaler can be used as aclock source. The prescaled clock has a frequency of either fCLK_I/O/8, fCLK_I/O/64, fCLK_I/O/256, orfCLK_I/O/1024.
16.3 External Clock Source
An external clock source applied to the T1/T0 pin can be used as Timer/Counter clock(clkT1/clkT0). The T1/T0 pin is sampled once every system clock cycle by the pin synchronizationlogic. The synchronized (sampled) signal is then passed through the edge detector. Figure 16-1on page 135 shows a functional equivalent block diagram of the T1/T0 synchronization andedge detector logic. The registers are clocked at the positive edge of the internal system clock(clkI/O). The latch is transparent in the high period of the internal system clock.
The edge detector generates one clkT1/clkT0 pulse for each positive (CSn2:0 = 7) or negative(CSn2:0 = 6) edge it detects.
Figure 16-1. T1/T0 Pin Sampling
The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cyclesfrom an edge has been applied to the T1/T0 pin to the counter is updated.
Tn_sync(To ClockSelect Logic)
Edge DetectorSynchronization
D QD Q
LE
D QTn
clkI/O
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Enabling and disabling of the clock input must be done when T1/T0 has been stable for at leastone system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated.
Each half period of the external clock applied must be longer than one system clock cycle toensure correct sampling. The external clock must be guaranteed to have less than half the sys-tem clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector usessampling, the maximum frequency of an external clock it can detect is half the sampling fre-quency (Nyquist sampling theorem). However, due to variation of the system clock frequencyand duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it isrecommended that maximum frequency of an external clock source is less than fclk_I/O/2.5.
An external clock source can not be prescaled.
Figure 16-2. Prescaler for Timer/Counter0 and Timer/Counter1(1)
Note: 1. The synchronization logic on the input pins (T1/T0) is shown in Figure 16-1 on page 135.
PSR10
Clear
clkT1 clkT0
T1
T0
clkI/O
Synchronization
Synchronization
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16.4 Register Description
16.4.1 GTCCR – General Timer/Counter Control Register
• Bit 7 – TSM: Timer/Counter Synchronization ModeWriting the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, thevalue that is written to the PSR2 and PSR10 bits is kept, hence keeping the corresponding pres-caler reset signals asserted. This ensures that the corresponding Timer/Counters are halted andcan be configured to the same value without the risk of one of them advancing during configura-tion. When the TSM bit is written to zero, the PSR2 and PSR10 bits are cleared by hardware,and the Timer/Counters start counting simultaneously.
• Bit 0 – PSR10: Prescaler Reset Timer/Counter1 and Timer/Counter0When this bit is one, Timer/Counter1 and Timer/Counter0 prescaler will be Reset. This bit is nor-mally cleared immediately by hardware, except if the TSM bit is set. Note that Timer/Counter1and Timer/Counter0 share the same prescaler and a reset of this prescaler will affect bothtimers.
Bit 7 6 5 4 3 2 1 0
0x23 (0x43) TSM – – – – – PSR2 PSR10 GTCCR
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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17. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
Timer/Counter2 is a general purpose, single compare unit, 8-bit Timer/Counter module. Themain features are:
• Single Compare Unit Counter• Clear Timer on Compare Match (Auto Reload)• Glitch-free, Phase Correct Pulse Width Modulator (PWM)• Frequency Generator• 10-bit Clock Prescaler• Overflow and Compare Match Interrupt Sources (TOV2 and OCF2A)• Allows Clocking from External 32 kHz Watch Crystal Independent of the I/O Clock
17.1 Overview
A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 17-1. For the actualplacement of I/O pins, refer to Figure 1-1 on page 2. CPU accessible I/O Registers, including I/Obits and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are listedin the Section 17.10 ”8-bit Timer/Counter Register Description” on page 153.
Figure 17-1. 8-bit Timer/Counter Block Diagram
17.1.1 Registers
The Timer/Counter (TCNT2) and Output Compare Register (OCR2A) are 8-bit registers. Inter-rupt request (shorten as Int.Req.) signals are all visible in the Timer Interrupt Flag Register
Timer/Counter
DAT
A B
US
=
TCNTn
WaveformGeneration
OCnx
= 0
Control Logic
= 0xFF
TOPBOTTOM
count
clear
direction
TOVn(Int.Req.)
OCnx(Int.Req.)
Synchronization Unit
OCRnx
TCCRnx
ASSRnStatus flags
clkI/O
clkASY
Synchronized Status flags
asynchronous modeselect (ASn)
TOSC1
T/COscillator
TOSC2
Prescaler
clkTn
clkI/O
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(TIFR2). All interrupts are individually masked with the Timer Interrupt Mask Register (TIMSK2).TIFR2 and TIMSK2 are not shown in the figure.
The Timer/Counter can be clocked internally, via the prescaler, or asynchronously clocked fromthe TOSC1/2 pins, as detailed later in this section. The asynchronous operation is controlled bythe Asynchronous Status Register (ASSR). The Clock Select logic block controls which clocksource the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is inac-tive when no clock source is selected. The output from the Clock Select logic is referred to as thetimer clock (clkT2).
The double buffered Output Compare Register (OCR2A) is compared with the Timer/Countervalue at all times. The result of the compare can be used by the Waveform Generator to gener-ate a PWM or variable frequency output on the Output Compare pin (OC2A). See ”OutputCompare Unit” on page 140. for details. The compare match event will also set the CompareFlag (OCF2A) which can be used to generate an Output Compare interrupt request.
17.1.2 Definitions
Many register and bit references in this document are written in general form. A lower case “n”replaces the Timer/Counter number, in this case 2. However, when using the register or bitdefines in a program, the precise form must be used, that is, TCNT2 for accessingTimer/Counter2 counter value and so on.
The definitions in Table 17-1 are also used extensively throughout the section.
17.2 Timer/Counter Clock Sources
The Timer/Counter can be clocked by an internal synchronous or an external asynchronousclock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O. When the AS2bit in the ASSR Register is written to logic one, the clock source is taken from the Timer/CounterOscillator connected to TOSC1 and TOSC2. For details on asynchronous operation, see ”ASSR– Asynchronous Status Register” on page 156. For details on clock sources and prescaler, see”Timer/Counter Prescaler” on page 152.
17.3 Counter Unit
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure17-2 on page 140 shows a block diagram of the counter and its surrounding environment.
Table 17-1. Timer/Counter Definitions
BOTTOM The counter reaches the BOTTOM when it becomes zero (0x00).
MAX The counter reaches its MAXimum when it becomes 0xFF (decimal 255).
TOP The counter reaches the TOP when it becomes equal to the highest value in thecount sequence. The TOP value can be assigned to be the fixed value 0xFF(MAX) or the value stored in the OCR2A Register. The assignment is dependenton the mode of operation.
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Figure 17-2. Counter Unit Block Diagram
Signal description (internal signals):
count Increment or decrement TCNT2 by 1.
direction Selects between increment and decrement.
clear Clear TCNT2 (set all bits to zero).
clkT2 Timer/Counter clock.
top Signalizes that TCNT2 has reached maximum value.
bottom Signalizes that TCNT2 has reached minimum value (zero).
Depending on the mode of operation used, the counter is cleared, incremented, or decrementedat each timer clock (clkT2). clkT2 can be generated from an external or internal clock source,selected by the Clock Select bits (CS22:0). When no clock source is selected (CS22:0 = 0) thetimer is stopped. However, the TCNT2 value can be accessed by the CPU, regardless ofwhether clkT2 is present or not. A CPU write overrides (has priority over) all counter clear orcount operations.
The counting sequence is determined by the setting of the WGM21 and WGM20 bits located inthe Timer/Counter Control Register (TCCR2A). There are close connections between how thecounter behaves (counts) and how waveforms are generated on the Output Compare outputOC2A. For more details about advanced counting sequences and waveform generation, see”Modes of Operation” on page 143.
The Timer/Counter Overflow Flag (TOV2) is set according to the mode of operation selected bythe WGM21:0 bits. TOV2 can be used for generating a CPU interrupt.
17.4 Output Compare Unit
The 8-bit comparator continuously compares TCNT2 with the Output Compare Register(OCR2A). Whenever TCNT2 equals OCR2A, the comparator signals a match. A match will setthe Output Compare Flag (OCF2A) at the next timer clock cycle. If enabled (OCIE2A = 1), theOutput Compare Flag generates an Output Compare interrupt. The OCF2A Flag is automaticallycleared when the interrupt is executed. Alternatively, the OCF2A Flag can be cleared by soft-ware by writing a logical one to its I/O bit location. The Waveform Generator uses the matchsignal to generate an output according to operating mode set by the WGM21:0 bits and Com-pare Output mode (COM2A1:0) bits. The max and bottom signals are used by the WaveformGenerator for handling the special cases of the extreme values in some modes of operation(”Modes of Operation” on page 143).
Figure 17-3 on page 141 shows a block diagram of the Output Compare unit.
DATA BUS
TCNTn Control Logic
count
TOVn(Int.Req.)
topbottom
direction
clear
TOSC1
T/COscillator
TOSC2
Prescaler
clkI/O
clkTn
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Figure 17-3. Output Compare Unit, Block Diagram
The OCR2A Register is double buffered when using any of the Pulse Width Modulation (PWM)modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the doublebuffering is disabled. The double buffering synchronizes the update of the OCR2A CompareRegister to either top or bottom of the counting sequence. The synchronization prevents theoccurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.
The OCR2A Register access may seem complex, but this is not case. When the double buffer-ing is enabled, the CPU has access to the OCR2A Buffer Register, and if double buffering isdisabled the CPU will access the OCR2A directly.
17.4.1 Force Output Compare
In non-PWM waveform generation modes, the match output of the comparator can be forced bywriting a one to the Force Output Compare (FOC2A) bit. Forcing compare match will not set theOCF2A Flag or reload/clear the timer, but the OC2A pin will be updated as if a real comparematch had occurred (the COM2A1:0 bits settings define whether the OC2A pin is set, cleared ortoggled).
17.4.2 Compare Match Blocking by TCNT2 Write
All CPU write operations to the TCNT2 Register will block any compare match that occurs in thenext timer clock cycle, even when the timer is stopped. This feature allows OCR2A to be initial-ized to the same value as TCNT2 without triggering an interrupt when the Timer/Counter clock isenabled.
17.4.3 Using the Output Compare Unit
Since writing TCNT2 in any mode of operation will block all compare matches for one timer clockcycle, there are risks involved when changing TCNT2 when using the Output Compare unit,independently of whether the Timer/Counter is running or not. If the value written to TCNT2equals the OCR2A value, the compare match will be missed, resulting in incorrect waveformgeneration. Similarly, do not write the TCNT2 value equal to BOTTOM when the counter is downcounting.
OCFnx (Int.Req.)
= (8-bit Comparator )
OCRnx
OCnx
DATA BUS
TCNTn
WGMn1:0
Waveform Generator
top
FOCn
COMnx1:0
bottom
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The setup of the OC2A should be performed before setting the Data Direction Register for theport pin to output. The easiest way of setting the OC2A value is to use the Force Output Com-pare (FOC2A) strobe bit in Normal mode. The OC2A Register keeps its value even whenchanging between Waveform Generation modes.
Be aware that the COM2A1:0 bits are not double buffered together with the compare value.Changing the COM2A1:0 bits will take effect immediately.
17.5 Compare Match Output Unit
The Compare Output mode (COM2A1:0) bits have two functions. The Waveform Generatoruses the COM2A1:0 bits for defining the Output Compare (OC2A) state at the next comparematch. Also, the COM2A1:0 bits control the OC2A pin output source. Figure 17-4 shows a sim-plified schematic of the logic affected by the COM2A1:0 bit setting. The I/O Registers, I/O bits,and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control Regis-ters (DDR and PORT) that are affected by the COM2A1:0 bits are shown. When referring to theOC2A state, the reference is for the internal OC2A Register, not the OC2A pin.
Figure 17-4. Compare Match Output Unit, Schematic
The general I/O port function is overridden by the Output Compare (OC2A) from the WaveformGenerator if either of the COM2A1:0 bits are set. However, the OC2A pin direction (input or out-put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data DirectionRegister bit for the OC2A pin (DDR_OC2A) must be set as output before the OC2A value is vis-ible on the pin. The port override function is independent of the Waveform Generation mode.
The design of the Output Compare pin logic allows initialization of the OC2A state before theoutput is enabled. Note that some COM2A1:0 bit settings are reserved for certain modes ofoperation. See ”8-bit Timer/Counter Register Description” on page 153.
PORT
DDR
D Q
D Q
OCnxPinOCnx
D QWaveformGenerator
COMnx1
COMnx0
0
1
DAT
A B
US
FOCnx
clkI/O
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17.5.1 Compare Output Mode and Waveform Generation
The Waveform Generator uses the COM2A1:0 bits differently in normal, CTC, and PWM modes.For all modes, setting the COM2A1:0 = 0 tells the Waveform Generator that no action on theOC2A Register is to be performed on the next compare match. For compare output actions inthe non-PWM modes refer to Table 17-3 on page 154. For fast PWM mode, refer to Table 17-4on page 154, and for phase correct PWM refer to Table 17-5 on page 154.
A change of the COM2A1:0 bits state will have effect at the first compare match after the bits arewritten. For non-PWM modes, the action can be forced to have immediate effect by using theFOC2A strobe bits.
17.6 Modes of Operation
The mode of operation, that is, the behavior of the Timer/Counter and the Output Compare pins,is defined by the combination of the Waveform Generation mode (WGM21:0) and Compare Out-put mode (COM2A1:0) bits. The Compare Output mode bits do not affect the countingsequence, while the Waveform Generation mode bits do. The COM2A1:0 bits control whetherthe PWM output generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes the COM2A1:0 bits control whether the output should be set, cleared, or toggled ata compare match. (See ”Compare Match Output Unit” on page 142.)
For detailed timing information refer to ”Timer/Counter Timing Diagrams” on page 148.
17.6.1 Normal Mode
The simplest mode of operation is the Normal mode (WGM21:0 = 0). In this mode the countingdirection is always up (incrementing), and no counter clear is performed. The counter simplyoverruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bot-tom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV2) will be set in the sametimer clock cycle as the TCNT2 becomes zero. The TOV2 Flag in this case behaves like a ninthbit, except that it is only set, not cleared. However, combined with the timer overflow interruptthat automatically clears the TOV2 Flag, the timer resolution can be increased by software.There are no special cases to consider in the Normal mode, a new counter value can be writtenanytime.
The Output Compare unit can be used to generate interrupts at some given time. Using the Out-put Compare to generate waveforms in Normal mode is not recommended, since this willoccupy too much of the CPU time.
17.6.2 Clear Timer on Compare Match (CTC) Mode
In Clear Timer on Compare or CTC mode (WGM21:0 = 2), the OCR2A Register is used tomanipulate the counter resolution. In CTC mode the counter is cleared to zero when the countervalue (TCNT2) matches the OCR2A. The OCR2A defines the top value for the counter, hencealso its resolution. This mode allows greater control of the compare match output frequency. Italso simplifies the operation of counting external events.
The timing diagram for the CTC mode is shown in Figure 17-5 on page 144. The counter value(TCNT2) increases until a compare match occurs between TCNT2 and OCR2A, and then coun-ter (TCNT2) is cleared.
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Figure 17-5. CTC Mode, Timing Diagram
An interrupt can be generated each time the counter value reaches the TOP value by using theOCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updatingthe TOP value. However, changing the TOP to a value close to BOTTOM when the counter isrunning with none or a low prescaler value must be done with care since the CTC mode doesnot have the double buffering feature. If the new value written to OCR2A is lower than the cur-rent value of TCNT2, the counter will miss the compare match. The counter will then have tocount to its maximum value (0xFF) and wrap around starting at 0x00 before the compare matchcan occur.
For generating a waveform output in CTC mode, the OC2A output can be set to toggle its logicallevel on each compare match by setting the Compare Output mode bits to toggle mode(COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the data direction forthe pin is set to output. The waveform generated will have a maximum frequency of fOC2A =fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform frequency is defined by the followingequation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle that thecounter counts from MAX to 0x00.
17.6.3 Fast PWM Mode
The fast Pulse Width Modulation or fast PWM mode (WGM21:0 = 3) provides a high frequencyPWM waveform generation option. The fast PWM differs from the other PWM option by its sin-gle-slope operation. The counter counts from BOTTOM to MAX then restarts from BOTTOM. Innon-inverting Compare Output mode, the Output Compare (OC2A) is cleared on the comparematch between TCNT2 and OCR2A, and set at BOTTOM. In inverting Compare Output mode,the output is set on compare match and cleared at BOTTOM. Due to the single-slope operation,the operating frequency of the fast PWM mode can be twice as high as the phase correct PWMmode that uses dual-slope operation. This high frequency makes the fast PWM mode well suitedfor power regulation, rectification, and DAC applications. High frequency allows physically smallsized external components (coils, capacitors), and therefore reduces total system cost.
In fast PWM mode, the counter is incremented until the counter value matches the MAX value.The counter is then cleared at the following timer clock cycle. The timing diagram for the fast
TCNTn
OCnx(Toggle)
OCnx Interrupt Flag Set
1 4Period 2 3
(COMnx1:0 = 1)
fOCnxfclk_I/O
2 N 1 OCRnx+( )⋅ ⋅--------------------------------------------------=
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PWM mode is shown in Figure 17-6. The TCNT2 value is in the timing diagram shown as a his-togram for illustrating the single-slope operation. The diagram includes non-inverted andinverted PWM outputs. The small horizontal line marks on the TCNT2 slopes represent comparematches between OCR2A and TCNT2.
Figure 17-6. Fast PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches MAX. If the inter-rupt is enabled, the interrupt handler routine can be used for updating the compare value.
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC2A pin.Setting the COM2A1:0 bits to two will produce a non-inverted PWM and an inverted PWM outputcan be generated by setting the COM2A1:0 to three (See Table 17-4 on page 154). The actualOC2A value will only be visible on the port pin if the data direction for the port pin is set as out-put. The PWM waveform is generated by setting (or clearing) the OC2A Register at the comparematch between OCR2A and TCNT2, and clearing (or setting) the OC2A Register at the timerclock cycle the counter is cleared (changes from MAX to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a PWMwaveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM, the output willbe a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A equal to MAX will resultin a constantly high or low output (depending on the polarity of the output set by the COM2A1:0bits).
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-ting OC2A to toggle its logical level on each compare match (COM2A1:0 = 1). The waveformgenerated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is set to zero. This fea-ture is similar to the OC2A toggle in CTC mode, except the double buffer feature of the OutputCompare unit is enabled in the fast PWM mode.
TCNTn
OCRnx Update andTOVn Interrupt Flag Set
1Period 2 3
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Interrupt Flag Set
4 5 6 7
fOCnxPWMfclk_I/O
N 256⋅------------------=
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17.6.4 Phase Correct PWM Mode
The phase correct PWM mode (WGM21:0 = 1) provides a high resolution phase correct PWMwaveform generation option. The phase correct PWM mode is based on a dual-slope operation.The counter counts repeatedly from BOTTOM to MAX and then from MAX to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC2A) is cleared on the compare matchbetween TCNT2 and OCR2A while upcounting, and set on the compare match while down-counting. In inverting Output Compare mode, the operation is inverted. The dual-slope operationhas lower maximum operation frequency than single slope operation. However, due to the sym-metric feature of the dual-slope PWM modes, these modes are preferred for motor controlapplications.
The PWM resolution for the phase correct PWM mode is fixed to eight bits. In phase correctPWM mode the counter is incremented until the counter value matches MAX. When the counterreaches MAX, it changes the count direction. The TCNT2 value will be equal to MAX for onetimer clock cycle. The timing diagram for the phase correct PWM mode is shown on Figure 17-7.The TCNT2 value is in the timing diagram shown as a histogram for illustrating the dual-slopeoperation. The diagram includes non-inverted and inverted PWM outputs. The small horizontalline marks on the TCNT2 slopes represent compare matches between OCR2A and TCNT2.
Figure 17-7. Phase Correct PWM Mode, Timing Diagram
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOTTOM. TheInterrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOMvalue.
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on theOC2A pin. Setting the COM2A1:0 bits to two will produce a non-inverted PWM. An invertedPWM output can be generated by setting the COM2A1:0 to three (See Table 17-5 on page 154).The actual OC2A value will only be visible on the port pin if the data direction for the port pin isset as output. The PWM waveform is generated by clearing (or setting) the OC2A Register at thecompare match between OCR2A and TCNT2 when the counter increments, and setting (or
TOVn Interrupt Flag Set
OCnx Interrupt Flag Set
1 2 3
TCNTn
Period
OCnx
OCnx
(COMnx1:0 = 2)
(COMnx1:0 = 3)
OCRnx Update
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clearing) the OC2A Register at compare match between OCR2A and TCNT2 when the counterdecrements. The PWM frequency for the output when using phase correct PWM can be calcu-lated by the following equation:
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a PWMwaveform output in the phase correct PWM mode. If the OCR2A is set equal to BOTTOM, theoutput will be continuously low and if set equal to MAX the output will be continuously high fornon-inverted PWM mode. For inverted PWM the output will have the opposite logic values.
At the very start of period 2 in Figure 17-7 on page 146 OCn has a transition from high to loweven though there is no Compare Match. The point of this transition is to guarantee symmetryaround BOTTOM. There are two cases that give a transition without Compare Match.
• OCR2A changes its value from MAX, like in Figure 17-7 on page 146. When the OCR2A value is MAX the OCn pin value is the same as the result of a down-counting compare match. To ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an up-counting Compare Match.
• The timer starts counting from a value higher than the one in OCR2A, and for that reason misses the Compare Match and hence the OCn change that would have happened on the way up.
fOCnxPCPWMfclk_I/O
N 510⋅------------------=
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17.7 Timer/Counter Timing Diagrams
The following figures show the Timer/Counter in synchronous mode, and the timer clock (clkT2)is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should be replaced bythe Timer/Counter Oscillator clock. The figures include information on when Interrupt Flags areset. Figure 17-8 contains timing data for basic Timer/Counter operation. The figure shows thecount sequence close to the MAX value in all modes other than phase correct PWM mode.
Figure 17-8. Timer/Counter Timing Diagram, no Prescaling
Figure 17-9 shows the same timing data, but with the prescaler enabled.
Figure 17-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)
Figure 17-10 on page 149 shows the setting of OCF2A in all modes except CTC mode.
clkTn(clkI/O/1)
TOVn
clkI/O
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
TOVn
TCNTn MAX - 1 MAX BOTTOM BOTTOM + 1
clkI/O
clkTn(clkI/O/8)
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Figure 17-10. Timer/Counter Timing Diagram, Setting of OCF2A, with Prescaler (fclk_I/O/8)
Figure 17-11 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode.
Figure 17-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Pres-caler (fclk_I/O/8)
OCFnx
OCRnx
TCNTn
OCRnx Value
OCRnx - 1 OCRnx OCRnx + 1 OCRnx + 2
clkI/O
clkTn(clkI/O/8)
OCFnx
OCRnx
TCNTn(CTC)
TOP
TOP - 1 TOP BOTTOM BOTTOM + 1
clkI/O
clkTn(clkI/O/8)
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17.8 Asynchronous operation of the Timer/Counter
17.8.1 Asynchronous Operation of Timer/Counter2
When Timer/Counter2 operates asynchronously, some considerations must be taken.
• Warning: When switching between asynchronous and synchronous clocking of Timer/Counter2, the Timer Registers TCNT2, OCR2A, and TCCR2A might be corrupted. A safe procedure for switching clock source is:
a. Disable the Timer/Counter2 interrupts by clearing OCIE2A and TOIE2.
b. Select clock source by setting AS2 as appropriate.
c. Write new values to TCNT2, OCR2A, and TCCR2A.
d. To switch to asynchronous operation: Wait for TCN2UB, OCR2UB, and TCR2UB.
e. Clear the Timer/Counter2 Interrupt Flags.
f. Enable interrupts, if needed.
• The CPU main clock frequency must be more than four times the Oscillator frequency.
• When writing to one of the registers TCNT2, OCR2A, or TCCR2A, the value is transferred to a temporary register, and latched after two positive edges on TOSC1. The user should not write a new value before the contents of the temporary register have been transferred to its destination. Each of the three mentioned registers have their individual temporary register, which means that, for example, writing to TCNT2 does not disturb an OCR2A write in progress. To detect that a transfer to the destination register has taken place, the Asynchronous Status Register – ASSR has been implemented.
• When entering Power-save or ADC Noise Reduction mode after having written to TCNT2, OCR2A, or TCCR2A, the user must wait until the written register has been updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will enter sleep mode before the changes are effective. This is particularly important if the Output Compare2 interrupt is used to wake up the device, since the Output Compare function is disabled during writing to OCR2A or TCNT2. If the write cycle is not finished, and the MCU enters sleep mode before the OCR2UB bit returns to zero, the device will never receive a compare match interrupt, and the MCU will not wake up.
• If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise Reduction mode, precautions must be taken if the user wants to re-enter one of these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time between wake-up and re-entering sleep mode is less than one TOSC1 cycle, the interrupt will not occur, and the device will fail to wake up. If the user is in doubt whether the time before re-entering Power-save or ADC Noise Reduction mode is sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has elapsed:
a. Write a value to TCCR2A, TCNT2, or OCR2A.
b. Wait until the corresponding Update Busy Flag in ASSR returns to zero.
c. Enter Power-save or ADC Noise Reduction mode.
• When the asynchronous operation is selected, the 32.768 kHz Oscillator for Timer/Counter2 is always running, except in Power-down and Standby modes. After a Power-up Reset or wake-up from Power-down or Standby mode, the user should be aware of the fact that this Oscillator might take as long as one second to stabilize. The user is advised to wait for at least one second before using Timer/Counter2 after power-up or wake-up from Power-down or Standby mode. The contents of all Timer/Counter2 Registers must be considered lost after a wake-up
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from Power-down or Standby mode due to unstable clock signal upon start-up, no matter whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin.
• Description of wake up from Power-save or ADC Noise Reduction mode when the timer is clocked asynchronously: When the interrupt condition is met, the wake up process is started on the following cycle of the timer clock, that is, the timer is always advanced by at least one before the processor can read the counter value. After wake-up, the MCU is halted for four cycles, it executes the interrupt routine, and resumes execution from the instruction following SLEEP.
• Reading of the TCNT2 Register shortly after wake-up from Power-save may give an incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading TCNT2 must be done through a register synchronized to the internal I/O clock domain. Synchronization takes place for every rising TOSC1 edge. When waking up from Power-save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will read as the previous value (before entering sleep) until the next rising TOSC1 edge. The phase of the TOSC clock after waking up from Power-save mode is essentially unpredictable, as it depends on the wake-up time. The recommended procedure for reading TCNT2 is thus as follows:
a. Write any value to either of the registers OCR2A or TCCR2A.
b. Wait for the corresponding Update Busy Flag to be cleared.
c. Read TCNT2.
• During asynchronous operation, the synchronization of the Interrupt Flags for the asynchronous timer takes 3 processor cycles plus one timer cycle. The timer is therefore advanced by at least one before the processor can read the timer value causing the setting of the Interrupt Flag. The Output Compare pin is changed on the timer clock and is not synchronized to the processor clock.
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17.9 Timer/Counter Prescaler
Figure 17-12. Prescaler for Timer/Counter2
The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to the mainsystem I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asynchronouslyclocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real Time Counter(RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from Port C. A crystal canthen be connected between the TOSC1 and TOSC2 pins to serve as an independent clocksource for Timer/Counter2. The Oscillator is optimized for use with a 32.768 kHz crystal. Ifapplying an external clock on TOSC1, the EXCLK bit in ASSR must be set.
For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64,clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be selected.Setting the PSR2 bit in GTCCR resets the prescaler. This allows the user to operate with a pre-dictable prescaler.
10-BIT T/C PRESCALER
TIMER/COUNTER2 CLOCK SOURCE
clkI/O clkT2S
TOSC1
AS2
CS20CS21CS22
clk T
2S/8
clk T
2S/6
4
clk T
2S/1
28
clk T
2S/1
024
clk T
2S/2
56
clk T
2S/3
2
0PSR2
Clear
clkT2
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17.10 8-bit Timer/Counter Register Description
17.10.1 TCCR2A – Timer/Counter Control Register A
• Bit 7 – FOC2A: Force Output Compare AThe FOC2A bit is only active when the WGM bits specify a non-PWM mode. However, for ensur-ing compatibility with future devices, this bit must be set to zero when TCCR2A is written whenoperating in PWM mode. When writing a logical one to the FOC2A bit, an immediate comparematch is forced on the Waveform Generation unit. The OC2A output is changed according to itsCOM2A1:0 bits setting. Note that the FOC2A bit is implemented as a strobe. Therefore it is thevalue present in the COM2A1:0 bits that determines the effect of the forced compare.
A FOC2A strobe will not generate any interrupt, nor will it clear the timer in CTC mode usingOCR2A as TOP.
The FOC2A bit is always read as zero.
• Bit 6, 3 – WGM21:0: Waveform Generation ModeThese bits control the counting sequence of the counter, the source for the maximum (TOP)counter value, and what type of waveform generation to be used. Modes of operation supportedby the Timer/Counter unit are: Normal mode, Clear Timer on Compare match (CTC) mode, andtwo types of Pulse Width Modulation (PWM) modes. See Table 17-2 and ”Modes of Operation”on page 143.
Note: 1. The CTC2 and PWM2 bit definition names are now obsolete. Use the WGM21:0 definitions. However, the functionality and location of these bits are compatible with previous versions of the timer.
• Bit 5:4 – COM2A1:0: Compare Match Output Mode A
These bits control the Output Compare pin (OC2A) behavior. If one or both of the COM2A1:0bits are set, the OC2A output overrides the normal port functionality of the I/O pin it is connectedto. However, note that the Data Direction Register (DDR) bit corresponding to OC2A pin must beset in order to enable the output driver.
When OC2A is connected to the pin, the function of the COM2A1:0 bits depends on theWGM21:0 bit setting. Table 17-3 on page 154 shows the COM2A1:0 bit functionality when theWGM21:0 bits are set to a normal or CTC mode (non-PWM).
Bit 7 6 5 4 3 2 1 0
(0xB0) FOC2A WGM20 COM2A1 COM2A0 WGM21 CS22 CS21 CS20 TCCR2A
Read/Write W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 17-2. Waveform Generation Mode Bit Description(1)
ModeWGM21(CTC2)
WGM20(PWM2)
Timer/Counter Mode of Operation TOP
Update ofOCR2A at
TOV2 FlagSet on
0 0 0 Normal 0xFF Immediate MAX
1 0 1 PWM, Phase Correct 0xFF TOP BOTTOM
2 1 0 CTC OCR2A Immediate MAX
3 1 1 Fast PWM 0xFF BOTTOM MAX
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Table 17-4 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast PWMmode.
Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the com-pare match is ignored, but the set or clear is done at TOP. See ”Fast PWM Mode” on page 144 for more details.
Table 17-5 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to phase cor-rect PWM mode.
Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case, the com-pare match is ignored, but the set or clear is done at TOP. See ”Phase Correct PWM Mode” on page 146 for more details.
Table 17-3. Compare Output Mode, non-PWM Mode
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected.
0 1 Toggle OC2A on compare match.
1 0 Clear OC2A on compare match.
1 1 Set OC2A on compare match.
Table 17-4. Compare Output Mode, Fast PWM Mode(1)
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected.
0 1 Reserved
1 0Clear OC2A on compare match, set OC2A at BOTTOM(non-inverting mode).
1 1Set OC2A on compare match, clear OC2A at BOTTOM(inverting mode).
Table 17-5. Compare Output Mode, Phase Correct PWM Mode(1)
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected.
0 1 Reserved
1 0Clear OC2A on compare match when up-counting. Set OC2A on compare match when down counting.
1 1Set OC2A on compare match when up-counting. Clear OC2A on compare match when down counting.
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• Bit 2:0 – CS22:0: Clock SelectThe three Clock Select bits select the clock source to be used by the Timer/Counter, see Table17-6.
17.10.2 TCNT2 – Timer/Counter Register
The Timer/Counter Register gives direct access, both for read and write operations, to theTimer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes) the comparematch on the following timer clock. Modifying the counter (TCNT2) while the counter is running,introduces a risk of missing a compare match between TCNT2 and the OCR2A Register.
17.10.3 OCR2A – Output Compare Register A
The Output Compare Register A contains an 8-bit value that is continuously compared with thecounter value (TCNT2). A match can be used to generate an Output Compare interrupt, or togenerate a waveform output on the OC2A pin.
Table 17-6. Clock Select Bit Description
CS22 CS21 CS20 Description
0 0 0 No clock source (Timer/Counter stopped).
0 0 1 clkT2S/(No prescaling)
0 1 0 clkT2S/8 (From prescaler)
0 1 1 clkT2S/32 (From prescaler)
1 0 0 clkT2S/64 (From prescaler)
1 0 1 clkT2S/128 (From prescaler)
1 1 0 clkT2S/256 (From prescaler)
1 1 1 clkT2S/1024 (From prescaler)
Bit 7 6 5 4 3 2 1 0
(0xB2) TCNT2[7:0] TCNT2
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xB3) OCR2A[7:0] OCR2A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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17.10.4 TIMSK2 – Timer/Counter2 Interrupt Mask Register
• Bit 1 – OCIE2A: Timer/Counter2 Output Compare Match A Interrupt EnableWhen the OCIE2A bit is written to one and the I-bit in the Status Register is set (one), theTimer/Counter2 Compare Match A interrupt is enabled. The corresponding interrupt is executedif a compare match in Timer/Counter2 occurs, that is, when the OCF2A bit is set in theTimer/Counter 2 Interrupt Flag Register – TIFR2.
• Bit 0 – TOIE2: Timer/Counter2 Overflow Interrupt EnableWhen the TOIE2 bit is written to one and the I-bit in the Status Register is set (one), theTimer/Counter2 Overflow interrupt is enabled. The corresponding interrupt is executed if anoverflow in Timer/Counter2 occurs, that is, when the TOV2 bit is set in the Timer/Counter2 Inter-rupt Flag Register – TIFR2.
17.10.5 TIFR2 – Timer/Counter2 Interrupt Flag Register
• Bit 1 – OCF2A: Output Compare Flag 2 AThe OCF2A bit is set (one) when a compare match occurs between the Timer/Counter2 and thedata in OCR2A – Output Compare Register2. OCF2A is cleared by hardware when executingthe corresponding interrupt handling vector. Alternatively, OCF2A is cleared by writing a logicone to the flag. When the I-bit in SREG, OCIE2A (Timer/Counter2 Compare match InterruptEnable), and OCF2A are set (one), the Timer/Counter2 Compare match Interrupt is executed.
• Bit 0 – TOV2: Timer/Counter2 Overflow FlagThe TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared by hard-ware when executing the corresponding interrupt handling vector. Alternatively, TOV2 is clearedby writing a logic one to the flag. When the SREG I-bit, TOIE2A (Timer/Counter2 Overflow Inter-rupt Enable), and TOV2 are set (one), the Timer/Counter2 Overflow interrupt is executed. InPWM mode, this bit is set when Timer/Counter2 changes counting direction at 0x00.
17.10.6 ASSR – Asynchronous Status Register
• Bit 4 – EXCLK: Enable External Clock InputWhen EXCLK is written to one, and asynchronous clock is selected, the external clock input buf-fer is enabled and an external clock can be input on Timer Oscillator 1 (TOSC1) pin instead of a
Bit 7 6 5 4 3 2 1 0
(0x70) – – – – – – OCIE2A TOIE2 TIMSK2
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x17 (0x37) – – – – – – OCF2A TOV2 TIFR2
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xB6) – – – EXCLK AS2 TCN2UB OCR2UB TCR2UB ASSR
Read/Write R R R R/W R/W R R R
Initial Value 0 0 0 0 0 0 0 0
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32 kHz crystal. Writing to EXCLK should be done before asynchronous operation is selected.Note that the crystal Oscillator will only run when this bit is zero.
• Bit 3 – AS2: Asynchronous Timer/Counter2When AS2 is written to zero, Timer/Counter2 is clocked from the I/O clock, clkI/O. When AS2 iswritten to one, Timer/Counter2 is clocked from a crystal Oscillator connected to the Timer Oscil-lator 1 (TOSC1) pin. When the value of AS2 is changed, the contents of TCNT2, OCR2A, andTCCR2A might be corrupted.
• Bit 2 – TCN2UB: Timer/Counter2 Update BusyWhen Timer/Counter2 operates asynchronously and TCNT2 is written, this bit becomes set.When TCNT2 has been updated from the temporary storage register, this bit is cleared by hard-ware. A logical zero in this bit indicates that TCNT2 is ready to be updated with a new value.
• Bit 1 – OCR2UB: Output Compare Register2 Update BusyWhen Timer/Counter2 operates asynchronously and OCR2A is written, this bit becomes set.When OCR2A has been updated from the temporary storage register, this bit is cleared by hard-ware. A logical zero in this bit indicates that OCR2A is ready to be updated with a new value.
• Bit 0 – TCR2UB: Timer/Counter Control Register2 Update BusyWhen Timer/Counter2 operates asynchronously and TCCR2A is written, this bit becomes set.When TCCR2A has been updated from the temporary storage register, this bit is cleared byhardware. A logical zero in this bit indicates that TCCR2A is ready to be updated with a newvalue.
If a write is performed to any of the three Timer/Counter2 Registers while its update busy flag isset, the updated value might get corrupted and cause an unintentional interrupt to occur.
The mechanisms for reading TCNT2, OCR2A, and TCCR2A are different. When readingTCNT2, the actual timer value is read. When reading OCR2A or TCCR2A, the value in the tem-porary storage register is read.
17.10.7 GTCCR – General Timer/Counter Control Register
• Bit 1 – PSR2: Prescaler Reset Timer/Counter2When this bit is one, the Timer/Counter2 prescaler will be reset. This bit is normally clearedimmediately by hardware. If the bit is written when Timer/Counter2 is operating in asynchronousmode, the bit will remain one until the prescaler has been reset. The bit will not be cleared byhardware if the TSM bit is set. Refer to the description of the ”Bit 7 – TSM: Timer/Counter Syn-chronization Mode” on page 137 for a description of the Timer/Counter Synchronization mode.
Bit 7 6 5 4 3 2 1 0
0x23 (0x43) TSM – – – – – PSR2 PSR10 GTCCR
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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18. SPI – Serial Peripheral Interface
18.1 Features
• Full-duplex, Three-wire Synchronous Data Transfer• Master or Slave Operation• LSB First or MSB First Data Transfer• Seven Programmable Bit Rates• End of Transmission Interrupt Flag• Write Collision Flag Protection• Wake-up from Idle Mode• Double Speed (CK/2) Master SPI Mode
18.2 Overview
The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between theATmega169P and peripheral devices or between several AVR devices.
The PRSPI bit in ”PRR – Power Reduction Register” on page 45 must be written to zero toenable SPI module.
Figure 18-1. SPI Block Diagram(1)
Note: 1. Refer to Figure 1-1 on page 2, and Table 13-6 on page 74 for SPI pin placement.
SP
I2X
SP
I2X
DIVIDER/2/4/8/16/32/64/128
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The interconnection between Master and Slave CPUs with SPI is shown in Figure 18-2. The sys-tem consists of two shift Registers, and a Master clock generator. The SPI Master initiates thecommunication cycle when pulling low the Slave Select SS pin of the desired Slave. Master andSlave prepare the data to be sent in their respective shift Registers, and the Master generatesthe required clock pulses on the SCK line to interchange data. Data is always shifted from Mas-ter to Slave on the Master Out – Slave In, MOSI, line, and from Slave to Master on the Master In– Slave Out, MISO, line. After each data packet, the Master will synchronize the Slave by pullinghigh the Slave Select, SS, line.
When configured as a Master, the SPI interface has no automatic control of the SS line. Thismust be handled by user software before communication can start. When this is done, writing abyte to the SPI Data Register starts the SPI clock generator, and the hardware shifts the eightbits into the Slave. After shifting one byte, the SPI clock generator stops, setting the end ofTransmission Flag (SPIF). If the SPI Interrupt Enable bit (SPIE) in the SPCR Register is set, aninterrupt is requested. The Master may continue to shift the next byte by writing it into SPDR, orsignal the end of packet by pulling high the Slave Select, SS line. The last incoming byte will bekept in the Buffer Register for later use.
When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated as longas the SS pin is driven high. In this state, software may update the contents of the SPI DataRegister, SPDR, but the data will not be shifted out by incoming clock pulses on the SCK pinuntil the SS pin is driven low. As one byte has been completely shifted, the end of TransmissionFlag, SPIF is set. If the SPI Interrupt Enable bit, SPIE, in the SPCR Register is set, an interruptis requested. The Slave may continue to place new data to be sent into SPDR before readingthe incoming data. The last incoming byte will be kept in the Buffer Register for later use.
Figure 18-2. SPI Master-slave Interconnection
The system is single buffered in the transmit direction and double buffered in the receive direc-tion. This means that bytes to be transmitted cannot be written to the SPI Data Register beforethe entire shift cycle is completed. When receiving data, however, a received character must beread from the SPI Data Register before the next character has been completely shifted in. Oth-erwise, the first byte is lost.
In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To ensurecorrect sampling of the clock signal, the minimum low and high periods should be:
Low period: longer than 2 CPU clock cycles.
High period: longer than 2 CPU clock cycles.
SHIFTENABLE
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When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is overriddenaccording to Table 18-1. For more details on automatic port overrides, refer to ”Alternate PortFunctions” on page 71.
Note: 1. See ”Alternate Functions of Port B” on page 74 for a detailed description of how to define the direction of the user defined SPI pins.
The following code examples show how to initialize the SPI as a Master and how to perform asimple transmission. DDR_SPI in the examples must be replaced by the actual Data DirectionRegister controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK must be replaced by theactual data direction bits for these pins. For example if MOSI is placed on pin PB5, replaceDD_MOSI with DDB5 and DDR_SPI with DDRB.
Table 18-1. SPI Pin Overrides(1)
Pin Direction, Master SPI Direction, Slave SPI
MOSI User Defined Input
MISO Input User Defined
SCK User Defined Input
SS User Defined Input
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Note: 1. ”About Code Examples” on page 10
Assembly Code Example(1)
SPI_MasterInit:
; Set MOSI and SCK output, all others input
ldi r17,(1<<DD_MOSI)|(1<<DD_SCK)
out DDR_SPI,r17
; Enable SPI, Master, set clock rate fck/16
ldi r17,(1<<SPE)|(1<<MSTR)|(1<<SPR0)
out SPCR,r17
ret
SPI_MasterTransmit:
; Start transmission of data (r16)
out SPDR,r16
Wait_Transmit:
; Wait for transmission complete
sbis SPSR,SPIF
rjmp Wait_Transmit
ret
C Code Example(1)
void SPI_MasterInit(void)
{
/* Set MOSI and SCK output, all others input */
DDR_SPI = (1<<DD_MOSI)|(1<<DD_SCK);
/* Enable SPI, Master, set clock rate fck/16 */
SPCR = (1<<SPE)|(1<<MSTR)|(1<<SPR0);
}
void SPI_MasterTransmit(char cData)
{
/* Start transmission */
SPDR = cData;
/* Wait for transmission complete */
while(!(SPSR & (1<<SPIF)))
;
}
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The following code examples show how to initialize the SPI as a Slave and how to perform asimple reception.
Note: 1. ”About Code Examples” on page 10.
Assembly Code Example(1)
SPI_SlaveInit:
; Set MISO output, all others input
ldi r17,(1<<DD_MISO)
out DDR_SPI,r17
; Enable SPI
ldi r17,(1<<SPE)
out SPCR,r17
ret
SPI_SlaveReceive:
; Wait for reception complete
sbis SPSR,SPIF
rjmp SPI_SlaveReceive
; Read received data and return
in r16,SPDR
ret
C Code Example(1)
void SPI_SlaveInit(void)
{
/* Set MISO output, all others input */
DDR_SPI = (1<<DD_MISO);
/* Enable SPI */
SPCR = (1<<SPE);
}
char SPI_SlaveReceive(void)
{
/* Wait for reception complete */
while(!(SPSR & (1<<SPIF)))
;
/* Return Data Register */
return SPDR;
}
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18.3 SS Pin Functionality
18.3.1 Slave Mode
When the SPI is configured as a Slave, the Slave Select (SS) pin is always input. When SS isheld low, the SPI is activated, and MISO becomes an output if configured so by the user. Allother pins are inputs. When SS is driven high, all pins are inputs, and the SPI is passive, whichmeans that it will not receive incoming data. Note that the SPI logic will be reset once the SS pinis driven high.
The SS pin is useful for packet/byte synchronization to keep the slave bit counter synchronouswith the master clock generator. When the SS pin is driven high, the SPI slave will immediatelyreset the send and receive logic, and drop any partially received data in the Shift Register.
18.3.2 Master Mode
When the SPI is configured as a Master (MSTR in SPCR is set), the user can determine thedirection of the SS pin.
If SS is configured as an output, the pin is a general output pin which does not affect the SPIsystem. Typically, the pin will be driving the SS pin of the SPI Slave.
If SS is configured as an input, it must be held high to ensure Master SPI operation. If the SS pinis driven low by peripheral circuitry when the SPI is configured as a Master with the SS pindefined as an input, the SPI system interprets this as another master selecting the SPI as aslave and starting to send data to it. To avoid bus contention, the SPI system takes the followingactions:
1. The MSTR bit in SPCR is cleared and the SPI system becomes a Slave. As a result of the SPI becoming a Slave, the MOSI and SCK pins become inputs.
2. The SPIF Flag in SPSR is set, and if the SPI interrupt is enabled, and the I-bit in SREG is set, the interrupt routine will be executed.
Thus, when interrupt-driven SPI transmission is used in Master mode, and there exists a possi-bility that SS is driven low, the interrupt should always check that the MSTR bit is still set. If theMSTR bit has been cleared by a slave select, it must be set by the user to re-enable SPI Mastermode.
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18.4 Data Modes
There are four combinations of SCK phase and polarity with respect to serial data, which aredetermined by control bits CPHA and CPOL. The SPI data transfer formats are shown in Figure18-3 and Figure 18-4. Data bits are shifted out and latched in on opposite edges of the SCK sig-nal, ensuring sufficient time for data signals to stabilize. This is clearly seen by summarizingTable 18-3 on page 165 and Table 18-4 on page 165, as done below:
Figure 18-3. SPI Transfer Format with CPHA = 0
Figure 18-4. SPI Transfer Format with CPHA = 1
Table 18-2. CPOL Functionality
Leading Edge Trailing eDge SPI Mode
CPOL=0, CPHA=0 Sample (Rising) Setup (Falling) 0
CPOL=0, CPHA=1 Setup (Rising) Sample (Falling) 1
CPOL=1, CPHA=0 Sample (Falling) Setup (Rising) 2
CPOL=1, CPHA=1 Setup (Falling) Sample (Rising) 3
Bit 1Bit 6
LSBMSB
SCK (CPOL = 0)mode 0
SAMPLE IMOSI/MISO
CHANGE 0MOSI PIN
CHANGE 0MISO PIN
SCK (CPOL = 1)mode 2
SS
MSBLSB
Bit 6Bit 1
Bit 5Bit 2
Bit 4Bit 3
Bit 3Bit 4
Bit 2Bit 5
MSB first (DORD = 0)LSB first (DORD = 1)
SCK (CPOL = 0)mode 1
SAMPLE IMOSI/MISO
CHANGE 0MOSI PIN
CHANGE 0MISO PIN
SCK (CPOL = 1)mode 3
SS
MSBLSB
Bit 6Bit 1
Bit 5Bit 2
Bit 4Bit 3
Bit 3Bit 4
Bit 2Bit 5
Bit 1Bit 6
LSBMSB
MSB first (DORD = 0)LSB first (DORD = 1)
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18.5 Register Description
18.5.1 SPCR – SPI Control Register
• Bit 7 – SPIE: SPI Interrupt EnableThis bit causes the SPI interrupt to be executed if SPIF bit in the SPSR Register is set and the ifthe Global Interrupt Enable bit in SREG is set.
