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  • 8/3/2019 Assignment Pmmd Abhijeet

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    1. Study any one of the JFET models, draw the output characteristics. Draw equivalent circuitand describe.

    An Improved Model for Four-Terminal Junction Field-Effect Transistors: [1]

    JFET has two distinct advantages. Due to direct contact with the substrate and absence ofoxide, there are no surface effects and hence surface traps. The absence of the trapping statesreduces the fluctuation of free-carrier transport, thus resulting in a very low noise in the JFET.

    Second, the JFET has two isolated gate terminals, which allows for two different inputs to beapplied simultaneously for signal mixing purposes.

    Conventionally the JFET model that we use has only three terminals where the top and bottomgate are connected to a common gate voltage. The source-to-drain current ISD, including both the

    linear and saturation regions, for a p-channel JFET is given by:

    = tanh 1 1 + ---- (1)Where,

    = 0 (1 2)2 ---- (2)1 = ---- (3)2 = ---- (4)

    Where,

    ISDSsource to drain saturation

    current

    -- parameter merging the linear

    and saturation regions

    VSD is the source-to drain voltage is the parameter accounting for

    the channel length modulation

    VPis the pinch-off voltage

    VGSis gate-to-source voltage

    ISDSO is ISDSat VGS = 0

    VP is the threshold voltage

    For a three terminal JFET

    definition of VP is

    straightforward.

    For a four-terminal JFET having two different gate voltages (see Fig. l), however, the

    definition of the pinch-off voltage becomes less clear. For a 4- terminal JFET the parameters

    change to

    B1 = VPT VGST ---- (5)B2 = VGST/VPT ---- (6)

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    Here VPT is the pinch-off voltage associated with the top gate of JFET and is a function of the

    bottom gate-to-source voltage VGSB. In other words, V-Tis the top gate-to- source voltage VGST

    which causes the entire channel to become depleted (channel cutoff) for a given VGSB. While ISD

    in such a model is influenced by both VGST and VGSB, the single-pinch-off-voltage model

    implicitly assumes that the effect of VGSB onXBis much less significant compared to that of VGST

    onXTand that the pinch-off voltage VPB associated with the bottom gate can be omitted. More

    detailed discussions on the physics underlying the use of VPT and the development of (5) and (6)

    are given below.

    Because of the two independent gate voltages in the four-terminal JFET, two different

    pinch-off voltages VPT and VPB were derived by making following considerations. The pinch-off

    voltage VPT was derived under the condition VGSB is fixed, and the top gate-to-source voltage

    that causes the channel to cutoff is VPT. On the other hand, the pinch-off voltage VPB was derived

    under the condition VGST is fixed, and the bottom gate-to-source voltage that causes the channel

    to cutoff is VPB. Consider a four-terminal JFET biased with VGST = 2 V and VGSB = 4 V. If the

    doping concentrations in the top and bottom gates are the same, then the thickness of depletionregion in the channel associated with the top gate will be smaller than that associated with the

    bottom gate, and VPT will be smaller than VPB. Since only a single pinch-off voltage is used in

    the JFET model (3), (4) selecting VPT or VPB as the pinch-off voltage iscrucial because it can

    give rise to a large difference in the current-voltage characteristics. The problem becomes less

    complicated if the doping concentration in the top gate is much higher than that in the bottom

    gate. In such a device, the effect of VGSB on the depletion region in the channel associated with

    the bottom gate is minimal, and the obvious choice for the single pinch-off voltage is V PT

    because VGSB is in effect fixed. Thus, the expressions given in (5) and (6), which use VPT as the

    pinch-off voltage is valid for JFETs in which the doping concentration in the bottom gate is

    much smaller than that in the top gate.An improved four-terminal JFET model is developed including both VPT and VPB. The

    model developed will be valid for a wider range of impurities N DB and NDT. By way of MEDICI

    simulations, B1 and B2 get modified to:

    1 = [ 1( ) +1

    ]1 ---- (7)

    2 = + ---- (8)

    The two pinch-off voltages can be derived using the condition that at VSD = 0,

    h =XT+XB ---- (9)Where h is the channel height, andXTandXBare the depletion region thicknesses in the channel

    associated with the top and bottom gate junctions (Fig. 1). Thus, considering VGSB as the fixed

    gate voltage and VGST as the varying gate voltage:

    = [ 21 2+

    1 ]2 ---- (10)

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    Where K1 = NDT/[NA(NA + NDT)] and K2 = NDB/[NA(NA + NDB]

    s is the dielectric permittivity; Tand B are the top and bottom gate junctions.

