technical explanation skyper issue date 12 pv r 30% fewer components than standard solutions, the...
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© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
Page 1/20
1. Introduction ............................................................................................................................... 2
2. Mechanical information ............................................................................................................... 3 2.1 Dimensions .......................................................................................................................... 3 2.2 Connector ............................................................................................................................ 4
3. Driver interface .......................................................................................................................... 5 3.1 Pin description - primary side ................................................................................................. 5 3.2 Pin description – secondary side – TOP .................................................................................... 6 3.3 Pin description – secondary side – BOT .................................................................................... 6 3.4 Application example .............................................................................................................. 7 3.5 Power supply – primary ......................................................................................................... 8 3.6 Switching signals – primary .................................................................................................... 8 3.7 Error output – primary ........................................................................................................... 9 3.8 Error input – primary ............................................................................................................. 9 3.9 Error behaviour configuration in case of a secondary side error ................................................. 10 3.10 External error input – secondary ........................................................................................... 11 3.11 Gate resistors – secondary ................................................................................................... 11 3.12 External boost capacitors ..................................................................................................... 12
4. Protection features ................................................................................................................... 13 4.1 Failure management ............................................................................................................ 13 4.2 Dead time generation (Interlock TOP / BOT ) .......................................................................... 14 4.3 Short pulse suppression ....................................................................................................... 14 4.4 Under voltage protection ...................................................................................................... 14 4.5 Dynamic short circuit protection ............................................................................................ 15 4.6 Active clamping................................................................................................................... 16 4.7 SoftOff ............................................................................................................................... 17
5. Environmental conditions .......................................................................................................... 18
6. Marking ................................................................................................................................... 19
Technical Explanation
SKYPER®
12 PV R
Revision: 02
Issue date: 2018-11-22
Prepared by: N. Hofstötter, J. Krapp
Reviewed by: A. Schiller
Approved by: M. Honsberg
Keyword: IGBT Driver
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
Page 2/20
1. Introduction
The SKYPER® 12 PV R is an driver core designed for power semiconductor modules in the range of 80A to
400A like MiniSKiiP Dual, SEMIX5 or SEMIX press-fit. The half bridge driver can be plugged or soldered with an adapter board on each module easily. With 30% fewer components than standard solutions, the driver achieves an MTBF (mean time between failures as per SN 29500) rate of over 12 million hours at full load. With 1W per channel SKYPER® 12 PV R can drive IGBTs up to 400 Ampere and 1700V.
Figure 1: SKYPER® 12 PV R
• Fits to 600V, 1200V & 1700V modules • Robust rectangle signal transmission • Two output channels • Adjustable dead time • Adjustable filter time
• Active clamping • MLI ready • Highest noise immunity with short pulse suppression • Secondary side error input for insulated over temperature trip • Under voltage lockout (UVLO) primary and secondary
• Dynamic Short Circuit Protection (DSCP) by VCE-monitoring and direct SoftOff • Fast mode detection for short circuits
• Integrated isolated power supply for the secondary side • 1W output power per channel
Figure 2: Block diagram of SKYPER®12 PV R
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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2. Mechanical information
2.1 Dimensions
Figure 3: Dimensions
If driver is soldered into adapter PCB:
Ø Solder Pad: 1.9 mm
Ø FHS: 1.3 mm
Step files are available on request.
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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2.2 Connector
Figure 4: Connector X10, X100, X200 (male RM2.54 10p)
Product information of suitable female connectors and distributor contact information: www.suyin-europe.com with order number 254303MA010S512ZR or
E-TEC with order number SS2-010-H140/09-55A PCB_Pin Header - 2.54mm - SSx - SMT standard
The driver can additionally be fixed on the user board by a support post.
Figure 5: Support post
Description: Nylon support post
Shape: Dual lock
Manufacturer: Richco
Art. No.: DLMSPM-8-01
If the driver is soldered, no reflow soldering should be applied but wave or selective soldering. To avoid overlapping of the pins, a support post on the connectors can be used.
