phase 1 fpix mechanics status phase 1 pixel upgrade workshop - aug2012 plenary iv session1 kirk...
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Plenary IV Session 1
Phase 1 FPIX mechanics status
Phase 1 Pixel Upgrade Workshop - Aug2012
Kirk ArndtPurdue University
for CMS FPIX Mechanical GroupS. Kwan, C.M. Lei, S. Los, G. Derylo (Fermilab)
G. Bolla, D. Bortoletto, I. Shipsey, Y. Ding, V. Noe-Kim, D. Snyder (Purdue)
Plenary IV Session 2
4-Blade Thermal Test Setup• 1st and 4th blades were glued to C-C rings with
high-temperature thermally-conductive epoxy Duralco 132.
• 2nd and 3rd blades were bonded with indium solder #1E (52%In 48%Sn).
• Duralco 132 epoxy was applied on all blade corners to reinforce the indium-bonded blade-to-rings joints.
• SS tubing was bonded within grooves in the C-C rings with Indalloy solder 121 (96.5%Sn 3.5%Ag) in the lower half and filled with thermal fillers in the upper half.
• RTDs were glued at points of interest.• An IR Camera was used to measure the blade
temperatures.• SS tubing was connected to the Fermilab CO2
cooling system• The whole assembly was installed inside an
insulated enclosure which is cooled by CO2 and purged by dry nitrogen.
Coolant inletCoolant outlet
Blade #1Inner C-C ring
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 3
-14.1-11.2-9.0
-7.9-11.1
Blade 1 Blade 2 Blade 3 Blade 4
4-Blade Test ResultsTemperature data at different module heating powers: 0, 1, 2 and 3 W per module
-15.2
Ambient
3.2
0 -19.31 -12.32 -8.13 -4.5
0 -17.41 -12.42 -7.33 -3.2
0 n/a1 n/a2 n/a3 n/a
3.2
0 -18.31 -9.92 -2.03 +5.5
0 -17.71 -9.22 -1.83 +5.7
0 n/a1 n/a2 n/a3 n/a
3.2
0 -19.01 -12.02 -5.73 +0.4
0 -18.11 -11.82 -4.73 +0.8
0 n/a1 n/a2 -7.73 -2.1
3.2
0 -19.01 -12.02 -5.63 +0.8
0 -17.31 -10.62 -4.53 +1.4
0 n/a1 n/a2 n/a3 n/a
0 -18.01 -18.02 -17.93 -17.7
0 -15.61 -14.22 -12.93 -11.7
0 -14.41 -11.62 -9.13 -6.8
0 -14.71 -12.82 -11.23 -9.9
0 -5.11 -4.82 -4.23 -3.9
0 -16.21 -14.92 -13.73 -12.7
0 -16.61 -16.52 -16.33 -16.3
Coolant inlet
Coolant outletInner C-C ring
Note: C-C rings and tubing temperatures measured by RTDs. Blade temperatures obtained from IR camera images.
Outer C-C ring
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 4
Blade temperatures (relative to the temperature measured on inlet tube) as a function of total power per blade
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 5
C-C ring temperatures (relative to the temperature measured on inlet tube) as a function of total power per blade
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 6
Conclusions from 4-Blade Test• Blade and C-C ring temperatures varied in proportion to the module power
– ∆T from center to ends of the blades was ~2.5oC with 3W per module (6 W per blade) input power
– ∆T from the inlet tube to the center of the blades was about:• 22oC on blade 3 (solder joints)
• 17oC on blade 2 (solder joints)
• 17oC on blade 1 (epoxy joints)
• 13oC on blade 4 (epoxy joints)
– ∆T from the inlet tube to the RTDs on the C-C rings was about:• 4 to 6oC on the outer ring
• 5 to 9oC on the inner ring
• All Blade ∆T’s failed to meet the <10oC design goal (which is actually <~8oC between blades and cooling to allow for ~2oC ∆T between modules and blades).
• The solder joints between blades and C-C rings performed poorly compared to the epoxy joints.
• The temperature rise of the C-C rings above the cooling inlet temperature was large.
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 7
Post Mortem of Blade #3
Silver coating remained,
never wetted.
Silver coating never wetted by solder
Once bonded with indium then
coating detached because of surgery.