    Thus considering VGSB as the fixed gate voltage and VGST as the varying gate voltage,

    = [ 21 2

    +

    1 ]2

    ---- (11)For a JFET having NDB > VPT even if NDB >

    NDB). Fig. 2(a) and (b)shows ISDS-VGST and ISD-VSD

    characteristics, respectively, calculated from the

    present model, calculated from the previous model,

    and simulated from a two-dimensional (2-D) device

    simulator MEDICI. For such a device, the previous

    and present models yield very similar results; except

    for large VGST, where the present model predicts

    slightly smaller drain currents than the previous

    model (Fig. 2(b)). This results because a large VGST

    gives rise to a relatively small VPB, and the VPB >> VPT assumption used in the previous model

    becomes questionable.

    Next we consider a four-terminal JFET (JFET-2) having NDB = 1 x 10l6

    cm-3

    , NDT = 1.5 x

    1017

    cm-3

    (e.g., NDT not much larger than NDB), but otherwise identical structure as JFET-1. Fig.

    3(a) and (b) showsISDS-VGST andISD-VSD characteristics, respectively, calculated from the present

    model, calculated from the previous model, and simulated from MEDICI. At VGSB = 0, the two

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    models have the same saturation drain current (Fig. 3(a)). As VGSB is increased, however, the

    degree of discrepancies of the two models increases with increasing VGSB and VGST. The results

    further suggest that the effective pinch-off voltage of the four-terminal JFET is smaller than that

    predicted by the previous model. This is due to the fact that the JFET considered here has a

    relatively small difference between the top- and bottom-gate doping concentrations, and thesingle-pinch-off-voltage approximation

    employed in the previous model becomes

    erroneous. For a constant VGSB of 4 V, the

    results in Fig. 3(b) indicate that the drain

    current can be greatly overestimated (i.e.,

    about 40% at VGST = 2V) if the single-pinch-

    off-voltage approach is used.

    Fig. 4 shows the relative magnitudes of

    VPT and VPB calculated as functions of VGST and VGSB for JFET-1 and JFET-2. We point out

    several important observations, which are consistent with device physics mentioned earlier. First,

    VPT

    is considerable larger than VPB

    for JFET-1, suggesting that (7) and (8) reduce to (5) and (6)

    for this device (e.g., VPB can be omitted). On the other hand, VPT can be larger or smaller than

    VPB for JFET-2, indicating the model given by (5) and (6) is not applicable for this device (e.g.,

    both VPT and VPB are important). Second, VPT is constant versus VGST because VGSB is fixed,

    whereas VPB decreases with increasing VGST. Finally, VPT and VPB for JFET-1 are larger than

    those for JFET-2 for all VGST due to the fact that JFET-1 has a lower bottom-gate doping density

    than JFET-2.

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    Electrical equivalent circuit: Fig. 5 shows the electrical equivalent circuit of a 4- terminal

    JFET. Two gates have been shown denoted by TG(top gate) and BG(bottom gate). The

    associated parasitic capacitances arising out of the substrate and gate electrode is shown.

    Fig 5. Electrical equivalent of a four-terminal JFET

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    2. Study one of the mosfet models, draw the output and transfer characteristics. Draw anequivalent circuit and describe.

    A simple MOSFET model for circuit analysis: [2]

    SHOCKLEY model for MOSFET is widely used in analytical treatments of MOSFET

    circuits. However, the model is not accurate in the short-channel region because it neglects thevelocity saturation effects of carriers. On the other hand, there are more precise MOS models

    like the SPICE LEVEL3 model, BSIM, table look-up models, and so on. However, some of them

    are time-consuming in evaluating models and some of them need a special system with a

    hardware/software combination for extracting model parameters and the number of parameters is

    large.

