assignment pmmd abhijeet
TRANSCRIPT
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1. Study any one of the JFET models, draw the output characteristics. Draw equivalent circuitand describe.
An Improved Model for Four-Terminal Junction Field-Effect Transistors: [1]
JFET has two distinct advantages. Due to direct contact with the substrate and absence ofoxide, there are no surface effects and hence surface traps. The absence of the trapping statesreduces the fluctuation of free-carrier transport, thus resulting in a very low noise in the JFET.
Second, the JFET has two isolated gate terminals, which allows for two different inputs to beapplied simultaneously for signal mixing purposes.
Conventionally the JFET model that we use has only three terminals where the top and bottomgate are connected to a common gate voltage. The source-to-drain current ISD, including both the
linear and saturation regions, for a p-channel JFET is given by:
= tanh 1 1 + ---- (1)Where,
= 0 (1 2)2 ---- (2)1 = ---- (3)2 = ---- (4)
Where,
ISDSsource to drain saturation
current
-- parameter merging the linear
and saturation regions
VSD is the source-to drain voltage is the parameter accounting for
the channel length modulation
VPis the pinch-off voltage
VGSis gate-to-source voltage
ISDSO is ISDSat VGS = 0
VP is the threshold voltage
For a three terminal JFET
definition of VP is
straightforward.
For a four-terminal JFET having two different gate voltages (see Fig. l), however, the
definition of the pinch-off voltage becomes less clear. For a 4- terminal JFET the parameters
change to
B1 = VPT VGST ---- (5)B2 = VGST/VPT ---- (6)
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Here VPT is the pinch-off voltage associated with the top gate of JFET and is a function of the
bottom gate-to-source voltage VGSB. In other words, V-Tis the top gate-to- source voltage VGST
which causes the entire channel to become depleted (channel cutoff) for a given VGSB. While ISD
in such a model is influenced by both VGST and VGSB, the single-pinch-off-voltage model
implicitly assumes that the effect of VGSB onXBis much less significant compared to that of VGST
onXTand that the pinch-off voltage VPB associated with the bottom gate can be omitted. More
detailed discussions on the physics underlying the use of VPT and the development of (5) and (6)
are given below.
Because of the two independent gate voltages in the four-terminal JFET, two different
pinch-off voltages VPT and VPB were derived by making following considerations. The pinch-off
voltage VPT was derived under the condition VGSB is fixed, and the top gate-to-source voltage
that causes the channel to cutoff is VPT. On the other hand, the pinch-off voltage VPB was derived
under the condition VGST is fixed, and the bottom gate-to-source voltage that causes the channel
to cutoff is VPB. Consider a four-terminal JFET biased with VGST = 2 V and VGSB = 4 V. If the
doping concentrations in the top and bottom gates are the same, then the thickness of depletionregion in the channel associated with the top gate will be smaller than that associated with the
bottom gate, and VPT will be smaller than VPB. Since only a single pinch-off voltage is used in
the JFET model (3), (4) selecting VPT or VPB as the pinch-off voltage iscrucial because it can
give rise to a large difference in the current-voltage characteristics. The problem becomes less
complicated if the doping concentration in the top gate is much higher than that in the bottom
gate. In such a device, the effect of VGSB on the depletion region in the channel associated with
the bottom gate is minimal, and the obvious choice for the single pinch-off voltage is V PT
because VGSB is in effect fixed. Thus, the expressions given in (5) and (6), which use VPT as the
pinch-off voltage is valid for JFETs in which the doping concentration in the bottom gate is
much smaller than that in the top gate.An improved four-terminal JFET model is developed including both VPT and VPB. The
model developed will be valid for a wider range of impurities N DB and NDT. By way of MEDICI
simulations, B1 and B2 get modified to:
1 = [ 1( ) +1
]1 ---- (7)
2 = + ---- (8)
The two pinch-off voltages can be derived using the condition that at VSD = 0,
h =XT+XB ---- (9)Where h is the channel height, andXTandXBare the depletion region thicknesses in the channel
associated with the top and bottom gate junctions (Fig. 1). Thus, considering VGSB as the fixed
gate voltage and VGST as the varying gate voltage:
= [ 21 2+
1 ]2 ---- (10)
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Where K1 = NDT/[NA(NA + NDT)] and K2 = NDB/[NA(NA + NDB]
s is the dielectric permittivity; Tand B are the top and bottom gate junctions.