Once bonded with solder then
coating detached during surgery
Finding: large voids existed between solder bonding surfaces , probably as a result of unmatched machined surfaces.Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 8
Alternative Blade Attachment Designs
Option A: Slot with depthplus
cf on both sides
Option B: Slot with depthplus
cf on 1 side
Option C: Through slotplus
cf on 1 side
- Option A: 0.8 mm end surface only - Option B : 0.75 mm wall on 1 side + 0.74 mm end surface - Option C : 2 mm wall on 1 side only
• Abandon the elevated tab design, which required 2 perfectly matched machined surfaces• Adopt a slot design which is easier to machine, solder, and increases contact area • Solder required to be in contact with TPG directly • The following 3 options are considered:
Notes: After the solder joint is made, epoxy will be used between the cf & C-C for a better structural joint. The blade profile is different for the inner and outer assemblies.
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 9
• 2 different shapes for blades needed
• Blade matched to outer assembly C-C rings shown here
• Identical blade does not match inner assembly C-C rings
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 10
Choices of Solder
Solder Available FormJoining Temp, C
Tensile Strength, psi
Lap shear, psi
Thermal K, W/m-K
CTE ppm/C
50 In 50 Sn0.030" wire/0.002"
ribbon 140 1720 1630 34 2058 Bi 42 Sn 0.030" wire only 160 8000 500 19 15
96.5Sn 3.0Ag 0.5Cu 0.030" wire/0.002"
ribbon 250 7200 n/a n/a n/a
96.5Sn 3.5Ag 0.030" wire/0.002"
ribbon 250 5800 2700 33 30S-200 0.063" wire only 220 n/a 5000 50 n/a
• Solder in ribbon form can be placed in contact with the C-C part first. Blade is then inserted into the slot and brought into contact with the solder.
• Solder in the form of wire is applied after the blade is inserted, along the width of blade just outside the slot. Electrical heater or ultrasonic solder iron is then used to flow the solder to fill the gap. Flux may or may not be needed.
• Setup time for the production HD is long and flux can be boiled away, so it is preferred that no flux be used.
• Brazing Graphite–Carbon Bonding is available from a carbon-bonding vendor S-Bond Technologies. Joining with S-Bond requires a special high temperature/vacuum metallization done at SBT or under a special license. Thermal conductivity >50 W/m-K and shear strength >5000 psi is claimed.
• After the S-Bond metallization is complete, any solder filler may be used to bond the graphite/carbon surfaces, provided it is fluxless and uses mechanical agitation to disrupt the solder’s oxide surfaces during assembly. This is an accessibility issue for production (i.e. can ultrasonically solder only 1 blade at a time).
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 11
Next Steps• Fabricate simple test samples
with different blade attachments. Profile and dimensions are basically the same as those for production except with straight TPG edges on flat C-C pieces.
• Perform FEA to verify thermal and structural performances.
• Resume thermal tests including thermal cycles.
Typical 1-Blade Sample(Option C as shown)
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 12
Phase 1 FPIX Service CylinderConcept for assembly of the cooling lines beyond the Half-Disks,
DC-DC converters and POH/Portcards
3 Half Disks
Port Cards and POH
End Flange
DC-DC converters
Pipes and Cables
CO2 cooling tubes and flex cables
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 13Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 14
Supply Tubes between HDs and Portcards (blue)Return Tubes (white)
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 15
DC-DC Converter Bus boards
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 16
Supply Tubes for DC-DC Converters
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 17
DC-DC Converter Mount Blocks
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 18
DC-DC Converters
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 19
POH / Portcard mount blocks (lower halves)
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 20
Supply Tubes for POH / Portcards
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 21
POH / Portcard mount blocks (upper halves)
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 22
POH (3 per port card) on mount blocks
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 23
POH and Portcards
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 24
Single Portcards with 14 module readout flex cables per portcard
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 25
Double-stacked Portcards (2 POH per port card) withwith 7 module readout flex cables per portcard
1st tier
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 26
Double-stacked Portcards (2 POH per port card)
2nd tier
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 27
• Flex cables attachment to the port cards still to be done.• Some cable slots on the forward section need to be relocated slightly.• For the first installation, it seems doable and easier to install in this order
1st outer, 1st inner, 2nd outer, 2nd inner, 3rd outer and 3rd inner.