    In order to fill the gap between the simple Shockley model and the more precise models,

    a new model, namely, the nth

    power law MOSFET model has been discussed. The objective of

    this model is to provide a simple model which is placed just above the Shockley model.

    Model: The proposed model equations are as follows. ID is the drain current.

    = 0 + (2 2 ---- (1) = ( ) ---- (2) = ( ) ---- (3) = = 1 + ; = 0 1 ---- (4)

    :

    = 3 = 5 2 / ---- (5)

    < : Where Vgs, Vds, Vbs are gate-source, drain-source, bulk-

    source voltages respectively

    WChannel width;

    LeffEffective channel length

    VTo, , and 2F are parameters which describe the

    threshold voltage. Parameters Kand m control the linear

    region characteristics while B and n determine the

    saturated region characteristics. o and lare related to the

    finite drain conductance in the saturated region. The

    subscript 3 and 5 for ID denotes a triode and a pentode

    operating region, respectively. The validity of (3) for

    various MOSFETs is shown in Fig. 1. Fig. 1. Measured nvalue for different MOSFETs

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    An application of the model to 0.25-m MOSFETs is shown in Figs. 3and 4.

    The present model does not give a very good approximation near and below the threshold

    voltage as seen in Fig. 3. The near- and sub-threshold region modelling is not important in

    calculating delay of most VLSIs. The modelling of the

    region is important in estimating the charge decay

    characteristic of charge storage nodes but in this case a

    statistical model should be used since it is very sensitive

    to process variation.

    In the sub micrometer devices, the contact

    resistance, drain/source diffusion resistance, and hot-

    carrier-induced drain resistance are important. It is

    better for MOS model to incorporate these resistance

    effects by just modifying parameters of the model.

    An example is shown in Fig. 4. Dotted lines in

    the figure are simulated ID-VDS curves of a 0.25-m

    PMOSFET, which includes lumped resistors whose value

    is 10% of the effective MOSFET resistance inserted in the drain and the source. Solid lines in the

    figure are calculated ID-VDS curves using the present model with the modified parameter set and

    without any resistors inserted in the drain and the source. This means that the present model can

    be fitted to the measured MOSFETI-Vcharacteristics which include inseparable resistor effects,

    without adding extra nodes which are necessary when the resistor effects are modelled by

    lumped external resistors.

    The model is quite general and can be applied for GaAs FET as well. The salient feature

    of GaAs FET is that VDSAT is constant and not a function of VGS, which can be expressed by

    setting m= 0.

    Fig. 2. Vds-Idcharacteristics of 0.25-nm NMOS( VBS= 0V) Fig. 3. VGS-lD characteristics of 0.25-nm NMOS

    Fig. 4:0.25-m PMOS VDS-IDand VGS-ID characteristics

    with and without source and drain resistance.

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    Electrical equivalent of MOSFET:

    The electrical equivalent of MOSFET is as shown in the figure. Here the circuit is prepared using

    the EKV model. EKV MOSFET model is a scalable and compact simulation model built on

    fundamental physical properties of the MOS structure. This model is dedicated to the design and

    simulation of low-voltage, low-current analog, and mixed analog-digital circuits using submicron

    CMOS technologies. This figure represents the intrinsic and extrinsic elements of the MOS

    transistor. For quasi-static dynamic operation, only the intrinsic capacitances from the simpler

    capacitances model are shown here.

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    REFERENCES

    [1]. J. J. Liou and Y. Yue, An Improved Model for Four-Terminal Junction Field-Effect

    Transistors,IEEE Transaction on electron devices Vol. 43 no. 8 p. 1309 August 1996.

    [2]. Takayasu Sakurai and A. Richard Newton, A Simple MOSFET model for circuit analysis,

    IEEE Transaction on electron devices Vol. 38 no. 4 p. 887 April 1991.