• Bit 6 – SPE: SPI EnableWhen the SPE bit is written to one, the SPI is enabled. This bit must be set to enable any SPIoperations.
• Bit 5 – DORD: Data OrderWhen the DORD bit is written to one, the LSB of the data word is transmitted first.
When the DORD bit is written to zero, the MSB of the data word is transmitted first.
• Bit 4 – MSTR: Master/Slave SelectThis bit selects Master SPI mode when written to one, and Slave SPI mode when written logiczero. If SS is configured as an input and is driven low while MSTR is set, MSTR will be cleared,and SPIF in SPSR will become set. The user will then have to set MSTR to re-enable SPI Mas-ter mode.
• Bit 3 – CPOL: Clock PolarityWhen this bit is written to one, SCK is high when idle. When CPOL is written to zero, SCK is lowwhen idle. Refer to Figure 18-3 on page 164 and Figure 18-4 on page 164 for an example. TheCPOL functionality is summarized below:
• Bit 2 – CPHA: Clock PhaseThe settings of the Clock Phase bit (CPHA) determine if data is sampled on the leading (first) ortrailing (last) edge of SCK. Refer to Figure 18-3 on page 164 and Figure 18-4 on page 164 for anexample. The CPOL functionality is summarized below:
Bit 7 6 5 4 3 2 1 0
0x2C (0x4C) SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 SPCR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 18-3. CPOL Functionality
CPOL Leading Edge Trailing Edge
0 Rising Falling
1 Falling Rising
Table 18-4. CPHA Functionality
CPHA Leading Edge Trailing Edge
0 Sample Setup
1 Setup Sample
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• Bits 1, 0 – SPR1, SPR0: SPI Clock Rate Select 1 and 0These two bits control the SCK rate of the device configured as a Master. SPR1 and SPR0 haveno effect on the Slave. The relationship between SCK and the Oscillator Clock frequency fosc isshown in the following table:
18.5.2 SPSR – SPI Status Register
• Bit 7 – SPIF: SPI Interrupt FlagWhen a serial transfer is complete, the SPIF Flag is set. An interrupt is generated if SPIE inSPCR is set and global interrupts are enabled. If SS is an input and is driven low when the SPI isin Master mode, this will also set the SPIF Flag. SPIF is cleared by hardware when executing thecorresponding interrupt handling vector. Alternatively, the SPIF bit is cleared by first reading theSPI Status Register with SPIF set, then accessing the SPI Data Register (SPDR).
• Bit 6 – WCOL: Write COLlision FlagThe WCOL bit is set if the SPI Data Register (SPDR) is written during a data transfer. TheWCOL bit (and the SPIF bit) are cleared by first reading the SPI Status Register with WCOL set,and then accessing the SPI Data Register.
• Bit 5..1 – Res: Reserved BitsThese bits are reserved and will always read as zero.
• Bit 0 – SPI2X: Double SPI Speed BitWhen this bit is written logic one the SPI speed (SCK Frequency) will be doubled when the SPIis in Master mode (see Table 18-5). This means that the minimum SCK period will be two CPUclock periods. When the SPI is configured as Slave, the SPI is only guaranteed to work at fosc/4or lower.
The SPI interface on the ATmega169P is also used for program memory and EEPROM down-loading or uploading. See page 310 for serial programming and verification.
Table 18-5. Relationship Between SCK and the Oscillator Frequency
SPI2X SPR1 SPR0 SCK Frequency
0 0 0 fosc/4
0 0 1 fosc/16
0 1 0 fosc/64
0 1 1 fosc/128
1 0 0 fosc/2
1 0 1 fosc/8
1 1 0 fosc/32
1 1 1 fosc/64
Bit 7 6 5 4 3 2 1 0
0x2D (0x4D) SPIF WCOL – – – – – SPI2X SPSR
Read/Write R R R R R R R R/W
Initial Value 0 0 0 0 0 0 0 0
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18.5.3 SPDR – SPI Data Register
The SPI Data Register is a read/write register used for data transfer between the Register Fileand the SPI Shift Register. Writing to the register initiates data transmission. Reading the regis-ter causes the Shift Register Receive buffer to be read.
Bit 7 6 5 4 3 2 1 0
0x2E (0x4E) MSB LSB SPDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value X X X X X X X X Undefined
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19. USART
19.1 Features
• Full Duplex Operation (Independent Serial Receive and Transmit Registers)• Asynchronous or Synchronous Operation• Master or Slave Clocked Synchronous Operation• High Resolution Baud Rate Generator• Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits• Odd or Even Parity Generation and Parity Check Supported by Hardware• Data OverRun Detection• Framing Error Detection• Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter• Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete• Multi-processor Communication Mode• Double Speed Asynchronous Communication Mode
19.2 Overview
The Universal Synchronous and Asynchronous serial Receiver and Transmitter (USART) is ahighly flexible serial communication device.
The PRUSART0 bit in ”PRR – Power Reduction Register” on page 45 must be written to zero toenable USART0 module.
A simplified block diagram of the USART Transmitter is shown in Figure 19-1 on page 169. CPUaccessible I/O Registers and I/O pins are shown in bold.
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Figure 19-1. USART Block Diagram(1)
Note: 1. Refer to Figure 1-1 on page 2, Table 13-13 on page 80, and Table 13-7 on page 76 for USART pin placement.
The dashed boxes in the block diagram separate the three main parts of the USART (listed fromthe top): Clock Generator, Transmitter and Receiver. Control Registers are shared by all units.The Clock Generation logic consists of synchronization logic for external clock input used bysynchronous slave operation, and the baud rate generator. The XCK (Transfer Clock) pin is onlyused by synchronous transfer mode. The Transmitter consists of a single write buffer, a serialShift Register, Parity Generator and Control logic for handling different serial frame formats. Thewrite buffer allows a continuous transfer of data without any delay between frames. TheReceiver is the most complex part of the USART module due to its clock and data recoveryunits. The recovery units are used for asynchronous data reception. In addition to the recoveryunits, the Receiver includes a Parity Checker, Control logic, a Shift Register and a two levelreceive buffer (UDRn). The Receiver supports the same frame formats as the Transmitter, andcan detect Frame Error, Data OverRun and Parity Errors.
PARITYGENERATOR
UBRR[H:L]
UDR (Transmit)
UCSRA UCSRB UCSRC
BAUD RATE GENERATOR
TRANSMIT SHIFT REGISTER
RECEIVE SHIFT REGISTER RxD
TxDPINCONTROL
UDR (Receive)
PINCONTROL
XCK
DATARECOVERY
CLOCKRECOVERY
PINCONTROL
TXCONTROL
RXCONTROL
PARITYCHECKER
DA
TA B
US
OSC
SYNC LOGIC
Clock Generator
Transmitter
Receiver
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19.2.1 AVR USART vs. AVR UART – Compatibility
The USART is fully compatible with the AVR UART regarding:
• Bit locations inside all USART Registers.
• Baud Rate Generation.
• Transmitter Operation.
• Transmit Buffer Functionality.
• Receiver Operation.
However, the receive buffering has two improvements that will affect the compatibility in somespecial cases:
• A second Buffer Register has been added. The two Buffer Registers operate as a circular FIFO buffer. Therefore the UDRn must only be read once for each incoming data! More important is the fact that the Error Flags (FEn and DORn) and the ninth data bit (RXB8n) are buffered with the data in the receive buffer. Therefore the status bits must always be read before the UDRn Register is read. Otherwise the error status will be lost since the buffer state is lost.
• The Receiver Shift Register can now act as a third buffer level. This is done by allowing the received data to remain in the serial Shift Register (see Figure 19-1 on page 169) if the Buffer Registers are full, until a new start bit is detected. The USART is therefore more resistant to Data OverRun (DORn) error conditions.
The following control bits have changed name, but have same functionality and register location:
• CHR9 is changed to UCSZn2.
• OR is changed to DORn.
19.3 Clock Generation
The Clock Generation logic generates the base clock for the Transmitter and Receiver. TheUSART supports four modes of clock operation: Normal asynchronous, Double Speed asyn-chronous, Master synchronous and Slave synchronous mode. The UMSELn bit in USARTControl and Status Register C (UCSRnC) selects between asynchronous and synchronousoperation. Double Speed (asynchronous mode only) is controlled by the U2Xn found in theUCSRnA Register. When using synchronous mode (UMSELn = 1), the Data Direction Registerfor the XCK pin (DDR_XCK) controls whether the clock source is internal (Master mode) orexternal (Slave mode). The XCK pin is only active when using synchronous mode.
Figure 19-2 on page 171 shows a block diagram of the clock generation logic.
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Figure 19-2. Clock Generation Logic, Block Diagram
Signal description:
txclk Transmitter clock (Internal Signal).
rxclk Receiver base clock (Internal Signal).
xcki Input from XCK pin (internal Signal). Used for synchronous slaveoperation.
xcko Clock output to XCK pin (Internal Signal). Used for synchronous masteroperation.
fosc XTAL pin frequency (System Clock).
19.3.1 Internal Clock Generation – The Baud Rate Generator
Internal clock generation is used for the asynchronous and the synchronous master modes ofoperation. The description in this section refers to Figure 19-2.
The USART Baud Rate Register (UBRRn) and the down-counter connected to it function as aprogrammable prescaler or baud rate generator. The down-counter, running at system clock(fosc), is loaded with the UBRRn value each time the counter has counted down to zero or whenthe UBRRLn Register is written. A clock is generated each time the counter reaches zero. Thisclock is the baud rate generator clock output (= fosc/(UBRRn+1)). The Transmitter divides thebaud rate generator clock output by 2, 8 or 16 depending on mode. The baud rate generator out-put is used directly by the Receiver’s clock and data recovery units. However, the recovery unitsuse a state machine that uses 2, 8 or 16 states depending on mode set by the state of theUMSELn, U2Xn and DDR_XCK bits.
Table 19-1 on page 172 contains equations for calculating the baud rate (in bits per second) andfor calculating the UBRRn value for each mode of operation using an internally generated clocksource.
PrescalingDown-Counter /2
UBRR
/4 /2
fosc
UBRR+1
SyncRegister
OSC
XCKPin
txclk
U2X
UMSEL
DDR_XCK
0
1
0
1
xcki
xcko
DDR_XCKrxclk
0
1
1
0Edge
Detector
UCPOL
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Note: 1. The baud rate is defined to be the transfer rate in bit per second (bps)
BAUD Baud rate (in bits per second, bps).
fOSC System Oscillator clock frequency.
UBRRn Contents of the UBRRHn and UBRRLn Registers, (0-4095).
Some examples of UBRRn values for some system clock frequencies are found in Table 19-4 onpage 190.
19.3.2 Double Speed Operation (U2Xn)
The transfer rate can be doubled by setting the U2Xn bit in UCSRnA. Setting this bit only haseffect for the asynchronous operation. Set this bit to zero when using synchronous operation.
Setting this bit will reduce the divisor of the baud rate divider from 16 to 8, effectively doublingthe transfer rate for asynchronous communication. Note however that the Receiver will in thiscase only use half the number of samples (reduced from 16 to 8) for data sampling and clockrecovery, and therefore a more accurate baud rate setting and system clock are required whenthis mode is used. For the Transmitter, there are no downsides.
19.3.3 External Clock
External clocking is used by the synchronous slave modes of operation. The description in thissection refers to Figure 19-2 on page 171 for details.
External clock input from the XCK pin is sampled by a synchronization register to minimize thechance of meta-stability. The output from the synchronization register must then pass throughan edge detector before it can be used by the Transmitter and Receiver. This process intro-duces a two CPU clock period delay and therefore the maximum external XCK clock frequencyis limited by the following equation:
Note that fosc depends on the stability of the system clock source. It is therefore recommended toadd some margin to avoid possible loss of data due to frequency variations.
Table 19-1. Equations for Calculating Baud Rate Register Setting
Operating ModeEquation for Calculating Baud
Rate(1)Equation for Calculating UBRRn
Value
Asynchronous Normal mode (U2Xn = 0)
Asynchronous Double Speed mode (U2Xn = 1)
Synchronous Master mode
BAUDfOSC
16 UBRRn 1+( )------------------------------------------= UBRRn
fOSC16BAUD------------------------ 1–=
BAUDfOSC
8 UBRRn 1+( )---------------------------------------= UBRRn
fOSC8BAUD-------------------- 1–=
BAUDfOSC
2 UBRRn 1+( )---------------------------------------= UBRRn
fOSC2BAUD-------------------- 1–=
fXCKfOSC
4-----------<
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19.3.4 Synchronous Clock Operation
When synchronous mode is used (UMSELn = 1), the XCK pin will be used as either clock input(Slave) or clock output (Master). The dependency between the clock edges and data samplingor data change is the same. The basic principle is that data input (on RxD) is sampled at theopposite XCK clock edge of the edge the data output (TxD) is changed.
Figure 19-3. Synchronous Mode XCK Timing.
The UCPOLn bit UCRSC selects which XCK clock edge is used for data sampling and which isused for data change. As Figure 19-3 shows, when UCPOLn is zero the data will be changed atrising XCK edge and sampled at falling XCK edge. If UCPOLn is set, the data will be changed atfalling XCK edge and sampled at rising XCK edge.
19.4 Frame Formats
A serial frame is defined to be one character of data bits with synchronization bits (start and stopbits), and optionally a parity bit for error checking. The USART accepts all 30 combinations ofthe following as valid frame formats:
• 1 start bit
• 5, 6, 7, 8, or 9 data bits
• no, even or odd parity bit
• 1 or 2 stop bits
A frame starts with the start bit followed by the least significant data bit. Then the next data bits,up to a total of nine, are succeeding, ending with the most significant bit. If enabled, the parity bitis inserted after the data bits, before the stop bits. When a complete frame is transmitted, it canbe directly followed by a new frame, or the communication line can be set to an idle (high) state.Figure 19-4 on page 174 illustrates the possible combinations of the frame formats. Bits insidebrackets are optional.
RxD / TxD
XCK
RxD / TxD
XCKUCPOL = 0
UCPOL = 1
Sample
Sample
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Figure 19-4. Frame Formats
St Start bit, always low.
(n) Data bits (0 to 8).
P Parity bit. Can be odd or even.
Sp Stop bit, always high.
IDLE No transfers on the communication line (RxD or TxD). An IDLE line mustbe high.
The frame format used by the USART is set by the UCSZn2:0, UPM1n:0 and USBSn bits inUCSRnB and UCSRnC. The Receiver and Transmitter use the same setting. Note that changingthe setting of any of these bits will corrupt all ongoing communication for both the Receiver andTransmitter.
The USART Character SiZe (UCSZn2:0) bits select the number of data bits in the frame. TheUSART Parity mode (UPM1n:0) bits enable and set the type of parity bit. The selection betweenone or two stop bits is done by the USART Stop Bit Select (USBSn) bit. The Receiver ignoresthe second stop bit. An FEn (Frame Error FEn) will therefore only be detected in the caseswhere the first stop bit is zero.
19.4.1 Parity Bit Calculation
The parity bit is calculated by doing an exclusive-or of all the data bits. If odd parity is used, theresult of the exclusive or is inverted. The relation between the parity bit and data bits is asfollows:
Peven Parity bit using even parity.
Podd Parity bit using odd parity.
dn Data bit n of the character.
If used, the parity bit is located between the last data bit and first stop bit of a serial frame.
10 2 3 4 [5] [6] [7] [8] [P]St Sp1 [Sp2] (St / IDLE)(IDLE)
FRAME
Peven dn 1– … d3 d2 d1 d0 0Podd
⊕ ⊕ ⊕ ⊕ ⊕ ⊕dn 1– … d3 d2 d1 d0 1⊕ ⊕ ⊕ ⊕ ⊕ ⊕
==
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19.5 USART Initialization
The USART has to be initialized before any communication can take place. The initialization pro-cess normally consists of setting the baud rate, setting frame format and enabling theTransmitter or the Receiver depending on the usage. For interrupt driven USART operation, theGlobal Interrupt Flag should be cleared (and interrupts globally disabled) when doing theinitialization.
Before doing a re-initialization with changed baud rate or frame format, be sure that there are noongoing transmissions during the period the registers are changed. The TXCn Flag can be usedto check that the Transmitter has completed all transfers, and the RXCn Flag can be used tocheck that there are no unread data in the receive buffer. Note that the TXCn Flag must becleared before each transmission (before UDRn is written) if it is used for this purpose.
The following simple USART initialization code examples show one assembly and one C func-tion that are equal in functionality. The examples assume asynchronous operation using polling(no interrupts enabled) and a fixed frame format. The baud rate is given as a function parameter.
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For the assembly code, the baud rate parameter is assumed to be stored in the r17:r16Registers.
Note: 1. See ”About Code Examples” on page 10.
More advanced initialization routines can be made that include frame format as parameters, dis-able interrupts and so on. However, many applications use a fixed setting of the baud andcontrol registers, and for these types of applications the initialization code can be placed directlyin the main routine, or be combined with initialization code for other I/O modules.
Assembly Code Example(1)
USART_Init:
; Set baud rate
sts UBRRH0, r17
sts UBRRL0, r16
; Enable receiver and transmitter
ldi r16, (1<<RXEN0)|(1<<TXEN0)
sts UCSR0B,r16
; Set frame format: 8data, 2stop bit
ldi r16, (1<<USBS0)|(3<<UCSZ00)
sts UCSR0C,r16
ret
C Code Example(1)
#define FOSC 1843200// Clock Speed
#define BAUD 9600
#define MYUBRR FOSC/16/BAUD-1
void main( void )
{
...
USART_Init ( MYUBRR );
...
}
void USART_Init( unsigned int ubrr)
{
/* Set baud rate */
UBRRH0 = (unsigned char)(ubrr>>8);
UBRRL0 = (unsigned char)ubrr;
/* Enable receiver and transmitter */
UCSR0B = (1<<RXEN0)|(1<<TXEN0);
/* Set frame format: 8data, 2stop bit */
UCSRnC = (1<<USBS0)|(3<<UCSZ00);
}
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19.6 Data Transmission – The USART Transmitter
The USART Transmitter is enabled by setting the Transmit Enable (TXENn) bit in the UCSRnBRegister. When the Transmitter is enabled, the normal port operation of the TxD pin is overrid-den by the USART and given the function as the Transmitter’s serial output. The baud rate,mode of operation and frame format must be set up once before doing any transmissions. If syn-chronous operation is used, the clock on the XCK pin will be overridden and used astransmission clock.
19.6.1 Sending Frames with 5 to 8 Data Bit
A data transmission is initiated by loading the transmit buffer with the data to be transmitted. TheCPU can load the transmit buffer by writing to the UDRn I/O location. The buffered data in thetransmit buffer will be moved to the Shift Register when the Shift Register is ready to send a newframe. The Shift Register is loaded with new data if it is in idle state (no ongoing transmission) orimmediately after the last stop bit of the previous frame is transmitted. When the Shift Register isloaded with new data, it will transfer one complete frame at the rate given by the Baud Register,U2Xn bit or by XCK depending on mode of operation.
The following code examples show a simple USART transmit function based on polling of theData Register Empty (UDREn) Flag. When using frames with less than eight bits, the most sig-nificant bits written to the UDRn are ignored. The USART has to be initialized before the functioncan be used. For the assembly code, the data to be sent is assumed to be stored in RegisterR16.
Note: 1. See ”About Code Examples” on page 10.
The function simply waits for the transmit buffer to be empty by checking the UDREn Flag,before loading it with new data to be transmitted. If the Data Register Empty interrupt is utilized,the interrupt routine writes the data into the buffer.
Assembly Code Example(1)
USART_Transmit:
; Wait for empty transmit buffer
sbis UCSR0A,UDREn
rjmp USART_Transmit
; Put data (r16) into buffer, sends the data
sts UDR0,r16
ret
C Code Example(1)
void USART_Transmit( unsigned char data )
{
/* Wait for empty transmit buffer */
while ( !( UCSR0A & (1<<UDRE0)) )
;
/* Put data into buffer, sends the data */
UDR0 = data;
}
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19.6.2 Sending Frames with 9 Data Bit
If 9-bit characters are used (UCSZ = 7), the ninth bit must be written to the TXB8n bit inUCSRnB before the low byte of the character is written to UDRn. The following code examplesshow a transmit function that handles 9-bit characters. For the assembly code, the data to besent is assumed to be stored in registers R17:R16.
Notes: 1. These transmit functions are written to be general functions. They can be optimized if the con-tents of the UCSRnB is static. For example, only the TXB8n bit of the UCSRnB Register is used after initialization.
2. See ”About Code Examples” on page 10.
The ninth bit can be used for indicating an address frame when using multi processor communi-cation mode or for other protocol handling as for example synchronization.
Assembly Code Example(1)(2)
USART_Transmit:
; Wait for empty transmit buffer
sbis UCSR0A,UDRE0
rjmp USART_Transmit
; Copy 9th bit from r17 to TXB80
cbi UCSR0B,TXB80
sbrc r17,0
sbi UCSR0B,TXB80
; Put LSB data (r16) into buffer, sends the data
sts UDR0,r16
ret
C Code Example(1)(2)
void USART_Transmit( unsigned int data )
{
/* Wait for empty transmit buffer */
while ( !( UCSR0A & (1<<UDRE0))) )
;
/* Copy 9th bit to TXB8n */
UCSR0B &= ~(1<<TXB80);
if ( data & 0x0100 )
UCSR0B |= (1<<TXB80);
/* Put data into buffer, sends the data */
UDR0 = data;
}
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19.6.3 Transmitter Flags and Interrupts
The USART Transmitter has two flags that indicate its state: USART Data Register Empty(UDREn) and Transmit Complete (TXCn). Both flags can be used for generating interrupts.
The Data Register Empty (UDREn) Flag indicates whether the transmit buffer is ready to receivenew data. This bit is set when the transmit buffer is empty, and cleared when the transmit buffercontains data to be transmitted that has not yet been moved into the Shift Register. For compat-ibility with future devices, always write this bit to zero when writing the UCSRnA Register.
When the Data Register Empty Interrupt Enable (UDRIEn) bit in UCSRnB is written to one, theUSART Data Register Empty Interrupt will be executed as long as UDREn is set (provided thatglobal interrupts are enabled). UDREn is cleared by writing UDRn. When interrupt-driven datatransmission is used, the Data Register Empty interrupt routine must either write new data toUDRn in order to clear UDREn or disable the Data Register Empty interrupt, otherwise a newinterrupt will occur once the interrupt routine terminates.
The Transmit Complete (TXCn) Flag bit is set one when the entire frame in the Transmit ShiftRegister has been shifted out and there are no new data currently present in the transmit buffer.The TXCn Flag bit is automatically cleared when a transmit complete interrupt is executed, or itcan be cleared by writing a one to its bit location. The TXCn Flag is useful in half-duplex commu-nication interfaces (like the RS-485 standard), where a transmitting application must enterreceive mode and free the communication bus immediately after completing the transmission.
When the Transmit Compete Interrupt Enable (TXCIEn) bit in UCSRnB is set, the USARTTransmit Complete Interrupt will be executed when the TXCn Flag becomes set (provided thatglobal interrupts are enabled). When the transmit complete interrupt is used, the interrupt han-dling routine does not have to clear the TXCn Flag, this is done automatically when the interruptis executed.
19.6.4 Parity Generator
The Parity Generator calculates the parity bit for the serial frame data. When parity bit is enabled(UPM1n = 1), the transmitter control logic inserts the parity bit between the last data bit and thefirst stop bit of the frame that is sent.
19.6.5 Disabling the Transmitter
The disabling of the Transmitter (setting the TXENn to zero) will not become effective until ongo-ing and pending transmissions are completed, that is, when the Transmit Shift Register andTransmit Buffer Register do not contain data to be transmitted. When disabled, the Transmitterwill no longer override the TxD pin.
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19.7 Data Reception – The USART Receiver
The USART Receiver is enabled by writing the Receive Enable (RXENn) bit in the UCSRnBRegister to one. When the Receiver is enabled, the normal pin operation of the RxD pin is over-ridden by the USART and given the function as the Receiver’s serial input. The baud rate, modeof operation and frame format must be set up once before any serial reception can be done. Ifsynchronous operation is used, the clock on the XCK pin will be used as transfer clock.
19.7.1 Receiving Frames with 5 to 8 Data Bits
The Receiver starts data reception when it detects a valid start bit. Each bit that follows the startbit will be sampled at the baud rate or XCK clock, and shifted into the Receive Shift Register untilthe first stop bit of a frame is received. A second stop bit will be ignored by the Receiver. Whenthe first stop bit is received, that is, a complete serial frame is present in the Receive Shift Regis-ter, the contents of the Shift Register will be moved into the receive buffer. The receive buffercan then be read by reading the UDRn I/O location.
The following code example shows a simple USART receive function based on polling of theReceive Complete (RXCn) Flag. When using frames with less than eight bits the most significantbits of the data read from the UDRn will be masked to zero. The USART has to be initializedbefore the function can be used.
Note: 1. See ”About Code Examples” on page 10.
The function simply waits for data to be present in the receive buffer by checking the RXCn Flag,before reading the buffer and returning the value.
Assembly Code Example(1)
USART_Receive:
; Wait for data to be received
sbis UCSR0A, RXC0
rjmp USART_Receive
; Get and return received data from buffer
in r16, UDR0
ret
C Code Example(1)
unsigned char USART_Receive( void )
{
/* Wait for data to be received */
while ( !(UCSR0A & (1<<RXC0)) )
;
/* Get and return received data from buffer */
return UDR0;
}
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19.7.2 Receiving Frames with 9 Data Bits
If 9-bit characters are used (UCSZ=7) the ninth bit must be read from the RXB8n bit in UCSRnBbefore reading the low bits from the UDRn. This rule applies to the FEn, DORn and UPEn Sta-tus Flags as well. Read status from UCSRnA, then data from UDRn. Reading the UDRn I/Olocation will change the state of the receive buffer FIFO and consequently the TXB8n, FEn,DORn and UPEn bits, which all are stored in the FIFO, will change.
The following code example shows a simple USART receive function that handles both nine bitcharacters and the status bits.
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Note: 1. ”About Code Examples” on page 10.
The receive function example reads all the I/O Registers into the Register File before any com-putation is done. This gives an optimal receive buffer utilization since the buffer location read willbe free to accept new data as early as possible.
Assembly Code Example(1)
USART_Receive:
; Wait for data to be received
sbis UCSR0A, RXC0
rjmp USART_Receive
; Get status and 9th bit, then data from buffer
in r18, UCSR0A
in r17, UCSR0B
in r16, UDR0
; If error, return -1
andi r18,(1<<FE0)|(1<<DOR0)|(1<<UPE0)
breq USART_ReceiveNoError
ldi r17, HIGH(-1)
ldi r16, LOW(-1)
USART_ReceiveNoError:
; Filter the 9th bit, then return
lsr r17
andi r17, 0x01
ret
C Code Example(1)
unsigned int USART_Receive( void )
{
unsigned char status, resh, resl;
/* Wait for data to be received */
while ( !(UCSRnA & (1<<RXCn)) )
;
/* Get status and 9th bit, then data */
/* from buffer */
status = UCSR0A;
resh = UCSR0B;
resl = UDR0;
/* If error, return -1 */
if ( status & (1<<FE0)|(1<<DOR0)|(1<<UPE0) )
return -1;
/* Filter the 9th bit, then return */
resh = (resh >> 1) & 0x01;
return ((resh << 8) | resl);
}
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19.7.3 Receive Compete Flag and Interrupt
The USART Receiver has one flag that indicates the Receiver state.
The Receive Complete (RXCn) Flag indicates if there are unread data present in the receive buf-fer. This flag is one when unread data exist in the receive buffer, and zero when the receivebuffer is empty (that is, does not contain any unread data). If the Receiver is disabled (RXENn =0), the receive buffer will be flushed and consequently the RXCn bit will become zero.
When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART ReceiveComplete interrupt will be executed as long as the RXCn Flag is set (provided that global inter-rupts are enabled). When interrupt-driven data reception is used, the receive complete routinemust read the received data from UDRn in order to clear the RXCn Flag, otherwise a new inter-rupt will occur once the interrupt routine terminates.
19.7.4 Receiver Error Flags
The USART Receiver has three Error Flags: Frame Error (FEn), Data OverRun (DORn) andParity Error (UPEn). All can be accessed by reading UCSRnA. Common for the Error Flags isthat they are located in the receive buffer together with the frame for which they indicate theerror status. Due to the buffering of the Error Flags, the UCSRnA must be read before thereceive buffer (UDRn), since reading the UDRn I/O location changes the buffer read location.Another equality for the Error Flags is that they can not be altered by software doing a write tothe flag location. However, all flags must be set to zero when the UCSRnA is written for upwardcompatibility of future USART implementations. None of the Error Flags can generate interrupts.
The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable framestored in the receive buffer. The FEn Flag is zero when the stop bit was correctly read (as one),and the FEn Flag will be one when the stop bit was incorrect (zero). This flag can be used fordetecting out-of-sync conditions, detecting break conditions and protocol handling. The FEnFlag is not affected by the setting of the USBSn bit in UCSRnC since the Receiver ignores all,except for the first, stop bits. For compatibility with future devices, always set this bit to zerowhen writing to UCSRnA.
The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condition. AData OverRun occurs when the receive buffer is full (two characters), it is a new character wait-ing in the Receive Shift Register, and a new start bit is detected. If the DORn Flag is set therewas one or more serial frame lost between the frame last read from UDRn, and the next frameread from UDRn. For compatibility with future devices, always write this bit to zero when writingto UCSRnA. The DORn Flag is cleared when the frame received was successfully moved fromthe Shift Register to the receive buffer.
The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a ParityError when received. If Parity Check is not enabled the UPEn bit will always be read zero. Forcompatibility with future devices, always set this bit to zero when writing to UCSRnA. For moredetails see ”Parity Bit Calculation” on page 174 and ”Parity Checker” on page 184.
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19.7.5 Parity Checker
The Parity Checker is active when the high USART Parity mode (UPM1n) bit is set. Type of Par-ity Check to be performed (odd or even) is selected by the UPM0n bit. When enabled, the ParityChecker calculates the parity of the data bits in incoming frames and compares the result withthe parity bit from the serial frame. The result of the check is stored in the receive buffer togetherwith the received data and stop bits. The Parity Error (UPEn) Flag can then be read by softwareto check if the frame had a Parity Error.
The UPEn bit is set if the next character that can be read from the receive buffer had a ParityError when received and the Parity Checking was enabled at that point (UPM1n = 1). This bit isvalid until the receive buffer (UDRn) is read.
19.7.6 Disabling the Receiver
In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from ongoingreceptions will therefore be lost. When disabled (that is, the RXENn is set to zero) the Receiverwill no longer override the normal function of the RxD port pin. The Receiver buffer FIFO will beflushed when the Receiver is disabled. Remaining data in the buffer will be lost.
19.7.7 Flushing the Receive Buffer
The receiver buffer FIFO will be flushed when the Receiver is disabled, that is, the buffer will beemptied of its contents. Unread data will be lost. If the buffer has to be flushed during normaloperation, due to for instance an error condition, read the UDRn I/O location until the RXCn Flagis cleared. The following code example shows how to flush the receive buffer.
Note: 1. See ”About Code Examples” on page 10.
Assembly Code Example(1)
USART_Flush:
sbis UCSR0A, RXC0
ret
in r16, UDR0
rjmp USART_Flush
C Code Example(1)
void USART_Flush( void )
{
unsigned char dummy;
while ( UCSR0A & (1<<RXC0) ) dummy = UDR0;
}
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19.8 Asynchronous Data Reception
The USART includes a clock recovery and a data recovery unit for handling asynchronous datareception. The clock recovery logic is used for synchronizing the internally generated baud rateclock to the incoming asynchronous serial frames at the RxD pin. The data recovery logic sam-ples and low pass filters each incoming bit, thereby improving the noise immunity of theReceiver. The asynchronous reception operational range depends on the accuracy of the inter-nal baud rate clock, the rate of the incoming frames, and the frame size in number of bits.
19.8.1 Asynchronous Clock Recovery
The clock recovery logic synchronizes internal clock to the incoming serial frames. Figure 19-5illustrates the sampling process of the start bit of an incoming frame. The sample rate is 16 timesthe baud rate for Normal mode, and eight times the baud rate for Double Speed mode. The hor-izontal arrows illustrate the synchronization variation due to the sampling process. Note thelarger time variation when using the Double Speed mode (U2Xn = 1) of operation. Samplesdenoted zero are samples done when the RxD line is idle (that is, no communication activity).
Figure 19-5. Start Bit Sampling
When the clock recovery logic detects a high (idle) to low (start) transition on the RxD line, thestart bit detection sequence is initiated. Let sample 1 denote the first zero-sample as shown inthe figure. The clock recovery logic then uses samples 8, 9, and 10 for Normal mode, and sam-ples 4, 5, and 6 for Double Speed mode (indicated with sample numbers inside boxes on thefigure), to decide if a valid start bit is received. If two or more of these three samples have logicalhigh levels (the majority wins), the start bit is rejected as a noise spike and the Receiver startslooking for the next high to low-transition. If however, a valid start bit is detected, the clock recov-ery logic is synchronized and the data recovery can begin. The synchronization process isrepeated for each start bit.
19.8.2 Asynchronous Data Recovery
When the receiver clock is synchronized to the start bit, the data recovery can begin. The datarecovery unit uses a state machine that has 16 states for each bit in Normal mode and eightstates for each bit in Double Speed mode. Figure 19-6 on page 186 shows the sampling of thedata bits and the parity bit. Each of the samples is given a number that is equal to the state ofthe recovery unit.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2
STARTIDLE
00
BIT 0
3
1 2 3 4 5 6 7 8 1 20
RxD
Sample(U2X = 0)
Sample(U2X = 1)
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Figure 19-6. Sampling of Data and Parity Bit
The decision of the logic level of the received bit is taken by doing a majority voting of the logicvalue to the three samples in the center of the received bit. The center samples are emphasizedon the figure by having the sample number inside boxes. The majority voting process is done asfollows: If two or all three samples have high levels, the received bit is registered to be a logic 1.If two or all three samples have low levels, the received bit is registered to be a logic 0. Thismajority voting process acts as a low pass filter for the incoming signal on the RxD pin. Therecovery process is then repeated until a complete frame is received. Including the first stop bit.Note that the Receiver only uses the first stop bit of a frame.
Figure 19-7 shows the sampling of the stop bit and the earliest possible beginning of the start bitof the next frame.
Figure 19-7. Stop Bit Sampling and Next Start Bit Sampling
The same majority voting is done to the stop bit as done for the other bits in the frame. If the stopbit is registered to have a logic 0 value, the Frame Error (FEn) Flag will be set.
A new high to low transition indicating the start bit of a new frame can come right after the last ofthe bits used for majority voting. For Normal Speed mode, the first low level sample can be atpoint marked (A) in Figure 19-7. For Double Speed mode the first low level must be delayed to(B). (C) marks a stop bit of full length. The early start bit detection influences the operationalrange of the Receiver.
19.8.3 Asynchronous Operational Range
The operational range of the Receiver is dependent on the mismatch between the received bitrate and the internally generated baud rate. If the Transmitter is sending frames at too fast or tooslow bit rates, or the internally generated baud rate of the Receiver does not have a similar (seeTable 19-2 on page 187) base frequency, the Receiver will not be able to synchronize theframes to the start bit.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1
BIT n
1 2 3 4 5 6 7 8 1
RxD
Sample(U2X = 0)
Sample(U2X = 1)
1 2 3 4 5 6 7 8 9 10 0/1 0/1 0/1
STOP 1
1 2 3 4 5 6 0/1
RxD
Sample(U2X = 0)
Sample(U2X = 1)
(A) (B) (C)
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The following equations can be used to calculate the ratio of the incoming data rate and internalreceiver baud rate.
D Sum of character size and parity size (D = 5 to 10 bit).
S Samples per bit. S = 16 for Normal Speed mode and S = 8 for Double Speedmode.
SF First sample number used for majority voting. SF = 8 for normal speed and SF = 4for Double Speed mode.
SM Middle sample number used for majority voting. SM = 9 for normal speed andSM = 5 for Double Speed mode.
Rslow is the ratio of the slowest incoming data rate that can be accepted in relation to thereceiver baud rate. Rfast is the ratio of the fastest incoming data rate that can beaccepted in relation to the receiver baud rate.
Table 19-2 and Table 19-3 list the maximum receiver baud rate error that can be tolerated. Notethat Normal Speed mode has higher toleration of baud rate variations.
Table 19-2. Recommended Maximum Receiver Baud Rate Error for Normal Speed Mode (U2Xn = 0)
D# (Data+Parity Bit) Rslow (%) Rfast (%) Max Total Error (%)
Recommended Max Receiver Error (%)
5 93.20 106.67 +6.67/-6.8 ±3.0
6 94.12 105.79 +5.79/-5.88 ±2.5
7 94.81 105.11 +5.11/-5.19 ±2.0
8 95.36 104.58 +4.58/-4.54 ±2.0
9 95.81 104.14 +4.14/-4.19 ±1.5
10 96.17 103.78 +3.78/-3.83 ±1.5
Table 19-3. Recommended Maximum Receiver Baud Rate Error for Double Speed Mode (U2Xn = 1)
D# (Data+Parity Bit) Rslow (%) Rfast (%) Max Total Error (%)
Recommended Max Receiver Error (%)
5 94.12 105.66 +5.66/-5.88 ±2.5
6 94.92 104.92 +4.92/-5.08 ±2.0
7 95.52 104.35 +4.35/-4.48 ±1.5
8 96.00 103.90 +3.90/-4.00 ±1.5
9 96.39 103.53 +3.53/-3.61 ±1.5
10 96.70 103.23 +3.23/-3.30 ±1.0
RslowD 1+( )S
S 1– D S⋅ SF+ +-------------------------------------------= Rfast
D 2+( )SD 1+( )S SM+
-----------------------------------=
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The recommendations of the maximum receiver baud rate error was made under the assump-tion that the Receiver and Transmitter equally divides the maximum total error.
There are two possible sources for the receivers baud rate error. The Receiver’s system clock(XTAL) will always have some minor instability over the supply voltage range and the tempera-ture range. When using a crystal to generate the system clock, this is rarely a problem, but for aresonator the system clock may differ more than 2% depending of the resonators tolerance. Thesecond source for the error is more controllable. The baud rate generator can not always do anexact division of the system frequency to get the baud rate wanted. In this case an UBRRn valuethat gives an acceptable low error can be used if possible.
19.9 Multi-processor Communication Mode
Setting the Multi-processor Communication mode (MPCMn) bit in UCSRnA enables a filteringfunction of incoming frames received by the USART Receiver. Frames that do not containaddress information will be ignored and not put into the receive buffer. This effectively reducesthe number of incoming frames that has to be handled by the CPU, in a system with multipleMCUs that communicate via the same serial bus. The Transmitter is unaffected by the MPCMnsetting, but has to be used differently when it is a part of a system utilizing the Multi-processorCommunication mode.
If the Receiver is set up to receive frames that contain 5 to 8 data bits, then the first stop bit indi-cates if the frame contains data or address information. If the Receiver is set up for frames withnine data bits, then the ninth bit (RXB8n) is used for identifying address and data frames. Whenthe frame type bit (the first stop or the ninth bit) is one, the frame contains an address. When theframe type bit is zero the frame is a data frame.
The Multi-processor Communication mode enables several slave MCUs to receive data from amaster MCU. This is done by first decoding an address frame to find out which MCU has beenaddressed. If a particular slave MCU has been addressed, it will receive the following dataframes as normal, while the other slave MCUs will ignore the received frames until anotheraddress frame is received.
19.9.1 Using MPCMn
For an MCU to act as a master MCU, it can use a 9-bit character frame format (UCSZ = 7). Theninth bit (TXB8n) must be set when an address frame (TXB8n = 1) or cleared when a data frame(TXB = 0) is being transmitted. The slave MCUs must in this case be set to use a 9-bit characterframe format.
The following procedure should be used to exchange data in Multi-processor Communicationmode:
1. All Slave MCUs are in Multi-processor Communication mode (MPCMn in UCSRnA is set).
2. The Master MCU sends an address frame, and all slaves receive and read this frame. In the Slave MCUs, the RXCn Flag in UCSRnA will be set as normal.
3. Each Slave MCU reads the UDRn Register and determines if it has been selected. If so, it clears the MPCMn bit in UCSRnA, otherwise it waits for the next address byte and keeps the MPCMn setting.
4. The addressed MCU will receive all data frames until a new address frame is received. The other Slave MCUs, which still have the MPCMn bit set, will ignore the data frames.
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5. When the last data frame is received by the addressed MCU, the addressed MCU sets the MPCMn bit and waits for a new address frame from master. The process then repeats from 2.
Using any of the 5-bit to 8-bit character frame formats is possible, but impractical since theReceiver must change between using n and n+1 character frame formats. This makes full-duplex operation difficult since the Transmitter and Receiver uses the same character size set-ting. If 5-bit to 8-bit character frames are used, the Transmitter must be set to use two stop bit(USBSn = 1) since the first stop bit is used for indicating the frame type.
Do not use Read-Modify-Write instructions (SBI and CBI) to set or clear the MPCMn bit. TheMPCMn bit shares the same I/O location as the TXCn Flag and this might accidentally becleared when using SBI or CBI instructions.
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19.10 Examples of Baud Rate Setting
For standard crystal and resonator frequencies, the most commonly used baud rates for asyn-chronous operation can be generated by using the UBRRn settings in Table 19-4. UBRRnvalues which yield an actual baud rate differing less than 0.5% from the target baud rate, arebold in the table. Higher error ratings are acceptable, but the Receiver will have less noise resis-tance when the error ratings are high, especially for large serial frames (see ”AsynchronousOperational Range” on page 186). The error values are calculated using the following equation:
Note: 1. UBRRn = 0, Error = 0%.
Error[%]BaudRateClosest Match
BaudRate-------------------------------------------------------- 1–⎝ ⎠
⎛ ⎞ 100%•=
Table 19-4. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies
Baud Rate (bps)
fosc = 1.0000 MHz fosc = 1.8432 MHz fosc = 2.0000 MHz
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error
2400 25 0.2% 51 0.2% 47 0.0% 95 0.0% 51 0.2% 103 0.2%
4800 12 0.2% 25 0.2% 23 0.0% 47 0.0% 25 0.2% 51 0.2%
9600 6 -7.0% 12 0.2% 11 0.0% 23 0.0% 12 0.2% 25 0.2%
14.4k 3 8.5% 8 -3.5% 7 0.0% 15 0.0% 8 -3.5% 16 2.1%
19.2k 2 8.5% 6 -7.0% 5 0.0% 11 0.0% 6 -7.0% 12 0.2%
28.8k 1 8.5% 3 8.5% 3 0.0% 7 0.0% 3 8.5% 8 -3.5%
38.4k 1 -18.6% 2 8.5% 2 0.0% 5 0.0% 2 8.5% 6 -7.0%
57.6k 0 8.5% 1 8.5% 1 0.0% 3 0.0% 1 8.5% 3 8.5%
76.8k – – 1 -18.6% 1 -25.0% 2 0.0% 1 -18.6% 2 8.5%
115.2k – – 0 8.5% 0 0.0% 1 0.0% 0 8.5% 1 8.5%
230.4k – – – – – – 0 0.0% – – – –
250k – – – – – – – – – – 0 0.0%
Max.(1) 62.5 Kbps 125 Kbps 115.2 Kbps 230.4 Kbps 125 Kbps 250 Kbps
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Note: 1. UBRRn = 0, Error = 0.0%
Table 19-5. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
Baud Rate (bps)
fosc = 3.6864 MHz fosc = 4.0000 MHz fosc = 7.3728 MHz
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error
2400 95 0.0% 191 0.0% 103 0.2% 207 0.2% 191 0.0% 383 0.0%
4800 47 0.0% 95 0.0% 51 0.2% 103 0.2% 95 0.0% 191 0.0%
9600 23 0.0% 47 0.0% 25 0.2% 51 0.2% 47 0.0% 95 0.0%
14.4k 15 0.0% 31 0.0% 16 2.1% 34 -0.8% 31 0.0% 63 0.0%
19.2k 11 0.0% 23 0.0% 12 0.2% 25 0.2% 23 0.0% 47 0.0%
28.8k 7 0.0% 15 0.0% 8 -3.5% 16 2.1% 15 0.0% 31 0.0%
38.4k 5 0.0% 11 0.0% 6 -7.0% 12 0.2% 11 0.0% 23 0.0%
57.6k 3 0.0% 7 0.0% 3 8.5% 8 -3.5% 7 0.0% 15 0.0%
76.8k 2 0.0% 5 0.0% 2 8.5% 6 -7.0% 5 0.0% 11 0.0%
115.2k 1 0.0% 3 0.0% 1 8.5% 3 8.5% 3 0.0% 7 0.0%
230.4k 0 0.0% 1 0.0% 0 8.5% 1 8.5% 1 0.0% 3 0.0%
250k 0 -7.8% 1 -7.8% 0 0.0% 1 0.0% 1 -7.8% 3 -7.8%
0.5M – – 0 -7.8% – – 0 0.0% 0 -7.8% 1 -7.8%
1M – – – – – – – – – – 0 -7.8%
Max.(1) 230.4 Kbps 460.8 Kbps 250 Kbps 0.5 Mbps 460.8 Kbps 921.6 Kbps
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Note: 1. UBRRn = 0, Error = 0.0%
Table 19-6. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
Baud Rate (bps)
fosc = 8.0000 MHz fosc = 11.0592 MHz fosc = 14.7456 MHz
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error
2400 207 0.2% 416 -0.1% 287 0.0% 575 0.0% 383 0.0% 767 0.0%
4800 103 0.2% 207 0.2% 143 0.0% 287 0.0% 191 0.0% 383 0.0%
9600 51 0.2% 103 0.2% 71 0.0% 143 0.0% 95 0.0% 191 0.0%
14.4k 34 -0.8% 68 0.6% 47 0.0% 95 0.0% 63 0.0% 127 0.0%
19.2k 25 0.2% 51 0.2% 35 0.0% 71 0.0% 47 0.0% 95 0.0%
28.8k 16 2.1% 34 -0.8% 23 0.0% 47 0.0% 31 0.0% 63 0.0%
38.4k 12 0.2% 25 0.2% 17 0.0% 35 0.0% 23 0.0% 47 0.0%
57.6k 8 -3.5% 16 2.1% 11 0.0% 23 0.0% 15 0.0% 31 0.0%
76.8k 6 -7.0% 12 0.2% 8 0.0% 17 0.0% 11 0.0% 23 0.0%
115.2k 3 8.5% 8 -3.5% 5 0.0% 11 0.0% 7 0.0% 15 0.0%
230.4k 1 8.5% 3 8.5% 2 0.0% 5 0.0% 3 0.0% 7 0.0%
250k 1 0.0% 3 0.0% 2 -7.8% 5 -7.8% 3 -7.8% 6 5.3%
0.5M 0 0.0% 1 0.0% – – 2 -7.8% 1 -7.8% 3 -7.8%
1M – – 0 0.0% – – – – 0 -7.8% 1 -7.8%
Max.(1) 0.5 Mbps 1 Mbps 691.2 Kbps 1.3824 Mbps 921.6 Kbps 1.8432 Mbps
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Note: 1. UBRRn = 0, Error = 0.0%
Table 19-7. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
Baud Rate (bps)
fosc = 16.0000 MHz fosc = 18.4320 MHz fosc = 20.0000 MHz
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error UBRRn Error
2400 416 -0.1% 832 0.0% 479 0.0% 959 0.0% 520 0.0% 1041 0.0%
4800 207 0.2% 416 -0.1% 239 0.0% 479 0.0% 259 0.2% 520 0.0%
9600 103 0.2% 207 0.2% 119 0.0% 239 0.0% 129 0.2% 259 0.2%
14.4k 68 0.6% 138 -0.1% 79 0.0% 159 0.0% 86 -0.2% 173 -0.2%
19.2k 51 0.2% 103 0.2% 59 0.0% 119 0.0% 64 0.2% 129 0.2%
28.8k 34 -0.8% 68 0.6% 39 0.0% 79 0.0% 42 0.9% 86 -0.2%
38.4k 25 0.2% 51 0.2% 29 0.0% 59 0.0% 32 -1.4% 64 0.2%
57.6k 16 2.1% 34 -0.8% 19 0.0% 39 0.0% 21 -1.4% 42 0.9%
76.8k 12 0.2% 25 0.2% 14 0.0% 29 0.0% 15 1.7% 32 -1.4%
115.2k 8 -3.5% 16 2.1% 9 0.0% 19 0.0% 10 -1.4% 21 -1.4%
230.4k 3 8.5% 8 -3.5% 4 0.0% 9 0.0% 4 8.5% 10 -1.4%
250k 3 0.0% 7 0.0% 4 -7.8% 8 2.4% 4 0.0% 9 0.0%
0.5M 1 0.0% 3 0.0% – – 4 -7.8% – – 4 0.0%
1M 0 0.0% 1 0.0% – – – – – – – –
Max.(1) 1 Mbps 2 Mbps 1.152 Mbps 2.304 Mbps 1.25 Mbps 2.5 Mbps
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19.11 USART Register Description
19.11.1 UDRn – USART I/O Data Register
The USART Transmit Data Buffer Register and USART Receive Data Buffer Registers share thesame I/O address referred to as USART Data Register or UDRn. The Transmit Data Buffer Reg-ister (TXB) will be the destination for data written to the UDRn Register location. Reading theUDRn Register location will return the contents of the Receive Data Buffer Register (RXB).
