test setup for ral structures - cedric mansuy
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Test setup for RAL structures - Cedric Mansuy
Test setup ready main board + chip carrier PCBs (2 types: transistors (1), HV
transistors, insulation, capacitances (2)) Setup with lab instruments (switching matrix, LCRmeter,
source-meters) and Labview Software for analyzing data (Matlab)
See presentations by Cedric in WG3 meetingshttps://indico.cern.ch/categoryDisplay.py?categId=3308
Wire bonding of dies not possible due to matrix-structure of the pads >> Au ball bonding with company in Switzerland (Hybrid SA)
10 carriers with chips mounted and Au ball bonded delivered 29/5/2012
Main board with chip carrier
Chip
10 chips mounted: 5.5 um epi without
deep p-well Next carriers
equipped with 12 um epi layer and without deep p-well
Connect 1-11 and 10-20 or 11-21 and 20-24
Chip carrier
0 0.5 1 1.5 2 2.5 3 3.50
50
100
150
200
NMOS HV NUM2
Gate=0Gate=1Gate=2Gate=3Gate=3.3
Vds [V]
Ids [
uA
]NMOS transistor (preliminary)
0 0.5 1 1.5 20
50
100
150
200
NMOS LV NUM2Gate=0Gate=0.5Gate=1Gate=1.5Gate=1.8
Vds [V]
Ids [
uA
]
Ids Vs Vds
Low voltage
High voltage
PMOS transistor (preliminary)
0 0.5 1 1.5 2 2.5 3 3.50
200
400
600
800
1000
1200
PMOS HV NUM1
Gate=0Gate=1VGate=2VGate=3VGate=3.3V
Vds [V]
Ids[u
A]
Ids Vs Vds
Isolation (preliminary)
Leakage current Vs voltage
Capacitance (preliminary)
Capacitance Vs voltage bias
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