appendix 3. electrical subsystem - juxi...

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Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter Datasheet p1 3.2 LS 14250 Batteries Datasheet p1 3.3 High Precision Accelerometers Datasheet p1 3.4 Accelerometer Pack ASC 5721 Datasheet p1 3.5 Compass Datasheet p1 3.6 Voltage regulators Datasheet p1 3.7 Linear 3 axis Accelerometer Datasheet p1 3.8 Voltage regulators Datasheet p1 3.9 LPC2364 Microcontroller Datasheet p1 3.10 Molex Memory Card pcb mount 3.11 PCB Board Top and Bottom Signal Layers 3.12 PCB Board Power Layer and Ground Plane 3.13 FISH Schematic part 1 3.14 FISH Schematic part 2 3.15 FISH Schematic part 3 3.16 PCB Front 3D Simulation 3.17 PCB Back 3D Simulation 3.18 PCB Side 3D Simulation 3.19 Part list w/ prices 3.20 Requirements Verification Table 3.21 Test Chart Flow 3.22 Calibration System Picture 3.23 Test Descriptions 3.24 Components Derating 3.25 Datasheets Main Payload

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Page 1: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Appendix 3.

Electrical Subsystem

3.1 Analog to Digital Converter Datasheet p1

3.2 LS 14250 Batteries Datasheet p1

3.3 High Precision Accelerometers Datasheet p1 3.4 Accelerometer Pack ASC 5721 Datasheet p1

3.5 Compass Datasheet p1

3.6 Voltage regulators Datasheet p1

3.7 Linear 3 axis Accelerometer Datasheet p1

3.8 Voltage regulators Datasheet p1

3.9 LPC2364 Microcontroller Datasheet p1

3.10 Molex Memory Card pcb mount

3.11 PCB Board Top and Bottom Signal Layers

3.12 PCB Board Power Layer and Ground Plane

3.13 FISH Schematic part 1

3.14 FISH Schematic part 2

3.15 FISH Schematic part 3

3.16 PCB Front 3D Simulation

3.17 PCB Back 3D Simulation

3.18 PCB Side 3D Simulation

3.19 Part list w/ prices

3.20 Requirements Verification Table

3.21 Test Chart Flow

3.22 Calibration System Picture

3.23 Test Descriptions

3.24 Components Derating

3.25 Datasheets Main Payload

Page 2: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.1 Analog to Digital Converter Datasheet p1

Page 3: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.2 LS 14250 Batteries Datasheet p1

Page 4: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.3 High Precision Accelerometers Datasheet p1

Page 5: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.4 Accelerometer Pack ASC 5721 Datasheet p1 (Based in

Colibrys, only difference with ASC 5421 is the size)

Page 6: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.5 Compass Datasheet p1

Page 7: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.6 Voltage regulators Datasheet p1

Page 8: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.7 Linear 3 axis Accelerometer Datasheet p1

Page 9: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.8 Voltage regulators Datasheet p1

Page 10: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.9 LPC2364 Microcontroller Datasheet p1

Page 11: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.10 Molex Memory Card pcb mount

Page 12: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.11 PCB Board Top and Bottom Signal Layers

3.12 PCB Board Power Layer and Ground Plane

Page 13: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.12 PCB Board All Layers

Page 14: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.13 FISH Schematic part 1

Page 15: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.14 FISH Schematic part 2

Page 16: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.15 FISH Schematic part 3

Page 17: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.16 PCB Front 3D Simulation

Page 18: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.17 PCB Back 3D Simulation

Page 19: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.18 PCB Side 3D Simulation

Page 20: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.19 Part list w/ prices

Page 21: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Part # Description Company provider