X200
X100X10
10 9
2 12
1
10
9
9
102
1
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3. Driver interface
3.1 Pin description - primary side
PIN Signal Function Specification
X10:01 PWR_GND Ground potential for power supply and digital signals
To be connected to ground
X10:02 CFG_IDT Interlock dead time configuration
15V logic; 150kΩ (pull-up) LOW = 2µs interlock HIGH = No interlock
X10:03 nERR_OUT Error output Open collector output; max. 18V/15mA (external pull-up resistor needed) LOW = Error HIGH = No error
X10:04 nERR_IN Error input 15V logic inverted; 150kΩ/10nF (pull-up) LOW = External error HIGH = No external error
X10:05 CFG_ERR Error behaviour configuration in case of secondary side error
15V logic; 150kΩ (pull-down) LOW = Both outputs switch off HIGH = Affected output switchs off
X10:06 CFG_FLT Filter configuration for switching signals
15V logic; 150kΩ (pull-down) LOW = Analoge filter (tSPS(ana)) HIGH = Digital filter (tSPS(dig))
X10:07 TOP_IN Switching signal input (TOP) 15V logic; 33kΩ/0.01nF (pull-down) LOW = TOP switch off HIGH = TOP switch on
X10:08 BOT_IN Switching signal input (BOT) 15V logic; 33kΩ/0.01nF (pull-down) LOW = BOT switch off HIGH = BOT switch on
X10:09 PWR_VS Driver power supply Stabilised +15V ±3%
X10:10 PWR_VS Driver power supply Stabilised +15V ±3%
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.2 Pin description – secondary side – TOP
PIN Signal Function Specification
X100:01 CFG_VCE VCE-monitoring reference voltage External voltage divider needed
X100:02 VCE_IN VCE-monitoring input External blocking diode needed
X100:03 PWR_VS_P_OUT Power supply output, positve voltage Equal to VG(on) (external buffer capacitors can be connected)
X100:04 nERR_IN External error input 15V logic inverted; 150kΩ/0.01nF (pull-up) LOW = External error HIGH = No external error
X100:05 TOP_ON On signal path to TOP semiconductor External gate resistor needed (in consideration of Iout(avg), Iout(peak), VG(on))
X100:06 TOP_OFF Off signal path to TOP semiconductor External gate resistor needed (in consideration of -Iout(avg), -Iout(peak), VG(off))
X100:07 CLMP_IN VCE-clamping input 150kΩ/0.01nF (pull-down) In case of activated TOP_OFF: LOW = TOP_OFF equal to VG(off) HIGH = TOP_OFF floating
X100:08 PWR_GND Ground potential for power supply and digital signals
Reference potential for gate voltages (emitter/source of power semiconductor)
X100:09 TOP_SOFTOFF SoftOff signal path to TOP semiconductor
External gate resistor needed
X100:10 PWR_VS_N_OUT Power supply output, negative voltage
Equal to VG(off) (external buffer capacitors can be connected)
3.3 Pin description – secondary side – BOT
PIN Signal Function Specification
X200:01 CFG_VCE VCE-monitoring reference voltage External voltage divider needed
X200:02 VCE_IN VCE-monitoring input External blocking diode needed
X200:03 PWR_VS_P_OUT Power supply output, positve voltage Equal to VG(on) (external buffer capacitors can be connected)
X200:04 nERR_IN External error input 15V logic inverted; 150kΩ/0.01nF (pull-up) LOW = External error HIGH = No external error
X200:05 BOT_ON On signal path to BOT semiconductor External gate resistor needed (in consideration of Iout(avg), Iout(peak), VG(on))
X200:06 BOT_OFF Off signal path to BOT semiconductor External gate resistor needed (in consideration of -Iout(avg), -Iout(peak), VG(off))
X200:07 CLMP_IN VCE-clamping input 150kΩ/0.01nF (pull-down) In case of activated BOT_OFF: LOW = BOT_OFF equal to VG(off) HIGH = BOT_OFF floating
X200:08 PWR_GND Ground potential for power supply and digital signals
Reference potential for gate voltages (emitter/source of power semiconductor)
X200:09 BOT_SOFTOFF SoftOff signal path to BOT semiconductor
External gate resistor needed
X200:10 PWR_VS_N_OUT Power supply output, negative voltage
Equal to VG(off) (external buffer capacitors can be connected)
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.4 Application example
Figure 6: Application specific wiring
BOT
TOP
X10:10 PWR_VS
X10:09 PWR_VS
X10:03 nERR_OUT
X10:04 nERR_IN
X10:05 CFG_ERR
X10:06 CFG_FLT
X10:07 TOP_IN
