slimm nano marketing pres
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SLLIMM-nano
Small low-loss intelligent molded modules
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Topics
Introduction to SLLIMM-nano
Features and protection
Package technology
Performance
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Module versus discrete approach
Short timeto market
Reduced design time andefforts (i.e. easier layout)
Not need for optimizingphase for power stage
Lower manufacturing cost
Single component instead ofseveral
Embedded protection
Space saving
Lower assembly cost
Higher yield
Easier management
Use of external analogcomponents can cause
time delay and noise
IGBTs/diodes HVICs Passivecomponents
High qualityand
reliability
Fewer components andsolder joints
Improved efficiency
Reduced EMI and noise
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Compact and reliable IPM for low-powermotor drives
The SLLIMM-nano is an intelligent power module and includes: three half-bridge HVICs for gate driving
six IGBTs six fast and ultra-soft recovery diodes for freewheeling
It is housed in a very compact and thermally efficient NDIP-26L package
The design of the embedded IGBTs and freewheeling diodes is tailored to offer the besttrade-off between switching and conduction losses for low-power BLDC motorapplications, resulting in high efficiency and low EMI
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Applications
Power range up to 100 W (free air)
9 Fans 9 Pumps 9 Compressors
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Main features and benefits
Features Benefits
Optimized driving characteristics Saved effort and design time
Low electromagnetic interference Reduced EMI and noise
VCE(sat) negative temperature coefficient Improved static performance with increasing temperature
3.3 V, 5 V, 15 V CMOS/TTL input comparators withhysteresis and pull-down/pull-up resistors
Easy and flexible driving
Undervoltage lockout Malfunctioning and fault prevention
Internal bootstrap diode Reduced bill of material and easier layout
Interlocking function Cross conduction prevention
Smart shutdown function Increased safety
Comparator for fault protection against over-temperatureand overcurrent
Effective failure protection
Uncommitted op-amp (for advanced current sensing) Flexible amplifying configurationsOptimized pinout Compact and simplified layout
Open emitter configuration Low-cost and flexible current sensing
1.57 mm creepage between high- and low-voltage pins Improved system safety
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SLLIMM-nano nomenclature
Technology information:H = Tailored for MC
Switch type:G = IGBT
Max VCE rating (x10)
Package type:N = NDIP (nano)
IC rating
Intelligentpower
GIPN3H60A
IC features:9 A = Basic version9 blank = Full version
(SD, comparator, op-amp)
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Part number STGIPN3H60A STGIPN3H60
Pin count 26 26
Package size (mm) 29.5 x 12.5 x 3.1 29.5 x 12.5 x 3.1
Voltage (V) 600 600
Current @ Tc = 25 C (A) 3 3
RTH(J-A) (C/W) 50 50
Integrated bootstrap diode
Smart shutdown funct ion
SD function
Op-amps for advanced current sensing
Comparator for fault protection
3.3/5 V input interface compatibil ity
Interlocking funct ion
Undervoltage lock out (on both VCC and VBOOT)
Product overview
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DIP molded package
Copper frame
RoHS and UL compatible
Small form factor
Package: full molded module
DiodeIGBTIC
Epoxymoldingcompound
CuframeCuframe
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Signal side is lowvoltage only
Leads optimized to preventpin short circuit during
soldering process
Package outline
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Further information
Please visitwww.st.com/modules
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