Price

Eur Qty Total

Accelerometer Colibrys

Precise accelerometer,10mg

bias,40Hz bandwidth ASC GmbH ASC GmbH 1000 1 1000.00

TMP275

Precise temperature sensor,i2c,

o.5 accuracy TI Farnell 4.68 1 4.68

LIS3L02AQ3

Medium-g, 3 axis, high

bandwidth ST Farnell 25.99 1 25.99

ADC1274

Precise,wide bandwidth

converter,sync mode 4 Channel Farnell 45.64 1 45.64

batteries saft 0.00

micro lpc2368 Philips Farnell 11.68 1 11.68

memory mount microSD Molex Farnell 3.19 1 3.19

memory microSD 1GB - 2GB Sandisk VerkkoKaupa 10 1 10.00

INA128UAE4 Opamp TI Farnell 6.26 3 18.78

HMC6352 Compass I2C Honeywell Farnell 110.98 1 110.98

Capacitor 22pF, Ceramic, 0805, 100V AVX Farnell 0.11 4 0.44

Capacitor 1uF, ceramic, 0805, 25V AVX Farnell 0.112 12 1.34

Capacitor 10uF, ceramic, 0805, 16V AVX Farnell 0.24 2 0.48

Capacitor 0.1uF, Ceramic, 0805, 50V AVX Farnell 0.24 4 0.96

Resistor 10Kohm,0805, 0.125W, 150V Yageo Farnell 0.054 15 0.81

LD1117AV18 1.8V Regulator ST Farnell 1.42 1 1.42

LM1086IT-3.3/NOPB 3.3V Regulator ST Farnell 2.83 1 2.83

LM1086IT-5.0/NOPB 5.0V Regulator ST Farnell 2.94 1 2.94

ADR445 B grade

Precise 5V reference,2mV max

error,10mA source

Vin Max

18V 10.09 1

3.20 Requirements Verification Table

Page 22: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Electrical

Subsystem

Req. ID # Test

ID # Test Title Test Model

Verified

by

Design

(YES/NO)

Verified by test

(PASS/FAIL/NYA)

Responsible

Member

F.E.6 , F.E.9 ,

F.E.15, T.E.7 E.1 Subsystem Basic FISH and MAIN David/Mikulas

F.E.1, T.E.1 ,

T.E.2, T.E.3 ,

T.E.4m O.E.2 E.2 Sensor Basic FISH and MAIN David/Mikulas

F.E.10 , F.E.11 ,

O.E.6 E.3 Motor Basic MAIN Mikulas

F.E.12 , O.E.1 ,

O.E.3 E.4 Battery Charging /Discharging

Electronics Test

Bench David/Mikulas

O.E.4 E.5 Battery Thermo Shock

Electronics Test

Bench David/Mikulas

O.E.4 E.6 Battery Temperature

Electronics Test

Bench David/Mikulas

O.E.4 E.7 Battery Drop

Electronics Test

Bench David/Mikulas

F.E.1, T.E.1 ,

T.E.2, T.E.3 ,

T.E.4 E.8

Data Acquisition AC and DC

Calibration FISH David

F.E.2 , F.E.3 E.9 Data Acquisition Data Rate FISH David

F.E.4 E.10 Communication Synchronization FISH and MAIN David/Mikulas

F.E.4,T.E.6 E.11 Communication Distance vs Data Rate FISH and MAIN David/Mikulas

F.E.4,T.E.6 E.12 Communication Interference FISH and MAIN David/Mikulas

F.E.16 E.13 Power Supply Capacity FISH and MAIN David/Mikulas

F.E.16 E.14 Power Supply Maximal Current FISH and MAIN David/Mikulas

F.E.16 E.15 Power Supply Voltage Regulators FISH and MAIN David/Mikulas

F.E.1, T.E.1 ,

T.E.2, T.E.3 ,

T.E.4 E.16 Accelerometer Temperature Stability FISH David

F.E.1, T.E.1 ,

T.E.2, T.E.3 ,

T.E.4 E.17 Accelerometer Bias FISH David

F.E.7 E.18 Optical Proximity Sensors MAIN Mikulas

F.E.8, F.E.14 E.19 Hall Proximity Sensors MAIN Mikulas

E.20 Magnetic Compass MAIN Mikulas

3.21 Test Chart Flow

Page 23: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.21 Calibration quote

Page 24: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.22 Calibration System Picture

Page 25: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter
Page 26: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

3.23 Test Descriptions

ID T01

Name Performance of Data Acquisition System Components Tested

Analog to Digital Converter TI ADS1278, Precision Voltage Reference TI REF5025, Precise Instrumentation Amplifiers

Purpose To test and evaluate overall performance of Data Acquisition system

in both DC and AC measurement with the variable temperature.

