wafer fabrication nam nguyen todd allen dipesh chasmawala daniel canales inoke hemaloto cheng hsiao

Wafer Fabrication

Nam Nguyen

Todd Allen

Dipesh Chasmawala

Daniel Canales

Inoke Hemaloto

Cheng Hsiao

Overview (1/3)

• Crystal Structure– Monocrystalline

• An existing monocrystalline silicon serves as a seed for uniform crystal growth

– Polycrystalline• Consists of a multitude of fine-grained gray

crystals

Overview (2/3)• Diffusion

– Process in which the dopants diffuse to a certain junction depth and forms a doped region

– Deposition

• Heat the wafer and external source of dopant atoms to form a shallow heavily doped region

– Drive

• External dopant source is removed and wafer is heated for a prolonged period of time to drive the dopants deeper

Overview (3/3)

• Ion Implantation– Accelerates dopant atoms so that they can

penetrate several microns of the silicon crystal• Causes damage to the crystal lattice that

must be repaired by annealing

Silicon Deposition

What is silicon deposition?

• A film of pure or doped silicon that is ‘grown’ onto an existing wafer.

• There are 2 types of crystal lattices formed from the process. Each lattice depends on the crystal structure that the silicon is applied to.

The 2 Types of Crystal Formed

• Mono crystal

• Requires contact with the mono crystalline wafer to act as a ‘seed’ for crystal growth

• Poly crystal

• Consists of fine grains of silicon formed when no contact with the underlying crystalline lattice is made

Epitaxy (epi)

• Epitaxy is the type of silicon deposition that results in single crystal growth due to contact with a suitable crystalline lattice.

• Epitaxy usually performed using the wafer, for economic reasons.

Different Methods for Growing an epi Layer.

• There are 2 types of epitaxy described in our textbooks

• The first is liquid-phase epitaxy• The second is low pressure chemical vapor

deposition (LPCVD)• There are several other methods for

producing an epi layer

Liquid-Phase Epitaxy

• Molten semiconductor material is poured directly onto wafer

• After allowing material to cool for a specified time the non-bonded material is wiped away

• Wafer must then be reground and polished for further processing

Drawbacks to Liquid-Phase Epitaxy

• Considered as economically undesirable due to the costs incurred to repolish the wafer after each step

• Also it is difficult to accurately control the thickness of the epi layer in this process

LPCVD Method

• Wafers are mounted on an inductively heated block and a mixture of Dichlorosilane and hydrogen gas is passed over the wafers. These gases react at the wafer surface to create a slow growing layer monocrystalline silicon.

Advantages of LPCVD Method

• The rate of silicon growth can be regulated by varying the temperature, pressure, and gas mixture.

• No polishing is required as the vapor deposited silicon will faithfully reproduce the structure of the underlying lattice.

• The epitaxial film can also be doped by adding small amounts of gaseous dopants such as phosphine or diborane.

Advantages / Disadvantages of Epitaxy

• ADVANTAGES• Create stacks of

differently doped layers useful in the creation of bipolar transistors

• Create buried layers

• DISADVANTAGES• Time required to grow

silicon layers• High cost of

equipment used in process

Buried Layers

• Epitaxy can create layers of differently doped silicon useful in the creation of bipolar transistors.

• By using epitaxy over a N+ region a heavily doped emitter region with low emitter to base resistance is created.

NBL Shadow

• A slight surface imperfection arises from the oxidation caused during the annealing of the N+ implant

• As the epitaxial layer grows this imperfection will be reproduced at the end of the growth cycle

Polysilicon Deposition

• Formed when no seed lattice is available, the silicon will form in small grains. Grain size depends upon conditions of the deposition as well as heat treatments.

NBL Shadow

• The imperfection will maintain the same geometry as the substrate imperfection but may be moved laterally, known as pattern shift

• Following photomasks can use the NBL shadow for alignment purposes. This requires an offset due to the pattern shift

Advantages / Disadvantages of Polysilicon Deposition

• ADVANTAGES• Withstand high

temperatures (better then al) for annealing source and drain

• Create narrow resistors with less parasitics

• Can be used as metallization layer

• DISADVANTAGES• Grain boundaries

represent lattice defects which allow high leakage current, not used for PN junctions

Metallization

• The active elements of an integrated circuit are connected by patterned wiring

• The wiring is consists of layers of metal and polysilicon separated by insulators, usually deposited oxides

Metallization Process

• A layer of oxide is grown or deposited over the entire wafer

• A photo etching process removes the oxide from areas desired for metallization contact