For 5-, 6-, or 7-bit characters the upper unused bits will be ignored by the Transmitter and set tozero by the Receiver.
The transmit buffer can only be written when the UDREn Flag in the UCSRnA Register is set.Data written to UDRn when the UDREn Flag is not set, will be ignored by the USART Transmit-ter. When data is written to the transmit buffer, and the Transmitter is enabled, the Transmitterwill load the data into the Transmit Shift Register when the Shift Register is empty. Then thedata will be serially transmitted on the TxD pin.
The receive buffer consists of a two level FIFO. The FIFO will change its state whenever thereceive buffer is accessed. Due to this behavior of the receive buffer, do not use Read-Modify-Write instructions (SBI and CBI) on this location. Be careful when using bit test instructions(SBIC and SBIS), since these also will change the state of the FIFO.
19.11.2 UCSRnA – USART Control and Status Register A
• Bit 7 – RXCn: USART Receive Complete nThis flag bit is set when there are unread data in the receive buffer and cleared when the receivebuffer is empty (that is, does not contain any unread data). If the Receiver is disabled, thereceive buffer will be flushed and consequently the RXCn bit will become zero. The RXCn Flagcan be used to generate a Receive Complete interrupt (see description of the RXCIEn bit).
• Bit 6 – TXCn: USART Transmit Complete nThis flag bit is set when the entire frame in the Transmit Shift Register has been shifted out andthere are no new data currently present in the transmit buffer (UDRn). The TXC Flag bit is auto-matically cleared when a transmit complete interrupt is executed, or it can be cleared by writinga one to its bit location. The TXC Flag can generate a Transmit Complete interrupt (see descrip-tion of the TXCIE bit).
• Bit 5 – UDREn: USART Data Register Empty n
The UDREn Flag indicates if the transmit buffer (UDRn) is ready to receive new data. If UDREnis one, the buffer is empty, and therefore ready to be written. The UDREn Flag can generate aData Register Empty interrupt (see description of the UDRIEn bit).
Bit 7 6 5 4 3 2 1 0
(0xC6)RXB[7:0] UDRn (Read)
TXB[7:0] UDRn (Write)
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xC0) RXCn TXCn UDREn FEn DORn UPEn U2Xn MPCMn UCSRnA
Read/Write R R/W R R R R R/W R/W
Initial Value 0 0 1 0 0 0 0 0
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UDREn is set after a reset to indicate that the Transmitter is ready.
• Bit 4 – FEn: Frame Error nThis bit is set if the next character in the receive buffer had a Frame Error when received, that is,when the first stop bit of the next character in the receive buffer is zero. This bit is valid until thereceive buffer (UDRn) is read. The FEn bit is zero when the stop bit of received data is one.Always set this bit to zero when writing to UCSRnA.
• Bit 3 – DORn: Data OverRun nThis bit is set if a Data OverRun condition is detected. A Data OverRun occurs when the receivebuffer is full (two characters), it is a new character waiting in the Receive Shift Register, and anew start bit is detected. This bit is valid until the receive buffer (UDRn) is read. Always set thisbit to zero when writing to UCSRnA.
• Bit 2 – UPEn: USART Parity Error nThis bit is set if the next character in the receive buffer had a Parity Error when received and theParity Checking was enabled at that point (UPM1n = 1). This bit is valid until the receive buffer(UDRn) is read. Always set this bit to zero when writing to UCSRnA.
• Bit 1 – U2Xn: Double the USART Transmission Speed nThis bit only has effect for the asynchronous operation. Write this bit to zero when using syn-chronous operation.
Writing this bit to one will reduce the divisor of the baud rate divider from 16 to 8 effectively dou-bling the transfer rate for asynchronous communication.
• Bit 0 – MPCMn: Multi-processor Communication Mode nThis bit enables the Multi-processor Communication mode. When the MPCMn bit is written toone, all the incoming frames received by the USART Receiver that do not contain address infor-mation will be ignored. The Transmitter is unaffected by the MPCMn setting. For more detailedinformation see ”Multi-processor Communication Mode” on page 188.
19.11.3 UCSRnB – USART Control and Status Register n B
• Bit 7 – RXCIEn: RX Complete Interrupt Enable nWriting this bit to one enables interrupt on the RXC Flag. A USART Receive Complete interruptwill be generated only if the RXCIE bit is written to one, the Global Interrupt Flag in SREG is writ-ten to one and the RXC bit in UCSRnA is set.
• Bit 6 – TXCIEn: TX Complete Interrupt Enable nWriting this bit to one enables interrupt on the TXCn Flag. A USART Transmit Complete interruptwill be generated only if the TXCIEn bit is written to one, the Global Interrupt Flag in SREG iswritten to one and the TXCn bit in UCSRnA is set.
Bit 7 6 5 4 3 2 1 0
(0xC1) RXCIEn TXCIEn UDRIEn RXENn TXENn UCSZn2 RXB8n TXB8n UCSRnB
Read/Write R/W R/W R/W R/W R/W R/W R R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 5 – UDRIEn: USART Data Register Empty Interrupt EnableWriting this bit to one enables interrupt on the UDREn Flag. A Data Register Empty interrupt willbe generated only if the UDRIEn bit is written to one, the Global Interrupt Flag in SREG is writtento one and the UDREn bit in UCSRnA is set.
• Bit 4 – RXENn: Receiver Enable nWriting this bit to one enables the USART Receiver. The Receiver will override normal port oper-ation for the RxD pin when enabled. Disabling the Receiver will flush the receive bufferinvalidating the FEn, DORn, and UPEn Flags.
• Bit 3 – TXENn: Transmitter Enable nWriting this bit to one enables the USART Transmitter. The Transmitter will override normal portoperation for the TxD pin when enabled. The disabling of the Transmitter (writing TXENn tozero) will not become effective until ongoing and pending transmissions are completed, that is,when the Transmit Shift Register and Transmit Buffer Register do not contain data to be trans-mitted. When disabled, the Transmitter will no longer override the TxD port.
• Bit 2 – UCSZn2: Character Size nThe UCSZn2 bits combined with the UCSZ1n:0 bit in UCSRnC sets the number of data bits(Character SiZe) in a frame the Receiver and Transmitter use.
• Bit 1 – RXB8n: Receive Data Bit 8 nRXB8n is the ninth data bit of the received character when operating with serial frames with ninedata bits. Must be read before reading the low bits from UDRn.
• Bit 0 – TXB8n: Transmit Data Bit 8 nTXB8n is the ninth data bit in the character to be transmitted when operating with serial frameswith nine data bits. Must be written before writing the low bits to UDRn.
19.11.4 UCSRnC – USART Control and Status Register n C
• Bit 6 – UMSELn: USART Mode Select nThis bit selects between asynchronous and synchronous mode of operation.
• Bit 5:4 – UPMn[1:0]: Parity ModeThese bits enable and set type of parity generation and check. If enabled, the Transmitter willautomatically generate and send the parity of the transmitted data bits within each frame. The
Bit 7 6 5 4 3 2 1 0
(0xC2) – UMSELn UPMn1 UPMn0 USBSn UCSZn1 UCSZn0 UCPOLn UCSRnC
Read/Write R R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 1 1 0
Table 19-8. UMSELn Bit Settings
UMSELn Mode
0 Asynchronous Operation
1 Synchronous Operation
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Receiver will generate a parity value for the incoming data and compare it to the UPM0n setting.If a mismatch is detected, the UPEn Flag in UCSRnA will be set.
• Bit 3 – USBSn: Stop Bit SelectThis bit selects the number of stop bits to be inserted by the Transmitter. The Receiver ignoresthis setting.
• Bit 2:1 – UCSZn[1:0]: Character Size
The UCSZn[1:0] bits combined with the UCSZn2 bit in UCSRnB sets the number of data bits(Character SiZe) in a frame the Receiver and Transmitter use.
• Bit 0 – UCPOLn: Clock PolarityThis bit is used for synchronous mode only. Write this bit to zero when asynchronous mode isused. The UCPOLn bit sets the relationship between data output change and data input sample,and the synchronous clock (XCK).
Table 19-9. UPM Bits Settings
UPMn1 UPMn0 Parity Mode
0 0 Disabled
0 1 Reserved
1 0 Enabled, Even Parity
1 1 Enabled, Odd Parity
Table 19-10. USBSn Bit Settings
USBSn Stop Bit(s)
0 1-bit
1 2-bit
Table 19-11. UCSZ Bits Settings
UCSZn2 UCSZn1 UCSZn0 Character Size
0 0 0 5-bit
0 0 1 6-bit
0 1 0 7-bit
0 1 1 8-bit
1 0 0 Reserved
1 0 1 Reserved
1 1 0 Reserved
1 1 1 9-bit
Table 19-12. UCPOLn Bit Settings
UCPOLnTransmitted Data Changed(Output of TxD Pin)
Received Data Sampled (Input on RxD Pin)
0 Rising XCK Edge Falling XCK Edge
1 Falling XCK Edge Rising XCK Edge
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19.11.5 UBRRLn and UBRRHn – USART Baud Rate Registers
• Bit 15:12 – Reserved BitsThese bits are reserved for future use. For compatibility with future devices, these bit must bewritten to zero when UBRRHn is written.
• Bit 11:0 – UBRR11:0: USART Baud Rate RegisterThis is a 12-bit register which contains the USART baud rate. The UBRRHn contains the fourmost significant bits, and the UBRRLn contains the eight least significant bits of the USARTbaud rate. Ongoing transmissions by the Transmitter and Receiver will be corrupted if the baudrate is changed. Writing UBRRLn will trigger an immediate update of the baud rate prescaler.
Bit 15 14 13 12 11 10 9 8
(0xC5) – – – – UBRRn[11:8] UBRRHn
(0xC4) UBRRn[7:0] UBRRLn
7 6 5 4 3 2 1 0
Read/Write R R R R R/W R/W R/W R/W
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
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20. USI – Universal Serial Interface
The Universal Serial Interface, or USI, provides the basic hardware resources needed for serialcommunication. Combined with a minimum of control software, the USI allows significantlyhigher transfer rates and uses less code space than solutions based on software only. Interruptsare included to minimize the processor load. The main features of the USI are:
• Two-wire Synchronous Data Transfer (Master or Slave)• Three-wire Synchronous Data Transfer (Master or Slave)• Data Received Interrupt• Wakeup from Idle Mode• In Two-wire Mode: Wake-up from All Sleep Modes, Including Power-down Mode• Two-wire Start Condition Detector with Interrupt Capability
20.1 Overview
A simplified block diagram of the USI is shown on Figure 20-1. For the actual placement of I/Opins, refer to Figure 1-1 on page 2. CPU accessible I/O Registers, including I/O bits and I/O pins,are shown in bold. The device-specific I/O Register and bit locations are listed in the ”USI Regis-ter Descriptions” on page 207.
Figure 20-1. Universal Serial Interface, Block Diagram
The 8-bit Shift Register is directly accessible via the data bus and contains the incoming andoutgoing data. The register has no buffering so the data must be read as quickly as possible toensure that no data is lost. The most significant bit is connected to one of two output pinsdepending of the wire mode configuration. A transparent latch is inserted between the SerialRegister Output and output pin, which delays the change of data output to the opposite clockedge of the data input sampling. The serial input is always sampled from the Data Input (DI) pinindependent of the configuration.
The 4-bit counter can be both read and written via the data bus, and can generate an overflowinterrupt. Both the Serial Register and the counter are clocked simultaneously by the same clocksource. This allows the counter to count the number of bits received or transmitted and generate
DA
TA
BU
S
US
IPF
US
ITC
US
ICLK
US
ICS
0
US
ICS
1
US
IOIF
US
IOIE
US
IDC
US
ISIF
US
IWM
0
US
IWM
1
US
ISIE
Bit7
Two-wire ClockControl Unit
DO (Output only)
DI/SDA (Input/Open Drain)
USCK/SCL (Input/Open Drain)4-bit Counter
USIDR
USISR
D QLE
USICR
CLOCKHOLD
TIM0 COMP
Bit0
[1]
3
01
2
3
01
2
0
1
2
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an interrupt when the transfer is complete. Note that when an external clock source is selectedthe counter counts both clock edges. In this case the counter counts the number of edges, andnot the number of bits. The clock can be selected from three different sources: The USCK pin,Timer/Counter0 Compare Match or from software.
The Two-wire clock control unit can generate an interrupt when a start condition is detected onthe Two-wire bus. It can also generate wait states by holding the clock pin low after a start con-dition is detected, or after the counter overflows.
20.2 Functional Descriptions
20.2.1 Three-wire Mode
The USI Three-wire mode is compliant to the Serial Peripheral Interface (SPI) mode 0 and 1, butdoes not have the slave select (SS) pin functionality. However, this feature can be implementedin software if necessary. Pin names used by this mode are: DI, DO, and USCK.
Figure 20-2. Three-wire Mode Operation, Simplified Diagram
Figure 20-2 shows two USI units operating in Three-wire mode, one as Master and one asSlave. The two Shift Registers are interconnected in such way that after eight USCK clocks, thedata in each register are interchanged. The same clock also increments the USI’s 4-bit counter.The Counter Overflow (interrupt) Flag, or USIOIF, can therefore be used to determine when atransfer is completed. The clock is generated by the Master device software by toggling theUSCK pin via the PORT Register or by writing a one to the USITC bit in USICR.
SLAVE
MASTER
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
DO
DI
USCK
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
DO
DI
USCK
PORTxn
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Figure 20-3. Three-wire Mode, Timing Diagram
The Three-wire mode timing is shown in Figure 20-3 At the top of the figure is a USCK cycle ref-erence. One bit is shifted into the USI Shift Register (USIDR) for each of these cycles. TheUSCK timing is shown for both external clock modes. In External Clock mode 0 (USICS0 = 0), DIis sampled at positive edges, and DO is changed (Data Register is shifted by one) at negativeedges. External Clock mode 1 (USICS0 = 1) uses the opposite edges versus mode 0, that is,samples data at negative and changes the output at positive edges. The USI clock modes corre-sponds to the SPI data mode 0 and 1.
Referring to the timing diagram (Figure 20-3), a bus transfer involves the following steps:
1. The Slave device and Master device sets up its data output and, depending on the proto-col used, enables its output driver (mark A and B). The output is set up by writing the data to be transmitted to the Serial Data Register. Enabling of the output is done by set-ting the corresponding bit in the port Data Direction Register. Note that point A and B does not have any specific order, but both must be at least one half USCK cycle before point C where the data is sampled. This must be done to ensure that the data setup requirement is satisfied. The 4-bit counter is reset to zero.
2. The Master generates a clock pulse by software toggling the USCK line twice (C and D). The bit value on the slave and master’s data input (DI) pin is sampled by the USI on the first edge (C), and the data output is changed on the opposite edge (D). The 4-bit counter will count both edges.
3. Step 2. is repeated eight times for a complete register (byte) transfer.
4. After eight clock pulses (that is, 16 clock edges) the counter will overflow and indicate that the transfer is completed. The data bytes transferred must now be processed before a new transfer can be initiated. The overflow interrupt will wake up the processor if it is set to Idle mode. Depending of the protocol used the slave device can now set its output to high impedance.
20.2.2 SPI Master Operation Example
The following code demonstrates how to use the USI module as a SPI Master:
SPITransfer:
sts USIDR,r16
ldi r16,(1<<USIOIF)
sts USISR,r16
ldi r16,(1<<USIWM0)|(1<<USICS1)|(1<<USICLK)|(1<<USITC)
SPITransfer_loop:
sts USICR,r16
lds r16, USISR
sbrs r16, USIOIF
MSB
MSB
6 5 4 3 2 1 LSB
1 2 3 4 5 6 7 8
6 5 4 3 2 1 LSB
USCK
USCK
DO
DI
DCBA E
CYCLE ( Reference )
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rjmp SPITransfer_loop
lds r16,USIDR
ret
The code is size optimized using only eight instructions (+ ret). The code example assumes thatthe DO and USCK pins are enabled as output in the DDRE Register. The value stored in registerr16 prior to the function is called is transferred to the Slave device, and when the transfer is com-pleted the data received from the Slave is stored back into the r16 Register.
The second and third instructions clears the USI Counter Overflow Flag and the USI countervalue. The fourth and fifth instruction set Three-wire mode, positive edge Shift Register clock,count at USITC strobe, and toggle USCK. The loop is repeated 16 times.
The following code demonstrates how to use the USI module as a SPI Master with maximumspeed (fsck = fck/4):
SPITransfer_Fast:
sts USIDR,r16
ldi r16,(1<<USIWM0)|(0<<USICS0)|(1<<USITC)
ldi r17,(1<<USIWM0)|(0<<USICS0)|(1<<USITC)|(1<<USICLK)
sts USICR,r16 ; MSB
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16
sts USICR,r17
sts USICR,r16 ; LSB
sts USICR,r17
lds r16,USIDR
ret
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20.2.3 SPI Slave Operation Example
The following code demonstrates how to use the USI module as a SPI Slave:
init:
ldi r16,(1<<USIWM0)|(1<<USICS1)
sts USICR,r16
...
SlaveSPITransfer:
sts USIDR,r16
ldi r16,(1<<USIOIF)
sts USISR,r16
SlaveSPITransfer_loop:
lds r16, USISR
sbrs r16, USIOIF
rjmp SlaveSPITransfer_loop
lds r16,USIDR
ret
The code is size optimized using only eight instructions (+ ret). The code example assumes thatthe DO is configured as output and USCK pin is configured as input in the DDR Register. Thevalue stored in register r16 prior to the function is called is transferred to the master device, andwhen the transfer is completed the data received from the Master is stored back into the r16Register.
Note that the first two instructions is for initialization only and needs only to be executedonce.These instructions sets Three-wire mode and positive edge Shift Register clock. The loopis repeated until the USI Counter Overflow Flag is set.
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20.2.4 Two-wire Mode
The USI Two-wire mode is compliant to the Inter IC (TWI) bus protocol, but without slew rate lim-iting on outputs and input noise filtering. Pin names used by this mode are SCL and SDA.
Figure 20-4. Two-wire Mode Operation, Simplified Diagram
Figure 20-4 shows two USI units operating in Two-wire mode, one as Master and one as Slave.It is only the physical layer that is shown since the system operation is highly dependent of thecommunication scheme used. The main differences between the Master and Slave operation atthis level, is the serial clock generation which is always done by the Master, and only the Slaveuses the clock control unit. Clock generation must be implemented in software, but the shiftoperation is done automatically by both devices. Note that only clocking on negative edge forshifting data is of practical use in this mode. The slave can insert wait states at start or end oftransfer by forcing the SCL clock low. This means that the Master must always check if the SCLline was actually released after it has generated a positive edge.
Since the clock also increments the counter, a counter overflow can be used to indicate that thetransfer is completed. The clock is generated by the master by toggling the USCK pin via thePORT Register.
The data direction is not given by the physical layer. A protocol, like the one used by the TWI-bus, must be implemented to control the data flow.
MASTER
SLAVE
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 SDA
SCL
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Two-wire ClockControl Unit
HOLDSCL
PORTxn
SDA
SCL
VCC
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Figure 20-5. Two-wire Mode, Typical Timing Diagram
Referring to the timing diagram (Figure 20-5), a bus transfer involves the following steps:
1. The a start condition is generated by the Master by forcing the SDA low line while the SCL line is high (A). SDA can be forced low either by writing a zero to bit 7 of the Shift Register, or by setting the corresponding bit in the PORT Register to zero. Note that the Data Direction Register bit must be set to one for the output to be enabled. The slave device’s start detector logic (Figure 20-6) detects the start condition and sets the USISIF Flag. The flag can generate an interrupt if necessary.
2. In addition, the start detector will hold the SCL line low after the Master has forced an negative edge on this line (B). This allows the Slave to wake up from sleep or complete its other tasks before setting up the Shift Register to receive the address. This is done by clearing the start condition flag and reset the counter.
3. The Master set the first bit to be transferred and releases the SCL line (C). The Slave samples the data and shift it into the Serial Register at the positive edge of the SCL clock.
4. After eight bits are transferred containing slave address and data direction (read or write), the Slave counter overflows and the SCL line is forced low (D). If the slave is not the one the Master has addressed, it releases the SCL line and waits for a new start condition.
5. If the Slave is addressed it holds the SDA line low during the acknowledgment cycle before holding the SCL line low again (that is, the Counter Register must be set to 14 before releasing SCL at (D)). Depending of the R/W bit the Master or Slave enables its output. If the bit is set, a master read operation is in progress (that is, the slave drives the SDA line) The slave can hold the SCL line low after the acknowledge (E).
6. Multiple bytes can now be transmitted, all in same direction, until a stop condition is given by the Master (F). Or a new start condition is given.
If the Slave is not able to receive more data it does not acknowledge the data byte it has lastreceived. When the Master does a read operation it must terminate the operation by force theacknowledge bit low after the last byte transmitted.
Figure 20-6. Start Condition Detector, Logic Diagram
PS ADDRESS
1 - 7 8 9
R/W ACK ACK
1 - 8 9
DATA ACK
1 - 8 9
DATA
SDA
SCL
A B D EC F
SDA
SCLWrite( USISIF)
CLOCKHOLD
USISIF
D Q
CLR
D Q
CLR
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20.2.5 Start Condition Detector
The start condition detector is shown in Figure 20-6 on page 205 The SDA line is delayed (in therange of 50 to 300 ns) to ensure valid sampling of the SCL line. The start condition detector isonly enabled in Two-wire mode.
The start condition detector is working asynchronously and can therefore wake up the processorfrom the Power-down sleep mode. However, the protocol used might have restrictions on theSCL hold time. Therefore, when using this feature in this case the Oscillator start-up time set bythe CKSEL Fuses (see ”Clock Systems and their Distribution” on page 30) must also be takeninto the consideration. Refer to the ”Bit 7 – USISIF: Start Condition Interrupt Flag” on page 207for further details.
20.2.6 Clock speed considerations.
Maximum frequency for SCL and SCK is f_CK /4. This is also the maximum data transmit andreceieve rate in both two- and three-wire mode. In two-wire slave mode the Two-wire Clock Con-trol Unit will hold the SCL low until the slave is ready to receive more data. This may reduce theactual data rate in two-wire mode.
20.3 Alternative USI Usage
When the USI unit is not used for serial communication, it can be set up to do alternative tasksdue to its flexible design.
20.3.1 Half-duplex Asynchronous Data Transfer
By utilizing the Shift Register in Three-wire mode, it is possible to implement a more compactand higher performance UART than by software only.
20.3.2 4-bit Counter
The 4-bit counter can be used as a stand-alone counter with overflow interrupt. Note that if thecounter is clocked externally, both clock edges will generate an increment.
20.3.3 12-bit Timer/Counter
Combining the USI 4-bit counter and Timer/Counter0 allows them to be used as a 12-bitcounter.
20.3.4 Edge Triggered External Interrupt
By setting the counter to maximum value (F) it can function as an additional external interrupt.The Overflow Flag and Interrupt Enable bit are then used for the external interrupt. This featureis selected by the USICS1 bit.
20.3.5 Software Interrupt
The counter overflow interrupt can be used as a software interrupt triggered by a clock strobe.
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20.4 USI Register Descriptions
20.4.1 USIDR – USI Data Register
The USI uses no buffering of the Serial Register, that is, when accessing the Data Register(USIDR) the Serial Register is accessed directly. If a serial clock occurs at the same cycle theregister is written, the register will contain the value written and no shift is performed. A (left) shiftoperation is performed depending of the USICS1..0 bits setting. The shift operation can be con-trolled by an external clock edge, by a Timer/Counter0 Compare Match, or directly by softwareusing the USICLK strobe bit. Note that even when no wire mode is selected (USIWM1..0 = 0)both the external data input (DI/SDA) and the external clock input (USCK/SCL) can still be usedby the Shift Register.
The output pin in use, DO or SDA depending on the wire mode, is connected via the output latchto the most significant bit (bit 7) of the Data Register. The output latch is open (transparent) dur-ing the first half of a serial clock cycle when an external clock source is selected (USICS1 = 1),and constantly open when an internal clock source is used (USICS1 = 0). The output will bechanged immediately when a new MSB written as long as the latch is open. The latch ensuresthat data input is sampled and data output is changed on opposite clock edges.
Note that the corresponding Data Direction Register to the pin must be set to one for enablingdata output from the Shift Register.
20.4.2 USISR – USI Status Register
The Status Register contains Interrupt Flags, line Status Flags and the counter value.
• Bit 7 – USISIF: Start Condition Interrupt FlagWhen Two-wire mode is selected, the USISIF Flag is set (to one) when a start condition isdetected. When output disable mode or Three-wire mode is selected and (USICSx = 0b11 &USICLK = 0) or (USICS = 0b10 & USICLK = 0), any edge on the SCK pin sets the flag.
An interrupt will be generated when the flag is set while the USISIE bit in USICR and the GlobalInterrupt Enable Flag are set. The flag will only be cleared by writing a logical one to the USISIFbit. Clearing this bit will release the start detection hold of USCL in Two-wire mode.
A start condition interrupt will wakeup the processor from all sleep modes.
• Bit 6 – USIOIF: Counter Overflow Interrupt FlagThis flag is set (one) when the 4-bit counter overflows (that is, at the transition from 15 to 0). Aninterrupt will be generated when the flag is set while the USIOIE bit in USICR and the GlobalInterrupt Enable Flag are set. The flag will only be cleared if a one is written to the USIOIF bit.Clearing this bit will release the counter overflow hold of SCL in Two-wire mode.
Bit 7 6 5 4 3 2 1 0
(0xBA) MSB LSB USIDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
(0xB9) USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 USISR
Read/Write R/W R/W R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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A counter overflow interrupt will wakeup the processor from Idle sleep mode.
• Bit 5 – USIPF: Stop Condition FlagWhen Two-wire mode is selected, the USIPF Flag is set (one) when a stop condition is detected.The flag is cleared by writing a one to this bit. Note that this is not an Interrupt Flag. This signal isuseful when implementing Two-wire bus master arbitration.
• Bit 4 – USIDC: Data Output CollisionThis bit is logical one when bit 7 in the Shift Register differs from the physical pin value. The flagis only valid when Two-wire mode is used. This signal is useful when implementing Two-wirebus master arbitration.
• Bits 3..0 – USICNT3:0: Counter ValueThese bits reflect the current 4-bit counter value. The 4-bit counter value can directly be read orwritten by the CPU.
The 4-bit counter increments by one for each clock generated either by the external clock edgedetector, by a Timer/Counter0 Compare Match, or by software using USICLK or USITC strobebits. The clock source depends of the setting of the USICS1:0 bits. For external clock operationa special feature is added that allows the clock to be generated by writing to the USITC strobebit. This feature is enabled by write a one to the USICLK bit while setting an external clocksource (USICS1 = 1).
Note that even when no wire mode is selected (USIWM1:0 = 0) the external clock input(USCK/SCL) are can still be used by the counter.
20.4.3 USICR – USI Control Register
The Control Register includes interrupt enable control, wire mode setting, Clock Select setting,and clock strobe.
• Bit 7 – USISIE: Start Condition Interrupt EnableSetting this bit to one enables the Start Condition detector interrupt. If there is a pending inter-rupt when the USISIE and the Global Interrupt Enable Flag is set to one, this will immediately beexecuted. Refer to the ”Bit 7 – USISIF: Start Condition Interrupt Flag” on page 207 for furtherdetails.
• Bit 6 – USIOIE: Counter Overflow Interrupt EnableSetting this bit to one enables the Counter Overflow interrupt. If there is a pending interrupt whenthe USIOIE and the Global Interrupt Enable Flag is set to one, this will immediately be executed.Refer to the ”Bit 6 – USIOIF: Counter Overflow Interrupt Flag” on page 207 for further details.
• Bit 5:4 – USIWM1:0: Wire ModeThese bits set the type of wire mode to be used. Basically only the function of the outputs areaffected by these bits. Data and clock inputs are not affected by the mode selected and willalways have the same function. The counter and Shift Register can therefore be clocked exter-
Bit 7 6 5 4 3 2 1 0
(0xB8) USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC USICR
Read/Write R/W R/W R/W R/W R/W R/W W W
Initial Value 0 0 0 0 0 0 0 0
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nally, and data input sampled, even when outputs are disabled. The relations betweenUSIWM1:0 and the USI operation is summarized in Table 20-1 on page 210.
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Note: 1. The DI and USCK pins are renamed to Serial Data (SDA) and Serial Clock (SCL) respectively to avoid confusion between the modes of operation.
• Bit 3:2 – USICS1:0: Clock Source Select
These bits set the clock source for the Shift Register and counter. The data output latch ensuresthat the output is changed at the opposite edge of the sampling of the data input (DI/SDA) whenusing external clock source (USCK/SCL). When software strobe or Timer/Counter0 CompareMatch clock option is selected, the output latch is transparent and therefore the output ischanged immediately. Clearing the USICS1..0 bits enables software strobe option. When usingthis option, writing a one to the USICLK bit clocks both the Shift Register and the counter. Forexternal clock source (USICS1 = 1), the USICLK bit is no longer used as a strobe, but selectsbetween external clocking and software clocking by the USITC strobe bit.
Table 20-1. Relations between USIWM1:0 and the USI Operation
USIWM1 USIWM0 Description
0 0Outputs, clock hold, and start detector disabled. Port pins operates as normal.
0 1
Three-wire mode. Uses DO, DI, and USCK pins.
The Data Output (DO) pin overrides the corresponding bit in the PORT Register in this mode. However, the corresponding DDR bit still controls the data direction. When the port pin is set as input the pins pull-up is controlled by the PORT bit.
The Data Input (DI) and Serial Clock (USCK) pins do not affect the normal port operation. When operating as master, clock pulses are software generated by toggling the PORT Register, while the data direction is set to output. The USITC bit in the USICR Register can be used for this purpose.
1 0
Two-wire mode. Uses SDA (DI) and SCL (USCK) pins(1).
The Serial Data (SDA) and the Serial Clock (SCL) pins are bi-directional and uses open-collector output drives. The output drivers are enabled by setting the corresponding bit for SDA and SCL in the DDR Register.
When the output driver is enabled for the SDA pin, the output driver will force the line SDA low if the output of the Shift Register or the corresponding bit in the PORT Register is zero. Otherwise the SDA line will not be driven (that is, it is released). When the SCL pin output driver is enabled the SCL line will be forced low if the corresponding bit in the PORT Register is zero, or by the start detector. Otherwise the SCL line will not be driven.The SCL line is held low when a start detector detects a start condition and the output is enabled. Clearing the Start Condition Flag (USISIF) releases the line. The SDA and SCL pin inputs is not affected by enabling this mode. Pull-ups on the SDA and SCL port pin are disabled in Two-wire mode.
1 1
Two-wire mode. Uses SDA and SCL pins.Same operation as for the Two-wire mode described above, except that the SCL line is also held low when a counter overflow occurs, and is held low until the Counter Overflow Flag (USIOIF) is cleared.
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Table 20-2 shows the relationship between the USICS1:0 and USICLK setting and clock sourceused for the Shift Register and the 4-bit counter.
• Bit 1 – USICLK: Clock StrobeWriting a one to this bit location strobes the Shift Register to shift one step and the counter toincrement by one, provided that the USICS1..0 bits are set to zero and by doing so the softwareclock strobe option is selected. The output will change immediately when the clock strobe is exe-cuted, that is, in the same instruction cycle. The value shifted into the Shift Register is sampledthe previous instruction cycle. The bit will be read as zero.
When an external clock source is selected (USICS1 = 1), the USICLK function is changed froma clock strobe to a Clock Select Register. Setting the USICLK bit in this case will select theUSITC strobe bit as clock source for the 4-bit counter (see Table 20-2).
• Bit 0 – USITC: Toggle Clock Port PinWriting a one to this bit location toggles the USCK/SCL value either from 0 to 1, or from 1 to 0.The toggling is independent of the setting in the Data Direction Register, but if the PORT value isto be shown on the pin the DDRE4 must be set as output (to one). This feature allows easy clockgeneration when implementing master devices. The bit will be read as zero.
When an external clock source is selected (USICS1 = 1) and the USICLK bit is set to one, writ-ing to the USITC strobe bit will directly clock the 4-bit counter. This allows an early detection ofwhen the transfer is done when operating as a master device.
Table 20-2. Relations between the USICS1:0 and USICLK Setting
USICS1 USICS0 USICLK Shift Register Clock Source 4-bit Counter Clock Source
0 0 0 No Clock No Clock
0 0 1Software clock strobe (USICLK)
Software clock strobe (USICLK)
0 1 XTimer/Counter0 Compare Match
Timer/Counter0 Compare Match
1 0 0 External, positive edge External, both edges
1 1 0 External, negative edge External, both edges
1 0 1 External, positive edge Software clock strobe (USITC)
1 1 1 External, negative edge Software clock strobe (USITC)
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21. AC - Analog Comparator
The Analog Comparator compares the input values on the positive pin AIN0 and negative pinAIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pinAIN1, the Analog Comparator output, ACO, is set. The comparator’s output can be set to triggerthe Timer/Counter1 Input Capture function. In addition, the comparator can trigger a separateinterrupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on com-parator output rise, fall or toggle. A block diagram of the comparator and its surrounding logic isshown in Figure 21-1.
The Power Reduction ADC bit, PRADC, in ”PRR – Power Reduction Register” on page 45 mustbe disabled by writing a logical zero to be able to use the ADC input MUX.
Figure 21-1. Analog Comparator Block Diagram(2)
Notes: 1. See Table 21-1 on page 213.2. Refer to Figure 1-1 on page 2 and Table 13-5 on page 74 for Analog Comparator pin
placement.
ACBG
BANDGAPREFERENCE
ADC MULTIPLEXEROUTPUT
ACMEADEN
(1)
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21.1 Analog Comparator Multiplexed Input
It is possible to select any of the ADC7:0 pins to replace the negative input to the Analog Com-parator. The ADC multiplexer is used to select this input, and consequently, the ADC must beswitched off to utilize this feature. If the Analog Comparator Multiplexer Enable bit (ACME inADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is zero), MUX2:0 in ADMUXselect the input pin to replace the negative input to the Analog Comparator, as shown in Table21-1. If ACME is cleared or ADEN is set, AIN1 is applied to the negative input to the AnalogComparator.
Table 21-1. Analog Comparator Multiplexed Input
ACME ADEN MUX2:0 Analog Comparator Negative Input
0 x xxx AIN1
1 1 xxx AIN1
1 0 000 ADC0
1 0 001 ADC1
1 0 010 ADC2
1 0 011 ADC3
1 0 100 ADC4
1 0 101 ADC5
1 0 110 ADC6
1 0 111 ADC7
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21.2 Analog Comparator Register Description
21.2.1 ADCSRB – ADC Control and Status Register B
• Bit 6 – ACME: Analog Comparator Multiplexer EnableWhen this bit is written logic one and the ADC is switched off (ADEN in ADCSRA is zero), theADC multiplexer selects the negative input to the Analog Comparator. When this bit is writtenlogic zero, AIN1 is applied to the negative input of the Analog Comparator. For a detaileddescription of this bit, see ”Analog Comparator Multiplexed Input” on page 213.
21.2.2 ACSR – Analog Comparator Control and Status Register
• Bit 7 – ACD: Analog Comparator DisableWhen this bit is written logic one, the power to the Analog Comparator is switched off. This bitcan be set at any time to turn off the Analog Comparator. This will reduce power consumption inActive and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must bedisabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit ischanged.
• Bit 6 – ACBG: Analog Comparator Bandgap SelectWhen this bit is set, a fixed bandgap reference voltage replaces the positive input to the AnalogComparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog Compar-ator. See ”Internal Voltage Reference” on page 51.
• Bit 5 – ACO: Analog Comparator OutputThe output of the Analog Comparator is synchronized and then directly connected to ACO. Thesynchronization introduces a delay of 1 - 2 clock cycles.
• Bit 4 – ACI: Analog Comparator Interrupt FlagThis bit is set by hardware when a comparator output event triggers the interrupt mode definedby ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is setand the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding inter-rupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag.
• Bit 3 – ACIE: Analog Comparator Interrupt EnableWhen the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Com-parator interrupt is activated. When written logic zero, the interrupt is disabled.
• Bit 2 – ACIC: Analog Comparator Input Capture EnableWhen written logic one, this bit enables the Input Capture function in Timer/Counter1 to be trig-gered by the Analog Comparator. The comparator output is in this case directly connected to the
Bit 7 6 5 4 3 2 1 0
(0x7B) – ACME – – – ADTS2 ADTS1 ADTS0 ADCSRB
Read/Write R R/W R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x30 (0x50) ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 ACSR
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 N/A 0 0 0 0 0
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Input Capture front-end logic, making the comparator utilize the noise canceler and edge selectfeatures of the Timer/Counter1 Input Capture interrupt. When written logic zero, no connectionbetween the Analog Comparator and the Input Capture function exists. To make the comparatortrigger the Timer/Counter1 Input Capture interrupt, the ICIE1 bit in the Timer Interrupt MaskRegister (TIMSK1) must be set.
• Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode SelectThese bits determine which comparator events that trigger the Analog Comparator interrupt. Thedifferent settings are shown in Table 21-2 on page 215.
When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled byclearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when thebits are changed.
21.2.3 DIDR1 – Digital Input Disable Register 1
• Bit 1, 0 – AIN1D, AIN0D: AIN1, AIN0 Digital Input DisableWhen this bit is written logic one, the digital input buffer on the AIN1/0 pin is disabled. The corre-sponding PIN Register bit will always read as zero when this bit is set. When an analog signal isapplied to the AIN1/0 pin and the digital input from this pin is not needed, this bit should be writ-ten logic one to reduce power consumption in the digital input buffer.
Table 21-2. ACIS1/ACIS0 Settings
ACIS1 ACIS0 Interrupt Mode
0 0 Comparator Interrupt on Output Toggle.
0 1 Reserved
1 0 Comparator Interrupt on Falling Output Edge.
1 1 Comparator Interrupt on Rising Output Edge.
Bit 7 6 5 4 3 2 1 0
(0x7F) – – – – – – AIN1D AIN0D DIDR1
Read/Write R R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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22. ADC - Analog to Digital Converter
22.1 Features
• 10-bit Resolution• 0.5 LSB Integral Non-linearity• ±2 LSB Absolute Accuracy• 13 µs - 260 µs Conversion Time (50 kHz to 1 MHz ADC clock)• Up to 15 ksps at Maximum Resolution (200 kHz ADC clock)• Eight Multiplexed Single Ended Input Channels• Optional Left Adjustment for ADC Result Readout• 0 - VCC ADC Input Voltage Range• Selectable 1.1V ADC Reference Voltage• Free Running or Single Conversion Mode• ADC Start Conversion by Auto Triggering on Interrupt Sources• Interrupt on ADC Conversion Complete• Sleep Mode Noise Canceler
22.2 Overview
The ATmega169P features a 10-bit successive approximation ADC. The ADC is connected toan 8-channel Analog Multiplexer which allows eight single-ended voltage inputs constructedfrom the pins of Port F. The single-ended voltage inputs refer to 0V (GND).
The ADC contains a Sample and Hold circuit which ensures that the input voltage to the ADC isheld at a constant level during conversion. A block diagram of the ADC is shown in Figure 22-1on page 217.
The ADC has a separate analog supply voltage pin, AVCC. AVCC must not differ more than±0.3V from VCC. See the paragraph ”ADC Noise Canceler” on page 222 on how to connect thispin.
Internal reference voltages of nominally 1.1V or AVCC are provided On-chip. The voltage refer-ence may be externally decoupled at the AREF pin by a capacitor for better noise performance.
The Power Reduction ADC bit, PRADC, in ”PRR – Power Reduction Register” on page 45 mustbe written to zero to enable the ADC module.
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Figure 22-1. Analog to Digital Converter Block Schematic
22.3 Operation
The ADC converts an analog input voltage to a 10-bit digital value through successive approxi-mation. The minimum value represents GND and the maximum value represents the voltage onthe AREF pin minus 1 LSB. Optionally, AVCC or an internal 1.1V reference voltage may be con-nected to the AREF pin by writing to the REFSn bits in the ADMUX Register. The internalvoltage reference may thus be decoupled by an external capacitor at the AREF pin to improvenoise immunity.
The analog input channel is selected by writing to the MUX bits in ADMUX. Any of the ADC inputpins, as well as GND and a fixed bandgap voltage reference, can be selected as single endedinputs to the ADC. The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Volt-age reference and input channel selections will not go into effect until ADEN is set. The ADCdoes not consume power when ADEN is cleared, so it is recommended to switch off the ADCbefore entering power saving sleep modes.
The ADC generates a 10-bit result which is presented in the ADC Data Registers, ADCH andADCL. By default, the result is presented right adjusted, but can optionally be presented leftadjusted by setting the ADLAR bit in ADMUX.
ADC CONVERSIONCOMPLETE IRQ
8-BIT DATA BUS
15 0
ADC MULTIPLEXERSELECT (ADMUX)
ADC CTRL. & STATUSREGISTER (ADCSRA)
ADC DATA REGISTER(ADCH/ADCL)
MU
X2
AD
IE
AD
AT
E
AD
SC
AD
EN
AD
IFA
DIF
MU
X1
MU
X0
AD
PS
0
AD
PS
1
AD
PS
2
MU
X3
CONVERSION LOGIC
10-BIT DAC
+-
SAMPLE & HOLDCOMPARATOR
INTERNAL REFERENCE
MUX DECODER
MU
X4
AVCC
ADC7
ADC6
ADC5
ADC4
ADC3
ADC2
ADC1
ADC0
RE
FS
0
RE
FS
1
AD
LAR
+
-
CH
AN
NE
L S
ELE
CT
ION
AD
C[9
:0]
ADC MULTIPLEXEROUTPUT
DIFFERENTIALAMPLIFIER
AREF
BANDGAPREFERENCE
PRESCALER
SINGLE ENDED / DIFFERENTIAL SELECTION
GND
POS.INPUTMUX
NEG.INPUTMUX
TRIGGERSELECT
ADTS[2:0]
INTERRUPTFLAGS
START
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If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to readADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content of the DataRegisters belongs to the same conversion. Once ADCL is read, ADC access to Data Registersis blocked. This means that if ADCL has been read, and a conversion completes before ADCH isread, neither register is updated and the result from the conversion is lost. When ADCH is read,ADC access to the ADCH and ADCL Registers is re-enabled.
The ADC has its own interrupt which can be triggered when a conversion completes. When ADCaccess to the Data Registers is prohibited between reading of ADCH and ADCL, the interruptwill trigger even if the result is lost.
22.4 Starting a Conversion
A single conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC.This bit stays high as long as the conversion is in progress and will be cleared by hardwarewhen the conversion is completed. If a different data channel is selected while a conversion is inprogress, the ADC will finish the current conversion before performing the channel change.
Alternatively, a conversion can be triggered automatically by various sources. Auto Triggering isenabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The trigger source isselected by setting the ADC Trigger Select bits, ADTS in ADCSRB (See description of the ADTSbits for a list of the trigger sources). When a positive edge occurs on the selected trigger signal,the ADC prescaler is reset and a conversion is started. This provides a method of starting con-versions at fixed intervals. If the trigger signal still is set when the conversion completes, a newconversion will not be started. If another positive edge occurs on the trigger signal during con-version, the edge will be ignored. Note that an Interrupt Flag will be set even if the specificinterrupt is disabled or the Global Interrupt Enable bit in SREG is cleared. A conversion can thusbe triggered without causing an interrupt. However, the Interrupt Flag must be cleared in order totrigger a new conversion at the next interrupt event.
Figure 22-2. ADC Auto Trigger Logic
Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion as soonas the ongoing conversion has finished. The ADC then operates in Free Running mode, con-stantly sampling and updating the ADC Data Register. The first conversion must be started bywriting a logical one to the ADSC bit in ADCSRA. In this mode the ADC will perform successiveconversions independently of whether the ADC Interrupt Flag, ADIF is cleared or not.
ADSC
ADIF
SOURCE 1
SOURCE n
ADTS[2:0]
CONVERSIONLOGIC
PRESCALER
START CLKADC
.
.
.
. EDGEDETECTOR
ADATE
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If Auto Triggering is enabled, single conversions can be started by writing ADSC in ADCSRA toone. ADSC can also be used to determine if a conversion is in progress. The ADSC bit will beread as one during a conversion, independently of how the conversion was started.
22.5 Prescaling and Conversion Timing
Figure 22-3. ADC Prescaler
By default, the successive approximation circuitry requires an input clock frequency between 50kHz and 200 kHz to get maximum resolution. If a lower resolution than 10 bits is needed, theinput clock frequency to the ADC can be higher than 200 kHz to get a higher sample rate.
The ADC module contains a prescaler, which generates an acceptable ADC clock frequencyfrom any CPU frequency above 100 kHz. The prescaling is set by the ADPS bits in ADCSRA.The prescaler starts counting from the moment the ADC is switched on by setting the ADEN bitin ADCSRA. The prescaler keeps running for as long as the ADEN bit is set, and is continuouslyreset when ADEN is low.
When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the conversionstarts at the following rising edge of the ADC clock cycle.