X10:08 BOT_IN
X10:01 PWR_GND
X10:02 CFG_IDT
VCE_IN X100:02
TOP_ON X100:05
TOP_SOFTOFF X100:09
nERR_IN X100:04
PWR_VS_P_OUT X100:03
CFG_VCE X100:01
PWR_GND X100:08
CLAMP_IN X100:07
PWR_VS_N_OUT X100:10
TOP_OFF X100:06
VCE_IN X200:02
BOT_ON X200:05
BOT_SOFTOFF X200:09
nERR_IN X200:04
PWR_VS_P_OUT X200:03
CFG_VCE X200:01
PWR_GND X200:08
CLAMP_IN X200:07
PWR_VS_N_OUT X200:10
BOT_OFF X200:06
SKYPER® 12 PV R
Adapter Board4,7
5kΩ
+15V
10kΩ
10kΩ
RG
E
511
RON
ROFF
RSOFF
DC+
DVCE
10k
R1
CC
FG
RG
E511
RON
ROFF
RSOFF
DC-
DVCE
10k
R1
CC
FG
Setting in application example:Primary sideX10:02-GND: 2µs interlockX10:03-X10:04: Bidirectional HaltX10:05-GND: Driver switches both channels of (no MLI mode)X10:06-High: Digital fi lter
Secondary sideX100:04-High: Deactivated error input, can be
used for over temperature
X100:07-GND: Deactivated active clamping
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.5 Power supply – primary
The customer power supply should deliver the 15V input and should be rated according the required maximum supply current in the application. During power on reset no switching signals should be applied,
otherwise the driver will not leave error state. Buffer for primary side power supply: Please consider that the buffer capacitors on the primary side power supply have to be calculated according to the secondary side buffer capacitors. Example: 10µF (=2,5µC) secondary side buffer capacitors, require a 10µF buffer capacitance on the 15V supply input. Details chapter 3.12.
3.6 Switching signals – primary
The inputs have schmitt trigger characteristic (HIGH = IGBT on; LOW = IGBT off). It is mandatory to use circuits which switch active to +15V and 0V. The duty cycle of the driver can be adjusted between 0 – 100%. It is forbidden to apply switching pulses shorter than 1µs.
Figure 7: TOP and BOT inputs
A capacitor should be connected to the inputs to obtain high noise immunity. For current limited line drivers this capacitor can cause a negligible delay of a few ns. The capacitors have to be placed as close as possible to the driver interface. In addition a small series resistor can be added for even higher robustness
with the consequence of a longer delay time.
Parameter Min Typ Max
Threshold high - - 10V
Threshold low 5V - -
X10:07 TOP_IN
X10:08 BOT_IN
Adapter Board
10kΩ
10kΩ
SKYPER® 12 PV R
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.7 Error output – primary
The error output nERROR_OUT is low active and any error will force it into low state. The error state will be active for at least 30µs. For detailed error management please see chapter 4.1 Failure management.
The pin is an open collector output that requires an external pull-up-resistor. This gives the opportunity that, when error in- and outputs are connected together, multiple drivers can share one error line. In this case one driver, that enters error mode, directly switches of the parallel drivers (see. Figure 9).
• The pull up resistor has to be in the range of VS / Imax < Rpull_up < 10kΩ. • To reset the TOP/BOT signals must be set to low for treset > 9µs • nERR_OUT can operate at 18V can switch a maximum of 15mA.
Important: A pull up resistor must be used!
Figure 8: Error output
Parameter Min Typ Max
Output Current - - 15mA
Voltage @15mA and error active - - 0,3V
3.8 Error input – primary
The nERR_IN pin is low active and allows external deactivation of the driver i.e. by connecting a monitoring
circuit. The pin can also be connected to nERR_OUT to have a bidirectional error (=HALT).
Figure 9: Example for bidirectional error with two drivers
Parameter Min Typ Max
Threshold high - - 11 V
Threshold low 7,5 V - -
X10:03 nERR_OUT
Rpull_up
SKYPER® 12 PV R
X10:01 PWR_GND
OUT
C
1nF
VS
Rpull_up
HALT
VS
X10:03 nERR_OUT
X10:01 PWR_GND
X10:04 nERR_IN
X10:03 nERR_OUT
SKYPER® 12 PV R
X10:01 PWR_GND
X10:04 nERR_IN
SKYPER® 12 PV R
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.9 Error behaviour configuration in case of a secondary side error
The error behavior of the driver in case of a secondary side error is selectable via pin CFG_ERR.