Justification Objectives regarding precision

Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature between -40 and +20 deg C

Required Resources

HP 34401A

GPIB- USB converter

PC with USB interface

HP 33220A Function/Arbitrary Waveform Generator

Tested components

Microcontroller LPC2368

USB-RS232 Converter

Temperature Chamber

Temperature Sensor number

NI LabWindows™/CVI

Matlab

Unsecured Resources

Unsecured does it mean that we have not bought it yet (in that everything is unsecured)?

Date Duration 1 day Dependencies Participants Mikulas Jandak, and / or David Leal Procedure a) Signal generator is to set to the voltage of 2.5V

b) Signal Generator HP33220A 1 is to be connected to the

channel 0 on the analog front part of the tested data

acquisition

c) Reference Millimeter HP 34401A 1 is to be connected to the

Signal Generator 1

d) RS-232/USB Converter is to be used for connection between

PC and microcontroller

e) Signal Generator HP33220A 2 is to be connected to the

channel 2 of the analog front part of the data acquisition

system. The reference signal is to be 1V peak-peak sin with

the frequency of 100Hz

f) Reference Millimeter HP 34401A 2 is to be connected to the

Signal Generator 1

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g)

h) Measurement is to start by applying peak DC Voltage on the

Channel 0 on the analog front part. Microcontroller starts

sending data to PC with corresponding time stamps. The

sampling rate is to be 1kHz. Microcontroller is to also

measure temperature connected via SPI interface at the rate

of 1Hz.

i) Temperature is to change from -20 to +40 with the change of

1deg/minute?

Expected Results

The measured voltages by ADC TI ADS1278 and reference

multimeters of both AC and DC signal should be similar and there

should be only small variation with the temperature.

ID T02 Name Performance of Data Acquisition System Components Tested

Analog to Digital Converter TI ADS1278, Precision Voltage Reference TI REF5025, Precise Instrumentation Amplifiers

Purpose To test reliability of the communication between ADC,

microcontroller and external memory under varying work load. To

test microcontroller capabilities when processing data.

Justification Objectives regarding sampling rate

Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25 deg C Required Resources

Microcontroller NXP LPC2368

AD Converter ADS1278

Micro SD card

HP 33220A Function/Arbitrary Waveform Generator

GPIB- USB converter

PC with USB interface

GCC compiler

MatLab

Unsecured Resources

Date Duration 1 day

Dependencies T01 Participants Mikulas Jandak, and / or David Leal Procedure a) Signal Generator HP33220A 1 is to be connected to

channel 0 of the AD Converter

b) Signal Generator HP33220A 1 is to be interface with PC

via GPIB-USB converter

c) Signal Generator HP33220A 2 is to be connected to the

Page 28: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

external interrupt pin of the microcontroller

d) Signal Generator HP33220A 2 is to be interface with PC

via GPIB-USB converter

e) Sine wave of frequency of 250Hz is to be used as a

reference signal

f) TTL signal of variable frequency is to be used to impose

work load on the microcontroller by the means of

executing high priority interrupt routine, which should

last 500us.

g) Microcontroller is to sample all 8 channels with the

sampling frequency of 1kHz

h) The frequency of the TTL signal is to be changed in

discrete intervals of 5s from 1kHz to 50kHz with the step

of 10kHz.

i) All data are to be saved on the SD card and after the

measurement transfer to PC

j) Data is to be analyzed with the help of Matlab.

Evaluation is based on examining total harmonic

distortion(THD) of sampled sine waves

Expected Results

The sampled sine waves should show certain THS when the

microcontroller is not able to proceed all channel in real time.

ID T03 Name Components Tested

Analog to Digital Converter TI ADS1278, Precision Voltage Reference TI REF5025, Precise Instrumentation Amplifiers

Purpose To test the interference between channel 14 (2470MHz), 15

(2475MHz) and 16 (2480MHz) of the 2.4Ghz band.

Justification Constraint regarding EMC Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25 deg C

Required Resources

XBee Starter Development Kit

2x PC

Microcontroller NXC LPC2368

Spectrum Analyzer #

HP 33220A Function/Arbitrary Waveform Generator

2.4GHz omnidirectional antenna with BNC connector

Matlab

Unsecured Resources

Date

Duration 10 hours

Page 29: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) XBee evaluation boards are to be connected to PCs

b) PC starts sending sequence of known data to other Zigbee in

loop using only channel 15 (16) with the data rate of 115kb/s

c) Zigbee 2 is in close proximity to Zigbee 1 and is to receive

data and logged the number of data lost.

d) Procedure b) to c) is to be repeat with the third Zigbee

connected to microcontroller, which sends random

sequence in a loop. Alternatively, the interference could be

induced by signal generator with 2.4GHz omnidirectional

antenna (if powerful enough)

e) The data lost is to be analyzed with respect to the

interference. The interference could be visually inspected by

using spectrum analyzer.

