antenna metal fill concepts
TRANSCRIPT
8/6/2019 Antenna Metal Fill Concepts
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Antenna & Metal Density
Concepts:
Venkata Simhadri
Time To Market Inc
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What is Antenna ?
( When metal layer is being deposited, electro static charge(ESD)
gets collected on the wires, which can destroy the device and
make chip useless. This is called ‘Charge-collecting antennaproblem’.
( Antenna problem is usually caused by dangling metal pieces
extending from the input pins.
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How to protect your chip from Antenna ?
( Minimising ‘the Antenna area’ by breaking the wireswith contacts and wires in other metal layers.
( Inserting extra diodes to protect input pins.
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Antenna Rules
There are 3 major factors in computing antenna rules:
( Antenna recognition – 3 modes
v ignoring lower layer segments (mode 1)
v including lower layer segments to pins (mode 2 )
v including all lower layer segments (mode 3)
( Side-wall area versus polygon area
v side-wall area of metal is used
v polygon-area of metal is used
( Protection from diode and output pins
v diode and output pins provide unlimited protection
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Antenna Recognition
( Mode 1 : Ignoring lower layer segments
v For metal1 antenna, it counts all metal1 wires between
input gate and first metal2 while tracing from input pin
v For metal2 antenna, it counts all metal2 wires between
gate and first metal3 piece while tracing input pin
v Similar rule applies for all metal layers.
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Antenna Recognition - Contd..
( Mode 2 : Including lower layer segments to pins
v All antenna area from ‘mode 1’ plus all the upward metalpieces from input gate to ‘mode 1’ antenna
v A metal piece is upward if all wired between the input gate
and itself are no higher than itself
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Antenna Recognition - Contd..
( Mode 3 : Including all lower layer segments
v All antenna area from ‘mode 1’ plus all metal piece between
‘mode 1 antenna and input gate
v most conservative method of computing antenna
v most difficult and expensive to fix
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Side wall / polygon Area
( For W x L metal piece counted as antenna, there are 2ways of computing antenna area:
Side wall area = (W + L) * 2 * thickness
Polygon area = W * L
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Protection from diode and output pins
( Unlimited protection :
v The input is considered safe once it is connected to adiode or output pin
v Because input pins are always connected to some outputpins through the highest metal layer of the net, the highestmetal layer of nets always meets antenna rules
( Limited protection :
v When input is connected to a diode or input pin, it canallow a higher antenna-to-gate ratio.
v All layers including the highest metal layers of nets needto be checked
v Limited protection rules are required for <0.18umprocesses.
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Filling and SlottingWHY?
To make these effects uniform and predictable due to the Varying
effects of manufacturing on device and interconnect features
Processes such as:
Optical exposure
Resist development
Etching
Chemical vapor deposition
Chemical-mechanical polishing (CMP)
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Metal Insertion - Filling
Partial Deletion - Slotting
Effects On:
RC extraction
Delay calculation
STA
Noise Analysis