“mini” computing: optimizing design to accelerate new...
TRANSCRIPT
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“Mini” Computing: Optimizing Design to Accelerate New Usage ModelsMike Rosenberg – Managing Director, Aleutia
Felix Tao – Lead Design Engineer, Aleutia
Kevin Lew – Customer Engineer, Intel Corporation
Robert Neil – Product Marketing Engineer, Intel Corporation
Roberta Zouain – Desktop Segment Marketing Manager, Intel Corporation
RPCS006
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary and Q&A
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary and Q&A
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Multiple OSs
What Makes a Mini PC a Mini PC?
SMALLLess than 3 liters
in volume
POWERFULPerformance scalable up to
Intel® Core™ i7 vPro™ processor
LOCALComputeand store
Mini PC - All the Power Without the Tower
Mini-ITX 5x5 Next Unit ofComputing
Mini Lake ComputeStick
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Mini PC Market Growth
Source: IDC
0
2
4
6
8
10
2013 2014 2015 2016 2017 2018
Millions
Mini PC Ramp
Commercial Consumer
One of the fastest Growing Segment in Desktops
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DESIGN CONSIDERATIONS
Usage Model• Productivity• Consumption• Entertainment
Form Factor• ID Consideration• Power Envelope• Thermal/Mechanical
Features• Technologies• I/O Selection
Cost• Platform Scaling• BOM target• Desired SPP
Scalable Designs for Scalable SolutionsMini-ITX
5x5
Intel® NUC
Mini Lake Ref. Design
Compute Stick
SOLUTIONSDigital ClassroomPoint of SaleHotel LobbyDigital Signage
Bank TellersPC in Conference RoomIndustrial/EmbeddedComputer Labs
Nurse’s StationDigital LibraryHospital Patient Room
Virtual Clothing BoutiqueDigital KiosksNetwork Operations Center
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary and Q&A
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Mini-ITX
Scalable Mini PC Designs
5x5 Intel® NUC Mini LakeReference Design
Compute Stick
170 x 170 mm 147 x 140 mm 102 x 102 mm 102 x 64 mm 30 x 90 mm
Intel® Core™ processorLGA Socket
UDIMM MemoryInt or Ext Graphics
3.5”/2.5”/M.2 DrivesSFX PSU
Intel Core processorLGA Socket
SODIMM MemoryInt GraphicsM.2 DrivesDC Power
Intel Core processorBGA Down
SODIMM MemoryInt GraphicsM.2 DrivesDC Power
Intel® Atom™ processorBGA Down
Memory DownInt GraphicseMMC Down
DC Power
Intel Atom processorBGA Down
Memory DownInt GraphicseMMC Down
DC Power
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Mini-ITX
Scalable Mini PC Designs
5x5 Intel® NUC Mini LakeReference Design
Compute Stick
170 x 170 mm 147 x 140 mm 102 x 102 mm 102 x 64 mm 30 x 90 mm
Intel® Core™ processorLGA Socket
UDIMM MemoryInt or Ext Graphics
3.5”/2.5”/M.2 DrivesSFX PSU
Intel Core processorLGA Socket
SODIMM MemoryInt GraphicsM.2 DrivesDC Power
Intel Core processorBGA Down
SODIMM MemoryInt GraphicsM.2 DrivesDC Power
Intel® Atom™ processorBGA Down
Memory DownInt GraphicseMMC Down
DC Power
Intel Atom processorBGA Down
Memory DownInt GraphicseMMC Down
DC Power
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary and Q&A
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Introducing… 5x5
• Board is 5.5” x 5.8” (140mm x 147mm)
- Smallest socketed board standard
- 29% smaller area than Mini-ITX standard
• Fully Featured
- Supports LGA based CPUs
- Feature rich I/O selection
- 2 channels SODIMM
- 2.5” SATA* or M.2 storage
- Wired & wireless networking options
- Support up to 65W CPU thermal design power
• Fixed length and width board dimensions
• Fixed CPU XY location on motherboard
• Value proposition
- Enables sub-1 liter socketed solution
- Provides Intel® Celeron® to Intel® Core™ i7 processor scalability
- Targeted to support both 35W and 65W TDP CPUs 5x5 measures 140x147 mm at 20,580 mm2
Mini-ITX measures 170x170 mm at 28,900 mm2.