A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is switchedon (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize the analog circuitry.
The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal conver-sion and 13.5 ADC clock cycles after the start of an first conversion. When a conversion iscomplete, the result is written to the ADC Data Registers, and ADIF is set. In Single Conversionmode, ADSC is cleared simultaneously. The software may then set ADSC again, and a newconversion will be initiated on the first rising ADC clock edge.
When Auto Triggering is used, the prescaler is reset when the trigger event occurs. This assuresa fixed delay from the trigger event to the start of conversion. In this mode, the sample-and-holdtakes place two ADC clock cycles after the rising edge on the trigger source signal. Three addi-tional CPU clock cycles are used for synchronization logic. When using Differential mode, alongwith Auto triggering from a source other than the ADC Conversion Complete, each conversionwill require 25 ADC clocks. This is because the ADC must be disabled and re-enabled afterevery conversion.
7-BIT ADC PRESCALER
ADC CLOCK SOURCE
CK
ADPS0ADPS1ADPS2
CK
/128
CK
/2
CK
/4
CK
/8
CK
/16
CK
/32
CK
/64
ResetADENSTART
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In Free Running mode, a new conversion will be started immediately after the conversion com-pletes, while ADSC remains high. For a summary of conversion times, see Table 22-1 on page221.
Figure 22-4. ADC Timing Diagram, First Conversion (Single Conversion Mode)
Figure 22-5. ADC Timing Diagram, Single Conversion
Figure 22-6. ADC Timing Diagram, Auto Triggered Conversion
Sign and MSB of Result
LSB of Result
ADC Clock
ADSC
Sample & Hold
ADIF
ADCH
ADCL
Cycle Number
ADEN
1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2
First ConversionNextConversion
3
MUX and REFSUpdate
MUX and REFSUpdate
ConversionComplete
1 2 3 4 5 6 7 8 9 10 11 12 13
Sign and MSB of Result
LSB of Result
ADC Clock
ADSC
ADIF
ADCH
ADCL
Cycle Number 1 2
One Conversion Next Conversion
3
Sample & Hold
MUX and REFSUpdate
ConversionComplete
MUX and REFSUpdate
1 2 3 4 5 6 7 8 9 10 11 12 13
Sign and MSB of Result
LSB of Result
ADC Clock
TriggerSource
ADIF
ADCH
ADCL
Cycle Number 1 2
One Conversion Next Conversion
ConversionCompletePrescaler
Reset
ADATE
PrescalerReset
Sample &Hold
MUX and REFS Update
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Figure 22-7. ADC Timing Diagram, Free Running Conversion
22.6 Changing Channel or Reference Selection
The MUXn and REFS1:0 bits in the ADMUX Register are single buffered through a temporaryregister to which the CPU has random access. This ensures that the channels and referenceselection only takes place at a safe point during the conversion. The channel and referenceselection is continuously updated until a conversion is started. Once the conversion starts, thechannel and reference selection is locked to ensure a sufficient sampling time for the ADC. Con-tinuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF inADCSRA is set). Note that the conversion starts on the following rising ADC clock edge afterADSC is written. The user is thus advised not to write new channel or reference selection valuesto ADMUX until one ADC clock cycle after ADSC is written.
If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Specialcare must be taken when updating the ADMUX Register, in order to control which conversionwill be affected by the new settings.
If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If theADMUX Register is changed in this period, the user cannot tell if the next conversion is basedon the old or the new settings. ADMUX can be safely updated in the following ways:
a. When ADATE or ADEN is cleared.
b. During conversion, minimum one ADC clock cycle after the trigger event.
c. After a conversion, before the Interrupt Flag used as trigger source is cleared.
When updating ADMUX in one of these conditions, the new settings will affect the next ADCconversion.
Table 22-1. ADC Conversion Time
ConditionSample & Hold (Cycles from Start of Conversion) Conversion Time (Cycles)
First conversion 13.5 25
Normal conversions, single ended 1.5 13
Auto Triggered conversions 2 13.5
11 12 13
Sign and MSB of Result
LSB of Result
ADC Clock
ADSC
ADIF
ADCH
ADCL
Cycle Number1 2
One Conversion Next Conversion
3 4
ConversionComplete
Sample & Hold
MUX and REFSUpdate
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22.6.1 ADC Input Channels
When changing channel selections, the user should observe the following guidelines to ensurethat the correct channel is selected:
In Single Conversion mode, always select the channel before starting the conversion. The chan-nel selection may be changed one ADC clock cycle after writing one to ADSC. However, thesimplest method is to wait for the conversion to complete before changing the channel selection.
In Free Running mode, always select the channel before starting the first conversion. The chan-nel selection may be changed one ADC clock cycle after writing one to ADSC. However, thesimplest method is to wait for the first conversion to complete, and then change the channelselection. Since the next conversion has already started automatically, the next result will reflectthe previous channel selection. Subsequent conversions will reflect the new channel selection.
22.6.2 ADC Voltage Reference
The reference voltage for the ADC (VREF) indicates the conversion range for the ADC. Singleended channels that exceed VREF will result in codes close to 0x3FF. VREF can be selected aseither AVCC, internal 1.1V reference, or external AREF pin.
AVCC is connected to the ADC through a passive switch. The internal 1.1V reference is gener-ated from the internal bandgap reference (VBG) through an internal buffer. In either case, theexternal AREF pin is directly connected to the ADC, and the reference voltage can be mademore immune to noise by connecting a capacitor between the AREF pin and ground. VREF canalso be measured at the AREF pin with a high impedant voltmeter. Note that VREF is a highimpedant source, and only a capacitive load should be connected in a system.
If the user has a fixed voltage source connected to the AREF pin, the user may not use the otherreference voltage options in the application, as they will be shorted to the external voltage. If noexternal voltage is applied to the AREF pin, the user may switch between AVCC and 1.1V asreference selection. The first ADC conversion result after switching reference voltage sourcemay be inaccurate, and the user is advised to discard this result.
22.7 ADC Noise Canceler
The ADC features a noise canceler that enables conversion during sleep mode to reduce noiseinduced from the CPU core and other I/O peripherals. The noise canceler can be used with ADCNoise Reduction and Idle mode. To make use of this feature, the following procedure should beused:
a. Make sure that the ADC is enabled and is not busy converting. Single Conversion mode must be selected and the ADC conversion complete interrupt must be enabled.
b. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion once the CPU has been halted.
c. If no other interrupts occur before the ADC conversion completes, the ADC interrupt will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If another interrupt wakes up the CPU before the ADC conversion is complete, that interrupt will be executed, and an ADC Conversion Complete interrupt request will be generated when the ADC conversion completes. The CPU will remain in active mode until a new sleep command is executed.
Note that the ADC will not be automatically turned off when entering other sleep modes than Idlemode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before enter-ing such sleep modes to avoid excessive power consumption.
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22.7.1 Analog Input Circuitry
The analog input circuitry for single ended channels is illustrated in Figure 22-8 An analogsource applied to ADCn is subjected to the pin capacitance and input leakage of that pin, regard-less of whether that channel is selected as input for the ADC. When the channel is selected, thesource must drive the S/H capacitor through the series resistance (combined resistance in theinput path).
The ADC is optimized for analog signals with an output impedance of approximately 10 kΩ orless. If such a source is used, the sampling time will be negligible. If a source with higher imped-ance is used, the sampling time will depend on how long time the source needs to charge theS/H capacitor, with can vary widely. The user is recommended to only use low impedant sourceswith slowly varying signals, since this minimizes the required charge transfer to the S/Hcapacitor.
Signal components higher than the Nyquist frequency (fADC/2) should not be present for eitherkind of channels, to avoid distortion from unpredictable signal convolution. The user is advisedto remove high frequency components with a low-pass filter before applying the signals asinputs to the ADC.
Figure 22-8. Analog Input Circuitry
ADCn
IIH
1..100 kΩCS/H= 14 pF
VCC/2
IIL
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22.7.2 Analog Noise Canceling Techniques
Digital circuitry inside and outside the device generates EMI which might affect the accuracy ofanalog measurements. If conversion accuracy is critical, the noise level can be reduced byapplying the following techniques:
a. Keep analog signal paths as short as possible. Make sure analog tracks run over the analog ground plane, and keep them well away from high-speed switching digital tracks.
b. The AVCC pin on the device should be connected to the digital VCC supply voltage via an LC network as shown in Figure 22-9.
c. Use the ADC noise canceler function to reduce induced noise from the CPU.
d. If any ADC port pins are used as digital outputs, it is essential that these do not switch while a conversion is in progress.
Figure 22-9. ADC Power Connections
VCC
GND
100 nF
Ground Plane
(ADC0) PF0
(ADC7) PF7
(ADC1) PF1
(ADC2) PF2
(ADC3) PF3
(ADC4) PF4
(ADC5) PF5
(ADC6) PF6
AREF
GND
AVCC
52
53
54
55
56
57
58
59
60
6161
6262
6363
6464
1
51
LCD
CA
P
PA0
10 µH
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22.7.3 ADC Accuracy Definitions
An n-bit single-ended ADC converts a voltage linearly between GND and VREF in 2n steps(LSBs). The lowest code is read as 0, and the highest code is read as 2n-1.
Several parameters describe the deviation from the ideal behavior:
• Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal transition (at 0.5 LSB). Ideal value: 0 LSB.
Figure 22-10. Offset Error
• Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the last transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below maximum). Ideal value: 0 LSB.
Figure 22-11. Gain Error
• Integral Non-linearity (INL): After adjusting for offset and gain error, the INL is the maximum deviation of an actual transition compared to an ideal transition for any code. Ideal value: 0 LSB.
Output Code
VREF Input Voltage
Ideal ADC
Actual ADC
OffsetError
Output Code
VREF Input Voltage
Ideal ADC
Actual ADC
GainError
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Figure 22-12. Integral Non-linearity (INL)
• Differential Non-linearity (DNL): The maximum deviation of the actual code width (the interval between two adjacent transitions) from the ideal code width (1 LSB). Ideal value: 0 LSB.
Figure 22-13. Differential Non-linearity (DNL)
• Quantization Error: Due to the quantization of the input voltage into a finite number of codes, a range of input voltages (1 LSB wide) will code to the same value. Always ±0.5 LSB.
• Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition compared to an ideal transition for any code. This is the compound effect of offset, gain error, differential error, non-linearity, and quantization error. Ideal value: ±0.5 LSB.
Output Code
VREF Input Voltage
Ideal ADC
Actual ADC
INL
Output Code
0x3FF
0x000
0 VREF Input Voltage
DNL
1 LSB
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22.8 ADC Conversion Result
After the conversion is complete (ADIF is high), the conversion result can be found in the ADCResult Registers (ADCL, ADCH).
For single ended conversion, the result is
where VIN is the voltage on the selected input pin and VREF the selected voltage reference (seeTable 22-3 on page 229 and Table 22-4 on page 230). 0x000 represents analog ground, and0x3FF represents the selected reference voltage minus one LSB.
Figure 22-14. Differential Measurement Range
ADCVIN 1024⋅VREF
--------------------------=
ADCVPOS VNEG–( ) 512⋅
VREF-----------------------------------------------------=
0
Output Code
0x1FF
0x000
VREFDifferential InputVoltage (Volts)
0x3FF
0x200
- VREF
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ADMUX = 0xFB (ADC3 - ADC2, 1.1V reference, left adjusted result).
Voltage on ADC3 is 300 mV, voltage on ADC2 is 500 mV.
ADCR = 512 × (300 - 500) / 1100 = -93 = 0x3A3.
ADCL will thus read 0xC0, and ADCH will read 0xD8. Writing zero to ADLAR right adjusts theresult: ADCL = 0xA3, ADCH = 0x03.
Table 22-2. Correlation Between Input Voltage and Output Codes
VADCn Read Code Corresponding Decimal Value
VADCm + VREF 0x1FF 511
VADCm + 511/512 VREF 0x1FF 511
VADCm + 510/512 VREF 0x1FE 510
... ... ...
VADCm + 1/512 VREF 0x001 1
VADCm 0x000 0
VADCm - 1/512 VREF 0x3FF -1
... ... ...
VADCm - 511/512 VREF 0x201 -511
VADCm - VREF 0x200 -512
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22.9 ADC Register Description
22.9.1 ADMUX – ADC Multiplexer Selection Register
• Bit 7:6 – REFS1:0: Reference Selection BitsThese bits select the voltage reference for the ADC, as shown in Table 22-3. If these bits arechanged during a conversion, the change will not go in effect until this conversion is complete(ADIF in ADCSRA is set). The internal voltage reference options may not be used if an externalreference voltage is being applied to the AREF pin.
• Bit 5 – ADLAR: ADC Left Adjust ResultThe ADLAR bit affects the presentation of the ADC conversion result in the ADC Data Register.Write one to ADLAR to left adjust the result. Otherwise, the result is right adjusted. Changing theADLAR bit will affect the ADC Data Register immediately, regardless of any ongoing conver-sions. For a complete description of this bit, see ”ADCL and ADCH – ADC Data Register” onpage 232.
• Bits 4:0 – MUX4:0: Analog Channel Selection BitsThe value of these bits selects which combination of analog inputs are connected to the ADC.See Table 22-4 on page 230 for details. If these bits are changed during a conversion, thechange will not go in effect until this conversion is complete (ADIF in ADCSRA is set).
Bit 7 6 5 4 3 2 1 0
(0x7C) REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 ADMUX
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 22-3. Voltage Reference Selections for ADC
REFS1 REFS0 Voltage Reference Selection
0 0 AREF, Internal Vref turned off
0 1 AVCC with external capacitor at AREF pin
1 0 Reserved
1 1 Internal 1.1V Voltage Reference with external capacitor at AREF pin
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Table 22-4. Input Channel Selections
MUX4..0 Single Ended Input Positive Differential Input Negative Differential Input
00000 ADC0
N/A
00001 ADC1
00010 ADC2
00011 ADC3
00100 ADC4
00101 ADC5
00110 ADC6
00111 ADC7
01000
01001
01010
01011
01100
01101
01110
01111
10000 ADC0 ADC1
10001 ADC1 ADC1
10010 N/A ADC2 ADC1
10011 ADC3 ADC1
10100 ADC4 ADC1
10101 ADC5 ADC1
10110 ADC6 ADC1
10111 ADC7 ADC1
11000 ADC0 ADC2
11001 ADC1 ADC2
11010 ADC2 ADC2
11011 ADC3 ADC2
11100 ADC4 ADC2
11101 ADC5 ADC2
11110 1.1V (VBG)N/A
11111 0V (GND)
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22.9.2 ADCSRA – ADC Control and Status Register A
• Bit 7 – ADEN: ADC EnableWriting this bit to one enables the ADC. By writing it to zero, the ADC is turned off. Turning theADC off while a conversion is in progress, will terminate this conversion.
• Bit 6 – ADSC: ADC Start ConversionIn Single Conversion mode, write this bit to one to start each conversion. In Free Running mode,write this bit to one to start the first conversion. The first conversion after ADSC has been writtenafter the ADC has been enabled, or if ADSC is written at the same time as the ADC is enabled,will take 25 ADC clock cycles instead of the normal 13. This first conversion performs initializa-tion of the ADC.
ADSC will read as one as long as a conversion is in progress. When the conversion is complete,it returns to zero. Writing zero to this bit has no effect.
• Bit 5 – ADATE: ADC Auto Trigger EnableWhen this bit is written to one, Auto Triggering of the ADC is enabled. The ADC will start a con-version on a positive edge of the selected trigger signal. The trigger source is selected by settingthe ADC Trigger Select bits, ADTS in ADCSRB.
• Bit 4 – ADIF: ADC Interrupt FlagThis bit is set when an ADC conversion completes and the Data Registers are updated. TheADC Conversion Complete Interrupt is executed if the ADIE bit and the I-bit in SREG are set.ADIF is cleared by hardware when executing the corresponding interrupt handling vector. Alter-natively, ADIF is cleared by writing a logical one to the flag. Beware that if doing a Read-Modify-Write on ADCSRA, a pending interrupt can be disabled. This also applies if the SBI and CBIinstructions are used.
• Bit 3 – ADIE: ADC Interrupt EnableWhen this bit is written to one and the I-bit in SREG is set, the ADC Conversion Complete Inter-rupt is activated.
• Bits 2:0 – ADPS2:0: ADC Prescaler Select Bits
These bits determine the division factor between the XTAL frequency and the input clock to theADC.
Bit 7 6 5 4 3 2 1 0
(0x7A) ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 ADCSRA
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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22.9.3 ADCL and ADCH – ADC Data Register
22.9.3.1 ADLAR = 0
22.9.3.2 ADLAR = 1
When an ADC conversion is complete, the result is found in these two registers.When ADCL isread, the ADC Data Register is not updated until ADCH is read. Consequently, if the result is leftadjusted and no more than 8-bit precision is required, it is sufficient to read ADCH. Otherwise,ADCL must be read first, then ADCH.
The ADLAR bit in ADMUX, and the MUXn bits in ADMUX affect the way the result is read fromthe registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared (default), the resultis right adjusted.
• ADC9:0: ADC Conversion ResultThese bits represent the result from the conversion, as detailed in ”ADC Conversion Result” onpage 227.
Table 22-5. ADC Prescaler Selections
ADPS2 ADPS1 ADPS0 Division Factor
0 0 0 2
0 0 1 2
0 1 0 4
0 1 1 8
1 0 0 16
1 0 1 32
1 1 0 64
1 1 1 128
Bit 15 14 13 12 11 10 9 8
(0x79) – – – – – – ADC9 ADC8 ADCH
(0x78) ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
Bit 15 14 13 12 11 10 9 8
ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH
ADC1 ADC0 – – – – – – ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
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22.9.4 ADCSRB – ADC Control and Status Register B
• Bit 7 – Res: Reserved BitThis bit is reserved for future use. To ensure compatibility with future devices, this bit must bewritten to zero when ADCSRB is written.
• Bit 2:0 – ADTS2:0: ADC Auto Trigger SourceIf ADATE in ADCSRA is written to one, the value of these bits selects which source will triggeran ADC conversion. If ADATE is cleared, the ADTS2:0 settings will have no effect. A conversionwill be triggered by the rising edge of the selected Interrupt Flag. Note that switching from a trig-ger source that is cleared to a trigger source that is set, will generate a positive edge on thetrigger signal. If ADEN in ADCSRA is set, this will start a conversion. Switching to Free Runningmode (ADTS[2:0]=0) will not cause a trigger event, even if the ADC Interrupt Flag is set.
22.9.5 DIDR0 – Digital Input Disable Register 0
• Bit 7:0 – ADC7D..ADC0D: ADC7:0 Digital Input DisableWhen this bit is written logic one, the digital input buffer on the corresponding ADC pin is dis-abled. The corresponding PIN Register bit will always read as zero when this bit is set. When ananalog signal is applied to the ADC7:0 pin and the digital input from this pin is not needed, thisbit should be written logic one to reduce power consumption in the digital input buffer.
Bit 7 6 5 4 3 2 1 0
(0x7B) – ACME – – – ADTS2 ADTS1 ADTS0 ADCSRB
Read/Write R R/W R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 22-6. ADC Auto Trigger Source Selections
ADTS2 ADTS1 ADTS0 Trigger Source
0 0 0 Free Running mode
0 0 1 Analog Comparator
0 1 0 External Interrupt Request 0
0 1 1 Timer/Counter0 Compare Match
1 0 0 Timer/Counter0 Overflow
1 0 1 Timer/Counter Compare Match B
1 1 0 Timer/Counter1 Overflow
1 1 1 Timer/Counter1 Capture Event
Bit 7 6 5 4 3 2 1 0
(0x7E) ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D DIDR0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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23. LCD Controller
23.1 Features
• Display Capacity of 25 Segments and Four Common Terminals• Support Static, 1/2, 1/3 and 1/4 Duty• Support Static, 1/2, 1/3 Bias• On-chip LCD Power Supply, only One External Capacitor needed• Display Possible in Power-save Mode for Low Power Consumption• Software Selectable Low Power Waveform Capability• Flexible Selection of Frame Frequency• Software Selection between System Clock or an External Asynchronous Clock Source• Equal Source and Sink Capability to maximize LCD Life Time• LCD Interrupt Can be Used for Display Data Update or Wake-up from Sleep Mode• Segment and Common Pins not Needed for Driving the Display Can be Used as Ordinary I/O Pins• Latching of Display Data gives Full Freedom in Register Update
23.2 Overview
The LCD Controller/driver is intended for monochrome passive liquid crystal display (LCD) withup to four common terminals and up to 25 segment terminals.
A simplified block diagram of the LCD Controller/Driver is shown in Figure 23-1 on page 235. Forthe actual placement of I/O pins, see ”64A (TQFP) and 64M1 (QFN/MLF) Pinout ATmega169P”on page 2.
An LCD consists of several segments (pixels or complete symbols) which can be visible or nonvisible. A segment has two electrodes with liquid crystal between them. When a voltage above athreshold voltage is applied across the liquid crystal, the segment becomes visible.
The voltage must alternate to avoid an electrophoresis effect in the liquid crystal, whichdegrades the display. Hence the waveform across a segment must not have a DC-component.
The PRLCD bit in ”PRR – Power Reduction Register” on page 45 must be written to zero toenable the LCD module.
23.2.1 Definitions
Several terms are used when describing LCD. The definitions in Table 23-1 are used throughoutthis document.
Table 23-1. Definitions
LCD A passive display panel with terminals leading directly to a segment
Segment The least viewing element (pixel) which can be on or off
Common Denotes how many segments are connected to a segment terminal
Duty 1/(Number of common terminals on a actual LCD display)
Bias 1/(Number of voltage levels used driving a LCD display -1)
Frame Rate Number of times the LCD segments is energized per second.
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Figure 23-1. LCD Module Block Diagram
23.2.2 LCD Clock Sources
The LCD Controller can be clocked by an internal synchronous or an external asynchronousclock source. The clock source clkLCD is by default equal to the system clock, clkI/O. When theLCDCS bit in the LCDCRB Register is written to logic one, the clock source is taken from theTOSC1 pin.
The clock source must be stable to obtain accurate LCD timing and hence minimize DC voltageoffset across LCD segments.
23.2.3 LCD Prescaler
The prescaler consist of a 12-bit ripple counter and a 1- to 8-clock divider. The LCDPS2:0 bitsselects clkLCD divided by 16, 64, 128, 256, 512, 1024, 2048, or 4096.
If a finer resolution rate is required, the LCDCD2:0 bits can be used to divide the clock further by1 to 8.
Output from the clock divider clkLCD_PS is used as clock source for the LCD timing.
23.2.4 LCD Memory
The display memory is available through I/O Registers grouped for each common terminal.When a bit in the display memory is written to one, the corresponding segment is energized (on),and non-energized when a bit in the display memory is written to zero.
ClockMultiplexer
12-bit Prescaler0
1
Divide by 1 to 8
LCDTiming
LCDCRB
LCDFRR
clki/o
TOSC
LCDCRA
DATA
BUS
clkLC
D /4096
clkLC
D /2048
clkLC
D /128
clkLC
D /1024
clkLC
D /512
clkLC
D /256
clkLC
D /64
clkLC
D /16
AnalogSwitchArray
lcdcs
lcdcd2:0
lcdps2:0
clkLCD
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
COM0
COM1
COM2
COM3
LCD Buffer/Driver
VLCD
LCDDR 18 -15
LCDDR 13 -10
LCDDR 8 - 5
LCDDR 3 - 0
LATCHarray
LCD OuputDecoder
LCDCCRlcdcc3:0
Contrast Controller/Power Supply
clkLCD_PS
LCDCAP
25 x4:1
MUX
LCD_voltage_ok
2/3 VLCD
1/2 VLCD
1/3 VLCD
DisplayConfiguration
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To energize a segment, an absolute voltage above a certain threshold must be applied. This isdone by letting the output voltage on corresponding COM pin and SEG pin have opposite phase.For display with more than one common, one (1/2 bias) or two (1/3 bias) additional voltage lev-els must be applied. Otherwise, non-energized segments on COM0 would be energized for allnon-selected common.
Addressing COM0 starts a frame by driving opposite phase with large amplitude out on COM0compared to none addressed COM lines. Non-energized segments are in phase with theaddressed COM0, and energized segments have opposite phase and large amplitude. Forwaveform figures refer to ”Mode of Operation” on page 237. Latched data from LCDDR4 -LCDDR0 is multiplexed into the decoder. The decoder is controlled from the LCD timing andsets up signals controlling the analog switches to produce an output waveform. Next, COM1 isaddressed, and latched data from LCDDR9 - LCDDR5 is input to decoder. Addressing continu-ous until all COM lines are addressed according to number of common (duty). The display dataare latched before a new frame start.
23.2.5 LCD Contrast Controller/Power Supply
The peak value (VLCD) on the output waveform determines the LCD Contrast. VLCD is controlledby software from 2.6V to 3.35V independent of VCC. An internal signal inhibits output to the LCDuntil VLCD has reached its target value.
23.2.6 LCDCAP
An external capacitor (typical > 470 nF) must be connected to the LCDCAP pin as shown in Fig-ure 23-2. This capacitor acts as a reservoir for LCD power (VLCD). A large capacitance reducesripple on VLCD but increases the time until VLCD reaches its target value.
It is possible to use an external power supply. This power can be applied to LCDCAP beforeVCC. Externally applied VLCD can be both above and below VCC. Maximum VLCD is 5.5V.
Figure 23-2. LCDCAP Connection
23.2.7 LCD Buffer Driver
Intermediate voltage levels are generated from buffers/drivers. The buffers are active theamount of time specified by LCDDC[2:0] in ”LCDCCR – LCD Contrast Control Register” on page250. Then LCD output pins are tri-stated and buffers are switched off. Shortening the drive timewill reduce power consumption, but displays with high internal resistance or capacitance mayneed longer drive time to achieve sufficient contrast.
321
64
63
62
LCDCAP
VLCD
(Optional)
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23.2.8 Minimizing Power Consumption
By keeping the percentage of the time the LCD drivers are turned on at a minimum, the powerconsumption of the LCD driver can be minimized. This can be achieved by using the lowestacceptable frame rate, and using low power waveform if possible. The drive time should be keptat the lowest setting that achieves satisfactory contrast for a particular display, while allowingsome headroom for production variations between individual LCD drivers and displays. Notethat some of the highest LCD voltage settings may result in high power consumption when VCC
is below 2.0V. The recommended maximum LCD voltage is 2*(VCC - 0.2V).
23.3 Mode of Operation
23.3.1 Static Duty and Bias
If all segments on a LCD have one electrode common, then each segment must have a uniqueterminal.
This kind of display is driven with the waveform shown in Figure 23-3. SEG0 - COM0 is the volt-age across a segment that is on, and SEG1 - COM0 is the voltage across a segment that is off.
Figure 23-3. Driving a LCD with One Common Terminal
23.3.2 1/2 Duty and 1/2 Bias
For LCD with two common terminals (1/2 duty) a more complex waveform must be used to indi-vidually control segments. Although 1/3 bias can be selected 1/2 bias is most common for thesedisplays. Waveform is shown in Figure 23-4 on page 238. SEG0 - COM0 is the voltage across asegment that is on, and SEG0 - COM1 is the voltage across a segment that is off.
VLCD
GND
VLCD
GND
VLCD
GND
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
VLCD
GND
VLCD
GND
GND
SEG1
COM0
SEG1 - COM0
Frame Frame
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Figure 23-4. Driving a LCD with Two Common Terminals
VLCD
GND
VLCD1/2VLCD
GND
VLCD1/2VLCD
GND-1/2VLCD
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
VLCD
GND
VLCD1/2VLCD
GND
VLCD1/2VLCD
GND-1/2VLCD
-VLCD
SEG0
COM1
SEG0 - COM1
Frame Frame
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23.3.3 1/3 Duty and 1/3 Bias
1/3 bias is usually recommended for LCD with three common terminals (1/3 duty). Waveform isshown in Figure 23-5. SEG0 - COM0 is the voltage across a segment that is on and SEG0-COM1 is the voltage across a segment that is off.
Figure 23-5. Driving a LCD with Three Common Terminals
23.3.4 1/4 Duty and 1/3 Bias
1/3 bias is optimal for LCD displays with four common terminals (1/4 duty). Waveform is shownin Figure 23-6. SEG0 - COM0 is the voltage across a segment that is on and SEG0 - COM1 isthe voltage across a segment that is off.
Figure 23-6. Driving a LCD with Four Common Terminals
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM1
SEG0 - COM1
Frame Frame
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM1
SEG0 - COM1
Frame Frame
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23.3.5 Low Power Waveform
To reduce toggle activity and hence power consumption a low power waveform can be selectedby writing LCDAB to one. Low power waveform requires two subsequent frames with the samedisplay data to obtain zero DC voltage. Consequently data latching and Interrupt Flag is only setevery second frame. Default and low power waveform is shown in Figure 23-7 for 1/3 duty and1/3 bias. For other selections of duty and bias, the effect is similar.
Figure 23-7. Default and Low Power Waveform
23.3.6 Operation in Sleep Mode
When synchronous LCD clock is selected (LCDCS = 0) the LCD display will operate in Idlemode and Power-save mode with any clock source.
An asynchronous clock from TOSC1 can be selected as LCD clock by writing the LCDCS bit toone when Calibrated Internal RC Oscillator is selected as system clock source. The LCD willthen operate in Idle mode, ADC Noise Reduction mode and Power-save mode.
When EXCLK in ASSR Register is written to one, and asynchronous clock is selected, the exter-nal clock input buffer is enabled and an external clock can be input on Timer Oscillator 1(TOSC1) pin instead of a 32 kHz crystal. See ”Asynchronous operation of the Timer/Counter” onpage 150 for further details.
Before entering Power-down mode, Standby mode or ADC Noise Reduction mode with synchro-nous LCD clock selected, the user have to disable the LCD. Refer to ”Disabling the LCD” onpage 244.
23.3.7 Display Blanking
When LCDBL is written to one, the LCD is blanked after completing the current frame. All seg-ments and common pins are connected to GND, discharging the LCD. Display memory ispreserved. Display blanking should be used before disabling the LCD to avoid DC voltageacross segments, and a slowly fading image.
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND
VLCD2/3VLCD1/3VLCD
GND-1/3VLCD-2/3VLCD
-VLCD
SEG0
COM0
SEG0 - COM0
Frame Frame
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23.3.8 Port Mask
For LCD with less than 25 segment terminals, it is possible to mask some of the unused pinsand use them as ordinary port pins instead. Refer to Table 23-3 on page 247 for details. Unusedcommon pins are automatically configured as port pins.
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23.4 LCD Usage
The following section describes how to use the LCD.
23.4.1 LCD Initialization
Prior to enabling the LCD some initialization must be preformed. The initialization process nor-mally consists of setting the frame rate, duty, bias and port mask. LCD contrast is set initially, butcan also be adjusted during operation.
Consider the following LCD as an example:
Figure 23-8. LCD usage example.
Display: TN Positive, Reflective
Number of common terminals: 3
Number of segment terminals: 21
Bias system: 1/3 Bias
Drive system: 1/3 Duty
Operating voltage: 3.0 ±0.3V
1b
1c
2a
2b
2c2e
2f
2d
2g
COM3
COM0 COM1 COM2
SEG0
SEG1
SEG2
1b,1c
2c
2f
2a
2d
2g
2b
2e
..
CO
M2
SEG0
SEG1
SEG2
ATmega169
CO
M1
CO
M0
Connection table
LCD
51 50 49
48
47
46
45
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Note: 1. See ”About Code Examples” on page 10.
Before a re-initialization is done, the LCD controller/driver should be disabled.
23.4.2 Updating the LCD
Display memory (LCDDR0, LCDDR1, ..), LCD Blanking (LCDBL), Low power waveform(LCDAB) and contrast control (LCDCCR) are latched prior to every new frame. There are norestrictions on writing these LCD Register locations, but an LCD data update may be splitbetween two frames if data are latched while an update is in progress. To avoid this, an interruptroutine can be used to update Display memory, LCD Blanking, Low power waveform, and con-trast control, just after data are latched.
Assembly Code Example(1)
LCD_Init:
; Use 32 kHz crystal oscillator
; 1/3 Bias and 1/3 duty, SEG21:SEG24 is used as port pins
ldi r16, (1<<LCDCS) | (1<<LCDMUX1)| (1<<LCDPM2)
sts LCDCRB, r16
; Using 16 as prescaler selection and 7 as LCD Clock Divide
; gives a frame rate of 49 Hz
ldi r16, (1<<LCDCD2) | (1<<LCDCD1)
sts LCDFRR, r16
; Set segment drive time to 125 µs and output voltage to 3.3 V
ldi r16, (1<<LCDDC1) | (1<<LCDCC3) | (1<<LCDCC2) | (1<<LCDCC1)
sts LCDCCR, r16
; Enable LCD, default waveform and no interrupt enabled
ldi r16, (1<<LCDEN)
sts LCDCRA, r16
ret
C Code Example(1)
Void LCD_Init(void);
{
/* Use 32 kHz crystal oscillator */
/* 1/3 Bias and 1/3 duty, SEG21:SEG24 is used as port pins */
LCDCRB = (1<<LCDCS) | (1<<LCDMUX1)| (1<<LCDPM2);
/* Using 16 as prescaler selection and 7 as LCD Clock Divide */
/* gives a frame rate of 49 Hz */
LCDFRR = (1<<LCDCD2) | (1<<LCDCD1);
/* Set segment drive time to 125 µs and output voltage to 3.3 V*/
LCDCCR = (1<<LCDDC1) | (1<<LCDCC3) | (1<<LCDCC2) | (1<<LCDCC1);
/* Enable LCD, default waveform and no interrupt enabled */
LCDCRA = (1<<LCDEN);
}
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In the example below we assume SEG10 and COM1 and SEG4 in COM0 are the only segmentschanged from frame to frame. Data are stored in r20 and r21 for simplicity
Note: 1. See ”About Code Examples” on page 10.
23.4.3 Disabling the LCD
In some application it may be necessary to disable the LCD. This is the case if the MCU entersPower-down mode where no clock source is present.
The LCD should be completely discharged before being disabled. No DC voltage should be leftacross any segment. The best way to achieve this is to use the LCD Blanking feature that drivesall segment pins and common pins to GND.
When the LCD is disabled, port function is activated again. Therefore, the user must check thatport pins connected to a LCD terminal are either tri-state or output low (sink).
Assembly Code Example(1)
LCD_update:
; LCD Blanking and Low power waveform are unchanged.
; Update Display memory.
sts LCDDR0, r20
sts LCDDR6, r21
ret
C Code Example(1)
Void LCD_update(unsigned char data1, data2);
{
/* LCD Blanking and Low power waveform are unchanged. */
/* Update Display memory. */
LCDDR0 = data1;
LCDDR6 = data2;
}
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Note: 1. See ”About Code Examples” on page 10.
Assembly Code Example(1)
LCD_disable:
; Wait until a new frame is started.
Wait_1:
lds r16, LCDCRA
sbrs r16, LCDIF
rjmp Wait_1
; Set LCD Blanking and clear interrupt flag
; by writing a logical one to the flag.
ldi r16, (1<<LCDEN)|(1<<LCDIF)|(1<<LCDBL)
sts LCDCRA, r16
; Wait until LCD Blanking is effective.
Wait_2:
lds r16, LCDCRA
sbrs r16, LCDIF
rjmp Wait_2
; Disable LCD.
ldi r16, (0<<LCDEN)
sts LCDCRA, r16
ret
C Code Example(1)
Void LCD_disable(void);
{
/* Wait until a new frame is started. */
while ( !(LCDCRA & (1<<LCDIF)) )
;
/* Set LCD Blanking and clear interrupt flag */
/* by writing a logical one to the flag. */
LCDCRA = (1<<LCDEN)|(1<<LCDIF)|(1<<LCDBL);
/* Wait until LCD Blanking is effective. */
while ( !(LCDCRA & (1<<LCDIF)) )
;
/* Disable LCD */
LCDCRA = (0<<LCDEN);
}
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23.5 LCD Register Description
23.5.1 LCDCRA – LCD Control and Status Register A
• Bit 7 – LCDEN: LCD EnableWriting this bit to one enables the LCD Controller/Driver. By writing it to zero, the LCD is turnedoff immediately. Turning the LCD Controller/Driver off while driving a display, enables ordinaryport function, and DC voltage can be applied to the display if ports are configured as output. It isrecommended to drive output to ground if the LCD Controller/Driver is disabled to discharge thedisplay.
• Bit 6 – LCDAB: LCD Low Power WaveformWhen LCDAB is written logic zero, the default waveform is output on the LCD pins. WhenLCDAB is written logic one, the Low Power Waveform is output on the LCD pins. If this bit ismodified during display operation the change takes place at the beginning of a new frame.
• Bit 5 – Res: Reserved BitThis bit is reserved and will always read as zero.
• Bit 4 – LCDIF: LCD Interrupt FlagThis bit is set by hardware at the beginning of a new frame, at the same time as the display datais updated. The LCD Start of Frame Interrupt is executed if the LCDIE bit and the I-bit in SREGare set. LCDIF is cleared by hardware when executing the corresponding Interrupt HandlingVector. Alternatively, writing a logical one to the flag clears LCDIF. Beware that if doing a Read-Modify-Write on LCDCRA, a pending interrupt can be disabled. If Low Power Waveform isselected the Interrupt Flag is set every second frame.
• Bit 3 – LCDIE: LCD Interrupt EnableWhen this bit is written to one and the I-bit in SREG is set, the LCD Start of Frame Interrupt isenabled.
• Bit 2 – LCDBD: LCD Buffer DisableThe intermediate voltage levels in the LCD are generated by an internal resistive voltage dividerand passed through buffer to increase the current driving capability. By writing this bit to one thebuffers are turned off and bypassed, resulting in decreased power consumption. The total resis-tance of the voltage divider is nominally 400 kΩ between LCDCAP and GND.
• Bit 1 – LCDCCD: LCD Contrast Control DisableWriting this bit to one disables the internal power supply for the LCD driver. The desired voltagemust be applied to the LCDCAP pin from an external power supply. To avoid conflict betweeninternal and external power supply, this bit must be written as '1' prior to or simultaneously withwriting '1' to the LCDEN bit.
Bit 7 6 5 4 3 2 1 0
(0xE4) LCDEN LCDAB – LCDIF LCDIE LCDBD LCDCCD LCDBL LCDCRA
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 0 – LCDBL: LCD BlankingWhen this bit is written to one, the display will be blanked after completion of a frame. All seg-ment and common pins will be driven to ground.
23.5.2 LCDCRB – LCD Control and Status Register B
• Bit 7 – LCDCS: LCD Clock SelectWhen this bit is written to zero, the system clock is used. When this bit is written to one, theexternal asynchronous clock source is used. The asynchronous clock source is eitherTimer/Counter Oscillator or external clock, depending on EXCLK in ASSR. See ”Asynchronousoperation of the Timer/Counter” on page 150 for further details.
• Bit 6 – LCD2B: LCD 1/2 Bias SelectWhen this bit is written to zero, 1/3 bias is used. When this bit is written to one, ½ bias is used.Refer to the LCD Manufacture for recommended bias selection.
• Bit 5:4 – LCDMUX1:0: LCD Mux SelectThe LCDMUX1:0 bits determine the duty cycle. Common pins that are not used are ordinary portpins. The different duty selections are shown in Table 23-2.
Note: 1. 1/2 bias when LCD2B is written to one and 1/3 otherwise.
• Bit 3 – Res: Reserved BitThis bit is reserved and will always read as zero.
• Bits 2:0 – LCDPM2:0: LCD Port MaskThe LCDPM2:0 bits determine the number of port pins to be used as segment drivers. The dif-ferent selections are shown in Table 23-3. Unused pins can be used as ordinary port pins.
Bit 7 6 5 4 3 2 1 0
(0xE5) LCDCS LCD2B LCDMUX1 LCDMUX0 – LCDPM2 LCDPM1 LCDPM0 LCDCRB
Read/Write R/W R/W R/W R/W R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 23-2. LCD Duty Select
LCDMUX1 LCDMUX0 Duty Bias COM Pin I/O Port Pin
0 0 Static Static COM0 COM1:3
0 1 1/2 1/2 or 1/3(1) COM0:1 COM2:3
1 0 1/3 1/2 or 1/3(1) COM0:2 COM3
1 1 1/4 1/2 or 1/3(1) COM0:3 None
Table 23-3. LCD Port Mask
LCDPM2 LCDPM1 LCDPM0I/O Port in Use as Segment
DriverMaximum Number of
Segments
0 0 0 SEG0:12 13
0 0 1 SEG0:14 15
0 1 0 SEG0:16 17
0 1 1 SEG0:18 19
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23.5.3 LCDFRR – LCD Frame Rate Register
• Bit 7 – Res: Reserved BitThis bit is reserved and will always read as zero.
• Bits 6:4 – LCDPS2:0: LCD Prescaler SelectThe LCDPS2:0 bits selects tap point from a prescaler. The prescaled output can be furtherdivided by setting the clock divide bits (LCDCD2:0). The different selections are shown in Table23-4. Together they determine the prescaled LCD clock (clkLCD_PS), which is clocking the LCDmodule.
1 0 0 SEG0:20 21
1 0 1 SEG0:22 23
1 1 0 SEG0:23 24
1 1 1 SEG0:24 25
Table 23-3. LCD Port Mask (Continued)
LCDPM2 LCDPM1 LCDPM0I/O Port in Use as Segment
DriverMaximum Number of
Segments
Bit 7 6 5 4 3 2 1 0
(0xE6) – LCDPS2 LCDPS1 LCDPS0 – LCDCD2 LCDCD1 LCDCD0 LCDFRR
Read/Write R R/W R/W R/W R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 23-4. LCD Prescaler Select
LCDPS2 LCDPS1 LCDPS0
Output from Prescaler clkLCD/N
Applied Prescaled LCD Clock Frequency when LCDCD2:0 = 0, Duty = 1/4, and
Frame Rate = 64Hz
0 0 0 clkLCD/16 8.1 kHz
0 0 1 clkLCD/64 33 kHz
0 1 0 clkLCD/128 66 kHz
0 1 1 clkLCD/256 130 kHz
1 0 0 clkLCD/512 260 kHz
1 0 1 clkLCD/1024 520 kHz
1 1 0 clkLCD/2048 1 MHz
1 1 1 clkLCD/4096 2 MHz
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• Bit 3 – Res: Reserved BitThis bit is reserved and will always read as zero.
• Bits 2:0 – LCDCD2:0: LCD Clock Divide 2, 1, and 0The LCDCD2:0 bits determine division ratio in the clock divider. The various selections areshown in Table 23-5. This Clock Divider gives extra flexibility in frame rate selection.
The frame frequency can be calculated by the following equation:
Where:
N = prescaler divider (16, 64, 128, 256, 512, 1024, 2048, or 4096).
K = 8 for duty = 1/4, 1/2, and static.
K = 6 for duty = 1/3.
D = Division factor (see Table 23-5).
This is a very flexible scheme, and users are encouraged to calculate their own table to investi-gate the possible frame rates from the formula above. Note when using 1/3 duty the frame rateis increased with 33% when Frame Rate Register is constant. Example of frame rate calculationis shown in Table 23-6.
Table 23-5. LCD Clock Divide
LCDCD2 LCDCD1 LCDCD0Output from Prescaler
divided by (D):clkLCD = 32.768 kHz, N = 16, and Duty = 1/4, gives a frame rate of:
0 0 0 1 256Hz
0 0 1 2 128Hz
0 1 0 3 85.3Hz
0 1 1 4 64Hz
1 0 0 5 51.2Hz
1 0 1 6 42.7Hz
1 1 0 7 36.6Hz
1 1 1 8 32Hz
Table 23-6. Example of frame rate calculation
clkLCD duty K N LCDCD2:0 D Frame Rate
4 MHz 1/4 8 2048 011 4 4000000/(8*2048*4) = 61Hz
4 MHz 1/3 6 2048 011 4 4000000/(6*2048*4) = 81Hz
32.768 kHz Static 8 16 000 1 32768/(8*16*1) = 256Hz
32.768 kHz 1/2 8 16 100 5 32768/(8*16*5) = 51Hz
fframefclkLCDK N D⋅ ⋅( )
--------------------------=
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23.5.4 LCDCCR – LCD Contrast Control Register
• Bits 7:5 – LCDDC2:0: LDC Display ConfigurationThe LCDDC2:0 bits determine the amount of time the LCD drivers are turned on for each volt-age transition on segment and common pins. A short drive time will lead to lower powerconsumption, but displays with high internal resistance may need longer drive time to achievesatisfactory contrast. Note that the drive time will never be longer than one half prescaled LCDclock period, even if the selected drive time is longer. When using static bias or blanking, drivetime will always be one half prescaled LCD clock period.
• Bit 4 – LCDMDT: LCD Maximum Drive TimeWriting this bit to one turns the LCD drivers on 100% on the time, regardless of the drive timeconfigured by LCDDC2:0.
• Bits 3:0 – LCDCC3:0: LCD Contrast ControlThe LCDCC3:0 bits determine the maximum voltage VLCD on segment and common pins. Thedifferent selections are shown in Table 23-8 on page 251. New values take effect every begin-ning of a new frame.
Bit 7 6 5 4 3 2 1 0
(0xE7) LCDDC2 LCDDC1 LCDDC0 LCDMDT LCDCC3 LCDCC2 LCDCC1 LCDCC0 LCDCCR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 23-7. LCD Display Configuration
LCDDC2 LCDDC1 LCDDC0 Nominal drive time
0 0 0 300 µs
0 0 1 70 µs
0 1 0 150 µs
0 1 1 450 µs
1 0 0 575 µs
1 0 1 850 µs
1 1 0 1150 µs
1 1 1 50% of clkLCD_PS
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23.5.5 LCD Memory Mapping
Write a LCD memory bit to one and the corresponding segment will be energized (visible).Unused LCD Memory bits for the actual display can be used freely as storage.