Notes:
Mock-up of phase 1 service cylinder
Dummy flex cables outside cylinder
Some interference of this cable with the spoke
Cable slots to be relocated to reduce cable
interference with the spokes
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 28
Backup slides
Phase 1 Pixel Upgrade Workshop - Aug2012
Phase 1 FPix Cooling & Mechanics Update 291-Feb-12
• 3 joint samples consisting of cf encapsulated TPG & CC were successfully made– 2 samples made on coatings
of Ni + Ag– 1 sample made on coatings
of Al + Ti + Ni + Ag• Reasonable joint strength
observed• Thermal testing was
conducted on first 2 samples
Indium Bonding R&D Status
Weight of steel ruler & al block ~ 235 g
USCMS Collaboration Meeting 30
X-Ray for TPG sample through CC base
New Joint Samples Made and Inspection Coating recipe: 5 micron Nickel + 1 micron Silver - 1 sample between cf encapsulated TPG and CC - 1 sample between ss tubing and CC - all samples appear to have good joint strength
Cut-section Check
18 May 2012
Plenary IV Session 31
Sample Option A A A B C C C D
Large end C-C 0.75mm dp slot 0.75mm dp slot 0.75mm dp slot thru' slot thru' slot thru' slot thru' slot 0.75mm dp slotLarge blade end cf on both sides cf on both sides cf on both sides cf on 1 side cf on 1 side cf on 1 side cf on 1 side cf on 1 side
Small end C-C 0.75mm deep slot 0.75mm deep slot 0.75mm deep slot 0.75mm deep slot thru' slot thru' slot thru' slot 0.75mm deep slot Small blade end cf on both sides cf on both sides cf on both sides cf on both sides cf on 1 side cf on 1 side cf on 1 side cf on 1 side
TPG L end t, mm 0.8 0.8 0.8 0.74 0.74 0.74 0.74 0.74Slot width, mm 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.04
solder t, mm 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1glue t, mm 0.14 0.14 0.2 0.2 0.2 0.2 0.2
Blade installation
slide in through open-end slot
engage L end C-C first; move in S end C-C
with tooling
engage L end C-C first; move in S end C-C
with tooling
slide in radial inwards thru' L end C-C;
push TPG sideway in contact with indium; fill up the gap with
epoxy;
slide in radial inwards thru' L end C-C;
push TPG sideway in contact with indium; fill up the gap with
epoxy;
slide in radial inwards thru' L end C-C;
keep 0.004" gap btw TPG & C-C wall; fill up the gap with epoxy;
slide in radial inwards thru' L end C-C;
keep 0.004" gap btw TPG & C-C wall; fill up the gap with epoxy;
slide in through open-end slot
coating Ni + Cu Ni + Cu S-Bond Ni + Cu Ni + Cu S-Bond S-Bond S-Bond
solder application
place 0.76mm 96.5Sn, 3.5 Ag wire beyond the groove
after blade installation
place 0.1mm 96.5Sn, 3.5 Ag ribbon
before blade installation
place 0.1mm 96.5Sn, 3.5 Ag ribbon
before blade installation
place 0.1mm 96.5Sn, 3.5 Ag ribbon
before blade installation
place 0.1mm 96.5Sn, 3.5 Ag ribbon
before blade installation
place 1.6 mm S-200 wire after blade
installation
place 0.76mm 96.5Sn, 3.5 Ag wire
after blade installation
place 1.6 mm S-200 wire after blade
installation
Post work add epoxy btw C-C &
cf add epoxy btw C-C &
cf add epoxy btw C-C &
cfadd epoxy btw C-C &
cfadd epoxy btw C-C &
cfadd epoxy btw C-C &
cfadd epoxy btw C-C &
cf add epoxy btw C-C &
cf
Remarks
"capillary" with flux, may not cook the
whole HD in 1 step because flux may boil off if too long time for
setting up.cook smaller HD sub-
assembliescook smaller HD sub-
assemblies
Need something extra to support the
L end C-C ring for installation; can cook
whole HD; largest contact area btw
indium & C-C;
Need something extra to support the
L end C-C ring for installation; can cook
whole HD; largest contact area btw
indium & C-C;
Need something extra to support the
L end C-C ring for installation; can cook
whole HD; largest contact area btw indium & C-C; can
only bond 1 blade at 1 time, laborious.
Need something extra to support the
L end C-C ring for installation; can cook
whole HD; largest contact area btw indium & C-C; can
only bond 1 blade at 1 time, laborious.
can only bond 1 blade at 1 time, laborious.
with or without flux
if ribbon works, S-bond coating is another option
no diff btw B & C, same cons for
installation, thermal performance,
machining $ may be higher, no ooze out
for blind slot. all vendor's work.make sample? no go go. go? debatable go go, make 2? no go. no go.