Thus considering VGSB as the fixed gate voltage and VGST as the varying gate voltage,
= [ 21 2
+
1 ]2
---- (11)For a JFET having NDB > VPT even if NDB >
NDB). Fig. 2(a) and (b)shows ISDS-VGST and ISD-VSD
characteristics, respectively, calculated from the
present model, calculated from the previous model,
and simulated from a two-dimensional (2-D) device
simulator MEDICI. For such a device, the previous
and present models yield very similar results; except
for large VGST, where the present model predicts
slightly smaller drain currents than the previous
model (Fig. 2(b)). This results because a large VGST
gives rise to a relatively small VPB, and the VPB >> VPT assumption used in the previous model
becomes questionable.
Next we consider a four-terminal JFET (JFET-2) having NDB = 1 x 10l6
cm-3
, NDT = 1.5 x
1017
cm-3
(e.g., NDT not much larger than NDB), but otherwise identical structure as JFET-1. Fig.
3(a) and (b) showsISDS-VGST andISD-VSD characteristics, respectively, calculated from the present
model, calculated from the previous model, and simulated from MEDICI. At VGSB = 0, the two
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models have the same saturation drain current (Fig. 3(a)). As VGSB is increased, however, the
degree of discrepancies of the two models increases with increasing VGSB and VGST. The results
further suggest that the effective pinch-off voltage of the four-terminal JFET is smaller than that
predicted by the previous model. This is due to the fact that the JFET considered here has a
relatively small difference between the top- and bottom-gate doping concentrations, and thesingle-pinch-off-voltage approximation
employed in the previous model becomes
erroneous. For a constant VGSB of 4 V, the
results in Fig. 3(b) indicate that the drain
current can be greatly overestimated (i.e.,
about 40% at VGST = 2V) if the single-pinch-
off-voltage approach is used.
Fig. 4 shows the relative magnitudes of
VPT and VPB calculated as functions of VGST and VGSB for JFET-1 and JFET-2. We point out
several important observations, which are consistent with device physics mentioned earlier. First,
VPT
is considerable larger than VPB
for JFET-1, suggesting that (7) and (8) reduce to (5) and (6)
for this device (e.g., VPB can be omitted). On the other hand, VPT can be larger or smaller than
VPB for JFET-2, indicating the model given by (5) and (6) is not applicable for this device (e.g.,
both VPT and VPB are important). Second, VPT is constant versus VGST because VGSB is fixed,
whereas VPB decreases with increasing VGST. Finally, VPT and VPB for JFET-1 are larger than
those for JFET-2 for all VGST due to the fact that JFET-1 has a lower bottom-gate doping density
than JFET-2.
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Electrical equivalent circuit: Fig. 5 shows the electrical equivalent circuit of a 4- terminal
JFET. Two gates have been shown denoted by TG(top gate) and BG(bottom gate). The
associated parasitic capacitances arising out of the substrate and gate electrode is shown.
Fig 5. Electrical equivalent of a four-terminal JFET
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2. Study one of the mosfet models, draw the output and transfer characteristics. Draw anequivalent circuit and describe.
A simple MOSFET model for circuit analysis: [2]
SHOCKLEY model for MOSFET is widely used in analytical treatments of MOSFET
circuits. However, the model is not accurate in the short-channel region because it neglects thevelocity saturation effects of carriers. On the other hand, there are more precise MOS models
like the SPICE LEVEL3 model, BSIM, table look-up models, and so on. However, some of them
are time-consuming in evaluating models and some of them need a special system with a
hardware/software combination for extracting model parameters and the number of parameters is
large.