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5x5 System Integration
Standardized Ingredients• Intel® Core™ i3/i5/i7 processors
- LGA socket for greatest flexibility
• Board
- Standardized mounting holes
- Support up to CPU w/65W TDP
• SODIMM Memory
- Dual channel performance
- Small footprint
• M.2 Storage
- Lowest Z-Height
• Chassis+Heatsink
- Complementary pair
System Considerations• Industrial Design
- Venting aesthetics
- System orientation
- Air intake top/bottom/side
• User Experience
- Hot air exhaust away from user
- Acoustics of low RPM fans
• Sub 1 Liter System Volume
- 0.85 liters @ 39mm Z-height
- Minimal heatsink Z-height @ CPU w/35W TDP
- Additional Z-height for 65W TDP and 2.5” drives
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary
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Aleutia – NUC-based FF
Making NUC Fanlessi3- 3217U 17W TDP
I3 4010U 15W TDP
Designed for challenging environments
Lamda(W/mK)
205 400 429
Δ λ - 95% 7%
Price/Kilo
$1.6 $5 $500
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Embracing Copper
i3 4010U 15W TDP @ 74 C (1% throttling)
i3 5010U 15W TDP @ 51 ̊C (0% throttling) Test conditions 22 ̊C
204 g copper mid section
44.5 ̊ C
39 ̊ C
Seek Thermal Camera images
Prime95 Torture Test
23 ̊C CPU decrease
5.5 ̊C Chassis decrease
24% Volume decrease
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Catalyst for Transformation
Uganda Solar Classroom
Computing Anywhere
CAD Workstation
Marine Server
Medical Cart
Remote Monitoring 4K EntertainmentIndustrial Automation
Digital Signage
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary
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Compute Stick Design Considerations
• System performance and BOM
- Active versus passive cooling
- Power limits
- Fan speed control acoustics
• Industrial design
- Materials selection of housing
- End User’s touch & handling areas
Exhausts toward high-touch area
Exhausts away from high-touch area
Air Flow
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Agenda• Mini PC Trends
• Design Challenges & Trade-Offs
- 5x5
- Next Unit of Computing
- Compute Stick
• Summary
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Summary
• Computing continues to expand into new areas and usages
• Mini PC’s provide opportunities for smaller desktop form factors:
- 5x5 scales to smaller footprints using standard ingredients
- Next Unit of Computing enables smaller footprints using Intel® Core™ processors
- Compute Stick adds computing with the smallest footprint
• As systems are designed smaller, skin temperature and air exhaust are key industrial design considerations
Take computing into new areas and usages not possible before
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Additional Sources of Information
• A PDF of this presentation is available from our Technical Session Catalog: www.intel.com/idfsessionsSF. This URL is also printed on the top of Session Agenda Pages in the Pocket Guide.
• Come and see our demos in the Intel Computing Innovation Exhibit located on the 2nd floor concourse
• More web based info:https://www-ssl.intel.com/content/www/us/en/mini-pc/mini-pc-overview.html
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Other Technical Sessions
Session ID Title Day Time Room
RPCS001 Overclocking 6th Generation Intel® Core processors! Tue 11:00 2008
RPCS002 Optimizing Performance and Usability of Thin and Fanless 2 in 1 Systems With Adaptive Performance Wed 11:00 2006
RPCS003 Content Independent Backlight Power Saving Technology for Mobile Devices
Wed 13:15 2008
RPCS004 Form Factor Reference Design: Developing a 2 in 1 Detachable Ultrabook™ System
Wed 14:30 2008
RPCS005 Innovation in Stationary and Portable All-in-One PCs Wed 16:00 2008
RPCS007 2015 platform implementation of USB-C Thu 09:30 2003
RPCS008 “Always Available”, Computing Devices and Applications: Intel® Ready Mode Technology
Thu 10:45 2003
RPCS009 Developer Training on Intel® Active Management Technology Thu 13:00 2003
RPCS010 Unleash Your Creativity: Develop Novel “Always-on” Apps Using the Intel® Integrated Sensor Solution Thu 14:15 2003
= DONE
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Risk FactorsThe above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be important factors that could cause actual results to differ materially from the company's expectations. Demand for Intel's products is highly variable and could differ from expectations due to factors including changes in business and economic conditions; consumer confidence or income levels; the introduction, availability and market acceptance of Intel's products, products used together with Intel products and competitors' products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel's gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; and product manufacturing quality/yields. Variations in gross margin may also be caused by the timing of Intel product introductions and related expenses, including marketing expenses, and Intel's ability to respond quickly to technological developments and to introduce new products or incorporate new features into existing products, which may result in restructuring and asset impairment charges. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Results may also be affected by the formal or informal imposition by countries of new or revised export and/or import and doing-business regulations, which could be changed without prior notice. Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term. The amount, timing and execution of Intel's stock repurchase program could be affected by changes in Intel's priorities for the use of cash, such as operational spending, capital spending, acquisitions, and as a result of changes to Intel's cash flows or changes in tax laws. Product defects or errata (deviations from published specifications) may adversely impact our expenses, revenues and reputation. Intel's results could be affected by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel's ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. Intel's results may be affected by the timing of closing of acquisitions, divestitures and other significant transactions. A detailed discussion of these and other factors that could affect Intel's results is included in Intel's SEC filings, including the company's most recent reports on Form 10-Q, Form 10-K and earnings release.
Rev. 4/14/15