Table 23-8. LCD Contrast Control
LCDCC3 LCDCC2 LCDCC1 LCDCC0 Maximum Voltage VLCD
0 0 0 0 2.60V
0 0 0 1 2.65V
0 0 1 0 2.70V
0 0 1 1 2.75V
0 1 0 0 2.80V
0 1 0 1 2.85V
0 1 1 0 2.90V
0 1 1 1 2.95V
1 0 0 0 3.00V
1 0 0 1 3.05V
1 0 1 0 3.10V
1 0 1 1 3.15V
1 1 0 0 3.20V
1 1 0 1 3.25V
1 1 1 0 3.30V
1 1 1 1 3.35V
Bit 7 6 5 4 3 2 1 0
– – – – – – – – LCDDR19
COM3 – – – – – – – SEG324 LCDDR18
COM3 SEG323 SEG322 SEG321 SEG320 SEG319 SEG318 SEG317 SEG316 LCDDR17
COM3 SEG315 SEG314 SEG313 SEG312 SEG311 SEG310 SEG309 SEG308 LCDDR16
COM3 SEG307 SEG306 SEG305 SEG304 SEG303 SEG302 SEG301 SEG300 LCDDR15
– – – – – – – – LCDDR14
COM2 – – – – – – – SEG224 LCDDR13
COM2 SEG223 SEG222 SEG221 SEG220 SEG219 SEG218 SEG217 SEG216 LCDDR12
COM2 SEG215 SEG214 SEG213 SEG212 SEG211 SEG210 SEG209 SEG208 LCDDR11
COM2 SEG207 SEG206 SEG205 SEG204 SEG203 SEG202 SEG201 SEG200 LCDDR10
– – – – – – – – LCDDR9
COM1 – – – – – – – SEG124 LCDDR8
COM1 SEG123 SEG122 SEG121 SEG120 SEG119 SEG118 SEG117 SEG116 LCDDR7
COM1 SEG115 SEG114 SEG113 SEG112 SEG111 SEG110 SEG109 SEG108 LCDDR6
COM1 SEG107 SEG106 SEG105 SEG104 SEG103 SEG102 SEG101 SEG100 LCDDR5
– – – – – – – – LCDDR4
COM0 – – – – – – – SEG024 LCDDR3
COM0 SEG023 SEG022 SEG021 SEG020 SEG019 SEG018 SEG017 SEG016 LCDDR2
COM0 SEG015 SEG014 SEG013 SEG012 SEG011 SEG010 SEG009 SEG008 LCDDR1
COM0 SEG007 SEG006 SEG005 SEG004 SEG003 SEG002 SEG001 SEG000 LCDDR0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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24. JTAG Interface and On-chip Debug System
24.0.1 Features
• JTAG (IEEE std. 1149.1 Compliant) Interface• Boundary-scan Capabilities According to the IEEE std. 1149.1 (JTAG) Standard• Debugger Access to:
– All Internal Peripheral Units– Internal and External RAM– The Internal Register File– Program Counter– EEPROM and Flash Memories
• Extensive On-chip Debug Support for Break Conditions, Including– AVR Break Instruction– Break on Change of Program Memory Flow– Single Step Break– Program Memory Break Points on Single Address or Address Range– Data Memory Break Points on Single Address or Address Range
• Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface• On-chip Debugging Supported by AVR Studio®
24.1 Overview
The AVR IEEE std. 1149.1 compliant JTAG interface can be used for:
• Testing PCBs by using the JTAG Boundary-scan capability.
• Programming the non-volatile memories, Fuses and Lock bits.
• On-chip debugging.
A brief description is given in the following sections. Detailed descriptions for Programming viathe JTAG interface, and using the Boundary-scan Chain can be found in the sections ”Program-ming via the JTAG Interface” on page 316 and ”IEEE 1149.1 (JTAG) Boundary-scan” on page259, respectively. The On-chip Debug support is considered being private JTAG instructions,and distributed within ATMEL and to selected third party vendors only.
Figure 24-1 on page 254 shows a block diagram of the JTAG interface and the On-chip Debugsystem. The TAP Controller is a state machine controlled by the TCK and TMS signals. The TAPController selects either the JTAG Instruction Register or one of several Data Registers as thescan chain (Shift Register) between the TDI – input and TDO – output. The Instruction Registerholds JTAG instructions controlling the behavior of a Data Register.
The ID-Register, Bypass Register, and the Boundary-scan Chain are the Data Registers usedfor board-level testing. The JTAG Programming Interface (actually consisting of several physicaland virtual Data Registers) is used for serial programming via the JTAG interface. The InternalScan Chain and Break Point Scan Chain are used for On-chip debugging only.
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24.2 TAP – Test Access Port
The JTAG interface is accessed through four of the AVR’s pins. In JTAG terminology, these pinsconstitute the Test Access Port – TAP. These pins are:
• TMS: Test mode select. This pin is used for navigating through the TAP-controller state machine.
• TCK: Test Clock. JTAG operation is synchronous to TCK.
• TDI: Test Data In. Serial input data to be shifted in to the Instruction Register or Data Register (Scan Chains).
• TDO: Test Data Out. Serial output data from Instruction Register or Data Register.
The IEEE std. 1149.1 also specifies an optional TAP signal; TRST – Test ReSeT – which is notprovided.
When the JTAGEN fuse is unprogrammed, these four TAP pins are normal port pins and theTAP controller is in reset. When programmed and the JTD bit in MCUCSR is cleared, the TAPpins are internally pulled high and the JTAG is enabled for Boundary-scan and programming.The device is shipped with this fuse programmed.
For the On-chip Debug system, in addition to the JTAG interface pins, the RESET pin is moni-tored by the debugger to be able to detect external reset sources. The debugger can also pullthe RESET pin low to reset the whole system, assuming only open collectors on the reset lineare used in the application.
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Figure 24-1. Block Diagram
TAPCONTROLLER
TDITDOTCKTMS
FLASHMEMORY
AVR CPU
DIGITALPERIPHERAL
UNITS
JTAG / AVR CORECOMMUNICATION
INTERFACE
BREAKPOINTUNIT
FLOW CONTROLUNIT
OCD STATUSAND CONTROL
INTERNAL SCANCHAIN
MUX
INSTRUCTIONREGISTER
IDREGISTER
BYPASSREGISTER
JTAG PROGRAMMINGINTERFACE
PCInstruction
AddressData
BREAKPOINTSCAN CHAIN
ADDRESSDECODER
ANALOGPERIPHERIAL
UNITS
I/O PORT 0
I/O PORT n
BOUNDARY SCAN CHAIN
Analog inputs
Control & Clock lines
DEVICE BOUNDARY
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Figure 24-2. TAP Controller State Diagram
24.3 TAP Controller
The TAP controller is a 16-state finite state machine that controls the operation of the Boundary-scan circuitry, JTAG programming circuitry, or On-chip Debug system. The state transitionsdepicted in Figure 24-2 depend on the signal present on TMS (shown adjacent to each statetransition) at the time of the rising edge at TCK. The initial state after a Power-on Reset is Test-Logic-Reset.
As a definition in this document, the LSB is shifted in and out first for all Shift Registers.
Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is:
• At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift Instruction Register – Shift-IR state. While in this state, shift the four bits of the JTAG instructions into the JTAG Instruction Register from the TDI input at the rising edge of TCK. The TMS input must be held low during input of the 3 LSBs in order to remain in the Shift-IR state. The MSB of the instruction is shifted in when this state is left by setting TMS high. While the instruction is shifted in from the TDI pin, the captured IR-state 0x01 is shifted out on the TDO pin. The JTAG Instruction selects a particular Data Register as path between TDI and TDO and controls the circuitry surrounding the selected Data Register.
Test-Logic-Reset
Run-Test/Idle
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Update-IR
Select-DR Scan
Capture-DR
0
1
0 1 1 1
0 0
0 0
1 1
1 0
1
1
0
1
0
0
1 0
1
1
0
1
0
0
00
11
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• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched onto the parallel output from the Shift Register path in the Update-IR state. The Exit-IR, Pause-IR, and Exit2-IR states are only used for navigating the state machine.
• At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift Data Register – Shift-DR state. While in this state, upload the selected Data Register (selected by the present JTAG instruction in the JTAG Instruction Register) from the TDI input at the rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must be held low during input of all bits except the MSB. The MSB of the data is shifted in when this state is left by setting TMS high. While the Data Register is shifted in from the TDI pin, the parallel inputs to the Data Register captured in the Capture-DR state is shifted out on the TDO pin.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data Register has a latched parallel-output, the latching takes place in the Update-DR state. The Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine.
As shown in the state diagram, the Run-Test/Idle state need not be entered between selectingJTAG instruction and using Data Registers, and some JTAG instructions may select certainfunctions to be performed in the Run-Test/Idle, making it unsuitable as an Idle state.
Note: Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be entered by holding TMS high for five TCK clock periods.
For detailed information on the JTAG specification, refer to the literature listed in ”Bibliography”on page 258.
24.4 Using the Boundary-scan Chain
A complete description of the Boundary-scan capabilities are given in the section ”IEEE 1149.1(JTAG) Boundary-scan” on page 259.
24.5 Using the On-chip Debug System
As shown in Figure 24-1 on page 254, the hardware support for On-chip Debugging consistsmainly of:
• A scan chain on the interface between the internal AVR CPU and the internal peripheral units.
• Break Point unit.
• Communication interface between the CPU and JTAG system.
All read or modify/write operations needed for implementing the Debugger are done by applyingAVR instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/Omemory mapped location which is part of the communication interface between the CPU and theJTAG system.
The Break Point Unit implements Break on Change of Program Flow, Single Step Break, twoProgram Memory Break Points, and two combined Break Points. Together, the four BreakPoints can be configured as either:
• 4 single Program Memory Break Points.
• 3 Single Program Memory Break Point + 1 single Data Memory Break Point.
• 2 single Program Memory Break Points + 2 single Data Memory Break Points.
• 2 single Program Memory Break Points + 1 Program Memory Break Point with mask (“range Break Point”).
• 2 single Program Memory Break Points + 1 Data Memory Break Point with mask (“range Break Point”).
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A debugger, like the AVR Studio, may however use one or more of these resources for its inter-nal purpose, leaving less flexibility to the end-user.
A list of the On-chip Debug specific JTAG instructions is given in ”On-chip Debug Specific JTAGInstructions” on page 257.
The JTAGEN Fuse must be programmed to enable the JTAG Test Access Port. In addition, theOCDEN Fuse must be programmed and no Lock bits must be set for the On-chip debug systemto work. As a security feature, the On-chip debug system is disabled when either of the LB1 orLB2 Lock bits are set. Otherwise, the On-chip debug system would have provided a back-doorinto a secured device.
The AVR Studio enables the user to fully control execution of programs on an AVR device withOn-chip Debug capability, AVR In-Circuit Emulator, or the built-in AVR Instruction Set Simulator.AVR Studio supports source level execution of Assembly programs assembled with Atmel Cor-poration’s AVR Assembler and C programs compiled with third party vendors’ compilers.
AVR Studio runs under Microsoft® Windows® 95/98/2000, Windows NT® and Windows XP®.
For a full description of the AVR Studio, please refer to the AVR Studio User Guide. Only high-lights are presented in this document.
All necessary execution commands are available in AVR Studio, both on source level and ondisassembly level. The user can execute the program, single step through the code either bytracing into or stepping over functions, step out of functions, place the cursor on a statement andexecute until the statement is reached, stop the execution, and reset the execution target. Inaddition, the user can have an unlimited number of code Break Points (using the BREAKinstruction) and up to two data memory Break Points, alternatively combined as a mask (range)Break Point.
24.6 On-chip Debug Specific JTAG Instructions
The On-chip debug support is considered being private JTAG instructions, and distributed withinATMEL and to selected third party vendors only. Instruction opcodes are listed for reference.
24.6.1 PRIVATE0; 0x8
Private JTAG instruction for accessing On-chip debug system.
24.6.2 PRIVATE1; 0x9
Private JTAG instruction for accessing On-chip debug system.
24.6.3 PRIVATE2; 0xA
Private JTAG instruction for accessing On-chip debug system.
24.6.4 PRIVATE3; 0xB
Private JTAG instruction for accessing On-chip debug system.
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24.7 On-chip Debug Related Register in I/O Memory
24.7.1 OCDR – On-chip Debug Register
The OCDR Register provides a communication channel from the running program in the micro-controller to the debugger. The CPU can transfer a byte to the debugger by writing to thislocation. At the same time, an internal flag; I/O Debug Register Dirty – IDRD – is set to indicateto the debugger that the register has been written. When the CPU reads the OCDR Register the7 LSB will be from the OCDR Register, while the MSB is the IDRD bit. The debugger clears theIDRD bit when it has read the information.
In some AVR devices, this register is shared with a standard I/O location. In this case, the OCDRRegister can only be accessed if the OCDEN Fuse is programmed, and the debugger enablesaccess to the OCDR Register. In all other cases, the standard I/O location is accessed.
Refer to the debugger documentation for further information on how to use this register.
24.8 Using the JTAG Programming Capabilities
Programming of AVR parts via JTAG is performed via the 4-pin JTAG port, TCK, TMS, TDI, andTDO. These are the only pins that need to be controlled/observed to perform JTAG program-ming (in addition to power pins). It is not required to apply 12V externally. The JTAGEN Fusemust be programmed and the JTD bit in the MCUCR Register must be cleared to enable theJTAG Test Access Port. See ”Boundary-scan Related Register in I/O Memory” on page 279.
The JTAG programming capability supports:
• Flash programming and verifying.
• EEPROM programming and verifying.
• Fuse programming and verifying.
• Lock bit programming and verifying.
The Lock bit security is exactly as in parallel programming mode. If the Lock bits LB1 or LB2 areprogrammed, the OCDEN Fuse cannot be programmed unless first doing a chip erase. This is asecurity feature that ensures no back-door exists for reading out the content of a secureddevice.
The details on programming through the JTAG interface and programming specific JTAGinstructions are given in the section ”Programming via the JTAG Interface” on page 316.
24.9 Bibliography
For more information about general Boundary-scan, the following literature can be consulted:
• IEEE: IEEE Std. 1149.1-1990. IEEE Standard Test Access Port and Boundary-scan Architecture, IEEE, 1993.
• Colin Maunder: The Board Designers Guide to Testable Logic Circuits, Addison-Wesley, 1992.
Bit 7 6 5 4 3 2 1 0
0x31 (0x51) MSB/IDRD LSB OCDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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25. IEEE 1149.1 (JTAG) Boundary-scan
25.1 Features
• JTAG (IEEE std. 1149.1 compliant) Interface• Boundary-scan Capabilities According to the JTAG Standard• Full Scan of all Port Functions as well as Analog Circuitry having Off-chip Connections• Supports the Optional IDCODE Instruction• Additional Public AVR_RESET Instruction to Reset the AVR
25.2 System Overview
The Boundary-scan chain has the capability of driving and observing the logic levels on the digi-tal I/O pins, as well as the boundary between digital and analog logic for analog circuitry havingoff-chip connections. At system level, all ICs having JTAG capabilities are connected serially bythe TDI/TDO signals to form a long Shift Register. An external controller sets up the devices todrive values at their output pins, and observe the input values received from other devices. Thecontroller compares the received data with the expected result. In this way, Boundary-scan pro-vides a mechanism for testing interconnections and integrity of components on Printed CircuitsBoards by using the four TAP signals only.
The four IEEE 1149.1 defined mandatory JTAG instructions IDCODE, BYPASS, SAMPLE/PRE-LOAD, and EXTEST, as well as the AVR specific public JTAG instruction AVR_RESET can beused for testing the Printed Circuit Board. Initial scanning of the Data Register path will show theID-Code of the device, since IDCODE is the default JTAG instruction. It may be desirable tohave the AVR device in reset during test mode. If not reset, inputs to the device may be deter-mined by the scan operations, and the internal software may be in an undetermined state whenexiting the test mode. Entering reset, the outputs of any port pin will instantly enter the highimpedance state, making the HIGHZ instruction redundant. If needed, the BYPASS instructioncan be issued to make the shortest possible scan chain through the device. The device can beset in the reset state either by pulling the external RESET pin low, or issuing the AVR_RESETinstruction with appropriate setting of the Reset Data Register.
The EXTEST instruction is used for sampling external pins and loading output pins with data.The data from the output latch will be driven out on the pins as soon as the EXTEST instructionis loaded into the JTAG IR-Register. Therefore, the SAMPLE/PRELOAD should also be used forsetting initial values to the scan ring, to avoid damaging the board when issuing the EXTESTinstruction for the first time. SAMPLE/PRELOAD can also be used for taking a snapshot of theexternal pins during normal operation of the part.
The JTAGEN Fuse must be programmed and the JTD bit in the I/O Register MCUCR must becleared to enable the JTAG Test Access Port.
When using the JTAG interface for Boundary-scan, using a JTAG TCK clock frequency higherthan the internal chip frequency is possible. The chip clock is not required to run.
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25.3 Data Registers
The Data Registers relevant for Boundary-scan operations are:
• Bypass Register
• Device Identification Register
• Reset Register
• Boundary-scan Chain
25.3.1 Bypass Register
The Bypass Register consists of a single Shift Register stage. When the Bypass Register isselected as path between TDI and TDO, the register is reset to 0 when leaving the Capture-DRcontroller state. The Bypass Register can be used to shorten the scan chain on a system whenthe other devices are to be tested.
25.3.2 Device Identification Register
Figure 25-1 shows the structure of the Device Identification Register.
Figure 25-1. The Format of the Device Identification Register.
25.3.2.1 Version
Version is a 4-bit number identifying the revision of the component. The JTAG version numberfollows the revision of the device. Revision A is 0x0, revision B is 0x1 and so on.
25.3.2.2 Part Number
The part number is a 16-bit code identifying the component. The JTAG Part Number forATmega169P is listed in Table 27-6 on page 299.
25.3.2.3 Manufacturer ID
The Manufacturer ID is a 11-bit code identifying the manufacturer. The JTAG manufacturer IDfor ATMEL is listed in Table 27-6 on page 299.
25.3.3 Reset Register
The Reset Register is a test Data Register used to reset the part. Since the AVR tri-states PortPins when reset, the Reset Register can also replace the function of the unimplemented optionalJTAG instruction HIGHZ.
A high value in the Reset Register corresponds to pulling the external Reset low. The part isreset as long as there is a high value present in the Reset Register. Depending on the fuse set-tings for the clock options, the part will remain reset for a reset time-out period (refer to ”ClockSources” on page 31) after releasing the Reset Register. The output from this Data Register isnot latched, so the reset will take place immediately, as shown in Figure 25-2 on page 261.
MSB LSB
Bit 31 28 27 12 11 1 0
Device ID Version Part Number Manufacturer ID 1
4 bits 16 bits 11 bits 1-bit
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Figure 25-2. Reset Register
25.3.4 Boundary-scan Chain
The Boundary-scan Chain has the capability of driving and observing the logic levels on the dig-ital I/O pins, as well as the boundary between digital and analog logic for analog circuitry havingoff-chip connections.
See ”Boundary-scan Chain” on page 262 for a complete description.
25.4 Boundary-scan Specific JTAG Instructions
The Instruction Register is 4-bit wide, supporting up to 16 instructions. Listed below are theJTAG instructions useful for Boundary-scan operation. Note that the optional HIGHZ instructionis not implemented, but all outputs with tri-state capability can be set in high-impedant state byusing the AVR_RESET instruction, since the initial state for all port pins is tri-state.
As a definition in this datasheet, the LSB is shifted in and out first for all Shift Registers.
The OPCODE for each instruction is shown behind the instruction name in hex format. The textdescribes which Data Register is selected as path between TDI and TDO for each instruction.
25.4.1 EXTEST; 0x0
Mandatory JTAG instruction for selecting the Boundary-scan Chain as Data Register for testingcircuitry external to the AVR package. For port-pins, Pull-up Disable, Output Control, OutputData, and Input Data are all accessible in the scan chain. For Analog circuits having off-chipconnections, the interface between the analog and the digital logic is in the scan chain. The con-tents of the latched outputs of the Boundary-scan chain is driven out as soon as the JTAG IR-Register is loaded with the EXTEST instruction.
The active states are:
• Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.
• Shift-DR: The Internal Scan Chain is shifted by the TCK input.
• Update-DR: Data from the scan chain is applied to output pins.
25.4.2 IDCODE; 0x1
Optional JTAG instruction selecting the 32-bit ID-Register as Data Register. The ID-Registerconsists of a version number, a device number and the manufacturer code chosen by JEDEC.This is the default instruction after power-up.
D QFromTDI
ClockDR · AVR_RESET
To TDO
From Other Internal andExternal Reset Sources
Internal reset
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The active states are:
• Capture-DR: Data in the IDCODE Register is sampled into the Boundary-scan Chain.
• Shift-DR: The IDCODE scan chain is shifted by the TCK input.
25.4.3 SAMPLE_PRELOAD; 0x2
Mandatory JTAG instruction for pre-loading the output latches and taking a snap-shot of theinput/output pins without affecting the system operation. However, the output latches are notconnected to the pins. The Boundary-scan Chain is selected as Data Register.
The active states are:
• Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.
• Shift-DR: The Boundary-scan Chain is shifted by the TCK input.
• Update-DR: Data from the Boundary-scan chain is applied to the output latches. However, the output latches are not connected to the pins.
25.4.4 AVR_RESET; 0xC
The AVR specific public JTAG instruction for forcing the AVR device into the Reset mode orreleasing the JTAG reset source. The TAP controller is not reset by this instruction. The one bitReset Register is selected as Data Register. Note that the reset will be active as long as there isa logic “one” in the Reset Chain. The output from this chain is not latched.
The active states are:
• Shift-DR: The Reset Register is shifted by the TCK input.
25.4.5 BYPASS; 0xF
Mandatory JTAG instruction selecting the Bypass Register for Data Register.
The active states are:
• Capture-DR: Loads a logic “0” into the Bypass Register.
• Shift-DR: The Bypass Register cell between TDI and TDO is shifted.
25.5 Boundary-scan Chain
The Boundary-scan chain has the capability of driving and observing the logic levels on the digi-tal I/O pins, as well as the boundary between digital and analog logic for analog circuitry havingoff-chip connection.
25.5.1 Scanning the Digital Port Pins
Figure 25-3 on page 263 shows the Boundary-scan Cell for a bi-directional port pin with pull-upfunction. The cell consists of a standard Boundary-scan cell for the Pull-up Enable – PUExn –function, and a bi-directional pin cell that combines the three signals Output Control – OCxn,Output Data – ODxn, and Input Data – IDxn, into only a two-stage Shift Register. The port andpin indexes are not used in the following description:
The Boundary-scan logic is not included in the figures in the datasheet. Figure 25-4 on page 264shows a simple digital port pin as described in the section ”I/O-Ports” on page 65. The Bound-ary-scan details from Figure 25-3 on page 263 replaces the dashed box in Figure 25-4 on page264.
When no alternate port function is present, the Input Data – ID – corresponds to the PINxn Reg-ister value (but ID has no synchronizer), Output Data corresponds to the PORT Register, Output
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Control corresponds to the Data Direction – DD Register, and the Pull-up Enable – PUExn – cor-responds to logic expression PUD · DDxn · PORTxn.
Digital alternate port functions are connected outside the dotted box in Figure 25-4 on page 264to make the scan chain read the actual pin value. For Analog function, there is a direct connec-tion from the external pin to the analog circuit, and a scan chain is inserted on the interfacebetween the digital logic and the analog circuitry.
Figure 25-3. Boundary-scan Cell for Bi-directional Port Pin with Pull-up Function.
D Q D Q
G
0
10
1
D Q D Q
G
0
10
1
0
1
0
1D Q D Q
G
0
1
Por
t Pin
(P
Xn)
VccEXTESTTo Next CellShiftDR
Output Control (OC)
Pullup Enable (PUE)
Output Data (OD)
Input Data (ID)
From Last Cell UpdateDRClockDR
FF2 LD2
FF1 LD1
LD0FF0
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Figure 25-4. General Port Pin Schematic Diagram
CLK
RPx
RDx
WDx
PUD
SYNCHRONIZER
WDx: WRITE DDRx
WRx: WRITE PORTxRRx: READ PORTx REGISTER
WPx: WRITE PINx REGISTER
PUD: PULLUP DISABLE
CLK : I/O CLOCK
RDx: READ DDRx
D
L
Q
Q
RESET
Q
QD
Q
Q D
CLR
DDxn
PINxn
DATA
BU
S
SLEEP
SLEEP: SLEEP CONTROL
Pxn
I/O
I/O
See Boundary-scan Description for Details!
PUExn
OCxn
ODxnIDxn
PUExn: PULLUP ENABLE for pin PxnOCxn: OUTPUT CONTROL for pin PxnODxn: OUTPUT DATA to pin PxnIDxn: INPUT DATA from pin Pxn RPx: READ PORTx PIN
RRx
RESET
Q
Q D
CLR
PORTxn
WPx
0
1
WRx
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25.5.2 Scanning the RESET Pin
The RESET pin accepts 5V active low logic for standard reset operation, and 12V active highlogic for High Voltage Parallel programming. An observe-only cell as shown in Figure 25-5 isinserted both for the 5V reset signal; RSTT, and the 12V reset signal; RSTHV.
Figure 25-5. Observe-only Cell
25.5.3 Scanning the Clock Pins
The AVR devices have many clock options selectable by fuses. These are: Internal RC Oscilla-tor, External Clock, (High Frequency) Crystal Oscillator, Low-frequency Crystal Oscillator, andCeramic Resonator.
Figure 25-6 shows how each Oscillator with external connection is supported in the scan chain.The Enable signal is supported with a general Boundary-scan cell, while the Oscillator/clock out-put is attached to an observe-only cell. In addition to the main clock, the timer Oscillator isscanned in the same way. The output from the internal RC Oscillator is not scanned, as thisOscillator does not have external connections.
Figure 25-6. Boundary-scan Cells for Oscillators and Clock Options
0
1D Q
FromPrevious
Cell
ClockDR
ShiftDR
ToNextCell
From System Pin To System Logic
FF1
0
1D Q
FromPrevious
Cell
ClockDR
ShiftDR
ToNextCell
To System Logic
FF10
1D Q D Q
G
0
1
FromPrevious
Cell
ClockDR UpdateDR
ShiftDR
ToNextCell EXTEST
From Digital Logic
XTAL1/TOSC1 XTAL2/TOSC2
Oscillator
ENABLE OUTPUT
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Table 25-1 summaries the scan registers for the external clock pin XTAL1, oscillators withXTAL1/XTAL2 connections as well as 32 kHz Timer Oscillator.
Notes: 1. Do not enable more than one clock source as main clock at a time.2. Scanning an Oscillator output gives unpredictable results as there is a frequency drift between
the internal Oscillator and the JTAG TCK clock. If possible, scanning an external clock is preferred.
3. The clock configuration is programmed by fuses. As a fuse is not changed run-time, the clock configuration is considered fixed for a given application. The user is advised to scan the same clock option as to be used in the final system. The enable signals are supported in the scan chain because the system logic can disable clock options in sleep modes, thereby disconnect-ing the Oscillator pins from the scan path if not provided.
25.5.4 Scanning the Analog Comparator
The relevant Comparator signals regarding Boundary-scan are shown in Figure 25-7. TheBoundary-scan cell from Figure 25-8 on page 267 is attached to each of these signals. The sig-nals are described in Table 25-2 on page 267.
The Comparator need not be used for pure connectivity testing, since all analog inputs areshared with a digital port pin as well.
Figure 25-7. Analog Comparator
Table 25-1. Scan Signals for the Oscillator(1)(2)(3)
Enable SignalScanned Clock Line Clock Option
Scanned Clock Linewhen not Used
EXTCLKEN EXTCLK (XTAL1) External Clock 0
OSCON OSCCKExternal Crystal
External Ceramic Resonator1
OSC32EN OSC32CK Low Freq. External Crystal 1
ACBG
BANDGAPREFERENCE
ADC MULTIPLEXEROUTPUT
ACME
AC_IDLE
ACO
ADCEN
ACD
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Figure 25-8. General Boundary-scan cell Used for Signals for Comparator and ADC
Table 25-2. Boundary-scan Signals for the Analog Comparator
Signal Name
Direction as Seen from the Comparator Description
Recommended Input when Not in Use
Output Values when Recommended Inputs are Used
AC_IDLE inputTurns off Analog Comparator when true
1Depends upon µC code being executed
ACO outputAnalog Comparator Output
Will become input to µC code being executed
0
ACME inputUses output signal from ADC mux when true
0Depends upon µC code being executed
ACBG inputBandgap Reference enable
0Depends upon µC code being executed
0
1D Q D Q
G
0
1
FromPrevious
Cell
ClockDR UpdateDR
ShiftDR
ToNextCell EXTEST
To Analog Circuitry/To Digital Logic
From Digital Logic/From Analog Ciruitry
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25.5.5 Scanning the ADC
Figure 25-9 shows a block diagram of the ADC with all relevant control and observe signals. TheBoundary-scan cell from Figure 25-5 on page 265 is attached to each of these signals. The ADCneed not be used for pure connectivity testing, since all analog inputs are shared with a digitalport pin as well.
Figure 25-9. Analog to Digital Converter.
The signals are described briefly in Table 25-3 on page 269.
10-bit DAC +
-
AREF
PRECH
DACOUT
COMP
MUXEN_7ADC_7
MUXEN_6ADC_6
MUXEN_5ADC_5
MUXEN_4ADC_4
MUXEN_3ADC_3
MUXEN_2ADC_2
MUXEN_1ADC_1
MUXEN_0ADC_0
NEGSEL_2ADC_2
NEGSEL_1ADC_1
NEGSEL_0ADC_0
EXTCH
+
-1x
STACLK
AMPEN
1.11Vref
IREFEN
AREF
VCCREN
DAC_9..0
ADCEN
HOLD
PRECH
GNDEN
PASSEN
COMP
SCTESTADCBGEN
To Comparator
1.22Vref
ACTEN
AREF
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Table 25-3. Boundary-scan Signals for the ADC(1)
Signal Name
Direction as Seen from the ADC Description
Recommen-ded Input when not in use
Output Values when Recommended Inputs are Used, and CPU is not Using the ADC
COMP Output Comparator Output 0 0
ACLK Input
Clock signal to differential amplifier implemented as Switch-cap filters
0 0
ACTEN InputEnable path from differential amplifier to the comparator
0 0
ADCBGEN InputEnable Band-gap reference as negative input to comparator
0 0
ADCEN InputPower-on signal to the ADC
0 0
AMPEN InputPower-on signal to the differential amplifier
0 0
DAC_9 InputBit 9 of digital value to DAC
1 1
DAC_8 InputBit 8 of digital value to DAC
0 0
DAC_7 InputBit 7 of digital value to DAC
0 0
DAC_6 InputBit 6 of digital value to DAC
0 0
DAC_5 InputBit 5 of digital value to DAC
0 0
DAC_4 InputBit 4 of digital value to DAC
0 0
DAC_3 InputBit 3 of digital value to DAC
0 0
DAC_2 InputBit 2 of digital value to DAC
0 0
DAC_1 InputBit 1 of digital value to DAC
0 0
DAC_0 InputBit 0 of digital value to DAC
0 0
EXTCH Input
Connect ADC channels 0 - 3 to by-pass path around differential amplifier
1 1
GNDEN InputGround the negative input to comparator when true
0 0
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HOLD Input
Sample & Hold signal. Sample analog signal when low. Hold signal when high. If differential amplifier is used, this signal must go active when ACLK is high.
1 1
IREFEN InputEnables Band-gap reference as AREF signal to DAC
0 0
MUXEN_7 Input Input Mux bit 7 0 0
MUXEN_6 Input Input Mux bit 6 0 0
MUXEN_5 Input Input Mux bit 5 0 0
MUXEN_4 Input Input Mux bit 4 0 0
MUXEN_3 Input Input Mux bit 3 0 0
MUXEN_2 Input Input Mux bit 2 0 0
MUXEN_1 Input Input Mux bit 1 0 0
MUXEN_0 Input Input Mux bit 0 1 1
NEGSEL_2 InputInput Mux for negative input for differential signal, bit 2
0 0
NEGSEL_1 InputInput Mux for negative input for differential signal, bit 1
0 0
NEGSEL_0 InputInput Mux for negative input for differential signal, bit 0
0 0
PASSEN InputEnable pass-gate of differential amplifier.
1 1
PRECH InputPrecharge output latch of comparator. (Active low)
1 1
SCTEST Input
Switch-cap TEST enable. Output from differential amplifier is sent out to Port Pin having ADC_4
0 0
ST Input
Output of differential amplifier will settle faster if this signal is high first two ACLK periods after AMPEN goes high.
0 0
VCCREN InputSelects Vcc as the ACC reference voltage.
0 0
Table 25-3. Boundary-scan Signals for the ADC(1)
Signal Name
Direction as Seen from the ADC Description
Recommen-ded Input when not in use
Output Values when Recommended Inputs are Used, and CPU is not Using the ADC
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Note: 1. Incorrect setting of the switches in Figure 25-9 on page 268 will make signal contention and may damage the part. There are several input choices to the S&H circuitry on the negative input of the output comparator in Figure 25-9 on page 268. Make sure only one path is selected from either one ADC pin, Bandgap reference source, or Ground.
If the ADC is not to be used during scan, the recommended input values from Table 25-3 onpage 269 should be used. The user is recommended not to use the Differential Amplifier duringscan. Switch-Cap based differential amplifier requires fast operation and accurate timing whichis difficult to obtain when used in a scan chain. Details concerning operations of the differentialamplifier is therefore not provided.
The AVR ADC is based on the analog circuitry shown in Figure 25-9 on page 268 with a succes-sive approximation algorithm implemented in the digital logic. When used in Boundary-scan, theproblem is usually to ensure that an applied analog voltage is measured within some limits. Thiscan easily be done without running a successive approximation algorithm: apply the lower limiton the digital DAC[9:0] lines, make sure the output from the comparator is low, then apply theupper limit on the digital DAC[9:0] lines, and verify the output from the comparator to be high.
The ADC need not be used for pure connectivity testing, since all analog inputs are shared witha digital port pin as well.
When using the ADC, remember the following:
• The port pin for the ADC channel in use must be configured to be an input with pull-up disabled to avoid signal contention.
• In Normal mode, a dummy conversion (consisting of 10 comparisons) is performed when enabling the ADC. The user is advised to wait at least 200 ns after enabling the ADC before controlling/observing any ADC signal, or perform a dummy conversion before using the first result.
• The DAC values must be stable at the midpoint value 0x200 when having the HOLD signal low (Sample mode).
As an example, consider the task of verifying a 1.5V ±5% input signal at ADC channel 3 whenthe power supply is 5.0V and AREF is externally connected to VCC.
The recommended values from Table 25-3 on page 269 are used unless other values are givenin the algorithm in Table 25-4 on page 272. Only the DAC and port pin values of the Scan Chainare shown. The column “Actions” describes what JTAG instruction to be used before filling theBoundary-scan Register with the succeeding columns. The verification should be done on thedata scanned out when scanning in the data on the same row in the table.
The lower limit is: 1024 1.5V 0,95 5V⁄⋅ ⋅ 291 0x123= = The upper limit is: 1024 1.5V 1.05 5V⁄⋅ ⋅ 323 0x143= =
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Using this algorithm, the timing constraint on the HOLD signal constrains the TCK clock fre-quency. As the algorithm keeps HOLD high for five steps, the TCK clock frequency has to be atleast five times the number of scan bits divided by the maximum hold time, thold,max
25.6 Boundary-scan Order
Table 25-5 shows the Scan order between TDI and TDO when the Boundary-scan chain isselected as data path. Bit 0 is the LSB; the first bit scanned in, and the first bit scanned out. Thescan order follows the pin-out order as far as possible. Therefore, the bits of Port A is scanned inthe opposite bit order of the other ports. Exceptions from the rules are the Scan chains for theanalog circuits, which constitute the most significant bits of the scan chain regardless of whichphysical pin they are connected to. In Figure 25-3 on page 263, PXn. Data corresponds to FF0,PXn. Control corresponds to FF1, and PXn. Pull-up_enable corresponds to FF2. Bit 4, bit 5, bit6, and bit 7 of Port F is not in the scan chain, since these pins constitute the TAP pins when theJTAG is enabled.
Table 25-4. Algorithm for Using the ADC
Step Actions ADCEN DAC MUXEN HOLD PRECHPA3.Data
PA3.Control
PA3.Pull-up_Enable
1SAMPLE_PRELOAD
1 0x200 0x08 1 1 0 0 0
2 EXTEST 1 0x200 0x08 0 1 0 0 0
3 1 0x200 0x08 1 1 0 0 0
4 1 0x123 0x08 1 1 0 0 0
5 1 0x123 0x08 1 0 0 0 0
6
Verify the COMP bit scanned out to be 0
1 0x200 0x08 1 1 0 0 0
7 1 0x200 0x08 0 1 0 0 0
8 1 0x200 0x08 1 1 0 0 0
9 1 0x143 0x08 1 1 0 0 0
10 1 0x143 0x08 1 0 0 0 0
11
Verify the COMP bit scanned out to be 1
1 0x200 0x08 1 1 0 0 0
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
197 AC_IDLE
Comparator196 ACO
195 ACME
194 AINBG
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193 COMP
ADC
192 ACLK
191 ACTEN
190 PRIVATE_SIGNAL1(1)
189 ADCBGEN
188 ADCEN
187 AMPEN
186 DAC_9
185 DAC_8
184 DAC_7
183 DAC_6
182 DAC_5
181 DAC_4
180 DAC_3
179 DAC_2
178 DAC_1
177 DAC_0
176 EXTCH
175 GNDEN
174 HOLD
173 IREFEN
172 MUXEN_7
171 MUXEN_6
170 MUXEN_5
169 MUXEN_4
168 MUXEN_3
ADC
167 MUXEN_2
166 MUXEN_1
165 MUXEN_0
164 NEGSEL_2
163 NEGSEL_1
162 NEGSEL_0
161 PASSEN
160 PRECH
159 ST
158 VCCREN
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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157 PE0.Data
Port E
156 PE0.Control
155 PE0.Pull-up_Enable
154 PE1.Data
153 PE1.Control
152 PE1.Pull-up_Enable
151 PE2.Data
150 PE2.Control
149 PE2.Pull-up_Enable
148 PE3.Data
147 PE3.Control
146 PE3.Pull-up_Enable
145 PE4.Data
144 PE4.Control
143 PE4.Pull-up_Enable
142 PE5.Data
141 PE5.Control
140 PE5.Pull-up_Enable
139 PE6.Data
138 PE6.Control
137 PE6.Pull-up_Enable
136 PE7.Data
135 PE7.Control
134 PE7.Pull-up_Enable
133 PB0.Data Port B
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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132 PB0.Control
Port B
131 PB0.Pull-up_Enable
130 PB1.Data
129 PB1.Control
128 PB1.Pull-up_Enable
127 PB2.Data
126 PB2.Control
125 PB2.Pull-up_Enable
124 PB3.Data
123 PB3.Control
122 PB3.Pull-up_Enable
121 PB4.Data
120 PB4.Control
119 PB4.Pull-up_Enable
118 PB5.Data
117 PB5.Control
116 PB5.Pull-up_Enable
115 PB6.Data
114 PB6.Control
113 PB6.Pull-up_Enable
112 PB7.Data
111 PB7.Control
110 PB7.Pull-up_Enable
109 PG3.Data
Port G
108 PG3.Control
107 PG3.Pull-up_Enable
106 PG4.Data
105 PG4.Control
104 PG4.Pull-up_Enable
103 PG5 (Observe Only)
102 RSTT Reset Logic (Observe-only)101 RSTHV
100 EXTCLKEN
Enable signals for main Clock/Oscillators99 OSCON
98 RCOSCEN
97 OSC32EN
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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96 EXTCLK (XTAL1)
Clock input and Oscillators for the main clock(Observe-only)
95 OSCCK
94 RCCK
93 OSC32CK
92 PD0.Data
Port D
91 PD0.Control
90 PD0.Pull-up_Enable
89 PD1.Data
88 PD1.Control
87 PD1.Pull-up_Enable
86 PD2.Data
85 PD2.Control
84 PD2.Pull-up_Enable
83 PD3.Data
82 PD3.Control
81 PD3.Pull-up_Enable
80 PD4.Data
79 PD4.Control
78 PD4.Pull-up_Enable
77 PD5.Data
76 PD5.Control
75 PD5.Pull-up_Enable
74 PD6.Data
73 PD6.Control
72 PD6.Pull-up_Enable
71 PD7.Data
70 PD7.Control
69 PD7.Pull-up_Enable
68 PG0.Data
Port G
67 PG0.Control
66 PG0.Pull-up_Enable
65 PG1.Data
64 PG1.Control
63 PG1.Pull-up_Enable
62 PC0.DataPort C
61 PC0.Control
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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60 PC0.Pull-up_Enable
Port C
59 PC1.Data
58 PC1.Control
57 PC1.Pull-up_Enable
56 PC2.Data
55 PC2.Control
54 PC2.Pull-up_Enable
53 PC3.Data
52 PC3.Control
51 PC3.Pull-up_Enable
50 PC4.Data
49 PC4.Control
48 PC4.Pull-up_Enable
47 PC5.Data
46 PC5.Control
45 PC5.Pull-up_Enable
44 PC6.Data
43 PC6.Control
42 PC6.Pull-up_Enable
41 PC7.Data
40 PC7.Control
39 PC7.Pull-up_Enable
38 PG2.Data
Port G37 PG2.Control
36 PG2.Pull-up_Enable
35 PA7.Data
Port A
34 PA7.Control
33 PA7.Pull-up_Enable
32 PA6.Data
31 PA6.Control
30 PA6.Pull-up_Enable
29 PA5.Data
28 PA5.Control
27 PA5.Pull-up_Enable
26 PA4.Data
25 PA4.Control
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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Note: 1. PRIVATE_SIGNAL1 should always be scanned in as zero.
25.7 Boundary-scan Description Language Files
Boundary-scan Description Language (BSDL) files describe Boundary-scan capable devices ina standard format used by automated test-generation software. The order and function of bits inthe Boundary-scan Data Register are included in this description. A BSDL file for ATmega169Pis available.
24 PA4.Pull-up_Enable
Port A
23 PA3.Data
22 PA3.Control
21 PA3.Pull-up_Enable
20 PA2.Data
19 PA2.Control
18 PA2.Pull-up_Enable
17 PA1.Data
16 PA1.Control
15 PA1.Pull-up_Enable
14 PA0.Data
13 PA0.Control
12 PA0.Pull-up_Enable
11 PF3.Data
Port F
10 PF3.Control
9 PF3.Pull-up_Enable
8 PF2.Data
7 PF2.Control
6 PF2.Pull-up_Enable
5 PF1.Data
4 PF1.Control
3 PF1.Pull-up_Enable
2 PF0.Data
1 PF0.Control
0 PF0.Pull-up_Enable
Table 25-5. ATmega169P Boundary-scan Order
Bit Number Signal Name Module
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25.8 Boundary-scan Related Register in I/O Memory
25.8.1 MCUCR – MCU Control Register
The MCU Control Register contains control bits for general MCU functions.
• Bit 7 – JTD: JTAG Interface DisableWhen this bit is zero, the JTAG interface is enabled if the JTAGEN Fuse is programmed. If thisbit is one, the JTAG interface is disabled. In order to avoid unintentional disabling or enabling ofthe JTAG interface, a timed sequence must be followed when changing this bit: The applicationsoftware must write this bit to the desired value twice within four cycles to change its value. Notethat this bit must not be altered when using the On-chip Debug system.
If the JTAG interface is left unconnected to other JTAG circuitry, the JTD bit should be set toone. The reason for this is to avoid static current at the TDO pin in the JTAG interface.
25.8.2 MCUSR – MCU Status Register
The MCU Status Register provides information on which reset source caused an MCU reset.
• Bit 4 – JTRF: JTAG Reset FlagThis bit is set if a reset is being caused by a logic one in the JTAG Reset Register selected bythe JTAG instruction AVR_RESET. This bit is reset by a Power-on Reset, or by writing a logiczero to the flag.
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) JTD - - PUD – – IVSEL IVCE MCUCR
Read/Write R/W R R R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Bit 7 6 5 4 3 2 1 0
0x34 (0x54) – – – JTRF WDRF BORF EXTRF PORF MCUSR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 See Bit Description
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26. Boot Loader Support – Read-While-Write Self-Programming
26.1 Features
• Read-While-Write Self-Programming• Flexible Boot Memory Size• High Security (Separate Boot Lock Bits for a Flexible Protection)• Separate Fuse to Select Reset Vector• Optimized Page(1) Size• Code Efficient Algorithm• Efficient Read-Modify-Write Support
Note: 1. A page is a section in the Flash consisting of several bytes (see Table 27-7 on page 299) used during programming. The page organization does not affect normal operation.
26.2 Overview
The Boot Loader Support provides a real Read-While-Write Self-Programming mechanism fordownloading and uploading program code by the MCU itself. This feature allows flexible applica-tion software updates controlled by the MCU using a Flash-resident Boot Loader program. TheBoot Loader program can use any available data interface and associated protocol to read codeand write (program) that code into the Flash memory, or read the code from the program mem-ory. The program code within the Boot Loader section has the capability to write into the entireFlash, including the Boot Loader memory. The Boot Loader can thus even modify itself, and itcan also erase itself from the code if the feature is not needed anymore. The size of the BootLoader memory is configurable with fuses and the Boot Loader has two separate sets of BootLock bits which can be set independently. This gives the user a unique flexibility to select differ-ent levels of protection.
26.3 Application and Boot Loader Flash Sections
The Flash memory is organized in two main sections, the Application section and the BootLoader section (see Figure 26-2 on page 283). The size of the different sections is configured bythe BOOTSZ Fuses as shown in Table 26-6 on page 292 and Figure 26-2 on page 283. Thesetwo sections can have different level of protection since they have different sets of Lock bits.
26.3.1 Application Section
The Application section is the section of the Flash that is used for storing the application code.The protection level for the Application section can be selected by the application Boot Lock bits(Boot Lock bits 0), see Table 26-2 on page 284. The Application section can never store anyBoot Loader code since the SPM instruction is disabled when executed from the Applicationsection.
26.3.2 BLS – Boot Loader Section
While the Application section is used for storing the application code, the The Boot Loader soft-ware must be located in the BLS since the SPM instruction can initiate a programming whenexecuting from the BLS only. The SPM instruction can access the entire Flash, including theBLS itself. The protection level for the Boot Loader section can be selected by the Boot LoaderLock bits (Boot Lock bits 1), see Table 26-3 on page 284.
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26.4 Read-While-Write and No Read-While-Write Flash Sections
Whether the CPU supports Read-While-Write or if the CPU is halted during a Boot Loader soft-ware update is dependent on which address that is being programmed. In addition to the twosections that are configurable by the BOOTSZ Fuses as described above, the Flash is alsodivided into two fixed sections, the Read-While-Write (RWW) section and the No Read-While-Write (NRWW) section. The limit between the RWW- and NRWW sections is given in Table 26-7 on page 293 and Figure 26-2 on page 283. The main difference between the two sections is:
• When erasing or writing a page located inside the RWW section, the NRWW section can be read during the operation.
• When erasing or writing a page located inside the NRWW section, the CPU is halted during the entire operation.
Note that the user software can never read any code that is located inside the RWW section dur-ing a Boot Loader software operation. The syntax “Read-While-Write section” refers to whichsection that is being programmed (erased or written), not which section that actually is beingread during a Boot Loader software update.
26.4.1 RWW – Read-While-Write Section
If a Boot Loader software update is programming a page inside the RWW section, it is possibleto read code from the Flash, but only code that is located in the NRWW section. During an on-going programming, the software must ensure that the RWW section never is being read. If theuser software is trying to read code that is located inside the RWW section (that is, by acall/jmp/lpm or an interrupt) during programming, the software might end up in an unknownstate. To avoid this, the interrupts should either be disabled or moved to the Boot Loader sec-tion. The Boot Loader section is always located in the NRWW section. The RWW Section Busybit (RWWSB) in the Store Program Memory Control and Status Register (SPMCSR) will be readas logical one as long as the RWW section is blocked for reading. After a programming is com-pleted, the RWWSB must be cleared by software before reading code located in the RWWsection. See ”SPMCSR – Store Program Memory Control and Status Register” on page 294. fordetails on how to clear RWWSB.
26.4.2 NRWW – No Read-While-Write Section
The code located in the NRWW section can be read when the Boot Loader software is updatinga page in the RWW section. When the Boot Loader code updates the NRWW section, the CPUis halted during the entire Page Erase or Page Write operation.
Table 26-1. Read-While-Write Features
Which Section does the Z-pointerAddress During the Programming?
Which Section Can be Read During Programming?
Is the CPU Halted?
Read-While-WriteSupported?
RWW Section NRWW Section No Yes
NRWW Section None Yes No
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Figure 26-1. Read-While-Write vs. No Read-While-Write
Read-While-Write(RWW) Section
No Read-While-Write (NRWW) Section
Z-pointerAddresses RWWSection
Z-pointerAddresses NRWWSection
CPU is HaltedDuring the Operation
Code Located in NRWW SectionCan be Read Duringthe Operation
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Figure 26-2. Memory Sections
Note: 1. The parameters in the figure above are given in Table 26-6 on page 292.
