Contact Solutions

Gutenbergstrasse 1 D-82178 Puchheim-Munich Germany Phone: +49-(0)89-841027-0 Fax: +49-(0)89-841027-11 www.aps -munic h.com

aps Solutions GmbH

Technology for

Better Contacts

aps Solutions GmbH

Spring Pin Socket

• Crown, conical, round, ect.

• Pitch below 0,2 mm

• Kelvin Option: 0,4mm

• Temp -40°C to +150°C

• Higher temp on request

• Easy to install

• Low Resistance < 50 mOhm

• Frequency rage up to 6 Ghz

• Plunger Material : Au alloy /

PdCo Alloy / SK4 / BeCu

• Plating: Gold, Pd-Alloy, Nano,

Multilayer(4L)

BGA – LGA – SO – TSOP I & II – QFP – LCC – QFN/MLF/MLP – CSP – MCM – WLCSP Many more …

Technology for

Better Contacts

aps Solutions GmbH

U-Contact Socket

• pitch down to 0.3mm

• Kelvin: 0,4mm

• Up to 1million operations

• (on specified condition)

• High frequency Characteristics

• Bandwidth -1dB@12.8GHz

• Current up to 2A

• Inductance <0.1nH

SOP – SSOP – TSSOP – QFP – QFN – PLCC – LCC

Technology for

Better Contacts

aps Solutions GmbH

PCR Socket

BGA – LGA – QFN

• Pressure conductive Rubber

• Pitches down to 0.3mm

• Min. contact resistance: ~ 20m Ω

average ~ 40mΩ

• Up to 3000 contacts

• Max. Bandwidth: -1dB@18,3GHz

• Temperature range: -40°C – +125°C

• Life time: ~300k

• Easy to install on site

Technology for

Better Contacts

aps Solutions GmbH

WLCSP Probe Head

• Planarity: ±35µm • Bandwidth: 6 Ghz • Current Rating: >1A (0,4mm Pitch) • Pitches: < 0.2mm • Kelvin / Force & Sense (0.4mm pitch) • Lifetime: >1000k • Universal Probe Head

Technology for

Better Contacts

aps Solutions GmbH

Co-Axial Test Socket

•• FFoorr BBGGAA,,QQFFNN •• PPii ttcchh:: 00..55,, 00..6655,, 00..88,, 11..00,, 11..2277mmmm •• AApppprroopprr iiaattee ooppeerraatt iinngg ffrreeqquueennccyy uupp ttoo

1133 GGHHzz •• Impedance match:50, 75, 90

BBGGAA –– QQFFNN

Technology for

Better Contacts

aps Solutions GmbH

Package on Package

For LGA, and BGA Package Types

Bottom View

Top View

Technology for

Better Contacts

• For BGA and LGA applications • Standard Spring Pin • Kelvin options • Pitches < 0,4 mm • Kelvin / Force & Sense Pitch 0,4mm • High Current

Technology for

Better Contacts

aps Solutions GmbH

Spring Pin Probe Card

Reduced Cost of Ownership • Easy in Operation • Easy to Maintain • Seperated Die Test

• Pitches 150µm possible • Planarity ± 35µm • Bandwidth 6.1 Ghz (@-1dB) • Current Rating >1A (0,4mm Pitch) • Lifetime >1000k • Long contact travel (OD up to 200um)

Manual Option

Technology for

Better Contacts

aps Solutions GmbH

Active Thermal Control

• ATC – for monitoring the IC´s testing temperature d uring characterization

• Max Temperature range (without loading): -60°C - +1 75°C • Temperature Accuracy: +-0,1°C (constant loading) • TEC cooling power (customized selection): 460W max • Termerature input: t-Type termocouple • Ramping time (without loading): • ambient to +175°C: ~200sec • ambient to -60°C: ~400sec • Die Crack prevention • Over Temperature protection • Customized software GUI • Manual • Semi – Automatic • Automatic

Cleaning of Spring pin and rigid pin test sockets

aps Solutions GmbH

Laser Cleaning

Technology for

Better Contacts

Principle:

Uses Flat Top Laser Beam (collimated—non focused)

with hybrid waveleng th and shockwave effect.

Result:

Handheld Scan System

Options:

RReeffrreesshhmmeenntt && rreeppaaii rr :: Options: • needle adjustment

• pin count 1-20 • pin count 22-30

• exchange of Pcb and needle adjustment • pin count 1-20 • pin count 22-30 • exchange of all needles (all other parts remain) • per # of pins • exchange of pcb and all needles • per # of pins • all components of test head have to be replaced (like new probe head) • per # of pins We produce, repair and refresh various types of Kelvin-Contact-Sets with tungsten probes for specific test handlers.

aps Solutions GmbH

Kelvin – Contact - Set

Technology for

Better Contacts