• A thin film of metal is then applied• The metal is etched off• An integrated circuit may have multiple

metallization layers to reduce cost

Deposition and Removal of Al

• Most metallization systems employ Al or Al alloys for the primary interconnection layers

• Al almost conducts as well as Cu and Ag and will readily deposit in thin films that adhere to all the materials used in the fabrication of integrated circuits

Sintering

• Sintering creates Ohmic contacts

• A brief period of heating will make a thin film of Al-doped silicon (sintering)

• The Al-Si alloy causes a heavily doped P-type diffusion that bridges the P-type silicon

• Also form Ohmic contact with heavily doped N-type silicon

Sintering Failures• Sintering causes some Al to dissolve into the

Si• Some Al diffusions are so thin that the Al

can erode completely, called contact spiking• CS was first observed in the emitter regions

of NPN transistors so CS is also known as emitter punchthrough

• CS is minimized by replacing Al with a saturated Al-Si alloy

Electromigration• Caused by heavy current flow, carriers

flowing through the metal collide with the lattice atoms

• At current densities of several million amps per cm2, impacts will start to cause the metal atoms to move

• As the atoms move, small gaps are made that eventually combine to cause an open connection, this is call electromigration

• A fraction of a percent Cu added improves resistance to electromigration by an order of magnitude

Step Coverage Problem

• As chips become more densely packed, the sidewalls of contacts and vias has become progressively steeper

• Evaporated Al does not deposit isotropically, it thins where it crosses oxide steps

Step Coverage Techniques - Reflow

• Step coverage is greatly improved if the slope of the side wall is moderated.

• By reheating the wafer the oxide will melt and the sidewalls form a sloped surface

• Pure oxide melts at too high a temperature so it is doped with either/and P and B

• If P doped is called phosphosilicate (PSG), if B doped is called borophosphosilicate (BSG)

Drawback to Reflow Solution

• Al cannot be applied before reflow as the temperatures involved are to high

• Reflow is effective for the first-level metal only

• Use of refractory barrier metals is used in subsequent metal layers

Refractory Barrier Metal

• Metals chosen for their isotropic deposit on sidewalls (molybdenum Mo, tungsten W, and titanium Ti)

• Refractory barrier metals have high melting temps and are unsuited for evaporation deposition like Al

• Sputtering is used for low temp deposit

Refractory Barrier Metals

• RBM’s posses high resistances and cannot be deposited thickly as easily as Al

• Use of a thin film of RBM under Al ensures suitably low resistance

• RBM’s are resistant to electromigration• RBM’s practically eliminate emitter punch

through so there is little need for Al-Si or Al-Si-Cu alloys

Sillicides

• Elemental SI reacts with many metals

• Can for low-resistance Ohmic contacts or Schottky diodes

• Sillicides have lower resistances than the most heavily doped Si

• Can withstand high temperature treatments

• Useful in MOS transistors

Interlevel Oxide

• Used to insulate metal layers from one another

• Vias can be etched through the ILO• Relatively thick ILO can reduce parasitic

capacitances • Can cause step problems in vias• No reflow after Al deposited so RBM’s are

often used to improved step coverage

Interlevel Nitride

• Used to create high capacitance-per-unit-area films

• Dielectric constant 2.3 times that of oxide• More prone to pinhole formations that

reduce the max voltage• Combination of stacked silicon nitride and

oxide are used for dielectric constant between oxide and silicon nitride

Protective Overcoat

• Al is fragile to mechanical stress • Al and the underlying Si are vulnerable to

certain chemical contaminants• The protective overcoat (PO) forms a seal

against mechanical and chemical threats• Most often made from compressive nitride

films, some are heavily doped phosphosilicate glasses

Assembly/Packaging

Assembly (1/3)

• Performed in an assembly/test site• Finished wafer

– Each square represents a completed integrated circuit

– Some of the locations in the array are occupied by process control structures and test dice

Finished Wafer

Process Control Structures

• Extensive arrays of transistors, resistors, capacitors, diodes, strings of contacts, and vias– Used to evaluate the success or failure of the

manufacturing process on the wafer by automated testing equipment

– Standardized so the same structures are used for a wide range of products

Test Dice (1/3)• Used to evaluate prototypes of an integrated

circuit• Specific to a given product• Dedicated test metal mask allows probing of

specific components and subcircuits that would be difficult to access on the finished die

Test Dice (2/3) – Created by adding a few more layers to the

database containing the layout of the integrated circuit (e.g., test metal, test nitride) • Layers create a separate set of reticles that

are used to expose a few selected spots on the stepped working plate

– These locations become unnecessary when testing is completed

Test Dice (3/3)