CFG_ERR = LOW (default) In any case of a secondary side error the driver sets both outputs to low level and reports an error at pin nERR_OUT. As long as the driver is in error state the switching signals on primary side will be ignored. CFG_ERR = HIGH In case of a secondary side error the driver sets the affected output to low level and reports an error at pin
nERR_OUT. The second output remains at its current level, but could be forced to low level if setting pin nERR_IN to low level. Exception: in case of an under voltage condition the driver sets both outputs to low level.
Parameter Min Typ Max
Threshold high - - 11 V
Threshold low 7,5 V - -
When using SKYPER® 12 PV R in MLI application the drivers have to be set the following way: • One driver for T1 and T2 (two upper switches) • One driver for T3 and T4 (two lower switches) • VCE-monitoring of T2 and T3 deactivated (on secondary side) • Set pin CFG_ERR to high level at both drivers • Active clamping for all T1/T2/T3/T4 in addition to SoftOff to cover all error scenarios can be used
Figure 10: Concept for MLI applications
DC+
T1
T2
Load
DVCE
X10:10 PWR_VS
X10:05 CFG_ERR
+15VX100:02VCE_IN
X100:05TOP_ON
X100:06TOP_OFF
X100:09TOP_SOFTOFF
X200:05BOT_ON
X200:06BOT_OFF
X200:09BOT_SOFTOFF
511
RON
ROFF
RSOFF
RON
ROFF
RSOFF
SKYPER® 12 PV R
T2
T3
DVCE
X10:10 PWR_VS
X10:05 CFG_ERR
X200:02VCE_IN
X100:05TOP_ON
X100:06TOP_OFF
X100:09TOP_SOFTOFF
X200:05BOT_ON
X200:06BOT_OFF
X200:09BOT_SOFTOFF
511
RON
ROFF
RSOFF
RON
ROFF
RSOFF
DC-
SKYPER® 12 PV R
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.10 External error input – secondary
Each secondary side of the driver can handle an external error event like over temperature or overcurrent that is signalized via the nERR_IN inputs. The error events are evaluated and transmitted to the primary
side.
Figure 11: External failure input on secondary side
The inputs are active low. The error inputs can be disabled by connecting them to VP.
Example for a NTC over temperature circuit, on the TOP secondary side, using the external error input.
Parameter Min Typ Max
Threshold high - - 13 V
Threshold low 2 V - -
3.11 Gate resistors – secondary
The turn-on and turn-off speed of each semiconductor can be set by the external resistors RG(on) and RG(off).
Gate resistors should be surge proof. The MELF and Mini-MELF resistors in the table below are recommended.
Description Shape Manufacturer Art. no.
MELF resistors MELF / MiniMELF SMD
Vishay Beyschlag, Vishay Draloric, Vitrohm
PRO MELF resistors, SMM0207, SMM 0204, ZC series
The values of the gate resistors depends on the semiconductor chip. To specify the optimum value the maximum overvoltage during switch off has to be checked regarding DC link voltage and the dI/dt during switch on.
SKYPER® 12 PV R
VP
nERR_IN X100:04
PWR_VS_P_OUT X100:03
PWR_VS_N_OUT X100:1030.1
k
15.0k
VN
VP
PWR_GND X100:08
-
+
30.1
k
30.1
k
VP VP
1nF
100nF 332R
VNVN
1µF
VN
NTC
Threshold modification
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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3.12 External boost capacitors
The rated gate charge of the driver can be increased by adding boost capacitors to the supply rails to drive
semiconductors with a large gate capacitance.
Figure 12: Boost capacitors
• SKYPER® 12 PV R has internal capa-citors to charge gate capacitance up to 1 µC
• External capacitors can be calculated the following way:
• 𝐶𝑏𝑜𝑜𝑠𝑡 = 4µ𝐹
µ𝐶∙ 𝑄𝑂𝑢𝑡 − 4µ𝐹
• The maximum rating for output
charge per pulse of the gate driver
has to be considered.
• The boost capacitors have to be
mirrored to the primary side. Further all boost capacitors should have the same value:
• 𝐶𝑏𝑜𝑜𝑠𝑡𝑃𝑟𝑖𝑚 = 𝐶𝑏𝑜𝑜𝑠𝑡𝑃 = 𝐶𝑏𝑜𝑜𝑠𝑡𝑁
• The external boost capacitors
should be connected as close as
possible to the gate driver to achieve low inductance.