0x0000
Flashend
Program MemoryBOOTSZ = '11'
Application Flash Section
Boot Loader Flash SectionFlashend
Program MemoryBOOTSZ = '10'
0x0000
Program MemoryBOOTSZ = '01'
Program MemoryBOOTSZ = '00'
Application Flash Section
Boot Loader Flash Section
0x0000
Flashend
Application Flash Section
Flashend
End RWW
Start NRWW
Application Flash Section
Boot Loader Flash Section
Boot Loader Flash Section
End RWW
Start NRWW
End RWW
Start NRWW
0x0000
End RWW, End Application
Start NRWW, Start Boot Loader
Application Flash SectionApplication Flash Section
Application Flash Section
Rea
d-W
hile
-Writ
e S
ectio
nN
o R
ead-
Whi
le-W
rite
Sec
tion
Rea
d-W
hile
-Writ
e S
ectio
nN
o R
ead-
Whi
le-W
rite
Sec
tion
Rea
d-W
hile
-Writ
e S
ectio
nN
o R
ead-
Whi
le-W
rite
Sec
tion
Rea
d-W
hile
-Writ
e S
ectio
nN
o R
ead-
Whi
le-W
rite
Sec
tion
End Application
Start Boot Loader
End Application
Start Boot Loader
End Application
Start Boot Loader
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26.5 Boot Loader Lock Bits
If no Boot Loader capability is needed, the entire Flash is available for application code. TheBoot Loader has two separate sets of Boot Lock bits which can be set independently. This givesthe user a unique flexibility to select different levels of protection.
The user can select:
• To protect the entire Flash from a software update by the MCU.
• To protect only the Boot Loader Flash section from a software update by the MCU.
• To protect only the Application Flash section from a software update by the MCU.
• Allow software update in the entire Flash.
See Table 26-2 and Table 26-3 for further details. The Boot Lock bits and general Lock bits canbe set in software and in Serial or Parallel Programming mode, but they can be cleared by aChip Erase command only. The general Write Lock (Lock Bit mode 2) does not control the pro-gramming of the Flash memory by SPM instruction. Similarly, the general Read/Write Lock(Lock Bit mode 1) does not control reading nor writing by LPM/SPM, if it is attempted.
Note: 1. “1” means unprogrammed, “0” means programmed
Note: 1. “1” means unprogrammed, “0” means programmed
Table 26-2. Boot Lock Bit0 Protection Modes (Application Section)(1)
BLB0 Mode BLB02 BLB01 Protection
1 1 1No restrictions for SPM or LPM accessing the Application section.
2 1 0 SPM is not allowed to write to the Application section.
3 0 0
SPM is not allowed to write to the Application section, and LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section.
4 0 1
LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section.
Table 26-3. Boot Lock Bit1 Protection Modes (Boot Loader Section)(1)
BLB1 Mode BLB12 BLB11 Protection
1 1 1No restrictions for SPM or LPM accessing the Boot Loader section.
2 1 0 SPM is not allowed to write to the Boot Loader section.
3 0 0
SPM is not allowed to write to the Boot Loader section, and LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section.
4 0 1
LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section.
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26.6 Entering the Boot Loader Program
Entering the Boot Loader takes place by a jump or call from the application program. This maybe initiated by a trigger such as a command received via USART, or SPI interface. Alternatively,the Boot Reset Fuse can be programmed so that the Reset Vector is pointing to the Boot Flashstart address after a reset. In this case, the Boot Loader is started after a reset. After the applica-tion code is loaded, the program can start executing the application code. Note that the fusescannot be changed by the MCU itself. This means that once the Boot Reset Fuse is pro-grammed, the Reset Vector will always point to the Boot Loader Reset and the fuse can only bechanged through the serial or parallel programming interface.
Note: 1. “1” means unprogrammed, “0” means programmed
Table 26-4. Boot Reset Fuse(1)
BOOTRST Reset Address
1 Reset Vector = Application Reset (address 0x0000)
0 Reset Vector = Boot Loader Reset (see Table 26-6 on page 292)
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26.7 Addressing the Flash During Self-Programming
The Z-pointer is used to address the SPM commands.
Since the Flash is organized in pages (see Table 27-7 on page 299), the Program Counter canbe treated as having two different sections. One section, consisting of the least significant bits, isaddressing the words within a page, while the most significant bits are addressing the pages.This is shown in Figure 26-3. Note that the Page Erase and Page Write operations areaddressed independently. Therefore it is of major importance that the Boot Loader softwareaddresses the same page in both the Page Erase and Page Write operation. Once a program-ming operation is initiated, the address is latched and the Z-pointer can be used for otheroperations.
The only SPM operation that does not use the Z-pointer is Setting the Boot Loader Lock bits.The content of the Z-pointer is ignored and will have no effect on the operation. The LPMinstruction does also use the Z-pointer to store the address. Since this instruction addresses theFlash byte-by-byte, also the LSB (bit Z0) of the Z-pointer is used.
Figure 26-3. Addressing the Flash During SPM(1)
Note: 1. The different variables used in Figure 26-3 are listed in Table 26-8 on page 293.
2. PCPAGE and PCWORD are listed in Table 27-7 on page 299.
Bit 15 14 13 12 11 10 9 8
ZH (R31) Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8
ZL (R30) Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0
7 6 5 4 3 2 1 0
PROGRAM MEMORY
0115
Z - REGISTER
BIT
0
ZPAGEMSB
WORD ADDRESSWITHIN A PAGE
PAGE ADDRESSWITHIN THE FLASH
ZPCMSB
INSTRUCTION WORD
PAGE PCWORD[PAGEMSB:0]:
00
01
02
PAGEEND
PAGE
PCWORDPCPAGE
PCMSB PAGEMSBPROGRAMCOUNTER
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26.8 Self-Programming the Flash
The program memory is updated in a page by page fashion. Before programming a page withthe data stored in the temporary page buffer, the page must be erased. The temporary page buf-fer is filled one word at a time using SPM and the buffer can be filled either before the PageErase command or between a Page Erase and a Page Write operation:
Alternative 1, fill the buffer before a Page Erase
• Fill temporary page buffer
• Perform a Page Erase
• Perform a Page Write
Alternative 2, fill the buffer after Page Erase
• Perform a Page Erase
• Fill temporary page buffer
• Perform a Page Write
If only a part of the page needs to be changed, the rest of the page must be stored (for examplein the temporary page buffer) before the erase, and then be rewritten. When using alternative 1,the Boot Loader provides an effective Read-Modify-Write feature which allows the user softwareto first read the page, do the necessary changes, and then write back the modified data. If alter-native 2 is used, it is not possible to read the old data while loading since the page is alreadyerased. The temporary page buffer can be accessed in a random sequence. It is essential thatthe page address used in both the Page Erase and Page Write operation is addressing the samepage. See ”Boot Loader: Simple Assembly Code Example” on page 291 for an assembly codeexample.
26.8.1 Performing Page Erase by SPM
To execute Page Erase, set up the address in the Z-pointer, write “X0000011” to SPMCSR andexecute SPM within four clock cycles after writing SPMCSR.(1) The data in R1 and R0 is ignored.The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer willbe ignored during this operation.
• Page Erase to the RWW section: The NRWW section can be read during the Page Erase.
• Page Erase to the NRWW section: The CPU is halted during the operation.
Note: 1. If an interrupt occurs in the timed sequence the four cycle access cannot be guaranteed. In order to ensure atomic operation you must disable interrupes before writing to SPMCSR.
26.8.2 Filling the Temporary Buffer (Page Loading)
To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write“00000001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. Thecontent of PCWORD in the Z-register is used to address the data in the temporary buffer. Thetemporary buffer will auto-erase after a Page Write operation or by writing the RWWSRE bit inSPMCSR. It is also erased after a system reset. Note that it is not possible to write more thanone time to each address without erasing the temporary buffer.
If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will belost.
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26.8.3 Performing a Page Write
To execute Page Write, set up the address in the Z-pointer, write “X0000101” to SPMCSR andexecute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored.The page address must be written to PCPAGE. Other bits in the Z-pointer must be written tozero during this operation.
• Page Write to the RWW section: The NRWW section can be read during the Page Write.
• Page Write to the NRWW section: The CPU is halted during the operation.
26.8.4 Using the SPM Interrupt
If the SPM interrupt is enabled, the SPM interrupt will generate a constant interrupt when theSPMEN bit in SPMCSR is cleared. This means that the interrupt can be used instead of pollingthe SPMCSR Register in software. When using the SPM interrupt, the Interrupt Vectors shouldbe moved to the BLS section to avoid that an interrupt is accessing the RWW section when it isblocked for reading. How to move the interrupts is described in ”Interrupts” on page 56.
26.8.5 Consideration While Updating BLS
Special care must be taken if the user allows the Boot Loader section to be updated by leavingBoot Lock bit11 unprogrammed. An accidental write to the Boot Loader itself can corrupt theentire Boot Loader, and further software updates might be impossible. If it is not necessary tochange the Boot Loader software itself, it is recommended to program the Boot Lock bit11 toprotect the Boot Loader software from any internal software changes.
26.8.6 Prevent Reading the RWW Section During Self-Programming
During Self-Programming (either Page Erase or Page Write), the RWW section is alwaysblocked for reading. The user software itself must prevent that this section is addressed duringthe self programming operation. The RWWSB in the SPMCSR will be set as long as the RWWsection is busy. During Self-Programming the Interrupt Vector table should be moved to the BLSas described in ”Interrupts” on page 56, or the interrupts must be disabled. Before addressingthe RWW section after the programming is completed, the user software must clear theRWWSB by writing the RWWSRE. See ”Boot Loader: Simple Assembly Code Example” onpage 291 for an example.
26.8.7 Setting the Boot Loader Lock Bits by SPM
To set the Boot Loader Lock bits and general Lock bits, write the desired data to R0, write“X0001001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR.
See Table 26-2 on page 284 and Table 26-3 on page 284 for how the different settings of theBoot Loader bits affect the Flash access.
If bits 5..0 in R0 are cleared (zero), the corresponding Lock bit will be programmed if an SPMinstruction is executed within four cycles after BLBSET and SPMEN are set in SPMCSR. The Z-pointer is don’t care during this operation, but for future compatibility it is recommended to loadthe Z-pointer with 0x0001 (same as used for reading the Lock bits). For future compatibility it isalso recommended to set bit 7 and bit 6 in R0 to “1” when writing the Lock bits. When program-ming the Lock bits the entire Flash can be read during the operation.
Bit 7 6 5 4 3 2 1 0
R0 1 1 BLB12 BLB11 BLB02 BLB01 LB2 LB1
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26.8.8 EEPROM Write Prevents Writing to SPMCSR
Note that an EEPROM write operation will block all software programming to Flash. Reading theFuses and Lock bits from software will also be prevented during the EEPROM write operation. Itis recommended that the user checks the status bit (EEWE) in the EECR Register and verifiesthat the bit is cleared before writing to the SPMCSR Register.
26.8.9 Reading the Fuse and Lock Bits from Software
It is possible to read both the Fuse and Lock bits from software. To read the Lock bits, load theZ-pointer with 0x0001 and set the BLBSET and SPMEN bits in SPMCSR. When an LPM instruc-tion is executed within three CPU cycles after the BLBSET and SPMEN bits are set in SPMCSR,the value of the Lock bits will be loaded in the destination register. The BLBSET and SPMENbits will auto-clear upon completion of reading the Lock bits or if no LPM instruction is executedwithin three CPU cycles or no SPM instruction is executed within four CPU cycles. When BLB-SET and SPMEN are cleared, LPM will work as described in the Instruction set Manual.
The algorithm for reading the Fuse Low byte is similar to the one described above for readingthe Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and set the BLBSETand SPMEN bits in SPMCSR. When an LPM instruction is executed within three cycles after theBLBSET and SPMEN bits are set in the SPMCSR, the value of the Fuse Low byte (FLB) will beloaded in the destination register as shown below. Refer to Table 27-5 on page 298 for adetailed description and mapping of the Fuse Low byte.
Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an LPM instruc-tion is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR,the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below.Refer to Table 27-4 on page 298 for detailed description and mapping of the Fuse High byte.
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an LPM instructionis executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, thevalue of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below.Refer to Table 27-3 on page 297 for detailed description and mapping of the Extended Fusebyte.
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that areunprogrammed, will be read as one.
Bit 7 6 5 4 3 2 1 0
Rd – – BLB12 BLB11 BLB02 BLB01 LB2 LB1
Bit 7 6 5 4 3 2 1 0
Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0
Bit 7 6 5 4 3 2 1 0
Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0
Bit 7 6 5 4 3 2 1 0
Rd – – – – EFB3 EFB2 EFB1 EFB0
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26.8.10 Preventing Flash Corruption
During periods of low VCC, the Flash program can be corrupted because the supply voltage istoo low for the CPU and the Flash to operate properly. These issues are the same as for boardlevel systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, aregular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructionsis too low.
Flash corruption can easily be avoided by following these design recommendations (one issufficient):
1. If there is no need for a Boot Loader update in the system, program the Boot Loader Lock bits to prevent any Boot Loader software updates.
2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be done by enabling the internal Brown-out Detector (BOD) if the operating volt-age matches the detection level. If not, an external low VCC reset protection circuit can be used. If a reset occurs while a write operation is in progress, the write operation will be completed provided that the power supply voltage is sufficient.
3. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will pre-vent the CPU from attempting to decode and execute instructions, effectively protecting the SPMCSR Register and thus the Flash from unintentional writes.
26.8.11 Programming Time for Flash when Using SPM
The calibrated RC Oscillator is used to time Flash accesses. Table 26-5 shows the typical pro-gramming time for Flash accesses from the CPU.
Table 26-5. SPM Programming Time
Symbol Min Programming Time Max Programming Time
Flash write (Page Erase, Page Write, and write Lock bits by SPM)
3.7 ms 4.5 ms
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26.8.12 Boot Loader: Simple Assembly Code Example
;-the routine writes one page of data from RAM to Flash; the first data location in RAM is pointed to by the Y pointer; the first data location in Flash is pointed to by the Z-pointer;-error handling is not included;-the routine must be placed inside the Boot space; (at least the Do_spm sub routine). Only code inside NRWW section can; be read during Self-Programming (Page Erase and Page Write).;-registers used: r0, r1, temp1 (r16), temp2 (r17), looplo (r24), ; loophi (r25), spmcrval (r20); storing and restoring of registers is not included in the routine; register usage can be optimized at the expense of code size;-It is assumed that either the interrupt table is moved to the Boot; loader section or that the interrupts are disabled.
.equ PAGESIZEB = PAGESIZE*2 ;PAGESIZEB is page size in BYTES, not words
.org SMALLBOOTSTARTWrite_page:; Page Eraseldi spmcrval, (1<<PGERS) | (1<<SPMEN)call Do_spm
; re-enable the RWW sectionldi spmcrval, (1<<RWWSRE) | (1<<SPMEN)call Do_spm
; transfer data from RAM to Flash page bufferldi looplo, low(PAGESIZEB) ;init loop variableldi loophi, high(PAGESIZEB) ;not required for PAGESIZEB<=256
Wrloop:ld r0, Y+ld r1, Y+ldi spmcrval, (1<<SPMEN)call Do_spmadiw ZH:ZL, 2sbiw loophi:looplo, 2 ;use subi for PAGESIZEB<=256brne Wrloop
; execute Page Writesubi ZL, low(PAGESIZEB) ;restore pointersbci ZH, high(PAGESIZEB) ;not required for PAGESIZEB<=256ldi spmcrval, (1<<PGWRT) | (1<<SPMEN)call Do_spm
; re-enable the RWW sectionldi spmcrval, (1<<RWWSRE) | (1<<SPMEN)call Do_spm
; read back and check, optionalldi looplo, low(PAGESIZEB) ;init loop variableldi loophi, high(PAGESIZEB) ;not required for PAGESIZEB<=256subi YL, low(PAGESIZEB) ;restore pointersbci YH, high(PAGESIZEB)
Rdloop:lpm r0, Z+ld r1, Y+cpse r0, r1jmp Error
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sbiw loophi:looplo, 1 ;use subi for PAGESIZEB<=256brne Rdloop
; return to RWW section; verify that RWW section is safe to read
Return:in temp1, SPMCSRsbrs temp1, RWWSB ; If RWWSB is set, the RWW section is not ready yetret; re-enable the RWW sectionldi spmcrval, (1<<RWWSRE) | (1<<SPMEN)call Do_spmrjmp Return
Do_spm:; check for previous SPM complete
Wait_spm:in temp1, SPMCSRsbrc temp1, SPMENrjmp Wait_spm; input: spmcrval determines SPM action; disable interrupts if enabled, store statusin temp2, SREGcli; check that no EEPROM write access is present
Wait_ee:sbic EECR, EEWErjmp Wait_ee; SPM timed sequenceout SPMCSR, spmcrvalspm; restore SREG (to enable interrupts if originally enabled)out SREG, temp2ret
26.8.13 ATmega169P Boot Loader Parameters
In Table 26-6 through Table 26-8 on page 293, the parameters used in the description of theSelf-Programming are given.
Note: 1. The different BOOTSZ Fuse configurations are shown in Figure 26-2 on page 283.
Table 26-6. Boot Size Configuration(1)
BO
OT
SZ
1
BO
OT
SZ
0
Bo
ot
Siz
e
Pag
es
Application FlashSection
Boot Loader FlashSection
End ApplicationSection
Boot Reset Address (Start Boot Loader Section)
1 1128
words2 0x0000 - 0x1F7F 0x1F80 - 0x1FFF 0x1F7F 0x1F80
1 0256
words4 0x0000 - 0x1EFF 0x1F00 - 0x1FFF 0x1EFF 0x1F00
0 1512
words8 0x0000 - 0x1DFF 0x1E00 - 0x1FFF 0x1DFF 0x1E00
0 01024words
16 0x0000 - 0x1BFF 0x1C00 - 0x1FFF 0x1BFF 0x1C00
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Note: 1. For details about these two section, see ”NRWW – No Read-While-Write Section” on page 281 and ”RWW – Read-While-Write Section” on page 281.
Note: 1. Z15:Z14: always ignoredZ0: should be zero for all SPM commands, byte select for the LPM instruction.See ”Addressing the Flash During Self-Programming” on page 286 for details about the use of Z-pointer during Self-Programming.
Table 26-7. Read-While-Write Limit(1)
Section Pages Address
Read-While-Write section (RWW) 112 0x0000 - 0x1BFF
No Read-While-Write section (NRWW) 16 0x1C00 - 0x1FFF
Table 26-8. Explanation of different variables used in Figure 26-3 on page 286 and the map-ping to the Z-pointer(1)
VariableCorresponding
Z-value Description
PCMSB 12Most significant bit in the Program Counter. (The Program Counter is 13 bits PC[12:0])
PAGEMSB 5Most significant bit which is used to address the words within one page (64 words in a page requires six bits PC [5:0]).
ZPCMSB Z13Bit in Z-register that is mapped to PCMSB. Because Z0 is not used, the ZPCMSB equals PCMSB + 1.
ZPAGEMSB Z6Bit in Z-register that is mapped to PAGEMSB. Because Z0 is not used, the ZPAGEMSB equals PAGEMSB + 1.
PCPAGE PC[12:6] Z13:Z7Program Counter page address: Page select, for Page Erase and Page Write
PCWORD PC[5:0] Z6:Z1Program Counter word address: Word select, for filling temporary buffer (must be zero during Page Write operation)
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26.9 Register Description
26.9.1 SPMCSR – Store Program Memory Control and Status Register
The Store Program Memory Control and Status Register contains the control bits needed to con-trol the Boot Loader operations.
• Bit 7 – SPMIE: SPM Interrupt EnableWhen the SPMIE bit is written to one, and the I-bit in the Status Register is set (one), the SPMready interrupt will be enabled. The SPM ready Interrupt will be executed as long as the SPMENbit in the SPMCSR Register is cleared.
• Bit 6 – RWWSB: Read-While-Write Section BusyWhen a Self-Programming (Page Erase or Page Write) operation to the RWW section is initi-ated, the RWWSB will be set (one) by hardware. When the RWWSB bit is set, the RWW sectioncannot be accessed. The RWWSB bit will be cleared if the RWWSRE bit is written to one after aSelf-Programming operation is completed. Alternatively the RWWSB bit will automatically becleared if a page load operation is initiated.
• Bit 5 – Res: Reserved BitThis bit is a reserved bit in the ATmega169P and always read as zero.
• Bit 4 – RWWSRE: Read-While-Write Section Read EnableWhen programming (Page Erase or Page Write) to the RWW section, the RWW section isblocked for reading (the RWWSB will be set by hardware). To re-enable the RWW section, theuser software must wait until the programming is completed (SPMEN will be cleared). Then, ifthe RWWSRE bit is written to one at the same time as SPMEN, the next SPM instruction withinfour clock cycles re-enables the RWW section. The RWW section cannot be re-enabled whilethe Flash is busy with a Page Erase or a Page Write (SPMEN is set). If the RWWSRE bit is writ-ten while the Flash is being loaded, the Flash load operation will abort and the data loaded willbe lost.
• Bit 3 – BLBSET: Boot Lock Bit SetIf this bit is written to one at the same time as SPMEN, the next SPM instruction within four clockcycles sets Boot Lock bits and general Lock bits, according to the data in R0. The data in R1 andthe address in the Z-pointer are ignored. The BLBSET bit will automatically be cleared uponcompletion of the Lock bit set, or if no SPM instruction is executed within four clock cycles.
An LPM instruction within three cycles after BLBSET and SPMEN are set in the SPMCSR Reg-ister, will read either the Lock bits or the Fuse bits (depending on Z0 in the Z-pointer) into thedestination register. See ”Reading the Fuse and Lock Bits from Software” on page 289 fordetails.
Bit 7 6 5 4 3 2 1 0
0x37 (0x57) SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN SPMCSR
Read/Write R/W R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 2 – PGWRT: Page WriteIf this bit is written to one at the same time as SPMEN, the next SPM instruction within four clockcycles executes Page Write, with the data stored in the temporary buffer. The page address istaken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bitwill auto-clear upon completion of a Page Write, or if no SPM instruction is executed within fourclock cycles. The CPU is halted during the entire Page Write operation if the NRWW section isaddressed.
• Bit 1 – PGERS: Page EraseIf this bit is written to one at the same time as SPMEN, the next SPM instruction within four clockcycles executes Page Erase. The page address is taken from the high part of the Z-pointer. Thedata in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase,or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entirePage Write operation if the NRWW section is addressed.
• Bit 0 – SPMEN: Store Program Memory EnableThis bit enables the SPM instruction for the next four clock cycles. If written to one together witheither RWWSRE, BLBSET, PGWRT’ or PGERS, the following SPM instruction will have a spe-cial meaning, see description above. If only SPMEN is written, the following SPM instruction willstore the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB ofthe Z-pointer is ignored. The SPMEN bit will auto-clear upon completion of an SPM instruction,or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write,the SPMEN bit remains high until the operation is completed.
Writing any other combination than “10001”, “01001”, “00101”, “00011” or “00001” in the lowerfive bits will have no effect.
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27. Memory Programming
27.1 Program And Data Memory Lock Bits
The ATmega169P provides six Lock bits which can be left unprogrammed (“1”) or can be pro-grammed (“0”) to obtain the additional features listed in Table 27-2. The Lock bits can only beerased to “1” with the Chip Erase command.
Note: 1. “1” means unprogrammed, “0” means programmed.
Table 27-1. Lock Bit Byte(1)
Lock Bit Byte Bit No Description Default Value
7 – 1 (unprogrammed)
6 – 1 (unprogrammed)
BLB12 5 Boot Lock bit 1 (unprogrammed)
BLB11 4 Boot Lock bit 1 (unprogrammed)
BLB02 3 Boot Lock bit 1 (unprogrammed)
BLB01 2 Boot Lock bit 1 (unprogrammed)
LB2 1 Lock bit 1 (unprogrammed)
LB1 0 Lock bit 1 (unprogrammed)
Table 27-2. Lock Bit Protection Modes(1)(2)
Memory Lock Bits Protection Type
LB Mode LB2 LB1
1 1 1 No memory lock features enabled.
2 1 0Further programming of the Flash and EEPROM is disabled in Parallel and Serial Programming mode. The Fuse bits are locked in both Serial and Parallel Programming mode.(1)
3 0 0
Further programming and verification of the Flash and EEPROM is disabled in Parallel and Serial Programming mode. The Boot Lock bits and Fuse bits are locked in both Serial and Parallel Programming mode.(1)
BLB0 Mode BLB02 BLB01
1 1 1No restrictions for SPM or LPM accessing the Application section.
2 1 0 SPM is not allowed to write to the Application section.
3 0 0
SPM is not allowed to write to the Application section, and LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section.
4 0 1
LPM executing from the Boot Loader section is not allowed to read from the Application section. If Interrupt Vectors are placed in the Boot Loader section, interrupts are disabled while executing from the Application section.
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Notes: 1. Program the Fuse bits and Boot Lock bits before programming the LB1 and LB2.2. “1” means unprogrammed, “0” means programmed.
27.2 Fuse Bits
The ATmega169P has three Fuse bytes. Table 27-3 to Table 27-5 on page 298 describe brieflythe functionality of all the fuses and how they are mapped into the Fuse bytes. Note that thefuses are read as logical zero, “0”, if they are programmed.
Notes: 1. See Table 28-5 on page 334 for BODLEVEL Fuse decoding.2. Port G, PG5 is input only. Pull-up is always on. See ”Alternate Functions of Port G” on page
85.
BLB1 Mode BLB12 BLB11
1 1 1No restrictions for SPM or LPM accessing the Boot Loader section.
2 1 0 SPM is not allowed to write to the Boot Loader section.
3 0 0
SPM is not allowed to write to the Boot Loader section, and LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section.
4 0 1
LPM executing from the Application section is not allowed to read from the Boot Loader section. If Interrupt Vectors are placed in the Application section, interrupts are disabled while executing from the Boot Loader section.
Table 27-2. Lock Bit Protection Modes(1)(2) (Continued)
Memory Lock Bits Protection Type
Table 27-3. Extended Fuse Byte
Fuse Low Byte Bit No Description Default Value
– 7 – 1
– 6 – 1
– 5 – 1
– 4 – 1
BODLEVEL2(1) 3 Brown-out Detector trigger level 1 (unprogrammed)
BODLEVEL1(1) 2 Brown-out Detector trigger level 1 (unprogrammed)
BODLEVEL0(1) 1 Brown-out Detector trigger level 1 (unprogrammed)
RSTDISBL(2) 0 External Reset Disable 1 (unprogrammed)
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Note: 1. The SPIEN Fuse is not accessible in serial programming mode.
2. The default value of BOOTSZ1..0 results in maximum Boot Size. See Table 26-6 on page 292 for details.
3. See ”WDTCR – Watchdog Timer Control Register” on page 54 for details.4. Never ship a product with the OCDEN Fuse programmed regardless of the setting of Lock bits
and JTAGEN Fuse. A programmed OCDEN Fuse enables some parts of the clock system to be running in all sleep modes. This may increase the power consumption.
5. If the JTAG interface is left unconnected, the JTAGEN fuse should if possible be disabled. This to avoid static current at the TDO pin in the JTAG interface.
.
Note: 1. The default value of SUT1..0 results in maximum start-up time for the default clock source. See Table 28-4 on page 333 for details.
2. The default setting of CKSEL3..0 results in internal RC Oscillator @ 8 MHz. See Table 8-9 on page 35 for details.
3. The CKOUT Fuse allow the system clock to be output on PORTE7. See ”Clock Output Buffer” on page 37 for details.
4. See ”System Clock Prescaler” on page 37 for details.
The status of the Fuse bits is not affected by Chip Erase. Note that the Fuse bits are locked ifLock bit1 (LB1) is programmed. Program the Fuse bits before programming the Lock bits.
Table 27-4. Fuse High Byte
Fuse High Byte Bit No Description Default Value
OCDEN(4) 7 Enable OCD 1 (unprogrammed, OCD disabled)
JTAGEN(5) 6 Enable JTAG 0 (programmed, JTAG enabled)
SPIEN(1) 5Enable Serial Program and Data Downloading
0 (programmed, SPI prog. enabled)
WDTON(3) 4 Watchdog Timer always on 1 (unprogrammed)
EESAVE 3EEPROM memory is preserved through the Chip Erase
1 (unprogrammed, EEPROM not preserved)
BOOTSZ1 2Select Boot Size (see Table 26-6 on page 292 for details)
0 (programmed)(2)
BOOTSZ0 1Select Boot Size (see Table 26-6 on page 292 for details)
0 (programmed)(2)
BOOTRST 0 Select Reset Vector 1 (unprogrammed)
Table 27-5. Fuse Low Byte
Fuse Low Byte Bit No Description Default Value
CKDIV8(4) 7 Divide clock by 8 0 (programmed)
CKOUT(3) 6 Clock output 1 (unprogrammed)
SUT1 5 Select start-up time 1 (unprogrammed)(1)
SUT0 4 Select start-up time 0 (programmed)(1)
CKSEL3 3 Select Clock source 0 (programmed)(2)
CKSEL2 2 Select Clock source 0 (programmed)(2)
CKSEL1 1 Select Clock source 1 (unprogrammed)(2)
CKSEL0 0 Select Clock source 0 (programmed)(2)
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27.2.1 Latching of Fuses
The fuse values are latched when the device enters programming mode and changes of thefuse values will have no effect until the part leaves Programming mode. This does not apply tothe EESAVE Fuse which will take effect once it is programmed. The fuses are also latched onPower-up in Normal mode.
27.3 Signature Bytes
All Atmel microcontrollers have a three-byte signature code which identifies the device. Thiscode can be read in both serial and parallel mode, also when the device is locked. The threebytes reside in a separate address space. The signature bytes are given in Table 27-6.
27.4 Calibration Byte
The ATmega169P has a byte calibration value for the internal RC Oscillator. This byte resides inthe high byte of address 0x000 in the signature address space. During reset, this byte is auto-matically written into the OSCCAL Register to ensure correct frequency of the calibrated RCOscillator.
27.5 Page Size
27.6 Parallel Programming Parameters, Pin Mapping, and Commands
This section describes how to parallel program and verify Flash Program memory, EEPROMData memory, Memory Lock bits, and Fuse bits in the ATmega169P. Pulses are assumed to beat least 250 ns unless otherwise noted.
27.6.1 Signal Names
In this section, some pins of the ATmega169P are referenced by signal names describing theirfunctionality during parallel programming, see Figure 27-1 on page 300 and Table 27-9 on page300. Pins not described in Table 27-9 on page 300 are referenced by pin names.
The XA1/XA0 pins determine the action executed when the XTAL1 pin is given a positive pulse.The bit coding is shown in Table 27-11 on page 301.
Table 27-6. Device and JTAG ID
Part
Signature Bytes Address JTAG
0x000 0x001 0x002 Part Number Manufacture ID
ATmega169P 0x1E 0x94 0x05 9405 0x1F
Table 27-7. No. of Words in a Page and No. of Pages in the Flash
Flash Size Page Size PCWORD No. of Pages PCPAGE PCMSB
8K words (16 Kbytes) 64 words PC[5:0] 128 PC[12:6] 12
Table 27-8. No. of Words in a Page and No. of Pages in the EEPROM
EEPROM Size Page Size PCWORD No. of Pages PCPAGE EEAMSB
512 bytes 4 bytes EEA[1:0] 128 EEA[8:2] 8
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When pulsing WR or OE, the command loaded determines the action executed. The differentCommands are shown in Table 27-12 on page 301.
Figure 27-1. Parallel Programming
Table 27-9. Pin Name Mapping
Signal Namein Programming Mode Pin Name I/O Function
RDY/BSY PD1 O0: Device is busy programming, 1: Device is ready for new command.
OE PD2 I Output Enable (Active low).
WR PD3 I Write Pulse (Active low).
BS1 PD4 IByte Select 1 (“0” selects low byte, “1” selects high byte).
XA0 PD5 I XTAL Action Bit 0
XA1 PD6 I XTAL Action Bit 1
PAGEL PD7 I Program Memory and EEPROM data Page Load.
BS2 PA0 IByte Select 2 (“0” selects low byte, “1” selects 2’nd high byte).
DATA PB7-0 I/O Bi-directional Data bus (Output when OE is low).
VCC
+5V
GND
XTAL1
PD1
PD2
PD3
PD4
PD5
PD6
PB7 - PB0 DATA
RESET
PD7
+12V
BS1
XA0
XA1
OE
RDY/BSY
PAGEL
PA0
WR
BS2
AVCC
+5V
Table 27-10. Pin Values Used to Enter Programming Mode
Pin Symbol Value
PAGEL Prog_enable[3] 0
XA1 Prog_enable[2] 0
XA0 Prog_enable[1] 0
BS1 Prog_enable[0] 0
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Table 27-11. XA1 and XA0 Coding
XA1 XA0 Action when XTAL1 is Pulsed
0 0Load Flash or EEPROM Address (High or low address byte determined by BS1).
0 1 Load Data (High or Low data byte for Flash determined by BS1).
1 0 Load Command
1 1 No Action, Idle
Table 27-12. Command Byte Bit Coding
Command Byte Command Executed
1000 0000 Chip Erase
0100 0000 Write Fuse bits
0010 0000 Write Lock bits
0001 0000 Write Flash
0001 0001 Write EEPROM
0000 1000 Read Signature Bytes and Calibration byte
0000 0100 Read Fuse and Lock bits
0000 0010 Read Flash
0000 0011 Read EEPROM
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27.7 Parallel Programming
27.7.1 Enter Programming Mode
The following algorithm puts the device in parallel programming mode:
1. Apply 4.5V - 5.5V between VCC and GND.
2. Set RESET to “0” and toggle XTAL1 at least six times.
3. Set the Prog_enable pins listed in Table 27-10 on page 300 to “0000” and wait at least 100 ns.
4. Apply 11.5V - 12.5V to RESET. Any activity on Prog_enable pins within 100 ns after +12V has been applied to RESET, will cause the device to fail entering programming mode.
5. Wait at least 50 µs before sending a new command.
27.7.2 Considerations for Efficient Programming
The loaded command and address are retained in the device during programming. For efficientprogramming, the following should be considered.
• The command needs only be loaded once when writing or reading multiple memory locations.
• Skip writing the data value 0xFF, that is the contents of the entire EEPROM (unless the EESAVE Fuse is programmed) and Flash after a Chip Erase.
• Address high byte needs only be loaded before programming or reading a new 256 word window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes reading.
27.7.3 Chip Erase
The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock bits arenot reset until the program memory has been completely erased. The Fuse bits are notchanged. A Chip Erase must be performed before the Flash and/or EEPROM arereprogrammed.
Note: 1. The EEPRPOM memory is preserved during Chip Erase if the EESAVE Fuse is programmed.
Load Command “Chip Erase”:
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “1000 0000”. This is the command for Chip Erase.
4. Give XTAL1 a positive pulse. This loads the command.
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.
6. Wait until RDY/BSY goes high before loading a new command.
27.7.4 Programming the Flash
The Flash is organized in pages, see Table 27-7 on page 299. When programming the Flash,the program data is latched into a page buffer. This allows one page of program data to be pro-grammed simultaneously. The following procedure describes how to program the entire Flashmemory:
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A. Load Command “Write Flash”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “0001 0000”. This is the command for Write Flash.
4. Give XTAL1 a positive pulse. This loads the command.
B. Load Address Low byte
1. Set XA1, XA0 to “00”. This enables address loading.
2. Set BS1 to “0”. This selects low address.
3. Set DATA = Address low byte (0x00 - 0xFF).
4. Give XTAL1 a positive pulse. This loads the address low byte.
C. Load Data Low Byte
1. Set XA1, XA0 to “01”. This enables data loading.
2. Set DATA = Data low byte (0x00 - 0xFF).
3. Give XTAL1 a positive pulse. This loads the data byte.
D. Load Data High Byte
1. Set BS1 to “1”. This selects high data byte.
2. Set XA1, XA0 to “01”. This enables data loading.
3. Set DATA = Data high byte (0x00 - 0xFF).
4. Give XTAL1 a positive pulse. This loads the data byte.
E. Latch Data
1. Set BS1 to “1”. This selects high data byte.
2. Give PAGEL a positive pulse. This latches the data bytes. (See Figure 27-3 on page 304 for signal waveforms)
F. Repeat B through E until the entire buffer is filled or until all data within the page is loaded
While the lower bits in the address are mapped to words within the page, the higher bits addressthe pages within the FLASH. This is illustrated in Figure 27-2 on page 304. Note that if less thaneight bits are required to address words in the page (pagesize < 256), the most significant bit(s)in the address low byte are used to address the page when performing a Page Write.
G. Load Address High byte
1. Set XA1, XA0 to “00”. This enables address loading.
2. Set BS1 to “1”. This selects high address.
3. Set DATA = Address high byte (0x00 - 0xFF).
4. Give XTAL1 a positive pulse. This loads the address high byte.
H. Program Page
1. Give WR a negative pulse. This starts programming of the entire page of data. RDY/BSY goes low.
2. Wait until RDY/BSY goes high (See Figure 27-3 on page 304 for signal waveforms).
I. Repeat B through H until the entire Flash is programmed or until all data has beenprogrammed.
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J. End Page Programming
1. 1. Set XA1, XA0 to “10”. This enables command loading.
2. Set DATA to “0000 0000”. This is the command for No Operation.
3. Give XTAL1 a positive pulse. This loads the command, and the internal write signals are reset.
Figure 27-2. Addressing the Flash Which is Organized in Pages(1)
Note: 1. PCPAGE and PCWORD are listed in Table 27-7 on page 299.
Figure 27-3. Programming the Flash Waveforms(1)
Note: 1. “XX” is don’t care. The letters refer to the programming description above.
PROGRAM MEMORY
WORD ADDRESSWITHIN A PAGE
PAGE ADDRESSWITHIN THE FLASH
INSTRUCTION WORD
PAGE PCWORD[PAGEMSB:0]:
00
01
02
PAGEEND
PAGE
PCWORDPCPAGE
PCMSB PAGEMSBPROGRAMCOUNTER
RDY/BSY
WR
OE
RESET +12V
PAGEL
BS2
0x10 ADDR. LOW ADDR. HIGHDATADATA LOW DATA HIGH ADDR. LOW DATA LOW DATA HIGH
XA1
XA0
BS1
XTAL1
XX XX XX
A B C D E B C D E G H
F
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27.7.5 Programming the EEPROM
The EEPROM is organized in pages, see Table 27-8 on page 299. When programming theEEPROM, the program data is latched into a page buffer. This allows one page of data to beprogrammed simultaneously. The programming algorithm for the EEPROM data memory is asfollows (refer to ”Programming the Flash” on page 302 for details on Command, Address andData loading):
1. A: Load Command “0001 0001”.
2. G: Load Address High Byte (0x00 - 0xFF).
3. B: Load Address Low Byte (0x00 - 0xFF).
4. C: Load Data (0x00 - 0xFF).
5. E: Latch data (give PAGEL a positive pulse).
K: Repeat 3 through 5 until the entire buffer is filled.
L: Program EEPROM page
1. Set BS to “0”.
2. Give WR a negative pulse. This starts programming of the EEPROM page. RDY/BSY goes low.
3. Wait until to RDY/BSY goes high before programming the next page (See Figure 27-4 for signal waveforms).
Figure 27-4. Programming the EEPROM Waveforms
27.7.6 Reading the Flash
The algorithm for reading the Flash memory is as follows (refer to ”Programming the Flash” onpage 302 for details on Command and Address loading):
1. A: Load Command “0000 0010”.
2. G: Load Address High Byte (0x00 - 0xFF).
3. B: Load Address Low Byte (0x00 - 0xFF).
4. Set OE to “0”, and BS1 to “0”. The Flash word low byte can now be read at DATA.
5. Set BS to “1”. The Flash word high byte can now be read at DATA.
6. Set OE to “1”.
RDY/BSY
WR
OE
RESET +12V
PAGEL
BS2
0x11 ADDR. HIGHDATA
ADDR. LOW DATA ADDR. LOW DATA XX
XA1
XA0
BS1
XTAL1
XX
A G B C E B C E L
K
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27.7.7 Reading the EEPROM
The algorithm for reading the EEPROM memory is as follows (refer to ”Programming the Flash”on page 302 for details on Command and Address loading):
1. A: Load Command “0000 0011”.
2. G: Load Address High Byte (0x00 - 0xFF).
3. B: Load Address Low Byte (0x00 - 0xFF).
4. Set OE to “0”, and BS1 to “0”. The EEPROM Data byte can now be read at DATA.
5. Set OE to “1”.
27.7.8 Programming the Fuse Low Bits
The algorithm for programming the Fuse Low bits is as follows (refer to ”Programming the Flash”on page 302 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Give WR a negative pulse and wait for RDY/BSY to go high.
27.7.9 Programming the Fuse High Bits
The algorithm for programming the Fuse High bits is as follows (refer to ”Programming theFlash” on page 302 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Set BS1 to “1” and BS2 to “0”. This selects high fuse byte.
4. Give WR a negative pulse and wait for RDY/BSY to go high.
5. Set BS1 to “0”. This selects low data byte.
27.7.10 Programming the Extended Fuse Bits
The algorithm for programming the Extended Fuse bits is as follows (refer to ”Programming theFlash” on page 302 for details on Command and Data loading):
1. 1. A: Load Command “0100 0000”.
2. 2. C: Load Data Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. 3. Set BS1 to “0” and BS2 to “1”. This selects extended fuse byte.
4. 4. Give WR a negative pulse and wait for RDY/BSY to go high.
5. 5. Set BS2 to “0”. This selects low data byte.
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Figure 27-5. Programming the FUSES Waveforms
27.7.11 Programming the Lock Bits
The algorithm for programming the Lock bits is as follows (refer to ”Programming the Flash” onpage 302 for details on Command and Data loading):
1. A: Load Command “0010 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs the Lock bit. If LB mode 3 is programmed (LB1 and LB2 is programmed), it is not possible to program the Boot Lock bits by any External Programming mode.
3. Give WR a negative pulse and wait for RDY/BSY to go high.
The Lock bits can only be cleared by executing Chip Erase.
27.7.12 Reading the Fuse and Lock Bits
The algorithm for reading the Fuse and Lock bits is as follows (refer to ”Programming the Flash”on page 302 for details on Command loading):
1. A: Load Command “0000 0100”.
2. Set OE to “0”, BS2 to “0” and BS1 to “0”. The status of the Fuse Low bits can now be read at DATA (“0” means programmed).
3. Set OE to “0”, BS2 to “1” and BS1 to “1”. The status of the Fuse High bits can now be read at DATA (“0” means programmed).
4. Set OE to “0”, BS2 to “1”, and BS1 to “0”. The status of the Extended Fuse bits can now be read at DATA (“0” means programmed).
5. Set OE to “0”, BS2 to “0” and BS1 to “1”. The status of the Lock bits can now be read at DATA (“0” means programmed).
6. Set OE to “1”.
RDY/BSY
WR
OE
RESET +12V
PAGEL
0x40DATA
DATA XX
XA1
XA0
BS1
XTAL1
A C
0x40 DATA XX
A C
Write Fuse Low byte Write Fuse high byte
0x40 DATA XX
A C
Write Extended Fuse byte
BS2
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Figure 27-6. Mapping Between BS1, BS2 and the Fuse and Lock Bits During Read
27.7.13 Reading the Signature Bytes
The algorithm for reading the Signature bytes is as follows (refer to ”Programming the Flash” onpage 302 for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte (0x00 - 0x02).
3. Set OE to “0”, and BS to “0”. The selected Signature byte can now be read at DATA.
4. Set OE to “1”.
27.7.14 Reading the Calibration Byte
The algorithm for reading the Calibration byte is as follows (refer to ”Programming the Flash” onpage 302 for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte, 0x00.
3. Set OE to “0”, and BS1 to “1”. The Calibration byte can now be read at DATA.
4. Set OE to “1”.
27.7.15 Parallel Programming Characteristics
Figure 27-7. Parallel Programming Timing, Including some General Timing Requirements
Lock Bits 0
1
BS2
Fuse High Byte
0
1
BS1
DATA
Fuse Low Byte 0
1
BS2
Extended Fuse Byte
Data & Contol(DATA, XA0/1, BS1, BS2)
XTAL1tXHXL
tWLWH
tDVXH tXLDX
tPLWL
tWLRH
WR
RDY/BSY
PAGEL tPHPL
tPLBXtBVPH
tXLWL
tWLBXtBVWL
WLRL
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Figure 27-8. Parallel Programming Timing, Loading Sequence with Timing Requirements(1)
Note: 1. The timing requirements shown in Figure 27-7 on page 308 (that is, tDVXH, tXHXL, and tXLDX) also apply to loading operation.
Figure 27-9. Parallel Programming Timing, Reading Sequence (within the Same Page) with Timing Requirements(1)
Note: 1. The timing requirements shown in Figure 27-7 on page 308 (that is, tDVXH, tXHXL, and tXLDX) also apply to reading operation.
Table 27-13. Parallel Programming Characteristics, VCC = 5V ±10%
Symbol Parameter Min Typ Max Units
VPP Programming Enable Voltage 11.5 12.5 V
IPP Programming Enable Current 250 μA
XTAL1
PAGEL
tPLXHXLXHt tXLPH
ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)DATA
BS1
XA0
XA1
LOAD ADDRESS(LOW BYTE)
LOAD DATA (LOW BYTE)
LOAD DATA(HIGH BYTE)
LOAD DATA LOAD ADDRESS(LOW BYTE)
XTAL1
OE
ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)DATA
BS1
XA0
XA1
LOAD ADDRESS(LOW BYTE)
READ DATA (LOW BYTE)
READ DATA(HIGH BYTE)
LOAD ADDRESS(LOW BYTE)
tBVDV
tOLDV
tXLOL
tOHDZ
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Notes: 1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock bits commands.
2. tWLRH_CE is valid for the Chip Erase command.
27.8 Serial Downloading
Both the Flash and EEPROM memory arrays can be programmed using the serial SPI bus whileRESET is pulled to GND. The serial interface consists of pins SCK, MOSI (input) and MISO (out-put). After RESET is set low, the Programming Enable instruction needs to be executed firstbefore program/erase operations can be executed. NOTE, in Table 27-14 on page 311, the pinmapping for SPI programming is listed. Not all parts use the SPI pins dedicated for the internalSPI interface.
tDVXH Data and Control Valid before XTAL1 High 67
ns
tXLXH XTAL1 Low to XTAL1 High 200
tXHXL XTAL1 Pulse Width High 150
tXLDX Data and Control Hold after XTAL1 Low 67
tXLWL XTAL1 Low to WR Low 0
tXLPH XTAL1 Low to PAGEL high 0
tPLXH PAGEL low to XTAL1 high 150
tBVPH BS1 Valid before PAGEL High 67
tPHPL PAGEL Pulse Width High 150
tPLBX BS1 Hold after PAGEL Low 67
tWLBX BS2/1 Hold after WR Low 67
tPLWL PAGEL Low to WR Low 67
tBVWL BS1 Valid to WR Low 67
tWLWH WR Pulse Width Low 150
tWLRL WR Low to RDY/BSY Low 0 1 μs
tWLRH WR Low to RDY/BSY High(1) 3.7 4.5ms
tWLRH_CE WR Low to RDY/BSY High for Chip Erase(2) 7.5 9
tXLOL XTAL1 Low to OE Low 0
nstBVDV BS1 Valid to DATA valid 0 250
tOLDV OE Low to DATA Valid 250
tOHDZ OE High to DATA Tri-stated 250
Table 27-13. Parallel Programming Characteristics, VCC = 5V ±10%
Symbol Parameter Min Typ Max Units
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27.8.1 Serial Programming Pin Mapping
Figure 27-10. Serial Programming and Verify(1)
Notes: 1. If the device is clocked by the internal Oscillator, it is no need to connect a clock source to the XTAL1 pin.