• Wafers created by direct-step-on-wafer (DSW) processing rarely include any test dice because at least one test die must be included in every exposure – If they are included then the test dice will most

likely be replaced with product dice after testing is completed to improve the die yield

Assembly (2/3)

• After the wafers are tested to ensure the process was performed correctly, each die is individually tested to determine its functionality– Testing of each die typically requires less than

three seconds– The percentage of good dice depends on the

size of the dice and the complexity of the process• Most products yield 80%, some in excess of

90%

Assembly (3/3)

• Wafer probing uses probes to make contact with specific locations on the interconnection pattern of the integrated circuit through holes in the protective overcoat and test each individual die to determine its functionality– Probes are mounted on a probe card that is

lowered until the probe comes in contact with the wafer to be tested

– The individual dice are sawn apart using a diamond-tipped saw blade, then separated for mounting and bonding

Mounting (Leadframe 1/2)

• The first step of packaging an integrated circuit is mounting it on a leadframe

• Leadframe Diagram– The leadframe consists of a rectangular mount

pad and a series of lead fingers– They are either stamped out or etched using

photographic techniques– Usually consists of copper or a copper alloy

plated with tin or a tin-lead alloy

Leadframe Diagram

Etched Leadframe

Pressed Leadframe

Mounting (Leadframe 2/2)– Copper is not an ideal material because it has a

different coefficient of thermal expansion than silicon• Differential expansion of the die and the

leadframe causes mechanical stresses that damages the performance of the die

– Most of the materials that possess coefficients of expansion similar to silicon have inferior mechanical and electrical properties

– Nickel-iron alloy (Alloy-42) is the most common

Mounting (Epoxy Resin)

• The die is usually mounted to the leadframe using an epoxy resin

• Sometimes the resin is filled with silver powder to improve thermal conductivity – Helps reduce the stresses produced by thermal

expansion of the leadframe and die• Alternate methods provide superior thermal union

between the silicon and the leadframe, but at the cost of greater mechanical stress

Mounting (Gold Preform)

– The backside of the die can be plated with a metal or a metal alloy and soldered to the leadframe

– Rectangle of gold foil called a gold preform can be attached to the leadframe; heating the die causes it to alloy with the gold preform to create a solid mechanical joint• Both allow excellent thermal contact and

produce an electrical connection that can be used to connect the substrate of the die to a pin

Bonding (1/2)• The next step is to attach bondwires to them• Can only be performed in areas of the die where

the metallization is exposed through openings in the protective overcoat called bondpads

• Performed by high-speed automated machines that use optical recognition to determine the locations of the bondpads– Employs gold wires ranging from 20 µm to 50

µm for bonding– Only one diameter and type of wire can be

bonded at a time

Bonding (2/2)– Multiple 25 µm wires bonded in parallel can

carry higher currents or provide lower resistances without requiring a second bonding pass for larger-diameter wire

Ball Bonding (1/2)• Most common technique for bonding gold wire is

ball bonding– Ball Bonding Diagram

• Bonding machine feeds the gold wire through a capillary

• Hydrogen flame melts the end of the wire to form a ball

• The capillary presses down against the bondpad

• Gold ball deforms under pressure, and the gold and aluminum fuse to form a weld

Ball Bonding (2/2)• Capillary lifts, moves to lead finger, and

presses the gold wire against the lead finger forming another weld

– This bond is called a stitch bond because of the absence of a ball

• The hydrogen flame then passes through the wire, fusing it into two

• Ball bonding requires a square bondpad approximately three times as wide as the diameter of the wire

Ball Bonding Diagram

Wedge Bonding (1/2)

• Wedge bonding is another technique used for aluminum wire– When the capillary brings the wire close to the

bondpad, a small, wedge-shaped smashes it against the pad to create a stitch bond

– Process is repeated at the lead finger and the tool is then held down against the lead finger while the capillary moves up causing the aluminum wire to snap

Wedge Bonding Diagram

Wedge Bonding (2/2)

• Wedge bonding requires a rectangular bondpad– Bondpads must lie in the same direction as the

wedge tool– Typically twice as wide and four times as long

as the diameter of the wire

Packaging (1/2)

• The next step is injection molding– A mold is clamped around the leadframe and

heated plastic resin is forced into the mold from below

– The plastic wells up around the die, lifting the wires away from it forming loops

– The plastic resin forms a rigid block of plastic

Packaging (2/2)

• After the molding process, the leads are trimmed and formed to their final shapes

• Done by using a pair of specially shaped dies that simultaneously trim away the links between the individual leads and bend the to the required shape

– Completed circuits are labeled and packaged in tubes, trays, reels and shipped off