Expected Results

The interference between channel should be miniscule (-28dB

crosstalk between) and both times should be almost identical with

only small variation

ID T04 Name Synchronization Test

Components Tested

Maxstream XBee OEM RF module with whip antenna 2xMircocontroler NXC LPC2368

Purpose To test the delay of communication subsystems within certain

temperature range and data rate for the synchronization purposes.

Justification There should be something about the correlation between xyz and xyz of the fish –flight simulator

Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C Required Resources

2 x XBee development boards

2xMircocontroler NXC LPC2368

Unsecured Resources

Date

Duration 10 hours Dependencies

Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Both Zigbee modules set the communication rate to the

fix value

b) First Zigbee after receiving 1 Byte from second one,

sends 1 Byte to second one. Both keep track of the time

when received the packet

c) Procedure above will be repeated for different data

Page 30: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

rates and different temperature (room temperature, two

different outside temperature)

d) Analysis based on the correlation between data rate and

ambient temperature

Expected Results

The delay should be mainly function of the delay caused by the

reaction of the communication subsystem (UART, interrupts) and

independent of the data rate. There may be negligible correlation

between temperature and delay. The delay should be constant for all

packets.

ID T05

Name EMC Test

Components Tested

Entire electrical subsystems with motors

Purpose evaluate the EMI caused by motors, magnets and rapidly changing

electrical field

Justification EMI within the required range Location Lulea EMC chamber

Conditions Normal humidity, Normal pressure(this refers to normal pressure and humidity), Temperature 25,0 and -10 deg C

Required Resources

EMI chamber

Unsecured Resources

EMI chamber

Date Duration 1 day Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Entire electronic and motors are to be put into shielded EMI

chamber

b) The EMI radiation is be measured when the motors are

turning on and off.

Expected Results

The result should be a variable level of EMI. The level of EMI should

be highest when the motor s are turn on.

ID T06 Name Maximal Current Test

Components Tested

Entire electrical subsystems with motors

Purpose evaluate the EMI caused by motors, magnets and rapidly changing

Page 31: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

electrical field

Justification Battery safety issue Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C Required Resources

HP 34401A

1Ohm 20W sensing resistor

Motor

Power Supply Pack

Unsecured Resources

Date Duration 2 hours Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Shaft of the motor is to be fixed so it cannot spin.

b) Motor is to be connected to power supply pack capable of

delivering high current (>20A) for short period of time (long

enough to measure the current).

c) Current is to be measured as a voltage drop across the

sensing resistor by the multimeter.

Expected Results

The in-rush current should not be higher than stall current stated in

the motor datasheet.

ID T07 Name Maximal Current Test

Components Tested

Entire electrical subsystems with motors.

Purpose Evaluate the EMI caused by motors, magnets and rapidly changing

electrical field.

Justification Battery safety issue

Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C. Required Resources

HP 34401A

1Ohm 20W sensing resistor

Motor

Power Supply Pack

Unsecured Resources

Date Duration 2 hours Dependencies

Page 32: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Shaft of the motor is to be fixed so it cannot spin.

b) Motor is to be connected to power supply pack capable of

delivering high current (>20A) for short period of time (long

enough to measure the current).

c) Current is to be measured as a voltage drop across the

sensing resistor by the multimeter.

Expected Results

The in-rush current should not be higher than stall current stated in

the motor datasheet.

ID T08

Name Power Budget Test

Components Tested

Power Supply Pack

Purpose To test capacity and reliability of power supply with respect to the

low temperature.