Examples for boost capacitors: AVX 12103C106K_Z2A
BOT
SKYPER® 12 PV R
X10:10 PWR_VS
X10:09 PWR_VS
TOP
X100:03PWR_VS_P_OUT
X100:08PWR_GND
X100:10PWR_VS_N_OUT
X200:03PWR_VS_P_OUT
X200:10PWR_VS_N_OUT
X200:08PWR_GND
X10:01 PWR_GND
CboostPrim CboostN
CboostP
CboostN
CboostP
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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4. Protection features
4.1 Failure management
The SKYPER® 12 PV R detects undervoltage on primary and secondary side, short circuit of the semiconductors and external error events like overtemperature conditions. Any error detected will force the output nERR_OUT to low state and has to be reset by the customer controller. When entering error state the semiconductors will be switched off (semiconductor driving signals are set to VN). Active switching
signals at the inputs of the driver will be ignored. Nonetheless, the input signals have to be set to low for 9µs to confirm the error and the error root cause has to be solved for 30µs. The following failures are indicated at the error output: • Undervoltage of primary side supply voltage • Undervoltage of secondary side voltages • Short circuit of the semiconductors
• External errors (e.g. over temperature circuits from the adapterboard)
Figure 13: Behavior on error event in default mode -> CFG_ERR = LOW
On error event the driver switches off=> VGE is negative
t
t
Any error(nERR_IN)
30 µs
t
TOP_IN
BOT_IN
9 µs
t
nERR_OUT
t
TOP_ON
t
BOT_ON
Error state is over:- No error for more than 30µs- No switching signals for at least 9µs
Switching signals are accepted again
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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4.2 Dead time generation (Interlock TOP / BOT )
The internal dead time of SKYPER® 12 PV R can be adjusted between 2µs and deactivated mode.
Deadtime activated
The deadtime function prevents, that TOP and BOT semiconductors of the same half bridge are being activated simultaneously. The dead time is not added to a dead time given by the controller. It is possible to control the driver with one switching signal and its inverted signal. No error signal will be generated when signals are overlapped.
Case Controller dead time Total dead time
Controller > driver 4µs 4µs
Controller < driver 1µs 2µs
Controller no dead time No dead time 2µs
Deadtime deactivated
When deadtime is deactivated the two semiconductors can be switched independent from each other. In this mode the two channels even can be switched on at the same time. Further, the mapping to TOP and BOT semiconductor is no longer relevant and can be interchanged. Important: When deadtime function is deactivated a shoot through is not prevented reliably.
4.3 Short pulse suppression
This driver functionality suppresses short on- and off-pulses on the switching signal inputs. This way the semiconductors are protected against electromagnetic noise. The filter time can be set by the customer via the CFG_FLT pin. When using the digital filter the tolerances are very low over the full temperature range. The analogue setting can be chosen for ambitious applications, like magnetic resonance imaging, which require very low jitter values. The propagation delay times depend on the filter setting.
Signal Function Specification
CFG_FLT = HIGH Digital filter
Filter time: 390 ns
Delay time: 830 ns
Jitter: ±12.5 ns
CFG_FLT = LOW Analog filter Filter time: 200 ns Delay time: 600 ns Jitter: ±3 ns
Parameter Min Typ Max
Threshold high - - 14 V
Threshold low 1 V - -
4.4 Under voltage protection
If the power supply drops below a negative threshold level the driver switches the semiconductors off and indicates an error on Pin X10:03. After passing the positive threshold, the driver can operate again.
Parameter Min Typ Max
Threshold negative 12.2 V - -
Threshold positive - - 13.9 V
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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4.5 Dynamic short circuit protection
The dynamic short circuit monitor supervises the collector-emitter voltage VCE of the semiconductor during its on-state. The protection circuit is called dynamic, because immediately after turn-on of the
semiconductor, a higher value is effective than in steady state. When an error is detected the affected semiconductor is turned off via the SoftOff path. Further an error is reported to the primary side.
Figure 14: Application design for the VCE-monitoring (example for TOP secondary side)
• In off-state the pin CFG_VCE is pulled to VP The external capacitor CCFG is charged and has the same potential as VP. After switch on the internal pull-up transistor is deactivated and the voltage VCEref at the reference
input CFG_VCE sinks to the voltage level defined by the external voltage divider (R1 and R2).
