div class=ts-pagebutton class=gotoPage data-page=1Page 1button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=1 data-page=1 class=ts-thumb lazyload alt=Page 1: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails1jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=2Page 2button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=2 data-page=2 class=ts-thumb lazyload alt=Page 2: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails2jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=3Page 3button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=3 data-page=3 class=ts-thumb lazyload alt=Page 3: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails3jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=4Page 4button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=4 data-page=4 class=ts-thumb lazyload alt=Page 4: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails4jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=5Page 5button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=5 data-page=5 class=ts-thumb lazyload alt=Page 5: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails5jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=6Page 6button div class=ts-imageimg data-url=assembly-issues-microvia-pad-that-at-the-fine-pitch-bga-devices-the-groundhtmlpage=6 data-page=6 class=ts-thumb lazyload alt=Page 6: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader034vdocumentsusreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails6jpg width=140 height=200 divdiv