Justification Battery safety issues Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C. Required Resources

2x HP 34401A

GPIB/ USB converter

GPIB –GPIB connecting cable

8Ohm 20W resistor

Power Supply Pack

Low Temperature Chamber

NI LabView

Unsecured Resources

Gas for the temperature chamber

Date Duration 10 hours Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Power pack with sensing resistor should be put into low

temperature chamber.

b) Multimeters should be connected to PC and program written

in NI LabView is to be used to acquire the data. The

multimeters should monitor with the sampling rate of 1Hz

current and voltage.

c) After the voltage reaches x volt the experiment is to be ???

d) The capacity of the battery pack is to be evaluated with

respect to the voltage across the battery pack

Expected The capacity of the battery pack should be reduced by 20%. The

Page 33: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Results battery pack should operate during whole experiment and it should

be able to deliver 3A of current. There should be clear correlation

between the voltage across the battery pack and the battery

capacity.

ID T08 Name Power Budget Test

Components Tested

Power Supply Pack

Purpose To test capacity and reliability of power supply with respect to the

low temperature

Justification Battery safety issues

Location IRF Electronic Lab Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C Required Resources

2x HP 34401A

GPIB/ USB converter

GPIB –GPIB connecting cable

8Ohm 20W resistor

Power Supply Pack

Low Temperature Chamber

NI LabView

Unsecured Resources

Gas for the temperature chamber

Date

Duration 10 hours Dependencies

Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Power pack with sensing resistor should be put into low

temperature chamber

b) Multimeters should be connected to PC and program written

in NI LabView is to be used to acquire the data. The

multimeters should monitor with the sampling rate of 1Hz

current and voltage.

c) After the voltage reaches x volt the experiment is to be ???

d) The capacity of the battery pack is to be evaluated with

respect to the voltage across the battery pack

Expected Results

The capacity of the battery pack should be reduced by 20%. The

battery pack should operate during whole experiment and it should

be able to deliver 3A of current. There should be clear correlation

between the voltage across the battery pack and the battery

capacity.

ID T09

Page 34: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Name Heat Dissipation Test

Components Tested

Voltage Regulators

Purpose To make sure the amount of heat needed to be dissipated can be

done so properly.

Justification Ensure proper regulator operation

Location IRF Electronic Lab Conditions Normal humidity, Varying pressure from normal, to expected

pressure at maximum height, Normal room Temperature. Required Resources

HP 34401A

Resistor equivalent to the load as seen from the regulator

Voltage source

Temperature sensors

Low pressure chamber

NI LabView

GPIB –GPIB connecting cable

GPIB/ USB converter

Unsecured Resources

Low pressure chamber

Date

Duration 10 hours Dependencies Participants Mikulas Jandak, and / or David Leal, technicians

Procedure a) Setup the voltage regulator with the corresponding resistor.

b) Multimeters should be connected to PC and program written

in NI LabView is to be used to acquire the data. The

multimeters should monitor with the sampling rate of 1Hz

current and voltage.

c) Set Temperature sensors on the regulator

d) As the pressure on the chamber decreases, the electrical and

physical properties of the regulator will be measured and

evaluated.

Expected Results

The voltage regulators should be able to properly dissipate the heat

that results from the voltage conversion, and this way, continue to

operate properly during the entire test. In case the heat cannot be

properly dissipated, heat sinks will be added and the test redone.

ID T10 Name Regulator Low Voltage performance

Components Tested

Voltage Regulators

Purpose To test what the voltage threshold when the systems will stop

operating.

Justification Ensure proper regulator operation Location IRF Electronic Lab

Conditions Normal humidity, , Normal pressure(this refers to normal pressure and humidity), Regular room temperature.

Page 35: Appendix 3. Electrical Subsystem - Juxi Leitnerjuxi.net/projects/SMRT/bexus/CDR/reel.SMRT_Appendix3_Electrical.pdf · Appendix 3. Electrical Subsystem 3.1 Analog to Digital Converter

Required Resources

HP 34401A

Resistor equivalent to the load as seen from the regulator

Voltage source

NI LabView

GPIB –GPIB connecting cable

GPIB/ USB converter

Unsecured Resources

Date Duration 2 Hours Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Setup the voltage regulator with the corresponding resistor.

b) Multimeters should be connected to PC and program written

in NI LabView is to be used to acquire the data. The

multimeters should monitor with the sampling rate of 1Hz

current and voltage.

c) Voltage being fed into the regulator will vary to find the real

limits at which the voltage regulator will still work properly.

Expected Results

The Voltage regulator should be able to work with over voltage, and

should be able to work properly with voltage as low as the desired

voltage plus the voltage drop in the device.

ID T11

Name Emergency Parachute deploying system

Components Tested

Emergency Parachute deploying system

Purpose To make sure the parachute deploying system works properly.