Blade-ring attachment Options
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 32
FEA of Temperatures with Different Blade Attachments
Simplified rectangular blade; same overall thickness with 0.68 mm TPG plus 0.06 mm cf facings; eqv. blade area half model: 39.5 mm x 30.4 mm x 0.8 mm heat input for half model: 3W heat sink temperature on ‘exposed’ TPG = 0oC - Option A : 0.8 mm end surface only - Option B : 0.75 mm wall on 1 side + 0.74 mm end surface - Option C : 2 mm wall on 1 side only
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 33
Results Max temp drop % ReductionOption A 2.12 91%Option B 2.10 91%Option C 2.32 100%
Option A Option COption B
Conclusion: • End surface contact with TPG generates less temperature drop,
but amount is not significant. • Blade solder attachment location should not be a deciding factor.Phase 1 Pixel Upgrade
Workshop - Aug2012
Plenary IV Session 34
50um gaps solder
C-C
TPGepoxy epoxy
Blade-Ring S-Bond design option
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 35
Boundary conditions:
• -30C fixed temperature in C-C cooling grooves• No heat from modules (so entire assembly is the
same -30C temperature)• C-C rings, TPG blades, Si modules material
properties• TPG blades bonded to C-C rings (no separation or
slippage allowed)• Si modules allowed to slip on, but not separate
from, surfaces of the blades
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 36
Boundary conditions same as previous slide, but with 3W power generated in each Si module Negligible change in overall stress
with modules powered on or off Most of the thermal stress results
from the difference in CTE between C-C and TPG
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 37
Engineering data used for this structural analysisC-C rings:Isotropic Instantaneous Coefficient of Thermal Expansion 4E-06 C^-1Isotropic Elasticity Derive from Bulk Modulus and Young's Modulus
Young's Modulus 95000 MPaPoisson's Ratio 0.318 PaBulk Modulus 87000 MPaShear Modulus 36039 MPa
Isotropic Thermal Conductivity 200 W m^-1 C^-1
TPG blades:Orthotropic Instantaneous Coefficient of Thermal Expansion
Coefficient of Thermal Expansion X direction 5E-07 C^-1Coefficient of Thermal Expansion Y direction 5E-07 C^-1Coefficient of Thermal Expansion Z direction 6.5E-06 C^-1
Isotropic Elasticity Derive from Bulk Modulus and Young's ModulusYoung's Modulus 20000 MPaPoisson's Ratio 0.467 PaBulk Modulus 100000 MPaShear Modulus 6818 MPa
Orthotropic Thermal ConductivityThermal Conductivity X direction 400 W m^-1 C^-1Thermal Conductivity Y direction 400 W m^-1 C^-1Thermal Conductivity Z direction 3.5 W m^-1 C^-1
Silicon modules:Isotropic Instantaneous Coefficient of Thermal Expansion 2.49E-06 C^-1Isotropic Elasticity Derive from Bulk Modulus and Shear Modulus
Young's Modulus 114701 MPaPoisson's Ratio 0.306 PaBulk Modulus 98740 MPaShear Modulus 43900 MPa
Isotropic Thermal Conductivity 124 W m^-1 C^-1
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 38
The tensile strength of #1E In solder is 1720psi = 11.8 MPa This is 72% of the maximum stress in the blade/ring joints from the FEA
In solder properties
Araldite 2011 epoxy cured properties
The tensile strength of Araldite 2011 is 4800psi = 33 MPa This is 200% of the maximum stress in the blade/ring joints
S-Bond claims their “active” solder joints between carbon materials are “strong” (>5000psi), see http://www.s-bond.com/cms/files/file_ID53422.pdf
Phase 1 Pixel Upgrade Workshop - Aug2012
Plenary IV Session 39
Removable Coupling Status(laser welded to 1.6mm OD tubing)
• Successfully held hydrostatic pressure up to 4,000 psi (276 bar)
• Safety factor >2.5 based on design pressure = 110 bar (EU standards require testing with safety factor x1.43 = 157 bar)
• Existing coupler design can be modified for larger tubing weldment for supply and return tubes.
Male plug hole ID can be machined for larger tube
and weldingPhase 1 Pixel Upgrade Workshop - Aug2012
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