• The maximum reference voltage is 9.5V which is related to the VCE comparator.
• The blanking time tbl(VCE) describes the duration
from start of the switch on process to the point of time when VCEref crosses the 10V threshold.
• After tbl(VCE) has passed, the VCE-monitoring will be triggered as soon as the voltage at pin VCE_IN exceeds VCEref and will turn off the semiconductor.
• The voltage at pin VCE_IN is the VCE voltage plus the forward voltage of the high voltage diode DVCE
and the voltage drop over RV. The voltage at pin VCE_IN is limited to 10V, by the internal voltage divider. As long as the VCE voltage is higher than 10V the diode blocks it.
𝑉𝐶𝐸𝑠𝑡𝑎𝑡 = 𝑉𝑃
𝑅2
𝑅1 + 𝑅2
𝑡𝑏𝑙(𝑉𝐶𝐸) = −𝐶𝐶𝐹𝐺 ∙𝑅1 ∙ 𝑅2
𝑅1 + 𝑅2∙ ln (
10𝑉𝑉𝑃
(𝑅1 + 𝑅2) − 𝑅2
𝑅1)
VDC
VCE-Error
SKYPER® 12 PV R
Semiconductor-On
E
C
R1
R2 CCFG
RV
CV
-
+
VP
DVCE
X100:02VCE_IN
X100:03PWR_VS_P_OUT
10k
5k
X100:01CFG_VCE
VP VP
5
10
15
V
t
VCEstat
VCEsat
VCEref
VCE
turn on instant
0
tbl(VCE)
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
Page 16/20
4.6 Active clamping
Figure 15: Application example for active clamping
The driver offers the possibility of reducing over voltages during switching. The voltage level where
the clamping starts is set by the breakdown voltage of the component with zener characteristic e.g. DClmp. If, during a switch off Vce raises beyond VZener the clamping diodes get conductive. This current
switches the gate on again until the VCE voltage is reduced below the VZener reference.
Important: During the clamping process the semiconductor is working in linear mode and is producing additional losses coming from the energy stored in the stray inductance. So active clamping must not work during standard switching to avoid thermal overstress and
reduced IGBT lifetime. It should only be used in case of error. The CLMP_IN input indicates the driver that the clamping is active so the driver output stage can be deactivated and losses on the driver can be reduced.
The resistors RCLMP and RV have to be set, so that the input voltage on the clamping input raises above the
threshold (13V) during active clamping. Also consider the internal pull-down resistor for the dimensioning.
VP
t
VGate
GND
VN
VCE
VZENER
VDCLink
Parameter Min Typ Max
Threshold high CLMP-input - - 13 V
Threshold low CLMP-input 2 V - -
VCE
SKYPER® 12 PV R
DV
RV
E
C
RCLMP
ROFF
VZener
DClmp
IGBT-Off&
VClmp
PWR_VS_N_OUT X100:10
PWR_GND X100:08
TOP_OFF X100:06
CLMP_IN X100:07
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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4.7 SoftOff
In the event of short circuit, the SoftOff feature increases the resistance in series with RG(off) and slows down the turn-off speed of the semiconductor. The reduced di/dt reduces the voltage spike above the
collector emitter in the short circuit case. The SoftOff resistor should be calculated 10 times as high as the standard off resistor. Typical values depend on the IGBT chip but lie in the range between 30-50 Ohm. Target is to stay within the short circuit proofed time of the semiconductor but at the same time reduce the overvoltage below the maximum collector emitter voltage of the semiconductor. It is mandatory to populate a SoftOff resistor of at least 1 Ohm to ensure a proper turn-off process in case
of a detected semiconductor’s desaturation according to chapter 4.5. If the driver’s SoftOff input is not connected to the gate of the semiconductor via a SoftOff resistor the semiconductor will not be switched-off in case of a desaturation detection.