Justification Make sure the Emergency parachute deploying system works properly, to eliminate the risk of the FISH going into freefall and being a security threat to people.

Location IRF Electronic Lab Conditions Normal humidity, , Normal pressure(this refers to normal

pressure and humidity), Regular room temperature. Required Resources

Signal Generator

Emergency Parachute deploying system

Unsecured Resources

Date Duration 2 Hours Dependencies Participants Mikulas Jandak, and / or David Leal, technicians Procedure a) Send a signal to the system that would correspond to the

signal send by the free fall detector when in free fall.

b) Send random data, test for possible failures.

Expected The system should be triggered only by detecting the payload has

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Results been in free fall for more that one minute.

Battery Test

ID B01 Name Battery Temperature Test

Components Tested

Power Supply Pack

Purpose To test capacity and reliability of power supply with respect to the

low temperature

Justification Battery safety issues Location Kiruna, dormitory Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 25,0 and -10 deg C Required Resources

Metal Container

Battery Pack

Freezer

Oven

Unsecured Resources

Date

Duration 21 hours Dependencies Participants Mikulas Jandak, Jan Speidel Procedure a) Fully charged battery in the metal container is to be stored

in the temperature of -18 in the freezer for 2 hours

b) Battery is to be then stored in the temperature of +50 in the

oven.

c) The procedure above is to be repeat 5 times

Expected Results

There should be no electrolytes leakage

ID B02 Name Battery Drop Test

Components Tested

Power Supply Pack

Purpose To ensure that the battery pack is capable of surviving high level of

vibration

Justification Battery safety issues Location Kiruna Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 0 deg C Required Resources

Battery Pack

Unsecured Resources

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Date Duration 20 hours Dependencies Participants Mikulas Jandak Procedure Drop the battery from 10m height onto concrete surface

Expected Results

There should be no electrolytes leakage, no explosition, no fire

ID B03 Name Battery Thermo Shock Test

Components Tested

Power Supply Pack

Purpose To test safety performance of the power pack

Justification Battery safety issues Location Kiruna, dormitory Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 0 deg C Required Resources

Battery Pack

Metal Container

Temperature sensor

Oven

Unsecured Resources

Date Duration 2 hours Dependencies Participants Mikulas Jandak Procedure a) The battery in the metal container is to be put in the oven

b) The temperature of the oven is to be raised at 5±1℃ per minute to

a temperature of 130±2℃ and remain there 60 minutes.

Expected Results

There should be no electrolytes leakage, no exposition, no fire

ID B04

Name Battery Discharging test

Components Tested

Power Supply Pack

Purpose To test safe charging and discharging of the battery power supply

pack

Justification Battery safety issues Location IRF Electronic lab, Kiruna Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 0 deg C Required Resources

Battery Pack

2x multimeter HP 34401A

Smart Charger (1.5A) for 11.1V Li-ion/Polymer Rechargeable Battery

Pack

Resistor

Unsecured Resources

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Date Duration 5 hours Dependencies Participants Mikulas Jandak Procedure a) The battery pack is to be charge by the smart charger, the current

and the voltage across the batter is to be monitor

b) When the charger indicates complatition, the current must drop to 0

and the voltage across battery must be less than 12.7 V

c) The battery pack is to be discharge at the approximate discharge

rate of 1C (2.2A) through the resisitor

d) When the voltage reaches 7.2V, the PCM (protection circuit

module) should disconnect the battery pack so no current should

flow through the resisitor.

Expected Results

The PCM should not allow the battery to be deeply discharge and

overcharge

Sensor Test, Calibration

ID S01 Name Infrared sensor calibration test

Components Tested

Sharp GP2D120

Purpose To test behavior of optical sensor with respect to temperature and

to test reaction of the system., to set threshold constant for ADC

Justification Overall objectives

Location IRF, Kiruna Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 0 deg C,-20 deg C Required Resources

GP2D120

Multimeter HP 34401A

Assembled main payload and fish

Freezer

Ruler

Unsecured Resources

Date Duration 3 hours

Dependencies Participants Mikulas Jandak

Procedure a) The output of GP2D120 is to be measured with anything in the

sensor proximity. The measurement is to be repeated for several

turn on/off cycles. The output is to be measured by multimeter HP

34401A.

b) The procedure a) is to be repeated but with the fish in the entrance

to the main payload.

c) The appropriate threshold from the sensor is set and the reaction

time is to be evaluated. The delay is proportional to the distance

between bottom of the main payload and the fish. When the

approaching fish is sensed by the sensor, the main reeling motor is

to be stopped and the distance is to be measured. This is repeated

for several turn on/off cycles.