2. VCC - 0.3V < AVCC < VCC + 0.3V, however, AVCC should always be within 1.8V - 5.5V
When programming the EEPROM, an auto-erase cycle is built into the self-timed programmingoperation (in the Serial mode ONLY) and there is no need to first execute the Chip Eraseinstruction. The Chip Erase operation turns the content of every memory location in both theProgram and EEPROM arrays into 0xFF.
Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high periodsfor the serial clock (SCK) input are defined as follows:
Low: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
High: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
27.8.2 Serial Programming Algorithm
When writing serial data to the ATmega169P, data is clocked on the rising edge of SCK.
When reading data from the ATmega169P, data is clocked on the falling edge of SCK. See Fig-ure 27-11 on page 313 for timing details.
To program and verify the ATmega169P in the serial programming mode, the followingsequence is recommended (See four byte instruction formats in Table 27-16 on page 314):
1. Power-up sequence:Apply power between VCC and GND while RESET and SCK are set to “0”. In some sys-tems, the programmer can not guarantee that SCK is held low during power-up. In this
Table 27-14. Pin Mapping Serial Programming
Symbol Pins I/O Description
MOSI PB2 I Serial Data in
MISO PB3 O Serial Data out
SCK PB1 I Serial Clock
VCC
GND
XTAL1
SCK
MISO
MOSI
RESET
+1.8V - 5.5V
AVCC
+1.8V - 5.5V(2)
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case, RESET must be given a positive pulse of at least two CPU clock cycles duration after SCK has been set to “0”.
2. Wait for at least 20 ms and enable serial programming by sending the Programming Enable serial instruction to pin MOSI.
3. The serial programming instructions will not work if the communication is out of synchro-nization. When in sync. the second byte (0x53), will echo back when issuing the third byte of the Programming Enable instruction. Whether the echo is correct or not, all four bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a positive pulse and issue a new Programming Enable command.
4. The Flash is programmed one page at a time. The page size is found in Table 27-7 on page 299. The memory page is loaded one byte at a time by supplying the 6 LSB of the address and data together with the Load Program Memory Page instruction. To ensure correct loading of the page, the data low byte must be loaded before data high byte is applied for a given address. The Program Memory Page is stored by loading the Write Program Memory Page instruction with the 7 MSB of the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before issuing the next page. (See Table 27-15.) Accessing the serial programming interface before the Flash write operation completes can result in incorrect programming.
5. A: The EEPROM array is programmed one byte at a time by supplying the address and data together with the appropriate Write instruction. An EEPROM memory location is first automatically erased before new data is written. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next byte (See Table 27-15). In a chip erased device, no 0xFFs in the data file(s) need to be programmed.B: The EEPROM array is programmed one page at a time. The Memory page is loaded one byte at a time by supplying the 2 LSB of the address and data together with the Load EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading the Write EEPROM Memory Page Instruction with the 4 MSB of the address. When using EEPROM page access only byte locations loaded with the Load EEPROM Memory Page instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is not used, the user must wait at least tWD_EEPROM before issuing the next page (See Table 27-15). In a chip erased device, no 0xFF in the data file(s) need to be programmed.
6. Any memory location can be verified by using the Read instruction which returns the con-tent at the selected address at serial output MISO.
7. At the end of the programming session, RESET can be set high to commence normal operation.
8. Power-off sequence (if needed):Set RESET to “1”.Turn VCC power off
Table 27-15. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location
Symbol Minimum Wait Delay
tWD_FUSE 4.5 ms
tWD_FLASH 4.5 ms
tWD_EEPROM 3.6 ms
tWD_ERASE 9.0 ms
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Figure 27-11. Serial Programming Waveforms
MSB
MSB
LSB
LSB
SERIAL CLOCK INPUT(SCK)
SERIAL DATA INPUT (MOSI)
(MISO)
SAMPLE
SERIAL DATA OUTPUT
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27.8.3 Serial Programming Instruction set
Table 27-16 and Figure 27-12 on page 315 describes the Instruction set.
Notes: 1. Not all instructions are applicable for all parts2. a = address3. Bits are programmed ‘0’, unprogrammed ‘1’.4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’).5. Refer to the corresponding section for Fuse and Lock bits, Calibration and Signature bytes and Page size.6. Instructions accessing program memory use a word address. This address may be random within the page range.7. See htt://www.atmel.com/avr for Application Notes regarding programming and programmers.
If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait untilthis bit returns ‘0’ before the next instruction is carried out.
Table 27-16. Serial Programming Instruction Set
Instruction/Operation
Instruction Format
Byte 1 Byte 2 Byte 3 Byte 4
Programming Enable $AC $53 $00 $00
Chip Erase (Program Memory/EEPROM) $AC $80 $00 $00
Poll RDY/BSY $F0 $00 $00 data byte out
Load Instructions
Load Extended Address byte(1) $4D $00 Extended adr $00
Load Program Memory Page, High byte $48 $00 adr LSB high data byte in
Load Program Memory Page, Low byte $40 $00 adr LSB low data byte in
Load EEPROM Memory Page (page access) $C1 $00 0000 00aa data byte in
Read Instructions
Read Program Memory, High byte $28 adr MSB adr LSB high data byte out
Read Program Memory, Low byte $20 adr MSB adr LSB low data byte out
Read EEPROM Memory $A0 0000 00aa aaaa aaaa data byte out
Read Lock bits $58 $00 $00 data byte out
Read Signature Byte $30 $00 0000 00aa data byte out
Read Fuse bits $50 $00 $00 data byte out
Read Fuse High bits $58 $08 $00 data byte out
Read Extended Fuse Bits $50 $08 $00 data byte out
Read Calibration Byte $38 $00 $00 data byte out
Write Instructions(6)
Write Program Memory Page $4C adr MSB adr LSB $00
Write EEPROM Memory $C0 0000 00aa aaaa aaaa data byte in
Write EEPROM Memory Page (page access) $C2 0000 00aa aaaa aa00 $00
Write Lock bits $AC $E0 $00 data byte in
Write Fuse bits $AC $A0 $00 data byte in
Write Fuse High bits $AC $A8 $00 data byte in
Write Extended Fuse Bits $AC $A4 $00 data byte in
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Within the same page, the low data byte must be loaded prior to the high data byte.
After data is loaded to the page buffer, program the EEPROM page, see Figure 27-12.
Figure 27-12. Serial Programming Instruction example
27.8.4 SPI Serial Programming Characteristics
For characteristics of the SPI module, see ”SPI Timing Characteristics” on page 334.
Byte 1 Byte 2 Byte 3 Byte 4
Adr MSB Adr LSB
Bit 15 B 0
Serial Programming Instruction
Program Memory/EEPROM Memory
Page 0
Page 1
Page 2
Page N-1
Page Buffer
Write Program Memory Page/Write EEPROM Memory Page
Load Program Memory Page (High/Low Byte)/Load EEPROM Memory Page (page access)
Byte 1 Byte 2 Byte 3 Byte 4
Bit 15 B 0
Adr MSB Adr LSB
Page Offset
Page Number
Adrdr Mr MSSBA AAdrdr LS LSBSB
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27.9 Programming via the JTAG Interface
Programming through the JTAG interface requires control of the four JTAG specific pins: TCK,TMS, TDI, and TDO. Control of the reset and clock pins is not required.
To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The device isdefault shipped with the fuse programmed. In addition, the JTD bit in MCUCSR must be cleared.Alternatively, if the JTD bit is set, the external reset can be forced low. Then, the JTD bit will becleared after two chip clocks, and the JTAG pins are available for programming. This provides ameans of using the JTAG pins as normal port pins in Running mode while still allowing In-Sys-tem Programming via the JTAG interface. Note that this technique can not be used when usingthe JTAG pins for Boundary-scan or On-chip Debug. In these cases the JTAG pins must be ded-icated for this purpose.
During programming the clock frequency of the TCK Input must be less than the maximum fre-quency of the chip. The System Clock Prescaler can not be used to divide the TCK Clock Inputinto a sufficiently low frequency.
As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers.
27.9.1 Programming Specific JTAG Instructions
The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG instructionsuseful for programming are listed below.
The OPCODE for each instruction is shown behind the instruction name in hex format. The textdescribes which Data Register is selected as path between TDI and TDO for each instruction.
The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can also beused as an idle state between JTAG sequences. The state machine sequence for changing theinstruction word is shown in Figure 27-13 on page 317.
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Figure 27-13. State Machine Sequence for Changing the Instruction Word
27.9.2 AVR_RESET (0xC)
The AVR specific public JTAG instruction for setting the AVR device in the Reset mode or takingthe device out from the Reset mode. The TAP controller is not reset by this instruction. The onebit Reset Register is selected as Data Register. Note that the reset will be active as long as thereis a logic “one” in the Reset Chain. The output from this chain is not latched.
The active states are:
• Shift-DR: The Reset Register is shifted by the TCK input.
27.9.3 PROG_ENABLE (0x4)
The AVR specific public JTAG instruction for enabling programming via the JTAG port. The 16-bit Programming Enable Register is selected as Data Register. The active states are thefollowing:
• Shift-DR: The programming enable signature is shifted into the Data Register.
• Update-DR: The programming enable signature is compared to the correct value, and Programming mode is entered if the signature is valid.
Test-Logic-Reset
Run-Test/Idle
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Update-IR
Select-DR Scan
Capture-DR
0
1
0 1 1 1
0 0
0 0
1 1
1 0
1
1
0
1
0
0
1 0
1
1
0
1
0
0
00
11
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27.9.4 PROG_COMMANDS (0x5)
The AVR specific public JTAG instruction for entering programming commands via the JTAGport. The 15-bit Programming Command Register is selected as Data Register. The activestates are the following:
• Capture-DR: The result of the previous command is loaded into the Data Register.
• Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the previous command and shifting in the new command.
• Update-DR: The programming command is applied to the Flash inputs.
• Run-Test/Idle: One clock cycle is generated, executing the applied command (not always required, see Table 27-17 on page 321).
27.9.5 PROG_PAGELOAD (0x6)
The AVR specific public JTAG instruction to directly load the Flash data page via the JTAG port.An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBsof the Programming Command Register. The active states are the following:
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
• Update-DR: The content of the Flash Data Byte Register is copied into a temporary register. A write sequence is initiated that within 11 TCK cycles loads the content of the temporary register into the Flash page buffer. The AVR automatically alternates between writing the low and the high byte for each new Update-DR state, starting with the low byte for the first Update-DR encountered after entering the PROG_PAGELOAD command. The Program Counter is pre-incremented before writing the low byte, except for the first written byte. This ensures that the first data is written to the address set up by PROG_COMMANDS, and loading the last location in the page buffer does not make the program counter increment into the next page.
27.9.6 PROG_PAGEREAD (0x7)
The AVR specific public JTAG instruction to directly capture the Flash content via the JTAG port.An 8-bit Flash Data Byte Register is selected as the Data Register. This is physically the 8 LSBsof the Programming Command Register. The active states are the following:
• Capture-DR: The content of the selected Flash byte is captured into the Flash Data Byte Register. The AVR automatically alternates between reading the low and the high byte for each new Capture-DR state, starting with the low byte for the first Capture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter is post-incremented after reading each high byte, including the first read byte. This ensures that the first data is captured from the first address set up by PROG_COMMANDS, and reading the last location in the page makes the program counter increment into the next page.
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
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27.9.7 Data Registers
The Data Registers are selected by the JTAG instruction registers described in section ”Pro-gramming Specific JTAG Instructions” on page 316. The Data Registers relevant forprogramming operations are:
• Reset Register
• Programming Enable Register
• Programming Command Register
• Flash Data Byte Register
27.9.8 Reset Register
The Reset Register is a Test Data Register used to reset the part during programming. It isrequired to reset the part before entering Programming mode.
A high value in the Reset Register corresponds to pulling the external reset low. The part is resetas long as there is a high value present in the Reset Register. Depending on the Fuse settingsfor the clock options, the part will remain reset for a Reset Time-out period (refer to ”ClockSources” on page 31) after releasing the Reset Register. The output from this Data Register isnot latched, so the reset will take place immediately, as shown in Figure 25-2 on page 261.
27.9.9 Programming Enable Register
The Programming Enable Register is a 16-bit register. The contents of this register is comparedto the programming enable signature, binary code 0b1010_0011_0111_0000. When the con-tents of the register is equal to the programming enable signature, programming via the JTAGport is enabled. The register is reset to 0 on Power-on Reset, and should always be reset whenleaving Programming mode.
Figure 27-14. Programming Enable Register
27.9.10 Programming Command Register
The Programming Command Register is a 15-bit register. This register is used to serially shift inprogramming commands, and to serially shift out the result of the previous command, if any. TheJTAG Programming Instruction Set is shown in Table 27-17 on page 321. The state sequencewhen shifting in the programming commands is illustrated in Figure 27-16 on page 324.
TDI
TDO
DATA
= D Q
ClockDR & PROG_ENABLE
Programming Enable0xA370
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Figure 27-15. Programming Command RegisterTDI
TDO
STROBES
ADDRESS/DATA
FlashEEPROM
FusesLock Bits
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Table 27-17. JTAG Programming Instruction Seta = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes
1a. Chip Erase
0100011_10000000
0110001_10000000
0110011_10000000
0110011_10000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
1b. Poll for Chip Erase Complete 0110011_10000000 xxxxxox_xxxxxxxx (2)
2a. Enter Flash Write 0100011_00010000 xxxxxxx_xxxxxxxx
2b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (9)
2c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
2d. Load Data Low Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
2e. Load Data High Byte 0010111_iiiiiiii xxxxxxx_xxxxxxxx
2f. Latch Data
0110111_00000000
1110111_000000000110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
(1)
2g. Write Flash Page
0110111_000000000110101_00000000
0110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
2h. Poll for Page Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
3a. Enter Flash Read 0100011_00000010 xxxxxxx_xxxxxxxx
3b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (9)
3c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
3d. Read Data Low and High Byte
0110010_00000000
0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_ooooooooxxxxxxx_oooooooo
Low byte
High byte
4a. Enter EEPROM Write 0100011_00010001 xxxxxxx_xxxxxxxx
4b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (9)
4c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
4d. Load Data Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
4e. Latch Data
0110111_00000000
1110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
4f. Write EEPROM Page
0110011_00000000
0110001_000000000110011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
4g. Poll for Page Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
5a. Enter EEPROM Read 0100011_00000011 xxxxxxx_xxxxxxxx
5b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (9)
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5c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
5d. Read Data Byte
0110011_bbbbbbbb0110010_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
6a. Enter Fuse Write 0100011_01000000 xxxxxxx_xxxxxxxx
6b. Load Data Low Byte(6) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6c. Write Fuse Extended Byte
0111011_00000000
0111001_000000000111011_00000000
0111011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6d. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
6e. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6f. Write Fuse High Byte
0110111_00000000
0110101_000000000110111_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6g. Poll for Fuse Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
6h. Load Data Low Byte(7) 0010011_iiiiiiii xxxxxxx_xxxxxxxx (3)
6i. Write Fuse Low Byte
0110011_00000000
0110001_000000000110011_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
(1)
6j. Poll for Fuse Write Complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
7a. Enter Lock Bit Write 0100011_00100000 xxxxxxx_xxxxxxxx
7b. Load Data Byte(9) 0010011_11iiiiii xxxxxxx_xxxxxxxx (4)
7c. Write Lock Bits
0110011_00000000
0110001_00000000
0110011_000000000110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxx
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
(1)
7d. Poll for Lock Bit Write complete 0110011_00000000 xxxxxox_xxxxxxxx (2)
8a. Enter Fuse/Lock Bit Read 0100011_00000100 xxxxxxx_xxxxxxxx
8b. Read Extended Fuse Byte(6) 0111010_00000000
0111011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
8c. Read Fuse High Byte(7) 0111110_00000000
0111111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
8d. Read Fuse Low Byte(8) 0110010_000000000110011_00000000
xxxxxxx_xxxxxxxxxxxxxxx_oooooooo
8e. Read Lock Bits(9) 0110110_000000000110111_00000000
xxxxxxx_xxxxxxxxxxxxxxx_xxoooooo
(5)
Table 27-17. JTAG Programming Instruction Seta = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes
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ATmega169P
Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is normally the case).
2. Repeat until o = “1”.3. Set bits to “0” to program the corresponding Fuse, “1” to unprogramme the Fuse.4. Set bits to “0” to program the corresponding Lock bit, “1” to leave the Lock bit unchanged.5. “0” = programmed, “1” = unprogrammed.6. The bit mapping for Fuses Extended byte is listed in Table 27-3 on page 297.7. The bit mapping for Fuses High byte is listed in Table 27-4 on page 298.8. The bit mapping for Fuses Low byte is listed in Table 27-5 on page 298.9. The bit mapping for Lock bits byte is listed in Table 27-1 on page 296.10. Address bits exceeding PCMSB and EEAMSB (Table 27-7 on page 299 and Table 27-8 on page 299).11. All TDI and TDO sequences are represented by binary digits (0b...).
8f. Read Fuses and Lock Bits
0111010_00000000
0111110_000000000110010_00000000
0110110_00000000
0110111_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_ooooooooxxxxxxx_ooooooooxxxxxxx_ooooooooxxxxxxx_oooooooo
(5)
Fuse Ext. byteFuse High byte
Fuse Low byte
Lock bits
9a. Enter Signature Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
9b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
9c. Read Signature Byte0110010_00000000
0110011_00000000
xxxxxxx_xxxxxxxx
xxxxxxx_oooooooo
10a. Enter Calibration Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
10b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
10c. Read Calibration Byte0110110_000000000110111_00000000
xxxxxxx_xxxxxxxxxxxxxxx_oooooooo
11a. Load No Operation Command0100011_000000000110011_00000000
xxxxxxx_xxxxxxxxxxxxxxx_xxxxxxxx
Table 27-17. JTAG Programming Instruction Seta = address high bits, b = address low bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes
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Figure 27-16. State Machine Sequence for Changing/Reading the Data Word
27.9.11 Flash Data Byte Register
The Flash Data Byte Register provides an efficient way to load the entire Flash page bufferbefore executing Page Write, or to read out/verify the content of the Flash. A state machine setsup the control signals to the Flash and senses the strobe signals from the Flash, thus only thedata words need to be shifted in/out.
The Flash Data Byte Register actually consists of the 8-bit scan chain and a 8-bit temporary reg-ister. During page load, the Update-DR state copies the content of the scan chain over to thetemporary register and initiates a write sequence that within 11 TCK cycles loads the content ofthe temporary register into the Flash page buffer. The AVR automatically alternates betweenwriting the low and the high byte for each new Update-DR state, starting with the low byte for thefirst Update-DR encountered after entering the PROG_PAGELOAD command. The ProgramCounter is pre-incremented before writing the low byte, except for the first written byte. Thisensures that the first data is written to the address set up by PROG_COMMANDS, and loadingthe last location in the page buffer does not make the Program Counter increment into the nextpage.
During Page Read, the content of the selected Flash byte is captured into the Flash Data ByteRegister during the Capture-DR state. The AVR automatically alternates between reading thelow and the high byte for each new Capture-DR state, starting with the low byte for the first Cap-
Test-Logic-Reset
Run-Test/Idle
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Update-IR
Select-DR Scan
Capture-DR
0
1
0 1 1 1
0 0
0 0
1 1
1 0
1
1
0
1
0
0
1 0
1
1
0
1
0
0
00
11
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ture-DR encountered after entering the PROG_PAGEREAD command. The Program Counter ispost-incremented after reading each high byte, including the first read byte. This ensures thatthe first data is captured from the first address set up by PROG_COMMANDS, and reading thelast location in the page makes the program counter increment into the next page.
Figure 27-17. Flash Data Byte Register
The state machine controlling the Flash Data Byte Register is clocked by TCK. During normaloperation in which eight bits are shifted for each Flash byte, the clock cycles needed to navigatethrough the TAP controller automatically feeds the state machine for the Flash Data Byte Regis-ter with sufficient number of clock pulses to complete its operation transparently for the user.However, if too few bits are shifted between each Update-DR state during page load, the TAPcontroller should stay in the Run-Test/Idle state for some TCK cycles to ensure that there are atleast 11 TCK cycles between each Update-DR state.
27.9.12 Programming Algorithm
All references below of type “1a”, “1b”, and so on, refer to Table 27-17 on page 321.
27.9.13 Entering Programming Mode
1. Enter JTAG instruction AVR_RESET and shift 1 in the Reset Register.
2. Enter instruction PROG_ENABLE and shift 0b1010_0011_0111_0000 in the Program-ming Enable Register.
27.9.14 Leaving Programming Mode
1. Enter JTAG instruction PROG_COMMANDS.
2. Disable all programming instructions by using no operation instruction 11a.
3. Enter instruction PROG_ENABLE and shift 0b0000_0000_0000_0000 in the program-ming Enable Register.
4. Enter JTAG instruction AVR_RESET and shift 0 in the Reset Register.
TDI
TDO
DATA
FlashEEPROM
FusesLock Bits
STROBES
ADDRESS
StateMachine
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27.9.15 Performing Chip Erase
1. Enter JTAG instruction PROG_COMMANDS.
2. Start Chip Erase using programming instruction 1a.
3. Poll for Chip Erase complete using programming instruction 1b, or wait for tWLRH_CE (refer to Table 27-13 on page 309).
27.9.16 Programming the Flash
Before programming the Flash a Chip Erase must be performed, see “Performing Chip Erase”on page 326.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load address High byte using programming instruction 2b.
4. Load address Low byte using programming instruction 2c.
5. Load data using programming instructions 2d, 2e and 2f.
6. Repeat steps 4 and 5 for all instruction words in the page.
7. Write the page using programming instruction 2g.
8. Poll for Flash write complete using programming instruction 2h, or wait for tWLRH (refer to Table 27-13 on page 309).
9. Repeat steps 3 to 7 until all data have been programmed.
A more efficient data transfer can be achieved using the PROG_PAGELOAD instruction:
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load the page address using programming instructions 2b and 2c. PCWORD (refer to Table 27-7 on page 299) is used to address within one page and must be written as 0.
4. Enter JTAG instruction PROG_PAGELOAD.
5. Load the entire page by shifting in all instruction words in the page byte-by-byte, starting with the LSB of the first instruction in the page and ending with the MSB of the last instruction in the page. Use Update-DR to copy the contents of the Flash Data Byte Reg-ister into the Flash page location and to auto-increment the Program Counter before each new word.
6. Enter JTAG instruction PROG_COMMANDS.
7. Write the page using programming instruction 2g.
8. Poll for Flash write complete using programming instruction 2h, or wait for tWLRH (refer to Table 27-13 on page 309).
9. Repeat steps 3 to 8 until all data have been programmed.
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27.9.17 Reading the Flash
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash read using programming instruction 3a.
3. Load address using programming instructions 3b and 3c.
4. Read data using programming instruction 3d.
5. Repeat steps 3 and 4 until all data have been read.
A more efficient data transfer can be achieved using the PROG_PAGEREAD instruction:
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash read using programming instruction 3a.
3. Load the page address using programming instructions 3b and 3c. PCWORD (refer to Table 27-7 on page 299) is used to address within one page and must be written as 0.
4. Enter JTAG instruction PROG_PAGEREAD.
5. Read the entire page (or Flash) by shifting out all instruction words in the page (or Flash), starting with the LSB of the first instruction in the page (Flash) and ending with the MSB of the last instruction in the page (Flash). The Capture-DR state both captures the data from the Flash, and also auto-increments the program counter after each word is read. Note that Capture-DR comes before the shift-DR state. Hence, the first byte which is shifted out contains valid data.
6. Enter JTAG instruction PROG_COMMANDS.
7. Repeat steps 3 to 6 until all data have been read.
27.9.18 Programming the EEPROM
Before programming the EEPROM a Chip Erase must be performed, see “Performing ChipErase” on page 326.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable EEPROM write using programming instruction 4a.
3. Load address High byte using programming instruction 4b.
4. Load address Low byte using programming instruction 4c.
5. Load data using programming instructions 4d and 4e.
6. Repeat steps 4 and 5 for all data bytes in the page.
7. Write the data using programming instruction 4f.
8. Poll for EEPROM write complete using programming instruction 4g, or wait for tWLRH (refer to Table 27-13 on page 309).
9. Repeat steps 3 to 8 until all data have been programmed.
Note that the PROG_PAGELOAD instruction can not be used when programming the EEPROM.
27.9.19 Reading the EEPROM
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable EEPROM read using programming instruction 5a.
3. Load address using programming instructions 5b and 5c.
4. Read data using programming instruction 5d.
5. Repeat steps 3 and 4 until all data have been read.
Note that the PROG_PAGEREAD instruction can not be used when reading the EEPROM.
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27.9.20 Programming the Fuses
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Fuse write using programming instruction 6a.
3. Load data high byte using programming instructions 6b. A bit value of “0” will program the corresponding fuse, a “1” will unprogram the fuse.
4. Write Fuse High byte using programming instruction 6c.
5. Poll for Fuse write complete using programming instruction 6d, or wait for tWLRH (refer to Table 27-13 on page 309).
6. Load data low byte using programming instructions 6e. A “0” will program the fuse, a “1” will unprogram the fuse.
7. Write Fuse low byte using programming instruction 6f.
8. Poll for Fuse write complete using programming instruction 6g, or wait for tWLRH (refer to Table 27-13 on page 309).
27.9.21 Programming the Lock Bits
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Lock bit write using programming instruction 7a.
3. Load data using programming instructions 7b. A bit value of “0” will program the corre-sponding lock bit, a “1” will leave the lock bit unchanged.
4. Write Lock bits using programming instruction 7c.
5. Poll for Lock bit write complete using programming instruction 7d, or wait for tWLRH (refer to Table 27-13 on page 309).
27.9.22 Reading the Fuses and Lock Bits
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Fuse/Lock bit read using programming instruction 8a.
3. To read all Fuses and Lock bits, use programming instruction 8e.To only read Fuse High byte, use programming instruction 8b.To only read Fuse Low byte, use programming instruction 8c.To only read Lock bits, use programming instruction 8d.
27.9.23 Reading the Signature Bytes
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Signature byte read using programming instruction 9a.
3. Load address 0x00 using programming instruction 9b.
4. Read first signature byte using programming instruction 9c.
5. Repeat steps 3 and 4 with address 0x01 and address 0x02 to read the second and third signature bytes, respectively.
27.9.24 Reading the Calibration Byte
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Calibration byte read using programming instruction 10a.
3. Load address 0x00 using programming instruction 10b.
4. Read the calibration byte using programming instruction 10c.
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28. Electrical Characteristics
28.1 Absolute Maximum Ratings*
28.2 DC Characteristics
Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam-age to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Storage Temperature ..................................... -65°C to +150°C
Voltage on any Pin except RESETwith respect to Ground ................................-0.5V to VCC+0.5V
Voltage on RESET with respect to Ground......-0.5V to +13.0V
Maximum Operating Voltage ............................................ 6.0V
DC Current per I/O Pin ............................................... 40.0 mA
DC Current VCC and GND Pins................................ 400.0 mA
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted)
Symbol Parameter Condition Min. Typ. Max. Units
VILInput Low Voltage except XTAL1 and RESET pins
VCC = 1.8V - 2.4VVCC = 2.4V - 5.5V
-0.5-0.5
0.2VCC(1)
0.3VCC(1)
V
VIHInput High Voltage except XTAL1 and RESET pins
VCC = 1.8V - 2.4VVCC = 2.4V - 5.5V
0.7VCC(2)
0.6VCC(2)
VCC + 0.5VCC + 0.5
VIL1Input Low Voltage XTAL1 pins
VCC = 1.8V - 5.5V -0.5 0.1VCC(1)
VIH1Input High Voltage, XTAL1 pin
VCC = 1.8V - 2.4VVCC = 2.4V - 5.5V
0.8VCC(2)
0.7VCC(2)
VCC + 0.5VCC + 0.5
VIL2Input Low Voltage, RESET pins
VCC = 1.8V - 5.5V -0.5 0.1VCC(1)
VIH2Input High Voltage, RESET pins
VCC = 1.8V - 5.5V 0.9VCC(2) VCC + 0.5
VOLOutput Low Voltage(3), Port A, C, D, E, F, G
IOL = 10 mA, VCC = 5VIOL = 5 mA, VCC = 3V
0.70.5
VOL1Output Low Voltage(3), Port B
IOL = 20 mA, VCC = 5VIOL = 10 mA, VCC = 3V
0.70.5
VOHOutput High Voltage(4), Port A, C, D, E, F, G
IOH = -10 mA, VCC = 5VIOH = -5 mA, VCC = 3V
4.22.3
VOH1Output High Voltage(4), Port B
IOH = -20 mA, VCC = 5VIOH = -10 mA, VCC = 3V
4.22.3
IILInput LeakageCurrent I/O Pin
VCC = 5.5V, pin low(absolute value)
1
µA
IIHInput LeakageCurrent I/O Pin
VCC = 5.5V, pin high(absolute value)
1
RRST Reset Pull-up Resistor 30 60kΩ
RPU I/O Pin Pull-up Resistor 20 50
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Note: 1. “Max” means the highest value where the pin is guaranteed to be read as low.
2. “Min” means the lowest value where the pin is guaranteed to be read as high.3. Although each I/O port can sink more than the test conditions (20 mA at VCC = 5V, 10 mA at VCC = 3V for Port B and 10 mA
at VCC = 5V, 5 mA at VCC = 3V for all other ports) under steady state conditions (non-transient), the following must be observed:TQFP and QFN/MLF Package:1] The sum of all IOL, for all ports, should not exceed 400 mA.2] The sum of all IOL, for ports A0 - A7, C4 - C7, G2 should not exceed 100 mA.3] The sum of all IOL, for ports B0 - B7, E0 - E7, G3 - G5 should not exceed 100 mA.4] The sum of all IOL, for ports D0 - D7, C0 - C3, G0 - G1 should not exceed 100 mA.5] The sum of all IOL, for ports F0 - F7, should not exceed 100 mA.If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition.
4. Although each I/O port can source more than the test conditions (20 mA at VCC = 5V, 10 mA at VCC = 3V for Port B and 10 mA at VCC = 5V, 5 mA at VCC = 3V for all other ports) under steady state conditions (non-transient), the following must be observed:TQFP and QFN/MLF Package:1] The sum of all IOH, for all ports, should not exceed 400 mA.2] The sum of all IOH, for ports A0 - A7, C4 - C7, G2 should not exceed 100 mA.3] The sum of all IOH, for ports B0 - B7, E0 - E7, G3 - G5 should not exceed 100 mA.4] The sum of all IOH, for ports D0 - D7, C0 - C3, G0 - G1 should not exceed 100 mA.5] The sum of all IOH, for ports F0 - F7, should not exceed 100 mA.If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition.
5. All bits set in the ”Power Reduction Register” on page 42.6. Typical values at 25°C. Maximum values are characterized values and not test limits in production.
ICC
Power Supply Current(5)
Active 1 MHz, VCC = 2V 0.35 0.44
mA
Active 4 MHz, VCC = 3V 2.3 2.5
Active 8 MHz, VCC = 5V 8.4 9.5
Idle 1 MHz, VCC = 2V 0.1 0.2
Idle 4 MHz, VCC = 3V 0,7 0.8
Idle 8 MHz, VCC = 5V 3.0 3.3
Power-save mode(6)
32 kHz TOSC enabled,
VCC = 1.8V0.55 1.6
µA32 kHz TOSC enabled,
VCC = 3V0.8 2.6
Power-down mode(6)WDT enabled, VCC = 3V 6 10
WDT disabled, VCC = 3V 0.2 2
VACIOAnalog Comparator Input Offset Voltage
VCC = 5V
Vin = VCC/2<10 40 mV
IACLKAnalog Comparator Input Leakage Current
VCC = 5VVin = VCC/2
-50 50 nA
tACPDAnalog Comparator Propagation Delay
VCC = 2.7VVCC = 4.0V
750500
ns
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted) (Continued)
Symbol Parameter Condition Min. Typ. Max. Units
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ATmega169P
28.3 Speed Grades
Maximum frequency is depending on VCC. As shown in Figure 28-1 and Figure 28-2 on page332, the Maximum Frequency vs. VCC curve is linear between 1.8V < VCC < 4.5V. To calculatethe maximum frequency at a given voltage in this interval, use this equation:
To calculate required voltage for a given frequency, use this equation::
At 3 Volt, this gives:
Thus, when VCC = 3V, maximum frequency will be 9.33 MHz.
At 6 MHz this gives:
Thus, a maximum frequency of 6 MHz requires VCC = 2.25V.
Figure 28-1. Maximum Frequency vs. VCC, ATmega169PV
Table 28-1. Constants used to calculate maximum speed vs. VCC
Voltage and Frequency range a b Vx Fy
2.7 < VCC < 4.5 or 8 < Frq < 168/1.8 1.8/8
2.7 8
1.8 < VCC < 2.7 or 4 < Frq < 8 1.8 4
Frequency a V Vx–( )• Fy+=
Voltage b F Fy–( )• Vx+=
Frequency 81.8-------- 3 2.7–( )• 8+ 9.33= =
Voltage 1.88
-------- 6 4–( )• 1.8+ 2.25= =
8 MHz
4 MHz
1.8V 2.7V 5.5V
Safe Operating Area
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Figure 28-2. Maximum Frequency vs. VCC, ATmega169P
28.4 Clock Characteristics
28.4.1 Calibrated Internal RC Oscillator Accuracy
Notes: 1. Voltage range for ATmega169PV.2. Voltage range for ATmega169P.
28.4.2 External Clock Drive Waveforms
Figure 28-3. External Clock Drive Waveforms
16 MHz
8 MHz
2.7V 4.5V 5.5V
Safe Operating Area
Table 28-2. Calibration Accuracy of Internal RC Oscillator
Frequency VCC Temperature Calibration Accuracy
Factory Calibration 8.0 MHz 3V 25°C ±10%
User Calibration7.3 MHz - 8.1 MHz
1.8V - 5.5V(1)
2.7V - 5.5V(2) -40°C - 85°C ±1%
VIL1
VIH1
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ATmega169P
28.4.3 External Clock Drive
28.5 System and Reset Characteristics
Note: 1. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling)
Table 28-3. External Clock Drive
Symbol Parameter
VCC = 1.8V - 5.5V VCC = 2.7V - 5.5V VCC = 4.5V - 5.5V
UnitsMin. Max. Min. Max. Min. Max.
1/tCLCLOscillator Frequency
0 1 0 8 0 16 MHz
tCLCL Clock Period 1000 125 62.5
nstCHCX High Time 400 50 25
tCLCX Low Time 400 50 25
tCLCH Rise Time 2.0 1.6 0.5μs
tCHCL Fall Time 2.0 1.6 0.5
ΔtCLCL
Change in period from one clock cycle to the next
2 2 2 %
Table 28-4. Reset, Brown-out,and Internal Voltage Characteristics
Symbol Parameter Condition Min Typ Max Units
VPOT
Power-on Reset Threshold Voltage (rising)
TA = -40°C to 85°C
0.7 1.0 1.4
VPower-on Reset Threshold Voltage (falling)(1)
TA = -40°C to 85°C
0.05 0.9 1.3
VPSR Power-on Reset Slope Rate 0.1 4.5 V/ms
VRST RESET Pin Threshold Voltage VCC = 3V 0.2VCC 0.9VCC V
tRSTMinimum pulse width on RESET Pin
VCC = 3V 2.5 µs
VHYST Brown-out Detector Hysteresis 50 mV
tBODMin Pulse Width on Brown-out Reset
2 µs
VBG Bandgap reference voltageVCC = 2.7V, TA = 25°C
1.0 1.1 1.2 V
tBG Bandgap reference start-up timeVCC = 2.7V, TA = 25°C
40 70 µs
IBGBandgap reference current consumption
VCC = 2.7V, TA = 25°C
15 µA
3338018P–AVR–08/10
ATmega169P
Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guar-antees that a Brown-Out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. The test is performed using BODLEVEL = 110 for ATmega169V.
28.6 SPI Timing Characteristics
See Figure 28-4 on page 335 and Figure 28-5 on page 335 for details.
Table 28-5. BODLEVEL Fuse Coding(1)
BODLEVEL 2..0 Fuses Min VBOT Typ VBOT Max VBOT Units
111 BOD Disabled
110 1.7 1.8 2.0
V101 2.5 2.7 2.9
100 4.1 4.3 4.5
011
Reserved010
001
000
Table 28-6. SPI Timing Parameters
Description Mode Min Typ Max
1 SCK period MasterSee Table 18-5 on
page 166
ns
2 SCK high/low Master 50% duty cycle
3 Rise/Fall time Master 3.6
4 Setup Master 10
5 Hold Master 10
6 Out to SCK Master 0.5 • tsck
7 SCK to out Master 10
8 SCK to out high Master 10
9 SS low to out Slave 15
10 SCK period Slave 4 • tck
11 SCK high/low(1) Slave 2 • tck
12 Rise/Fall time Slave 1.6 µs
13 Setup Slave 10
ns
14 Hold Slave tck
15 SCK to out Slave 15
16 SCK to SS high Slave 20
17 SS high to tri-state Slave 10
18 SS low to SCK Slave 20 • tck
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Note: 1. In SPI Programming mode the minimum SCK high/low period is:- 2 tCLCL for fCK < 12 MHz- 3 tCLCL for fCK > 12 MHz
Figure 28-4. SPI Interface Timing Requirements (Master Mode)
Figure 28-5. SPI Interface Timing Requirements (Slave Mode)
MOSI(Data Output)
SCK(CPOL = 1)
MISO(Data Input)
SCK(CPOL = 0)
SS
MSB LSB
LSBMSB
...
...
6 1
2 2
34 5
87
MISO(Data Output)
SCK(CPOL = 1)
MOSI(Data Input)
SCK(CPOL = 0)
SS
MSB LSB
LSBMSB
...
...
10
11 11
1213 14
1715
9
X
16
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ATmega169P
28.7 ADC Characteristics – Preliminary Data
Table 28-7. ADC Characteristics
Symbol Parameter Condition Min Typ Max Units
ResolutionSingle Ended Conversion 10
BitsDifferential Conversion 8
Absolute accuracy
(Including INL, DNL,
quantization error, gain andoffset error)
Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHz
2 2.5
LSB
Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 1 MHz
4.5
Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHzNoise Reduction Mode
2
Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 1 MHzNoise Reduction Mode
4.5
Integral Non-Linearity (INL)Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHz
0.5
Differential Non-Linearity (DNL)Single Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHz
0.25
Gain ErrorSingle Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHz
2
Offset ErrorSingle Ended ConversionVREF = 4V, VCC = 4V,ADC clock = 200 kHz
2
Conversion Time Free Running Conversion 13 260 µs
Clock Frequency Single Ended Conversion 50 1000 kHz
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3
V
VREF Reference VoltageSingle Ended Conversion 1.0 AVCC
Differential Conversion 1.0 AVCC - 0.5
VIN
Pin Input VoltageSingle Ended Channels GND VREF
Differential Channels GND AVCC
Input RangeSingle Ended Channels GND VREF
Differential Channels(1) -0.85VREF VREF
Input BandwidthSingle Ended Channels 38.5
kHzDifferential Channels 4
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Note: 1. Voltage difference between channels.
28.8 LCD Controller Characteristics
VINT Internal Voltage Reference 1.0 1.1 1.2 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
Table 28-7. ADC Characteristics
Symbol Parameter Condition Min Typ Max Units
Table 28-8. LCD Controller Characteristics
Symbol Parameter Condition Min Typ Max Units
ILCD LCD Driver Current Total for All COM and SEG pins 6 µA
RSEG SEG Driver Output Impedance 10kΩ
RCOM COM Driver Output Impedance 2
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29. Typical Characteristics
The following charts show typical behavior. These figures are not tested during manufacturing.All current consumption measurements are performed with all I/O pins configured as inputs andwith internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clocksource.
All Active- and Idle current consumption measurements are done with all bits in the PRR registerset and thus, the corresponding I/O modules are turned off. Also the Analog Comparator is dis-abled during these measurements. Table 29-1 on page 343 and Table 29-2 on page 343 showthe additional current consumption compared to ICC Active and ICC Idle for every I/O module con-trolled by the Power Reduction Register. See ”Power Reduction Register” on page 42 for details.
The power consumption in Power-down mode is independent of clock selection.
The current consumption is a function of several factors such as: operating voltage, operatingfrequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient tempera-ture. The dominating factors are operating voltage and frequency.
The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f whereCL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin.
The parts are characterized at frequencies higher than test limits. Parts are not guaranteed tofunction properly at frequencies higher than the ordering code indicates.
The difference between current consumption in Power-down mode with Watchdog Timerenabled and Power-down mode with Watchdog Timer disabled represents the differential cur-rent drawn by the Watchdog Timer.
29.1 Active Supply Current
Figure 29-1. Active Supply Current vs. Frequency (0.1 MHz - 1.0 MHz)
5.5V
5.0V
4.5V
4.0V
3.3V
2.7V
1.8V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
I CC (
mA
)
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ATmega169P
Figure 29-2. Active Supply Current vs. Frequency (1 MHz - 20 MHz)
Figure 29-3. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz
1 MHz - 20 MHz
5.5V
5.0V
4.5V
0
5
10
15
20
25
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
I CC (
mA
)
4.0V
3.3V
2.7V
1.8V
85°C25°C
-40°C
0
1
2
3
4
5
6
7
8
9
10
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
mA
)
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ATmega169P
Figure 29-4. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
Figure 29-5. Active Supply Current vs. VCC (32 kHz Watch Crystal)
85°C25°C
-40°C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
mA
)
25°C
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
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ATmega169P
29.2 Idle Supply Current
Figure 29-6. Idle Supply Current vs. Frequency (0.1 MHz - 1.0 MHz)
Figure 29-7. Idle Supply Current vs. Frequency (1 MHz - 20 MHz)
0.1 MHz - 1.0 MHz
5.5V
5.0V
4.5V
4.0V
3.3V
2.7V
1.8V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
I CC (
mA
)
1 MHz - 20 MHz
5.5V
5.0V
4.5V
0
1
2
3
4
5
6
7
8
9
10
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
I CC (
mA
)
4.0V
3.3V
2.7V
1.8V
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ATmega169P
Figure 29-8. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
Figure 29-9. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
85°C25°C
-40°C
0
0.5
1
1.5
2
2.5
3
3.5
4
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
mA
)
85°C25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
mA
)
3428018P–AVR–08/10
ATmega169P
Figure 29-10. Idle Supply Current vs. VCC (32 kHz Watch Crystal)
29.3 Supply Current of I/O modules
The tables and formulas below can be used to calculate the additional current consumption forthe different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modulesare controlled by the Power Reduction Register. See ”Power Reduction Register” on page 42 fordetails.
25°C
0
2
4
6
8
10
12
14
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
Table 29-1. Additional Current Consumption for the different I/O modules (absolute values)
PRR bit Typical numbers
VCC = 2V, F = 1 MHz VCC = 3V, F = 4 MHz VCC = 5V, F = 8 MHz
PRADC 18 µA 116 µA 495 µA
PRUSART0 11 µA 79 µA 313 µA
PRSPI 10 µA 72 µA 283 µA
PRTIM1 19 µA 117 µA 481 µA
PRLCD 4 µA 32 µA 105 µA
Table 29-2. Additional Current Consumption (percentage) in Active and Idle mode
PRR bit
Additional Current consumption compared to Active with external clock (see Figure 29-1 on page 338 and Figure 29-2 on page 339)
Additional Current consumption compared to Idle with external clock (see Figure 29-6 on page 341 and Figure 29-7 on page 341)
PRADC 5.6% 18.7%
PRUSART0 3.7% 12.4%
3438018P–AVR–08/10
ATmega169P
It is possible to calculate the typical current consumption based on the numbers from Table 29-2on page 343 for other VCC and frequency settings than listed in Table 29-1 on page 343.
29.3.0.1 Example 1
Calculate the expected current consumption in idle mode with USART0, TIMER1, and SPIenabled at VCC = 3.0V and F = 1 MHz. From Table 29-2 on page 343, second column, we seethat we need to add 12.4% for the USART0, 10.8% for the SPI, and 18.6% for the TIMER1 mod-ule. Reading from Figure 29-6 on page 341, we find that the idle current consumption is ~0.18mA at VCC = 3.0V and F = 1 MHz. The total current consumption in idle mode with USART0,TIMER1, and SPI enabled, gives:
29.4 Power-down Supply Current
Figure 29-11. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)
PRSPI 3.2% 10.8%
PRTIM1 5.6% 18.6%
PRLCD 12.5% 41.7%
Table 29-2. Additional Current Consumption (percentage) in Active and Idle mode
PRR bit
Additional Current consumption compared to Active with external clock (see Figure 29-1 on page 338 and Figure 29-2 on page 339)
Additional Current consumption compared to Idle with external clock (see Figure 29-6 on page 341 and Figure 29-7 on page 341)
ICCtotal 0.18mA 1 0.124 0.108 0.186+ + +( )• 0.26mA≈ ≈
85°C
-40°C
25°C
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VCC (V)
I CC
(µ
A)
3448018P–AVR–08/10
ATmega169P
Figure 29-12. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)
29.5 Power-save Supply Current
Figure 29-13. Power-save Supply Current vs. VCC (Watchdog Timer Disabled)
The differential current consumption between Power-save with WD disabled and 32 kHz TOSCrepresents the current drawn by Timer/Counter2.
