tht dual side avi -aoi

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Why need Automatic Optical Inspection System ?

Circuit board production

Common defect after wave soldering process

Wave soldering process

Function Test

Customer end

1. THT Dual Sided AOI Specs2. Optional functions3. Machine model seletive

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THT AOI (DIP AVI)

– Before or after Wave solder , use high speed in-line AOI solution

– Applicable for

• Before or after Wave solder THT/DIP component insertion check (DIP

through hole component)

• Optional: Press-fit inspection ability of pressing parts

• Optional: SMD component placement test ability

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1. THT Dual Sided AOIFeaturesBest Pre & Post Wave AOI Inspection System providing the highest Return on Investment,(ROI) in the industry by eliminating the need for human inspection◆ Extra Large 10cm Depth of Field eliminates the effects of component height◆ Extreme high speed (both sides 45 sec, Server board 600 x 600 mm2)◆ Innovative vision algorithms eliminate PCB/Placement variation and detects defects perfectly

Application for◆Post wave, Leaded components, DIP, Axial leaded and metal can Dimension & Weight◆PCI-770 Model– 900 L x 1000 W x 1950 H (mm) / 450 Kg( Inspection area 330 L x 250 W (mm))◆PCI-770M Model– 1410 L x 1345 W x 1875 H (mm) / 800 Kg( Inspection area 510 L x 510 W (mm))◆PCI-770L Model– 1410 L x 1345 W x 1875 H (mm) / 800 Kg( Inspection area 610 L x 610 W (mm))

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Typical Defect Types

◆THT/DIP Components

–Missing / Wrong Components

*Optical shape recognition

*Color and Band Inspection

–Polarity Check

*Electrolytic Capacitors, Resistors & Diodes

*All components w/ text including IC's (character verification)

*Connectors and other components w/ polarity requirements

–Solder Bridge and Solder Joint

◆Optional inspection functions

–Press-fit Inspection (down to 0.5x0.5mm2)

*Lifted components & Pin shifting (top side)

*Pin invisible & Pin unseated (bottom side)

–SMD Inspection (down to 0603 package)

*Drop / Wrong parts / Polarity check

*Solder bridge

*Missing components (down to 0402 package)

–Label Inspection by OCR

*Missing component

*Polarity check

Lead bend&lead shifting SMD component lack

Press-fit connector THT connector

Label sticker

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◆Optional inspection functions

–Surface Inspection (down to 0.5x0.5mm2)

*Board surface inspection (scratch, particle)

*Drop solder / component

–Laser Height Detection (down to 0.5x0.5mm2)

*Lifted components & Pin shifting (top side)

PCB surface check PCB surface component drop

Component surface check

CPU block lead

--Large depth of field optical system

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2.Optional Functions

– Press-fit Inspection (down to 0.5x0.5mm2)* Lifted components & Pin shifting (top side)* Pin invisible & Pin unseated (bottom side)

Ordinary checking method Landrex professioal checking technology

– SMD Inspection (down to 0603 package)* Drop / Wrong parts / Polarity check* Solder bridge* Missing components (down to 0402 package)

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2.Optional Functions

– OCR word identification

Function: the use of wildcards "?" instead of any character identification "ABC?" Pass condition = ABC + arbitrary two characters

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– Click on the substrate surface check

2.Optional Functions

PCB surface checking component drop Cop layer leakage

Checking ability ,minimum down to 0.5x0.5mm2

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– CPU lead socket ad lead's checking function

- high efficiency CPU lead socket for wave soldering or functional testing , lead check function

• X/Y direction shifting (± 200 UM)• Lead tip missing

X/Y direction shifting (± 200 UM)

Lead tip missing

2.Optional Functions

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3.Machine model seletive

Model Defect types can be checkedTop of Substrate Bottom of substrate

S-760 M / W / P -S-770 M / W / P / L SS-780 - S

Checking type of M/W/P/L/S = >• M: missing pieces• W: wrong piece• P: polarity reverse• L: parts float high (part height)• S: tin point short circuit

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Top of PCB checkingn Enable checking type of defect

-DIP component*Drop / Wrong parts / Polarity opposite direction(PCB top side)*Lead bend(PCB top side)-Press-fit component(Minimum down to 0.5mm spacing)*Component floating high (PCB top side, Z axis resolution ratio:100μm)*Lead shifting (PCB top side)-SMD component(minimum down to 0603 package)

*Drop / Wrong parts / Polarity opposite direction(PCB top side)

THT AOI (DIP AVI) S-760

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THT AOI (DIP AVI) S-770

Double side of PCB checking and height checking abilityn Enable checking type of defect

-DIP component*Drop / Wrong parts / Polarity opposite direction(PCB top side)*Lead bend(PCB top side)/ tin solder point short circuit(PCB bottom side)-Press-fit component(Minimum down to 0.5mm spacing)*Component floating high (PCB top side, Z axis resolution ratio:100μm)*Lead shifting (PCB top side)*Lead not insert or on lead(PCB bottom side)-SMD component(minimum down to 0603 package)

*Drop / Wrong parts / Polarity opposite direction(PCB top/bottom side)

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THT AOI (DIP AVI) S-780

Bottom side of PCB checking n Enable checking type of defect

-DIP component*Tin solder point short circuit(PCB bottom side)-Press-fit component(Minimum down to 0.5mm spacing)*Lead not insert or on lead(PCB bottom side)-SMD component(minimum down to 0603 package)

*Drop / Wrong parts / Polarity opposite direction(PCB top/bottom side)*Tin solder point short circuit(PCB bottom side)

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Machine running interface (including real-time marking function)

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Program editing interface

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