In order to fill the gap between the simple Shockley model and the more precise models,
a new model, namely, the nth
power law MOSFET model has been discussed. The objective of
this model is to provide a simple model which is placed just above the Shockley model.
Model: The proposed model equations are as follows. ID is the drain current.
= 0 + (2 2 ---- (1) = ( ) ---- (2) = ( ) ---- (3) = = 1 + ; = 0 1 ---- (4)
:
= 3 = 5 2 / ---- (5)
< : Where Vgs, Vds, Vbs are gate-source, drain-source, bulk-
source voltages respectively
WChannel width;
LeffEffective channel length
VTo, , and 2F are parameters which describe the
threshold voltage. Parameters Kand m control the linear
region characteristics while B and n determine the
saturated region characteristics. o and lare related to the
finite drain conductance in the saturated region. The
subscript 3 and 5 for ID denotes a triode and a pentode
operating region, respectively. The validity of (3) for
various MOSFETs is shown in Fig. 1. Fig. 1. Measured nvalue for different MOSFETs
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An application of the model to 0.25-m MOSFETs is shown in Figs. 3and 4.
The present model does not give a very good approximation near and below the threshold
voltage as seen in Fig. 3. The near- and sub-threshold region modelling is not important in
calculating delay of most VLSIs. The modelling of the
region is important in estimating the charge decay
characteristic of charge storage nodes but in this case a
statistical model should be used since it is very sensitive
to process variation.
In the sub micrometer devices, the contact
resistance, drain/source diffusion resistance, and hot-
carrier-induced drain resistance are important. It is
better for MOS model to incorporate these resistance
effects by just modifying parameters of the model.
An example is shown in Fig. 4. Dotted lines in
the figure are simulated ID-VDS curves of a 0.25-m
PMOSFET, which includes lumped resistors whose value
is 10% of the effective MOSFET resistance inserted in the drain and the source. Solid lines in the
figure are calculated ID-VDS curves using the present model with the modified parameter set and
without any resistors inserted in the drain and the source. This means that the present model can
be fitted to the measured MOSFETI-Vcharacteristics which include inseparable resistor effects,
without adding extra nodes which are necessary when the resistor effects are modelled by
lumped external resistors.
The model is quite general and can be applied for GaAs FET as well. The salient feature
of GaAs FET is that VDSAT is constant and not a function of VGS, which can be expressed by
setting m= 0.
Fig. 2. Vds-Idcharacteristics of 0.25-nm NMOS( VBS= 0V) Fig. 3. VGS-lD characteristics of 0.25-nm NMOS
Fig. 4:0.25-m PMOS VDS-IDand VGS-ID characteristics
with and without source and drain resistance.
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Electrical equivalent of MOSFET:
The electrical equivalent of MOSFET is as shown in the figure. Here the circuit is prepared using
the EKV model. EKV MOSFET model is a scalable and compact simulation model built on
fundamental physical properties of the MOS structure. This model is dedicated to the design and
simulation of low-voltage, low-current analog, and mixed analog-digital circuits using submicron
CMOS technologies. This figure represents the intrinsic and extrinsic elements of the MOS
transistor. For quasi-static dynamic operation, only the intrinsic capacitances from the simpler
capacitances model are shown here.
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REFERENCES
[1]. J. J. Liou and Y. Yue, An Improved Model for Four-Terminal Junction Field-Effect
Transistors,IEEE Transaction on electron devices Vol. 43 no. 8 p. 1309 August 1996.
[2]. Takayasu Sakurai and A. Richard Newton, A Simple MOSFET model for circuit analysis,
IEEE Transaction on electron devices Vol. 38 no. 4 p. 887 April 1991.