rfid in the world of printed electronics

RFID in the world of Printed Electronics

Application/Cost/Supply Chain

Dr. Andreas Schaller

ASC Andreas Schaller Technology Consulting

info@andreas-schaller.de

Dr. Andreas Schaller

RFID in the world of Printed Electronics1

SMT Hierarchy

RFID in the world of Printed Electronics2

Connections between physically separate

systems such as host computer to

terminals, computer to printers, and so on.Level 5 Connections between systems

Level 4 Subassembly

Level 3 Connections between PWBs

Level 2 Printed Wiring Board (PWB)

Level 1 Integrated Circuits

Level 0 Monolithic Silicon Chip Gate-to-gate interconnections on a

monolithic silicon chip

Connections between two subassemblies.

For example, a rack or frame may hold

several shelves of subassemblies that

must be connected together to make up a

complete system.

Connections between PWBs, including

PWB-to-PWB interconnections or card-to-

motherboard interconnections.

Printed wiring board (PWB) level of

interconnections. Printed conductor paths

connect the device leads of components

to PWBs and to the electrical edge

connectors for off-the-board

interconnection.

Packaging of silicon chips into dual-in-line

packages (DIPs), small outline integrated

circuit (SOICs), chip carriers, multichip

packages, and so on, and the chip-level

interconnects that join the chip to the lead

frames.

PET Hierarchy

RFID in the world of Printed Electronics3

Level 5 Connections between systems Ambient Intelligence

Level 4 Subassembly System Integration

Level 3 Connections between PWBs Smart System

Level 2 Printed Wiring Board (PWB) System-in-Foil

Level 1 Integrated Circuits Functional Layers

Level 0 Monolithic Silicon Chip Printable InkSilver Ink

Printed

Antenna

RFID Label

Battery Assisted

Label

Smart Package

RFID System

SMT PET Example

PET Applications and KPI

RFID in the world of Printed Electronics4

PET Products

Large Area Printing

Small Feature Printing

min

PET Market Players examples only

RFID in the world of Printed Electronics5

PET Benefits beyond cost

RFID in the world of Printed Electronics6

Smart Objects are driven by LEVEL 5

(Content driven) Connectivity enables an object to become ”smart”

Flexible Electronics is driven by LEVEL 4

Customer Benefits is flexible-to-install vs. flexible-to-use

Integrated Smart Systems are driven by LEVEL 3

Application driven system integration

Large Area Electronics is driven by LEVEL 2

Macro electronics for functional area maximization (vs. microminiaturization)

Printed Electronics is driven by LEVEL 1

Low cost and environmental preferred manufacturing

Organic(Inorganic) Electronics is driven by LEVEL 0

Multi-functional materials for electronic and sensing functions

Printed RFID Markets

RFID in the world of Printed Electronics7

Ticketing (Disposable)

(Integrated Smart System)Pharma (New Services )

(Smart Objects)

ehealth ( Hygiene )

(Integrated Smart System)

eMarketing ( HMI )

(Large Area Electronics )

Games (New Services)

(Smart Objects)

All use cases are disposable !

System Integration (SMT)

RFID in the world of Printed Electronics8

<

40

<

20

<

10

Gross Margin in %

System Integration (RFID)

RFID in the world of Printed Electronics9

Packaging

Battery

> 0,10 €

< 5 €

System Integration (pRFID V1)

RFID in the world of Printed Electronics

10

R2R Q↑

Battery

Packaging Packaging

> 10 €

€ TBD

System Integration (pRFID V2)

RFID in the world of Printed Electronics

11

S2S Q↑

Battery

Packaging Packaging

~ 0,10 €

System Integration (pRFID V3)

RFID in the world of Printed Electronics

12

R2R

Battery

Packaging Packaging

€ TBD

> 10 €Packaging

System Integration (PET)

RFID in the world of Printed Electronics13

Additional Printed RFID Components

RFID in the world of Printed Electronics14

Contact Readout Conductive Readout RF Readout

Passive

Active

(Sensing)

ROM /WORM

RAM ROM /WORMROM /WORM

WORM / RAM

Primary Batteries Primary / Secondary Batteries

Sensing !

Smart Packaging Examples

RFID in the world of Printed Electronics15

Smart Packaging

Non-Inductive Tag Printed EAS Tag Printed RFID Tag UHF RFID Tag Hybrid Tag

Comparison

………… …… …………

Smart Packaging Costs

RFID in the world of Printed Electronics16

Ink

(Organic and/or Inorganic)

Foils and/or Paper Inkjet / Gravure / Screen

Printing

Assembly

(Lamination)

Lamination

Labeling

(none if integrated)

Battery and/or IC

Antenna and/or Sensor

Connectingwire / wireless

Tagged Object

( included in BOM)

Costs Comparison

RFID in the world of Printed Electronics17

RFID

RFID

Optimized Costs

RFID in the world of Printed Electronics18

RFID

RFID

Printing

Foils

Inks

Added Value ?

Active Systems

RFID in the world of Printed Electronics19

Active

System

Smart Packaging Cost Drivers

RFID in the world of Printed Electronics20

Component System

Passive Harvesting Active

Active

Passive

Driven by Higher PET Levels

Driven b

y L

ow

er

PE

T L

evels

Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3

Cost %

Cost %

TBD TBD

Printed Sensor Tag

RFID in the world of Printed Electronics21

System-in-Foil

Write

Function : SensingEnergy Harvesting

Even

tD

ata

Function : Storing

Info

rmat

ion

Function : Computing

Function : ConnectingEnergy Harvesting

Kn

ow

led

ge

Rea

d / W

rite

Cost Breakdown

RFID in the world of Printed Electronics22

Passive System

Running Costs

Foils

Row Material Ink

Screen Gravure

Alignment Lamination

% Cost = Bill Of Material (BOM) + Conversion Costs (CC)

Bill Of Material (BOM)= cost of purchased row materials, sub-assemblies, components, parts

Conversion Costs (CC)= cost of changing row materials into finished or semi-finished products

Optimization Potential (Theoretical)

RFID in the world of Printed Electronics23

Level Action Potential for Reduction

• Level 5 : Update only Infrastructure Firmware

• Level 4 : Integrate Automated Inline Customization - 50%

• Level 3 : Focus on Passive Solutions

• Level 2 : Reduce Numbers of Layers (Avoid Alignment) - 85%

• Level 1 : Switch from Batch to Inline Printing Processes - 50%

• Level 0 : Change from Contactless (13.56 MHz) to a

Sweep/Contact Readout - 40%

Passive System

Running Costs

Foils

Row Material Ink

Screen Gravure

Alignment Lamination

- 60%

% Cost = Bill Of Material (BOM) + Conversion Costs (CC)

Net Present Value Breakdown

RFID in the world of Printed Electronics24

% Net Present Value (NPV)

Net Present Value (NPV) = Method for using the time value of money to appraise long-term projects

Interest Rate =15%

Profit Margin [Level]

Questions ?

RFID in the world of Printed Electronics25

Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)

Dr. Andreas Schaller

Email : Andreas.Schaller@t-online.de

Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)

Office : Schulstr. 11, 95676 Wiesau

Management : Dr. Andreas Schaller

District Court : AG Weiden, HRB 3499