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d) The sensor is put into a freezer for 1 hour in the temperature -20

deg C and the procedures above are to be repeated.

Expected Results

The reaction time should be constant for both 20 deg and -20 deg C

and there should be clear difference in the output of the sensor

when the fish is in the entrance and there is nothing in the close

proximity.

ID S02 Name Hall sensor calibration test

Components Tested

Radiometric Linear Hall Effect Sensor A1321

Purpose To test the behavior of hall sensors with respect to temperature, the

distance between the sensor and the magnet, and the operation of

the motor.

Justification Overall objectives Location IRF, Kiruna Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature 0 deg C,-20 deg C Required Resources

A1321

Multimeter HP 34401A

Counter

Assembled main payload

Freezer

Ruler

Unsecured Resources

Counter

Date Duration 10 hours Dependencies

Participants Mikulas Jandak Procedure a) The motor is off. The output of the hall sensor is to be measured by

HP 34401A with respect to the distance between the magnet

mounted on the bail and the number of pulses provided by the

incremental sensor mounted on the shaft. The pulses are to be

measured by the counter.

b) The emergency motor is to be put in proximity to the hall sensor

and the procedure a) is to be repeated.

c) The reel with hall sensors and motors is to be put into freezer in the

temperature of -20 deg and the procedure a) and b) is to be repeated

Expected Results

There should be linear dependency among the distance of the

magnet, number of pulses and the sensor voltage. The temperature

should have negligible effect of the output voltage.

ID S03 Name Inertial sensors bias temperature stability

Components Tested

MS8002.D, ADXRS150, LIS3L02AQ3

Purpose To measure the bias temperature coefficient.

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Justification Overall objectives (precision) Location IRF, Kiruna Conditions Normal humidity, Normal pressure(this refers to normal

pressure and humidity), Temperature -40 deg C 85 deg C Required Resources

ADXRS150(6x)

LIS3L02AQ3(2x)

MS8002.D(1x)

15 x Multimeter HP 34401A

GPIB/USB converter

GPIB/GPIB connections cables

1x PC

Low temperature chamber

Precise temperature sensor

Oven

NI LabWindows™/CVI

Matlab

Unsecured Resources

Precise temperature sensor

Date It could accompanied other tests in the low temperature chamber which not produce vibrations

Duration 1-2days Dependencies

Participants Mikulas Jandak Procedure a) Inertial sensor are to be put into the low temperature chamber

b) The temperature, the voltages from 15 different sources (6 gyros, 3

3-axis accelerometers) are to be simultaneously measured by HP

34401A at the rate of 10Hz.

c) The temperature is to be changed from +25 de C to -40 deg C

d) The procedures above are to be repeated in the oven with the

temperature change between +25 to +80 for almost identical

position of the accelerometers.

e) The noise is to be filtered in matlab and the temperature bias

coefficient is to evaluated

Expected Results

The temperature bias coefficient should be linear within -40 to +80

range and it should be within the value specified in the datasheet.

ID S04 Name The calibration of the compass

Components Tested

Honeywell HMC6352

Purpose To calibrate the compass with the respect to the small magnet

positioning in the entrance to the main payload. To select

appropriate magnet in terms of size and optimally position it.

Justification Overall objectives (flight simulator) Location IRF, Kiruna

Conditions Normal humidity, Normal pressure(this refers to normal pressure and humidity), Temperature -40 deg C 85 deg C

Required Resources

Angular ruler

Assembled platform

Unsecured

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Resources Date Duration 1 days Dependencies Participants Mikulas Jandak

Procedure a) The heading of the magnetometer is to be measured with respect to

the position and size of the magnet

b) The true heading is to be measured by angular ruler

Expected Results

The temperature heading should show precision of less than 5 deg.

