application of accelerated testing and modeling to ... · this presentation was given at the 2014...
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2014 CONFIDENTIAL | 1 2014 CONFIDENTIAL | 1
T. Paul Parker – SolarBridge Technologies
NREL PV Module Reliability Workshop
February, 2014
APPLICATION OF ACCELERATED
TESTING AND MODELING TO
RELIABILITY ANALYSIS OF
MICROINVERTERS
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2014 CONFIDENTIAL | 2
• Predicting Microinverter Lifetime
• Design Parameters / Field Use Conditions
• Phoenix AZ Case Study
• Reliability Modeling
• Validation using Accelerated Testing
OUTLINE
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2014 CONFIDENTIAL | 3
Predicting Microinverter Lifetime
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2014 CONFIDENTIAL | 4
BATHTUB CURVE AND TYPICAL FAILURE
MECHANISMS FOR POWER PRODUCTS
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• No generic reliability models for Power Electronics Reliability
• Traditional MTBF models (MIL-217, Telcordia SR332, etc)
• Not applicable to predicting useful life
• Marginal effectiveness predicting steady state failure mechanisms
• Each MI component has a unique set of failure mechanisms
• Intrinsic mechanisms limit the lifetime of an inverter
• 100% of units produced are at risk
• Cumulative failure of >1% for a given wearout mechanism
considered end of life
• Extrinsic mechanisms are often due to quality excursions of
component suppliers or contract manufacturer
• Small populations at risk, (typically <0.1%)
• Typical Annualized Failure Rate (AFR) <0.2% for all failure
mechanisms
PREDICTING PV MICROINVERTER (MI) LIFETIME
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• Step 1: Review all known intrinsic wearout mechanisms
• Solder joint fatigue, Film / Electrolytic capacitance reduction, PCB
via fatigue, Time Dependent Dielectric Breakdown, etc,
• Step 2: Define failure
• Solder Joint – hard failure or measurable loss of energy harvest
• Step 3: Measure field stresses associated with failure mechanism
• Solder joint
• Minimum and maximum temperature
• Diurnal Δ temperature
• Ramp rate and dwell times
• Step 4: Identify appropriate solder joint reliability model
• Step 5: Perform accelerated test to validate model
LIFETIME PREDICTION AND TEST VALIDATION
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2014 CONFIDENTIAL | 7
Design Parameters /
Field Use Conditions
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• Inverter Electrical Parameters
• Power dissipation = f(insolation, efficiency, module power)
• Component Temperature (min, max, ΔT) =
f(power, ambient temperature, wind velocity, module rooftop
gap)
• Material parameters (PCB, solder, components, chassis,
potting, etc.)
• CTE, hardness, Young’s modulus, Tg, etc.
• Environmental conditions
• Ambient Temperature
• Wind velocity (affects internal component temperature)
• Relative Humidity
• Insolation
DESIGN PARAMETERS / FIELD USE CONDITIONS
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• Inverter reported parameters
• Voltage, current, power, component voltage / temperature
SOURCES OF DATA
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• NREL Solar Radiation Data Manual for Flat-Plate and
Concentrating Collectors, Report NREL/TP--463-5607, 1994
• Atlas Material Testing Technology LLC
REGIONAL ENVIRONMENTAL DATA
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Phoenix AZ Case Study -
SolarBridge Microinverter
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2014 CONFIDENTIAL | 12
SOLARBRIDGE AC MODULE
2011 CONFIDENTIAL | 12
POWER PORTAL
POWER MANAGER
AC MODULES
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2014 CONFIDENTIAL | 13
PHOENIX AZ
42 MODULE ACPV INSTALLATION
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2014 CONFIDENTIAL | 14
SOLARBRIDGE POWER PORTAL VIEW
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2014 CONFIDENTIAL | 15
FULL YEAR PHOENIX AZ AMBIENT TEMPERATURE 5 MINUTE SAMPLE INTERVAL (SOURCE – ATLAS)
August
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2014 CONFIDENTIAL | 16
AUGUST ‘13 AMBIENT TEMP / INSOLATION
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2014 CONFIDENTIAL | 17
FULL YEAR SOLDER JOINT TEMPERATURE 5 MINUTE SAMPLE INTERVAL
August
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2014 CONFIDENTIAL | 18
AUGUST ‘13 MI DC POWER /
COMPONENT TEMPERATURE
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2014 CONFIDENTIAL | 19
ΔT = 51°C
DAILY POWER / TEMPERATURE FLUCTUATION
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DAILY SOLDER JOINT ΔT
2/19/13 – 2/18/14
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2014 CONFIDENTIAL | 21
MONTHLY AVERAGE SOLDER JOINT ΔT
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Solder Joint Reliability Modeling
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• Step 4: Identify appropriate solder joint reliability model
• Norris Landzberg
• N Pan, et.al, “An Acceleration Model for Sn-Ag-Cu Solder Joint
Reliability Under Various Thermal Cycle Conditions”, SMTA
International, 2005.
• ANSYS Finite Element Analysis
• B. Zahn, “Impact of Ball Via Configurations on Solder Joint
Reliability in Tape-Based CSP”, ECTC, 2002
• Cumulative Strain Energy Damage
• N. Blattau, C. Hillman, “An Engelmaier Model for Leadless Ceramic
Chip Devices with Pb-free Solder”, IPC/JEDEC Lead Free
Conference, 2006.
• DfR Solutions Sherlock
• R. Schueller, C. Tulkoff, “Automated Design Analysis:
Comprehensive Modeling of Circuit Card Assemblies, APEX, 2011
LIFETIME PREDICTION AND TEST VALIDATION
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SOLDER JOINT FAILURE DISTRIBUTION
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Validation Using Accelerated Testing
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• Necessary for detection of intrinsic failure mechanisms
in a short amount of time
• Requirements:
• Powering and monitoring to detect intermittents
• Multiple test environments
• Thermal cycle
• High temperature
• Temperature Humidity
• Salt Fog
• Random Vibration
• Requires testing beyond specification
• Risk of false failures
ACCELERATED TESTING
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IEC 62093* PV INVERTER BOS / ENVIRONMENTAL TEST
STANDARD
• Thermal Cycle (TC)
• -40°C to 85°C
• Purpose: identifies mechanisms related to thermal mechanical cyclic
fatigue such as solder joints and PCB vias
• Acceleration factor 10x – 30x typical
• Highly Accelerated Life Test (HALT)
• High Temperature Operating Bias (HTOB)
• Damp Heat (DH)
• Humidity Freeze (HF)
• Salt Mist
• UV
Notes:
-UL 1741 / IEC 62109 do not have accelerated test requirement,
they address safety only
-Acceleration factors must be developed for each failure mechanism;
-Recommend Weibull analysis using multiple stress conditions
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2014 CONFIDENTIAL | 28
• Confirmation of useful life requires an understanding of
all potential intrinsic wearout mechanisms
• Each failure mechanism requires
• An understanding of physics of failure
• Appropriate model capable of predicting time to failure
• Field use conditions
• Accelerated test method to speed time to detect failure
• Acceleration factors to predict time to failure
• Actual field reliability data to validate model and test
SUMMARY