qualcomm 60ghz wigig/wifi 802.11ad chipset world’s first ... · qualcomm 60ghz wigig/wifi...

2018 is a turning point for 5G communications.All players have done several studies on hugedata rates using millimeter wave (mmWave)compared to current technologies. Today,manufacturers are focusing on backhaulapplications with high power and no voltagelimitation. But the next steps – such as handsetapplications - are gaining attention asintegration will have several issues to solve,including chip implementation, packagingtechnology, antennae placement and heatmanagement. Using the 60GHz band, the IEEEhas licensed a Wi-Fi 802.11 protocol, known asWiGig. Today, a few routers and only onecommercially available smartphone use thisprotocol, providing an early glimpse of 5Gmobile capability and using Qualcomm’schipset.

This complete solution has been designed forsmartphones, especially for ASUS. The module,integrated in the ASUS ZenFone 4 Pro, comeswith two systems linked by a coaxialconnection. Both Systems-in-Packages (SiPs)use non-conventional double-sided moldedpackaging developed by Murata. One isintegrated on the main board and the otherfeatures innovative antennae integrated into anorganic PCB. The latter SiP integrates almost 20antennae, a radio frequency integrated circuit(RFIC) die, thermal management and isolationsolution, all in a single package smaller than40mm².

Developed by Wilocity, which has been aQualcomm subsidiary since 2014, the RFIC fea-

tures up to four transceivers controlling up to32 antennas, both patch and dipole, forbeamforming at 60GHz. Both SiPs have verythin confined PCB substrates and embeddedcopper pillars realizing the signal distributionstructure. This first integration of such ammWave device in a handset shows the fullcompatibility of this SiP technology that couldanswer 5G integration issues.

This report includes a full investigation of thesystem, featuring a detailed study of the SiPsand the antenna board including die analyses,processes and board cross-sections. It containsa complete cost analysis and a selling priceestimation of the system. Finally, it features anexhaustive comparison with the QualcommQCA9500, which is dedicated to routers ormobile computers.Title: Qualcomm WiGig

Chipset Smartphone Edition

Pages: 157

Date: July 2018

Format: PDF & Excel file

Price: EUR 3,490

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

Early glimpse of very compact form millimeter-wave chipset commerciallyavailable for handset applications.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

COMPLETE TEARDOWN WITH

• Detailed photos and cross-sections

• Precise measurements

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• Supply chain evaluation

• Manufacturing cost analysis

• Comparison with QCA9500 chipsetfor router applications

• Estimated sales price

Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

TABLE OF CONTENTS

Overview/Introduction

Company Profile and WiGig technology

ASUS ZenFone 4 Pro Teardown

Physical Analysis

• Physical Analysis Methodology

• Module Analysis

Module view and dimensions

Module marking and block diagram

• Main Board and Antenna Board Analysis

Board overview

Board bill of material

Board cross-section

• Baseband and Antenna SiP analysis

Package view and dimensions

Package X-Ray: antennae placement and connection

Package opening: copper pillar, bill of material

Package cross-section: PCB, copper pillar, dimensions

Package process analysis

• Die analysis: Baseband processor and RFIC

Die view and dimensions

Die delayering and main block ID

Die cross-section

Die process

• Die analysis: Current and voltage regulator, memory

Die view and dimensions

AUTHORS

Die cross-section

Die process

• Physical analysis comparison

SiP vs discrete

Femtocell vs. smartphones application:

system, size and features, antennae

Manufacturing process flow

• Die fabrication unit: Baseband processor, RFIC

• Packaging fabrication unit

• SiP package process flow

Cost Analysis

• Overview of the cost analysis

• Supply chain description

• Yield hypotheses

• Die cost analyses: Baseband processor, RFIC

Front-end cost

Wafers and die costs

• Baseband and Antenna SiP Package cost analysis

Baseband and antenna SiP front-end cost

Baseband and antenna SiP cost by process step

• Final test cost

• Final assembly

• Component cost

Estimated Price Analysis

Qualcomm VIVE® QCA9500High Density WiGig/WiFi802.11ad Chipset for the 60GHz BandDisruptive double side moldedsystem-in-package-based chipset formillimeter-wave applications tar-geting consumer devices, includingintegrated antennae.January 2018 - EUR 3,990*

RF Front-End Module Comparison2018Extensive overview of 40 RF Front-End modules and components foundin 10 flagship products, includingthe Apple Watch Series 3, iPhone 8and X, Samsung Galaxy S8, HuaweiP10, Asus Zenfone4 Pro, Sony XZsand Xiaomi Mi6.May 2018 - Price: EUR 6,490*

Advanced RF SiPs for CellPhones: Reverse CostingOverviewPhysical analyses and cost estimationof radio-frequency Systems-in-Packages from Skyworks Solutions,Murata, TDK-Epcos, Qorvo andBroadcom/Avago.November 2017 - EUR 4,990*

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Dr Stéphane Elisabeth has joinedSystem Plus Consulting's team in2016. He has a deep knowledge ofMaterials characterizations andElectronics systems.He holds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.

Yvon Le Goff has joined SystemPlus Consulting in 2011, in order tosetup the laboratory of SystemPlus Consulting. He previouslyworked during 25 years in AtmelNantes Technological AnalysisLaboratory as fab support inphysical analysis, and 3 years atHirex Engineering in Toulouse, in aDPA lab.

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