ID S05 Name Accelerometer bias calibration test

Components Tested

MS8002.D

Purpose To measure the bias of the precise accelerometer

Justification Overall objectives (axis alignment) Location IRF, Kiruna

Conditions Normal humidity, Normal pressure(this refers to normal pressure and humidity), Temperature 20 deg C

Required Resources

Rotating platform

MS8002.D(1x)

Microcontroller LPC2368, AD Converter ADIS2178 and its analog front

part, micro sd card

NI LabWindows™/CVI

Matlab

Unsecured Resources

Rotation platform

Date Duration 1days Dependencies

Participants Mikulas Jandak Procedure a) MS8002.D with the microcontroller and the analog/digital converter

is to be put onto the platform which is positioned vertically with

respect to the surface

b) MS8002.D is to be fixed so it cannot move and the the z-axis is

positioned perpendicular to the rotation axis so the change in the

acceleration is maximal.

c) The platform I to be rotated at the constant speed of 1 Hz.

d) The acceleration from all 3 axis is to be measured at the rate of

10kHz and stored at external memory

e) The data is to be filtered and proceeded in matlab and the dc

components is to be determined.

Expected Results

The DC components of the measured acceleration should be within

the range stated in the datasheet and used as a value for 0g

acceleration

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3.24 Components Derating

Appendix Derating

a) Component derating

Device: LM1086 Regulators

Device Value Design Value Required

Derated Value

Margin Note

Maximum

operating

voltage

250V 24V 48V 80 The circuit

includes

inductive load

so the design

value may be

more but 80%

margin should

enough

Hot spot

temperature

150C 60C 130 46 Temperature

analysis based

on mechanical

subsystem

Device: POWER-CHOKE WE-HCFT

Device Value Design Value Required

Derated

Value

Margin Note

Maximum

operating voltage

- 24V 48V - Not stated in

datasheet

Hot spot

temperature

150C 60C 130 46 Temperature

analysis based

on mechanical

subsystem

1) Diode Derating

a) Criteria

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Parameter Load ratio or limit

Forward surge

current (IFSM

):

‐ non‐repetitive

operation

‐ repetitive

operation

80 %

60 %

Reverse voltage

(VR)

75 %

Dissipated

power (PD)

50 % (only if dissipated power is defined by the manufacturer)

Maximum

junction

temperature (Tx)

110 °C or Tj max

– 40 °C (whichever is lower).

Device: Power Rectifier MBR1045

Device Value Design Value Required

Derated

Value

Margin Note

Forward Surge

Repetitive

150 15 18.75 87 To deliver stall

torque of

600% of the

nominal

Forward Surge

Non-Repetitive

20 3.5 5.8 70 Based on

assumption

that the 2.5A

motor

current,1A

system

current, all

going through

one diode

2) Ceramic Capacitor Derating

a) Criteria

Parameters Load ratio or limit Voltage:

rated voltage ≤ 500 V 60 %

Voltage:

rated voltage > 500 V 50 %

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ceramic, X7R Dielectric

Device

Value

Design

Value

Required

Derated

Value

Margin Note

Voltage: 100V <63V <105V <-5% In

most

cases,

the

design

value

is less

then

12V

3) Electrolytic Capacitors

The electrolytic capacitors were not listed in ESA derating manual

4) Connector Derating

a) Criteria

Parameters Load ratio or limit

Working voltage 50 % of specified voltage at any altitude (pin-to-pin

and

pin-to-shell).

Current 50 %

Maximum operating temperature 30 ºC below maximum rated temperature.

Maximum mating and demating

cycles 50

b) Component Derating

Device: Hirschmann GDM 3016

Device

Value

Design Value Required

Derated

Value

Margin Note

Working voltage 250 24 48 66

Current 32 15 30 6 When two

pins are used

Maximum

operating 125 60 95 58

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Maximum

mating and

demating

cycles

- Value not

stated in

thedatasheet

Device: Cannon ZD connector zd solder cup

Device

Value

Design Value Required

Derated

Value

Margin [%] Note

Working voltage 500 24 48 90

Current 2 1 2 0 When two

pins are used

Maximum

operating 105 60 95 10

Maximum

mating and

demating

cycles

- Value not

stated in the

datasheet

The electrolytic capacitors were not listed in ESA derating manual

Chip resistor (RM), network resistor derating table

Part type Derating

Voltage 80 %

Power 50 % up to 85 °C, decreasing

to 0 % at 125 °C

3.25 Datasheet Main Payload

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