WATCHDOG TIMER ENABLED
0
2
4
6
8
10
12
14
16
18
20
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
85°C
25°C-40°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VCC (V)
I CC (
µA)
85°C
25°C-40°C
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29.6 Standby Supply Current
Figure 29-14. Standby Supply Current vs. VCC (32 kHz Watch Crystal, Watchdog Timer Disabled)
Figure 29-15. Standby Supply Current vs. VCC (455 kHz Resonator, Watchdog Timer Disabled)
85°C
25°C
-40°C
0.00
0.50
1.00
1.50
2.00
2.50
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VCC (V)
I CC
(µ
A)
0
10
20
30
40
50
60
70
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
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Figure 29-16. Standby Supply Current vs. VCC (1 MHz Resonator, Watchdog Timer Disabled)
Figure 29-17. Standby Supply Current vs. VCC (2 MHz Resonator, Watchdog Timer Disabled)
0
10
20
30
40
50
60
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
0
10
20
30
40
50
60
70
80
90
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
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Figure 29-18. Standby Supply Current vs. VCC (2 MHz Xtal, Watchdog Timer Disabled)
Figure 29-19. Standby Supply Current vs. VCC (4 MHz Resonator, Watchdog Timer Disabled)
0
10
20
30
40
50
60
70
80
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
0
20
40
60
80
100
120
140
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
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Figure 29-20. Standby Supply Current vs. VCC (4 MHz Xtal, Watchdog Timer Disabled)
Figure 29-21. Standby Supply Current vs. VCC (6 MHz Resonator, Watchdog Timer Disabled)
0
20
40
60
80
100
120
140
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
0
20
40
60
80
100
120
140
160
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
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Figure 29-22. Standby Supply Current vs. VCC (6 MHz Xtal, Watchdog Timer Disabled)
29.7 Pin Pull-up
Figure 29-23. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)
0
20
40
60
80
100
120
140
160
180
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGEVcc = 5V
0
20
40
60
80
100
120
140
160
0 1 2 3 4 5
VIO (V)
I IO (
µA
)
85°C25°C
-40°C
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ATmega169P
Figure 29-24. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V)
Figure 29-25. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8V)
0
10
20
30
40
50
60
70
80
90
0 0.5 1 1.5 2 2.5 3
VIO (V)
I IO (
µA)
85°C 25°C
-40°C
0
10
20
30
40
50
60
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2VOP (V)
I OP
85°C 25°C
-40°C
(µ
A)
3518018P–AVR–08/10
ATmega169P
Figure 29-26. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)
Figure 29-27. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)
Vcc = 5V
0
20
40
60
80
100
120
0 1 2 3 4 5
VRESET (V)
I RE
SE
T (
µA
)
-40°C25°C
85°C
0
10
20
30
40
50
60
70
0 0.5 1 1.5 2 2.5 3
VRESET (V)
I RE
SE
T (
µA
)
-40°C 25°C
85°C
3528018P–AVR–08/10
ATmega169P
Figure 29-28. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8V)
29.8 Pin Driver Strength
Figure 29-29. I/O Pin Source Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 5V)
0
5
10
15
20
25
30
35
40
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VRESET (V)
I RE
SE
T (
µA
)
-40°C
25°C
85°C
0
10
20
30
40
50
60
70
0 1 2 3 4 5 6
VOH (V)
I OH (
mA
)
85°C25°C
-40°C
3538018P–AVR–08/10
ATmega169P
Figure 29-30. I/O Pin Source Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 2.7V)
Figure 29-31. I/O Pin Source Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 1.8V)
Vcc = 2.7V
0
5
10
15
20
25
0 0.5 1 1.5 2 2.5 3
VOH (V)
I OH (
mA
)
85°C25°C
-40°C
Vcc = 1.8V
0
1
2
3
4
5
6
7
8
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOH (V)
I OH (
mA
)
85°C
25°C-40°C
3548018P–AVR–08/10
ATmega169P
Figure 29-32. I/O Pin Source Current vs. Output Voltage, Port B (VCC= 5V)
Figure 29-33. I/O Pin Source Current vs. Output Voltage, Port B (VCC = 2.7V)
0
10
20
30
40
50
60
70
80
0 1 2 3 4
VOH (V)
I OH (
mA
)
85°C
25°C
-40°C
Vcc = 2.7V
0
5
10
15
20
25
30
35
0 0.5 1 1.5 2 2.5 3
VOH (V)
I OH (
mA
)
85°C25°C
-40°C
3558018P–AVR–08/10
ATmega169P
Figure 29-34. I/O Pin Source Current vs. Output Voltage, Port B (VCC = 1.8V)
Figure 29-35. I/O Pin Sink Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 5V)
Vcc = 1.8V
0
1
2
3
4
5
6
7
8
9
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOH (V)
I OH (
mA
)
85°C25°C
-40°C
0
5
10
15
20
25
30
35
40
45
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
)
85°C
25°C
-40°C
3568018P–AVR–08/10
ATmega169P
Figure 29-36. I/O Pin Sink Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 2.7V)
Figure 29-37. I/O Pin Sink Current vs. Output Voltage, Ports A, C, D, E, F, G (VCC = 1.8V)
0
2
4
6
8
10
12
14
16
18
20
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
)
85°C
25°C
-40°C
0
1
2
3
4
5
6
7
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
)
85°C
25°C
-40°C
3578018P–AVR–08/10
ATmega169P
Figure 29-38. I/O Pin Sink Current vs. Output Voltage, Port B (VCC = 5V)
Figure 29-39. I/O Pin Sink Current vs. Output Voltage, Port B (VCC = 2.7V)
0
10
20
30
40
50
60
70
80
90
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
) 85°C
25°C
-40°C
0
5
10
15
20
25
30
35
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
)
85°C
25°C
-40°C
3588018P–AVR–08/10
ATmega169P
Figure 29-40. I/O Pin Sink Current vs. Output Voltage, Port B (VCC = 1.8V)
29.9 Pin Thresholds and Hysteresis
Figure 29-41. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”)
0
2
4
6
8
10
12
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
VOL (V)
I OL (
mA
)85°C
25°C
-40°C
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Thr
esho
ld (
V)
85°C25°C
-40°C
3598018P–AVR–08/10
ATmega169P
Figure 29-42. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”)
Figure 29-43. I/O Pin Input Hysteresis vs. VCC
VIL, I/O PIN READ AS '0'
0
0.5
1
1.5
2
2.5
3
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Th
resh
old
(V
)
85°C25°C
-40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Inpu
t hys
tere
sis
(V
)
85°C
25°C
-40°C
3608018P–AVR–08/10
ATmega169P
Figure 29-44. Reset Input Threshold Voltage vs. VCC (VIH,Reset Pin Read as “1”)
Figure 29-45. Reset Input Threshold Voltage vs. VCC (VIL,Reset Pin Read as “0”)
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Thr
esho
ld (
V)
85°C25°C-40°C
RESET INPUT THRESHOLD VOLTAGE vs. VCC
VIL, RESET PIN READ AS '0'
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Th
resh
old
(V
)
85°C25°C
-40°C
0
0.5
1
1.5
2
2.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Thr
esho
ld (
V)
85°C25°C-40°C
3618018P–AVR–08/10
ATmega169P
Figure 29-46. Reset Input Pin Hysteresis vs. VCC
29.10 BOD Thresholds and Analog Comparator Offset
Figure 29-47. BOD Thresholds vs. Temperature (BOD Level is 4.3V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Inp
ut
hys
tere
sis
(V
)
85°C
25°C
-40°C
4
4.1
4.2
4.3
4.4
4.5
4.6
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (°C)
Th
resh
old
(V)
Rising VCC
Falling VCC
3628018P–AVR–08/10
ATmega169P
Figure 29-48. BOD Thresholds vs. Temperature (BOD Level is 2.7V)
Figure 29-49. BOD Thresholds vs. Temperature (BOD Level is 1.8V)
BODLEVEL IS 2.7V
2.4
2.5
2.6
2.7
2.8
2.9
3
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (°C)
Th
resh
old
(V)
Rising VCC
Falling VCC
BODLEVEL IS 1.8V
1.5
1.6
1.7
1.8
1.9
2
2.1
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (°C)
Th
resh
old
(V)
Rising VCC
Falling VCC
3638018P–AVR–08/10
ATmega169P
Figure 29-50. Bandgap Voltage vs. VCC
Figure 29-51. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 5V)
CC
1.08
1.09
1.1
1.11
1.12
1.13
1.14
1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Ban
dgap
Vol
tage
(V
)
85°C25°C
-40°C
CC
-0.004
-0.002
0
0.002
0.004
0.006
0.008
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Common Mode Voltage (V)
Com
para
tor O
ffset
Vol
tage
(V
)
85°C25°C
-40°C
3648018P–AVR–08/10
ATmega169P
Figure 29-52. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC = 2.7V)
29.11 Internal Oscillator Speed
Figure 29-53. Oscillator Current vs. VCC (32 kHz Watch Crystal)
CC
-0.004
-0.003
-0.002
-0.001
0
0.001
0.002
0.003
0 0.5 1 1.5 2 2.5 3
Common Mode Voltage (V)
Com
para
tor
Offs
et V
olta
ge (
V)
85°C
25°C
-40°C
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VCC (V)
I CC
(µ
A)
85°C
25°C
-40°C
3658018P–AVR–08/10
ATmega169P
Figure 29-54. Watchdog Oscillator Frequency vs. VCC
Figure 29-55. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature
800
850
900
950
1000
1050
1100
1150
1200
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FR
C (
kHz)
85°C25°C
-40°C
CALIBRATED 8MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE
7.2
7.4
7.6
7.8
8
8.2
8.4
8.6
8.8
-60 -40 -20 0 20 40 60 80 100
Ta (°C)
FR
C (
MH
z)
5.5V4.0V2.7V1.8V
3668018P–AVR–08/10
ATmega169P
Figure 29-56. Calibrated 8 MHz RC Oscillator Frequency vs. VCC
Figure 29-57. Calibrated 8 MHz RC Oscillator Frequency vs. Osccal Value
6
6.5
7
7.5
8
8.5
9
9.5
10
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
FR
C (
MH
z)85°C
25°C
-40°C
CALIBRATED 8 MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE
85°C25°C
-40°C
4
6
8
10
12
14
16
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
OSCCAL VALUE
FR
C (
MH
z)
3678018P–AVR–08/10
ATmega169P
29.12 Current Consumption of Peripheral Units
Figure 29-58. Brownout Detector Current vs. VCC
Figure 29-59. ADC Current vs. VCC (AREF = AVCC)
0
5
10
15
20
25
30
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA)
25°C85°C-40°C
CC
0
50
100
150
200
250
300
350
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
85°C25°C
-40°C
3688018P–AVR–08/10
ATmega169P
Figure 29-60. AREF External Reference Current vs. VCC
The differential current consumption between Power-save with WD disabled and 32 kHz TOSCrepresents the current drawn by Timer/Counter2.
Figure 29-61. Watchdog Timer Current vs. VCC
CC
0
20
40
60
80
100
120
140
160
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I AR
EF (
µA
)
85°C25°C
-40°C
0
2
4
6
8
10
12
14
16
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
µA
)
85°C25°C
-40°C
3698018P–AVR–08/10
ATmega169P
Figure 29-62. Analog Comparator Current vs. VCC
Figure 29-63. Programming Current vs. VCC
0
20
40
60
80
100
120
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC
(µ
A)
85°C25°C
-40°C
0
5
10
15
20
25
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
I CC (
mA
)
85°C
25°C
-40°C
3708018P–AVR–08/10
ATmega169P
29.13 Current Consumption in Reset and Reset Pulsewidth
Figure 29-64. Reset Supply Current vs. VCC (0.1 MHz - 1.0 MHz, Excluding Current Through The Reset Pull-up)
Figure 29-65. Reset Supply Current vs. VCC (1 MHz - 20 MHz, Excluding Current Through The Reset Pull-up)
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
I CC
(m
A)
5.5V
4.5V
4.0V
3.3V
2.7V
1.8V
5.0V
0
0.5
1
1.5
2
2.5
3
3.5
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
I CC
(m
A)
5.5V
4.5V
4.0V
3.3V
2.7V1.8V
5.0V
3718018P–AVR–08/10
ATmega169P
Figure 29-66. Minimum Reset Pulse Width vs. VCC
0
500
1000
1500
2000
2500
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Pu
lse
wid
th (
ns)
85°C25°C
-40°C
3728018P–AVR–08/10
ATmega169P
30. Register Summary
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0xFF) Reserved – – – – – – – –
(0xFE) LCDDR18 – – – – – – – SEG324 251
(0xFD) LCDDR17 SEG323 SEG322 SEG321 SEG320 SEG319 SEG318 SEG317 SEG316 251
(0xFC) LCDDR16 SEG315 SEG314 SEG313 SEG312 SEG311 SEG310 SEG309 SEG308 251
(0xFB) LCDDR15 SEG307 SEG306 SEG305 SEG304 SEG303 SEG302 SEG301 SEG300 251
(0xFA) Reserved – – – – – – – –
(0xF9) LCDDR13 – – – – – – – SEG224 251
(0xF8) LCDDR12 SEG223 SEG222 SEG221 SEG220 SEG219 SEG218 SEG217 SEG216 251
(0xF7) LCDDR11 SEG215 SEG214 SEG213 SEG212 SEG211 SEG210 SEG209 SEG208 251
(0xF6) LCDDR10 SEG207 SEG206 SEG205 SEG204 SEG203 SEG202 SEG201 SEG200 251
(0xF5) Reserved – – – – – – – –
(0xF4) LCDDR8 – – – – – – – SEG124 251
(0xF3) LCDDR7 SEG123 SEG122 SEG121 SEG120 SEG119 SEG118 SEG117 SEG116 251
(0xF2) LCDDR6 SEG115 SEG114 SEG113 SEG112 SEG111 SEG110 SEG109 SEG108 251
(0xF1) LCDDR5 SEG107 SEG106 SEG105 SEG104 SEG103 SEG102 SEG101 SEG100 251
(0xF0) Reserved – – – – – – – –
(0xEF) LCDDR3 – – – – – – – SEG024 251
(0xEE) LCDDR2 SEG023 SEG022 SEG021 SEG020 SEG019 SEG018 SEG017 SEG016 251
(0xED) LCDDR1 SEG015 SEG014 SEG013 SEG012 SEG011 SEG010 SEG09 SEG008 251
(0xEC) LCDDR0 SEG007 SEG006 SEG005 SEG004 SEG003 SEG002 SEG001 SEG000 251
(0xEB) Reserved – – – – – – – –
(0xEA) Reserved – – – – – – – –
(0xE9) Reserved – – – – – – – –
(0xE8) Reserved – – – – – – – –
(0xE7) LCDCCR LCDDC2 LCDDC1 LCDDC0 LCDMDT LCDCC3 LCDCC2 LCDCC1 LCDCC0 250
(0xE6) LCDFRR – LCDPS2 LCDPS1 LCDPS0 – LCDCD2 LCDCD1 LCDCD0 248
(0xE5) LCDCRB LCDCS LCD2B LCDMUX1 LCDMUX0 – LCDPM2 LCDPM1 LCDPM0 247
(0xE4) LCDCRA LCDEN LCDAB – LCDIF LCDIE LCDBD LCDCCD LCDBL 246
(0xE3) Reserved – – – – – – – –
(0xE2) Reserved – – – – – – – –
(0xE1) Reserved – – – – – – – –
(0xE0) Reserved – – – – – – – –
(0xDF) Reserved – – – – – – – –
(0xDE) Reserved – – – – – – – –
(0xDD) Reserved – – – – – – – –
(0xDC) Reserved – – – – – – – –
(0xDB) Reserved – – – – – – – –
(0xDA) Reserved – – – – – – – –
(0xD9) Reserved – – – – – – – –
(0xD8) Reserved – – – – – – – –
(0xD7) Reserved – – – – – – – –
(0xD6) Reserved – – – – – – – –
(0xD5) Reserved – – – – – – – –
(0xD4) Reserved – – – – – – – –
(0xD3) Reserved – – – – – – – –
(0xD2) Reserved – – – – – – – –
(0xD1) Reserved – – – – – – – –
(0xD0) Reserved – – – – – – – –
(0xCF) Reserved – – – – – – – –
(0xCE) Reserved – – – – – – – –
(0xCD) Reserved – – – – – – – –
(0xCC) Reserved – – – – – – – –
(0xCB) Reserved – – – – – – – –
(0xCA) Reserved – – – – – – – –
(0xC9) Reserved – – – – – – – –
(0xC8) Reserved – – – – – – – –
(0xC7) Reserved – – – – – – – –
(0xC6) UDR0 USART0 I/O Data Register 194
(0xC5) UBRRH0 USART0 Baud Rate Register High 198
(0xC4) UBRRL0 USART0 Baud Rate Register Low 198
(0xC3) Reserved – – – – – – – –
(0xC2) UCSR0C – UMSEL0 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 194
(0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 194
(0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 194
3738018P–AVR–08/10
ATmega169P
(0xBF) Reserved – – – – – – – –
(0xBE) Reserved – – – – – – – –
(0xBD) Reserved – – – – – – – –
(0xBC) Reserved – – – – – – – –
(0xBB) Reserved – – – – – – – –
(0xBA) USIDR USI Data Register 207
(0xB9) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 207
(0xB8) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 208
(0xB7) Reserved – – – – – – –
(0xB6) ASSR – – – EXCLK AS2 TCN2UB OCR2UB TCR2UB 156
(0xB5) Reserved – – – – – – – –
(0xB4) Reserved – – – – – – – –
(0xB3) OCR2A Timer/Counter2 Output Compare Register A 155
(0xB2) TCNT2 Timer/Counter2 (8-bit) 155
(0xB1) Reserved – – – – – – – –
(0xB0) TCCR2A FOC2A WGM20 COM2A1 COM2A0 WGM21 CS22 CS21 CS20 153
(0xAF) Reserved – – – – – – – –
(0xAE) Reserved – – – – – – – –
(0xAD) Reserved – – – – – – – –
(0xAC) Reserved – – – – – – – –
(0xAB) Reserved – – – – – – – –
(0xAA) Reserved – – – – – – – –
(0xA9) Reserved – – – – – – – –
(0xA8) Reserved – – – – – – – –
(0xA7) Reserved – – – – – – – –
(0xA6) Reserved – – – – – – – –
(0xA5) Reserved – – – – – – – –
(0xA4) Reserved – – – – – – – –
(0xA3) Reserved – – – – – – – –
(0xA2) Reserved – – – – – – – –
(0xA1) Reserved – – – – – – – –
(0xA0) Reserved – – – – – – – –
(0x9F) Reserved – – – – – – – –
(0x9E) Reserved – – – – – – – –
(0x9D) Reserved – – – – – – – –
(0x9C) Reserved – – – – – – – –
(0x9B) Reserved – – – – – – – –
(0x9A) Reserved – – – – – – – –
(0x99) Reserved – – – – – – – –
(0x98) Reserved – – – – – – – –
(0x97) Reserved – – – – – – – –
(0x96) Reserved – – – – – – – –
(0x95) Reserved – – – – – – – –
(0x94) Reserved – – – – – – – –
(0x93) Reserved – – – – – – – –
(0x92) Reserved – – – – – – – –
(0x91) Reserved – – – – – – – –
(0x90) Reserved – – – – – – – –
(0x8F) Reserved – – – – – – – –
(0x8E) Reserved – – – – – – – –
(0x8D) Reserved – – – – – – – –
(0x8C) Reserved – – – – – – – –
(0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte 132
(0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte 132
(0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte 132
(0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte 132
(0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte 133
(0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte 133
(0x85) TCNT1H Timer/Counter1 - Counter Register High Byte 132
(0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte 132
(0x83) Reserved – – – – – – – –
(0x82) TCCR1C FOC1A FOC1B – – – – – – 131
(0x81) TCCR1B ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 130
(0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 – – WGM11 WGM10 128
(0x7F) DIDR1 – – – – – – AIN1D AIN0D 215
(0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D 233
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
3748018P–AVR–08/10
ATmega169P
(0x7D) Reserved – – – – – – – –
(0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 229
(0x7B) ADCSRB – ACME – – – ADTS2 ADTS1 ADTS0 214, 233
(0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 231
(0x79) ADCH ADC Data Register High byte 232
(0x78) ADCL ADC Data Register Low byte 232
(0x77) Reserved – – – – – – – –
(0x76) Reserved – – – – – – – –
(0x75) Reserved – – – – – – – –
(0x74) Reserved – – – – – – – –
(0x73) Reserved – – – – – – – –
(0x72) Reserved – – – – – – – –
(0x71) Reserved – – – – – – – –
(0x70) TIMSK2 – – – – – – OCIE2A TOIE2 156
(0x6F) TIMSK1 – – ICIE1 – – OCIE1B OCIE1A TOIE1 133
(0x6E) TIMSK0 – – – – – – OCIE0A TOIE0 104
(0x6D) Reserved – – – – – – – –
(0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 63
(0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 64
(0x6A) Reserved – – – – – – – –
(0x69) EICRA – – – – – – ISC01 ISC00 62
(0x68) Reserved – – – – – – – –
(0x67) Reserved – – – – – – – –
(0x66) OSCCAL Oscillator Calibration Register 38
(0x65) Reserved – – – – – – – –
(0x64) PRR – – – PRLCD PRTIM1 PRSPI PRUSART0 PRADC 45
(0x63) Reserved – – – – – – – –
(0x62) Reserved – – – – – – – –
(0x61) CLKPR CLKPCE – – – CLKPS3 CLKPS2 CLKPS1 CLKPS0 38
(0x60) WDTCR – – – WDCE WDE WDP2 WDP1 WDP0 54
0x3F (0x5F) SREG I T H S V N Z C 13
0x3E (0x5E) SPH – – – – – SP10 SP9 SP8 13
0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 13
0x3C (0x5C) Reserved
0x3B (0x5B) Reserved
0x3A (0x5A) Reserved
0x39 (0x59) Reserved
0x38 (0x58) Reserved
0x37 (0x57) SPMCSR SPMIE RWWSB – RWWSRE BLBSET PGWRT PGERS SPMEN 294
0x36 (0x56) Reserved – – – – – – – –
0x35 (0x55) MCUCR JTD – – PUD – – IVSEL IVCE 60, 88, 279
0x34 (0x54) MCUSR – – – JTRF WDRF BORF EXTRF PORF 279
0x33 (0x53) SMCR – – – – SM2 SM1 SM0 SE 45
0x32 (0x52) Reserved – – – – – – – –
0x31 (0x51) OCDR IDRD/OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 258
0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 214
0x2F (0x4F) Reserved – – – – – – – –
0x2E (0x4E) SPDR SPI Data Register 167
0x2D (0x4D) SPSR SPIF WCOL – – – – – SPI2X 166
0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 165
0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 28
0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 28
0x29 (0x49) Reserved – – – – – – – –
0x28 (0x48) Reserved – – – – – – – –
0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A 104
0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) 104
0x25 (0x45) Reserved – – – – – – – –
0x24 (0x44) TCCR0A FOC0A WGM00 COM0A1 COM0A0 WGM01 CS02 CS01 CS00 102
0x23 (0x43) GTCCR TSM – – – – – PSR2 PSR10 137, 157
0x22 (0x42) EEARH – – – – – – – EEAR8 28
0x21 (0x41) EEARL EEPROM Address Register Low Byte 28
0x20 (0x40) EEDR EEPROM Data Register 29
0x1F (0x3F) EECR – – – – EERIE EEMWE EEWE EERE 29
0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 28
0x1D (0x3D) EIMSK PCIE1 PCIE0 – – – – – INT0 62
0x1C (0x3C) EIFR PCIF1 PCIF0 – – – – – INTF0 63
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
3758018P–AVR–08/10
ATmega169P
Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written.
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD and ST instructions, 0x20 must be added to these addresses. The ATmega169P is a com-plex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from 0x60 - 0xFF in SRAM, only the ST/STS/STD and LD/LDS/LDD instructions can be used.
0x1B (0x3B) Reserved – – – – – – – –
0x1A (0x3A) Reserved – – – – – – – –
0x19 (0x39) Reserved – – – – – – – –
0x18 (0x38) Reserved – – – – – – – –
0x17 (0x37) TIFR2 – – – – – – OCF2A TOV2 156
0x16 (0x36) TIFR1 – – ICF1 – – OCF1B OCF1A TOV1 134
0x15 (0x35) TIFR0 – – – – – – OCF0A TOV0 105
0x14 (0x34) PORTG – – PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 90
0x13 (0x33) DDRG – – DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 90
0x12 (0x32) PING – – PING5 PING4 PING3 PING2 PING1 PING0 90
0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 90
0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 90
0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 90
0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 89
0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 89
0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 90
0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 89
0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 89
0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 89
0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 89
0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 89
0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 89
0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 88
0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 88
0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 88
0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 88
0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 88
0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 88
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
3768018P–AVR–08/10
ATmega169P
31. Instruction Set Summary
Mnemonics Operands Description Operation Flags #Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1
ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1
ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2
SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1
SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1
SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1
SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1
SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2
AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1
ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1
OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1
ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1
EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1
COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1
NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1
SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1
CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1
INC Rd Increment Rd ← Rd + 1 Z,N,V 1
DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1
TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1
CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1
SER Rd Set Register Rd ← 0xFF None 1
MUL Rd, Rr Multiply Unsigned R1:R0 ← Rd x Rr Z,C 2
MULS Rd, Rr Multiply Signed R1:R0 ← Rd x Rr Z,C 2
MULSU Rd, Rr Multiply Signed with Unsigned R1:R0 ← Rd x Rr Z,C 2
FMUL Rd, Rr Fractional Multiply Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2
FMULS Rd, Rr Fractional Multiply Signed R1:R0 ← (Rd x Rr) << 1 Z,C 2
FMULSU Rd, Rr Fractional Multiply Signed with Unsigned R1:R0 ← (Rd x Rr) << 1 Z,C 2
BRANCH INSTRUCTIONS
RJMP k Relative Jump PC ← PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC ← Z None 2
JMP k Direct Jump PC ← k None 3
RCALL k Relative Subroutine Call PC ← PC + k + 1 None 3
ICALL Indirect Call to (Z) PC ← Z None 3
CALL k Direct Subroutine Call PC ← k None 4
RET Subroutine Return PC ← STACK None 4
RETI Interrupt Return PC ← STACK I 4
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3
CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1
CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1
CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3
SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3
SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2
BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2
BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2
BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2
BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2
BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2
BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2
BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2
BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2
BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2
BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2
BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2
BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2
3778018P–AVR–08/10
ATmega169P
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2
BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2
BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2
BIT AND BIT-TEST INSTRUCTIONS
SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2
CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2
LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1
LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1
ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1
ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1
BSET s Flag Set SREG(s) ← 1 SREG(s) 1
BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1
BST Rr, b Bit Store from Register to T T ← Rr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) ← T None 1
SEC Set Carry C ← 1 C 1
CLC Clear Carry C ← 0 C 1
SEN Set Negative Flag N ← 1 N 1
CLN Clear Negative Flag N ← 0 N 1
SEZ Set Zero Flag Z ← 1 Z 1
CLZ Clear Zero Flag Z ← 0 Z 1
SEI Global Interrupt Enable I ← 1 I 1
CLI Global Interrupt Disable I ← 0 I 1
SES Set Signed Test Flag S ← 1 S 1
CLS Clear Signed Test Flag S ← 0 S 1
SEV Set Twos Complement Overflow. V ← 1 V 1
CLV Clear Twos Complement Overflow V ← 0 V 1
SET Set T in SREG T ← 1 T 1
CLT Clear T in SREG T ← 0 T 1
SEH Set Half Carry Flag in SREG H ← 1 H 1
CLH Clear Half Carry Flag in SREG H ← 0 H 1
DATA TRANSFER INSTRUCTIONS
MOV Rd, Rr Move Between Registers Rd ← Rr None 1
MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd ← K None 1
LD Rd, X Load Indirect Rd ← (X) None 2
LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2
LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2
LD Rd, Y Load Indirect Rd ← (Y) None 2
LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2
LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2
LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2
LD Rd, Z Load Indirect Rd ← (Z) None 2
LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2
LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2
LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2
LDS Rd, k Load Direct from SRAM Rd ← (k) None 2
ST X, Rr Store Indirect (X) ← Rr None 2
ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2
ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2
ST Y, Rr Store Indirect (Y) ← Rr None 2
ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2
ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2
STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2
ST Z, Rr Store Indirect (Z) ← Rr None 2
ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2
ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2
STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2
STS k, Rr Store Direct to SRAM (k) ← Rr None 2
LPM Load Program Memory R0 ← (Z) None 3
LPM Rd, Z Load Program Memory Rd ← (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3
SPM Store Program Memory (Z) ← R1:R0 None -
IN Rd, P In Port Rd ← P None 1
OUT P, Rr Out Port P ← Rr None 1
Mnemonics Operands Description Operation Flags #Clocks
3788018P–AVR–08/10
ATmega169P
PUSH Rr Push Register on Stack STACK ← Rr None 2
POP Rd Pop Register from Stack Rd ← STACK None 2
MCU CONTROL INSTRUCTIONS
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep function) None 1
WDR Watchdog Reset (see specific descr. for WDR/timer) None 1
BREAK Break For On-chip Debug Only None N/A
Mnemonics Operands Description Operation Flags #Clocks
3798018P–AVR–08/10
ATmega169P
32. Ordering Information
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For Speed vs. VCC, see Figure 28-1 on page 331 and Figure 28-2 on page 332.
Speed (MHz)(3) Power Supply Ordering Code Package(1)(2) Operation Range
8 1.8V - 5.5V
ATmega169PV-8AU
ATmega169PV-8MUATmega169PV-8MCH
64A
64M164MC
Industrial(-40°C to 85°C)
16 2.7V - 5.5VATmega169P-16AUATmega169P-16MU
ATmega169P-16MCH
64A64M1
64MC
Industrial(-40°C to 85°C)
Package Type
64A 64-Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M1 64-pad, 9 × 9 × 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
64MC 64-lead (2-row Staggered), 7 × 7 × 1.0 mm body, 4.0 × 4.0 mm Exposed Pad, Quad Flat No-Lead Package (QFN)
3808018P–AVR–08/10
ATmega169P
33. Packaging Information
33.1 64A
2325 Orchard Parkway San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B64A
10/5/2001
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1 A2 A
D1
D
e E1 E
B
COMMON DIMENSIONS(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 15.75 16.00 16.25
D1 13.90 14.00 14.10 Note 2
E 15.75 16.00 16.25
E1 13.90 14.00 14.10 Note 2
B 0.30 – 0.45
C 0.09 – 0.20
L 0.45 – 0.75
e 0.80 TYP
3818018P–AVR–08/10
ATmega169P
33.2 64M1
2325 Orchard Parkway San Jose, CA 95131
TITLE DRAWING NO.
R
REV. 64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm,
G64M1
5/25/06
COMMON DIMENSIONS(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A 0.80 0.90 1.00
A1 – 0.02 0.05
b 0.18 0.25 0.30
D
D2 5.20 5.40 5.60
8.90 9.00 9.10
8.90 9.00 9.10 E
E2 5.20 5.40 5.60
e 0.50 BSC
L 0.35 0.40 0.45
Note: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994.
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D
E
Marked Pin# 1 ID
SEATING PLANE
A1
C
A
C0.08
123
K 1.25 1.40 1.55
E2
D2
b e
Pin #1 CornerL
Pin #1 Triangle
Pin #1 Chamfer(C 0.30)
Option A
Option B
Pin #1 Notch(0.20 R)
Option C
K
K
5.40 mm Exposed Pad, Micro Lead Frame Package (MLF)
3828018P–AVR–08/10
ATmega169P
33.3 64MC
TITLE DRAWING NO.GPC REV. Package Drawing Contact: [email protected] 64MCZXC A
64MC, 64QFN (2-Row Staggered), 7 x 7 x 1.00 mm Body, 4.0 x 4.0 mm Exposed Pad,Quad Flat No Lead Package
10/3/07
COMMON DIMENSIONS(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A 0.80 0.90 1.00
A1 0.00 0.02 0.05
b 0.18 0.23 0.28
C 0.20 REF
D 6.90 7.00 7.10
D2 3.95 4.00 4.05
E 6.90 7.00 7.10
E2 3.95 4.00 4.05
eT – 0.65 –
eR – 0.65 –
K 0.20 – – (REF)
L 0.35 0.40 0.45
y 0.00 – 0.075
SIDE VIEW
TOP VIEW
BOTTOM VIEW
Note: 1. The terminal #1 ID is a Laser-marked Feature.
Pin 1 ID
D
EA1
A
y
C
eT/2
R0.20 0.40
B1A1
B30
A34
b
A8
B7
eT
D2
B16
A18
B22A25
E2 K (0.1) REF
B8
A9
(0.18) REF
L
B15
A17
L
eR
A26
B23
eT
3838018P–AVR–08/10
ATmega169P
34. Errata
34.1 ATmega169P Rev. G
No known errata.
34.2 ATmega169P Rev. A to F
Not sampled.
3848018P–AVR–08/10
ATmega169P
35. Datasheet Revision History
Please note that the referring page numbers in this section are referring to this document. Thereferring revision in this section are referring to the document revision.
35.1 Rev. 8018P 08/10
35.2 Rev. 8018O 10/09
35.3 Rev. 8018N 08/09
35.4 Rev. 8018M 07/09
35.5 Rev. L 08/08
35.6 Rev. K 06/08
1. Status changed to active2. EEPROM minimum wait delay, Table 27-15 on page 312, has been changed from 9.0
ms to 3.6 ms3. Datasheet layout and technical terminology updated
1. Changed datasheet status to “Mature”2. Added Capacitance for Low-frequency Crystal Oscillator, Table 8-5 on page 33.
1. Updated ”Ordering Information” on page 380, MCU replaced by MCH.
1. Updated the last page with new Atmel’s addresses.
1. Updated package information in ”Features” on page 1.2. Added ”Pinout - DRQFN” on page 3:
• The Staggered QFN is named Dual Row QFN (DRQFN).
1. Updated package information in ”Features” on page 1.2. Removed “Disclaimer” from section ”Pin Configurations” on page 23. Added ”64MC (DRQFN) Pinout ATmega169P” on page 34. Added ”Data Retention” on page 9.5. Updated ”Stack Pointer” on page 13.6. Updated ”Low-frequency Crystal Oscillator” on page 34.7. Updated ”USART Register Description” on page 194, register descriptions and tables.8. Updated ”UCSRnB – USART Control and Status Register n B” on page 195.9. Updated VIL2 in ”DC Characteristics” on page 329, by removing 0.2VCC from the table.
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35.7 Rev. J 08/07
35.8 Rev. I 11/06
35.9 Rev. H 09/06
35.10 Rev. G 08/06
35.11 Rev. F 08/06
35.12 Rev. E 08/06
10. Replaced Figure 29-36 on page 357 by a correct one.11. Updated ”Ordering Information” on page 380.12. Added ”64MC” on page 383 package to ”Packaging Information” on page 381.
1. Updated ”Features” on page 1.2. Added ”Minimizing Power Consumption” on page 237 in the LCD section.3. Updated ”System and Reset Characteristics” on page 333.
1. Updated ”Low-frequency Crystal Oscillator” on page 34.2. Updated Table 8-8 on page 35, Table 8-9 on page 35, Table 8-10 on page 35, Table
28-7 on page 336.3. Updated note in Table 28-7 on page 336.
1. All characterization data moved to ”Electrical Characteristics” on page 329.2. Updated ”Calibrated Internal RC Oscillator” on page 32.3. Updated ”System Control and Reset” on page 47.4. Added note to Table 27-16 on page 314.5. Updated ”LCD Controller Characteristics” on page 337.
1. Updated ”LCD Controller Characteristics” on page 337.
1. Updated ”DC Characteristics” on page 329.2. Updated Table 13-19 on page 84.
1. Updated ”Low-frequency Crystal Oscillator” on page 34.2. Updated ”Device Identification Register” on page 260.3. Updated ”Signature Bytes” on page 299.4. Added Table 27-6 on page 299.
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35.13 Rev. D 07/06
35.14 Rev. C 06/06
35.15 Rev. B 04/06
35.16 Rev. A 03/06
1. Updated ”Register Description for I/O-Ports” on page 88.2. Updated ”Fast PWM Mode” on page 97.3. Updated ”Fast PWM Mode” on page 120.4. Updated Table 14-2 on page 102, Table 14-4 on page 103, Table 15-3 on page 129,
Table 15-4 on page 130, Table 17-2 on page 153 and Table 17-4 on page 154.5 Updated ”UCSRnC – USART Control and Status Register n C” on page 196.6. Updated Features in ”USI – Universal Serial Interface” on page 199.7. Added ”Clock speed considerations.” on page 206.8. Updated Features in ”LCD Controller” on page 234.9. Updated ”Register Summary” on page 373.
1. Updated typos.2. Updated ”Calibrated Internal RC Oscillator” on page 32.3. Updated ”OSCCAL – Oscillator Calibration Register” on page 38.4. Added Table 28-2 on page 332.
1. Updated ”Calibrated Internal RC Oscillator” on page 32.
1. Initial revision.
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ATmega169P
Table of Contents
Features ..................................................................................................... 1
1 Pin Configurations ................................................................................... 2
1.1Pinout - TQFP/QFN/MLF ...........................................................................................2
1.2Pinout - DRQFN ........................................................................................................3
2 Overview ................................................................................................... 4
2.1Block Diagram ...........................................................................................................4
2.2Pin Descriptions ........................................................................................................6
3 Resources ................................................................................................. 9
4 Data Retention .......................................................................................... 9
5 About Code Examples ........................................................................... 10
6 AVR CPU Core ........................................................................................ 11
6.1Introduction ..............................................................................................................11
6.2Architectural Overview ............................................................................................11
6.3ALU – Arithmetic Logic Unit ....................................................................................12
6.4Stack Pointer ...........................................................................................................13
6.5Instruction Execution Timing ...................................................................................14
6.6Reset and Interrupt Handling ..................................................................................15
6.7Status Register ........................................................................................................17
6.8General Purpose Register File ................................................................................18
7 AVR Memories ........................................................................................ 20
7.1In-System Reprogrammable Flash Program Memory .............................................20
7.2SRAM Data Memory ...............................................................................................21
7.3EEPROM Data Memory ..........................................................................................23
7.4I/O Memory ..............................................................................................................27
7.5General Purpose I/O Registers ...............................................................................28
7.6EEPROM Register Description ................................................................................28
8 System Clock and Clock Options ......................................................... 30
8.1Clock Systems and their Distribution .......................................................................30
8.2Clock Sources .........................................................................................................31
8.3Default Clock Source ...............................................................................................32
8.4Calibrated Internal RC Oscillator .............................................................................32
8.5Crystal Oscillator .....................................................................................................33
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8.6Low-frequency Crystal Oscillator .............................................................................34
8.7External Clock .........................................................................................................36
8.8Timer/Counter Oscillator .........................................................................................37
8.9Clock Output Buffer .................................................................................................37
8.10System Clock Prescaler ........................................................................................37
8.11Register Description ..............................................................................................38
9 Power Management and Sleep Modes ................................................. 40
9.1Sleep Modes ...........................................................................................................40
9.2Idle Mode .................................................................................................................41
9.3ADC Noise Reduction Mode ...................................................................................41
9.4Power-down Mode ..................................................................................................41
9.5Power-save Mode ...................................................................................................42
9.6Standby Mode .........................................................................................................42
9.7Power Reduction Register .......................................................................................42
9.8Minimizing Power Consumption ..............................................................................43
9.9Register Description ................................................................................................45
10 System Control and Reset .................................................................... 47
10.1Resetting the AVR .................................................................................................47
10.2Reset Sources .......................................................................................................47
10.3Internal Voltage Reference ....................................................................................51
10.4Watchdog Timer ....................................................................................................51
10.5Register Description ..............................................................................................54
11 Interrupts ................................................................................................ 56
11.1Interrupt Vectors in ATmega169P .........................................................................56
11.2Moving Interrupts Between Application and Boot Space ......................................59
12 External Interrupts ................................................................................. 61
12.1Pin Change Interrupt Timing .................................................................................61
12.2Register Description ..............................................................................................62
13 I/O-Ports .................................................................................................. 65
13.1Overview ...............................................................................................................65
13.2Ports as General Digital I/O ...................................................................................66
13.3Alternate Port Functions ........................................................................................71
13.4Register Description for I/O-Ports ..........................................................................88
14 8-bit Timer/Counter0 with PWM ............................................................ 91
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14.1Features ................................................................................................................91
14.2Overview ...............................................................................................................91
14.3Timer/Counter Clock Sources ...............................................................................92
14.4Counter Unit ..........................................................................................................92
14.5Output Compare Unit ............................................................................................93
14.6Compare Match Output Unit ..................................................................................95
14.7Modes of Operation ...............................................................................................96
14.8Timer/Counter Timing Diagrams .........................................................................100
14.98-bit Timer/Counter Register Description ............................................................102
15 16-bit Timer/Counter1 .......................................................................... 106
15.1Features ..............................................................................................................106
15.2Overview .............................................................................................................106
15.3Accessing 16-bit Registers ..................................................................................109
15.4Timer/Counter Clock Sources .............................................................................111
15.5Counter Unit ........................................................................................................112
15.6Input Capture Unit ...............................................................................................113
15.7Output Compare Units .........................................................................................115
15.8Compare Match Output Unit ................................................................................117
15.9Modes of Operation .............................................................................................118
15.10Timer/Counter Timing Diagrams .......................................................................126
15.1116-bit Timer/Counter Register Description ........................................................128
16 Timer/Counter0 and Timer/Counter1 Prescalers .............................. 135
16.1Prescaler Reset ...................................................................................................135
16.2Internal Clock Source ..........................................................................................135
16.3External Clock Source .........................................................................................135
16.4Register Description ............................................................................................137
17 8-bit Timer/Counter2 with PWM and Asynchronous Operation ...... 138
17.1Overview .............................................................................................................138
17.2Timer/Counter Clock Sources .............................................................................139
17.3Counter Unit ........................................................................................................139
17.4Output Compare Unit ..........................................................................................140
17.5Compare Match Output Unit ................................................................................142
17.6Modes of Operation .............................................................................................143
17.7Timer/Counter Timing Diagrams .........................................................................148
17.8Asynchronous operation of the Timer/Counter ....................................................150
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17.9Timer/Counter Prescaler .....................................................................................152
17.108-bit Timer/Counter Register Description ..........................................................153
18 SPI – Serial Peripheral Interface ......................................................... 158
18.1Features ..............................................................................................................158
18.2Overview .............................................................................................................158
18.3SS Pin Functionality ............................................................................................163
18.4Data Modes .........................................................................................................164
18.5Register Description ............................................................................................165
19 USART ................................................................................................... 168
19.1Features ..............................................................................................................168
19.2Overview .............................................................................................................168
19.3Clock Generation .................................................................................................170
19.4Frame Formats ....................................................................................................173
19.5USART Initialization ............................................................................................175
19.6Data Transmission – The USART Transmitter ....................................................177
19.7Data Reception – The USART Receiver .............................................................180
19.8Asynchronous Data Reception ............................................................................185
19.9Multi-processor Communication Mode ................................................................188
19.10Examples of Baud Rate Setting ........................................................................190
19.11USART Register Description .............................................................................194
20 USI – Universal Serial Interface .......................................................... 199
20.1Overview .............................................................................................................199
20.2Functional Descriptions .......................................................................................200
20.3Alternative USI Usage .........................................................................................206
20.4USI Register Descriptions ...................................................................................207
21 AC - Analog Comparator ..................................................................... 212
21.1Analog Comparator Multiplexed Input .................................................................213
21.2Analog Comparator Register Description ............................................................214
22 ADC - Analog to Digital Converter ..................................................... 216
22.1Features ..............................................................................................................216
22.2Overview .............................................................................................................216
22.3Operation .............................................................................................................217
22.4Starting a Conversion ..........................................................................................218
22.5Prescaling and Conversion Timing ......................................................................219
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22.6Changing Channel or Reference Selection .........................................................221
22.7ADC Noise Canceler ...........................................................................................222
22.8ADC Conversion Result ......................................................................................227
22.9ADC Register Description ...................................................................................229
23 LCD Controller ..................................................................................... 234
23.1Features ..............................................................................................................234
23.2Overview .............................................................................................................234
23.3Mode of Operation ...............................................................................................237
23.4LCD Usage ..........................................................................................................242
23.5LCD Register Description ....................................................................................246
24 JTAG Interface and On-chip Debug System ..................................... 252
24.1Overview .............................................................................................................252
24.2TAP – Test Access Port ......................................................................................253
24.3TAP Controller .....................................................................................................255
24.4Using the Boundary-scan Chain ..........................................................................256
24.5Using the On-chip Debug System .......................................................................256
24.6On-chip Debug Specific JTAG Instructions .........................................................257
24.7On-chip Debug Related Register in I/O Memory .................................................258
24.8Using the JTAG Programming Capabilities .........................................................258
24.9Bibliography .........................................................................................................258
25 IEEE 1149.1 (JTAG) Boundary-scan ................................................... 259
25.1Features ..............................................................................................................259
25.2System Overview ................................................................................................259
25.3Data Registers .....................................................................................................260
25.4Boundary-scan Specific JTAG Instructions .........................................................261
25.5Boundary-scan Chain ..........................................................................................262
25.6Boundary-scan Order ..........................................................................................272
25.7Boundary-scan Description Language Files ........................................................278
25.8Boundary-scan Related Register in I/O Memory .................................................279
26 Boot Loader Support – Read-While-Write Self-Programming ......... 280
26.1Features ..............................................................................................................280
26.2Overview .............................................................................................................280
26.3Application and Boot Loader Flash Sections .......................................................280
26.4Read-While-Write and No Read-While-Write Flash Sections ..............................281
26.5Boot Loader Lock Bits .........................................................................................284
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26.6Entering the Boot Loader Program ......................................................................285
26.7Addressing the Flash During Self-Programming .................................................286
26.8Self-Programming the Flash ................................................................................287
26.9Register Description ............................................................................................294
27 Memory Programming ......................................................................... 296
27.1Program And Data Memory Lock Bits .................................................................296
27.2Fuse Bits .............................................................................................................297
27.3Signature Bytes ...................................................................................................299
27.4Calibration Byte ...................................................................................................299
27.5Page Size ............................................................................................................299
27.6Parallel Programming Parameters, Pin Mapping, and Commands .....................299
27.7Parallel Programming ..........................................................................................302
27.8Serial Downloading .............................................................................................310
27.9Programming via the JTAG Interface ..................................................................316
28 Electrical Characteristics .................................................................... 329
28.1Absolute Maximum Ratings* ...............................................................................329
28.2DC Characteristics ..............................................................................................329
28.3Speed Grades .....................................................................................................331
28.4Clock Characteristics ...........................................................................................332
28.5System and Reset Characteristics ......................................................................333
28.6SPI Timing Characteristics ..................................................................................334
28.7ADC Characteristics – Preliminary Data ..............................................................336
28.8LCD Controller Characteristics ............................................................................337
29 Typical Characteristics ........................................................................ 338
29.1Active Supply Current ..........................................................................................338
29.2Idle Supply Current ..............................................................................................341
29.3Supply Current of I/O modules ............................................................................343
29.4Power-down Supply Current ...............................................................................344
29.5Power-save Supply Current ................................................................................345
29.6Standby Supply Current ......................................................................................346
29.7Pin Pull-up ...........................................................................................................350
29.8Pin Driver Strength ..............................................................................................353
29.9Pin Thresholds and Hysteresis ............................................................................359
29.10BOD Thresholds and Analog Comparator Offset ..............................................362
29.11Internal Oscillator Speed ...................................................................................365
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29.12Current Consumption of Peripheral Units ..........................................................368
29.13Current Consumption in Reset and Reset Pulsewidth ......................................371
30 Register Summary ............................................................................... 373
31 Instruction Set Summary .................................................................... 377
32 Ordering Information ........................................................................... 380
33 Packaging Information ........................................................................ 381
33.164A ......................................................................................................................381
33.264M1 ...................................................................................................................382
33.364MC ...................................................................................................................383
34 Errata ..................................................................................................... 384
34.1ATmega169P Rev. G ..........................................................................................384
34.2ATmega169P Rev. A to F ...................................................................................384
35 Datasheet Revision History ................................................................ 385
35.1Rev. 8018P 08/10 ................................................................................................385
35.2Rev. 8018O 10/09 ...............................................................................................385
35.3Rev. 8018N 08/09 ...............................................................................................385
35.4Rev. 8018M 07/09 ...............................................................................................385
35.5Rev. L 08/08 ........................................................................................................385
35.6Rev. K 06/08 ........................................................................................................385
35.7Rev. J 08/07 ........................................................................................................386
35.8Rev. I 11/06 .........................................................................................................386
35.9Rev. H 09/06 .......................................................................................................386
35.10Rev. G 08/06 .....................................................................................................386
35.11Rev. F 08/06 ......................................................................................................386
35.12Rev. E 08/06 ......................................................................................................386
35.13Rev. D 07/06 .....................................................................................................387
35.14Rev. C 06/06 .....................................................................................................387
35.15Rev. B 04/06 ......................................................................................................387
35.16Rev. A 03/06 ......................................................................................................387
Table of Contents....................................................................................... i
vii8018O–AVR–10/09
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8018O–AVR–10/09
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