Figure 16: SoftOff Resistor
DC+
T1
T2
X100:02
X100:05TOP_ON
X100:06TOP_OFF
X100:09TOP_SOFTOFF
X200:05BOT_ON
X200:06BOT_OFF
X200:09BOT_SOFTOFF
RON
ROFF
RSOFF
RON
ROFF
RSOFF
DC-
SKYPER® 12 PV R
© by SEMIKRON / 2018-11-22 / Technical Explanation / SKYPER® 12 PV R PROMGT.1026/ Rev.7/ Template Technical Explanation
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5. Environmental conditions
Insulation parameters Rating
Grid voltage (grounded delta) 690V
Climatic Classification Pollution Degree (PD) PD2
Maximum permanent DC link voltage (EN 61800-5-1) 1500V
Climate class 3K3 – IEC 60721-3-3
Maximum altitude (above sea level) 2000 meter above sea
Overvoltage category (according to EN 61800-5-1) OVC 3
Isolation resistance test, Prim-Sec, two times per lot as series test.
Insulation test must be performed in the system.
5000 VAC, rms,2s (10s as type
test)
Partial discharge (tested 100% of transformer) 2.2kV/1.8kV
Creepage distance primary/secondary side 20.9mm
Clearance distance primary/secondary side 14.0mm
Creepage distance secondary secondary 10.5mm
Clearance distance secondary secondary (within a circuit, OVCI) 6.1mm
CTI of PCB II (400-600)
CTI of transformer I (600)
Environmental Condition Norm / Standard
Operating/storage temperature -40.. +85 °C
High humidity 85 °C, 85%
Flammability UL94 V0 Heavy flammable materials
only
RoHS / WEEE / China RoHS/ UL
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EMC Condition Norm / Standard Parameter
ESD IEC 61000-4-2
IEC 61800-3 EN 50121-3-2
6 kV contact discharge /
8 kV air discharge
Burst IEC 61000-4-4 IEC 61800-3 EN 50121-3-2
≥ 2kV on adaptor board for signal lines ≥ 4kV for AC lines
Immunity against radiated interference
IEC 61000-4-3 IEC 61800-3 EN 50121-3-2
≥ 20V/m 80MHz – 1000MHz
Immunity against conducted
interference
IEC 61000-4-6
IEC 61800-3 EN 50121-3-2
≥ 20V
150kHz – 80MHz
Shock Vibration
Vibration Sinusoidal 20Hz … 500Hz, 5g, 2h per axis (x, y, z), 26 sweeps Random 10Hz … 2000Hz, 3g, 2 h per axis (x, y, z)
Shock 180 Shocks (6 axis; +-x, +-y, +-z, 30 shocks per axis), 30g, 11ms Connection between driver and PCB has to be reinforced by support post
Quality
6. Marking
Figure 17: Labeling
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Figure 1: SKYPER® 12 PV R ............................................................................................................... 2 Figure 2: Block diagram of SKYPER®12 PV R ....................................................................................... 2 Figure 3: Dimensions ....................................................................................................................... 3 Figure 4: Connector X10, X100, X200 (male RM2.54 10p) .................................................................... 4 Figure 5: Support post ..................................................................................................................... 4 Figure 6: Application specific wiring ................................................................................................... 7 Figure 7: TOP and BOT inputs ........................................................................................................... 8 Figure 8: Error output ...................................................................................................................... 9 Figure 9: Example for bidirectional error with two drivers ..................................................................... 9 Figure 10: Concept for MLI applications ............................................................................................ 10 Figure 11: External failure input on secondary side ............................................................................ 11 Figure 12: Boost capacitors ............................................................................................................. 12 Figure 13: Behavior on error event in default mode -> CFG_ERR = LOW .............................................. 13 Figure 14: Application design for the VCE-monitoring (example for TOP secondary side) .......................... 15 Figure 15: Application example for active clamping ............................................................................ 16 Figure 16: SoftOff Resistor .............................................................................................................. 17 Figure 16: Labeling ........................................................................................................................ 19
References
[1] www.SEMIKRON.com [2] A. Wintrich, U. Nicolai, W. Tursky, T. Reimann, “Application Manual Power Semiconductors”, 2nd
edition, ISLE Verlag 2015, ISBN 978-3-938843-83-3
IMPORTANT INFORMATION AND WARNINGS
The information in this document may not be considered as guarantee or assurance of product characteristics
("Beschaffenheitsgarantie"). This document describes only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes. SEMIKRON INTERNATIONAL GmbH Sigmundstrasse 200, 90431 Nuremberg, Germany Tel: +49 911 6559 6663, Fax: +49 911 6559 262 sales@semikron.com, www.semikron.com
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